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JP4271674B2 - Wire bonding equipment - Google Patents

Wire bonding equipment Download PDF

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JP4271674B2
JP4271674B2 JP2005215446A JP2005215446A JP4271674B2 JP 4271674 B2 JP4271674 B2 JP 4271674B2 JP 2005215446 A JP2005215446 A JP 2005215446A JP 2005215446 A JP2005215446 A JP 2005215446A JP 4271674 B2 JP4271674 B2 JP 4271674B2
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conductor
bonding
bonding tool
tip
horn
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JP2007035827A5 (en
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正児 小林
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ULTRASONIC ENGINEERING CO., LTD.
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ULTRASONIC ENGINEERING CO., LTD.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic wire bonder which stabilizes impedance and a resonance frequency of a horn, and has stable bondability, and in which transmission of ultrasonic vibration amplitude is not inhibited while a structure at a periphery of a bonding tool comprising a conductor is reduced in a size, in a lateral direction for achieving usage in a narrow place with a barrier such as a casing of a semiconductor package in a wire bonding device which performs ultrasonic-bonding of the conductor and a material to be bonded. <P>SOLUTION: Conductor guides 11 and 12 are arranged in such a way that a supply route guiding the conductor 6 to vicinity of a tip of the bonding tool 7 is made almost parallel to the bonding tool 7, and is placed to a nearer position of a side opposite to a resonance object with respect to the bonding tool 7 as much as possible. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

本発明は、半導体デバイスの製造に用いる超音波方式のワイヤボンディング装置に関し、特に半導体パッケージのケーシングなどの障壁がある狭い場所においてボンディング可能なワイヤボンディング装置に関する。   The present invention relates to an ultrasonic wire bonding apparatus used for manufacturing a semiconductor device, and more particularly to a wire bonding apparatus capable of bonding in a narrow place with a barrier such as a casing of a semiconductor package.

半導体デバイスの製造において、半導体チップ上に設けられた接続電極（ボンディングパッド）と半導体パッケージに設けられた外部引出し用端子（リード）とを電気的に接続するために、アルミ等の導電性ワイヤを用いる超音波ワイヤボンディング装置が広く一般に使用されている。   In the manufacture of semiconductor devices, a conductive wire such as aluminum is used to electrically connect connection electrodes (bonding pads) provided on a semiconductor chip and external lead terminals (leads) provided on a semiconductor package. The ultrasonic wire bonding apparatus to be used is widely used generally.

一般に、ウェッジボンダのワイヤ接合部におけるワイヤが供給される方向は、ツールの振動方向と一致させる必要があり、また、ワイヤの供給には負荷がかからないような経路をとる必要がある。そこで、ワイヤが超音波振動子の下方を通ってツール先端に供給されるような構造（特許文献１参照）や、ホーン本体にボンディングツール先端へ向けたワイヤ通過穴をあけた構造（特許文献２参照）が採用されている。   In general, the direction in which the wire is supplied at the wire bonder of the wedge bonder needs to coincide with the vibration direction of the tool, and it is necessary to take a path in which no load is applied to the supply of the wire. Therefore, a structure in which the wire is supplied to the tool tip through the lower part of the ultrasonic transducer (see Patent Document 1), or a structure in which a wire passing hole toward the bonding tool tip is formed in the horn body (Patent Document 2). Reference) is adopted.

また、本発明に関連する先行技術として、ホーン先端部分に取り付けられているキャピラリの交換によって生じるホーンのインピーダンスや共振周波数の変化を安定させ、規定の超音波エネルギ、振動振幅を得るために、超音波振動モードの節となる部位に、穴をあける等のホーンを形成する材料とは密度の異なる物質を存在させるという技術が知られている（特許文献３参照）。
特開平１０−０４１３３４号公報 特開平０６−１７７２１６号公報 特開２００１−１２１０８０号公報 Also, as a prior art related to the present invention, in order to stabilize the change of the horn impedance and the resonance frequency caused by the exchange of the capillary attached to the tip of the horn, and to obtain the specified ultrasonic energy and vibration amplitude, A technique is known in which a substance having a density different from that of a material for forming a horn, such as making a hole, is present in a portion that becomes a node of a sonic vibration mode (see Patent Document 3).
Japanese Patent Laid-Open No. 10-041334 Japanese Patent Laid-Open No. 06-177216 JP 2001-112080 A

半導体パッケージの形状は様々であり、その形状に適用できるワイヤボンディング装置を使用する必要があるが、パッケージの形状が小型化・複雑化するに伴って、ワイヤボンダのボンディングツール周辺の構造も横寸法を縮小化しなければならない。   There are various shapes of semiconductor packages, and it is necessary to use wire bonding equipment that can be applied to those shapes. However, as the package shape becomes smaller and more complex, the structure around the bonding tool of the wire bonder also becomes lateral dimensions. Must be scaled down.

また、自動車等に用いられるパワーデバイスにおいては、ボンディングパッドとリードとの接続に用いられる断面が円形状のワイヤを、耐電流容量を増大し、ボンド接合面積を拡大するために、断面が幅広のリボン状の導電体（以下「リボン」と呼ぶ。）を用いて接続するワイヤボンディング（以下ワイヤ及びリボンを用いるものを含めて「ワイヤボンディング」と呼ぶ。）の需要が高まってきている。   In addition, in power devices used in automobiles and the like, the cross section used for connecting the bonding pad and the lead has a circular cross section, and the cross section is wide in order to increase the withstand current capacity and expand the bond junction area. There is an increasing demand for wire bonding (hereinafter referred to as “wire bonding” including a wire and a ribbon) using a ribbon-like conductor (hereinafter referred to as “ribbon”).

しかし、前述のようにワイヤが超音波振動子の後方を通ってツール先端に供給される構造では、ボンディングツールとワイヤとのなす角度が大きく、半導体パッケージのケーシングなどの障壁がある狭い場所においてはボンディングを行えないことがある。また、ホーン本体にボンディングツール先端へ向けた導電体通過穴をあけた構造では、特にリボンを用いた場合に幅広の通過穴が必要となり、ホーンの外径及びボンディングツール穴に対する影響が大きくなる。その結果、ホーンのインピーダンスや共振周波数を変化させ、ホーンの振動振幅の伝達を阻害することとなる。   However, in the structure in which the wire is supplied to the tip of the tool through the back of the ultrasonic transducer as described above, the angle between the bonding tool and the wire is large, and in a narrow place where there is a barrier such as a casing of a semiconductor package. Bonding may not be performed. Further, in the structure in which the conductor passage hole toward the tip of the bonding tool is formed in the horn body, a wide passage hole is required particularly when a ribbon is used, and the influence on the outer diameter of the horn and the bonding tool hole is increased. As a result, the impedance and resonance frequency of the horn are changed, and transmission of the vibration amplitude of the horn is hindered.

そこで、本発明は、超音波を用いて被ボンディング材に導電体を接合するワイヤボンディング装置であって、半導体パッケージのケーシングなどの障壁がある狭い場所における使用を可能とするために、ワイヤを含めたボンディングツール周辺の構造を横方向のサイズについて縮小化を図りつつ、ホーンのインピーダンスや共振周波数を安定させ、安定したボンダビリティを有し、超音波振動振幅の伝達が阻害されないワイヤボンディング装置を提供することを目的とする。   Therefore, the present invention is a wire bonding apparatus for bonding a conductor to a material to be bonded using ultrasonic waves, and includes a wire in order to enable use in a narrow place such as a casing of a semiconductor package. Provides wire bonding equipment that stabilizes the impedance and resonance frequency of the horn while reducing the size of the structure around the bonding tool in the lateral direction, has stable bondability, and does not impede transmission of ultrasonic vibration amplitude The purpose is to do.

上記の課題を解決するために、本発明によるワイヤボンディング装置では、導電体をボンディングツールの先端付近まで導く供給経路を、ボンディングツールと概ね平行とし、ボンディングツールに対して共振体と相反する側のできるだけ近い位置にとるようにする。   In order to solve the above problems, in the wire bonding apparatus according to the present invention, the supply path for guiding the conductor to the vicinity of the tip of the bonding tool is made substantially parallel to the bonding tool, and is on the side opposite to the resonator with respect to the bonding tool. Try to be as close as possible.

すなわち本発明は、上記課題を解決するための第１の手段として、振動子から発生された超音波振動を伝達する共振体と、共振体の先端部付近に、共振体の中心軸に略直交する向きに延出されたボンディングツールと、ボンディングツール先端に導かれる導電体を供給する導電体供給体とを有し、被ボンディング材に導電体を接合するワイヤボンディング装置であって、ボンディングツールの先端付近にあって共振体と相反する側に配設された導電体ガイドを有し、導電体供給体を導電体ガイドの上方に配設することにより、導電体をボンディングツールと概ね平行にボンディングツールの先端付近まで導くワイヤボンディング装置を提供する。   That is, according to the present invention, as a first means for solving the above-described problem, a resonator that transmits ultrasonic vibration generated from a vibrator, and the vicinity of the tip of the resonator, approximately perpendicular to the central axis of the resonator. A wire bonding apparatus for bonding a conductor to a material to be bonded, which has a bonding tool extended in a direction and a conductor supplier for supplying a conductor guided to the tip of the bonding tool. It has a conductor guide disposed near the tip and on the side opposite to the resonator, and the conductor supply body is disposed above the conductor guide so that the conductor is bonded substantially parallel to the bonding tool. Provided is a wire bonding apparatus that leads to the vicinity of the tip of a tool.

これによると、導電体をボンディングツールに近接させることにより、導電体からボンディングツール中心までの横方向のサイズが縮小され、障壁があるような狭い場所においてもボンディングを行うことができ、共振体に導電体の通過穴をあける必要がないため、通過穴によって生じる共振体の超音波振動伝達への影響を受けることなく、ボンディングを行うことができる。   According to this, by bringing the conductor close to the bonding tool, the lateral size from the conductor to the center of the bonding tool is reduced, and bonding can be performed even in a narrow place where there is a barrier. Since there is no need to make a through hole for the conductor, bonding can be performed without being affected by the ultrasonic vibration transmission of the resonator caused by the through hole.

また本発明は、上記課題を解決するための第２の手段として、振動子から発生された超音波振動を伝達する共振体と、共振体の先端部付近に、共振体の中心軸に略直交する向きに延出されたボンディングツールと、ボンディングツール先端に導かれる導電体を供給する導電体供給体とを有し、被ボンディング材に導電体を接合するワイヤボンディング装置であって、ボンディングツールの先端付近にあって共振体と相反する側に配設された第１の導電体ガイドと、第１の導電体ガイドの上方に配設された第２の導電体ガイドとを有することにより、導電体をボンディングツールと概ね平行にボンディングツールの先端付近まで導くことを特徴とするワイヤボンディング装置を提供する。   In addition, as a second means for solving the above-described problems, the present invention provides a resonator that transmits ultrasonic vibrations generated from the vibrator, and is substantially orthogonal to the central axis of the resonator near the tip of the resonator. A wire bonding apparatus for bonding a conductor to a material to be bonded, which has a bonding tool extended in a direction and a conductor supplier for supplying a conductor guided to the tip of the bonding tool. By having a first conductor guide disposed near the tip and on the side opposite to the resonator, and a second conductor guide disposed above the first conductor guide, Provided is a wire bonding apparatus characterized in that a body is guided almost parallel to a bonding tool to the vicinity of the tip of the bonding tool.

これによると、第１の手段による作用・効果に加えて、導電体供給体を配設する位置が限定されないため、導電体供給経路及び装置の設計に自由度が与えられる。   According to this, in addition to the operation and effect of the first means, the position where the conductor supply body is disposed is not limited, and thus the degree of freedom is given to the design of the conductor supply path and the apparatus.

さらに本発明は、上記課題を解決するための第３の手段として、第１及び第２の手段である前記ワイヤボンディング装置において、導電体がリボンであるワイヤボンディング装置を提供する。   Furthermore, the present invention provides, as a third means for solving the above problems, a wire bonding apparatus in which the conductor is a ribbon in the wire bonding apparatus as the first and second means.

これによると、共振体に導電体の通過穴をあけた構造のワイヤボンディング装置においては、通過穴が幅広であるほど共振体のインピーダンスや共振周波数を変化させ、振動振幅の伝達を阻害することとなるが、通過穴によるこれらの影響を生じないために特に幅広のリボンを用いたときに本手段による効果は大きい。   According to this, in a wire bonding apparatus having a structure in which a through hole for a conductor is formed in a resonator, the wider the through hole is, the more the impedance and resonance frequency of the resonator are changed, thereby inhibiting the transmission of vibration amplitude. However, in order not to cause these influences due to the passage holes, the effect of this means is great particularly when a wide ribbon is used.

上記手段を用いることにより、ボンディングツールの長さ方向と直交するどの断面においても、従来技術の超音波ワイヤボンダよりも導電体とボンディングツール中心との横寸法を小さくすることができる。したがって、半導体パッケージのケーシングなどの障壁がある狭い場所において、ワイヤボンディングを行うことができるようになり、しいては半導体パッケージの小型化を可能とする。また、通過穴を大きくしたときに生ずる共振体のインピーダンスや共振周波数の変化の影響を受けないため、安定したワイヤボンディングを行うことが可能となり、超音波振動振幅の伝達が阻害されることもない。したがって、超音波振動系設計の自由度も広がる。 By using the above means, the horizontal dimension between the conductor and the center of the bonding tool can be made smaller than that of the conventional ultrasonic wire bonder in any cross section orthogonal to the length direction of the bonding tool. Therefore, wire bonding can be performed in a narrow place where there is a barrier such as a casing of the semiconductor package, and the semiconductor package can be downsized. In addition, since it is not affected by changes in the impedance or resonance frequency of the resonator that occurs when the passage hole is enlarged, stable wire bonding can be performed, and transmission of ultrasonic vibration amplitude is not hindered. . Therefore, also spread the degree of freedom of the ultrasonic vibration system design.

次に、本発明の実施形態について、図面を参照しながら詳細に説明する。   Next, embodiments of the present invention will be described in detail with reference to the drawings.

図１は本発明の一実施例として、ワイヤボンディング装置のボンディング動作を行う様子を示した側面図である。ワイヤボンディング装置は、超音波発振器１と、超音波発振器１から発振された電気信号から超音波振動を発生するＢＬＴ振動子２と、ＢＬＴ振動子２から発生された超音波振動を伝達する共振体としてのコーン３と、同じく超音波振動を伝達する共振体としてのホーン４と、ホーン４の先端部付近に取り付けられたボンディングツール７とを有している。   FIG. 1 is a side view showing how a wire bonding apparatus performs a bonding operation as one embodiment of the present invention. The wire bonding apparatus includes an ultrasonic oscillator 1, a BLT vibrator 2 that generates ultrasonic vibration from an electric signal oscillated from the ultrasonic oscillator 1, and a resonator that transmits ultrasonic vibration generated from the BLT vibrator 2. , A horn 4 as a resonator that similarly transmits ultrasonic vibrations, and a bonding tool 7 attached near the tip of the horn 4.

ＢＬＴ振動子２、コーン３及びホーン４の中心軸は全て一致するように連結されており、ボンディングツール７は、ホーン４の中心軸と概ね直行する向きに伸びるようにボンディングツールセットねじ８により固定されている。ボンディングツール７の先端は、導電体６へ効率よく超音波を印加でき、さらに導電体を正確な位置に接合できるような形状、例えば凹部を有する形状又は複数の凹部若しくは大きさの異なる複数の凹部を有する形状であってよい。   The BLT vibrator 2, the cone 3, and the central axis of the horn 4 are all connected so as to coincide with each other, and the bonding tool 7 is fixed by a bonding tool set screw 8 so as to extend in a direction substantially perpendicular to the central axis of the horn 4. Has been. The tip of the bonding tool 7 has a shape that can efficiently apply ultrasonic waves to the conductor 6, and can join the conductor to an accurate position, for example, a shape having a recess, or a plurality of recesses or a plurality of recesses having different sizes. The shape may have

ＢＬＴ振動子２、コーン３及びホーン４の上方にはブロック１４が配置されている。ブロック１４から懸装されたホルダ１５によってコーン３の振動振幅の節となる位置を保持している。   A block 14 is disposed above the BLT vibrator 2, the cone 3 and the horn 4. A holder 15 suspended from the block 14 holds a position that becomes a node of the vibration amplitude of the cone 3.

ボンディングツール７の先端付近であってホーン４の先端部側には、ブロック１４から懸装された導電体ガイドホルダ１０により固定された、導電体ガイド手段としての第１の導電体ガイド１１が配設されている。第１の導電体ガイド１１は、導電体６が導かれる方向を変え、ボンディングツール７の先端下方で一定方向に供給されるような構造をしていればよい。ボンディングツール７に対して導電体ガイドホルダ１０の反対側には、導電体ガイドホルダ１０と同様にブロック１４から懸装された、導電体を切断する導電体カッタ９が取り付けてある。   Near the front end of the bonding tool 7 and on the front end side of the horn 4, a first conductor guide 11 as a conductor guide means fixed by a conductor guide holder 10 suspended from the block 14 is arranged. It is installed. The first conductor guide 11 only needs to have a structure in which the direction in which the conductor 6 is guided is changed and supplied in a certain direction below the tip of the bonding tool 7. On the opposite side of the conductor guide holder 10 with respect to the bonding tool 7, a conductor cutter 9 suspended from the block 14 and cutting the conductor is attached in the same manner as the conductor guide holder 10.

また、ブロック１４には、導電体供給体としての導電体スプール１３が装備され、第１の導電体ガイド１１の上方には導電体ガイド手段として、第２の導電体ガイド１２が配設されている。導電体スプール１３から引き出される導電体６は、第２の導電体ガイド１２を経由して、ホーン４の中心軸線上であってホーンの先端部に近接する点を通過し、ボンディングツール７とほぼ平行にツール先端方向に導かれ、第１の導電体ガイド１１を経由してツール先端下方に供給される。   The block 14 is provided with a conductor spool 13 as a conductor supplier, and a second conductor guide 12 is disposed above the first conductor guide 11 as conductor guide means. Yes. The conductor 6 drawn out from the conductor spool 13 passes through a point on the central axis of the horn 4 and close to the tip of the horn via the second conductor guide 12, and substantially the same as the bonding tool 7. It is guided in the direction of the tool tip in parallel and supplied to the lower side of the tool tip via the first conductor guide 11.

ボンディングツール７は、ツール先端がホーン４の中心軸と同じ方向に振動し、ツールの長さ方向に加圧を行いつつ超音波振動を印加して導電体６を被ボンディング材に超音波接合する。ワイヤボンディング装置は、半導体素子２２に設けられた接続電極（ボンディングパッド）にファーストボンディングを行う。続いてボンディングツール７を含むボンディングヘッドがケーシング２０の方向（図面右方向）へ移動しながら、若しくはケーシング２０がボンディングツール７の方向（図面左方向）へ移動しながら、導電体６が引き出され、ケーシング２０に設けられた回路主端子２１と接続した外部引出し端子（リード）にセカンドボンディングを行う。その後、導電体カッタ９によって導電体６は切断されて、ボンディング１工程が終了する。   The bonding tool 7 vibrates in the same direction as the center axis of the horn 4 and applies ultrasonic vibration while applying pressure in the length direction of the tool to ultrasonically bond the conductor 6 to the material to be bonded. . The wire bonding apparatus performs first bonding on connection electrodes (bonding pads) provided on the semiconductor element 22. Subsequently, the conductor 6 is pulled out while the bonding head including the bonding tool 7 moves in the direction of the casing 20 (right direction in the drawing) or while the casing 20 moves in the direction of the bonding tool 7 (left direction in the drawing). Second bonding is performed on an external lead terminal (lead) connected to the circuit main terminal 21 provided in the casing 20. Thereafter, the conductor 6 is cut by the conductor cutter 9, and the bonding step 1 is completed.

第１の導電体ガイド１１及びボンディングツールセットねじ８の横寸法を小さくするほど、ボンディングツール７の先端をさらにケーシング２０に近づけることができる。すなわち、より狭い場所におけるボンディングが可能となり、ケーシング形状の小型化・複雑化が可能であるといえる。   The tip of the bonding tool 7 can be brought closer to the casing 20 as the lateral dimensions of the first conductor guide 11 and the bonding tool set screw 8 are reduced. That is, it is possible to bond in a narrower place, and it can be said that the casing shape can be downsized and complicated.

図２は、本発明の一実施例として、ワイヤボンディング装置の側面を一部破断して示した概念図である。（Ａ）は本発明によるワイヤボンディング装置の側面を一部破断して示しており、（Ｂ）はＢＬＴ振動子２の後端からホーン４の先端までの縦振動振幅モードを示しており、（Ｃ）はボンディングツール７の後端から先端までの撓み振動振幅モードを示している。   FIG. 2 is a conceptual diagram showing a partially broken side surface of a wire bonding apparatus as an embodiment of the present invention. (A) shows a partially broken side view of the wire bonding apparatus according to the present invention, (B) shows a longitudinal vibration amplitude mode from the rear end of the BLT vibrator 2 to the front end of the horn 4, C) shows a flexural vibration amplitude mode from the rear end to the front end of the bonding tool 7.

超音波発振器１から発振された電気信号は、ＢＬＴ振動子２により縦振動の超音波振動に変換され、コーン３及びホーン４を共振して伝達され、ホーン４の先端部付近に取り付けられたボンディングツール７で撓み振動に変換される。ホーンには導電体の通過穴が設けられていないため、振動振幅は損失なくホーン先端まで伝わる。ホーン４の先端は固定されておらず、振動振幅が最大（振動振幅の腹）となるようにされている。ボンディングツール７は、ホーン４の先端部付近の振動振幅が大きな位置に取り付けられることにより、縦振動から撓み振動へ変換する際の超音波振動振幅の減衰を抑える。ボンディングツール７の撓み振動は、ボンディングツールセットねじ８により固定された部位が振幅の腹となり、ツール先端の振動振幅が最大となって伝達されるように調整される。そしてボンディングツール７の先端において、導電体に超音波振動を印加し、ツールによる加圧を併用して導電材をボンディングパッド及びリードなどの被ボンディング材に超音波接合する。   The electrical signal oscillated from the ultrasonic oscillator 1 is converted into longitudinal ultrasonic vibration by the BLT vibrator 2, transmitted by resonating the cone 3 and the horn 4, and attached to the vicinity of the tip of the horn 4. It is converted into flexural vibration by the tool 7. Since the horn is not provided with a conductor passage hole, the vibration amplitude is transmitted to the tip of the horn without loss. The tip of the horn 4 is not fixed, and the vibration amplitude is maximized (vibration amplitude antinode). The bonding tool 7 is attached at a position where the vibration amplitude in the vicinity of the tip of the horn 4 is large, thereby suppressing attenuation of the ultrasonic vibration amplitude when converting from longitudinal vibration to flexural vibration. The bending vibration of the bonding tool 7 is adjusted so that the portion fixed by the bonding tool set screw 8 becomes an antinode and the vibration amplitude at the tool tip is maximized and transmitted. Then, ultrasonic vibration is applied to the conductor at the tip of the bonding tool 7, and the conductive material is ultrasonically bonded to a material to be bonded such as a bonding pad and a lead using pressure applied by the tool.

図３は、本発明の一実施例として、ワイヤボンディング装置のホーン先端部付近を示す上面図である。リボン６は、ホーン４の先端部にできるだけ近い位置を供給経路とされている。   FIG. 3 is a top view showing the vicinity of the horn tip of the wire bonding apparatus as an embodiment of the present invention. The supply path of the ribbon 6 is as close as possible to the tip of the horn 4.

このように図１〜図３は、本発明によるワイヤボンディング装置の一実施例を示すが、本発明がここに示された実施例に限定されるものではない。例えば、コーン３を介さずに、ＢＬＴ振動子２に直接ホーン４を連結してもよい。この場合、ブロック１４から懸装されたホルダ１５が保持する位置は、コーン３を固定する場合と同様に、ＢＬＴ振動子２又はホーン４の振動振幅の節となる位置であればよい。また、第２の導電体ガイド１２の配設位置は、第１の導電体ガイド１１の上方であればよく、第１の導電体ガイド１１からの距離を大きくするほどより高い障壁を有するケーシングに適用することができる。   1 to 3 show one embodiment of the wire bonding apparatus according to the present invention, the present invention is not limited to the embodiment shown here. For example, the horn 4 may be directly connected to the BLT vibrator 2 without using the cone 3. In this case, the position held by the holder 15 suspended from the block 14 may be a position that becomes a node of the vibration amplitude of the BLT vibrator 2 or the horn 4 as in the case where the cone 3 is fixed. Further, the second conductor guide 12 may be disposed above the first conductor guide 11 and the casing having a higher barrier as the distance from the first conductor guide 11 is increased. Can be applied.

また、導電体スプール１３から引き出される導電体の経路の始点が、ブロック１４に設けられる第２の導電体ガイド１２の上方すなわちホーン４の先端部の上方となるように、導電体スプール１３を配置してもよい。さらに、導電体スプール１３をこのように配置した場合に、第２の導電体ガイド１２を設けずに、導電体６が、共振体の中心軸線上であって共振体の先端部に近接する点を通過し、ボンディングツール７と概ね平行にボンディングツール先端付近まで直接導かれるようにしてもよい。   The conductor spool 13 is arranged so that the starting point of the path of the conductor drawn out from the conductor spool 13 is above the second conductor guide 12 provided in the block 14, that is, above the tip of the horn 4. May be. Further, when the conductor spool 13 is arranged in this way, the conductor 6 is located on the center axis of the resonator and close to the tip of the resonator without providing the second conductor guide 12. May be guided directly to the vicinity of the tip of the bonding tool substantially parallel to the bonding tool 7.

図４は、従来技術に基づいて構成されたワイヤボンディング装置の側面を一部破断して示した概念図である。（Ａ）は従来技術によるワイヤボンディング装置の側面を一部破断して示しており、（Ｂ）はＢＬＴ振動子２の後端からホーン４の先端までの縦振動振幅モードを示しており、（Ｃ）はボンディングツール７の後端から先端までの撓み振動振幅モードを示している。導電体をボンディングツールと概ね平行にしてツール先端付近へ導く手段を含んだものであって、半導体パッケージのケーシングなどの障壁がある狭い場所において、ワイヤボンディングを行うことができる。   FIG. 4 is a conceptual diagram showing a partially broken side view of a wire bonding apparatus configured based on the prior art. (A) shows a partially broken side view of a wire bonding apparatus according to the prior art, and (B) shows a longitudinal vibration amplitude mode from the rear end of the BLT vibrator 2 to the front end of the horn 4, C) shows a flexural vibration amplitude mode from the rear end to the front end of the bonding tool 7. It includes means for guiding the conductor to the vicinity of the tip of the tool in parallel with the bonding tool, and wire bonding can be performed in a narrow place with a barrier such as a casing of a semiconductor package.

図５は、従来技術に基づいて構成されたワイヤボンディング装置のホーン先端部付近を示す上面図である。   FIG. 5 is a top view showing the vicinity of the horn tip of a wire bonding apparatus configured based on the prior art.

図４及び図５に示す従来技術に基づいて構成されたワイヤボンディング装置は、図１〜図３に示す本発明によるワイヤボンディング装置と異なり、ボンディングツール７に対してＢＬＴ振動子２の側であって、ホーン４の中心軸線上に導電体通過穴５があけられている。導電体６は、図１〜図３のようにホーン先端部に近接した中心軸の延長線上を通過するのではなく、ホーン４にあけられた導電体通過穴５を通過して、ボンディングツール７と概ね平行な経路をたどってツール先端付近まで導かれる。第１の導電体ガイド１１はボンディングツール７に対してＢＬＴ振動子２の側に取り付けてある。   Unlike the wire bonding apparatus according to the present invention shown in FIGS. 1 to 3, the wire bonding apparatus configured based on the prior art shown in FIGS. 4 and 5 is on the BLT vibrator 2 side with respect to the bonding tool 7. A conductor passage hole 5 is formed on the central axis of the horn 4. The conductor 6 does not pass through the extension of the central axis close to the horn tip as shown in FIGS. 1 to 3, but passes through the conductor passage hole 5 formed in the horn 4 and passes through the bonding tool 7. Is guided to the vicinity of the tool tip. The first conductor guide 11 is attached to the BLT vibrator 2 side with respect to the bonding tool 7.

ホーン４にあけられた導電体通過穴５が小さい場合には、超音波振動の伝達への影響は少なく、ホーンのどの部位にあけても問題とはならない。しかし、導電体通過穴５がホーン４の外径及びボンディングツール穴に対して穴径の影響を無視できなくなる大きさになると、ホーンのインピーダンスや共振周波数を変化させ、例え超音波振動モードの節となる部位に穴をあけたとしても、ホーンの振動振幅の伝達を阻害することとなる。   When the conductor passage hole 5 formed in the horn 4 is small, the influence on the transmission of the ultrasonic vibration is small, and it does not matter if it is opened in any part of the horn. However, when the conductor passage hole 5 has such a size that the influence of the hole diameter cannot be ignored with respect to the outer diameter of the horn 4 and the bonding tool hole, the impedance and resonance frequency of the horn are changed, for example, in the ultrasonic vibration mode mode. Even if a hole is made in the region, the transmission of the vibration amplitude of the horn is hindered.

したがって、縦振動振幅モードに示すように、導電体通過穴をあけた場合には、導電体通過穴がない場合よりも超音波振動振幅が小さくなってボンディングツール７へ伝達される。その結果、ボンディングツールの撓み振動振幅モードに示すように、撓み振動に変換された振動振幅についても、導電体通過穴をあけた場合には、導電体通過穴がない場合よりも超音波振動振幅は小さくなり、超音波接合能力を低下させる。   Therefore, as shown in the longitudinal vibration amplitude mode, when the conductor passage hole is made, the ultrasonic vibration amplitude becomes smaller than that when there is no conductor passage hole, and is transmitted to the bonding tool 7. As a result, as shown in the bending vibration amplitude mode of the bonding tool, the vibration amplitude converted into the bending vibration is also greater when the conductor passage hole is formed than when there is no conductor passage hole. Becomes smaller and lowers the ultrasonic bonding ability.

本発明の一実施例として、ワイヤボンディング装置のボンディング動作を行う様子を一部破断して示した側面図である。It is the side view which showed a mode that a bonding operation of the wire bonding apparatus was performed partially fractured as one example of the present invention. 本発明の一実施例として、ワイヤボンディング装置の側面を一部破断して示した概念図である。It is the conceptual diagram which fractured | ruptured and showed the side surface of the wire bonding apparatus as one Example of this invention. 本発明の一実施例として、ワイヤボンディング装置のホーン先端部付近を示す上面図である。It is a top view which shows the horn front-end | tip part vicinity of a wire bonding apparatus as one Example of this invention. 従来技術に基づいて構成されたワイヤボンディング装置の側面を一部破断して示した概念図である。It is the conceptual diagram which fractured | ruptured and showed the side surface of the wire bonding apparatus comprised based on the prior art. 従来技術に基づいて構成されたワイヤボンディング装置のホーン先端部付近を示す上面図である。It is a top view which shows the horn front-end | tip part vicinity of the wire bonding apparatus comprised based on the prior art.

符号の説明Explanation of symbols

１ 超音波発振器
２ ＢＬＴ振動子
３ コーン
４ ホーン
５ 導電体通過穴
６ 導電体
７ ボンディングツール
８ ボンディングツールセットねじ
９ 導電体カッタ
１０ 導電体ガイドホルダ
１１ 第１の導電体ガイド
１２ 第２の導電体ガイド
１３ 導電体スプール
１４ ブロック
１５ ホルダ
２０ ケーシング
２１ 主回路端子
２２ 半導体素子 DESCRIPTION OF SYMBOLS 1 Ultrasonic oscillator 2 BLT vibrator 3 Cone 4 Horn 5 Conductor passage hole 6 Conductor 7 Bonding tool 8 Bonding tool set screw 9 Conductor cutter 10 Conductor guide holder 11 First conductor guide 12 Second conductor Guide 13 Conductor spool 14 Block 15 Holder 20 Casing 21 Main circuit terminal 22 Semiconductor element

Claims (3)

振動子から発生された超音波振動を伝達する共振体と、
前記共振体の先端部付近に、前記共振体の中心軸に略直交する向きに延出されたボンディングツールと、
前記ボンディングツール先端に導かれる導電体を供給する導電体供給体とを有し、
被ボンディング材に導電体を接合するワイヤボンディング装置であって、
前記ボンディングツールの先端付近にあって前記共振体と相反する側に配設された導電体ガイドを有し、
前記導電体供給体を前記導電体ガイドの上方に配設することにより、
前記導電体を前記ボンディングツールと概ね平行に前記ボンディングツールの先端付近まで導くことを特徴とするワイヤボンディング装置。 A resonator that transmits ultrasonic vibration generated from the vibrator;
A bonding tool extending in a direction substantially perpendicular to the central axis of the resonator, near the tip of the resonator,
A conductor supply body for supplying a conductor guided to the tip of the bonding tool;
A wire bonding apparatus for bonding a conductor to a material to be bonded,
A conductor guide disposed near the tip of the bonding tool and on the side opposite to the resonator;
By disposing the conductor supply body above the conductor guide,
A wire bonding apparatus that guides the conductor to the vicinity of the tip of the bonding tool substantially parallel to the bonding tool. 振動子から発生された超音波振動を伝達する共振体と、
前記共振体の先端部付近に、前記共振体の中心軸に略直交する向きに延出されたボンディングツールと、
前記ボンディングツール先端に導かれる導電体を供給する導電体供給体とを有し、
被ボンディング材に導電体を接合するワイヤボンディング装置であって、
前記ボンディングツールの先端付近にあって前記共振体と相反する側に配設された第１の導電体ガイドと、
前記第１の導電体ガイドの上方に配設された第２の導電体ガイドとを有することにより、
前記導電体を前記ボンディングツールと概ね平行に前記ボンディングツールの先端付近まで導くことを特徴とするワイヤボンディング装置。 A resonator that transmits ultrasonic vibration generated from the vibrator;
A bonding tool extending in a direction substantially perpendicular to the central axis of the resonator, near the tip of the resonator,
A conductor supply body for supplying a conductor guided to the tip of the bonding tool;
A wire bonding apparatus for bonding a conductor to a material to be bonded,
A first conductor guide disposed near the tip of the bonding tool and on the side opposite to the resonator;
Having a second conductor guide disposed above the first conductor guide,
A wire bonding apparatus that guides the conductor to the vicinity of the tip of the bonding tool substantially parallel to the bonding tool. 前記導電体が、リボンであることを特徴とする請求項１または請求項２のいずれか一項に記載のワイヤボンディング装置。   The wire bonding apparatus according to claim 1, wherein the conductor is a ribbon.
JP2005215446A 2005-07-26 2005-07-26 Wire bonding equipment Expired - Fee Related JP4271674B2 (en)

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US7537149B2 (en) * 2006-09-26 2009-05-26 Orthodyne Electronics Corporation Deep access large ribbon bond head
CH700015B1 (en) * 2007-04-04 2010-06-15 Oerlikon Assembly Equipment Ag Ultrasonic Transducer.
JP4874445B2 (en) * 2007-11-07 2012-02-15 超音波工業株式会社 Ultrasonic welding tool and method of attaching ultrasonic welding tool
US20110290859A1 (en) * 2009-02-06 2011-12-01 Orthodyne Electronics Corporation Ribbon bonding tools and methods of using the same
US10847491B2 (en) 2009-02-06 2020-11-24 Kulicke And Soffa Industries, Inc. Ribbon bonding tools and methods of using the same
JP5804644B2 (en) * 2012-02-21 2015-11-04 超音波工業株式会社 Ultrasonic wire bonding apparatus and ultrasonic wire bonding method
JP6427813B2 (en) * 2015-01-06 2018-11-28 株式会社アドウェルズ Wire bonding equipment

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