JP4264423B2 - Vacuum processing apparatus and processing chamber expansion method - Google Patents

Description

  The present invention relates to a vacuum processing apparatus and a processing chamber expansion method, and in particular, a vacuum processing apparatus exemplified by a plasma CVD apparatus, a dry etching apparatus, and a sputtering apparatus, that is, a substrate or a film-formed substrate having a vacuum or reduced pressure atmosphere. And a processing chamber expansion method for adding a processing chamber to the vacuum processing apparatus.

  A plasma CVD apparatus is known as a vacuum processing apparatus that gasifies a semiconductor using plasma and forms a thin film of the semiconductor on a heated substrate. 2. Description of the Related Art A thin-film silicon solar cell that converts p-layer, i-layer, and n-layer into a silicon-based thin film formed on a glass substrate and converts light applied to the i-layer into electric power is known. The solar cell is desired to have a larger glass substrate mainly from the viewpoint of productivity. The vacuum processing apparatus is desired to include more processing chambers for forming a semiconductor film independently on a large substrate, and to be installed in a smaller space.

  In Japanese Patent No. 2141379, the independent separation type semiconductor device manufacturing apparatus is further improved, the temperature accuracy is kept to 300 ± 1 ° C. or less, and the loading quantity per time can be 50 to 500 sheets. Thus, a coating film manufacturing apparatus that manufactures a large amount of low-cost, high-quality semiconductor devices is disclosed. The film forming apparatus has a plurality of reaction chambers and a common chamber connected to all of the plurality of reaction chambers.

  Japanese Patent Laid-Open No. 2000-183129 discloses a novel vacuum processing system capable of obtaining higher throughput. The vacuum processing system is a vacuum processing system for processing a substrate to be processed, and a carriage for traveling in the system, and a support disposed on the carriage for supporting the substrate to be processed. A transfer device having a mechanism, a common transfer chamber configured as a cart rotation chamber in which the transfer device supporting the object to be processed can move, and a gate valve with respect to the common transfer chamber A plurality of vacuum processing chambers that are connected to each other, and are connected to the common transfer chamber via a gate valve, and are used for transferring the object to be processed. A load chamber configured as a load lock chamber; an unload chamber configured as a load lock chamber connected to the common transfer chamber via a gate valve and for carrying out the object to be processed; It is characterized by comprising a carriage chamber capable of accommodating therein the transport device is connected with respect to the serial common transfer chamber.

  In Japanese Patent Laid-Open No. 2001-081557, the use of a semi-tray facilitates vacuum conveyance and improves the substrate positioning accuracy, and the influence of troubles and maintenance on some processing chambers does not reach other processing chambers. A high availability multi-chamber vacuum processing system and a substrate transfer apparatus are disclosed. The multi-chamber type vacuum processing system is a multi-chamber type vacuum processing system for transferring and processing substrates to be processed one after another to a plurality of processing chambers, and a carriage provided so as to be able to travel, and a substrate on the carriage. A support transport mechanism having a support member that supports the substrate, a common transport chamber in which the support transport mechanism can support and transport the substrate to be processed, and a communication with the common transport chamber via a gate valve. A plurality of vacuum processing chambers for processing the substrate to be processed in a vacuum atmosphere, and a load chamber that is provided to be able to communicate with the common transfer chamber via a gate valve and into which the substrate to be processed is carried And an unloading chamber provided so as to be able to communicate with the common transfer chamber via a gate valve and from which a substrate to be processed is unloaded.

  Japanese Laid-Open Patent Publication No. 2001-118907 discloses a trayless oblique substrate transport apparatus that can uniformly form a film on a large substrate without causing temperature distribution or bias distribution. The trayless oblique substrate transfer apparatus includes a vacuum processing chamber that processes substrates under reduced pressure, a transfer carriage that transfers the substrate to and from the vacuum processing chamber, and a substrate holder that supports the substrate in an inclined manner on the transfer carriage. A mechanism, a double-sided film forming unit provided in the vacuum processing chamber, and a heater cover that is disposed on both sides of the film forming unit and covers the heater heating surface that is movable with respect to the film forming unit. And a heater cover that moves the heater cover in a direction substantially perpendicular to the heater heat generating surface while maintaining a parallel relationship in a plane with the heater heat generating surface, and causes the heater cover to adhere to the substrate. And a moving means.

  Japanese Patent Application Laid-Open No. 2001-127133 discloses a high-throughput cluster type vacuum process that can quickly transfer a substrate to each vacuum processing chamber and can smoothly and quickly shift a transfer carriage from a standby state to a use state. A system is disclosed. The cluster type vacuum processing system is a cluster type vacuum processing system that transports and processes substrates one after another to a plurality of processing chambers, and is disposed around a common transport chamber located in the center and the common transport chamber, Provided to be able to communicate with each other via a gate valve to the common transfer chamber, and provided with a plurality of vacuum processing chambers for processing the substrate in a vacuum atmosphere, and to be able to communicate with the common transfer chamber via a gate valve. A load chamber into which a substrate is loaded, and an unload chamber in which the substrate is unloaded, the unload chamber from which the substrate is unloaded, the vacuum processing chamber, the common transfer chamber, And a load chamber and at least three transport carts for transporting a substrate between the unload chambers.

  Japanese Patent Application Laid-Open No. 2002-167035 discloses a transport carriage for delivering a substrate at a substrate delivery stage outside the vacuum processing chamber and a substrate delivery position inside the vacuum processing chamber for processing under reduced pressure, and on the transport carriage. In a large substrate transfer device equipped with a substrate holding mechanism for holding the substrate in the above, it is easy to maintain the vacuum in the vacuum chamber, the size of the vacuum chamber can be made as compact as possible, and the substrate delivery operation is highly reliable A large-sized substrate transfer apparatus is disclosed in which a substrate transfer mechanism having a small drive source is incorporated in the substrate holding mechanism. The large substrate transfer apparatus includes a transfer carriage for transferring a substrate at a substrate transfer stage outside the vacuum processing chamber and a substrate transfer position in a vacuum processing chamber for processing under reduced pressure, and a substrate on the transfer carriage. In a large substrate transport apparatus having a substrate holding mechanism for holding, at least one pair of engagement gripping means for engaging and gripping both upper and lower ends of the substrate upright at an inclination stable angle, and at least one of the engagement gripping means A link mechanism that moves in a direction to separate and open from both ends of the substrate or a direction to approach and grip both ends of the substrate, a moving means that moves the link mechanism by transmitting a driving force from an external drive means, and the engagement gripping means is a substrate A substrate transfer mechanism including a position holding unit that is held at the engagement position is incorporated in the substrate holding mechanism.

  In Japanese Patent Laid-Open No. 2002-167036, when a substrate is raised or tilted to a stable tilt angle, a load is not concentrated on a portion where the substrate is held by the substrate holding mechanism, and the substrate is raised with a stable operation. A rollable substrate delivery mechanism and method is disclosed. The substrate transfer mechanism is a large substrate transfer apparatus comprising a transfer carriage that transfers a large substrate at a substrate transfer stage outside the vacuum processing chamber, and a substrate holding mechanism that holds the substrate on the transfer carriage. In the substrate transfer mechanism on the substrate transfer stage of the transfer roller, the roller frame at the substrate transfer stage position of the substrate transfer roller separates from other substrate transfer roller parts when the substrate is raised or tilted to the stable tilt angle. It is characterized in that a tiltable substrate delivery mechanism that stands up to a stable tilt angle and delivers the substrate to the substrate holding mechanism of the transport carriage is incorporated in the transport roller.

  Japanese Patent Application Laid-Open No. 2002-170861 discloses a cluster type vacuum processing system in which substrates are successively transferred to a plurality of processing chambers for processing, and two transfer carriages, a turntable, and the transfer carriage laid on the turntable. Two sets of rails, a power transmission mechanism, a rotary table rotation motor, and a transfer carriage advance / retreat motor are provided. The large substrate carriage is rotated in a common transfer chamber maintained in a vacuum, and in a plurality of chambers maintained in a vacuum. Rotating transfer device that advances and retreats, motors are not special specifications, can be fixed stationary, and provides a large substrate transfer carriage rotation transfer device and method common to large substrate transfer carriages with no wiring or operation problems. There has been disclosed a large-sized substrate transfer carriage common transfer chamber rotation transfer device for the purpose of reducing the cost of the manufacturing apparatus and further improving the productivity by improving the operability in manufacturing a large substrate. The large substrate transfer carriage common transfer chamber rotation transfer device is laid on two transfer carriages, a turntable and a turntable in a cluster type vacuum processing system for transferring and processing substrates to a plurality of processing chambers one after another. A plurality of rails, a power transmission mechanism, a rotating table rotating motor, and a conveying cart advance / retreat motor, which are mounted on the conveying cart, rotate in a common conveying chamber kept in a vacuum and are kept in a vacuum. A power transfer mechanism storage portion provided below the turntable, and an input end of the power transmission mechanism stored in the storage portion projects out of the common transfer chamber via a seal portion. It is connected to the motor arranged outside the common transfer chamber, and is configured to rotate the turntable and advance and retreat the transfer carriage.

Japanese Patent No. 2141379 JP 2000-183129 A JP 2001-081557 A JP 2001-118907 A JP 2001-127133 A Japanese Patent Laid-Open No. 2002-167035 JP 2002-167036 A JP 2002-170861 A

The present invention relates to a vacuum processing apparatus such as a plasma CVD apparatus, a dry etching apparatus, or a sputtering apparatus, which performs a process on a substrate or a film-formed substrate under a vacuum or a reduced-pressure atmosphere. Therefore, description will be made by taking a film forming process of a plasma CVD apparatus as an example.
An object of the present invention is to provide a vacuum processing apparatus that includes a larger number of processing chambers for forming a thin film such as a semiconductor film on a larger substrate, and further reduces the size of the installation place.
Another object of the present invention is to provide a vacuum processing apparatus that includes a larger number of processing chambers for forming a semiconductor film on a larger substrate, further reduces the size of the installation space, and reduces distortion in the processing chamber. It is in.
Still another object of the present invention is to provide more processing chambers for depositing a thin film such as a semiconductor film on a larger substrate, to reduce the size of the place where it is installed, and to perform vacuum processing to deposit a film on the substrate faster. To provide an apparatus.
Still another object of the present invention is to provide a larger number of processing chambers for forming a thin film such as a semiconductor film on a larger substrate, further reducing the size of the installation space, and facilitating the expansion of the processing chambers. The object is to provide a vacuum processing apparatus.
Still another object of the present invention is to provide a process chamber extension method for more easily adding a process chamber.

  In the following, means for solving the problems will be described using the reference numerals used in the best modes and embodiments for carrying out the invention in parentheses. This reference numeral is added to clarify the correspondence between the description of the claims and the description of the best mode for carrying out the invention / example, and is described in the claims. It should not be used to interpret the technical scope of the invention.

  The vacuum processing apparatus (1) according to the present invention includes a transfer chamber (2), and a plurality of processing chambers (3) connected to the transfer chamber (2) and supporting the substrate (120) by tilting from the vertical direction and performing vacuum processing. -1 to 3-6) and a substrate transfer device (6) that moves in the transfer chamber (2). The substrate transfer device (6) carries out the substrate (120) from one of the plurality of processing chambers (3-1 to 3-6) while supporting the substrate (120) in an inclined manner to the transfer chamber (2). The substrate (120) is inclined and supported from the transfer chamber (2) in the other processing chamber among the processing chambers (3-1 to 3-6). The plurality of processing chambers (3-1 to 3-6) are separated from the plurality of right processing chambers (3-1 to 3-3) and the transfer chamber (2) by the right processing chambers (3-1 to 3-3). ) And a plurality of left side processing chambers (3-4 to 3-6) respectively disposed on the opposite side. Further, the positional relationship of the right processing chamber (3-1 to 3-3) and the left processing chamber (3-4 to 3-6) associated with the substrate transfer is symmetrical with respect to the transfer chamber (2). It is in. For this reason, the substrate (120) is inclined in the same direction, and the direction of film formation is the same. That is, in the transfer chamber (2), the substrate (120) is inclined from the vertical direction in the same direction, and the right processing chamber (3-1 to 3-3) and the left processing chamber (3-4 to 3-6). Can be carried in and out. For this reason, a mechanism for changing the substrate tilt direction is not required in the substrate transfer device (6), and the substrate transfer device (6) and the transfer chamber (2) can be downsized.

  The vacuum processing apparatus (1) according to the present invention can be installed in a narrower place than when the plurality of processing chambers (3-1 to 3-6) are arranged in a cluster type. This is because, in the cluster structure, when a plurality of processing chambers are provided, it is necessary to enlarge the central transfer chamber so that the peripheral length of the central transfer chamber can be increased. This is because space is generated and the entire apparatus is enlarged.

  The vacuum processing apparatus (1) heats the substrate (120) with a heater during film formation in the processing chamber (3-1 to 3-6) or generates plasma, thereby increasing the temperature of the constituent members. Sometimes. Furthermore, the temperature of the transfer chamber (2) may rise by transferring the substrate (120) whose temperature has been increased by heating. The plurality of processing chambers (3-1 to 3-6) are supported so as to be movable in a direction away from the transfer chamber (2). For this reason, it is preferable that the plurality of processing chambers (3-1 to 3-6) or the transfer chamber (2) are less constrained by heat and less distorted in the processing chamber.

  The first process executed by the first processing chamber among the plurality of right processing chambers (3-1 to 3-3) is a transfer chamber (2 of the plurality of left processing chambers (3-4 to 3-6)). ) Is executed immediately after the second process executed by the second processing chamber facing the first processing chamber. When the vacuum processing apparatus (1) performs the second process and the first process on the substrate (120), the substrate transfer apparatus (6) needs to move in the longitudinal direction (x) of the transfer chamber (2). In addition, since the substrate (120) is carried out or carried into the left processing chamber (3-4 to 3-6) and the right processing chamber (3-1 to 3-3), the substrate (120) can be processed quickly. it can.

  The vacuum processing apparatus (1) according to the present invention is connected to the transfer chamber (2) and connected to the transfer chamber (2) and the load chamber (4) for carrying the substrate (120) from the outside into the transfer chamber (2). And an unload chamber (5) for carrying the substrate (120) out of the transfer chamber (2). The load chamber (4) and the unload chamber (5) are configured as a load lock chamber. The load chamber (4) is disposed opposite the unload chamber (5) with the transfer chamber (2) therebetween. At this time, in the factory where the vacuum processing apparatus (1) is installed, the position of the substrate (120) at the time of carrying in and out of the vacuum processing chamber (1) can be moved linearly, The degree of freedom in device layout is increased, which is preferable.

  The transfer chamber (2) and the plurality of processing chambers (3-1 to 3-6) include a plurality of units (26-1 to 26-3) having the same structure so that they can be replaced. The transfer chamber (2) is formed from a plurality of processing chamber portions (22-1 to 22-3), and each of the plurality of units (26-1 to 26-3) includes a plurality of processing chamber portions (22-1). To 22-3), a processing chamber connected to one of the plurality of right processing chambers (3-1 to 3-3), and a plurality of left processing chambers (3-4). ~ 3-6) are formed from a processing chamber connected to one of the portions and a ground supporting them. Many such units (26-1 to 26-3) can be produced under the same specifications, and can be produced at a lower cost.

  The process chamber extension method according to the present invention is a method of adding a process chamber to the vacuum processing apparatus (1) according to the present invention, the step of manufacturing an extension unit having the same structure as the unit, and the extension unit in the vacuum processing apparatus (1). And adding a step. According to such a processing chamber extension method, the vacuum processing apparatus (1) can easily increase the number of processing chambers, and can cope with an increase in the film forming layer and an improvement in the film forming processing capability. preferable.

  The vacuum processing apparatus (1) is connected to the transfer chamber (2) to load the substrate (120) into the transfer chamber (2) from the outside, and connected to the transfer chamber (2) to the substrate ( 120) is further provided with an unload chamber (5) for carrying it out of the transfer chamber (2). The load chamber (4) is disposed opposite the unload chamber (5) with the transfer chamber (2) therebetween. At this time, the expansion processing chambers included in the expansion unit are the expansion of the processing chambers that are expanded from the load chamber (4) and the unload chamber (5) to a part away from the plurality of units (26-1 to 26-3). Method. According to such a processing chamber expansion method, the existing processing chamber does not need to be disassembled, moved, or reassembled when the processing chamber is expanded, and the vacuum processing apparatus (1) can easily install the processing chamber. It can be expanded and is preferable.

  The vacuum processing apparatus according to the present invention includes more processing chambers for forming a thin film such as a semiconductor film on a larger substrate, and can further reduce the size of a place where the apparatus is installed. The processing chamber extension method according to the present invention can increase the processing chamber more easily.

An embodiment of a vacuum processing apparatus according to the present invention will be described with reference to the drawings. As shown in FIG. 1, the vacuum processing apparatus 1 includes a transfer chamber 2, a plurality of processing chambers 3-1 to 3-6, a load chamber 4, and an unload chamber 5. The load chamber 4 and the unload chamber 5 are configured as load lock chambers. The transfer chamber 2 is a container that seals the interior from the environment, and is formed so that the interior is elongated in the x direction, which is parallel to the horizontal direction. Each of the processing chambers 3-1 to 3-6 is a container that seals the inside from the environment. Each of the processing chambers 3-1 to 3-6, when performing film formation, decomposes a material gas such as SiH ₄ in a radial manner using plasma, and deposits a thin film such as a semiconductor on a substrate supported inside. Form a film.

  The processing chamber 3-1 is disposed on the opposite side of the processing chamber 3-4 with the transfer chamber 2 therebetween. The processing chamber 3-2 is disposed on the opposite side of the processing chamber 3-5 with the transfer chamber 2 therebetween. The processing chamber 3-3 is arranged on the opposite side of the processing chamber 3-6 with the transfer chamber 2 interposed therebetween. Each processing chamber 3-i (i = 1, 2, 3,..., 6) supports the substrate by tilting it in the same direction from the vertical direction. That is, since the contact positional relationship associated with the substrate transport between the right processing chambers 3-1 to 3-3 and the left processing chamber 3-4 to 3-6 is a plane-symmetrical relationship with respect to the transport chamber 2, Processing can be performed by carrying in and out of the right processing chambers 3-1 to 3-3 and the left processing chambers 3-4 to 3-6 with the inclination from the vertical in the same direction. The processing chamber 3-i may be used for vacuum processing other than film formation. For example, a substrate or a film-formed substrate is formed in a vacuum or reduced pressure atmosphere exemplified by sputtering, dry etching, and heat treatment. It does not matter if it is something to be processed.

  The plurality of processing chambers 3-1 to 3-6, the transfer chamber 2, the load chamber 4, and the unload chamber 5 are preferably formed of a stainless steel material from the viewpoint of satisfying corrosion resistance and member strength. Further, it is preferable that the processing chambers 3-1 to 3-6 are formed of a stainless steel material (for example, SUS304) that is a nonmagnetic or weakly magnetic material in that plasma generation is not hindered. The plurality of processing chambers 3-1 to 3-6, the transfer chamber 2, the load chamber 4, and the unload chamber 5 may be made of other materials (for example, an aluminum alloy or a surface by plating treatment depending on the processing content in the vacuum atmosphere and design considerations. Iron-based materials) can also be used.

  Each processing chamber 3-i (i = 1, 2, 3,..., 6) includes a gate valve 7-i. The gate valve 7-i is interposed between the transfer chamber 2 and the processing chamber 3-i, and closes or opens a gate connecting the inside of the transfer chamber 2 and the inside of the processing chamber 3-i. . The transfer chamber 2 is maintained in a vacuum atmosphere, and the gate valve 7-i is provided with an interlock control. The interlock control is performed so that the gate valve 7-i is opened only when the inside of each processing chamber 3-i is in a vacuum atmosphere, and contamination between processing chambers via the transfer chamber 2 is controlled. Is suppressed. Further, the processing chamber 3-1 is configured in the same manner as the processing chambers 3-2 and 3-3 in terms of the dimensions of the transfer chamber 2 and the gate valve 7-i and the various reference dimensions related to substrate transfer. The processing chamber 3-4 is configured in the same manner as the processing chambers 3-5 and 3-6 in the contact dimensions of the transfer chamber 2 and the gate valve 7-i and various reference dimensions related to substrate transfer. It is configured with plane symmetry.

  The load chamber 4 is a container that seals the inside from the environment, and includes a gate valve 11, a loader atmosphere side insertion device 12, and a gate valve 13. The gate valve 11 is interposed between the transfer chamber 2 and the load chamber 4, and closes or opens the transfer chamber 2 and the load chamber 4. The gate valve 11 is provided with interlock control. The interlock control controls the gate valve 11 to be opened only when the load chamber 4 is in a vacuum atmosphere, and suppresses the contamination of the vent gas in the load chamber 4 via the transfer chamber 2. . The gate valve 13 is interposed between the atmospheric pressure environment and the load chamber 4. The gate valve 13 is opened when the inside of the load chamber 4 is in an atmospheric pressure environment, and is closed when the inside of the load chamber 4 is in a vacuum atmosphere.

  As shown in FIG. 2, the loader atmosphere-side insertion device 12 includes a lifting mechanism 18-1 and a substrate transport mechanism 18-2. The lifting mechanism 18-1 is installed exclusively at the entrance of the load chamber 4, and lifts the substrate in the horizontal position to the inclined position. Such a lifting mechanism 18-1 is described in detail in Japanese Patent Application Laid-Open No. 2002-167036. The substrate transport mechanism 18-2 is installed exclusively at the entrance of the load chamber 4 and moves the substrate in the inclined position in the y direction. The substrate transport mechanism 18-2 has a structure similar to that of the B frame 33 and the C frame 34 in the substrate transport apparatus 6 described later, and moves the substrate in the y direction to carry it into the load chamber 4. In other words, the loader atmosphere side insertion device 12 uses the lifting mechanism 18-1 to lift the substrate in the horizontal position to the inclined position in parallel with performing the original processing work of the load chamber 4, and transports the substrate to the substrate. When the gate valve 13 opens the atmospheric pressure environment and the inside of the load chamber 4 while being transferred to the mechanism 18-2, the substrate transport mechanism 18-2 allows the substrate at the inclined position to be large. It is carried into the load chamber 4 from the atmospheric pressure environment.

  The unload chamber 5 is a container that seals the inside from the environment, and includes a gate valve 15, an unloader atmosphere side take-out device 16, and a gate valve 17 as shown in FIG. 1. The gate valve 15 is interposed between the transfer chamber 2 and the unload chamber 5 and closes or opens the transfer chamber 2 and the unload chamber 5. The gate valve 15 is provided with interlock control. The interlock control is performed so that the gate valve 15 is opened only when the unload chamber 5 is in a vacuum atmosphere, and contamination of the vent gas in the unload chamber 5 via the transfer chamber 2 is suppressed. ing. The gate valve 17 is interposed between the atmospheric pressure environment and the unload chamber 5. The gate valve 17 is opened when the inside of the unload chamber 5 is in an atmospheric pressure environment, and is closed when the inside of the unload chamber 5 is in a vacuum atmosphere.

  As shown in FIG. 2, the unloader atmosphere-side extraction device 16 includes a substrate transport mechanism 19-1 and a lifting mechanism 19-2. The substrate transport mechanism 19-1 is installed exclusively at the exit of the unload chamber 5, and moves the substrate in the inclined position in the y direction. The substrate transport mechanism 19-1 has a structure similar to that of the B frame 33 and the C frame 34 in the substrate transport apparatus 6 described later, and moves the substrate in the y direction to carry it out of the unload chamber 5. The lifting mechanism 19-2 is installed exclusively at the outlet of the unload chamber 5, and lowers the substrate in the inclined position to the horizontal position. That is, the unloader atmosphere side take-out device 16 performs an operation reverse to that of the loader atmosphere side insertion device 12, and when the gate valve 17 opens the atmospheric pressure environment and the inside of the unload chamber 5, the substrate transfer mechanism 19. The substrate is carried out from the inside of the unload chamber 5 to the atmospheric pressure environment by -1, and the gate valve 17 is closed. In parallel with the unload chamber 5 performing its own processing operation, the unloader atmosphere side take-out device 16 returns the substrate in the inclined position to the horizontal position using the lifting mechanism 19-2.

  The transfer chamber 2 includes a substrate transfer device 6 therein. The substrate transfer device 6 can move parallel to the x direction. The substrate transfer device 6 further transfers the substrate from the processing chamber 3-i to the transfer chamber when the gate valve 7-i opens the gate connecting the inside of the processing chamber 3-i and the inside of the transfer chamber 2. 2 to carry out the substrate from the transfer chamber 2 to the processing chamber 3-i. The substrate transfer device 6 unloads the substrate from the load chamber 4 to the transfer chamber 2 when the gate valve 11 opens the gate connecting the inside of the load chamber 4 and the inside of the transfer chamber 2. The substrate transfer device 6 further carries the substrate into the unload chamber 5 from the transfer chamber 2 when the gate valve 15 opens the gate connecting the inside of the unload chamber 5 and the inside of the transfer chamber 2. .

  In a factory, it is desired to move a product on a straight line in order to increase the degree of freedom of layout of each device and simplify transfer and transfer between devices. In the vacuum processing apparatus, the load chamber 4 and the unload chamber 5 are opposed to each other with the transfer chamber 2 therebetween. The substrate can be moved linearly by arranging the load chamber 4 and the unload chamber 5 in a straight line, which is preferable.

  As shown in FIG. 2, the vacuum processing apparatus 1 further includes rails 21-1 to 21-6. The rails 21-1 to 21-6 are arranged on the ground supporting the vacuum processing apparatus 1 so as to be parallel to the horizontal direction and perpendicular to the x direction, that is, to be parallel to the y direction. It is placed on the ground. Each rail 21-i supports the processing chamber 3-i on its ground so that the processing chamber 3-i can move in the y direction. In the processing chamber 3-i, the temperature of the entire processing chamber is easily increased by heating the substrate or generating plasma during the film forming process. The transfer chamber 2 is heated by transferring the heated substrate. At this time, the processing chamber 3-i and the transfer chamber 2 are different from each other in temperature increase rate and settling temperature. The vacuum processing apparatus 1 is configured such that the processing chamber 3-i is deformed when the transfer chamber 2 or the processing chamber 3-i is thermally expanded by being supported so as to be movable in the y direction. This can be reduced, which is preferable.

  The transfer chamber 2 is formed of a plurality of processing chamber portions 22-1 to 22-3, a load chamber portion 24, and a lid 25. The plurality of processing chamber portions 22-1 to 22-3, the load chamber portion 24, and the lid 25 are formed. And can be divided into The processing chamber portion 22-1 is formed in the same joint structure as the processing chamber portions 22-2 and 22-3. The processing chamber portion 22-1 is a portion connected to the processing chamber 3-1 and the processing chamber 3-4 in the transfer chamber 2. The processing chamber portion 22-2 is a portion of the transfer chamber 2 that is connected to the processing chamber 3-2 and the processing chamber 3-5. The processing chamber portion 22-3 is a portion of the transfer chamber 2 that is connected to the processing chamber 3-3 and the processing chamber 3-6. The load chamber portion 24 is a portion connected to the load chamber 4 and the unload chamber 5 in the transfer chamber 2.

  The lid 25 hermetically closes one end of a cylindrical processing chamber portion 22-1 having a rectangular cross section and can be removed. The other end of the processing chamber portion 22-1 is connected to one end of the processing chamber portion 22-2. The other end of the processing chamber portion 22-2 is connected to one end of the processing chamber portion 22-3. The other end of the processing chamber portion 22-3 is connected to the load chamber portion 24.

  The vacuum processing apparatus 1 can be divided into a plurality of units 26-1 to 26-3. That is, the unit 26-1 is formed of the processing chamber portion 22-1, the processing chamber 3-1, the rail 21-1, the processing chamber 3-4, the rail 21-4, and the ground supporting the same. The unit 26-2 is formed of a processing chamber portion 22-2, a processing chamber 3-2, a rail 21-2, a processing chamber 3-5, a rail 21-5, and a ground supporting the same. The unit 26-3 is formed of a processing chamber portion 22-3, a processing chamber 3-3, a rail 21-3, a processing chamber 3-6, a rail 21-6, and a ground supporting the same. That is, the plurality of units 26-1 to 26-3 have the same reference dimensions and structures that are mutually connected, and can be replaced. For example, unit 26-1 can be replaced with unit 26-2 or unit 26-3. Such units 26-1 to 26-3 have many common members under the same design specifications, can be mass-produced, and can be produced at a lower cost.

  When a cluster type vacuum processing apparatus is equipped with more processing chambers, it is necessary to increase the peripheral length of the central transfer chamber to ensure a connection with the processing chamber, and the area occupied by the central transfer chamber is extremely large. It is necessary to increase the useless space unnecessary for transporting the substrate and increase the occupied floor area of the entire apparatus. On the other hand, such a vacuum processing apparatus 1 can be provided with many processing chambers by extending the installation location in the x direction and increasing the number of units 26-1 to 26-3. Such a vacuum processing apparatus 1 can be installed in a narrower place when the processing chambers are arranged in a cluster type when more processing chambers are provided.

  As shown in FIG. 3, the substrate transfer device 6 is formed of a slide base 31, an A frame 32, a B frame 33, and a C frame 34. The substrate transfer device 6 is preferable in that the stainless steel material satisfies the corrosion resistance and the member strength, and the thermal expansion coefficient is not great. As the stainless steel material, SUS304 is exemplified. The substrate transport device 6 can be made of other materials due to design considerations. Examples of other materials include aluminum alloys and iron-based materials whose surfaces are plated. The A frame 32, the B frame 33, and the C frame 34 are support structures that allow each frame to pass through each other so that the substrate can be carried into and out of the processing chambers 3-i on the right and left sides in the y direction. . The transfer chamber 2 includes rails 36-1 to 36-2 and a central rail 39 on the bottom surface. The rails 36-1 to 36-2 and the central rail 39 are arranged on the bottom surface so as to be parallel to the x direction, and can be divided by the processing portions 22-1, 22-2, and 22-3. It is like that.

  As shown in FIG. 4, the slide base 31 is formed of a frame in which four rod-shaped members are assembled in a rectangular shape. The rod-shaped member is formed of a member 31-1, a member 31-2, a member 31-3, and a member 31-4. The member 31-1 and the member 31-2 are disposed so as to be parallel to the x direction. The member 31-3 and the member 31-4 are formed in a rail shape and are arranged so as to be parallel to the y direction. The slide base 31 includes sliders 35-1 to 35-2. The slider 35-1 is joined to the member 31-3 and the member 31-4 of the slide base 31 in the same body, and can move in the x direction along the rail 36-1. The slider 35-2 is joined to the member 31-3 and the member 31-4 of the slide base 31 in the same body, and can move in the x direction along the rail 36-2. That is, the slide base 31 is supported on the bottom surface of the transfer chamber 2 by the sliders 35-1 to 35-2 so as to be slidable in parallel with the x direction along the rails 36-1 to 36-2.

  The transfer chamber 2 includes a rotary drive motor 131, a bearing 132 with a magnetic fluid seal, and a pinion 133 on the bottom surface. The slide base 31 has a rack 134 attached to the lower part of the slide 31 and joined to the member 31-3 and the member 31-4. The rotational drive motor 131 is fixedly disposed outside the transfer chamber 2 and converts electric power into rotational power. The bearing 132 with a magnetic fluid seal is disposed on the bottom surface of the transfer chamber 2 and transmits the rotational power generated by the rotation drive motor 131 to the pinion 133 while maintaining the inside of the transfer chamber 2 in a vacuum. The pinion 133 meshes with the rack 134 and rotates to move the rack 133 in the x direction. In other words, the slide base 31 is movable in the x direction when the pinion is rotated by the rotation drive motor 50. A plurality of rotation drive motors 131, bearings 132 with magnetic fluid seals, and pinions 133 are installed in the transfer chamber 2 and arranged for each length of the rack 134 on a straight line parallel to the x direction.

  As shown in FIG. 5, the A frame 32 is formed by assembling a plurality of rod-shaped members. The rod-shaped member is formed of members 32-1 to 32-12. The members 32-1 to 32-4 are formed in a rectangular shape at the lower end of the A frame 32, and are arranged so as to be parallel to the horizontal direction. The members 32-5 to 32-8 are formed in a rectangular shape at the upper end of the A frame 32, and are arranged so as to be parallel to the horizontal direction. The members 32-9 to 32-10 are disposed between the upper end frame and the lower end frame of the A frame 32, and are disposed so as to be parallel to the vertical direction. As shown in FIG. 6, the members 32-11 to 32-12 are arranged between the upper end frame and the lower end frame of the A frame 32 and are arranged so as to be parallel to the vertical direction. . The z direction is perpendicular to the y direction, and the angle between the z direction and the vertical direction is 10 degrees. That is, the angle formed by the plane formed by the members 32-11 to 13-12 of the A frame 32 and the vertical direction is 10 degrees. The lengths of the members 32-1 and 32-2 are longer than the lengths of the members 32-5 and 32-7.

  The angle formed between the z direction and the vertical direction can be replaced with an angle different from 10 degrees, for example, an angle included in a range of 7 degrees to 12 degrees. The inclination angle of 10 degrees is the same as or close to the angle at which the substrate is inclined to support and transport. As in JP-A-2002-167035, the upper and lower portions of the substrate are supported by utilizing the weight of the substrate, so that the substrate can be stably transported without being excessively constrained. If the angle is less than 7 degrees, the stability due to the substrate weight is poor, and if it exceeds 12 degrees, the device installation area increases due to an increase in dead space due to the substrate tilt, which is not preferable.

  As shown in FIG. 5, the A frame 32 includes a slider 37 and a slider 38. The slider 37 is joined to the members 32-1 to 32-4 of the A frame 32 in the same body, and can move in the y direction along the slide base 31. That is, the A frame 32 is supported by the slide base 31 by the slider 37 so as to be movable in parallel to the y direction. The slider 38 is fixed to the A frame 32 and is formed of two rollers that sandwich the central rail 39. The slider 38 can move in the x direction along the central rail 39. That is, the A frame 32 is supported by the central rail 39 by the slider 38 so as to be movable in parallel with the x direction.

  As shown in FIG. 7, the B frame 33 is formed of a frame in which four rod-shaped members are assembled in a rectangular shape, and the plane formed by the frame is parallel to the z direction and the y direction. Is arranged. The rod-shaped member is formed from members 33-1 to 33-4. The members 33-1 to 33-2 are arranged in parallel to the y direction. The members 33-3 to 33-4 are disposed between the members 33-1 to 33-2 and are disposed in parallel to the z direction.

  The A frame 32 further includes support members 41-1 to 41-2 as shown in FIG. The support member 41-1 is joined to the members 32-11 and 32-12 of the A frame 32 in the same body, and supports the member 33-1 of the B frame 33 so that it can move in the y direction. .

  As shown in FIG. 8, the support member 41-2 is supported by the members 32-11 and 32-12 of the A frame 32 so as to be movable in the z direction, and the B frame 33 The member 33-2 is supported so as to be movable in the y direction. In other words, the B frame 33 is supported by the A frame 32 so as to be movable in parallel with the y direction by the support members 41-1 to 41-2. Further, the support member 41-2 can absorb the mechanical error of the B frame 33, and when the support member temperature rises due to the heat flux from the heated substrate, the B frame 33 is moved in the z direction. It is possible to absorb deformation due to thermal expansion. That is, the support member 41-2 can reduce the deformation of the B frame 33 into a shape different from the rectangular shape, suppress the positional variation at the lower position of the substrate serving as a reference when the substrate is delivered, and the A frame 32, B Stable substrate transfer is possible without generating sticks during each operation of the gantry 33 and the C gantry 34.

  As shown in FIG. 3, the C mount 34 is formed of a frame in which rod-shaped members are assembled in a rectangular shape, and is arranged so that the plane formed by the frame is parallel to the z direction and the y direction. Has been. The B frame 33 includes a slider 44, a support member 45, and sliders 46-1, 46-2. The slider 44 can move in the y direction along the member 33-1 of the B frame 33. The support member 45 is joined to the slider 44 in the same body, and joined to the center of the lower end frame of the C frame 34. The slider 46-1 can move in the y direction along the member 33-2 of the B frame 33, and is joined to the upper end frame of the C frame 34 in the same body. The slider 46-2 can move in the y direction along the member 33-2 of the B frame 33, and is joined to the upper end frame of the C frame 34 in the same body. That is, the C frame 34 is supported by the B frame 33 so as to be movable in parallel to the y direction by the slider 44, the support member 45, and the sliders 46-1 and 46-2. Further, the position at which the slider 46-1 on the upper frame of the C mount 34 is joined and the position at which the slider 46-2 is joined are symmetrical with respect to the center of the lower frame of the C mount 34.

  FIG. 9 shows the slider 44, the support member 45, and the sliders 46-1 and 46-2. The slider 46-1 includes a spring. The spring is elastically deformed so that the contact point at which the slider 46-1 contacts the C mount 34 moves relative to the B mount 33 in parallel to the normal line of the plane formed by the C mount 34. The slider 46-2 includes a spring. The spring is elastically deformed so that the contact point at which the slider 46-2 contacts the C mount 34 moves relative to the B mount 33 in parallel to the normal line of the plane formed by the C mount 34. At this time, the C frame 34 can slightly rotate about the rotation shaft 72 that passes through the slider 44 and is parallel to the y direction. Further, the support member 45 supports the support member 45 so that the C mount 34 rotates around a rotation shaft 71 that is parallel to the z direction through a contact point that contacts the C mount 34. Pin supported by contact. Note that the support member 45 is replaced with another member that elastically deforms so that the C mount 34 rotates about a rotation shaft 71 that passes through the contact point where the support member 45 contacts the C mount 34 and is parallel to the z direction. You can also. At this time, the direction of the normal line of the plane formed by the C mount 34 is changed by a predetermined range, and the A mount 32 or the B mount 33 is slightly deformed due to thermal deformation accompanying the temperature distribution. However, it can be along a predetermined plane, which is preferable.

  FIG. 10 shows the center rail 39 and shows the driving of the A frame 32 in the y direction and its guide mechanism. The center rail 39 is formed by a moving rail 51 and a fixed rail 52. The moving rail 51 is slightly longer than the width of the slider 38 in the x direction, and is arranged at the position of the gate valves 7-1 to 7-6 in the x direction, and is movable in the y direction with respect to the bottom surface of the transfer chamber 2. It is supported by. The fixed rail 52 is a portion of the central rail 39 excluding the moving rail 51, and is fixed to the bottom surface of the transfer chamber 2.

  The central rail 39 further includes a ball screw 53, a driving device 54, and a slider 55. The ball screw 53 is disposed on the bottom surface of the transfer chamber 2 so that helically formed teeth are formed on the surface and are parallel to the y direction. The ball screw 53 is further supported on the bottom surface of the transfer chamber 2 so as to be rotatable about an axis parallel to the y direction. The driving device 54 is a motor that is installed outside the transfer chamber 2 and converts supplied electric power into rotational movement. The drive device 54 introduces rotation from the outside of the transfer chamber 2 while holding a vacuum, for example, by a bearing with a magnetic fluid seal. The ball screw 53 is rotated. The slider 55 is joined to the moving rail 51 in the same body, and meshes with teeth formed on the ball screw 53. The ball screw 53 and the slider 55 form a mechanism for converting the rotational movement of the ball screw 53 into the parallel movement of the slider 55. That is, the moving rail 51 moves parallel to the y direction when the ball screw 53 is rotated by the driving device 54.

  The transfer chamber 2 further includes a guide 58 and a guide 59. The guide 58 and the guide 59 are disposed on the bottom surface of the transfer chamber 2 so as to be parallel to the y direction along the path along which the moving rail 51 moves. At this time, the guide 58 and the guide 59 are arranged so as not to prevent the slider 38 from moving in the x direction along the central rail 39 when the moving rail 51 is arranged on the extension line of the fixed rail 52. It is arranged in a range excluding the periphery of the rail 39. As shown in FIG. 11, the guide 58 and the guide 59 are disposed so as to sandwich the slider 38 from both sides in the x direction. That is, the slider 38 is prevented from moving in the x direction when the slider 38 attached to the A frame 32 of the substrate transfer device 6 is not arranged on the extension line of the fixed rail 52. Thereby, it becomes a mechanical stopper function with respect to the x direction of the substrate transport mechanism 6 during the substrate delivery operation, and the reliability is improved.

  FIG. 12 shows a mechanism for driving the B mount 33 in the y direction with respect to the A mount 32. The A frame 32 includes a rotating member 63. The rotating member 63 is supported by the A frame 32 so as to be rotatable about a rotating shaft 62 parallel to the z direction. The rotating member 63 is formed with a pinion 64 and a pinion 65. The B frame 33 has a rack 61 formed at the lower end frame. A rack 67 is formed on the slide base 31. The rack 67 is engaged with the pinion 65. The rack 61 is engaged with the pinion 64. For this reason, the rotation member 63 rotates when the A frame 32 moves in the y direction with respect to the slide base 31, and the B frame 33 moves in the y direction with respect to the A frame 32 when the rotation member 63 rotates.

  As shown in FIG. 3, the substrate transfer device 6 further includes pulleys 47-1 and 47-2 and belts 48-1 and 48-2. The pulley 47-1 has a rotation shaft fixed to the left end frame of the B frame 33. The pulley 47-2 has a rotation shaft fixed to the right end frame of the B frame 33. The belt 48-1 is put on a pulley 47-1, one end is joined to the A frame 32, and the other end is joined to the C frame 34. The belt 48-2 is put on the pulley 47-2, one end is joined to the A frame 32, and the other end is joined to the C frame 34. When the B frame 33 moves with respect to the A frame 32 by a movement amount in the y direction, the C frame 34 moves in the y direction with respect to the B frame 33. In other words, the C frame 34 moves by an amount twice as much as the B frame 33 moves relative to the A frame 32, and is three times the movement amount of the A frame 32 relative to the processing chamber 3-i. To move. According to such an operation, the substrate moving speed can be improved, the tact time is shortened, and the processing capability is improved. Further, since the amount of movement of the slide base 31 in the y direction is smaller than that of the C frame 34, the vibration of the substrate transfer device 6 is small, the impact applied to the glass substrate can be reduced, and breakage of the glass substrate can be suppressed. Further, since the amount of movement of the C frame 34 is three times the amount of movement of the A frame 32, the substrate transfer device 6 can be downsized and the transfer chamber 2 can be downsized.

  FIG. 13 shows the C frame 34. The C frame 34 includes levers 81-1 to 81-2, shafts 82-1 to 82-2, movable claws 83-1 to 83-4, and movable claws 84-1 to 84-4. The lever 81-1 is supported by the upper end frame of the C frame 34. The shaft 82-1 is disposed in the vicinity of the upper end frame of the C frame 34 so as to be parallel to the y direction, and is rotatably supported by the upper frame of the C frame. The movable claw 83-1 is formed with a groove sandwiching the glass substrate and is arranged on the upper left of the C frame 34. The movable claw 83-1 is supported by the left end frame of the C frame 34 so that it can move in parallel with the z direction. The movable claw 84-1 is formed with a groove sandwiching the glass substrate, and is disposed on the upper left of the C frame 34. The movable claw 84-1 is supported by the left end frame of the C frame 34 so that it can move in parallel to the y direction. The movable claw 83-2 is formed with a groove sandwiching the glass substrate, and is arranged on the upper right of the C frame 34. The movable claw 83-2 is supported by the right end frame of the C frame 34 so that it can move in parallel with the z direction. The movable claw 84-2 has a groove that sandwiches the glass substrate, and is arranged at the upper right of the C frame 34. The movable claw 84-2 is supported by the right end frame of the C frame 34 so that it can move in parallel to the y direction. The four corners of the glass substrate are movable claws 83-1, 83-2, 83-3, 83-4 in the vertical direction, and the movable claws 84-1, 84-2, 84-3, 84-4 in the horizontal direction. Since it is supported, there is little shaking during conveyance of the glass substrate, and the impact applied to the glass substrate can be reduced and damage to the glass substrate can be suppressed, which is preferable.

  The lever 81-2 is supported by the frame at the lower end of the C frame 34. The shaft 82-2 is arranged in the vicinity of the lower frame of the C frame 34 so as to be parallel to the y direction, and is rotatably supported by the lower frame of the C frame. The movable claw 83-3 has a groove that sandwiches the glass substrate, and is disposed at the lower left of the C frame 34. The movable claw 83-3 is supported by the left end frame of the C frame 34 so that it can move in parallel with the z direction. The movable claw 84-3 is formed with a groove sandwiching the glass substrate, and is arranged at the lower left of the C frame 34. The movable claw 84-3 is supported by the left end frame of the C frame 34 so that it can move in parallel to the y direction. The movable claw 83-4 is formed with a groove sandwiching the glass substrate, and is arranged at the lower right of the C frame 34. The movable claw 83-4 is supported by the right end frame of the C frame 34 so that it can move in parallel with the z direction. The movable claw 84-4 is formed with a groove sandwiching the glass substrate, and is arranged at the lower right of the C frame 34. The movable claw 84-4 is supported by the right end frame of the C frame 34 so that it can move in parallel to the y direction.

  The lever 81-2 is connected to the shaft 82-2 as shown in FIG. At this time, the shaft 82-2 rotates when the lever 81-2 is pushed inward of the C frame 34. The shaft 82-2 is connected to the movable claw 83-4 and the movable claw 84-4 via the link mechanism 86. The link mechanism 86 includes pinions 141 and 142 and racks 143, 144 and 145. The pinion 141 is joined to the shaft 82-2 in the same body, and rotates together with the shaft 82-2. The rack 143 is joined to the movable claw 83-4 in the same body, and meshes with the pinion 141. When the pinion 141 rotates, the rack 143 translates in the z direction and translates the movable claw 83-4 in the z direction. The rack 144 is joined to the rack 143 in the same body, and moves in parallel with the rack 143. The pinion 142 meshes with the rack 144 and rotates when the rack 144 moves in parallel. The rack 145 is joined to the movable claw 84-4 in the same body and meshes with the pinion 142. When the pinion 142 rotates, the rack 145 translates in the z direction to translate the movable claw 84-4 in the y direction.

  At this time, the link mechanism 86 converts the rotational movement of the shaft 82-2 into the parallel movement in the z direction of the movable claw 83-4, and converts it into the parallel movement in the y direction of the movable claw 84-4. That is, when the lever 81-2 is pushed inward of the C frame 34, the shaft 82-2 rotates in the direction of the arrow in the figure (inner direction of the C frame 34), and the movable claw 83-4 is moved to the pinion. The rotation of 141 is converted into the straight movement of the rack 143 in the z direction and moves in parallel to the z direction to the outside of the C frame 34 (downward in FIG. 14), and the movable claw 84-4 is moved to the movable claw 83-4. Is moved to the linear movement of the rack 145 in the y direction, which is perpendicular to the z direction, via the pinion 142, and moves to the outside of the C frame 34 (in the right direction in FIG. 14) parallel to the y direction.

  The lever 81-2 also moves the movable claws 83-3 and 84-3 provided in opposite directions not shown in FIG. That is, the rotation operation in the inner direction of the shaft 82-2 is performed in the same manner as the movable claw 83-4 and the movable claw 84-4 via the link mechanism 86 combining the pinion and the rack, and the movable claw 83-3 and the movable claw. 84-3. That is, when the lever 81-2 is pushed inward of the C frame 34, the movable claw 83-3 moves to the outside of the C frame 34 in parallel to the z direction, and the movable claw 84-3 is parallel to the y direction. To the outside of the C frame 34.

  The lever 81-1 is connected to the movable claws 83-1, 83-2 and the movable claws 83-1, 83-2 in the same manner as the lever 81-2. That is, when the lever 81-1 is pushed inward of the C frame 34, the movable claw 83-1 moves to the outside of the C frame 34 parallel to the z direction, and the movable claw 84-1 is parallel to the y direction. The movable claw 83-2 moves to the outside of the C frame 34 in parallel to the z direction, and the movable claw 84-2 moves to the outside of the C frame 34 in parallel to the y direction. To do.

  The link mechanism 86 further includes return mechanism springs 87-1 to 87-4. As shown in FIG. 14, the return mechanism spring 87-4 has one end joined to the C frame 34 and the other end joined to the movable claw 83-4. The return mechanism spring 87-4 gives an elastic force to the movable claw 83-4 so that the movable claw 83-4 moves in the closing direction. Similar to the return mechanism spring 87-4, the return mechanism spring 87-1 gives an elastic force to the movable claw 83-1, so that the movable claw 83-1 moves in the closing direction. Similar to the return mechanism spring 87-4, the return mechanism spring 87-2 gives an elastic force to the movable claw 83-2 so that the movable claw 83-2 moves in the closing direction. Similarly to the return mechanism spring 87-4, the return mechanism spring 87-3 gives an elastic force to the movable claw 83-3 so that the movable claw 83-3 moves in the closing direction.

  When the lever 81-2 is stopped from being pushed inwardly of the C frame 34, the return mechanism springs 87-3 and 87-4 attached to the movable claws 83-3 and 83-4 cause the movable claws 83-3 and 83-4 moves in the closing direction to hold the glass substrate. When the lever 81-1 is stopped from being pushed inward of the C frame 34, the movable claws 83-1, 87-2 are moved by the return mechanism springs 87-1 and 87-2 attached to the movable claws 83-1 and 83-2. 83-2 moves in the closing direction to hold the glass substrate.

  At this time, the board | substrate conveyance apparatus 6 is lighter and preferable than when it is formed using a plate-shaped member. Furthermore, the board | substrate conveyance apparatus 6 can reduce the gas to adsorb | suck compared with the case where it forms from a plate-shaped member, and is preferable. Furthermore, according to the substrate transfer device 6, by supporting the upper, lower, left and right four corners of the substrate in surface contact, the number of members close to the periphery of the substrate is limited to the minimum, and the heat transfer rate from the substrate surface to the surroundings is reduced. This is preferable because the difference in temperature is small, and the substrate is less likely to have temperature unevenness, and substrate deformation, substrate damage, and uniform substrate temperature distribution in the next processing step can be achieved.

  FIG. 15 shows the processing chamber 3-i. The processing chamber 3-i includes a casing 101, a substrate table 102, an electrode 103, and a deposition preventing plate 104. The casing 101 forms a cavity inside. The substrate table 102, the electrode 103, and the deposition preventing plate 104 are disposed inside the casing 101. The substrate table 102 is formed in a rectangular plate shape. The deposition preventing plate 104 is formed in a vessel shape, and the concave surface faces the substrate table 102. The electrode 103 is a ladder-type electrode in which a plurality of rod-shaped electrodes are combined so that a material gas can be ejected from the inside. It is disposed between the substrate table 102 and the deposition preventing plate 104. The electrode 103 is further electrically insulated from the deposition preventing plate 104 and joined and fixed to the casing 101 in the same body. The processing chamber 3-i further includes a substrate table moving mechanism, a clamp mechanism, and a substrate transport apparatus operating mechanism.

  The substrate table moving mechanism includes four bars 105, a coupling tool 106, and a driving device 107. One end of each of the four bars 105 is joined to the four corners of the substrate table 102. Each of the four bars 105 further passes through a hole 108 formed in the casing 101. The hole 108 includes an O-ring (not shown). The O-ring prevents external air from leaking through the gap between the rod 105 and the hole 108 and maintains the vacuum in the casing 101. The connector 106 is supported by the casing 101 so as to be movable in a direction perpendicular to the y direction and perpendicular to the z direction. Each of the four bars 105 has the other end opposite to the end joined to the substrate table 102 joined to the connector 106 in the same body. The driving device 107 is formed of an air cylinder and translates the connector 106 in a direction perpendicular to the y direction and perpendicular to the z direction.

  The clamping mechanism includes four rods 111 and four driving devices 112. Each of the four bars 111 includes a support claw 114 at one end. Each of the four bars 111 further penetrates a hole 113 formed in the casing 101. The hole 113 includes an O-ring (not shown). The O-ring prevents external air from leaking through the gap between the rod 111 and the hole 113 and maintains the vacuum in the casing 101. The four bars 111 are further installed on both sides in the y direction of the deposition preventing plate 104 so as not to interfere with the deposition preventing plate 104, and pass through holes formed in the casing 101. The driving devices 112 are each formed from an air cylinder. Each of the driving devices 112 translates the rod 111 in a direction perpendicular to the y direction and perpendicular to the z direction. The driving device 107 is preferably simplified by applying an air cylinder because the movement distance of the deposition preventing plate 104 is short and high accuracy is not required for the position and speed of the deposition preventing plate 104 movement.

  The substrate transfer device operating mechanism includes rods 91-1 and 91-2 and driving devices 92-1 and 92-2. The rod 91-1 passes through a hole 93-1 formed in the upper portion of the casing 101. The hole 93-1 includes an O-ring (not shown). The O-ring prevents external air from leaking through the gap between the rod 91-1 and the hole 93-1, and maintains the vacuum in the casing 101. Each of the driving devices 92-1 translates the rod 91-1 in a direction parallel to the z direction. The rod 91-2 passes through a hole 93-2 formed in the lower portion of the casing 101. The hole 93-2 includes an O-ring (not shown). The O-ring prevents external air from leaking through the gap between the rod 91-2 and the hole 93-2, and maintains the vacuum in the casing 101. Each of the driving devices 92-2 translates the rod 91-2 in a direction parallel to the z direction.

  When the C frame 34 of the substrate transfer device 6 is placed in the processing chamber 3-i, the substrate table 102 and the support claw 114 move closer to each other, and the C table 34 of the substrate transfer device 6 is moved to the substrate. It fixes between the table 102 and the support claw 114.

  FIG. 16 shows the substrate transfer apparatus 6 when the A frame 32 moves to the right end of the slide base 31. In the substrate transfer device 6, when the slider 38 is disposed on the moving rail 51, the moving rail 51 moves in the y direction by the ball screw 53 and the driving device 54, so that the A frame 32 moves in the y direction. In the substrate transfer apparatus 6, when the A frame 32 moves in the y direction, the B frame 33 moves in the y direction. In the substrate transfer apparatus 6, when the B frame 33 moves in the y direction, the C frame 34 moves in the y direction. In the substrate transfer device 6, when the moving rail 51 is farthest from the center, the C frame 34 is disposed at a predetermined position in the processing chamber 3-i. In addition, since the A frame 32, the B frame 33, and the C frame 34 are support structures that allow each frame to pass through each other, the A frame 32, the B frame 33, and the C frame 34 can move to the left side opposite to the right side movement shown in FIG. The substrate can be carried into and out of any of the processing chambers 3-i installed on the left and right sides of the transfer chamber 2 by the substrate transfer device 6. Such an operation is preferable because the driving mechanism of the substrate transfer device 6 is simplified.

  The lever 81-1 is arranged at a position where the rod 91-1 can be pushed when the C frame 34 is arranged at a predetermined position in the processing chamber 3-i. The lever 81-2 is disposed at a position where the rod 91-2 can be pushed by movement when the C frame 34 is disposed at a predetermined position in the processing chamber 3-i.

  FIG. 17 shows the substrate table 102. The substrate table 102 is formed such that the recess 121 and the support claw 122 are inclined by 10 degrees from the vertical direction on the surface facing the deposition preventing plate 104. Four recesses 121 are formed at positions where the four corners of the substrate 120 supported by the substrate table 102 are arranged. The support claws 122 are disposed at both ends of a portion of the substrate 120 that is supported by the substrate table 102 so as not to overlap the depression 121 at the lower end side, and are formed so as to be in contact with the lower end side of the substrate 120. That is, the substrate 120 is supported at a predetermined position on the substrate table 102 by supporting the load at the lower edge of the support claw 122 and leaning the substrate surface against the substrate table 102.

  The movable claw 83-4 is disposed in the recess 121 as shown in FIG. 18 when the C frame 34 is sandwiched and fixed between the substrate table 102 and the support claw 114. The recess 121 is deep enough so that the movable claws 83-1, 83-2 and the movable claws 83-1, 83-2 can move to support or release the glass substrate 120. large.

  The operation of the substrate transfer device 6 to transfer the substrate 120 is formed of a set operation and an unset operation. Since the substrate inclination direction of the processing chamber 3-i is symmetrical with respect to the transfer chamber 2, the substrate can be carried into and out of the processing chamber on the right side and the processing chamber on the left side.

  The set operation is an operation for carrying the substrate 120 supported by the substrate transfer apparatus 6 from the transfer chamber 2 to the processing chamber 3-i. In the setting operation, first, the substrate 120 is held on the C frame 34. The substrate transfer device 6 translates in the x direction until the position in the x direction matches the position of the processing chamber 3-i into which the substrate 120 is loaded. This position is a position where the slider 38 attached to the A frame 32 is sandwiched between the guides 59. Since the A frame 32 does not move in the x direction while the A frame is moving in the y direction, the x direction conveyance mechanism is clamped. There is no need to fix it. After the gate valve 7-i is opened, the substrate transfer device 6 moves the moving rail 51 in parallel to the y direction toward the processing chamber 3-i, so that the A frame 32, the B frame 33, and the C frame 34 are moved. Move toward the processing chamber 3-i in parallel to the y direction.

  The processing chamber 3-i moves so that the substrate table 102 and the support claws 114 come close to each other after the C mount 34 is arranged at a predetermined position in the processing chamber 3-i, and the C mount 34 is moved to the substrate table. It fixes between 102 and the support nail | claw 114. Next, the processing chamber 3-i pushes the levers 81-1 and 81-2 toward the inside of the C mount 34 using the rods 91-1 and 91-2. When the levers 81-1 and 81-2 are pressed, the substrate transfer device 6 moves the movable claws 83-1 to 83-4 and the movable claws 84-1 to 84-4 to the outside of the C frame 34, and supports them. Release the substrate 120. The substrate 120 is thus transferred from the C mount 34 to the substrate table 102.

  After the substrate transfer device 6 releases the substrate 120, the processing chamber 3-i moves the substrate table 102 and the support claw 114 away from each other to release the C frame 34. After the substrate 120 is released from the movable claws 83-1 to 83-4 and the movable claws 84-1 to 84-4 of the substrate transfer device 6, the processing chamber 3-i moves the rods 91-1 and 91-2. Separate from levers 81-1, 81-2. After the levers 81-1 and 81-2 are separated from the rods 91-1 and 91-2, the substrate transfer device 6 moves in parallel with the y direction toward the center of the transfer chamber 2 by moving the moving rail 51 toward the center of the transfer chamber 2. The A frame 32, the B frame 33, and the C frame 34 move to the center of the transfer chamber 2. The processing chamber 3-i closes the gate valve 7-i after the C frame 34 exits the processing chamber 3-i.

  The unset operation is an operation in which the substrate transfer device 6 carries the substrate 120 supported by the processing chamber 3-i into the transfer chamber 2. In the unset operation, the substrate transfer device 6 first translates in the x direction until the position in the x direction matches the position of the processing chamber 3-i. After the gate valve 7-i is opened, the substrate transfer device 6 moves the moving rail 51 in parallel to the y direction toward the processing chamber 3-i, so that the A frame 32, the B frame 33, and the C frame 34 are moved. Move toward the processing chamber 3-i in parallel to the y direction.

  In the processing chamber 3-i, after the C mount 34 is arranged at a predetermined position in the processing chamber 3-i, the levers 81-1 and 81-2 are moved to the C mount using the rods 91-1 and 91-2. Push in the direction of 34. The substrate transfer device 6 moves the movable claws 83-1 to 83-4 and the movable claws 84-1 to 84-4 to the outside of the C frame 34 by pressing the levers 81-1 and 81-2. Next, the processing chamber 3-i moves so that the substrate table 102 and the support claw 114 come close to each other, and fixes the C frame 34 between the substrate table 102 and the support claw 114.

  The processing chamber 3-i separates the rods 91-1 and 91-2 from the levers 81-1 and 81-2 after the C frame 34 is fixed. The board transfer device 6 includes return mechanism springs 87-1 to 87- attached to the movable claws 83-1 to 83-4 when the levers 81-1 and 81-2 are separated from the rods 91-1 and 91-2. 4, the movable claws 83-1 to 83-4 and the movable claws 84-1 to 84-4 move to the inside of the C frame 34 to support the substrate 120. The substrate 120 is transferred from the substrate table 102 to the C frame 34. In the processing chamber 3-i, after the substrate transfer device 6 supports the substrate 120, the substrate table 102 and the support claw 114 move away from each other to release the C frame 34. After the C mount 34 is released, the substrate transfer apparatus 6 moves the moving rail 51 toward the center of the transfer chamber 2 in parallel in the y direction so that the A mount 32, the B mount 33, and the C mount 34 are moved. Move to the center of the transfer chamber 2. The processing chamber 3-i closes the gate valve 7-i after the C frame 34 exits the processing chamber 3-i. According to such an operation, the substrate transport device 6 is preferable because the substrate delivery driving mechanism is simple and reliable.

  The operation of unloading the substrate 120 supported by the substrate transfer device 6 to the load chamber 4 to the transfer chamber 2 is performed in the same manner as the unset operation, and the substrate 120 supported by the substrate transfer device 6 is removed from the transfer chamber 2. The operation of carrying in the unload chamber 5 is executed in the same manner as the setting operation.

  According to such an operation, when the substrate 120 is delivered, both the upper movable claws 83-1 to 83-2 and the lower movable claws 83-3 to 83-4 are opened and closed. Compared with the case where only the 83-3 to 83-4 is moved and the substrate 120 is transferred from the C frame 34 to the substrate table 102, the movable strokes of the lower movable claws 83-3 to 83-4 can be reduced. That is, since the vertical movement of the substrate 120 performed when the substrate 120 is delivered is reduced, the length of the scratch generated by rubbing against the substrate table 102 on the surface where the substrate 120 is in contact with the substrate table 102 is short, and the generation of the scratch can be reduced. it can.

  The vacuum processing apparatus 1 preferably assigns two adjacent processes to two processing chambers facing each other. For example, the vacuum processing apparatus 1 can assign a certain process to the processing chamber 3-1, and assign a process to be executed immediately after that process to the processing chamber 3-4. At this time, the substrate transfer device 6 can process the substrate 6 quickly without having to move in the x direction when the substrate 6 is unloaded from the processing chamber 3-1 and loaded into the processing chamber 3-4. The processing speed of the vacuum processing apparatus 1 is improved.

  The embodiment of the process chamber extension method according to the present invention is executed by using the vacuum processing apparatus 1. In the process chamber expansion method, first, an expansion unit is manufactured. The extension unit has the same reference position and connection structure as the units 26-1 to 26-3, and is manufactured in the same connection shape as the units 26-1 to 26-3. In the vacuum processing apparatus 1, the inside of the transfer chamber 2 is increased to atmospheric pressure, and the lid 25 is removed. Next, in the vacuum processing apparatus 1, the extension unit is installed in the processing chamber portion where the lid 25 of the unit 26-1 has been installed, and the lid 25 is installed in the release portion of the extension unit.

  In a cluster type vacuum processing apparatus, when a processing chamber is added, it is necessary to design a central transfer chamber larger than the processing chamber to be added in advance. The vacuum processing apparatus 1 can easily add a processing chamber by such a processing chamber extension method only by securing an installation place. For this reason, after the vacuum processing apparatus 1 is installed, it is possible to cope with an increase in the process such as an increase in the number of film forming layers and an improvement in the film forming capacity without moving the load chamber 4 and the unload chamber 5. This is possible and preferable.

  By adding the extension unit between the lid 25 and the unit 26-1, the plurality of units 26-1 to 26-3 need not be disassembled, moved, or reassembled at the time of extension, and can be more easily performed. A processing chamber can be added. Note that the extension unit can be added to a place other than between the lid 25 and the unit 26-1. For example, the extension unit is added between the unit 26-1 and the unit 26-2, between the unit 26-2 and the unit 26-3, or between the unit 26-3 and the load lock portion 24. can do.

FIG. 1 is a block diagram showing an embodiment of a vacuum processing apparatus according to the present invention. FIG. 2 is a perspective view showing an embodiment of a vacuum processing apparatus according to the present invention. FIG. 3 is a front view showing the substrate transfer apparatus. FIG. 4 is a perspective view showing the slide base. FIG. 5 is a perspective view showing the A frame. FIG. 6 is a side view showing the substrate transfer apparatus. FIG. 7 is a perspective view showing the B frame. FIG. 8 is a perspective view showing the support member. FIG. 9 is a perspective view showing the C frame. FIG. 10 is a perspective view showing the central rail. FIG. 11 is a cross-sectional view showing the guide. FIG. 12 is a perspective view showing a mechanism for driving the B frame. FIG. 13 is a front view showing the C frame. FIG. 14 is a perspective view showing a mechanism for driving the movable claw. FIG. 15 is a cross-sectional view showing the processing chamber. FIG. 16 is a front view showing the substrate transfer apparatus. FIG. 17 is a front view showing the substrate table. FIG. 18 is a cross-sectional view showing the substrate table.

Explanation of symbols

1: Vacuum processing device 2: Transfer chamber 3-1 to 3-6: Processing chamber 4: Load chamber 5: Unload chamber 6: Substrate transfer device 7-1 to 7-6: Gate valve 11: Gate valve 12: Loader Atmosphere side insertion device 13: Gate valve 15: Gate valve 16: Unloader atmosphere side insertion device 17: Gate valve 18-1: Lifting mechanism 18-2: Loader substrate transfer device 19-1: Unloader substrate transfer device 19-2 : Lifting mechanism 21-1 to 21-6: Rails 22-1 to 22-3: Processing chamber portion 24: Load chamber portion 25: Lids 26-1 to 26-3: Unit 31: Slide base 32: A stand 33: B frame 34: C frame 35-1 to 35-2: Slider 36-1 to 36-2: Rail 37: Slider 38: Slider 39: Center rail 131: Rotation drive motor 132: Magnetism Bearing with ionic fluid seal 133: Pinion 134: Rack 41-1 to 41-2: Support member 44: Slider 45: Support member 46-1 to 46-2: Slider 47-1 to 47-2: Pulley 48-1 48-2: Belt 51: Moving rail 52: Fixed rail 53: Ball screw 54: Drive device 55: Slider 58: Guide 59: Guide 61: Rack 62: Rotating shaft 63: Rotating member 64: Pinion 65: Pinion 67: Rack 71 : Rotating shaft 72: rotating shaft 81-1 to 81-2: lever 82-1 to 82-2: shaft 83-1 to 83-4: movable claw 84-1 to 84-4: movable claw 86: link mechanism 141 : Pinion 142: Pinion 143: Rack 144: Rack 145: Rack 87-1 to 87-4: Spring for return mechanism 91-1 to 91-2 Rod 92-1 to 92-2: Driving device 93-1 to 93-2: Hole 101: Casing 102: Substrate table 103: Electrode 104: Attachment plate 105: Rod 106: Connecting tool 107: Driving device 111: Rod 112 : Drive device 113: Hole 114: Support claw 120: Substrate 121: Recess 122: Support claw

Claims (8)

A transfer chamber;
A plurality of processing chambers connected to the transfer chamber and supporting the substrate by inclining the substrate from the vertical direction, and vacuum processing;
A substrate transfer apparatus that moves in the transfer chamber and moves the substrate in parallel to move in the transfer chamber and the plurality of processing chambers without changing the tilting direction of the substrate. And
The plurality of processing chambers are
Multiple right processing chambers;
A plurality of left side processing chambers disposed on opposite sides of the right side processing chamber across the transfer chamber;
The substrate transfer device includes:
In a state where the substrate is inclined and supported, the substrate is moved in parallel in the transfer chamber,
A vacuum processing apparatus for carrying in and out the substrate while moving the substrate in a state where the substrate is inclined and supported when the substrate is carried into and out of all the processing chambers . In claim 1,
Each of the plurality of processing chambers is connected to the transfer chamber and is supported so as to be movable in a direction away from the transfer chamber in accordance with a deformation amount due to thermal expansion. In claim 1 or claim 2,
The first process executed by the first processing chamber of the plurality of right processing chambers or the plurality of left processing chambers is separated from the transfer chambers of the plurality of left processing chambers or the plurality of right processing chambers. A vacuum processing apparatus which can be executed immediately after a second process executed by a second processing chamber facing the first processing chamber. In any one of Claims 1-3,
A load chamber connected to the transfer chamber and carrying the substrate into the transfer chamber from the outside;
An unload chamber connected to the transfer chamber and carrying the substrate out of the transfer chamber to the outside;
The said load chamber is arrange | positioned facing the said unload chamber across the said transfer chamber, The vacuum processing apparatus which enables the said board | substrate to carry in and the board | substrate to carry out to move linearly. In any one of Claims 1-4,
The transfer chamber and the plurality of processing chambers include a plurality of units having the same structure.
The transfer chamber is formed from a plurality of processing chamber portions,
Each of the plurality of units is
One portion of the plurality of processing chamber portions;
A processing chamber connected to the one portion of the plurality of right side processing chambers;
A vacuum processing apparatus formed from a processing chamber connected to the one portion of the plurality of left side processing chambers. In any one of Claims 1-5,
A vacuum processing apparatus for forming a thin film on the substrate by plasma CVD in at least one of the processing chambers. A process chamber extension method for adding a process chamber to the vacuum processing apparatus according to claim 5,
Producing an expansion unit having a mating structure equal to that of the unit;
A process chamber expansion method comprising: adding an expansion unit to the vacuum processing apparatus. In claim 7 ,
The vacuum processing apparatus includes:
A load chamber connected to the transfer chamber and carrying the substrate into the transfer chamber from the outside;
An unload chamber connected to the transfer chamber and carrying the substrate out of the transfer chamber to the outside;
The load chamber is disposed opposite the unload chamber across the transfer chamber,
The expansion processing chamber included in the expansion unit is
A method for adding a processing chamber, wherein the processing chamber is extended from the loading chamber and the unloading chamber to a portion separated from the plurality of units.

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