JP4257915B2 - Method for producing insulating thin film body - Google Patents

Description

The present invention is applied to a case, a protective member, etc., for securing or holding insulation of, for example, a portable personal computer, a PC card, a mobile phone, a PDA, and other electronic / electrical devices mainly with a printed circuit board. The present invention relates to a method for manufacturing an insulating thin film body that is used after being stuck.

Conventionally, for example, in an electronic device such as a PC card shown in FIG. 7, in order to ensure electrical insulation between a metal housing 6 and an electronic component on an internal printed circuit board 16, As shown in FIG. 8, an insulating sheet or an insulating film 18 attached through an adhesive layer 19 is used. As shown in FIG. 9, after attaching the insulating sheet 18 or the like to the cover 6, the pull tab 8 a is pulled to peel the separator 8 along the half cut 20. As a result, the insulating sheet 18 and the like are exposed, and a part of the adhesive layer 19 is exposed to form an adhesive area. In addition, there is known a buffer layer having a buffer property, an adhesive layer, and an insulating resin film, wherein the buffer layer and the resin film are attached to each other by the adhesive layer (patent) Reference 1).
JP 2002-260468 A

However, the conventional insulating sheet 18 is sandwiched between the casing 6 and the members, and in order to be attached to the casing 6, an adhesive layer and a release layer (separator) are further required. Is bulky and is an obstacle to thinning.
Further, as shown in FIG. 9, there is no problem when the portion where insulation is desired has a relatively simple shape. However, when the portion has a complicated shape, the insulating sheet or film 18 is not problematic. Since the punching die for punching out becomes complicated, labor and cost increase. In addition, electronic parts are mounted with high density due to the recent reduction in size and thickness of electronic equipment, and the range to ensure insulation is often extremely complicated, making it difficult to create a punching die for punching films and the like. May be.

  Further, an adhesive layer 19 may be appropriately provided around the insulating sheet or the resin film 18. In such a case, a perforation (half cut) 20 for cutting is put in the insulating sheet 18 or the like. Thus, when the periphery of the insulating sheet 18 or the like is peeled off, the adhesive layer 19 must be formed to be exposed, which is troublesome. In this case as well, if the shape is complicated, a plurality of punching dies may be required or it may be difficult to create the punching dies. The insulating thin film body and the manufacturing method thereof according to the present invention have been proposed in order to solve such problems.

The gist of the method for producing an insulating thin film according to the present invention is as follows: a backing sheet, an insulating and flexible flat substrate pasted on the backing sheet through an adhesive layer, and one side of the backing material. For a sheet made of a separator attached to the adhesive layer, the separator is peeled off from the mount to expose the adhesive layer, and the exposed surface of the adhesive layer has a shape in a range where insulation is required. Insulating ink is applied by screen printing using a plate, and a non-adhesive coating is applied to a portion of the screen other than the printed portion on one side of the screen so as not to adhere to the adhesive layer. Forming a layer, exposing an adhesive layer having an arbitrary width in an appropriate range of a peripheral portion of the insulating coating layer, and covering the separator with the insulating coating layer and the adhesive layer having an arbitrary width Let and die It cuts to the upper surface of the said mount, and it forms by adjusting the outer periphery according to the shape of the target object which affixes the said insulating thin film body.

According to the method for producing an insulating thin film of the present invention, conventionally, an insulating sheet or an insulating film must be used in order to ensure electrical insulation. As a result, the thickness is significantly reduced. As a result, the electronic device can be further reduced in thickness.
Furthermore, since the coating method of the insulating ink is based on printing such as screen printing, the shape can correspond to any complicated shape. Therefore, in the conventional sheet or film, a complicated and expensive mold has to be prepared and cut. However, according to the present invention, it is possible to easily cope with the required range of insulation having a complicated shape at low cost. be able to.

  Further, according to the manufacturing method according to the present invention, since the insulating coating layer is formed by a method of printing insulating ink, it is possible to cope with a complicated shape in a range where insulation is required. . In addition, during screen printing, the screen can be printed easily by applying a non-adhesive coating to the screen.

  As shown in FIG. 1, an insulating thin film body 1 according to the present invention is provided on both surfaces in this embodiment on an insulating and flexible flat substrate 2 and at least one surface of the substrate 2. Insulating coating layer 5 coated with insulating ink in the shape of a range where insulation is required on one side of adhesive layer 3, 4 and adhesive layer 4 on one side of adhesive layers 3, 4. It has.

  The substrate 2 is an insulating sheet or film such as a polyester film. The base material 2 can prevent the intrusion of the insulating ink applied to the pressure-sensitive adhesive layer. Further, the insulating property of the insulating thin film body 1 is ensured and stabilized.

  The pressure-sensitive adhesive layers 3 and 4 are synthetic rubber-based or acrylic pressure-sensitive adhesives. The insulating coating layer 5 is, for example, a polyimide ink and is not particularly limited.

  As shown in FIG. 1, for example, the insulating thin film 1 is attached to the inside of a cover 6 of a PC card by removing the mount and exposing the adhesive layer 3. The insulating coating layer 5 on the inner side is on the electronic component side, and ensures insulation with the stainless steel cover 6. In addition, the insulating coating layer 5 peels and exposes the separator (release paper) stuck on this for protection.

  In order to increase the insulating property of the insulating thin film body 1, as shown in FIG. 2, when the thickness of the base material 2 is increased (FIG. 2A), the base material 2 is sandwiched between the adhesive layers 3. When a plurality of layers are provided by sandwiching them (FIG. (B)), the thickness of the insulating coating layer 5 of the insulating ink is increased (FIG. (C)), etc. is there.

  In addition, as another embodiment of the insulating thin film body 1, as an insulating thin film body 1a (not shown) without a base material 2, an adhesive layer 4 applied on a mount and the adhesive film It can also be set as the insulating coating-film layer 5 by which an insulating ink is apply | coated to the shape of the range as which the insulation is calculated | required by the agent layer 4. FIG. In addition, the direction which has the said base material 2 can acquire insulation reliably.

  As shown in FIG. 3 (A), the insulating thin film body 1 is prepared by preparing a sheet 9 composed of a base material 2 attached to a mount 7 and a separator 8 attached thereto. The separator 8 is peeled off from the pressure-sensitive adhesive layer 4 and guided by a roller 10 to expose the pressure-sensitive adhesive layer 4.

  As shown in FIG. 4, the insulating ink 5 a is screen-printed on the pressure-sensitive adhesive layer 4. Here, a plate 12 is formed on the screen 11 so that the ink 5a is printed in an arbitrary shape within a range where insulation is required. Further, a non-adhesive coating such as a silicon coating 12 a is applied to the plate 12 so as not to adhere to the pressure-sensitive adhesive layer 4 on the side in contact with the pressure-sensitive adhesive layer 4. Thereby, screen printing can be performed smoothly.

  In the screen printing, the plate frame 13 is moved up and down by the vertical drive device with respect to the pressure-sensitive adhesive layer 4, and when the screen 11 is placed on the pressure-sensitive adhesive layer 4, the squeegee 14 moves sideways and imprints the insulating ink 5a. Thereafter, the plate frame 13 rises and the sheet 9 advances. The sheet 9 is intermittently moved and stopped only during screen printing.

  The printed insulating coating layer 5 is coated with the separator 8 once peeled off and guided by the roller 10. Then, the die 15 is cut to reach the top surface of the mount 7. The outer shape of the punching die 15 is adjusted according to the shape of the product to be attached. It is larger than the outer shape of the insulating coating layer 5 and has a simple shape. Therefore, in this insulating thin film 1, the adhesive layer 4 having an arbitrary width is exposed in an appropriate range of the peripheral portion of the insulating coating layer 5 when the separator 8 is peeled off after being attached to the product. Become. It is a matter of design which part is exposed and how much.

  After pressing with the punching die 15, the unused part is wound up by, for example, a collection drum. Then, the insulating thin film 1 is formed on the mount 7.

  In order to use the insulating thin film body 1 of the present invention formed in this way, as shown in FIG. 5, the insulating thin film body 1 is peeled off from the mount 7 and is attached to the back surface of the product cover 6. It sticks through the adhesive layer 3. Thereafter, as shown in FIG. 6, the pull tab 8 a is pulled to peel off the separator 8. Thereby, the insulating coating film layer 5 is exposed. Then, the adhesive area of the pressure-sensitive adhesive layer 4 is exposed in a part of the peripheral portion, and is adhered to a frame or the like on the printed board 16 where the electronic components are avoided.

  In the method for manufacturing the insulating thin film 1, the insulating ink 5a is screen-printed on the pressure-sensitive adhesive layer 4. However, the pressure-sensitive adhesive layer 4 has a strong adhesive force, and the screen or the like sticks to the screen. 3B, the insulating ink 5a is screen-printed in a desired shape on the separator 8 side (back surface) to form the insulating coating layer 5, and this separator 8 Is pressed against the pressure-sensitive adhesive layer 4 with a desired pressing force to transfer the insulating coating layer 5 with the insulating ink 5a. In this case, as the insulating ink 5a, UV-based ink having high quick-drying property is used so as to dry before being transferred to the pressure-sensitive adhesive layer 4.

  Thereafter, pressing is performed with a die 15. Thereby, the insulating coating film layer 5 is transcribe | transferred to the adhesive layer 4 side with strong adhesive force. In the use of the insulating thin film 1 by this transfer printing, the insulating coating layer 5 is present on the pressure-sensitive adhesive layer 4 side by peeling off the separator 8 and can be used in the same manner as described above. Thus, it is possible to arbitrarily select whether to perform screen printing on either the pressure-sensitive adhesive layer 4 or the separator 8 depending on the strength of the pressure-sensitive adhesive layer 4 of the sheet 9.

It is sectional drawing of the insulating thin film body 1 which concerns on this invention. It is sectional drawing (A), (B), (C) of each example of the aspect which improves insulation with the insulating thin film body of the same invention. It is explanatory drawing (A) which shows the manufacturing method by the direct printing of the insulating thin film body 1, and explanatory drawing (B) which shows the manufacturing method by the transfer printing. FIG. 4 is an enlarged explanatory view showing a part of the method for manufacturing the insulating thin film body 1. 3 is a cross-sectional view for explaining the usage state of the insulating thin film body 1. FIG. 3 is a plan view showing a usage state of the insulating thin film body 1. FIG. They are a top view (A) of an example of PC card 17, a front view (B), and a side view (C). FIG. 6 is a partial cross-sectional view showing a usage state of a conventional sheet in the PC card 17. FIG. 10 is a plan view showing a usage state of a conventional sheet in the PC card 17.

Explanation of symbols

1 Insulating thin film,
2 base material,
3, 4 adhesive layer,
5 Insulating coating layer, 5a Insulating ink,
6 Cover,
7 Mount,
8 Separator, 8a Pull tab,
9 seats,
10 rollers,
11 screens,
12 edition, 12a silicon coating,
13 plates,
14 Squeegee,
15 die cutting,
16 Printed circuit board,
17 PC card,
18 Insulating sheet or film,
19 Adhesive layer,
20 Half cut.

Claims (2)

It consists of a backing sheet, an insulating and flexible flat base material stuck to this backing sheet via an adhesive layer, and a separator attached to one side of the base material via an adhesive layer For the sheet, peel off the separator from the mount to expose the adhesive layer,
  Insulating ink is applied to the exposed surface of the pressure-sensitive adhesive layer by screen printing with a plate having a shape in a range where insulation is required, and the screen is printed on one side of the screen and adhered to the pressure-sensitive adhesive layer on a portion other than the printed portion. Non-adhesive coating is applied to form an insulating coating layer,
  In the appropriate range of the peripheral portion of the insulating coating layer, to expose an adhesive layer of any width,
  The separator is coated on the insulating coating layer and the adhesive layer having an arbitrary width,
  Cutting to the upper surface of the mount by a punching die and adjusting the outer periphery according to the shape of the object to be pasted with the insulating coating layer,
  A method for producing an insulating thin film characterized by the following. The separator has a pull tab that makes it easy to peel off,
The manufacturing method of the insulating thin film body of Claim 1 characterized by these .

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