JP4206178B2 - Substrate processing apparatus and substrate processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the foot-printing in a substrate treating system. SOLUTION: In the substrate treating system 101 having a delivery part 120 for transferring and placing a substrate 8 on a transporting structure 131 from a conveyer, a chemical nozzle 134 for forming the paddle of a developer in a single treating chamber 132 and a pure water nozzle 135 for washing with water are provided. The developer is applied on the substrate 8 transported to the inside of the treating chamber 132 through a shutter 133 and, after that, the substrate 8 is inclined and washed with water. At the time of carrying out the substrate 8, the liquid is removed with an air knife 137. As a result, the development and the washing are performed with the single treating chamber 132 and the foot-printing in the substrate treating system 101 is reduced compared to the conventional case separately using a developing part and a washing part.

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention belongs to a technique for performing processing using a processing liquid on a substrate such as a glass substrate or a printed substrate used for manufacturing a liquid crystal display, a plasma display, or the like.
[0002]
[Prior art]
FIG. 21 is a diagram showing a configuration of a conventional substrate processing system 901 that performs processing on a glass substrate for liquid crystal display (hereinafter referred to as “substrate”). As shown in FIG. 21, in the conventional substrate processing system 901, a substrate that is placed on a conveyor 911 and moves in a direction indicated by an arrow 911A includes a delivery unit 921, a chemical solution processing unit 922, a water washing unit 923, and a drying unit. It goes through the part 924 in order.
[0003]
The substrate moving on the conveyor 911 is adjusted in movement timing by the delivery unit 921 and processed (for example, development) using a chemical solution by the chemical solution processing unit 922. Subsequently, the substrate is washed with pure water in the water washing unit 923, and liquid is removed by an air knife in the drying unit 924.
[0004]
Further, as shown in FIG. 22, the delivery unit 921 takes out the substrate conveyed on the conveyor 911 in the direction indicated by the arrow 911A, and the substrate moves on the separately provided conveyance mechanism, whereby the chemical solution processing unit 922 is obtained. In addition, a substrate processing system 902 that performs chemical treatment, water washing and drying on a substrate in the water washing unit 923 and the drying unit 924 has also been proposed. That is, in the substrate processing system 902 shown in FIG. 22, the substrate is processed at a position away from the conveyor 911.
[0005]
Furthermore, as shown in FIG. 23, a substrate processing system 903 configured to place a plurality of substrates on a loader 931 in a state of being accommodated in a cassette and accommodate a processed substrate in an unloader 932 has also been proposed. . In the case of the substrate processing system 903, the transfer robot 941 is positioned at the center of the system, and the chemical solution processing unit 942, the water washing unit 943, and the drying unit 944 are disposed around the transfer robot 941. Then, the substrate is sequentially transferred to the loader 931, the chemical solution processing unit 942, the water washing unit 943, the drying unit 944, and the unloader 932 by the transfer robot 941.
[0006]
[Problems to be solved by the invention]
As shown in FIGS. 21 to 23, in the conventional substrate processing system, a dedicated processing unit (that is, a substrate processing apparatus) is arranged for each of chemical processing, water washing and drying. . Therefore, the footprint (occupied floor area) of the substrate processing system includes an area sufficient to arrange these processing units.
[0007]
However, since processing of a substrate on which a precise circuit pattern is formed is performed in a clean room where high cleanliness is maintained, reduction of the footprint of the substrate processing system is an important issue for cost reduction.
[0008]
Accordingly, an object of the present invention is to provide a substrate processing apparatus and a substrate processing system that can realize a reduction in footprint.
[0009]
[Means for Solving the Problems]
The invention of claim 1 is a substrate processing apparatus for processing a substrate, wherein a space for performing the substrate processing is formed, and a substrate is taken into and out of the space. single A processing means for performing a plurality of processes including a process with a chemical solution and a cleaning with pure water on a substrate using a single process chamber having an opening and a plurality of different types of process liquids including a chemical solution in the process chamber. And the substrate toward the processing chamber In a horizontal position A conveying means for linearly conveying the substrate conveyed into the processing chamber by the conveying means, Inclination means for inclining about an axis parallel to the transport direction, support means for supporting an inclined substrate in the processing chamber, and recovery provided in the processing chamber for receiving a chemical solution from the substrate bat And the recovery bat Receive chemicals from the substrate and from the substrate. Pure water The substrate is drained by ejecting a gas toward the substrate in the vicinity of the opening and switching means for switching between the state of avoiding the state Air knife The processing means is provided in the vicinity of the opening of the processing chamber, extends in a direction intersecting the substrate transport direction by the transport means, and has substantially the same length as the substrate in the intersecting direction. And a first nozzle provided in the processing chamber, extending in the transport direction and having substantially the same length as the substrate in the transport direction. By supplying the first processing liquid to the entire surface of the substrate carried in the processing chamber in a horizontal posture through the opening by the transport means, the first processing liquid is placed on the entire upper surface of the substrate, Slope The means is configured to remove the substrate after a predetermined time has elapsed in the processing chamber in a state where the first processing liquid is accumulated. Slope Then, the first processing liquid deposited on the upper surface of the substrate is drained, and after the liquid has been drained, the second nozzle applies the second processing liquid to the substrate supported in an inclined posture by the support means. It is characterized by supplying.
[0010]
The invention of claim 2 is a substrate processing apparatus for processing a substrate, wherein a single processing chamber forming a space in which the substrate processing is performed, and a plurality of different types of processing including a chemical solution in the processing chamber. Processing means for applying a plurality of treatments to the substrate, including treatment with a chemical solution and cleaning with pure water, using the solution, and the substrate toward the treatment chamber. In a horizontal position Conveying means for conveying linearly; Inclining means for inclining a substrate transported into the processing chamber by the transporting means about an axis parallel to the transporting direction, and a substrate tilted in the processing chamber A support means capable of supporting; A recovery bat provided in the processing chamber for receiving a chemical from the substrate And the recovery bat Receive chemicals from the substrate and from the substrate. Pure water The substrate is drained by jetting gas toward the substrate in the vicinity of the opening of the processing chamber, and switching means for switching between a state to avoid the state Air knife The processing means is provided in the processing chamber, extends in the substrate transport direction by the transport means, and has a first nozzle having substantially the same length as the substrate in the transport direction, and the processing A second nozzle provided in a room, extending in the transport direction and having a length substantially the same as the substrate in the transport direction, and supported by the support means in a tilted posture. In addition, after the first processing liquid is supplied from the first nozzle, the second processing liquid is supplied from the second nozzle.
[0014]
The invention of claim 3 is a substrate processing system for processing a substrate, comprising: a plurality of substrate processing apparatuses; and a delivery means for delivering a substrate to the plurality of substrate processing apparatuses, wherein the plurality of substrates Each of the processing devices forms a space where substrate processing is performed, and is used for loading and unloading the substrate into and out of the space. single A processing means for performing a plurality of processes including a process with a chemical solution and a cleaning with pure water on a substrate using a single process chamber having an opening and a plurality of different types of process liquids including a chemical solution in the process chamber. And the substrate toward the processing chamber In a horizontal position A conveying means for linearly conveying the substrate conveyed into the processing chamber by the conveying means, Inclination means for inclining about an axis parallel to the transport direction, support means for supporting an inclined substrate in the processing chamber, and recovery provided in the processing chamber for receiving a chemical solution from the substrate bat And the recovery bat Receive chemicals from the substrate and from the substrate. Pure water The substrate is drained by ejecting a gas toward the substrate in the vicinity of the opening and switching means for switching between the state of avoiding the state Air knife The processing means is provided in the vicinity of the opening of the processing chamber, extends in a direction intersecting the substrate transport direction by the transport means, and has substantially the same length as the substrate in the intersecting direction. And a first nozzle provided in the processing chamber, extending in the transport direction and having substantially the same length as the substrate in the transport direction. By supplying the first processing liquid to the entire surface of the substrate carried in the processing chamber in a horizontal posture through the opening by the transport means, the first processing liquid is placed on the entire upper surface of the substrate, Slope The means is configured to remove the substrate after a predetermined time has elapsed in the processing chamber in a state where the first processing liquid is accumulated. Slope Then, the first processing liquid deposited on the upper surface of the substrate is drained, and after the liquid has been drained, the second nozzle applies the second processing liquid to the substrate supported in an inclined posture by the support means. It is characterized by supplying.
According to a fourth aspect of the present invention, there is provided a substrate processing system for processing a substrate, comprising: a plurality of substrate processing apparatuses; and a delivery means for delivering a substrate to the plurality of substrate processing apparatuses, the plurality of substrates. Each of the processing apparatuses uses a single processing chamber that forms a space in which substrate processing is performed, and a plurality of different types of processing liquids including a chemical solution in the processing chamber. Processing means for applying a plurality of processes to the substrate, and the substrate toward the processing chamber In a horizontal position Conveying means for conveying linearly; The substrate transported into the processing chamber by the transport means is parallel to the transport direction. axis And tilting means for tilting the substrate around the substrate, and a substrate in a tilted posture in the processing chamber. A support means capable of supporting; A recovery bat provided in the processing chamber for receiving a chemical from the substrate And the recovery bat Receive chemicals from the substrate and from the substrate. Pure water The substrate is drained by jetting gas toward the substrate in the vicinity of the opening of the processing chamber, and switching means for switching between a state to avoid the state Air knife The processing means is provided in the processing chamber, extends in the substrate transport direction by the transport means, and has a first nozzle having substantially the same length as the substrate in the transport direction, and the processing A second nozzle provided in a room, extending in the transport direction and having a length substantially the same as the substrate in the transport direction, and supported by the support means in a tilted posture. In addition, after the first processing liquid is supplied from the first nozzle, the second processing liquid is supplied from the second nozzle.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
<1. First Embodiment>
FIG. 1 is a plan view schematically showing the configuration of a substrate processing system 101 according to the present invention. In the following description, the XYZ directions shown in FIG. The substrate processing system 101 is a system that sequentially performs development, water washing (cleaning with pure water), and drying (liquid removal) on a glass substrate for liquid crystal display (hereinafter referred to as “substrate”).
[0017]
The substrate processing system 101 is a system that receives a substrate conveyed from an upstream apparatus on the conveyor 111 in a direction indicated by an arrow 111 </ b> A, processes the substrate, and returns the substrate to the conveyor 111 again. It is comprised from the delivery part 120 and the process part 130 which performs a some process to a board | substrate. The processed substrate is transported in the direction indicated by arrow 111B and sent to the downstream apparatus. A part of the conveyor 111 may be regarded as a part of the substrate processing system 101.
[0018]
The delivery unit 120 has a transfer mechanism 121 that delivers a substrate to and from the conveyor 111, and the processing unit 130 has a transport mechanism 131 that delivers the substrate to and from the transfer mechanism 121. With such a configuration, the transfer mechanism 121 takes out the substrate 8 once stopped on the conveyor 111 and transfers it to the transport mechanism 131, and the transport mechanism 131 transports the substrate into the processing unit 130 (X direction). In the processing unit 130, the substrate transported by the transport mechanism 131 is processed, and the processed substrate is again guided out of the processing unit 130 by the transport mechanism 131. Thereafter, the substrate is picked up from the transport mechanism 131 by the transfer mechanism 121 and returned to the conveyor 111. That is, the substrate reciprocates between the conveyor 111 and the processing unit 130 by the delivery unit 120 as indicated by an arrow 121A.
[0019]
FIG. 2 is a diagram showing an internal configuration of the substrate processing system 101, and is a longitudinal sectional view when viewed in the Y direction shown in FIG. 1 at the position of the transport mechanism 131.
[0020]
As shown in FIG. 2, the transport mechanism 131 has a configuration in which a plurality of rollers 131a are arranged in the X direction, and a substrate 8 on the transport mechanism 131 is rotated by rotating a part (or all) of these rollers 131a. Is linearly conveyed in the X direction. Further, the portion in the processing unit 130 of the transport mechanism 131 also plays a role of supporting the substrate 8 to be processed.
[0021]
The transport mechanism 131 is arranged so as to extend from the delivery unit 120 to the inside of the processing unit 130, and the transfer mechanism 121 of the delivery unit 120 transfers the substrate 8 from the conveyor 111 to the transport mechanism 131 outside the processing unit 130. To do. As the transfer mechanism 121, a conveyor may be used, a chuck mechanism that holds the outer edge portion of the substrate 8, or a robot that holds the substrate 8 by suction may be used.
[0022]
The processing unit 130 has a single processing chamber 132 that forms a space 132S in which a plurality of processings are performed on the substrate 8 using a plurality of different types of processing liquids that are chemical solutions and pure water. The substrate 8 is taken in and out through a loading / unloading port provided with an openable / closable shutter 133. The shutter 133 is provided to prevent the liquid that scatters inside the processing chamber 132 from entering the delivery unit 120 side.
[0023]
Above the transport mechanism 131 inside the processing chamber 132, a chemical nozzle 134 having a slit for discharging a developer as a chemical, and pure water as a cleaning liquid are sprayed in a spray form (that is, a plurality of nozzle openings are formed in the pipe). ) A pure water nozzle 135 is disposed. The chemical nozzle 134 has a shape extending in the Y direction, and the pure water nozzle 135 has a shape extending in the X direction (see FIG. 3).
[0024]
Two air knives 137 are arranged on the outside of the carry-in / out port as viewed from the processing chamber 132 so as to sandwich the transport mechanism 131 from above and below, and these air knives 137 have a function of removing the liquid adhering to the substrate 8 to be carried out. . In addition, the processing unit 130 is provided with a control unit 138 that controls the entire operation, and operation control of each component inside the transport mechanism 131, the air knife 137, and the processing chamber 132 is appropriately performed.
[0025]
FIG. 3 is a cross-sectional view showing a state when the inside of the processing unit 130 is viewed in the (−X) direction, and a piping system connected to the processing unit 130 is also illustrated.
[0026]
As shown in FIG. 3, the chemical nozzle 134 is a slit type nozzle having substantially the same length as the substrate 8 in the Y direction. A chemical solution supply unit 241 that supplies a chemical solution that is a developing solution is connected to the chemical solution nozzle 134. On the other hand, as shown in FIG. 2, the pure water nozzle 135 is a spray-type nozzle having substantially the same length as the substrate 8 in the X direction, and pure water is supplied from the pure water supply unit 251 through the valve 252. It is possible.
[0027]
A drain (discharge pipe) that discharges the processing liquid is connected to the lower portion of the processing chamber 132, and the liquid discharged from the processing chamber 132 is guided to the outside of the processing unit 130 or the recovery tank 253 via the valve 242. . The recovery tank 253 is a tank that recovers reusable used pure water, and the used pure water is supplied again from the recovery tank 253 to the pure water nozzle 135 through the valve 252 by the action of the pump 254. Is possible.
[0028]
A part of the plurality of rollers 131a in the processing chamber 132 is connected to the cylinder 131b, and can be rotated around a support member 131c (an axis facing the X direction) by the action of the cylinder 131b. . The manner in which the cylinder 131b is operated to tilt the substrate 8 together with the roller 131a will be described later.
[0029]
The operation of the chemical solution supply unit 241, the pure water supply unit 251, the various valves, the pump, and the cylinder 131b shown in FIG.
[0030]
Next, the operation of the substrate processing system 101 will be described. 4 and 5 are flow charts showing the flow of operations for one substrate 8 until it is taken out from the conveyor 111, processed, and returned to the conveyor 111 again.
[0031]
First, the substrate 8 is transferred from the conveyor 111 to the transfer mechanism 131 by the transfer mechanism 121 (step S11). FIG. 2 shows the state of the substrate 8 at this time. Thereafter, the shutter 133 is opened and the chemical solution is supplied from the chemical solution supply unit 241 to the chemical solution nozzle 134, and the chemical solution is discharged from the chemical solution nozzle 134 in a curtain shape extending in the Y direction (step S12).
[0032]
Subsequently, the loading of the substrate 8 into the processing chamber 132 is started as indicated by an arrow 131A in FIG. 2 (step S13). In FIG. 6, the carry-in port 133a (which becomes a carry-out port when the substrate 8 is carried out) is opened by the movement of the shutter 133, and the operation of the roller 131a moves the substrate 8 in the direction indicated by the arrow 131A. It is a figure which shows a mode that it carries in into the chamber 132. FIG. When the tip of the substrate 8 reaches below the chemical nozzle 134, the chemical 81 is sequentially deposited from the tip of the substrate 8.
[0033]
At this time, as indicated by a thick line in FIG. 3, the chemical solution is supplied from the chemical solution supply unit 241 to the chemical solution nozzle 134, and the chemical solution spilled into the processing chamber 132 is discharged out of the processing unit 130 through the valve 242. The In the following figures, the flow of the liquid is also indicated by bold lines as appropriate.
[0034]
When the substrate 8 is completely carried into the processing chamber 132, the conveyance by the conveyance mechanism 131 is stopped and the discharge of the chemical solution from the chemical solution nozzle 134 is also stopped. Further, the shutter 133 closes the carry-in port 133a (step S14). FIG. 7 is a diagram showing the state of the substrate 8 at this time, and a state in which the chemical solution 81 is formed on the entire upper surface of the substrate 8 using surface tension (that is, a paddle is formed). In the state shown in FIG. 7, the substrate 8 is left for a certain period of time (step S <b> 15), whereby the upper surface of the substrate 8 is developed with a chemical solution.
[0035]
When the development is completed, the roller 131a in the processing chamber 132 indicated by reference numeral 131d in FIG. 7 rotates about the axis facing the X direction to tilt the substrate 8 (step S16). FIG. 8 is a diagram showing the state of the substrate 8 at this time. When the cylinder 131b pushes one end of the roller 131a upward, the roller 131a rotates around the support member 131c, and the substrate 8 is inclined together with the roller 131a. To do. As a result, the used chemical solution on the substrate 8 flows down from the substrate 8 as indicated by an arrow 81a, and the chemical solution is drained. The chemical liquid that has flowed down to the bottom surface of the processing chamber 132 is guided to the valve 242 through the drain and discharged to the outside.
[0036]
When the chemical liquid is completely drained, the pump 254 is then operated as shown in FIG. 9, and the used pure water in the collection tank 253 (the pure water used in the previous substrate washing) is the valve 252. And supplied to the pure water nozzle 135 (step S21). The pure water nozzle 135 has a length that substantially covers the substrate 8 in the X direction, and jets pure water to the highest position of the inclined substrate 8. As a result, pure water flows down the entire surface of the substrate 8 as shown by arrows 81b and 81c in FIG. 9, and the entire surface of the substrate 8 can be efficiently washed with water. The reused pure water is appropriately returned from the drain via the valve 242 to the recovery tank 253 or discharged outside the processing unit 130.
[0037]
When a certain amount of washing is completed by washing with used pure water, pure water supplied to the pure water nozzle 135 is switched from the pure water nozzle 135 by switching the valve 252 as shown in FIG. Switch to pure water. Thereby, more advanced water washing is performed (step S22). The pure water used in this process is collected in the collection tank 253 via the valve 242 and used for the next substrate washing with water.
[0038]
When the above two types of water washing (so-called circulating water washing and direct water washing) are completed, the substrate 8 is returned to the horizontal posture again by the operation of the cylinder 131b (step S23). After that, as shown in FIG. 11, the shutter 133 is opened, and the substrate 8 is unloaded by being conveyed on the roller 131a of the conveying mechanism 131 through the carry-out port 133a in the direction indicated by the arrow 131B. At this time, air is ejected from the air knife 137 provided near the outside of the carry-out port 133a toward the upper and lower main surfaces of the substrate 8, and the pure water adhering to the substrate 8 is drained (dried) ( Steps S25 and S26).
[0039]
When the entire substrate 8 is carried out from the processing chamber 132 to the delivery unit 120 side, the conveyance of the substrate 8 is stopped, the ejection of air from the air knife 137 is stopped, and the shutter 133 is closed (step S27). Thereby, the draining of the substrate 8 is completed.
[0040]
Thereafter, the substrate 8 is transferred from the transport mechanism 131 to the conveyor 111 by the transfer mechanism 121 of the delivery unit 120 (step S28). The board | substrate 8 on the conveyor 111 is conveyed toward a downstream apparatus.
[0041]
As described above, the configuration and operation of the substrate processing system 101 have been described. In the substrate processing system 101, development and washing can be performed in the single processing chamber 132 of the processing unit 130. The footprint of the processing unit, that is, the footprint of the substrate processing system can be reduced as compared with the case where the developing unit and the water washing unit are configured using separate processing chambers. As a result, the clean room can be used efficiently, and the manufacturing cost of the substrate 8 can be reduced.
[0042]
<2. Second Embodiment>
FIG. 12 and FIG. 13 are diagrams showing the configuration of the substrate processing system 101a according to the second embodiment of the present invention, and correspond to FIG. 2 and FIG. 3 in the first embodiment. The plan view of the substrate processing system 101a is the same as that of FIG. 1, and FIG. 13 shows a state where the substrate 8 is tilted.
[0043]
The processing unit 130a of the substrate processing system 101a is compared with the processing unit 130 according to the first embodiment, a slit-type chemical solution nozzle 134a having a length equal to or longer than the length of the substrate 8 in the transport direction (X direction). And a recovery bat 136 for recovering a used chemical (developer) is provided below the processing chamber 132 (below the lowest end of the inclined substrate 8). ing. The recovery bat 136 is rotatable about an axis facing the X direction by a motor 136a.
[0044]
Further, as a configuration for using the used chemical liquid, a chemical liquid tank 244 connected to the recovery bat 136 via the valve 243, and a pump 245 for supplying the chemical liquid in the chemical liquid tank 244 to the chemical liquid nozzle 134a are further provided. Prepare. The chemical solution supply unit 241 is connected to the chemical solution tank 244. Therefore, the valve 255 provided between the drain connected to the lower portion of the processing chamber 132 and the used pure water recovery tank 253 is used as a switching valve dedicated to pure water.
[0045]
Other configurations of the delivery unit 120 and the processing unit 130a are the same as those in the first embodiment, and the same reference numerals are used in FIGS. 12 and 13. In the following description, the same reference numerals used in the first embodiment will be given for explanation.
[0046]
Next, the operation of the substrate processing system 101a will be described with reference to FIG.
[0047]
First, as in the first embodiment, when the substrate 8 is transferred from the conveyor 111 to the transport mechanism 131 by the transfer mechanism 121 (step S31), the shutter 133 of the processing chamber 132 is opened and the substrate 8 is moved. It is carried into the processing chamber 132 (Steps S32 and S33), and the shutter 133 is closed (Step S34).
[0048]
Thereafter, the cylinder 131b is operated to place the substrate 8 in an inclined posture (step S35). At this time, the recovery bat 136 is positioned at a position for recovering the chemical as indicated by the solid line in FIG. 13 by the operation of the motor 136a (step S36). In this state, the chemical liquid in the chemical liquid tank 244 is supplied to the chemical liquid nozzle 134a by the operation of the pump 245, and the curtain-shaped chemical liquid is discharged to the highest position of the inclined substrate 8. As a result, the chemical solution flows over the entire upper surface of the substrate 8, and the treatment (development) with the chemical solution is efficiently performed on the entire upper surface of the substrate 8 (step S37).
[0049]
The chemical solution flowing down from the substrate 8 is received by the recovery bat 136 and is appropriately discarded or recovered in the chemical solution tank 244 via the valve 243. Further, the chemical solution is supplied from the chemical solution supply unit 241 to the chemical solution tank 244 as necessary.
[0050]
When the development is completed, the discharge of the developer is stopped, and the recovery bat 136 is positioned to avoid the processing solution (developer) flowing down from the substrate 8 as shown by the broken line in FIG. 13 by the action of the motor 136a (step S38). ).
[0051]
In this state, water washing in the next process is started. In addition, since the used pure water in the first stage at the time of rinsing contains a lot of chemical components, it is used from the valve 243 with the recovery bat 136 positioned at a position for receiving the liquid from the substrate 8 until immediately after the start of rinsing. The used pure water may be discarded, and then the collection vat 136 may be moved to a position where the liquid from the substrate 8 is avoided to collect the used pure water in the collection tank 253.
[0052]
The steps after the water washing are the same as those in the first embodiment, and the operations after step S21 in FIG. 5 are performed. That is, after washing with used pure water (step S21), high-grade washing is performed with unused pure water (step S22), and the substrate 8 is returned to a horizontal posture (step S23).
[0053]
Further, the shutter 133 is opened and the air knife 137 is operated (steps S24 and S25), and the pure water adhering to the substrate 8 is drained by unloading the substrate 8 (step S26). When the substrate 8 is unloaded, the air knife 137 is stopped and the shutter 133 is closed (step S27), and the substrate 8 is returned from the transport mechanism 131 to the conveyor 111 by the transfer mechanism 121 (step S28).
[0054]
The configuration and operation of the substrate processing system 101a have been described above. In the substrate processing system 101a, development and water washing can be performed in the single processing chamber 132, and the processing unit is the same as in the first embodiment. The footprint of 130a can be reduced (the footprint of the substrate processing system 101 can be reduced).
[0055]
In the processing unit 130a, a recovery bat 136 is provided, and the recovery bat 136 can be moved between a position where the processing liquid from the substrate 8 is received and a position where the processing liquid from the substrate 8 is avoided. It is possible to collect the processing liquid (ie, the chemical liquid and pure water) used for the above in an appropriate manner. As a result, the processing liquid can be used efficiently, and the manufacturing cost of the substrate 8 can be reduced.
[0056]
<3. Third Embodiment>
FIG. 15 is a diagram for explaining the configuration of the processing unit 130b in the substrate processing system according to the third embodiment of the present invention. The overall configuration of the substrate processing system is as shown in FIG. 1, and the arrangement relationship between the delivery unit 120 and the processing unit 130b is the same as that in FIG.
[0057]
Compared with the processing unit 130a according to the second embodiment (see FIGS. 12 and 13), the processing unit 130b according to the third embodiment can use two types of chemicals, that is, a developer and an etching solution. It is different in that it can be done. Specifically, as shown in FIG. 15, a chemical solution supply unit 341, a spray-type chemical solution nozzle 334, a recovery bat 336, a motor 336a, a valve 343, a chemical solution tank 344, and a pump are provided as a configuration for supplying the etching solution to the substrate 8. 345, and another configuration related to the chemical solution of the processing unit 130a according to the second embodiment is added. In FIG. 15, the same reference numerals are given to other configurations similar to those of the second embodiment. Also in the following description, description will be made using the reference numerals attached to FIGS. 1, 12 and 13 as appropriate.
[0058]
FIG. 16 is a flowchart showing an outline of the operation of the substrate processing system according to the third embodiment. First, when the substrate 8 is carried into the processing chamber 132 from the conveyor 111 via the transfer mechanism 121 and the transport mechanism 131, the substrate 8 is tilted, and the developer is discharged from the chemical nozzle 134a in a curtain shape. Thereby, the development of the substrate 8 is performed (step S41). At this time, the recovery bat 136 is located at a position for receiving the processing liquid from the substrate 8 as indicated by a broken line, and the developer flowing down from the substrate 8 is recovered in the chemical liquid tank 244. These steps are the same as steps S31 to S37 shown in FIG. During development, the recovery bat 336 is positioned so as to avoid the processing liquid from the substrate 8 as indicated by a solid line.
[0059]
When the development is completed, the recovery bat 136 moves to a position where the processing liquid from the substrate 8 is avoided, and water washing is performed in a state where both of the recovery bats 136, 336 are positioned so as to avoid the processing liquid flowing down from the substrate 8. S42). The water washing process is the same as steps S21 and S22 in FIG. 5, and a circulating water washing using circulating water and a direct water washing using unused pure water are performed.
[0060]
When the washing with water is completed, the etching liquid is then sprayed out from the chemical nozzle 334 to perform etching (step S43). At this time, the recovery bat 336 is moved to a position for receiving the processing liquid flowing down from the substrate 8 as shown by a broken line in FIG. 15 by the action of the motor 336a. As a result, the etching solution flowing down from the substrate 8 is collected in the chemical solution tank 344 via the recovery bat 336 and the valve 343 and supplied from the chemical solution tank 344 to the chemical solution nozzle 334 via the pump 345.
[0061]
When the etching is completed, washing with water is performed again in a state where both of the recovery bats 136 and 336 are moved to the positions indicated by the solid lines (step S44). That is, circulating water washing and direct water washing are performed.
[0062]
When the washing with water is completed, the shutter 133 is opened and the air knife 137 is operated to remove the substrate 8 from the processing chamber 132 and drain the pure water adhering to the substrate 8 (step S45). Thereafter, the substrate 8 is returned from the transport mechanism 131 to the conveyor 111 via the transfer mechanism 121.
[0063]
As described above, in the processing unit 130b according to the third embodiment, all the processes of development, etching, and water washing can be performed in the single processing chamber 132. There is no need to separately provide a developing unit, an etching unit, a washing unit, and the like. Thereby, the footprint of the processing unit and the substrate processing system can be greatly reduced.
[0064]
<4. Fourth Embodiment>
FIG. 17 is a plan view showing the configuration of a substrate processing system 101b according to the fourth embodiment of the present invention. As illustrated in FIG. 17, the substrate processing system 101 b includes one delivery unit 420 and four processing units 430. Note that a part of the conveyor 111 may be regarded as being included in the substrate processing system 101b.
[0065]
The four processing units 430 have the same configuration as any of the processing units according to the first to third embodiments. However, as illustrated in FIG. 17, the processing unit 430 located on the same side with respect to the conveyor 111 shares the transport mechanism 431. The delivery unit 420 also has two transfer mechanisms 421 so that the substrate 8 on the conveyor 111 can be transferred to any of the transport mechanisms 431 located on both sides of the conveyor 111.
[0066]
Next, features of the substrate processing system 101b in the case where the four processing units 430 have the same configuration as the processing units according to the first or second embodiment will be described.
[0067]
When each of the four processing units 430 can perform development, water washing, and drying (liquid draining), the substrate 8 that has been transported on the conveyor 111 from the upstream as indicated by an arrow 111A is transferred to the delivery unit 420. One of the transfer mechanisms 421 is transferred to one transport mechanism 431. Further, the substrate 8 transferred onto the transport mechanism 431 is guided to one of the two processing units 430 sharing the transport mechanism 431, and development, washing and drying are performed. Thereafter, the substrate 8 is returned to the conveyor 111. The substrate 8 returned to the conveyor 111 is guided to a downstream apparatus as indicated by an arrow 111B.
[0068]
In this way, in the substrate processing system 101b, the transport mechanism 431 (a part thereof) and the transfer mechanism 421 are shared between the two processing units 430. Therefore, it is possible to improve the degree of processing capability (processing capability per unit occupied floor area) for the footprint of the substrate processing system 101b while having the maximum processing capability by the four processing units 430.
[0069]
The number of processing units 430 connected to the delivery unit 420 is not limited to four, and may be two or three. When the number of processing units 430 is two, it is possible to use the delivery unit 120 shown in FIG. 1 almost as it is. The number of processing units 430 may be flexibly changed in accordance with an increase or decrease in the number of substrates to be processed (that is, processing capability and processing tact).
[0070]
Next, features of the substrate processing system 101b in the case where the four processing units 430 have the same configuration as the processing unit according to the third embodiment will be described.
[0071]
When the processing unit 430 can perform development, etching, washing with water, and drying (liquid draining), and the processing shown in FIG. 16 is performed in each processing unit 430, the transport mechanism 431 and the transfer mechanism 421 share the 4 The processing efficiency with respect to the footprint of the substrate processing system 101b can be improved while having the maximum processing capability realized by the two processing units 430.
[0072]
On the other hand, the processing unit 430 according to the third embodiment can also be used as a developing device that performs development, washing, and drying, or an etching device that performs etching, washing, and drying. Therefore, for example, in normal operation, when the four processing units 430 are operated as a developing device and a problem occurs in an etching device in another line, some of the four processing units 430 are used as etching devices. May be. Thereby, the fall of the processing efficiency of the board | substrate 8 can be suppressed.
[0073]
In normal operation, it is also effective to use the two processing units 430 as a developing device and the remaining two processing units 430 as an etching device. In this case, when the ratio of the substrate 8 to be developed and the substrate 8 to be etched that is conveyed on the conveyor 111 varies for any reason, any one of the processing units 430 is set as a developing function. It is possible to switch between the etching functions and process the substrate 8 conveyed on the conveyor 111 without delay.
[0074]
As described above, in the substrate processing system 101b according to the fourth embodiment, not only can the footprint of the processing unit 430 be reduced as in the first to third embodiments, but also the transfer mechanism 431 and the transfer mechanism. By sharing the mechanism 421, the processing efficiency for the footprint of the substrate processing system 101b can be improved.
[0075]
Further, by providing a plurality of processing units 430, the efficiency of substrate processing can be stabilized.
[0076]
<5. Fifth embodiment>
18 and 19 are plan views showing substrate processing systems 101c and 101d according to the fifth embodiment of the present invention. In these substrate processing systems, the processing units according to the first to third embodiments are applied to a cassette type substrate processing system. In the following description, reference numerals used in the respective embodiments are referred to as appropriate.
[0077]
A substrate processing system 101c shown in FIG. 18 includes a loader 511 for storing a plurality of unprocessed substrates 8 in a cassette around the transfer robot 520, an unloader 512 for storing a plurality of processed substrates 8 in a cassette, and a first In addition, the processing unit 530 having the same configuration as that of any of the processing units of the third embodiment is arranged. A part of the transport mechanism 131 of the processing unit 530 protrudes to the position where the transport robot 520 is disposed.
[0078]
In the substrate processing system 101 c, the unprocessed substrate 8 is taken out from the loader 511 and placed on the transport mechanism 131. Thereafter, the substrate 8 is carried into the processing chamber 132. Subsequently, a plurality of treatments are performed on the substrate 8 using a plurality of treatment liquids (chemical solution and pure water), and the substrate 8 is carried out to the transport robot 520 side while being drained by the air knife 137. The unloaded substrate 8 is returned to the unloader 512 by the transfer robot 520.
[0079]
As described above, in the substrate processing system 101c, the substrate 8 is transferred so as to sequentially pass through the loader 511, the processing unit 530, and the unloader 512. On the other hand, in the conventional cassette-type substrate processing system 903 shown in FIG. 23, it is necessary to transport the substrate through the loader 931, the chemical solution processing unit 942, the water washing unit 943, the drying unit 944, and the unloader 932 sequentially. In addition, the burden on the transfer robot 941 increases and the substrate processing efficiency decreases.
[0080]
As described above, the substrate processing system 101c can reduce the footprint of the processing unit 530 (that is, reduce the footprint of the substrate processing system 101c), as in the first to third embodiments. The processing efficiency of the substrate 8 can be improved.
[0081]
A substrate processing system 101d illustrated in FIG. 19 is a diagram illustrating a configuration in which another processing unit 530 is added around the transfer robot 520 in the substrate processing system 101c illustrated in FIG. Also in the substrate processing system 101d, the footprint can be reduced and the processing efficiency can be improved.
[0082]
In the substrate processing system 101d, since the two processing units 530 share the loader 511, the unloader 512, and the transfer robot 520, it is possible to improve the processing efficiency for the footprint while improving the processing capability.
[0083]
Furthermore, by using the processing unit 130b according to the third embodiment as the processing unit 530 of the substrate processing system 101d, the same effects as those of the substrate processing system 101b according to the fourth embodiment can be obtained. In other words, by appropriately switching the functions of the plurality of processing units 530, it is possible to suppress a reduction in substrate processing efficiency.
[0084]
<6. Modification>
Although the substrate processing system according to the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made.
[0085]
For example, the substrate processing system according to the first to fourth embodiments takes out the substrate 8 from the conveyor 111 and processes it, and the substrate processing system according to the fifth embodiment is a cassette type. As shown in FIG. 20, the present invention can be applied to a substrate processing system 101e that directly processes a substrate on a conveyor 111.
[0086]
The substrate processing system 101e includes a delivery unit 611 that adjusts the conveyance timing of the substrate that has been conveyed to the conveyor 111 as indicated by an arrow 111A, and a conveyance mechanism 131 of the processing unit according to the first to third embodiments. In addition, a processing chamber 612 having a portion other than the air knife 137 and a drying unit 613 that performs liquid drainage with the air knife are sequentially arranged. With such a configuration of the substrate processing system 101e, a plurality of processes can be performed in the single processing chamber 612, and the footprint of the substrate processing system can be reduced.
[0087]
In addition, various modifications can be made to the method of supplying the chemical solution to the substrate. For example, in the first embodiment, the chemical solution nozzle 134 can be moved in the conveyance direction of the substrate 8, and a chemical solution paddle is formed on the entire upper surface of the substrate 8 after the conveyance of the substrate 8 is stopped. It may be. Also in the second embodiment, the chemical nozzle 134a may be movable. Furthermore, the spray type nozzle is not limited to an elongated shape, and a short nozzle that ejects the processing liquid may swing.
[0088]
In the second and third embodiments, it has been described that the developer is discharged from the slit nozzle. However, a spray type nozzle may be used. In this case, nitrogen is purged into the processing chamber to prevent oxidation of the developer.
[0089]
Moreover, the content of the process performed to the board | substrate 8 is not limited to what was shown to the said embodiment, For example, arbitrary things, such as image development, an etching, peeling, chemical | medical solution washing | cleaning, and water washing, may be combined. In addition, when a plurality of types of processes using chemical solutions are performed, the inside of the processing chamber 132 may be cleaned every time one chemical process is performed.
[0090]
In the first embodiment, the chemical solution is not recovered. However, a recovery vat is provided so that the chemical solution is recovered (or discarded by a separate route from the pure water). Also good.
[0091]
Moreover, in the said embodiment, although it has become the conveyance mechanism 131 using the roller 131a, the conveyance mechanism 131 may be another. For example, a conveyor using a belt may be used.
[0092]
Moreover, in the said embodiment, although it is a substrate processing system which processes the glass substrate for liquid crystal displays, it can utilize even if it is another board | substrate. For example, it can be used for manufacturing a substrate (so-called rectangular substrate) such as a glass substrate or a printed circuit board used for manufacturing another type of FPD (for example, a plasma display).
[0093]
In the second and third embodiments, the recovery bat is rotated by a motor. However, the movement mechanism of the recovery bat may be a parallel movement. Further, the recovery bat may be provided with a lid to open and close the lid. In other words, any mechanism may be employed as long as the recovery bat switches between a state where it receives the processing liquid from the substrate and a state where it is avoided.
[0094]
In the above-described embodiment, the air knife 137 is disposed near the outside of the carry-out port (load-in port) 133a. However, the air knife 137 may be disposed near the carry-out port 133a in the processing chamber 132.
[0095]
In the fourth and fifth embodiments, the substrate processing system provided with a plurality of processing units has been described. However, more processing units may be connected to the delivery unit 420 and the transfer robot 520.
[0096]
【The invention's effect】
Claim 1 Or 2 In the invention described in (1), the footprint of the substrate processing apparatus can be reduced.
[0097]
Also ,medicine The treatment with the liquid and the cleaning with pure water can be performed in a single treatment chamber.
[0098]
Also ,place The scientific liquid can be used efficiently.
[0100]
Also , Group The liquid can be drained when the plate is carried out.
[0101]
Claim 3 And claim 4 In the invention described in (1), the processing efficiency for the footprint of the substrate processing system can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing an example of the configuration of a substrate processing system according to the present invention.
FIG. 2 is a longitudinal sectional view showing an internal configuration of the substrate processing system according to the first embodiment.
FIG. 3 is a longitudinal sectional view showing an internal configuration and the like of a processing unit according to the first embodiment.
FIG. 4 is a flowchart showing an operation flow of the substrate processing system according to the first embodiment.
FIG. 5 is a flowchart showing an operation flow of the substrate processing system according to the first embodiment;
FIG. 6 is a diagram showing a state during operation of the substrate processing system.
FIG. 7 is a diagram illustrating a state during operation of the substrate processing system.
FIG. 8 is a diagram showing a state in which a chemical solution on a substrate is drained.
FIG. 9 is a diagram showing a state during circulating water washing.
FIG. 10 is a diagram showing a state during direct water washing.
FIG. 11 is a diagram showing a state of liquid draining with an air knife.
FIG. 12 is a longitudinal sectional view showing an internal configuration of a substrate processing system according to a second embodiment.
FIG. 13 is a longitudinal sectional view showing an internal configuration and the like of a processing unit according to the second embodiment.
FIG. 14 is a flowchart showing an operation flow of the substrate processing system according to the second embodiment.
FIG. 15 is a longitudinal sectional view showing an internal configuration and the like of a processing unit according to a third embodiment.
FIG. 16 is a flowchart showing an outline of an operation flow of the substrate processing system according to the third embodiment;
FIG. 17 is a plan view showing a configuration of a substrate processing system according to a fourth embodiment.
FIG. 18 is a plan view showing an example of a configuration of a substrate processing system according to a fifth embodiment.
FIG. 19 is a plan view showing another example of the configuration of the substrate processing system according to the fifth embodiment.
FIG. 20 is a plan view showing another example of the configuration of the substrate processing system according to the present invention.
FIG. 21 is a plan view showing an example of the configuration of a conventional substrate processing system.
FIG. 22 is a plan view showing another example of the configuration of a conventional substrate processing system.
FIG. 23 is a plan view showing still another example of the configuration of a conventional substrate processing system.
[Explanation of symbols]
8 Board
81 chemicals
101b, 101c, 101d, 101e Substrate processing system
130, 130a, 130b, 430, 530 processing unit
131,431 transport mechanism
131a roller
131b cylinder
131c Support member
132,612 processing chamber
132S space
133a Unloading port
134, 134a, 334 Chemical liquid nozzle
135 Pure water nozzle
136,336 Recovery bat
136a, 336a motor
137 Air Knife
420 Delivery Department
520 transfer robot

Claims (4)

A substrate processing apparatus for processing a substrate,
To form a space in which a substrate processing is performed, and a single processing chamber having a single opening for loading and unloading a substrate into its interior,
In the processing chamber, using a plurality of different types of processing liquids including a chemical solution, a processing means for performing a plurality of processing including processing with a chemical solution and cleaning with pure water on a substrate,
Transport means for linearly transporting the substrate in a horizontal posture toward the processing chamber;
Tilting means for tilting the substrate transported into the processing chamber by the transporting means about an axis parallel to the transporting direction;
Support means capable of supporting a substrate in an inclined posture in the processing chamber;
A recovery bat provided in the processing chamber for receiving a chemical from the substrate ;
Switching means for switching the recovery bat between a state of receiving a chemical solution from a substrate and a state of avoiding pure water from the substrate;
An air knife that drains the substrate by blowing gas toward the substrate in the vicinity of the opening;
With
The processing means includes
A first nozzle that is provided in the vicinity of the opening of the processing chamber, extends in a direction intersecting the substrate transport direction by the transport means, and has substantially the same length as the substrate in the intersecting direction;
A second nozzle provided in the processing chamber, extending in the transport direction and having substantially the same length as the substrate in the transport direction;
With
The first nozzle supplies the first processing liquid to the entire surface of the substrate that is carried in the processing chamber in a horizontal posture through the opening by the transport means, so that the first nozzle is applied to the entire upper surface of the substrate. Pour processing liquid,
Said tilting means, in the processing chamber in a state where the first treatment liquid has been piled by inclining the substrate after a predetermined time has elapsed, the first treatment liquid drainer Mr. piled on the upper surface of the substrate ,
The substrate processing apparatus, wherein after the liquid is drained, the second nozzle supplies a second processing liquid to the substrate supported in an inclined posture by the support means. A substrate processing apparatus for processing a substrate,
A single processing chamber forming a space in which substrate processing is performed;
In the processing chamber, using a plurality of different types of processing liquids including a chemical solution, a processing means for performing a plurality of processing including processing with a chemical solution and cleaning with pure water on a substrate,
Transport means for linearly transporting the substrate in a horizontal posture toward the processing chamber;
Tilting means for tilting the substrate transported into the processing chamber by the transporting means about an axis parallel to the transporting direction;
Support means capable of supporting a substrate in an inclined posture in the processing chamber ;
A recovery bat provided in the processing chamber for receiving a chemical from the substrate ;
Switching means for switching the recovery bat between a state of receiving a chemical solution from a substrate and a state of avoiding pure water from the substrate;
An air knife that drains the substrate by blowing gas toward the substrate in the vicinity of the opening of the processing chamber;
With
The processing means includes
A first nozzle provided in the processing chamber, extending in a substrate transport direction by the transport means and having substantially the same length as the substrate in the transport direction;
A second nozzle provided in the processing chamber, extending in the transport direction and having substantially the same length as the substrate in the transport direction;
With
After supplying the first processing liquid from the first nozzle to the entire surface of the substrate supported in a tilted posture by the supporting means, the second processing liquid is supplied from the second nozzle. A substrate processing apparatus. A substrate processing system for processing a substrate,
A plurality of substrate processing apparatuses;
Delivery means for delivering a substrate to the plurality of substrate processing apparatuses;
With
Each of the plurality of substrate processing apparatuses includes:
To form a space in which a substrate processing is performed, and a single processing chamber having a single opening for loading and unloading a substrate into its interior,
In the processing chamber, using a plurality of different types of processing liquids including a chemical solution, a processing means for performing a plurality of processing including processing with a chemical solution and cleaning with pure water on a substrate,
Transport means for linearly transporting the substrate in a horizontal posture toward the processing chamber;
Tilting means for tilting the substrate transported into the processing chamber by the transporting means about an axis parallel to the transporting direction;
Support means capable of supporting a substrate in an inclined posture in the processing chamber;
A recovery bat provided in the processing chamber for receiving a chemical from the substrate ;
Switching means for switching the recovery bat between a state of receiving a chemical solution from a substrate and a state of avoiding pure water from the substrate;
An air knife that drains the substrate by blowing gas toward the substrate in the vicinity of the opening;
With
The processing means includes
A first nozzle that is provided in the vicinity of the opening of the processing chamber, extends in a direction intersecting the substrate transport direction by the transport means, and has substantially the same length as the substrate in the intersecting direction;
A second nozzle provided in the processing chamber, extending in the transport direction and having substantially the same length as the substrate in the transport direction;
With
The first nozzle supplies the first processing liquid to the entire surface of the substrate that is carried in the processing chamber in a horizontal posture through the opening by the transport means, so that the first nozzle is applied to the entire upper surface of the substrate. Pour processing liquid,
Said tilting means, in the processing chamber in a state where the first treatment liquid has been piled by inclining the substrate after a predetermined time has elapsed, the first treatment liquid drainer Mr. piled on the upper surface of the substrate ,
The substrate processing system, wherein the second nozzle supplies a second processing liquid to the substrate supported in an inclined posture by the support means after the liquid is drained. A substrate processing system for processing a substrate,
A plurality of substrate processing apparatuses;
Delivery means for delivering a substrate to the plurality of substrate processing apparatuses;
With
Each of the plurality of substrate processing apparatuses includes:
A single processing chamber forming a space in which substrate processing is performed;
In the processing chamber, using a plurality of different types of processing liquids including a chemical solution, a processing means for performing a plurality of processing including processing with a chemical solution and cleaning with pure water on a substrate,
Transport means for linearly transporting the substrate in a horizontal posture toward the processing chamber;
And tilting means for tilting the substrate transferred into the processing chamber, mainly in axis parallel to the conveying direction by the conveying means,
Support means capable of supporting a substrate in an inclined posture in the processing chamber ;
A recovery bat provided in the processing chamber for receiving a chemical from the substrate ;
Switching means for switching the recovery bat between a state of receiving a chemical solution from a substrate and a state of avoiding pure water from the substrate;
An air knife that drains the substrate by blowing gas toward the substrate in the vicinity of the opening of the processing chamber;
With
The processing means includes
A first nozzle provided in the processing chamber, extending in a substrate transport direction by the transport means and having substantially the same length as the substrate in the transport direction;
A second nozzle provided in the processing chamber, extending in the transport direction and having substantially the same length as the substrate in the transport direction;
With
After supplying the first processing liquid from the first nozzle to the entire surface of the substrate supported in a tilted posture by the supporting means, the second processing liquid is supplied from the second nozzle. A substrate processing system.

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