JP4202934B2 - Coating device - Google Patents

Description

  The present invention relates to a coating apparatus that applies or drops liquid onto a substrate to be processed using a nozzle.

  Recently, in a lithography process in a flat panel display (FPD) manufacturing process, as a resist coating method that is advantageous for increasing the size of a substrate to be processed (for example, a glass substrate), a resist solution is moved while a resist nozzle is relatively moved or scanned above the substrate. A technique (spinless method) in which a resist solution is applied in a desired film thickness on a stationary substrate by continuously ejecting a thin film with a small diameter has become widespread.

  The resist nozzle used in this spinless method has a discharge port with a very small diameter (for example, about 100 μm), and is configured to discharge the resist solution at a considerably high pressure, in order to increase the coating efficiency. The nozzle body is formed in a horizontally long or elongated shape, and fine-diameter discharge ports are arranged in a porous structure with a constant pitch in the longitudinal direction, or a continuous slit structure is formed.

  In general, in the resist nozzle, when the discharge operation is stopped, the resist solution is likely to adhere or remain near the discharge port, and if this is left as it is and dried and solidified, the resist discharge flow may be hindered during the next coating process, Or, it may be disturbed to cause fluctuations in the resist film thickness. Therefore, a solvent atmosphere chamber that provides an atmosphere of a resist solvent, for example, a thinner vapor, is provided in the nozzle standby section that is installed adjacent to the coating processing section, and the resist nozzle is waited in this solvent atmosphere chamber while the coating process is not performed. The nozzle discharge port is exposed to thinner vapor to prevent drying of the resist in the nozzle.

  However, in the micro-hole type resist nozzle used in the spinless method as described above, clogging is likely to occur even if the resist is solidified in a gel form in the nozzle, and clogging is likely to occur even by small particles. . Once the micropores are clogged, it is difficult to correct the clogging even if the cleaning liquid or solvent is sprayed or immersed in the cleaning liquid. For this reason, the present situation is that the resist nozzle is removed from the coating apparatus and is sent for disassembly cleaning or repair, which causes the production line to stop and lowers the apparatus operation rate and production efficiency.

The present invention has been made in view of such problems of the prior art, and is a coating apparatus that maintains the discharge function of the coating nozzle in a normal state at all times, and improves the apparatus operating rate or the production efficiency and the solvent use efficiency of the nozzle standby part. The purpose is to provide.

In order to achieve the above object, a coating apparatus according to the present invention includes a coating nozzle having a discharge port for discharging a coating liquid and a substrate to be processed at a predetermined position, and the coating nozzle is used to place the substrate on the substrate. A coating processing unit for applying the coating liquid to the coating tank and a cleaning tank for storing a solvent for the coating liquid as a cleaning liquid are disposed near the coating processing unit, and applying the ultrasonic vibration to the solvent in the cleaning tank An ultrasonic cleaning section for immersing and cleaning a portion near the discharge port of the nozzle in the solvent, and for exposing a portion near the discharge port of the coating nozzle to an atmosphere of solvent vapor next to the cleaning tank of the ultrasonic cleaning unit. A solvent atmosphere chamber, and a solvent reservoir for storing the solvent in the solvent atmosphere chamber is provided, the solvent overflowing from the cleaning tank is guided to the solvent reservoir, and discharged to the bottom of the solvent atmosphere chamber. A drain groove for liquid is provided, and the solvent The囲気coating liquid chamber at ejected with the dummy dispense from the coating nozzle and discharged outdoors received in the drain groove to discharge the solvent overflowing from the solvent reservoir to the outside is received by the drain groove.

In the above configuration, an ultrasonic cleaning unit is installed near the coating processing unit, and an ultrasonic wave is applied to the portion near the discharge port of the coating nozzle in the ultrasonic cleaning unit using the interval or waiting time between coating processes. By immersing in the solvent (cleaning liquid) and cleaning, stubborn dirt to minute particles can be effectively and quickly removed in detail in the vicinity of the discharge port.
In addition, a solvent atmosphere chamber is provided next to the ultrasonic cleaning section, and is preferably provided integrally. Therefore, the non-operating application nozzle is kept waiting in the solvent atmosphere chamber, and the next ultrasonic wave is periodically or as necessary. It is possible to perform ultrasonic cleaning in the cleaning unit and then immediately return to the solvent atmosphere chamber, and it is possible to reliably avoid the drying and solidification of the processing liquid in the nozzle for performing ultrasonic cleaning.
In the coating apparatus of the present invention, a solvent reservoir for storing the solvent in the solvent atmosphere chamber is provided, and the solvent overflowing from the cleaning tank of the ultrasonic cleaning unit is guided to the solvent reservoir. The solvent used for ultrasonic cleaning in the sonic cleaning section can be effectively used to generate solvent vapor in the solvent atmosphere chamber.
In addition, a drain groove for drainage is provided at the bottom of the solvent atmosphere chamber, and the coating liquid discharged by the dummy dispense from the application nozzle in the solvent atmosphere chamber is received by the drain groove and discharged to the outside, overflowing from the solvent reservoir. The discharged solvent is received by the drain groove and discharged outside the room. As a result, it is possible to wash off the dirt adhering to the drain groove by the dummy dispense in the solvent atmosphere chamber using the solvent overflowed from the ultrasonic cleaning section side, and at the same time the effective use of the solvent can be achieved, and at the same time, the drain can be constructed with a simple structure. A cleaning function can be realized.

  According to a preferred aspect of the present invention, the ultrasonic cleaning unit has a watertight ultrasonic vibration housing with a built-in ultrasonic vibrator, and the ultrasonic vibration surface of the ultrasonic vibration housing faces upward. Thus, it may be detachably disposed in the cleaning tank. In this configuration, when the ultrasonic vibration surface of the ultrasonic vibration casing deteriorates due to erosion, etc., only the ultrasonic vibration casing needs to be replaced, and the cleaning tank of the ultrasonic cleaning section is not required to be used continuously. it can.

  As a preferred embodiment, the ultrasonic cleaning section may be provided with a solvent supply port at a position avoiding the ultrasonic vibration casing at the bottom of the cleaning tank, and the solvent may be introduced into the tank from the solvent supply port. According to this structure, the solvent of the new liquid just introduced into the cleaning tank can be quickly supplied to the object to be cleaned (site near the nozzle discharge port) with a good flow, and the cleaning effect can be enhanced.

  Moreover, as a preferable aspect, the ultrasonic cleaning unit may continuously introduce the solvent into the cleaning tank and allow the solvent to overflow from the cleaning tank when cleaning the portion near the discharge port of the coating nozzle. In such a configuration, the solvent (cleaning liquid) in the cleaning tank can be continuously metabolized to ensure a stable cleaning effect and to control the liquid temperature of the cleaning liquid (especially an increase in liquid temperature due to ultrasonic waves can be avoided). ).

  As a preferred embodiment, the ultrasonic cleaning unit has a temperature sensor for detecting the temperature of the solvent in the cleaning tank, and controls the introduction of the solvent into the cleaning tank based on the output signal of the temperature sensor. You can do it. Further, the ultrasonic cleaning unit has a liquid level sensor for detecting the liquid level of the solvent in the cleaning tank, and controls the introduction of the solvent into the cleaning tank based on the output signal of the liquid level sensor. May be.

  Further, as a preferred embodiment, there may be provided rocking means for relatively rocking the coating nozzle in a state where a portion near the discharge port of the coating nozzle is immersed in a solvent. By such rocking motion, the solvent (cleaning liquid) can be stirred, and the effect of ultrasonic cleaning can be further enhanced.

  Moreover, as a preferable aspect, the ultrasonic cleaning unit may include a sealing unit for substantially sealing the upper surface of the cleaning tank in a state where a portion near the discharge port of the coating nozzle is immersed in a solvent. In particular, when the nozzle body of the application nozzle is an elongated one extending in the horizontal direction, and the nozzle part protrudes vertically downward from the lower surface of the nozzle body and is provided with a discharge port at the lower end, the sealing part is applied. It is preferable to have a lid provided with a slit-like opening for passing the nozzle part of the nozzle. Such sealing can prevent diffusion and dissipation of the solvent mist from the washing tank to the surroundings.

  Further, as one aspect, it is possible to form an atmosphere of a solvent vapor in the cleaning tank and expose a portion near the discharge port of the coating nozzle to the solvent vapor while ultrasonic cleaning is not performed. It is also preferable to provide an elevating mechanism for moving the cleaning tank up and down between a first height position for performing ultrasonic cleaning and a second height position for evacuation lower than that.

The said solvent reservoir part may have a groove part with an open upper end that extends in the circumferential direction along the inner wall of the solvent atmosphere chamber. Further, an overflow passage may be provided at the upper end portion of the partition wall separating the solvent atmosphere chamber and the cleaning tank to allow the solvent in the cleaning tank to overflow to the solvent atmosphere chamber side. With this configuration, the solvent from the ultrasonic cleaning section side can be efficiently guided into the solvent atmosphere chamber by the shortest route, and a uniform solvent vapor atmosphere can be formed in the chamber. In this case, it is preferable to arrange the ultrasonic vibration casing close to the partition wall in the cleaning tank, thereby improving the flow of the solvent toward the overflow passage. Further, on the solvent atmosphere chamber side, it is preferable that the partition wall constitutes a part of the inner wall of the solvent atmosphere chamber and the solvent overflowing from the cleaning tank is guided to the solvent reservoir along the partition wall in the solvent atmosphere chamber. Thus, the solvent can be efficiently supplied from the overflow passage to the solvent reservoir.

  The temperature sensor of the ultrasonic cleaning unit may be provided in the cleaning tank, but may be disposed on the solvent atmosphere chamber side at a position where the solvent overflowing from the cleaning tank is received. With this configuration, it is not necessary to apply unnecessary ultrasonic waves to the temperature sensor, and deterioration with time of the temperature sensor can be reduced.

  Moreover, as a preferable aspect, the lifting mechanism may be configured to move the solvent atmosphere chamber up and down together with the cleaning tank. Further, a configuration in which the solvent atmosphere chamber has a lid provided with a slit-like opening for passing the nozzle portion of the coating nozzle is also preferable.

  Furthermore, as a preferred embodiment, a nozzle cleaning unit that cleans a portion near the discharge port of the coating nozzle with a cleaning liquid at a position away from the ultrasonic cleaning unit can be provided. Preferably, the nozzle cleaning unit includes a cleaning nozzle that sprays the cleaning liquid toward a portion near the discharge port of the coating nozzle, and a drainage recovery unit that collects and collects the liquid dropped from the coating nozzle with a vacuum force. You can do it. In addition, the nozzle cleaning unit is positioned above the ultrasonic cleaning unit so that the cleaning nozzle and the drainage recovery unit are opposed to a portion near the discharge port of the coating nozzle with a certain distance from one end to the other end of the coating nozzle It is preferable to have a scanning configuration that scans up to. In this case, there may be provided a gas nozzle that sprays a drying gas onto a portion near the discharge port of the application nozzle at a position behind the cleaning nozzle in the scanning direction. Using such a nozzle cleaning unit, finishing cleaning can also be performed after ultrasonic cleaning.

According to the coating apparatus of the present invention, by having the above-described configuration and operation, the discharge function of the coating nozzle is always kept in a normal state, the apparatus operation rate or the production efficiency, and the nozzle standby section (ultrasonic cleaning section, solvent) The use efficiency of the solvent in the atmosphere chamber or the like) can be improved.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows a coating and developing treatment system as one configuration example to which the coating apparatus of the present invention can be applied. This coating / development processing system 10 is installed in a clean room. For example, an LCD substrate is a substrate to be processed, and a series of processes such as cleaning, resist coating, pre-baking, developing, and post-baking in a photolithography process are performed in the LCD manufacturing process. Is what you do. The exposure process is performed by an external exposure apparatus 12 installed adjacent to the processing system.

  In the coating and developing system 10, a horizontally long process station (P / S) 16 is disposed at the center, and a cassette station (C / S) 14 and an interface station (I / F) are disposed at both ends in the longitudinal direction (X direction). ) 18.

  The cassette station (C / S) 14 is a cassette loading / unloading port of the system 10, and up to four cassettes C can be accommodated in a horizontal direction, for example, in the Y direction by stacking square glass substrates G in multiple stages. A cassette stage 20 that can be placed side by side and a transport mechanism 22 that puts and removes the substrate G to and from the cassette C on the stage 20 are provided. The transport mechanism 22 has a means for holding the substrate G, for example, a transport arm 22a, and can be operated with four axes of X, Y, Z, and θ. Delivery is now possible.

  In the process station (P / S) 16, the processing units are arranged in the order of the process flow or process on a pair of parallel and opposite lines A and B extending in the system longitudinal direction (X direction). More specifically, the upstream process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side includes a cleaning process unit 24, a first thermal processing unit 26, and The coating process section 28 and the second thermal processing section 30 are arranged in a horizontal row. On the other hand, in the downstream process line B from the interface station (I / F) 18 side to the cassette station (C / S) 14 side, a second thermal processing unit 30, a development processing unit 32, and a decolorization process are provided. The unit 34 and the third thermal processing unit 36 are arranged in a horizontal row. In this line configuration, the second thermal processing unit 30 is located at the end of the upstream process line A and at the beginning of the downstream process line B, and straddles between both lines A and B. ing.

  An auxiliary transfer space 38 is provided between the process lines A and B, and a shuttle 40 that can horizontally place the substrate G in units of one sheet is bidirectional in the line direction (X direction) by a drive mechanism (not shown). Can be moved to.

  In the upstream process line A, the cleaning process unit 24 includes a scrubber cleaning unit (SCR) 42, and an excimer is disposed at a location adjacent to the cassette station (C / S) 10 in the scrubber cleaning unit (SCR) 42. A UV irradiation unit (e-UV) 41 is arranged. The cleaning unit in the scrubber cleaning unit (SCR) 42 performs brushing cleaning and blow cleaning on the upper surface (surface to be processed) of the substrate G while transporting the substrate G in the horizontal direction A by roller transport or belt transport. It has become.

  The first thermal processing unit 26 adjacent to the downstream side of the cleaning process unit 24 is provided with a vertical transfer mechanism 46 in the center along the process line A, and a plurality of single-wafer oven units are provided on both front and rear sides thereof. A multi-stage unit section or oven towers (TB) 44 and 48 are provided which are stacked in multiple stages together with a substrate transfer pass unit.

For example, as shown in FIG. 2, an upstream oven tower (TB) 44 includes a substrate carrying pass unit (PASS _L ) 50, dehydrating baking heating units (DHP) 52 and 54, and an adhesion unit. (AD) 56 are stacked in order from the bottom. Here, the pass unit (PASS _L ) 50 provides a space for carrying the substrate G after the cleaning process from the scrubber cleaning unit (SCR) 42 into the first thermal processing unit 26. The oven tower (TB) 48 on the downstream side includes a pass unit (PASS _R ) 60 for carrying out the substrate, cooling units (CL) 62 and 64 for adjusting the substrate temperature, and an adhesion unit (AD) 66 in order from the bottom. Stacked. Here, pass unit (PASS _R) 60 provides a space for unloading the substrate G having undergone the required heat treatment at a first thermal processing unit 26 to the downstream side of the coating process portion 28.

  In FIG. 2, the transport mechanism 46 includes a lift transport body 70 that can be moved up and down along a guide rail 68 that extends in the vertical direction, and a swivel transport body 72 that can rotate or turn in the θ direction on the lift transport body 70. And a transport arm or tweezers 74 that can move back and forth or extend and retract in the front-rear direction while supporting the substrate G on the revolving transport body 72. A drive unit 76 for driving the lifting and lowering conveyance body 70 up and down is provided on the base end side of the vertical guide rail 68, and a driving unit 78 for driving the swiveling conveyance body 72 to rotate is attached to the lifting and lowering conveyance body 70. A drive unit 80 for advancing and retracting 74 is attached to the rotary transport body 72. Each drive part 76,78,80 may be comprised by the electric motor etc., for example.

  The transport mechanism 46 configured as described above can access any unit in the oven towers (TB) 44 and 48 adjacent to each other by moving up and down at high speed, and the shuttle 40 on the auxiliary transport space 38 side. In both cases, the substrate G can be delivered.

  The coating process unit 28 adjacent to the downstream side of the first thermal processing unit 26 includes a resist coating unit (CT) 82 and a vacuum drying unit (VD) 84 along the process line A as shown in FIG. Arranged in a row. The configuration in the coating process unit 28 will be described in detail later.

  The second thermal processing unit 30 adjacent to the downstream side of the coating process unit 28 has the same configuration as that of the first thermal processing unit 26, and a vertical type between the process lines A and B. The transfer mechanism 90 is provided, one oven tower (TB) 88 is provided on the process line A side (last), and the other oven tower (TB) 92 is provided on the process line B side (lead).

Although not shown, for example, in the oven tower (TB) 88 on the process line A side, a substrate loading pass unit (PASS _L ) is disposed at the bottom, and a pre-baking heating unit (PREBAKE) is disposed thereon. For example, they may be stacked in three stages. Further, in the oven tower (TB) 92 on the process line B side, a pass unit (PASS _R ) for carrying out the substrate is disposed at the lowest stage, and a cooling unit (COL) for adjusting the substrate temperature is provided thereon, for example, one stage. The heating unit (PREBAKE) for pre-baking may be stacked thereon, for example, in a two-stage stack.

The transport mechanism 90 in the second thermal processing unit 30 includes the coating process unit 28 and the development process unit 32 via the pass units (PASS _L ) and (PASS _R ) of both oven towers (TB) 88 and 92. Not only can the substrates G be transferred in units of one sheet, but also the substrates G can be transferred in units of sheets to the shuttle 40 in the auxiliary transport space 38 and the interface station (I / F) 18 described later.

  In the downstream process line B, the development process unit 32 includes a so-called flat-flow development unit (DEV) 94 that performs a series of development processing steps while transporting the substrate G in a horizontal posture.

  A third thermal processing unit 36 is disposed downstream of the development process unit 32 with the decolorization process unit 34 interposed therebetween. The decoloring process unit 34 includes an i-ray UV irradiation unit (i-UV) 96 for performing a decoloring process by irradiating the surface to be processed of the substrate G with i-line (wavelength 365 nm).

  The third thermal processing unit 36 has the same configuration as that of the first thermal processing unit 26 and the second thermal processing unit 30, and the vertical transport mechanism 100 along the process line B. A pair of oven towers (TB) 98 and 102 are provided on both the front and rear sides.

Although not shown, for example, in the upstream oven tower (TB) 98, a pass unit (PASS _L ) for carrying a substrate is placed at the lowest stage, and a heating unit (POBAKE) for post-baking is placed thereon, for example. May be stacked in three stacks. Further, in the oven tower (TB) 102 on the downstream side, a post baking unit (POBAKE) is placed at the lowermost stage, and a pass cooling unit (PASS _R · COL) for carrying out and cooling the substrate is placed on the post baking unit (POSBAKE). The heating unit (POBAKE) for post-baking may be stacked in two layers.

The transport mechanism 100 in the third thermal processing unit 36 irradiates with i-line UV via the pass units (PASS _L ) and pass cooling units (PASS _R · COL) of both multi-stage unit parts (TB) 98 and 102. Not only can the unit (i-UV) 96 and cassette station (C / S) 14 and the substrate G be transferred in units of one sheet, but also the substrate G can be transferred in units of one unit to the shuttle 40 in the auxiliary transport space 38. ing.

  The interface station (I / F) 18 includes a transfer device 104 for exchanging the substrate G with the adjacent exposure device 12, and a buffer stage (BUF) 106 and an extension / cooling stage (EXT / COL) around the transfer device 104. ) 108 and peripheral device 110 are arranged. A stationary buffer cassette (not shown) is placed on the buffer stage (BUF) 106. The extension / cooling stage (EXT / COL) 108 is a stage for transferring a substrate having a cooling function, and is used when the substrate G is exchanged with the process station (P / S) 16 side. For example, the peripheral device 110 may have a configuration in which a titler (TITLER) and a peripheral exposure device (EE) are stacked vertically. The transfer device 104 has a means for holding the substrate G, for example, a transfer arm 104a, and transfers the substrate G to and from the adjacent exposure device 12, each unit (BUF) 106, (EXT / COL) 108, (TITLER / EE) 110. Can be done.

FIG. 3 shows a processing procedure in this coating and developing processing system. First, in the cassette station (C / S) 14, the transport mechanism 22 takes out one substrate G from any of the cassettes C on the stage 20, and the cleaning process unit 24 of the process station (P / S) 16. It is carried into the excimer UV irradiation unit (e-UV) 41 (step S ₁ ).

Excimer UV irradiation unit (e-UV) substrate G in the 41 is subjected to dry cleaning by UV irradiation (step S _2). This UV cleaning mainly removes organic substances on the substrate surface. After completion of the ultraviolet cleaning, the substrate G is moved to the scrubber cleaning unit (SCR) 42 of the cleaning process unit 24 by the transport mechanism 22 of the cassette station (C / S) 14.

In the scrubber cleaning unit (SCR) 42, as described above, the substrate G is brushed or blown onto the upper surface (surface to be processed) of the substrate G while being transported in a horizontal position in the horizontal direction by roller transport or belt transport. By performing cleaning, particulate dirt is removed from the substrate surface (step S ₃ ). After the cleaning, the substrate G is rinsed while being conveyed in a flat flow, and finally the substrate G is dried using an air knife or the like.

The substrate G that has been cleaned in the scrubber cleaning unit (SCR) 42 is carried into the pass unit (PASS _L ) 50 in the upstream oven tower (TB) 44 of the first thermal processing section 26 in a flat flow. The

In the first thermal processing unit 26, the substrate G is sequentially transferred to a predetermined oven unit in a predetermined sequence by the transport mechanism 46. For example, the substrate G is first transferred from the pass unit (PASS _L ) 50 to one of the heating units (DHP) 52 and 54, where it is subjected to dehydration (step S ₄ ). Next, the substrate G is transferred to one of the cooling units (COL) 62 and 64 where it is cooled to a constant substrate temperature (step S ₅ ). Thereafter, the substrate G is transferred to an adhesion unit (AD) 56 where it is subjected to a hydrophobic treatment (step S ₆ ). After completion of the hydrophobic treatment, the substrate G is cooled to a constant substrate temperature by one of the cooling units (COL) 62 and 64 (step S ₇ ). Finally, the substrate G is transferred to the pass unit (PASS _R ) 60 in the downstream oven tower (TB) 48.

  As described above, in the first thermal processing unit 26, the substrate G is arbitrarily transferred between the upstream multi-stage oven tower (TB) 44 and the downstream oven tower (TB) 48 via the transport mechanism 46. You can come and go. The second and third thermal processing units 30 and 36 perform the same substrate transfer operation.

The substrate G that has undergone the series of thermal or thermal processing as described above in the first thermal processing unit 26 is adjacent to the downstream side from the pass unit (PASS _R ) 60 in the downstream oven tower (TB) 48. The application process unit 28 is moved to the carry-in unit (IN) 81, and is moved from the carry-in unit (IN) 81 to the resist coating unit (CT) 82.

In the resist coating unit (CT) 82, the substrate G is coated with a resist solution on the upper surface (surface to be processed) by a spinless method using a slit type resist nozzle as will be described later. Next, the substrate G is subjected to a drying process by a reduced pressure drying unit (VD) 84 adjacent to the downstream side (step S ₈ ).

The substrate G subjected to the resist coating process as described above is transferred from the reduced pressure drying unit (VD) 84 to the pass unit (PASS _L ) in the upstream oven tower (TB) 88 of the adjacent second thermal processing unit 30. It is brought in.

Within the second thermal processing unit 30, the substrate G is sequentially transferred to a predetermined unit by the transport mechanism 90 in a predetermined sequence. For example, the substrate G is first transferred from the pass unit (PASS _L) to one of the heating units (PREBAKE), where it undergoes a heat treatment of pre-baking (Step S _9). Next, the substrate G is transferred to one of the cooling units (COL), where it is cooled to a constant substrate temperature (step S ₁₀ ). Thereafter, the substrate G passes through the pass unit (PASS _R ) on the downstream oven tower (TB) 92 side or without the extension cooling stage (EXT COL) on the interface station (I / F) 18 side. ) 108.

In the interface station (I / F) 18, the substrate G is transferred from the extension / cooling stage (EXT / COL) 108 to the peripheral exposure device (EE) of the peripheral device 110, where the resist adhering to the peripheral portion of the substrate G is removed. After receiving an exposure for removal during development, the image is sent to the adjacent exposure apparatus 12 (step S ₁₁ ).

In the exposure device 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Then, when the substrate G that has undergone pattern exposure is returned from the exposure apparatus 12 to the interface station (I / F) 18 (step S ₁₁ ), it is first carried into a titler (TITLER) of the peripheral device 110, where it is placed on the substrate. Predetermined information is written in a predetermined part (step S ₁₂ ). Thereafter, the substrate G is returned to the extension / cooling stage (EXT / COL) 108. Transfer of the substrate G in the interface station (I / F) 18 and exchange of the substrate G with the exposure apparatus 12 is performed by the transfer device 104.

In the process station (P / S) 16, the transport mechanism 90 receives the exposed substrate G from the extension / cooling stage (EXT / COL) 108 in the second thermal processing unit 30, and the oven tower ( TB) is transferred to the developing process section 32 via the pass unit (PASS _R ) in the 92.

In the development process unit 32, the substrate G received from the pass unit (PASS _R ) in the oven tower (TB) 92 is carried into the development unit (DEV) 94. Substrate G in the developing unit (DEV) 94 is conveyed by the flat flow manner toward the downstream process line B, developing during the transport, rinse, a series of development processing step drying is performed (step S _13).

The substrate G subjected to the development process in the development process unit 32 is carried into the decolorization process unit 34 adjacent to the downstream side in a flat flow, where it is subjected to a decolorization process by i-line irradiation (step S ₁₄ ). The substrate G that has been subjected to the decoloring process is carried into the pass unit (PASS _L ) in the upstream oven tower (TB) 98 of the third thermal processing unit 36.

In the third thermal processing unit 36, the substrate G is transferred to the first one of the heating units (POBAKE) from the pass unit (PASS _L), where it undergoes a heat treatment of the post-baking (Step S _15). Next, the substrate G is transferred to a path cooling unit (PASS _R · COL) in the downstream oven tower (TB) 102, where it is cooled to a predetermined substrate temperature (step S ₁₆ ). The transport mechanism 100 transports the substrate G in the third thermal processing unit 36.

On the cassette station (C / S) 14 side, the transport mechanism 22 receives the substrate G that has completed all the steps of the coating and developing process from the pass cooling unit (PASS _R COL) of the third thermal processing unit 36, The received substrate G is accommodated in one of the cassettes C on the stage 20 (step S ₁ ).

  In the coating and developing treatment system 10, the present invention can be applied to the coating process unit 28, particularly the resist coating unit (CT) 82. Hereinafter, an embodiment in which the present invention is applied to the coating process section 28 will be described with reference to FIGS.

  4 and 5 show the configuration of the main parts of a resist coating unit (CT) 82, a vacuum drying unit (VD) 84, and an edge remover unit (ER) 86 in the coating process unit 28. FIG. These coating system processing unit groups (CT) 82, (VD) 84, and (ER) 86 are arranged in a horizontal row on the support base 112 in the order of processing steps. A pair of guide rails 114, 114 are laid on both sides of the support base 112, and the substrate G is directly exchanged between the units by one or a plurality of pairs of transfer arms 116, 116 that translate along the guide rails 114, 114. It can be done.

  The resist coating unit (CT) 82 includes a coating processing unit 122 for coating a resist solution on the upper surface or a surface to be processed (device forming surface) of the substrate G using a fine-diameter ejection type resist nozzle 120, A refresh unit 124 for normally maintaining or refreshing the resist discharge function and a controller (not shown) for controlling each unit in the unit.

  The coating processing unit 122 includes a cup-shaped processing container 126 having an open upper surface, a stage 128 for horizontally placing and holding the substrate G in the processing container 126, and fixing the stage 128. Alternatively, a stage support 130 that can be moved up and down and / or rotatably, and a long resist nozzle 120 so that a resist solution is dropped onto the entire surface of the substrate G on the stage 128 from above by a scanning method. And a nozzle scanning mechanism 132 driven in a fixed direction (X direction).

  The nozzle scanning mechanism 132 lays a pair of X guide rails 134 and 134 extending in the X direction with the coating processing unit 122 and the refresh unit 124 interposed therebetween, and a nozzle support 136 extending in the Y direction is disposed on both the X guide rails 134. , 134 and is moved in the X direction by straight drive means (not shown). The resist nozzle 120 has a long nozzle body that extends in the Y direction with a length that covers the substrate G on the stage 128 from one end to the other end, and is attached to the nozzle support 136 so as to be movable up and down. . The nozzle support 136 has a first position for receiving the liquid dripping from the nozzle directly below the resist nozzle 120 and a second position for retreating outside (side) the lifting / lowering space of the resist nozzle 120. A drain pan 138 configured to be movable in the X direction is also attached.

  The refresh unit 124 is installed next to the coating processing unit 122 on the reduced pressure drying unit (VD) 84 side, and the ultrasonic cleaning unit 140 and the solvent atmosphere chamber 142 are integrally arranged in parallel to be moved up and down by the lifting mechanism 144. A scanning type nozzle cleaning unit 146 that can be configured and is movable in the Y direction is provided. The configuration and operation of each unit in the refresh unit 124 will be described in detail later.

  The vacuum drying unit (VD) 84 includes a tray or shallow container type lower chamber 148 having an open upper surface, and a lid-like upper chamber configured to be tightly fitted or fitted to the upper surface of the lower chamber 148. 150. The lower chamber 148 has a substantially rectangular shape, a stage 152 for placing and supporting the substrate G horizontally is disposed at the center, and exhaust ports 154 are provided at the four corners of the bottom surface. Exhaust pipes 156 connected to the respective exhaust ports 154 from below the lower chamber 148 communicate with a vacuum pump (not shown). With the lower chamber 148 covered with the upper chamber 150, the processing spaces in both the chambers 148, 150 can be depressurized to a predetermined degree of vacuum by the vacuum pump.

  The edge remover unit (ER) 86 includes a stage 158 made of, for example, an aluminum plate for placing the substrate G horizontally, an alignment mechanism 160 for positioning the substrate G on the stage 158, and peripheral edges (on the four sides of the substrate G). Four remover heads 162 and the like for removing excess resist from the edge) are provided. While each of the remover heads 162 moves along each side of the substrate G in a state where the alignment mechanism 160 positions the substrate G at the set position on the stage 158 and is fixedly held in a horizontal posture, the peripheral portion of each side of the substrate G Excess resist adhering to the film is dissolved and removed with a solvent such as thinner.

  6 to 15 show the configuration of each part in the refresh unit 124 in the resist coating unit (CT) 82. More specifically, FIGS. 6 and 7 are sectional views showing the internal structure, FIG. 8 is a plan view showing the internal structure, and FIG. 9 is a line JJ in FIG. FIG. 10 is a perspective view showing the configuration of the main part, FIG. 11 is a perspective view showing the configuration of the ultrasonic vibration housing in the ultrasonic cleaning unit 140, and FIG. ), (B) are a sectional view taken along line KK and LL in FIG. 8 showing the temperature sensor mounting structure, and FIG. 13 is a partial sectional side view showing the mounting structure of the liquid level sensor. 14 and 15 are a perspective view and a plan view showing the configuration of the main part of the scanning nozzle cleaning unit 146. FIG.

  6 to 11, the ultrasonic cleaning unit 140 has a long cleaning tank 164 that covers the entire length of the resist nozzle 120 and extends in the Y direction, and fits in the cleaning tank 164 completely. A prismatic ultrasonic vibration casing 166 is provided. The ultrasonic vibration casing 166 is made of, for example, a stainless steel (SUS) plate and incorporates one or a plurality of solid ultrasonic vibrators 168 (FIG. 11). Each ultrasonic vibrator 168 is joined to the upper surface of the ultrasonic vibration casing 166 by welding or the like in the casing, and the ultrasonic wave output from each ultrasonic vibrator 168 is the upper surface of the ultrasonic vibration casing 166, that is, the supersonic wave. The sound wave is radiated upward from the sound wave vibrating surface 166a. As shown in FIG. 11, an electrical cable 163 for supplying driving power or signals to the ultrasonic transducer 168 is connected to or pulled into one end surface of the ultrasonic vibration casing 166 via a connector portion 165. ing. As shown in FIGS. 8 and 9, the ultrasonic vibration casing 166 has one end face on the connector portion 165 side in close contact with the inner wall of the cleaning tank 164 via an O-ring 167, and the electric cable 163 is connected to the cleaning tank 164. Pull out to the outside. For this attachment, a male screw may be formed on the outer periphery of the connector portion 165, and a nut 169 may be screwed from the outside of the cleaning tank 164.

  As shown in FIGS. 6, 7, and 10, in the cleaning tank 164 of the ultrasonic cleaning unit 140, the ultrasonic vibration casing 166 is disposed closely to the wall surface 170 on the adjacent solvent atmosphere chamber 142 side, A space 173 is provided between the wall 172 on the opposite side. A plurality of solvent inlets 174 are provided on the bottom surface of the space 173 at a predetermined interval in the longitudinal direction of the cleaning tank 164. A solvent supply source (not shown) is connected to the solvent introduction ports 174 through a solvent supply pipe 176. The solvent supply pipe 176 is provided with an open / close valve 178. The on-off valve 178 is opened so that a resist solvent such as thinner S can be introduced into the cleaning tank 164 from the solvent supply source through the solvent introduction port 174. In the cleaning tank 164, the thinner S is used as a cleaning liquid for ultrasonic cleaning.

  In addition, the ultrasonic vibration casing 166 is placed on the plurality of protruding pedestals 180 so that the lower surface of the ultrasonic vibration casing 166 is floated from the tank bottom in the cleaning tank 164, and below the position where the ultrasonic vibration casing 166 is disposed. A drainage port 182 is provided. The drainage port 182 communicates with a drain, that is, a drainage processing unit (not shown) via a drainage pipe 184. The on-off valve 186 provided in the pipe 184 is normally closed and is opened when the thinner S in the cleaning tank 164 is pulled out.

  As shown in FIGS. 6, 7, and 10, a lid 188 having a slit-like opening 188 a extending in the longitudinal direction facing the ultrasonic vibration casing 166 is attached to the upper surface of the cleaning tank 164. Yes. The opening 188a of the lid 188 is formed to have a size that allows the nozzle portion 120a of the resist nozzle 120 to pass therethrough with some margin (gap). As shown in the figure, the nozzle portion 120a of the resist nozzle 120 protrudes in a taper shape vertically downward substantially over the entire length of the long rectangular parallelepiped-shaped nozzle body, and a porous or slit-type fine-diameter discharge port (see FIG. Not shown). When the lower surface of the resist nozzle 120 is aligned with the lid 188 of the cleaning tank 164 from above, only the nozzle portion 120a passes through the opening 188a and enters the substantially sealed tank, and the portion near the discharge port at the lower end is the cleaning tank 164. It is designed to be immersed in the thinner bath (FIGS. 7 and 10).

  Of the inner wall of the cleaning tank 164, the wall surface 170 on the solvent atmosphere chamber 142 side forms a partition for separating the cleaning tank 164 and the solvent atmosphere chamber 142. At the upper end portion of the partition wall 170, a large number of overflow cutouts 170a are formed at a constant pitch in the longitudinal direction to form a gap with the lid body 188 (or the lid body 202). When the liquid level of the thinner S exceeds the notch 170a in the cleaning tank 164, it overflows to the adjacent solvent atmosphere chamber 142 side through the notch 170a (FIG. 7).

  As shown in FIGS. 6 to 8 and 10, the solvent atmosphere chamber 142 is provided integrally with the cleaning tank 164 so as to cover the entire length of the resist nozzle 120. In the room, a gallery-like groove 192 having an open upper end extending in the circumferential direction along the inner wall (circulating in the horizontal direction) is formed as a solvent reservoir, and the inside of the solvent reservoir 192 (inside the room) A drain groove 196 communicating with the drainage port 194 is formed in the central portion. A pipe 198 communicating with an external drain processing unit (not shown) is connected to the drain port 194, and an open / close valve 200 is provided in the pipe 198. The thinner S overflowing from the boundary wall with the cleaning tank 164 or the notch 170 a of the partition wall 170 to the solvent atmosphere chamber 142 side flows down along the wall of the partition wall 170 and is guided to the solvent reservoir 192. Then, the thinner S accumulated in the solvent reservoir 192 evaporates, and the vapor of the thinner stands in the vicinity. Further, the thinner S overflowing in the solvent reservoir 192 flows down to the drain groove 196. The thinner S that has flowed down into the drain groove 196 is sent from the drainage port 194 to the drainage pipe 198.

  On the upper surface of the solvent atmosphere chamber 142, a lid 202 provided with a slit-shaped opening 202a extending in the longitudinal direction facing the drain groove 196 is attached. The opening 202a of the lid 202 is also formed to a size that allows the nozzle portion 120a of the resist nozzle 120 to pass through with some margin (gap). When the lower surface of the resist nozzle 120 is aligned with the lid 202 of the solvent atmosphere chamber 142 from above, only the nozzle portion 120a passes through the opening 202a and enters a substantially sealed chamber, and the discharge port at the lower end faces the drain groove 196. Thus, it is exposed to the vapor of the thinner S standing in the room (FIG. 6).

  As shown in FIGS. 8 and 12, a counterbore 204 extending in the vertical direction is formed in one end of the solvent atmosphere chamber 142, and the temperature sensor 206 is accommodated in the counterbore 204 with the temperature sensing portion 206a at the top position. ing. For sensor mounting, a sensor holding plate 208, mounting bolts 210, and the like are used. A part of the thinner S overflowing from the cleaning tank 164 side to the solvent atmosphere chamber 142 side through the notch 170a of the partition wall 170 touches the temperature sensing portion 206 of the temperature sensor 206 and accumulates in the counterbore 204. ing. The thinner S filled with the counterbore 204 moves to the adjacent solvent reservoir 192 or flows down to the drain groove 196. The temperature sensor 206 detects the temperature of the thinner S that touches the temperature sensing unit 206, and sends an electric signal representing the detected temperature to the controller via the electric cable 212. The controller controls introduction of the thinner S into the cleaning tank 164 based on the output signal of the temperature sensor 206.

  On the other hand, as shown in FIGS. 8 and 13, outside the other end portion of the solvent atmosphere chamber 142, a pipe 214 is connected between the upper end portion and the lower end portion of the cleaning tank 164, and cleaning is performed in the middle of the pipe 214. A liquid level sensor 216 for detecting the liquid level in the tank 164 is provided. The output signal of the liquid level sensor 216 is also given to the controller.

The scanning nozzle cleaning unit 146 (FIGS. 4 and 5) has a movable cleaning head 220 as shown in FIGS. On the upper surface of the cleaning head 220, a groove portion 222 extending in the Y direction is formed so that the lower end portion of the nozzle portion 120a of the resist nozzle 120 can be inserted with a sufficient margin (gap). Are provided with a number of cleaning nozzles 224 in a line in the Y direction. These cleaning nozzles 224 are connected to a cleaning liquid supply source (not shown) via piping (not shown) passing through the arm portion 228 of the nozzle cleaning unit 146, and the lower end of the nozzle part 120 a of the resist nozzle 120. A cleaning liquid such as a thinner is sprayed toward the part. In addition, gas nozzles 226 are attached to the outer sides of both ends of the cleaning nozzle 224. These gas nozzles 226 are connected to a dry gas supply source (not shown) via a pipe (not shown) passing through the arm part 228 of the nozzle cleaning unit 146, and directed toward the lower end of the nozzle part 120a. A drying gas such as N ₂ gas is sprayed. However, the gas nozzles 226 outside both ends do not operate at the same time, and only the gas nozzle 226 located behind the cleaning nozzle 224 in the direction in which the cleaning head 220 moves (scanning direction) ejects the drying gas. Yes. The bottom hole 222a of the groove portion 222 is connected to a vacuum source (not shown) via a pipe (not shown) passing through the arm portion 228 of the nozzle cleaning portion 146, and the liquid dropped from the nozzle portion 120a is vacuum force. Thus, the grooves 222 are collected and collected.

  The cleaning head 220 of the nozzle cleaning unit 146 is connected to the Y-direction rectilinear drive unit 230 via the arm unit 228 (FIGS. 4 and 5). The Y-direction rectilinear drive unit 230 may be constituted by, for example, a ball screw mechanism with a guide or a linear motor mechanism, and the cleaning head 220 is linearly moved in the Y direction with a positional relationship facing the resist nozzle 120 as shown in FIG. Move.

  FIGS. 16 and 17 show a configuration example of the drain pan 138 attached to the nozzle support 136 in association with the resist nozzle 120. The drain pan 138 is a long tray that covers the entire length of the resist nozzle 120 and extends in the Y direction, and has a slit-shaped opening 138 a on the upper surface. The nozzle support 136 is attached with a cylinder 232 having cylinder rods 232 a coupled to both ends of the drain pan 138. As shown in FIG. 16, when the cylinder 232 extends the cylinder rod 232a, the drain pan 138 is retracted to a position to the side of the resist nozzle 120, and the resist nozzle 120 can be moved up and down without hitting the drain pan 138. . As shown in FIG. 17, when the cylinder 232 pulls the cylinder rod 232a, the drain pan 138 moves to a position directly below the registration nozzle 120, and the liquid dripping from the vicinity of the discharge port of the registration nozzle 120 at this position It is supposed to be received inside. The drain pan 138 is connected to a drain pipe (not shown) that communicates with a drain processing section (not shown).

  Next, the overall operation or action of the resist coating unit (CT) 82 of this embodiment will be described.

As described above, the substrate G that has undergone the predetermined heat treatment in the first thermal processing section 26 (FIG. 1) is transferred from the pass unit (PASS _R ) 60 (FIG. 2) in the downstream oven tower (TB) 48 to the resist. It is carried into a coating unit (CT) 82. In the resist coating unit (CT) 82, the resist nozzle 120 stands by in the solvent atmosphere chamber 142 of the refresh unit 124 as shown in FIG. 6 until the substrate G is loaded. During this waiting period, the lower end portion of the nozzle portion 120a of the resist nozzle 120 is exposed to the vapor of the thinner S standing from the solvent reservoir portion 192 in the solvent atmosphere chamber 142, so that the inside of the nozzle (particularly near the discharge port). The resist solution does not dry and solidify. In addition, dummy dispensing is performed periodically or as necessary, and the residual resist solution in the resist nozzle 120 is discharged toward the drain groove 196. Due to this dummy dispensing, the drain groove 196 is soiled with resist. However, as will be described later, when the ultrasonic cleaning by the adjacent ultrasonic cleaning unit 140 is performed, the drain groove 196 is automatically cleaned along with this.

When passing unit (PASS _R) 60 from the substrate G next it is carried to the resist coating unit (CT) 82, which simultaneously or before or after, the resist nozzle 120 retreats from the solvent atmosphere chamber 142 of the refresh part 124. For this withdrawal, the nozzle support 136 may move the resist nozzle 120 up, but the lifting mechanism 144 (FIGS. 5 and 9) is a solvent in that the working space can be given to the scanning nozzle cleaning unit 146. It is preferable that the atmosphere chamber 142 and the cleaning tank 144 of the ultrasonic cleaning unit 140 are moved down to the lowest position (retracted position).

  The scanning nozzle cleaning unit 146 attaches the cleaning head 220 under the resist nozzle 120 as shown in FIG. 14 so as to replace the solvent atmosphere chamber 142 and the ultrasonic cleaning unit 140 that have been lowered to the retreat position. Then, while the cleaning liquid (thinner) is sprayed from the cleaning nozzle 224 to the lower end of the nozzle portion 120a of the resist nozzle 120, the cleaning nozzle 224 is moved straight in the Y direction from one end to the other end of the resist nozzle 120 by driving the linear driving portion 230 Let The nozzle portion 120a of the resist nozzle 120 can be sprayed with a dry gas from the gas nozzle 226 following the cleaning liquid from the cleaning nozzle 224, and also has a vacuum force (suction force) from the groove 222 side of the cleaning head 220. The cleaning liquid that hits is instantaneously separated by the wind pressure and the vacuum force and collected in the groove 222. In this way, dirt (particularly resist dirt) adhering to the vicinity of the discharge port of the resist nozzle 120 is removed in a short time by the scanning nozzle cleaning unit 146.

When the nozzle cleaning by the scanning nozzle cleaning unit 146 as described above is completed, the drain pan 138 that has been kept at the side position (retracted position) of the resist nozzle 120 on the nozzle support 136 side is placed under the resist nozzle 120. It is sunk (FIG. 17). As a result, even if the cleaning liquid adhering to or remaining on the resist nozzle 120 drips down, it is captured in the drain pan 138. Thus, the resist nozzle 120 whose ejection function is refreshed by the refresh unit 124 is sent to the coating processing unit 122 by the nozzle scanning mechanism 132. On the other hand, the substrate G loaded from the adjacent pass unit (PASS _R ) 60 is placed on the stage 128 in the processing container 126 of the coating processing unit 122.

  In the coating processing unit 122, the drain pan 138 is moved to the side of the resist nozzle 120, and then the resist nozzle 120 is moved in the X direction above the substrate G by the nozzle scanning mechanism 132. Then, a resist solution is dropped in a line shape. Thus, when the resist nozzle 120 finishes scanning from one end of the substrate G to the other end in the X direction, a resist solution coating film is formed on the substrate G with a certain film thickness. In this embodiment, the scanning start position of the resist nozzle 120 may be set on the side opposite to the refresh unit 124, and scanning may be performed in the X direction in a direction approaching the refresh unit 124 (left to right direction in FIG. 4). Alternatively, the resist nozzle 120 that has finished the application scan may be moved straight ahead and returned to the refresh unit 124. When the application scan is completed, the drain pan 138 is moved below the resist nozzle 120, and the drain pan 138 receives the resist solution that drips from the vicinity of the discharge port of the resist nozzle 120.

  The resist nozzle 120 that has finished the application scan and returned to the refresh unit 124 may be first sent to the solvent atmosphere chamber 142 or may be sent to the ultrasonic cleaning unit 140. During the waiting time until the next coating process is performed, the resist nozzle 120 can receive any treatment at any place in the refresh unit 124. In particular, the resist nozzle 120 can be subjected to ultrasonic cleaning by the ultrasonic cleaning unit 140 periodically or at any time.

  When ultrasonic cleaning is performed on the resist nozzle 120, the lifting tank 144 (FIGS. 5 and 9) is used to align the cleaning tank 164 of the ultrasonic cleaning unit 140 at a predetermined height position, and the nozzle support 136 side has the drain pan 138 attached. The nozzle portion 120 a of the resist nozzle 120 is inserted into the opening 188 a of the lid 188 of the cleaning tank 164 by retreating to the retreat position. Thus, the lower end portion of the nozzle portion 120a, that is, the portion near the discharge port, can be immersed in a thinner bath to which ultrasonic waves are added in the cleaning tank 164 (FIGS. 7 and 10).

  At this time, on the ultrasonic cleaning section 140 side, the liquid level of the thinner bath is adjusted so that the lower end of the nozzle section 120a is immersed in the cleaning tank 164 to a predetermined depth. As shown in FIG. 7, when the nozzle portion 120a of the resist nozzle 120 is immersed in the thinner bath, the liquid level exceeds the notch 170a of the partition wall 170, and the thinner S is transferred from the cleaning tank 164 to the adjacent solvent atmosphere chamber 142. It is designed to overflow. On the other hand, the new solution of thinner S is continuously supplied from the solvent introduction port 178 into the cleaning tank 164 during the ultrasonic cleaning. As shown in FIG. 7, the thinner S introduced in an upward flow from the solvent introduction port 178 at the bottom of the cleaning tank 164 passes through the space 173 along the side surface of the ultrasonic oscillation casing 166 and crosses the vicinity of the nozzle portion 120a. In this way, it flows toward the overflow outlet 170a. Thus, the nozzle portion 120a of the resist nozzle 120 is immersed in the flow of the thinner new liquid in the cleaning tank 164.

  The ultrasonic oscillating casing 166 has a thinner bath at a desired frequency (for example, 38 kHz) and a desired output (for example, 600 W) above its upper surface (ultrasonic vibration surface) 166a, that is, toward the nozzle portion 120a of the resist nozzle 120. It emits sound waves. By applying this ultrasonic wave, the object to be cleaned (part near the discharge port of the nozzle portion 120a) is simply immersed in a thinner bath, and the so-called cavitation action reliably removes dirt inside the discharge port with a small diameter. In addition to being able to be removed, the chemical dissolution action of the thinner is promoted, and the maximum cleaning effect can be obtained in a short time. The depth D of the upper surface (ultrasonic vibration surface) 166a of the ultrasonic oscillation casing 166 at the time of ultrasonic cleaning may be arbitrarily set, but preferably the resonance of the thinner bath with the vibration frequency of the ultrasonic vibrator Alternatively, the resonance depth may be set to an integral multiple of ½ wavelength of ultrasonic vibration, for example.

  Moreover, since the temperature (liquid temperature) of a thinner bath rises during ultrasonic cleaning, liquid temperature management is also important. In this respect, in this embodiment, the temperature sensor 206 installed in the solvent atmosphere chamber 142 detects the temperature of the thinner S immediately after overflowing from the cleaning tank 164, and is detected by the controller based on the sensor output signal (detected temperature). Since the introduction of a new thinner liquid into the cleaning tank 164 (for example, the introduction rate) is controlled, the thinner liquid temperature in the cleaning tank 164 can be maintained within an appropriate range even during ultrasonic cleaning. The temperature sensor 206 may be disposed on the ultrasonic cleaning unit 140 side, for example, in the cleaning tank 164. However, by being arranged on the solvent atmosphere chamber 142 side as in this embodiment, unnecessary ultrasonic waves can be avoided and deterioration with time can be reduced.

  Further, during the ultrasonic cleaning, for example, the resist nozzle 120 may be swung relative to the thinner bath in the cleaning tank 164 by driving on the nozzle support 136 side or by driving on the lifting mechanism 144 side. Good. When swinging in the horizontal direction, a margin for the swing stroke may be given to the opening 188a of the lid 188. By such swinging, the thinner bath can be stirred and the ultrasonic cleaning effect can be further enhanced.

  While the ultrasonic cleaning unit 140 is performing ultrasonic cleaning on the resist nozzle 120 as described above, the thinner S overflowing from the cleaning tank 164 of the ultrasonic cleaning unit 140 in the solvent atmosphere chamber 142 is removed from the solvent reservoir 192. When the solvent reservoir 192 is filled, the thinner S overflows into the drain groove 196. Due to the overflow of the thinner S from the solvent reservoir 192 to the drain groove 196, dirt (especially dirt due to dummy dispensing) adhering to the inner wall of the drain groove 196 is dissolved in the thinner S and washed away. Thus, when ultrasonic cleaning is performed by the ultrasonic cleaning unit 140, the drain groove 196 in the solvent atmosphere chamber 142 can be cleaned by effectively using the thinner S overflowed from the cleaning tank 164.

  After the ultrasonic cleaning of the resist nozzle 120 is completed by the ultrasonic cleaning unit 140, the resist nozzle 120 is moved out of the cleaning tank 164. Also in this case, the elevating mechanism 144 (FIGS. 5 and 9) may move the ultrasonic cleaning unit 140 downward together with the solvent atmosphere chamber 142 to the lowest position (retracted position).

  Next, it is preferable to finish-clean the resist nozzle 120 using the scanning nozzle cleaning unit 146. Also in this final cleaning, the scanning nozzle cleaning unit 146 attaches the cleaning head 220 under the resist nozzle 120 as shown in FIG. 14, and the cleaning liquid (thinner) is supplied from the cleaning nozzle 224 to the lower end of the nozzle unit 120 a of the resist nozzle 120. The spray nozzle 224 is driven in the Y direction from one end to the other end of the resist nozzle 120 by being driven by the linear drive unit 230 while spraying dry gas from the gas nozzle 226 at a position behind the cleaning nozzle 224. Thus, the blow cleaning for finishing can be efficiently performed in a short time on the resist nozzle 120 immediately after the ultrasonic cleaning.

  After finishing cleaning by the scanning nozzle cleaning unit 146 as described above, the resist nozzle 120 may be retained in the solvent atmosphere chamber 142 until the next coating process is performed. For this purpose, the elevating mechanism 144 (FIGS. 5 and 9) moves the solvent atmosphere chamber 142 upward from the retracted position to the operating position together with the ultrasonic cleaning unit 140.

  In the ultrasonic cleaning unit 140, after the ultrasonic cleaning is completed, the supply of the new thinner liquid to the cleaning tank 164 may be stopped. Then, the thinner S gradually evaporates in the cleaning tank 164, but the controller monitors the liquid level through the liquid level sensor 216. When the predetermined lower limit level is reached, a new thinner liquid can be replenished. it can. Further, even in a period when ultrasonic cleaning is not performed, the thinner in the cleaning tank 164 may be overflowed in order to supply the solvent reservoir 192 in the solvent atmosphere chamber 142 with the thinner S.

  In addition, when erosion occurs on the ultrasonic vibration surface 166a of the ultrasonic vibration casing 166 after a long period of use, the ultrasonic vibration casing 166 is replaced with a new one to avoid the cleaning tank 164 becoming a contamination source. Replace it. This part replacement operation is extremely simple. After the drain opening / closing valve 186 is opened and the thinner in the cleaning tank 164 is discharged, the nut 169 outside the cleaning tank 164 is loosened, and the old casing 166 can be taken out. . Then, the new casing 166 may be placed in the cleaning tank 164 and the nut 169 may be tightened. The cleaning tank 164 itself does not require replacement or repair, and can be used permanently.

  The preferred embodiments of the present invention have been described above, but various modifications and changes can be made within the scope of the technical idea of the present invention. For example, in the above-described embodiment, the solvent atmosphere chamber 142 is provided adjacent to the ultrasonic cleaning unit 140 in an integral structure. However, it is also possible to have a unit structure in which both (140, 142) are separated or separated. In addition, it is possible to use the solvent vapor atmosphere formed in the cleaning tank 164 of the ultrasonic cleaning unit 140 and make the resist nozzle 120 stand by in the atmosphere. In that case, the level of the liquid level may be lowered or the position of the resist nozzle 120 may be increased so that the discharge port of the resist nozzle 120 does not touch the thinner bath in the cleaning tank 164. In the above-described embodiment, the detachable ultrasonic vibration casing 166 is disposed in the cleaning tank 164 of the ultrasonic cleaning unit 140 so that the minimum necessary parts can be replaced. A configuration in which an ultrasonic vibrator is provided in a built-in type is also possible.

  The present invention is particularly suitable when applied to a fine diameter discharge type nozzle that discharges a resist liquid (treatment liquid) as in the above-described embodiment with a fine diameter. However, the present invention can be applied to a treatment liquid discharge nozzle having an arbitrary discharge port structure.

  In addition, the present invention can be applied to any application that supplies a processing liquid onto a substrate to be processed using a processing liquid discharge nozzle. For example, a coating film can be formed by rotating a substrate to be processed without using a spinless method. It can also be applied to the spin method to be formed. In addition to the resist solution, the processing solution in the present invention may be a liquid such as an interlayer insulating material, a dielectric material, or a wiring material. The substrate to be processed in the present invention is not limited to an LCD substrate, but may be a semiconductor wafer, a CD substrate, a glass substrate, a photomask, a printed substrate, or the like.

It is a top view which shows the structure of the application | coating development processing system which can apply this invention. It is a side view which shows the structure of the thermal process part in the said application | coating development processing system. It is a flowchart which shows the process sequence in the said application | coating development processing system. It is a top view which shows the structure of the application | coating process part in the said application | coating development processing system. It is a side view which shows the structure of the said application | coating process part. It is sectional drawing which shows the internal structure and one effect | action of an ultrasonic cleaning part and a solvent atmosphere chamber in the refresh part of the said application | coating process part. It is sectional drawing which shows the internal structure and one effect | action of the said ultrasonic cleaning part and a solvent atmosphere chamber. It is a top view which shows the inside of the said ultrasonic cleaning part and a solvent atmosphere chamber. It is the partial cross section side view seen by the JJ line | wire of FIG. It is a perspective view which shows the principal part of the internal structure of the said ultrasonic cleaning part and a solvent atmosphere chamber. It is a perspective view which shows the structure of the ultrasonic vibration housing | casing in the said ultrasonic cleaning part. It is the KK sectional view taken on the line in FIG. 8, and the LL sectional view showing the attachment structure of the temperature sensor used with the said ultrasonic cleaning part. It is a partial cross section side view which shows the attachment structure of the liquid level sensor used with the said ultrasonic cleaning part. It is a perspective view which shows the structure of the principal part of the scanning-type nozzle washing | cleaning part in the said refresh part. It is a top view which shows the structure of the principal part of a scanning type nozzle washing | cleaning part. It is a perspective view which shows the structural example of the drain pan in the said application | coating process part, and its one state. It is a perspective view which shows the structural example of the said drain pan, and its one state.

Explanation of symbols

28 Coating Process Unit 82 Resist Coating Unit (CT)
DESCRIPTION OF SYMBOLS 120 Resist nozzle 122 Application | coating process part 124 Refresh part 140 Ultrasonic cleaning part 142 Solvent atmosphere chamber 144 Elevating mechanism 146 Scanning nozzle cleaning part 164 Cleaning tank 166 Ultrasonic vibration housing | casing 170 Bulkhead 170a Notch (overflow passage)
174 Solvent inlet 188 Lid 192 Solvent reservoir 196 Drain groove 202 Lid 206 Temperature sensor 216 Liquid level sensor

Claims (21)

A coating nozzle having a discharge port for discharging a coating liquid;
A coating processing unit that arranges a substrate to be processed at a predetermined position and applies a coating liquid onto the substrate using the coating nozzle;
A cleaning tank containing a solvent for the coating liquid as a cleaning liquid is disposed near the coating processing unit, and a portion near the discharge port of the coating nozzle is used as the solvent while applying ultrasonic vibration to the solvent in the cleaning tank. An ultrasonic cleaning section for immersion and cleaning ;
A solvent atmosphere chamber for exposing a portion near the discharge port of the application nozzle next to a cleaning tank of the ultrasonic cleaning section to an atmosphere of solvent vapor;
Have
A solvent reservoir for storing the solvent in the solvent atmosphere chamber is provided, and the solvent overflowing from the cleaning tank is guided to the solvent reservoir,
A drain groove for drainage is provided at the bottom of the solvent atmosphere chamber, and the coating liquid discharged from the application nozzle by a dummy dispense in the solvent atmosphere chamber is received by the drain groove and discharged to the outside from the solvent reservoir. The overflowing solvent is received by the drain groove and discharged to the outside.
Coating device. The coating apparatus according to claim 1 , wherein the solvent atmosphere chamber is provided integrally with the cleaning tank. 3. The coating apparatus according to claim 1 , wherein the solvent reservoir has a groove having an open upper end extending in a circumferential direction along an inner wall of the solvent atmosphere chamber. 4. The coating apparatus according to claim 2 , wherein an overflow passage is provided at an upper end portion of a partition wall that separates the solvent atmosphere chamber and the cleaning tank to allow the solvent in the cleaning tank to overflow to the solvent atmosphere chamber side. The coating apparatus according to claim 4 , wherein the ultrasonic vibration casing is disposed close to the partition wall in the cleaning tank. The partition wall constitutes a part of the inner wall of the solvent atmosphere chamber, said overflowing solvent from the cleaning tank with the solvent atmosphere chamber leading to said solvent reservoir to Tsutai the partition wall, according to claim 4 or 5 Coating device. The ultrasonic cleaning unit has a watertight ultrasonic vibration housing with a built-in ultrasonic vibrator, and the ultrasonic vibration housing is placed in the cleaning tank with its ultrasonic vibration surface facing upward. The coating device according to claim 1, wherein the coating device is detachably disposed. The application according to claim 7 , wherein the ultrasonic cleaning unit is provided with a solvent supply port at a position avoiding the ultrasonic vibration casing at the bottom of the cleaning tank, and introduces the solvent into the tank through the solvent supply port. apparatus.   The ultrasonic cleaning unit, when cleaning a portion near the discharge port of the coating nozzle, continues to introduce the solvent into the cleaning tank from the solvent supply port, overflowing the solvent from the cleaning tank. The coating apparatus according to 8. The ultrasonic cleaning unit includes a temperature sensor for detecting the temperature of the solvent in the cleaning tank, and controls introduction of the solvent into the cleaning tank based on an output signal of the temperature sensor. coating apparatus according to any one of 1-9. The coating apparatus according to claim 10 , wherein the temperature sensor is disposed in the solvent atmosphere chamber so as to receive a solvent overflowing from the cleaning tank. The ultrasonic cleaning unit has a liquid level sensor that detects a liquid level of the solvent in the cleaning tank, and controls introduction of the solvent into the cleaning tank based on an output signal of the liquid level sensor. coating apparatus according to any one of claims 1 to 11. Having a swinging means for swinging the said coating nozzle to a site around the outlet of the coating nozzle in a state immersed in a solvent in the cleaning tank, the coating apparatus according to any one of claims 1 to 12. The ultrasonic cleaning unit has a sealing portion for substantially sealing the upper surface of the washing tub to a site around the outlet of the coating nozzle in a state immersed in the solvent, any one of claims 1 to 13 The coating apparatus according to one item. The coating nozzle has a long nozzle body extending in the horizontal direction, and a nozzle portion that protrudes vertically downward from the lower surface of the nozzle body and has the discharge port at the lower end.
The coating device according to claim 14 , wherein the sealing portion includes a lid provided with a slit-like opening for passing the nozzle portion of the coating nozzle. The cleaning tank is moved up and down together with the cleaning tank between a first height position for performing ultrasonic cleaning and a second height position for evacuation lower than the first height position. The coating apparatus as described in any one of Claims 1-15 which has the raising / lowering mechanism for. The coating apparatus according to any one of claims 1 to 16 , wherein the solvent atmosphere chamber has a lid provided with a slit-shaped opening for passing a nozzle portion of the coating nozzle. The coating apparatus according to any one of claims 1 to 17 , further comprising a nozzle cleaning unit that cleans a portion near the discharge port of the coating nozzle with a cleaning liquid at a position away from the ultrasonic cleaning unit. The nozzle cleaning unit includes a cleaning nozzle that sprays a cleaning liquid toward a portion near the discharge port of the application nozzle, and a drainage recovery unit that collects and recovers the liquid dropped from the application nozzle with a vacuum force. The coating device according to claim 18 . The nozzle cleaning unit is positioned above the ultrasonic cleaning unit so that the cleaning nozzle and the drainage recovery unit are opposed to a part near the discharge port of the coating nozzle with a certain interval therebetween, and one end of the coating nozzle. The coating apparatus according to claim 19 , wherein scanning is performed from one end to the other end. 21. The coating apparatus according to claim 20 , wherein the nozzle cleaning unit includes a gas nozzle that sprays a drying gas onto a portion in the vicinity of a discharge port of the coating nozzle at a position behind the cleaning nozzle in the scanning direction.

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