JP4297167B2 - 電気部品の接続装置 - Google Patents
電気部品の接続装置 Download PDFInfo
- Publication number
- JP4297167B2 JP4297167B2 JP2007026739A JP2007026739A JP4297167B2 JP 4297167 B2 JP4297167 B2 JP 4297167B2 JP 2007026739 A JP2007026739 A JP 2007026739A JP 2007026739 A JP2007026739 A JP 2007026739A JP 4297167 B2 JP4297167 B2 JP 4297167B2
- Authority
- JP
- Japan
- Prior art keywords
- unit
- end side
- electrical component
- flexible substrate
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Description
2ユニット3に対して上昇させ、第2支持部21に支持されたフレキシブル基板4の他端側4bの表面を第2吸着部6の吸着パッド6aに当接させる。このとき、第2支持部21を非吸着モードに切り換え、裏面からの吸着が解除された他端側4bが上昇に伴い吸着パッド21aに対して水平方向に変位しやすくしているので、一端側4aが吸着面20aに対して水平方向に変位することがなく、両者の間に位置ずれが発生しないようになっている。
するため、配線基板30を下方から支持しておく必要があるが、熱圧着ツール7は低融点の半田粒子を接続端子列4cと接続端子列30aの間で押し潰して両端子列に融着させる程度の荷重を加えるだけなので、適宜配置した数本の支持ピン32であっても配線基板30に過大な変形を生じさせることなく十分に荷重に耐えることができる。また、熱圧着ツール7が設けられる第1ユニット2は小型軽量化が図られているので、支持ピン32に過大な負担とならない低荷重での圧着や配線基板30の限られた接続領域に近接して作業を行う装置として好適である。従って、配線基板30には、フレキシブル基板4の一端側4aとの接続領域が最低限確保されていれば、接続領域の裏面にあたる領域を含む全領域に電子部品31が高密度に実装されている場合であってもフレキシブル基板4と接続することができる。
2 第1ユニット
3 第2ユニット
4 フレキシブル基板
4a 一端側
4b 他端側
4c 接続端子列
5 第1吸着部
6 第2吸着部
20 第1支持部
21 第2支持部
30 配線基板
30a 接続端子列
40 カメラモジュール
41 配線群
41a 接続端子列
41b 一端部
Claims (3)
- 少なくとも一部に可撓性領域を含み一端側と他端側との相対的な高さ位置が変更可能な電気部品の表面の一端側を吸着するとともに裏面の一端側に形成された接続端子列を配線基板に形成された接続端子列に対して押圧する第1吸着部と、電気部品の一端側より高い位置で表面の他端側を吸着する第2吸着部を備え、第1吸着部と第2吸着部で吸着した電気部品の接続端子列を配線基板に形成された接続端子列に接続する第1ユニットと、
第1ユニットと独立して設けられ、電気部品の裏面の一端側を支持する第1支持部と、電気部品の裏面の他端側を支持する第2支持部と、第1支持部と第2支持部の相対的な高さ位置を変更する第1の高さ位置変更手段を備えた第2ユニットと、
第1ユニットと第2ユニットの相対的な高さ位置を変更する第2の高さ位置変更手段を備え、
第2ユニットに他端側が一端側より高い位置となる姿勢で支持された電気部品を第1ユニットに受け渡す電気部品の接続装置。 - 前記第1吸着部と前記第2吸着部の相対的な高さ位置を変更可能にした請求項1に記載の電気部品の接続装置。
- 前記第1吸着部と前記第2吸着部の離間距離を変更可能にした請求項1または2に記載の電気部品の接続装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007026739A JP4297167B2 (ja) | 2007-02-06 | 2007-02-06 | 電気部品の接続装置 |
US12/026,083 US7950140B2 (en) | 2007-02-06 | 2008-02-05 | Connection device for electric components |
TW097104581A TW200838059A (en) | 2007-02-06 | 2008-02-05 | Connection device for electric components |
KR1020080011732A KR20080073666A (ko) | 2007-02-06 | 2008-02-05 | 전기 부품의 접속 장치 |
CN2008100095932A CN101242737B (zh) | 2007-02-06 | 2008-02-13 | 电气元件连接装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007026739A JP4297167B2 (ja) | 2007-02-06 | 2007-02-06 | 電気部品の接続装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008192895A JP2008192895A (ja) | 2008-08-21 |
JP4297167B2 true JP4297167B2 (ja) | 2009-07-15 |
Family
ID=39752699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007026739A Active JP4297167B2 (ja) | 2007-02-06 | 2007-02-06 | 電気部品の接続装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7950140B2 (ja) |
JP (1) | JP4297167B2 (ja) |
KR (1) | KR20080073666A (ja) |
CN (1) | CN101242737B (ja) |
TW (1) | TW200838059A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6123077B2 (ja) * | 2014-03-05 | 2017-05-10 | パナソニックIpマネジメント株式会社 | フィルム状基板保持ユニットの調整用治具 |
JP6554667B2 (ja) * | 2015-12-25 | 2019-08-07 | パナソニックIpマネジメント株式会社 | 部品圧着装置 |
US9855908B2 (en) * | 2016-01-12 | 2018-01-02 | Tesla, Inc. | Load limiter configuration using multidimensional model |
JP6643578B2 (ja) * | 2016-09-08 | 2020-02-12 | パナソニックIpマネジメント株式会社 | 部品搭載装置及び部品搭載方法 |
CN109121317B (zh) * | 2018-07-23 | 2020-06-09 | 武汉华星光电半导体显示技术有限公司 | 支撑装置以及热压设备 |
JP7535745B2 (ja) | 2020-07-27 | 2024-08-19 | パナソニックIpマネジメント株式会社 | 基板搬送装置及び基板搬送方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2471061Y (zh) * | 2001-02-14 | 2002-01-09 | 微星科技股份有限公司 | 电路板布局设定可分离装置 |
JP3943481B2 (ja) * | 2002-10-30 | 2007-07-11 | 芝浦メカトロニクス株式会社 | 電子部品搬送ヘッド、及び電子部品実装装置 |
JP3887351B2 (ja) * | 2003-05-30 | 2007-02-28 | Tdk株式会社 | 可撓性基板の貼合せ方法および貼合せ装置 |
CN2724379Y (zh) * | 2004-07-30 | 2005-09-07 | 昶驎科技股份有限公司 | 电路板定位及压合设备 |
JP4490238B2 (ja) * | 2004-11-08 | 2010-06-23 | パナソニック株式会社 | パネル組み立て装置及びパネル組み立て方法 |
-
2007
- 2007-02-06 JP JP2007026739A patent/JP4297167B2/ja active Active
-
2008
- 2008-02-05 KR KR1020080011732A patent/KR20080073666A/ko not_active Application Discontinuation
- 2008-02-05 TW TW097104581A patent/TW200838059A/zh unknown
- 2008-02-05 US US12/026,083 patent/US7950140B2/en active Active
- 2008-02-13 CN CN2008100095932A patent/CN101242737B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20080073666A (ko) | 2008-08-11 |
US20080295321A1 (en) | 2008-12-04 |
JP2008192895A (ja) | 2008-08-21 |
CN101242737A (zh) | 2008-08-13 |
US7950140B2 (en) | 2011-05-31 |
CN101242737B (zh) | 2011-07-13 |
TW200838059A (en) | 2008-09-16 |
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