JP4374297B2 - Electrical junction box and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electrical junction box containing a circuit board on which electronic components are mounted, and a method for manufacturing the same.

Conventionally, this type of electric junction box has been installed in an automobile or the like, and an example disclosed in Patent Document 1 is known. In this housing, a circuit board is accommodated in a housing having an open bottom so that the open face is closed, and is fixed to the housing by a well-known locking mechanism. It is a structure with a large heat sink attached. A portion of the heat radiating plate that protrudes from the outer periphery of the circuit board is in close contact with the outer peripheral edge of the bottom of the housing, whereby the open bottom surface of the housing is sealed by the heat radiating plate.
JP 2003-164039 A

  Conventionally, in order to manufacture the electrical junction box, the circuit board is accommodated in the housing, and then fixed to the housing. After that, an insulating adhesive is applied to the lower surface of the circuit board, and the heat sink is applied from below. It was trying to make it adhere closely.

  However, the heat sink needs to be in close contact with both the lower surface of the circuit board and the outer peripheral edge of the bottom of the housing, and an assembly error may occur when the circuit board is fixed to the housing in advance. There was a problem that it could not adhere closely. For example, when the circuit board is assembled in a state of being retracted from the outer peripheral edge of the bottom of the housing, a gap is generated between the circuit board and the heat sink when the heat sink is in close contact with the outer peripheral edge of the bottom of the housing. If it becomes like this, the heat transfer from a circuit board to a heat sink will not be performed smoothly, but heat dissipation will fall. On the other hand, if the circuit board protrudes from the outer peripheral edge of the bottom of the housing, even if the heat sink can be in close contact with the circuit board, it cannot be in close contact with the outer peripheral edge of the housing. Is produced.

  The present invention has been completed based on the above circumstances, and provides an electrical junction box and a method for manufacturing the same that can prevent a decrease in the hermeticity of the housing while preventing a decrease in heat dissipation. The purpose is to do.

As means for achieving the above object, an electrical junction box according to the invention of claim 1 includes a housing having an opening surface, a circuit board accommodated so as to close the opening surface of the housing, and the circuit board. And a temporary holding means for holding the housing in a state in which displacement in a direction perpendicular to the plate surface is allowed while preventing displacement in a direction along the plate surface, and protruding to the outer peripheral side of the circuit board The peripheral edge portion is bonded to the circuit board by being crimped to the circuit board in a state where the circuit board is held by the temporary holding means, and the peripheral edge portion is an opening edge portion of the housing Ri Na and an adhesion have been heat sink, the circuit board is a circuit structure obtained by bonding a plurality of bus bars on the rear surface of the printed wiring board surface mounting electronic components, the said bus bar side Heat sink The housing includes a frame and a cover that closes one surface of the frame, and the temporary holding means includes a holding protrusion formed on one of the frame and the bus bar, and the frame. It is characterized in that it is configured by an insertion hole formed in the other of the body and the bus bar and through which the holding projection is inserted .

According to a second aspect of the present invention, in the first aspect, the temporary holding means includes a holding projection formed on the frame body and an insertion hole formed on the bus bar through which the holding projection is inserted. Characterize

According to a third aspect of the present invention, there is provided a housing having an opening surface, a circuit board accommodated so as to close the opening surface of the housing, and displacement of the circuit board with respect to the housing in a direction along the plate surface. A temporary holding means for holding while preventing displacement in a direction perpendicular to the plate surface, and a peripheral edge protruding to the outer peripheral side of the circuit board. A heat sink that is adhered to the circuit board by being crimped to the circuit board in a held state, and the peripheral edge portion is in close contact with the opening edge of the housing;
The circuit board is a circuit structure in which a plurality of bus bars are bonded to the back surface of a printed wiring board on which electronic components are surface-mounted, the heat sink is bonded to the bus bar side, and the housing includes a frame And a cover that closes one surface of the frame, and the temporary holding means includes a holding projection formed on the bus bar and a recess formed on the frame and capable of locking the holding projection. It has the characteristics in the configuration.

According to a fourth aspect of the present invention, in the one according to any one of the first to third aspects, the predetermined one of the bus bar groups is bent so that a tip portion thereof is along the plate surface of the circuit board. The tip portion of the connector constitutes a male terminal of the connector.

According to a fifth aspect of the present invention, there is provided a housing having an opening surface, a circuit board accommodated so as to close the opening surface of the housing, and heat dissipation that adheres to the circuit board and has an outer peripheral edge closely contacting the opening peripheral edge of the housing. A method of manufacturing an electrical junction box comprising a board, wherein the housing is prevented from being displaced in a direction perpendicular to the board surface while preventing the circuit board from being displaced in a direction along the board surface. Temporary holding means for holding the circuit board is provided, and the circuit board is held by pressing the housing and the circuit board over the heat sink with an adhesive while the circuit board is held by the temporary holding means. The circuit board is a circuit structure formed by bonding a plurality of bus bars to the back surface of a printed wiring board on which electronic components are surface-mounted, and is attached to the heat radiating plate. The heat sink is bonded, the housing includes a frame and a cover that closes one surface of the frame, and the temporary holding means is a holding protrusion formed on one of the frame and the bus bar. And an insertion hole formed in the other of the frame body and the bus bar and through which the holding projection is inserted.
Invention of Claim 6 is a manufacturing method of Claim 5 , Comprising: The said temporary holding means is the holding protrusion formed in the said frame, The penetration hole formed in the said bus bar and the said holding protrusion penetrates It is characterized by comprising.
According to a seventh aspect of the present invention, there is provided a housing having an opening surface, a circuit board accommodated so as to close the opening surface of the housing, and heat dissipation bonded to the circuit board and having an outer peripheral edge closely contacting the opening peripheral edge of the housing. A method of manufacturing an electrical junction box comprising a board, wherein the housing is prevented from being displaced in a direction perpendicular to the board surface while preventing the circuit board from being displaced in a direction along the board surface. Temporary holding means for holding the circuit board is provided, and the circuit board is held by pressing the housing and the circuit board over the heat sink with an adhesive while the circuit board is held by the temporary holding means. The circuit board is a circuit structure formed by bonding a plurality of bus bars to the back surface of a printed wiring board on which electronic components are surface-mounted, and is attached to the heat radiating plate. The heat radiating plate is bonded, the housing includes a frame body and a cover for closing one surface of the frame body, and the temporary holding means includes a holding projection formed on the bus bar, and the frame body. It consists of the recessed part which is formed and can hold | maintain the said holding protrusion.

<Inventions of Claims 1 and 5 >
According to the first and fifth aspects of the invention, the circuit board is held by the temporary holding means in a state in which displacement in a direction perpendicular to the plate surface is allowed. In this state, the circuit board can be displaced in a direction perpendicular to the plate surface to a position where both the circuit board and the opening edge of the opening surface of the housing can be in close contact with the heat sink. Thereby, while a circuit board and a heat sink are pressed and adhere | attached, the opening edge part of the opening surface of a housing and a heat sink can be stuck. By bonding the circuit board and the heat sink in this way, the heat generated from the circuit board is quickly transferred from the circuit board to the heat sink and dissipated from the heat sink to the outside. Can be prevented. Moreover, since the opening edge part of the opening surface of a housing and the heat sink are closely_contact | adhered, the fall of the sealing performance of a housing can be suppressed.

Further, since the bus bar bonded to the printed wiring board can be used as, for example, a power circuit, the wiring density of the electrical junction box can be increased.

  Moreover, since the heat radiating plate is bonded to the bus bar side, the heat generated from the bus bar can be dissipated by the heat radiating plate, so that the heat dissipation of the electrical junction box is improved.

Further, since the housing is composed of separate parts such as the frame and the cover, the dimensional accuracy of the frame can be improved as compared with the case where the housing is formed from one part. Thereby, since the adhesiveness of a frame and a heat sink can be improved, the sealing performance of a housing can be improved.

<Invention of Claim 2 >
According to the invention of claim 2 , since the temporary holding means is formed by a simple structure of the holding protrusion formed on the frame and the insertion hole formed in one of the bus bar groups, Miniaturization can be achieved.

<Invention of Claim 4 >
According to the invention of claim 4 , since a part of the bus bar group can be used as the male terminal of the connector, the number of parts can be reduced compared to the case where the male terminal of the connector is separately formed. Thereby, an electrical junction box can be reduced in size.

According to the invention of claim 4 , the fitting direction of the connector and the mating connector is a direction along the plate surface of the circuit board. As a result, when connecting and disconnecting the connector, no force is applied in the direction perpendicular to the board surface of the circuit board to the bonding surface of the circuit board and the heat sink, so the adhesion between the circuit board and the heat sink is reduced. Can be prevented. Thereby, the fall of the heat dissipation of an electrical junction box can be prevented.

  On the other hand, according to the invention of claim 4, when the connector is inserted and removed, a force in the direction along the plate surface of the circuit board is applied to the circuit board. However, since the displacement of the circuit board and the housing in the direction along the plate surface is regulated by the temporary holding means, the force in the direction along the plate surface is applied to the bonding surface between the circuit board and the heat sink. Does not work. For this reason, it can prevent that the adhesiveness of a circuit board and a heat sink falls. Thereby, the fall of the heat dissipation of an electrical junction box can be prevented.

<Embodiment>
An embodiment of the present invention will be described with reference to FIGS. As shown in FIGS. 1 and 2, the electrical junction box 80 of the present embodiment is configured by housing a circuit structure 10 (corresponding to the circuit board of claim 1) in a flat housing 20.

  The housing 20 is made of synthetic resin, and is formed by combining a frame body 21 whose top and bottom are opened and a cover 25 that covers the frame body 21 from above. The frame body 21 has a shape in which one corner of a rectangle is dropped, and continuously surrounds the circuit structure 10 over the entire circumference without any breaks. On the outer side surface of the side wall of the frame body 21, there is provided a lock protrusion 23 for engaging with a lock piece 26 described later. On the other hand, a lock piece 26 that can be bent and deformed is provided on the side wall of the cover 25 at a position corresponding to the lock protrusion 23. Cover mounting holes 27 are formed in the upper wall of the cover 25 at positions near both ends on the right back side in FIG. The cover 25 and the frame body 21 are coupled by elastically locking the lock piece 26 to the lock projection 23 and screwing a screw (not shown) inserted into the cover mounting hole 27 over the frame body 21. Yes. The lower end edge of the frame body 21 corresponds to the opening edge of the housing 20 in claim 1.

  The circuit component 10 is accommodated inside the frame body 21. The circuit structure 10 is configured by forming a control circuit by printed wiring means on one surface of the printed wiring board 11 having substantially the same shape as the inner periphery of the frame body 21 and mounting an electrical component 13 thereon. The plurality of bus bars 12 are arranged along the surface opposite to the component mounting surface in a state of being electrically connected to the control circuit. The bus bar 12 group is integrally bonded to the printed wiring board 11 through a thin adhesive sheet (not shown) having insulating properties. A through hole 14 is formed on the left front side in FIG. 2 of the circuit structure 10, and a terminal fitting (not shown) of a PCB connector 40 described later is inserted therein.

  The bus bar 12 group is formed by punching a metal plate to form a predetermined conductive path serving as a power circuit. These bus bar 12 groups protrude side by side from the edge on the right back side in FIG. Of the bus bar 12 group, except for one arranged at the far left side in FIG. 2, those arranged over the leftmost region are bent twice at right angles on the component mounting surface side of the circuit structure 10. As a result, the tip protrudes toward the back side of the right hand in FIG. 2, and a slit 16 is formed at the tip, so that a fuse (not shown) can be inserted. Further, the remaining bus bar 12 is further bent at a right angle twice, so that the tip protrudes toward the left front side in FIG.

  As shown in FIG. 1, a PCB connector 40 is attached to the left front side of the circuit structure 10. The PCB connector 40 has a horizontally long shape and includes a connector housing 42 made of a synthetic resin and opened to the left front side in FIG. In the connector housing 42, terminal fittings (not shown) bent into an L shape are arranged in such a manner that one end protrudes into the opening and the other end protrudes downward through the back wall. It is installed. The downward projecting end of each terminal fitting is inserted into the through hole 14 opened in the circuit structure 10 from above and soldered to the control circuit.

  As shown in FIG. 1, a fuse box 50 is attached to the right rear side of the circuit structure 10. The fuse box 50 is made of synthetic resin and has a horizontally long shape. At both ends in the length direction of the fuse box 50, a connector part 51 opened on the left front side in FIG. 1 is provided, a fuse mounting part 52 is provided on one side therebetween, and a terminal accommodating part 53 is provided on the other side. It has been.

  The fuse mounting portion 52 is provided with a plurality of mounting holes (not shown) in which a fuse (not shown) is mounted, opened to the right rear side in FIG. 2. The bus bar 12 that protrudes to the right back side is attached by press-fitting, and one end of a tab-shaped connection piece 54 that is paired with the bus bar 12 is also attached by press-fitting to the upper side. The other end protrudes to the left front side in FIG. On the other hand, the bus bar 12 formed to protrude to the left front side in FIG.

  A relay connector 55 (corresponding to the connector in claim 6) is coupled to the left front side in FIG. 2 of the fuse box 50 in the region extending between the fuse mounting portion 52 and the terminal accommodating portion 53. In the relay connector 55, the connecting piece 54 and the bus bar 12 protruding from the fuse mounting portion 52 and the terminal accommodating portion 53 to the left front side in FIG. 56 protrudes into the inside. The connection terminals 85 and the bus bars 12 correspond to male terminals in claim 6.

  A heat sink 30 is attached below the circuit structure 10 and the frame body 21. The heat radiating plate 30 is for radiating heat generated from the electrical component 13 and is formed in a shape substantially the same as the outer shape of the frame body 21 by a metal plate such as aluminum having high thermal conductivity. In the heat sink 30, a relief recess 31 is provided on the left front side in FIG. 2 in order to avoid interference with the end of the terminal fitting attached to the PCB connector 40 that protrudes to the lower surface side of the circuit component 10. Is formed. A heat radiating plate mounting hole 32 for inserting a screw 33 (for example, a tapping screw) is formed in the peripheral portion of the heat radiating plate 30 as shown in FIG. The frame body 21 and the heat radiating plate 30 are fixed by screwing screws 33 while the peripheral edge of the heat radiating plate 30 is bonded to the lower surface of the frame body 21. On the other hand, on the upper surface of the heat radiating plate 30, the bus bar 12 as a circuit component plate is attached with an insulating adhesive.

  The space formed by the heat sink 30 and the frame body 21 that rises along the outer periphery of the heat sink 30 is filled with a potting agent (not shown) as a waterproof means. Waterproofness is ensured by covering the surface with a potting agent.

  Now, as shown in FIGS. 2 and 5, a plurality of support portions 24 (four in this embodiment) for mounting the circuit component 10 are formed at the four corners of the frame body 21. A substantially cylindrical holding projection 22 (corresponding to the temporary holding means of claim 1) is formed on the upper end of the support portion 24 so as to protrude upward. The height dimension H of the holding projection 22 is formed larger than the thickness dimension T of the bus bar 12 (see FIG. 6).

  And among the bus bar 12 groups attached to the circuit structure 10, those located on the left and right ends in FIG. 5 are such that the lower end in FIG. 5 is slightly extended from the printed wiring board 11. The tip is projected downward in FIG. 5 by being bent at a right angle twice on the mounting surface side.

  Among the bus bar 12 groups, those located on the left and right ends in FIG. 5 are inserted through holes 15 penetrating the bus bar 12 in the vertical direction at positions corresponding to the holding projections 22 formed on the frame body 21 (Claim 1). (Refer to FIG. 3). As shown in FIG. 6, the diameter D <b> 1 of the insertion hole 15 is slightly larger than the outer diameter D <b> 2 of the holding protrusion 22 by the tolerance. This tolerance includes a dimensional tolerance in manufacturing the printed wiring board 11, a dimensional tolerance in manufacturing the frame 21, a dimensional tolerance in manufacturing the cover 25, and a tolerance in assembling the circuit component 10 and the frame 21. Etc. A holding protrusion 22 is inserted into the insertion hole 15 from below (see FIGS. 3 to 6).

  Note that the height of the support portion 24 is such that when the lower surface of the bus bar 12 abuts the upper surface of the support portion 24 from above with the holding projection 22 inserted into the insertion hole 15, the circuit component 10 It is set so as to protrude from the lower surface of the frame body 21.

Then, an example of the assembly procedure of the circuit structure 10, the frame body 21, and the heat sink 30 will be described.
As shown in FIG. 7, when the PCB connector 40 attached to the circuit structure 10 is assembled from above the frame body 21, the insertion holes 15 formed in the bus bar 12 are respectively inserted into the insertion holes 15 as shown in FIG. 8. On the other hand, the holding protrusion 22 formed on the frame body 21 is inserted from below. Then, when the circuit component 10 is about to be displaced with respect to the frame 21 in the direction along the plate surface of the circuit component 10, the inner peripheral wall of the insertion hole 15 and the outer wall of the holding protrusion 22 are in contact with each other. Touch. Thereby, the circuit structure 10 and the frame 21 are held in a state where displacement in the direction along the plate surface of the circuit structure 10 is restricted.

  Since the above-described height dimension H of the holding protrusion 22 is formed to be larger than the thickness dimension T of the bus bar 12, the inner peripheral wall of the insertion hole 15 is the holding protrusion within the range of the height dimension H of the holding protrusion 22. By being guided by the outer wall 22, the circuit structure 10 can be freely displaced with respect to the frame body 21 in a direction (upward or downward) perpendicular to the plate surface of the circuit structure 10. Yes.

  Thereafter, an insulating adhesive is applied to the entire upper surface of the heat sink 30, and the circuit component 10 and the frame body 21 are assembled from above the heat sink 30 as shown in FIG. 8. At this time, when the circuit component 10 is positioned above the frame body 21, the outer periphery of the heat sink 30 is brought into close contact with the lower surface of the frame body 21 from below, and then the circuit component 10 is mounted. The heat sink 30 and both the lower surface of the circuit component 10 and the lower surface of the frame body 21 can be brought into close contact by being pressed from above and displaced downward.

  On the other hand, when the circuit structural body 10 is positioned below the frame body 21, the heat radiating plate 30 is brought into close contact with the lower surface of the circuit structural body 10 from below, and then the heat radiating plate 30 and the circuit structural body. 10 is displaced upward to bring the outer periphery of the heat sink 30 into close contact with the lower surface of the frame body 21. Thereby, both the heat sink 30 and the lower surface of the circuit structure 10 and the lower surface of the frame body 21 can be brought into close contact with each other.

  As described above, with the heat sink 30 and both the lower surface of the circuit component 10 and the lower surface of the frame 21 in close contact with each other, the frame member 21 and the circuit component 10 are pressed against the heat sink 30, Glue. Further, a screw 33 (for example, a tapping screw) is inserted into the heat sink mounting hole 32 and screwed into the frame body 21, thereby fixing the heat sink 30 and the frame body 21. In this manner, the heat radiating plate 30 and the circuit component 10 are bonded together, and the heat radiating plate 30 and the frame body 21 are brought into close contact with each other.

  Next, the operation and effect of this embodiment will be described. According to this embodiment, the heat sink 30 and the lower surface of the circuit component 10 can be bonded, and the heat sink 30 and the frame body 21 can be brought into close contact with each other. Thereby, the heat generated from the circuit structure 10 is quickly transmitted from the circuit structure 10 to the heat radiating plate 30 and dissipated from the heat radiating plate 30 to the outside. . Further, since the frame body 21 corresponding to the opening edge portion of the opening surface of the housing 20 and the heat radiating plate 30 are in close contact with each other, it is possible to suppress a decrease in the sealing performance of the housing 20.

  According to this embodiment, the diameter D1 of the insertion hole 15 is formed to be slightly larger than the outer diameter D2 of the holding projection 22 by the tolerance. For this reason, when the error in the dimensions of the circuit component 10, the frame body 21, and the heat sink 30 or the error in assembly is within the tolerance, the holding projection 22 is inserted into the insertion hole 15, By displacing the circuit component 10 with respect to the frame 21 in the direction along the plate surface of the circuit component 10 within a tolerance range, the radiator plate 30 is moved between the lower surface of the circuit component 10 and the frame 21. It can be adhered to both the lower surface. Thereby, while the fall of the heat dissipation of the electrical junction box 80 can be prevented, the fall of the sealing performance of the housing 20 can be suppressed.

  Further, according to the present embodiment, even if the corner of the circuit structure 10 is bent and deformed so as to be turned up with respect to the plate surface of the circuit structure 10, the inner peripheral wall of the insertion hole 15 is outside the holding projection 22. By coming into contact with the wall, it is possible to prevent the corner of the circuit component 10 from being deformed. Thereby, since the fall of the adhesiveness of the heat sink 30 and the circuit structure 10 can be prevented, the fall of the heat dissipation of the electrical junction box 80 can be prevented.

  Furthermore, according to the present embodiment, a mating connector (not shown) is fitted to the relay connector 55 from the left front side in FIG. Then, a force is applied to the relay connector 55 toward the right rear side in FIG. Since this force is transmitted to the circuit structure 10 via the bus bar 12, a force toward the right back side in FIG. When the circuit component 10 is about to be displaced to the right rear side in FIG. 1 by this force, the inner peripheral wall of the insertion hole 15 formed in the bus bar 12 of the circuit component 10 is formed by the holding projection 22 formed in the frame 21. It abuts against the outer side wall from the left front side in FIG. Thereby, the circuit component 10 can be prevented from being further displaced to the right rear side in FIG. 1, and the force applied to the circuit component 10 is transmitted from the holding projection 22 to the frame body 21, the cover 25, and the heat sink. It is mitigated to 30. As a result, the force to the right back side in FIG. 1 generated when the relay connector 55 and the mating connector (not shown) are fitted to the bonding surface between the circuit component 10 and the heat sink 30 acts. Therefore, it is possible to prevent the force in the direction in which the circuit component 10 and the heat radiating plate 30 are peeled from acting on the bonding surface between the circuit component 10 and the heat radiating plate 30. Further, since the relay connector 55 and the mating connector (not shown) are inserted / removed in a direction along the plate surface of the circuit component 10, a force in a direction perpendicular to the plate surface is applied to the circuit component 10. Can be prevented from being added. Thereby, it can prevent that the force of the direction which peels the circuit structure 10 and the heat sink 30 with respect to the adhesion surface of the circuit structure 10 and the heat sink 30 acts. As described above, according to the present embodiment, as a result of maintaining the adhesion between the circuit structure 10 and the heat radiating plate 30, it is possible to prevent the heat dissipation of the electrical junction box 80 from being lowered.

  Further, according to the present embodiment, since the heat radiating plate 30 is bonded to the bus bar 12, the heat generated from the bus bar 12 is quickly dissipated by the heat radiating plate 30. Thereby, the heat dissipation of the electrical junction box 80 improves.

  Further, according to the present embodiment, the housing 20 is configured separately from the frame body 21 and the cover 25, so that the dimensional accuracy of the frame body 21 can be improved. Since dimensional accuracy can be improved, the adhesiveness of the heat sink 30 and the lower surface of the frame 21 can be improved. Thereby, the sealing performance of the housing 20 can be improved.

  In addition, according to the present embodiment, the circuit structure 10 is held by the frame body 21 by the simple structure of the holding protrusion 22 formed on the frame body 21 and the insertion hole 15 formed on the bus bar 12. The electrical connection box 80 can be downsized.

  And according to this embodiment, since a part of bus bar 12 can be used as a male terminal of the relay connector 55, compared with the case where the male terminal of the relay connector 55 is formed separately, a number of parts can be reduced. Thereby, the electrical junction box 80 can be reduced in size.

  Moreover, according to this embodiment, since the bus bar 12 is utilized as a power circuit, the wiring density of the electrical junction box 80 can be increased.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.

  (1) According to the present embodiment, the holding projection 22 has a cylindrical shape protruding from the frame body 21, but is not limited to this, and after inserting the holding projection 22 into the insertion hole 15, the distal end portion of the holding projection 22 May be formed by pressing or the like to form an enlarged portion having an outer diameter larger than the diameter D1 of the insertion hole 15 at the tip of the holding projection 22. Accordingly, even when the assembly of the circuit component 10 from above the frame 21 is turned upside down, the peripheral portion of the insertion hole 15 is locked to the enlarged diameter portion of the holding projection 22, so that the circuit component 10 Can be prevented from falling. Thereby, after combining the frame body 21 and the circuit structure 10, it becomes possible to work in a state where the frame body 21 is turned upside down. As a result, the degree of freedom in the work process is improved. The efficiency of assembly work is improved. Also, the same effect as described above can be obtained by attaching a jig having a size larger than the diameter D1 of the insertion hole 15 to the tip of the holding projection 22.

  (2) According to the present embodiment, the form in which a plurality of bus bars 12 are bonded to the back surface of the printed wiring board 11 via an adhesive sheet (not shown) is not limited thereto, and the back surface of the printed wiring board 11 is not limited thereto. Alternatively, a circuit pattern may be formed by printed wiring means, and the circuit pattern and the heat sink 30 may be bonded via an insulating layer. Alternatively, a circuit pattern may be formed on the back surface of the printed wiring board 11 by printed wiring means, and the circuit pattern and the bus bar 12 may be bonded via an insulating layer. Thereby, the wiring density of the electrical junction box 80 is improved.

  (3) According to the present embodiment, the housing 20 is composed of the frame body 21 that is located on the outer peripheral side of the printed wiring board 11 and that is open at the top and bottom, and the cover 25 that closes one of the frame bodies 21. However, the present invention is not limited to this, and the housing 20 formed of one member may be used when the adhesion between the heat radiating plate 30 and the housing 20 can be secured. Thereby, the number of parts can be reduced.

  (4) According to the present embodiment, the temporary holding means is constituted by the holding protrusion 22 formed on the frame body 21 and the insertion hole 15 formed on the bus bar 12, but is not limited thereto. The temporary holding means can displace the circuit component 10 and the frame member 21 in the direction perpendicular to the plate surface of the circuit component 10 by the locking claws formed on the frame member 21. It is good also as a structure by which the displacement more than predetermined amount is controlled in the direction parallel to a plate surface. In addition, the circuit structure 10 and the frame body 21 can be displaced in a direction perpendicular to the plate surface of the circuit structure body 10 by a clamp that holds the circuit structure body 10 and the frame body 21 together. It is good also as a structure by which the displacement more than predetermined amount is controlled in the direction parallel to the 10 plate | board surface.

  (5) According to the present embodiment, the temporary holding means is provided at the four corners of the circuit structure 10, but is not limited thereto, and the temporary holding means may be deformed so that the corners of the circuit structure 10 are turned up. If it can be prevented, temporary holding means may be provided at two or three locations along the outer periphery of the circuit structure 10. Moreover, you may provide five or more places along the outer peripheral part of the circuit structure 10. FIG.

  (6) According to the present embodiment, predetermined ones of the bus bars 12 are bent so that the end on the right back side in FIG. 2 is along the plate surface of the printed wiring board 11, and the leading end is relayed Although the male terminal of the connector 55 is formed, the present invention is not limited to this. On the other hand, when it is possible to prevent a force from being applied in a direction perpendicular to the plate surface of the circuit component 10, the tip of a predetermined one of the bus bars 12 rises from the plate surface of the circuit component 10. It is good also as a male terminal of the relay connector 55 for the front-end | tip part.

  (7) According to the present embodiment, the temporary holding means is composed of the holding protrusion 22 formed in the frame body 21 and the insertion hole 15 formed in the bus bar 12, but is not limited thereto, for example, press working It is possible to form a holding projection on the bus bar 12 by, for example, to form an insertion hole through which the holding projection can be inserted on the frame body 21 side, or to form a recess capable of engaging the holding projection. Also good.

The perspective view of the electrical junction box concerning one embodiment of the present invention. 1 is an exploded perspective view of an electrical junction box according to an embodiment of the present invention. The perspective view which shows the corresponding state of the holding | maintenance protrusion formed in the frame, and the insertion hole formed in the circuit structure body The perspective view which shows the state which assembled | attached the circuit structure body to the frame. The top view which shows the state which assembled | attached the circuit structure body to the frame AA line sectional view of FIG. The perspective view which shows the state which attaches a circuit structure to a frame. The perspective view which shows the state which assembled | attached the heat sink with what assembled the frame to the circuit structure

Explanation of symbols

10 ... Circuit structure (circuit board)
DESCRIPTION OF SYMBOLS 11 ... Printed wiring board 12 ... Bus bar 15 ... Insertion hole (temporary holding means)
20 ... Housing 21 ... Frame 22 ... Holding projection (temporary holding means)
25 ... Cover 30 ... Heat sink 55 ... Relay connector (connector)
80 ... Electric junction box

Claims (7)

A housing having an opening surface, a circuit board accommodated so as to close the opening surface of the housing, and the plate surface of the circuit board while preventing displacement of the circuit board in the direction along the plate surface with respect to the housing. A temporary holding means for holding in a state in which displacement in a direction perpendicular to the vertical direction is allowed, and a peripheral edge protruding to the outer peripheral side of the circuit board, and the circuit board is held by the temporary holding means A heat sink that is bonded to the circuit board by being crimped to the circuit board, and the peripheral edge is in close contact with the opening edge of the housing;
The circuit board is a circuit structure formed by bonding a plurality of bus bars to the back surface of a printed wiring board on which electronic components are surface-mounted, and the heat sink is bonded to the bus bar side,
The housing comprises a frame and a cover that closes one surface of the frame,
The temporary holding means includes: a holding projection formed on one of the frame and the bus bar; and an insertion hole formed on the other of the frame and the bus bar through which the holding projection is inserted. Connection box. The electrical connection box according to claim 1, wherein the temporary holding means includes a holding protrusion formed on the frame body and an insertion hole formed on the bus bar through which the holding protrusion is inserted. A housing having an opening surface, a circuit board accommodated so as to close the opening surface of the housing, and the plate surface of the circuit board while preventing displacement of the circuit board in the direction along the plate surface with respect to the housing. A temporary holding means for holding in a state in which displacement in a direction perpendicular to the vertical direction is allowed, and a peripheral edge protruding to the outer peripheral side of the circuit board, and the circuit board is held by the temporary holding means A heat sink that is bonded to the circuit board by being crimped to the circuit board, and the peripheral edge is in close contact with the opening edge of the housing;
The circuit board is a circuit structure formed by bonding a plurality of bus bars to the back surface of a printed wiring board on which electronic components are surface-mounted, and the heat sink is bonded to the bus bar side,
The housing comprises a frame and a cover that closes one surface of the frame,
The electrical connection box, wherein the temporary holding means includes a holding projection formed on the bus bar and a recess formed on the frame body and capable of locking the holding projection. The predetermined one of the bus bar groups is bent so that a tip portion thereof is along a plate surface of the circuit board, and the tip portion constitutes a male terminal of the connector. Item 4. The electrical junction box according to any one of Items 3 to 3. An electric circuit comprising: a housing having an opening surface; a circuit board housed so as to close the opening surface of the housing; and a heat radiating plate bonded to the circuit board and having an outer peripheral edge closely contacting the opening peripheral edge of the housing. A method for manufacturing a junction box, wherein the housing holds the circuit board in a state in which the circuit board is prevented from being displaced in a direction along the plate surface and is allowed to be displaced in a direction perpendicular to the plate surface. Means for adhering the circuit board to the heat radiating plate by pressing the housing and the circuit board over the heat radiating plate via an adhesive while the circuit board is held by the temporary holding means. Because
  The circuit board is a circuit structure formed by bonding a plurality of bus bars to the back surface of a printed wiring board on which electronic components are surface-mounted, and the heat sink is bonded to the bus bar side,
  The housing comprises a frame and a cover that closes one surface of the frame,
  The temporary holding means includes: a holding projection formed on one of the frame and the bus bar; and an insertion hole formed on the other of the frame and the bus bar through which the holding projection is inserted. A method for manufacturing a junction box. 6. The method of manufacturing an electrical junction box according to claim 5, wherein the temporary holding means includes a holding projection formed on the frame and an insertion hole formed on the bus bar through which the holding projection is inserted. . An electric circuit comprising: a housing having an opening surface; a circuit board housed so as to close the opening surface of the housing; and a heat radiating plate bonded to the circuit board and having an outer peripheral edge closely contacting the opening peripheral edge of the housing. A method for manufacturing a junction box, wherein the housing holds the circuit board in a state in which the circuit board is prevented from being displaced in a direction along the plate surface and is allowed to be displaced in a direction perpendicular to the plate surface. Means for adhering the circuit board to the heat radiating plate by pressing the housing and the circuit board over the heat radiating plate via an adhesive while the circuit board is held by the temporary holding means. Because
  The circuit board is a circuit structure formed by bonding a plurality of bus bars to the back surface of a printed wiring board on which electronic components are surface-mounted, and the heat sink is bonded to the bus bar side,
  The housing comprises a frame and a cover that closes one surface of the frame,
  The method of manufacturing an electrical junction box, wherein the temporary holding means includes a holding projection formed on the bus bar and a recess formed on the frame body and capable of locking the holding projection.

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