JP4213905B2 - Substrate processing apparatus and processing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus and a processing method for processing a substrate with a processing liquid in a processing chamber.
[0002]
[Prior art]
For example, a circuit pattern is formed on a glass substrate used in a liquid crystal display device. A lithographic process is employed to form a circuit pattern on the substrate. In a lithography process, as is well known, a resist is applied to the substrate, and light is irradiated through a mask having a circuit pattern formed on the resist.
[0003]
Next, by repeating a series of steps such as removing a portion of the resist not irradiated with light or a portion irradiated with light, etching the portion of the substrate where the resist is removed, and removing the resist after etching, a plurality of times. Then, a circuit pattern is formed on the substrate.
[0004]
In such a lithography process, it is necessary to process the substrate with a processing solution such as an etching solution or a stripping solution for removing the resist after etching, and a cleaning solution for cleaning the substrate after removing the resist.
[0005]
When processing the plate surface of the substrate with a processing solution, for example, an etching chamber for supplying the etching solution to the substrate, a peeling chamber for removing the resist with the stripping solution after etching, and a rinsing chamber for rinsing the substrate after removing the resist are successively connected. An installed processing apparatus is used.
[0006]
The substrate is transported in a predetermined direction by a transport device. Then, when the substrate is carried into the chamber, the processing liquid is sprayed toward the substrate. Thereby, the substrate is processed by different types of processing liquid in each chamber.
[0007]
When processing a substrate with the above etching solution or stripping solution, it is required as an important factor that processing speed is improved and that the entire plate surface of the substrate can be processed uniformly.
[0008]
Conventionally, a shower pipe is disposed in the processing chamber. When the substrate is carried into the processing chamber, the substrate is stopped at a predetermined position, and the processing liquid is sprayed from the shower pipe onto the upper surface of the substrate. Then, when the processing action by the processing liquid has progressed, the substrate is unloaded from the processing chamber.
[0009]
[Problems to be solved by the invention]
However, simply supplying the processing liquid to the substrate whose conveyance has been stopped makes it difficult to uniformly supply the processing liquid to the plate surface of the substrate, so that the entire plate surface of the substrate cannot be uniformly processed by the processing liquid. is there.
[0010]
In addition, when the processing liquid is supplied to the substrate whose conveyance has been stopped, the fluidity of the processing liquid on the substrate cannot be sufficiently increased. Therefore, the processing action by the processing liquid is difficult to proceed, and the processing time of the substrate becomes long.
[0011]
An object of the present invention is to provide a substrate processing apparatus and a processing method capable of improving processing speed and processing uniformity when processing a substrate with a processing liquid.
[0012]
[Means for Solving the Problems]
The invention of claim 1 is a processing apparatus for processing a substrate with a processing liquid.
Conveying means for conveying the substrate;
A processing chamber into which the substrate transported by the transport means is loaded;
A processing liquid supply means for supplying a processing liquid to the upper surface of the substrate carried into the processing chamber;
Comprising a swinging mechanism for flowing the process liquid supplied to the upper surface of the substrate by swinging the substrate provided in the processing chamber in a predetermined direction,
The swing mechanism is provided on each of the swing table and one end side and the other end side of the swing table in the transport direction of the substrate, and the swing table is disposed below the substrate transported by the transport means. A lowering state, a floating state in which the substrate is lifted from the conveying means, a first inclined state in which one end on the downstream side in the conveying direction from the floating state is lower than the other end, and a direction opposite to the first inclined state The substrate processing apparatus is characterized by comprising a pair of linear motors or air cylinders that are driven to a second inclined state that is inclined in the vertical direction .
[0013]
Invention of Claim 2 is the processing method which processes a board | substrate with a process liquid,
Carrying the substrate into the processing chamber by a transfer means ;
Supplying a processing liquid to the substrate carried into the processing chamber;
A first inclined state in which the substrate carried into the processing chamber is levitated from the transport means by a swing table provided in the processing chamber so that one end on the downstream side in the transport direction is lower than the other end. Driving to a second inclined state inclined in a direction opposite to the inclined state to flow the processing liquid supplied to the upper surface of the substrate;
The substrate processing method is characterized by comprising:
[0016]
According to the present invention, since the processing liquid supplied to the upper surface of the substrate flows on the upper surface, the processing action can be promoted and uniform.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0018]
1 to 3 show a first embodiment of the present invention, and FIG. 1 shows a schematic configuration of a processing apparatus of the present invention. This processing apparatus includes a main body 1. In the main body 1, a partition wall 2 forms a loading chamber 3, a separation chamber 4 as a processing chamber, a rinse chamber 5 as a cleaning chamber, a drying chamber 6, and an unloading chamber 7 that are sequentially separated in series.
[0019]
In the main body 1, a plurality of transport shafts 11 constituting the transport means are disposed over the chambers 3 to 7 so as to be rotatable at predetermined intervals with the axes parallel. Each transport shaft 11 is provided with a plurality of transport rollers 12 having a diameter larger than that of the transport shaft 11 at predetermined intervals in the axial direction.
[0020]
The conveyance shafts 11 of the respective chambers 3 to 7 are interlocked by, for example, chains or belts, and these conveyance shafts 11 are driven to rotate by the respective chambers by first to fifth drive sources 13 to 17. It has become so. The rotation of the transport shaft 11 by these drive sources 13 to 17 is controlled by a control device 18 as control means.
[0021]
Thereby, for example, a rectangular glass substrate W for a liquid crystal display device can be transferred from the loading chamber 3 toward the unloading chamber 7. The transport shaft 11 and the transport roller 12 constitute transport means for transporting the substrate W along a predetermined direction.
[0022]
Each partition wall 2 has an opening 22 that is opened and closed by a shutter 21. The opening 22 is formed at a height position that allows the substrate W transported by the transport roller 12 to pass therethrough. Accordingly, the substrate W is sequentially transferred from the loading chamber 3 to the unloading chamber 7 through the opening 14.
[0023]
The peeling chamber 4 is provided with a swing mechanism 24. The swing mechanism 24 includes a swing table 25 as shown in FIGS. A through hole 26 is formed in the swing table 25 at a position corresponding to the transport roller 12 provided on the transport shaft 11, and a conical support is formed on the upper surface at a position corresponding to the transport roller 12 in the width direction. The protrusions 27 are provided at predetermined intervals in the longitudinal direction.
[0024]
A pair of attachment pieces 28 (only one of them is shown) are provided on the lower surfaces of both ends in the longitudinal direction of the swing table 25 at both ends in the width direction. Both ends of the connecting shaft 29 are rotatably supported by each pair of attachment pieces 28. The upper end of the rod 32a of the first linear motor 31a is connected to an intermediate portion in the axial direction of one connecting shaft 29, and the rod 32b of the second linear motor 31b is connected to the intermediate portion in the axial direction of the other connecting shaft 29. The upper end is connected.
[0025]
The linear motors 31 a and 31 b are arranged on the outer bottom of the peeling chamber 4 with the axis line vertical. The rods 32a32b of the linear motors 31a and 31b are slidably and liquid-tightly inserted into a guide 33 provided on the inner bottom portion of the peeling chamber 4.
[0026]
A drive signal is supplied from the control device 18 to the pair of linear motors 31a and 31b. Accordingly, the rods 32a and 32b of the linear motors 31a and 31b are driven in the vertical direction.
[0027]
In this embodiment, the swing table 25 is controlled in four states described below by a pair of linear motors 31a and 31b. First, as shown in FIG. 3A, the support protrusion 27 provided on the upper surface is in a lowered state positioned slightly below the substrate W transported by the transport roller 12. The second is a floating state in which the rods 32a and 32b of the linear motors 31a and 31b are slightly raised so that the substrate W is lifted from the transport roller 12 as shown in FIG.
[0028]
3rd, the 1st linear motor located in the conveyance direction upstream of the board | substrate W from the floating state shown to FIG. 3 (B) which floated the board | substrate W from the conveyance roller 12, as shown in FIG.3 (C) . By further raising the rod 32b of 31b, the swing table 25 is in a second inclined state in which one end on the downstream side in the transport direction of the substrate W is inclined higher than the other end on the downstream side.
[0029]
Fourth, as shown in FIG. 3 (D), the rod 32b of the second linear motor 31b is further raised from the floating state shown in the head 3 (B) where the substrate W is lifted from the transport roller 12. This is the second tilted state in which the swing table 25 is tilted in the opposite direction to the first tilted state.
[0030]
Above the swing table 25 in the peeling chamber 4, a plurality of shower pipes 35 are arranged in parallel at predetermined intervals along the transport direction of the substrate W. These shower pipes 35 communicate with a stripping solution supply tank (not shown). Accordingly, the stripping liquid can be sprayed from the shower pipe 35 toward the upper surface of the substrate W held on the swing table 25.
[0031]
The substrate W is transferred from the peeling chamber 4 to the rinse chamber 5. As shown in FIG. 2, in the peeling chamber 4, the transport shaft 11 (this transport shaft is indicated by 11A in FIG. 2) located at the end of the transport direction of the substrate W and the transport direction of the substrate W from the transport shaft 11A The transport shaft 11 located on the downstream side has a shaft center that is a predetermined dimension higher than the shaft core of the transport shaft 11 in the peeling chamber 4 and the loading chamber 3 located on the upstream side of the transport shaft 11A in the transport direction of the substrate W. Are arranged. The amount of deviation between the transport shafts 11A and 11 and the axis of the transport shaft 11 provided on the upstream side of the transport shaft 11A is indicated by h in FIG.
[0032]
Thereby, when the substrate W is transported from the peeling chamber 4 to the rinse chamber 5, the substrate W is placed on the transport roller 12 of the transport shaft 11 </ b> A located at the transport direction end of the stripping chamber 4, so that the transport shaft of the substrate W is placed. The part corresponding to 11 is inclined higher than the part on the rear side (upstream side) of this part.
[0033]
When the substrate W is transported by the transport shaft 11A with the front in the transport direction being inclined higher than the rear, the peeling liquid remaining on the upper surface of the substrate W is rearward in the transport direction of the substrate W as indicated by an arrow Z in FIG. And dropped into the peeling chamber 4 from the rear end in the transport direction of the substrate W. That is, the stripping solution is removed from the upper surface of the substrate W, falls into the stripping chamber 4 and is collected.
[0034]
Therefore, almost no stripping liquid remains on the upper surface of the substrate W transferred from the stripping chamber 4 to the rinse chamber 5. That is, in the peeling chamber 4, the peeling liquid supplied to the upper surface of the substrate W is not taken out to the rinse chamber 5 together with the substrate W.
[0035]
In addition, the axis of the conveyance shaft 11 disposed in the rinse chamber 5, the drying chamber 6, and the unloading chamber 7 is the same height as the axis of the conveyance shaft 11A located at the end of the peeling chamber 4 as described above. Is set. Therefore, the substrate W transferred with a high inclination from the peeling chamber 4 toward the rinse chamber 5 is again transferred horizontally in the rinse chamber 5.
[0036]
Although the height of the axis of the transport shaft 11 is changed in order to incline the substrate W, the outer dimensions of the transport roller 12 are changed instead, so that when the substrate W is unloaded from the peeling chamber 4, the transport is performed. The portion that rides on the shaft 11A may be inclined higher than the portion on the upstream side in the transport direction from this portion.
[0037]
In the rinse chamber 5, a first rinse portion 37, a second rinse portion 38, and a third rinse portion 39 are sequentially arranged along the transport direction of the substrate W. The first rinsing section 37 has a container 41 whose upper surface is opened, and the rinsing liquid made of pure water supplied into the container 41 overflows from the upper surface opening of the container 41 along one side surface, and the substrate It is supplied to the upper surface of W.
[0038]
The second rinse section 38 is composed of a shower pipe 42 disposed so as to face the upper surface and the lower surface of the substrate W transported by the transport roller 12, and the shower pipe 42 faces the upper surface and the lower surface of the substrate W. The rinsing liquid is sprayed at a high pressure. The upper shower pipe 42 is covered with an upper cover 43, and the lower shower pipe 42 is covered with a lower cover 44. Thereby, the rinse liquid containing dirt reflected from the substrate W is prevented from scattering around.
[0039]
The third rinsing section 39 is composed of a plurality of shower pipes 45 arranged along the transport direction of the substrate W, and the rinsing liquid is jetted from each shower pipe 45 toward the upper surface of the substrate W at a low pressure.
[0040]
Accordingly, the stripping liquid adhering to the upper and lower surfaces of the substrate W transferred from the stripping chamber 4 to the rinse chamber 5 is rinsed by the rinse liquid supplied from the first to third rinse sections 37, 38, 39. Become.
[0041]
The substrate W rinsed in the rinse chamber 5 is carried into the drying chamber 6. In the drying chamber 6, a plurality of mist nozzles 47 for supplying pure water in the form of mist to the upper surface of the substrate W in order to prevent partial drying of the substrate W, and downstream of the mist nozzle 47. A pair of upper and lower air knives 48 disposed on the side is provided.
[0042]
From a pair of upper and lower air knives 48, compressed air is jetted toward the upper and lower surfaces of the substrate W, respectively, toward the rear of the substrate W in the transport direction, that is, upstream. As a result, the rinse liquid adhering to the upper and lower surfaces of the substrate W is removed by drying.
[0043]
Mist pure water is supplied to the upper surface of the substrate W before reaching the air knife 48. Therefore, the upper surface of the substrate W is conveyed to the air knife 48 in a state where the entire upper surface is substantially uniformly wet. Therefore, it is possible to prevent unevenness of drying from occurring on the substrate W dried by the air knife 48. .
[0044]
That is, when the partially dried substrate W is dried with the air knife 48, uneven drying occurs. However, since the entire substrate W is uniformly wetted beforehand by the nozzle 47, the drying process is performed without causing uneven drying. The
[0045]
The substrate W dried in the drying chamber 6 is transferred to the unloading chamber 7 and is transferred from here to the next process.
[0046]
In the processing apparatus configured as described above, when the substrate W is carried into the peeling chamber 6 and reaches a predetermined position, that is, above the swinging table 25 in the lowered state shown in FIG. The second drive source 14 is stopped, and the transfer of the substrate W is stopped.
[0047]
Next, the control device 18 drives the rods 32a and 32b of the first and second linear motors 31a and 31b in the upward direction so that the swing table 25 is in the floating state shown in FIG. Thereby, the substrate W is lifted from the transport roller 12 and transferred to the swing table 25.
[0048]
When the substrate W is transferred to the swing table 25, the peeling liquid is sprayed from the shower pipe 35 onto the upper surface of the substrate W, and the swing table 25 is moved to the first position shown in FIGS. 3 (C) and 3 (D). Oscillation is driven alternately between the first inclined state and the second inclined state.
[0049]
When the substrate W is swung along the conveying direction, it supplied stripping solution on the upper surface of the substrate W FIG. 3 (C), alternately toward the inclined direction under the substrate W as indicated by arrows in (D) To flow. That is, the stripping liquid is not only sprayed on the upper surface of the substrate W, but also flows downward on the upper surface of the substrate W in the swinging direction.
[0050]
When stripping solution on the upper surface of the substrate W flows, as well as uniformly distributed throughout the upper surface of the substrate W, old stripping solution in contact with the substrate W is rather difficulty remaining on the substrate W, replaces the rapidly new process liquid. That is, the processing liquid that has deteriorated by acting on the resist of the substrate W is less likely to stay on the upper surface of the substrate W.
[0051]
Therefore, the entire upper surface of the substrate W is processed uniformly, and the processing speed is improved by always replacing the upper surface with a new processing liquid. In other words, by swinging the substrate W by the swing mechanism 24, the processing with the stripping solution can be performed uniformly and quickly, so that the processing time can be shortened.
[0052]
If the substrate W is swung and processed with the stripping solution for a predetermined time, the swing table 25 is returned to the lowered state shown in FIG. 3A, and then the transport shaft 11 of the stripping chamber 4 is rotated by the control device 18. As a result, the substrate W processed with the stripping solution is transferred from the stripping chamber 4 to the rinse chamber 5.
[0053]
When the substrate W is unloaded from the peeling chamber 4, the transfer shaft 11A located at the end of the peeling chamber 4 causes the substrate W to be tilted such that the portion of the transfer shaft 11A is higher than the upstream side of this portion. Therefore, the stripping liquid remaining on the upper surface of the substrate W flows toward the rear of the substrate W and finally falls from the rear end of the substrate W, so that the stripping liquid is prevented from being brought into the rinse chamber 5.
[0054]
The substrate W is rinsed in the rinse chamber 5 and then unloaded through the unloading chamber 7.
[0055]
The conveyance shafts 11 of the respective chambers 3 to 7 can be driven and controlled separately by the control device 18. Therefore, even if the processing times in the respective chambers 3 to 7 are different, the substrate W can be made to stand by in each chamber, so that the processing of the substrate W in each chamber can be performed reliably.
[0056]
In the first embodiment, the oscillating table 25 is oscillated along the transport direction of the substrate W. However, the oscillating table 25 is oscillated along the width direction intersecting the transport direction, or a predetermined angle in the horizontal direction. Or the substrate W may be reciprocated in the front-rear direction along the transport direction by the transport roller 12 so that the processing of the substrate W by the processing liquid can be made uniform or quick. Further, the various movements described above may be performed simultaneously or sequentially.
[0057]
Further, instead of the first and second linear motors 31a and 31b shown in the embodiment, the swing table 25 may be swung using an air cylinder.
[0058]
4 and FIGS. 5A and 5B are modifications of the processing chamber 4 showing the second embodiment of the present invention. In the processing chamber 4 of this embodiment, instead of the swinging mechanism 24, a plurality of first shower pipes 51 and second shower pipes 52 having different stripping liquid spray directions are alternately arranged.
[0059]
The first shower pipe 51 injects the stripping solution toward the upstream side in the conveyance direction of the substrate W, and the second shower pipe 52 injects the downstream side. The spray angle of the processing liquid from each of the shower pipes 51 and 52 is preferably 30 to smaller for the plate surface of the substrate W so that the relative speed of the stripping liquid with respect to the substrate W is larger. The range is set to 60 degrees.
[0060]
The treatment liquid is supplied to the first shower pipe 51 by the first pump 54 through the first liquid supply pipe 53, and the second shower pipe 52 is supplied by the second pump 56 through the second liquid supply pipe 55. Treatment liquid is supplied. The first liquid supply pipe 53 is provided with a first opening / closing control valve 57, and the second liquid supply pipe 55 is provided with a second opening / closing control valve 58. The pumps 54 and 56 and the open / close control valves 57 and 58 are controlled by the control device 18 to start and stop and open / close, respectively.
[0061]
When the substrate W is carried into the peeling chamber 4, the transfer shaft 11 of the peeling chamber 4 is alternately rotated forward and reverse every predetermined time. As a result, the substrate W reciprocates within the peeling chamber 4 within a predetermined range. In conjunction with this reciprocation, the first opening / closing control valve 57 and the second opening / closing control valve 58 are controlled to open / close by the control device 18.
[0062]
That is, when the substrate W is transported in the forward and backward movement direction indicated by the arrow X in FIG. 5A, the first opening / closing control valve 57 is opened and the second opening / closing control valve 58 is closed. As a result, the stripping solution is sprayed from the first shower pipe 51 in the backward movement direction that is opposite to the moving direction of the substrate W.
[0063]
When the substrate W is transported in the backward movement direction indicated by the arrow Y in FIG. 5B, the second opening / closing control valve 58 is opened and the first opening / closing control valve 57 is closed. As a result, the stripping solution is sprayed from the second shower pipe 52 in the forward movement direction that is opposite to the moving direction of the substrate W.
[0064]
The first and second pumps 54 and 56 are always operated. When one of the first and second open / close control valves 57 and 58 is closed, one of the supply valves provided with the control valve is closed. The internal pressure of the liquid pipe 53 or 55 increases. In this case, the stripping solution in the supply pipe whose internal pressure has increased is opened by a relief valve (not shown) at that pressure, and returned to a tank (not shown) that is a supply source of the stripping solution through the relief valve.
[0065]
According to the processing chamber 4 having such a configuration, when the substrate W is carried into the peeling chamber 4 from the loading chamber 3 and reaches a predetermined position, first, the transfer of the substrate W is stopped. Next, the transport shaft 11 in the peeling chamber 4 is driven to rotate alternately every predetermined time in the forward direction and the reverse direction. Thereby, the substrate W is reciprocated in the peeling chamber 4.
[0066]
In conjunction with the reciprocating drive of the substrate W, the stripping solution is alternately sprayed from the first shower pipe 51 and the second shower pipe 52 onto the substrate W. That is, when the substrate W is transported in the reciprocating movement direction indicated by the arrow X in FIG. 5A, the first shower pipe 51 is moved in the backward movement direction that is opposite to the forward movement direction of the substrate W. A stripping solution is sprayed toward it.
[0067]
When the substrate W is transported in the reciprocating direction of the reciprocating motion indicated by the arrow Y in FIG. 5B, the second shower pipe 52 is directed in the forward direction that is opposite to the backward direction of the substrate W. Stripping solution is sprayed.
[0068]
In this way, by switching the spraying direction of the stripping solution to the opposite direction to the movement of the substrate W that is driven to reciprocate, not only the stripping solution can be sprayed uniformly over the entire surface of the substrate W but also the substrate W and the stripping solution. And the relative speed increases. Thereby, not only the entire surface of the substrate W is processed uniformly, but also the processing speed by the stripping solution is improved, so that the processing time can be shortened.
[0069]
The present invention is not limited to the above-described embodiments. For example, the substrate is not limited to a glass substrate for a liquid crystal panel, and may be a semiconductor wafer. In addition, the peeling chamber using the peeling liquid is exemplified as the processing chamber. However, an etching chamber may be used instead of the peeling chamber. In short, the processing that requires the substrate to be processed uniformly and quickly in the chamber is performed. The present invention can be applied if it is performed.
[0070]
【The invention's effect】
As described above, according to the present invention, it is possible to perform substrate processing with a processing solution uniformly and in a short processing time.
[Brief description of the drawings]
FIG. 1 is a schematic view of a processing apparatus showing a first embodiment of the present invention.
FIG. 2 is an explanatory diagram of a portion of the peeling chamber on the end side in the transport direction of the substrate.
FIGS. 3A to 3D are explanatory views showing a relationship between a substrate and a swing table. FIGS.
FIG. 4 is an explanatory view of a peeling chamber showing a second embodiment of the present invention.
FIGS. 5A and 5B are explanatory views when supplying a stripping solution to a substrate that is driven to reciprocate.
[Explanation of symbols]
4. Peeling chamber (processing chamber)
11 ... Conveying shaft (conveying means)
12 ... Conveying roller (conveying means)
18 ... Control device 24 ... Oscillating mechanism 25 ... Oscillating table 35 ... Shower pipe (treatment liquid supply means)
51. First shower pipe (treatment liquid supply means)
52 ... Second shower pipe (treatment liquid supply means)
57 ... 1st opening / closing control valve 58 ... 2nd opening / closing control valve

Claims (2)

In a processing apparatus for processing a substrate with a processing liquid,
Conveying means for conveying the substrate;
A processing chamber into which the substrate transported by the transport means is loaded;
A processing liquid supply means for supplying a processing liquid to the upper surface of the substrate carried into the processing chamber;
Comprising a swinging mechanism for flowing the process liquid supplied to the upper surface of the substrate by swinging the substrate provided in the processing chamber in a predetermined direction,
The swing mechanism is provided on each of the swing table and one end side and the other end side of the swing table in the transport direction of the substrate, and the swing table is disposed below the substrate transported by the transport means. A lowering state, a floating state in which the substrate is lifted from the conveying means, a first inclined state in which one end on the downstream side in the conveying direction from the floating state is lower than the other end, and a direction opposite to the first inclined state An apparatus for processing a substrate, comprising: a pair of linear motors or air cylinders that are driven in a second tilted state . In a processing method of processing a substrate with a processing liquid,
Carrying the substrate into the processing chamber by a transfer means ;
Supplying a processing liquid to the substrate carried into the processing chamber;
A first inclined state in which the substrate carried into the processing chamber is levitated from the transport means by a swing table provided in the processing chamber so that one end on the downstream side in the transport direction is lower than the other end. Driving to a second inclined state inclined in a direction opposite to the inclined state to flow the processing liquid supplied to the upper surface of the substrate;
A substrate processing method characterized by comprising:

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