JP4246987B2 - Substrate inspection apparatus and substrate inspection method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate inspection apparatus, and more particularly to inspection of wiring using a capacitance.
[0002]
[Prior art]
Conventionally, as a wiring pattern formed on a printed wiring board, a glass substrate for a plasma display panel or a liquid crystal panel is miniaturized, the contact type inspection probe does not damage the fine wiring pattern. A substrate inspection apparatus that inspects the continuity of a wiring pattern using a contact inspection probe is known (for example, see Patent Document 1).
[0003]
For example, in the substrate inspection apparatus described in Japanese Patent Application Laid-Open No. 11-133090, an electrode covered with an insulating film is used as an inspection probe, and this electrode is disposed so as to face a wiring pattern to be inspected. The electrode and the wiring pattern are electrostatically coupled by the capacitance of the capacitor formed by the electrode and the wiring pattern facing each other across the film. Then, an inspection signal is injected into the inspection target pattern from the signal injection probe electrostatically coupled at one end portion of one inspection target pattern of the plurality of wiring patterns, and the other end portion of the plurality of wiring patterns. Thus, the continuity of the inspection target pattern is inspected by detecting the inspection signal with a signal detection probe that collectively detects signals from the plurality of wiring patterns.
[0004]
[Patent Document 1]
JP-A-11-133090
[0005]
[Problems to be solved by the invention]
However, in the above-described substrate inspection apparatus, when a fine wiring pattern is formed in parallel on the inspection target substrate, the inspection injected into the inspection target pattern due to electrostatic coupling between adjacent wiring patterns As a result of the detection of the signal for use by the signal detection probe via the adjacent wiring pattern, it is difficult to reliably detect the disconnection of the pattern to be inspected.
[0006]
The present invention has been made in view of the above circumstances, and provides a substrate inspection apparatus that can more reliably determine the quality of wiring by eliminating the influence of capacitance between adjacent wirings. Objective.
[0007]
[Means for Solving the Problems]
A first aspect of the present invention is a substrate inspection apparatus for inspecting a wiring formed on a substrate surface, wherein the first wiring is arranged opposite to the first wiring in the vicinity of both ends of the first wiring to be inspected. 1. The first power supply electrode and a first inspection signal having a predetermined signal waveform are supplied to the first power supply electrode, and at the same time, the second power supply electrode has a waveform different from that of the first inspection signal. Inspection signal supply means for supplying a second inspection signal; first and second inspection electrodes disposed opposite to the first wiring in the vicinity of the first and second power supply electrodes; First inspection means for determining whether or not the first wiring is conductive according to the difference between the detection signals from the second inspection electrode is provided, and the second inspection signal is transmitted from the first wiring in the wiring. And the first and second signals without canceling each other. Der made test signal with the different signal A third power supply electrode disposed opposite to the second wiring adjacent to the first wiring and supplied with one of the first and second inspection signals; and the second wiring, the first wiring. A third inspection electrode opposed to the second wiring in the vicinity of the end on the end side where the inspection electrode is opposed, the first inspection electrode, the third inspection electrode, and the second inspection electrode And a second inspection means for determining whether or not there is a short circuit between the first wiring and the second wiring in accordance with the difference in detection signal from each inspection electrode in either one of the third inspection electrode and the third inspection electrode, The third power supply electrode is integral with the first power supply electrode, a plurality of the wirings are formed on the substrate surface at a constant pitch, and the second power supply electrode is the first power supply electrode. With the same shape as that of the first wiring and shifted by one pitch on the opposite side of the second wiring across the first wiring Is it It is characterized by.
[0008]
According to the first aspect of the present invention, the inspection signal supply means is provided by arranging the first and second feeding electrodes opposite to the first wiring in the vicinity of both ends of the first wiring to be inspected. The first inspection signal having a predetermined signal waveform supplied from is supplied to the vicinity of one end of the first wiring through the first power supply electrode in a non-contact manner, and at the same time, the first inspection signal is A second inspection signal having a different waveform is supplied in a non-contact manner near the other end of the first wiring via the second power supply electrode. Then, a signal induced in the first wiring is detected in a non-contact manner by the first and second inspection electrodes disposed in opposition to the first wiring in the vicinity of the first and second power supply electrodes. Whether the first wiring is conductive or not is determined by the first inspection means in accordance with the difference in signal.
[0009]
Thereby, when the first wiring is conductive, the same signal obtained by combining the signals induced in the first wiring by the first inspection signal and the second inspection signal is the first signal. Since it is detected by the second inspection electrode, there is no difference between the detection signals. In addition, when the first wiring is disconnected, different signals are induced on both sides of the insulating portion by the first inspection signal and the second inspection signal. In this case, signals induced on both sides of the insulating portion by the signal supplied via the electrostatic coupling from the wiring adjacent to the first wiring are not made the same signal. Therefore, by determining the presence or absence of conduction of the first wiring in accordance with the presence or absence of the difference between the signals induced on both sides across the insulating portion, the influence of the capacitance between adjacent wirings is eliminated. The
[0010]
Also, Since the third power supply electrode is disposed opposite to the second wiring, one of the first and second inspection signals is supplied to the second wiring in a non-contact manner via the third power supply electrode. Then, a signal induced in the second wiring is detected in a non-contact manner by the third inspection electrode in the vicinity of the end portion of the second wiring that faces the first inspection electrode. The first wiring and the second wiring according to the difference in the detection signal from each of the inspection electrodes in any one of the first inspection electrode, the third inspection electrode, and the second inspection electrode and the third inspection electrode The second inspection means determines whether or not there is a short circuit. Thereby, when the first wiring and the second wiring are short-circuited, the same signal obtained by synthesizing the signal induced in the first wiring and the signal induced in the second wiring Are detected by any one of the first inspection electrode, the third inspection electrode, the second inspection electrode, and the third inspection electrode, and there is no difference between the detection signals. Further, when the first wiring and the second wiring are not short-circuited, different signals are induced in the first wiring and the second wiring, so that the detection signals are different. Therefore, it is possible to determine the presence or absence of a short circuit between the first wiring and the second wiring according to the difference in the detection signal from each inspection electrode.
[0011]
Also, The second power supply electrode has the same shape as the first power supply electrode, and is arranged by being shifted by one pitch on the opposite side of the second wiring across the first wiring. The second power supply electrode can be configured using the same member as the first power supply electrode, and the same material can be used as the first power supply electrode and the second power supply electrode. It becomes possible.
[0012]
Claim 2 The invention described in claim 1 The substrate inspection apparatus described above is characterized in that the first and second inspection signals are obtained by shifting the phase of the periodic signal by a predetermined angle. Claim 2 Since the phase of the periodic signal is shifted by a predetermined angle in the first and second inspection signals, the difference between the detection signals is the phase shift of the periodic signal. Obtained as the presence or absence of.
[0013]
Claim 3 The invention described in claim 1 In the substrate inspection apparatus described above, the first and second inspection signals are periodic signals having different frequencies.
[0014]
Claim 4 The invention described in claim 1 In the substrate inspection apparatus described above, the first and second inspection signals are signals whose voltage changes sharply, and the second inspection signal is a signal whose change timing is shifted from that of the first inspection signal. It is characterized by being.
[0015]
Claim 5 The invention described in claim 1 4 The substrate inspection apparatus according to any one of the above, wherein the first inspection means performs the determination when a signal is detected by both the first and second inspection electrodes. . Claim 5 According to the invention described in (1), when a signal is detected by both the first and second inspection electrodes, that is, both the first and second inspection electrodes are arranged at positions facing the first wiring. The determination is made in the state.
[0016]
Claim 6 The invention described in 1 is a substrate inspection method for inspecting a wiring formed on a substrate surface, wherein the first and second power supply electrodes are arranged near the both ends of the first wiring to be inspected. A second inspection circuit is disposed opposite to the wiring, and a first inspection signal having a predetermined signal waveform is supplied to the first power supply electrode, and at the same time, a second waveform having a waveform different from that of the first inspection signal is supplied to the second power supply electrode. An inspection signal is supplied, and the first and second inspection electrodes are arranged opposite to the first wiring in the vicinity of the first and second power supply electrodes, and each detection from the first and second inspection electrodes is performed. Whether the first wiring is conductive or not is determined according to the difference in signal, and the second inspection signal does not cancel each other when combined with the first inspection signal in the wiring, and The first and second inspection signals are different from each other. Thus, the third feeding electrode to which one of the first and second inspection signals is supplied is disposed opposite to the second wiring adjacent to the first wiring, and the third inspection electrode is disposed to the second wiring. The first inspection electrode, the third inspection electrode, the second inspection electrode, and the second inspection electrode are opposed to the second wiring in the vicinity of the end on the end portion side where the first inspection electrode is opposed. Whether or not there is a short circuit between the first wiring and the second wiring is determined according to the difference in detection signal from each inspection electrode in any one of the three inspection electrodes, and the third power supply electrode A plurality of wirings are formed on the substrate surface at a constant pitch, and the second feeding electrode has the same shape as the first feeding electrode, and The second power supply electrode is arranged with a shift of 1 pitch on the side opposite to the second wiring with the first wiring interposed therebetween. It is characterized by that.
Claim 6 According to the invention described in (1), the first and second feeding electrodes are arranged opposite to the first wiring in the vicinity of both ends of the first wiring to be inspected, so that the first signal having a predetermined signal waveform is obtained. The first inspection signal is supplied in a non-contact manner near one end of the first wiring via the first power supply electrode, and at the same time, a second inspection signal having a waveform different from that of the first inspection signal is It is supplied in a non-contact manner near the other end of the first wiring via the second power supply electrode. Then, a signal induced in the first wiring is detected in a non-contact manner by the first and second inspection electrodes disposed in opposition to the first wiring in the vicinity of the first and second power supply electrodes. Whether or not the first wiring is conductive is determined according to the difference in signal.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments according to the present invention will be described below with reference to the drawings. In addition, about the same structure in each figure, the same code | symbol is attached | subjected and the description is abbreviate | omitted.
[0018]
FIG. 1 is a schematic diagram for explaining a configuration of a substrate inspection apparatus according to an embodiment of the present invention. The substrate inspection apparatus shown in FIG. 1 includes, for example, inspection signal sources 21 and 22, power supply electrodes 31 and 32, inspection plate 4, inspection electrodes 41, 42, 43, and 44, a control unit 5, amplifiers 61, 62, 63, and 64, A phase difference detection unit 65, 66, 67, a determination processing unit 7, a position detection processing unit 8, and a display unit 9 are provided. In FIG. 1, the substrate 1, the feeding electrodes 31 and 32, and the inspection electrodes 41, 42, 43, and 44 are shown in a state where the inspection plate 4 is seen through.
[0019]
The substrate 1 is a substrate to be inspected, for example, a glass substrate of a plasma display panel. On the surface of the substrate 1, wirings 101, 102, 103, 104, and 105 that are substantially linear wiring patterns are formed in the horizontal direction in parallel at substantially equal intervals. In addition, the board | substrate 1 should just be a board | substrate with which the wiring pattern which transmits an electric signal was formed in the surface, for example, the glass substrate of a liquid crystal panel, a printed wiring board, a flexible substrate, and TAB (Tape Automated Bonding) mounting of a semiconductor chip The film carrier etc. which are used for etc. may be sufficient.
[0020]
The inspection signal source 21 generates, for example, a sine wave signal having a predetermined frequency as the inspection signal 21 a and outputs it to the power supply electrode 31. The inspection signal source 22 generates an inspection signal 22 a obtained by delaying the phase angle of the inspection signal 21 a by 90 degrees, for example, and outputs the inspection signal 22 a to the power supply electrode 32. Note that the inspection signal 21a and the inspection signal 22a may be those in which the phase angle is shifted so that they do not cancel each other when they are combined. For example, the phase angle shift is 90 degrees, such as 45 degrees and 135 degrees. Other angles may be used.
[0021]
The power supply electrodes 31 and 32 are electrodes whose surfaces are covered with an insulating film, and are shaped to cover the wiring pattern when placed on the substrate 1. For example, when the wiring pattern to be inspected is the wiring 102, the power supply electrode 31 is placed at a position facing the wiring 102 and the wiring 101 adjacent to the wiring 102, and the static electricity generated between the wirings 102 and 101. The inspection signal 21a is supplied to the wirings 102 and 101 by the coupling. On the other hand, the power supply electrode 32 is placed at a position facing the wiring 102, and supplies the inspection signal 22 a to the wiring 102 by electrostatic coupling generated between the power supply electrode 32 and the wiring 102.
[0022]
The power supply electrode 31 may have a shape that covers three or more wiring patterns. Further, the power supply electrode 32 may have a shape that covers two or more wiring patterns. In this case, at the time of inspection, the power supply electrode 31 is disposed so as to face the adjacent wiring pattern with the wiring pattern to be inspected as the end, and the power supply electrode 32 has the wiring pattern to be inspected as the end of the power supply electrode 31. Are arranged so as to face the wiring pattern formed on the opposite side of the facing wiring pattern.
[0023]
As a result, it becomes possible to use large-sized electrodes that can supply the inspection signal to the wiring patterns other than the wiring patterns to be supplied with the inspection signals 21a and 22a, respectively. Even when a wiring pattern is inspected, it is possible to use electrodes with low processing accuracy as the feeding electrodes 31 and 32. Moreover, since it becomes possible to use the electrode of the same shape as the electric power feeding electrodes 31 and 32, the electric power feeding electrodes 31 and 32 can be comprised using the same member.
[0024]
The inspection electrodes 41, 42, 43, 44 are electrodes whose surfaces are covered with an insulating film, and have a shape that faces one wiring pattern when placed on the substrate 1. The feeding electrodes 31 and 32 and the inspection electrodes 41, 42, 43, and 44 are disposed on the surface of a substantially rectangular inspection plate 4 that covers the entire substrate 1 in the lateral direction, for example. Then, by placing the inspection plate 4 on the substrate 1, the feeding electrodes 31, 32 and the inspection electrodes 41, 42, 43, 44 are electrostatically contacted with the wirings 101, 102, 103, 104, 105 without contact. Can be combined.
[0025]
The inspection plate 4 can be moved in parallel with the wirings 101, 102, 103, 104, and 105 on the substrate 1 by a driving unit (not shown) driven according to a control signal from the control unit 5 described later, for example. Composed. In addition, the inspection electrodes 41, 42, 43, and 44 are positioned at positions facing substantially both end positions of the wiring 102 of the inspection plate 4 in a state where the inspection plate 4 is placed at the inspection position of the wiring 102 on the substrate 1, for example. Inspection electrodes 41 and 42 are provided, inspection electrodes 43 and 44 are provided at positions facing substantially both end positions of the wiring 101 adjacent to the wiring 102, and the feeding electrode 31 is provided at a position facing the wirings 102 and 101. The feed electrode 32 is provided at a position facing the wirings 102 and 103. Accordingly, for example, when the wiring 102 is inspected, the inspection electrode 43 and 44 are simultaneously wired by moving the position of the inspection plate 4 to a position where the inspection electrodes 41 and 42 are opposed to the wiring 102 by the driving unit. The power supply electrode 31 can be disposed at a position facing the wiring 101 and the wiring 102, and the power feeding electrode 32 can be disposed at a position facing the wiring 102 and the wiring 103.
[0026]
For example, when inspecting the wiring 103, the inspection electrode 43 and 44 are simultaneously connected to the wiring 102 by moving the position of the inspection plate 4 to a position where the inspection electrodes 41 and 42 face the wiring 103 by the drive unit. The power supply electrode 31 can be disposed at a position facing the wiring 102 and the wiring 103, and the power supply electrode 32 can be disposed at a position facing the wiring 103 and the wiring 104.
[0027]
Hereinafter, a case where the wiring 102 is inspected will be described as an example.
[0028]
The amplifier 61 amplifies the detection signal 41a guided from the inspection electrode 41 without changing the phase, and outputs the amplified signal to the phase difference detection unit 65, the phase difference detection unit 66, and the position detection processing unit 8. The amplifier 62 amplifies the detection signal 42 a guided from the inspection electrode 42 without changing the phase, and outputs the amplified signal to the phase difference detection unit 65, the phase difference detection unit 67, and the position detection processing unit 8. The amplifier 63 amplifies the detection signal 43 a guided from the inspection electrode 43 without changing the phase, and outputs the amplified signal to the phase difference detection unit 66. The amplifier 64 amplifies the detection signal 44 a guided from the inspection electrode 44 without changing the phase, and outputs the amplified signal to the phase difference detection unit 67.
[0029]
The phase difference detection unit 65 detects a phase difference between the signal output from the amplifier 61 and the signal output from the amplifier 62. For example, the sine wave signals having different phases from the amplifier 61 and the amplifier 62 are detected. Is output to the phase difference detection unit 65, the phase difference detection unit 65 detects the peak positions of these two sine wave signals, and compares the detection positions to detect the presence or absence of the phase difference. The phase difference detection unit 65 outputs the phase difference detection signal 65a to the determination processing unit 7 at a high level when there is a phase difference between the two sine wave signals, and detects the phase difference when there is no phase difference. The signal 65a is output to the determination processing unit 7 at a low level. In this case, when the phase difference is equal to or smaller than a predetermined phase angle, it is assumed that there is no phase difference. This makes it possible to eliminate the influence of signal detection errors and the like.
[0030]
The phase difference detection unit 65 is configured by, for example, a differential amplifier, and is input to the phase difference detection unit 65 when, for example, there is a difference in phase between these two signals output from the amplifier 61 and the amplifier 62. The phase difference detection signal 65a may be output to the determination processing unit 7 in accordance with the potential difference generated between the instantaneous voltages of the two signals. Specifically, when the potential difference between these signals exceeds a predetermined voltage value, the phase difference detection signal 65a is output at a high level to indicate that the phase angles of these signals are different. When the potential difference is equal to or less than a predetermined voltage value, the phase difference detection signal 65a is output at a low level to indicate that the phase angles of these signals are the same.
[0031]
The phase difference detection unit 66 detects a phase difference between the signal output from the amplifier 61 and the signal output from the amplifier 63. Similarly to the phase difference detection unit 65, the phase difference detection unit 66 When there is a phase difference, the phase difference detection signal 66a is output to the determination processing unit 7 at a high level, and when there is no phase difference between these signals, the phase difference detection signal 66a is output to the determination processing unit 7 at a low level. Output.
[0032]
The phase difference detection unit 67 detects a phase difference between the signal output from the amplifier 62 and the signal output from the amplifier 64. Similar to the phase difference detection unit 65, the phase difference detection unit 67 When there is a phase difference, the phase difference detection signal 67a is output to the determination processing unit 7 at a high level. When there is no phase difference between these signals, the phase difference detection signal 67a is output to the determination processing unit 7 at a low level. Output.
[0033]
Based on the phase difference detection signals 65a, 66a, and 67a output from the phase difference detection units 65, 66, and 67, the determination processing unit 7 determines the quality of the wiring pattern to be inspected. Specifically, when a high-level end wiring signal indicating that the wiring pattern to be inspected is the first wiring pattern at the end of the substrate 1, for example, the wiring 101, is received from the control unit 5, the phase difference When the detection signal 65a is at a low level, the wiring 101 is determined to be non-defective, and a quality determination signal indicating the determination result is output to the control unit 5 at a high level, while a low-level end wiring signal is received from the control unit 5. In this case, when the phase difference detection signal 65a is at a low level and the phase difference detection signals 66a and 67a are at a high level, for example, the wiring 102 to be inspected is determined as a non-defective product, and a pass / fail determination signal indicating the determination result is displayed. Output to the control unit 5 at a high level.
[0034]
The position detection processing unit 8 takes in the output signals of the amplifier 61 and the amplifier 62, determines whether or not the signal is a predetermined frequency signal, and the signals are both predetermined frequency signals. In addition, a positioning signal indicating that the inspection electrodes 41 and 42 are at positions facing the wiring pattern on the substrate 1 is output to the control unit 5. Specifically, the position detection processing unit 8 uses a bandpass filter or the like that passes the frequencies of the inspection signal 21a and the inspection signal 22a, for example, to output a predetermined frequency signal from the output signals of the amplifier 61 and the amplifier 62, that is, the inspection signal 21a. When a signal having substantially the same frequency as that of the inspection signal 22a is detected and detected from the output signals of both the amplifier 61 and the amplifier 62, the positioning signal is output to the control unit 5.
[0035]
The display unit 9 is a display device including a liquid crystal display panel, for example, and displays data output from the control unit 5. The control unit 5 includes, for example, a ROM (Read Only Memory) that stores a control program for the substrate inspection apparatus, a RAM (Random Access Memory) that temporarily stores data, and a microcomputer that executes the control program stored in the ROM. The control signal for driving the drive unit is output based on the positioning signal from the position detection processing unit 8 to move the position of the inspection plate 4 and position it at the inspection position.
[0036]
Further, when the control unit 5 inspects the first wiring pattern at the end of the substrate 1, the determination processing is performed by setting the end wiring signal indicating whether or not the wiring pattern to be inspected is the first wiring pattern to a high level. Send to part 7. Further, the control unit 5 outputs and displays data indicating the pass / fail determination result of the substrate 1 to the display unit 9 in accordance with a signal indicating the determination result obtained by the determination processing unit 7.
[0037]
Next, the operation of the substrate inspection apparatus configured as described above will be described. FIG. 2 is a flowchart for explaining the operation of the substrate inspection apparatus shown in FIG. FIGS. 3 and 4 are plan views showing the positional relationship between the substrate 1 and the inspection plate 4.
[0038]
First, before the inspection of the substrate 1 is started, the inspection plate 4 is arranged at a position not overlapping the substrate 1 as shown in FIG. When the inspection is started, a control signal for driving the driving unit is output from the control unit 5, and the inspection plate 4 is translated in the direction of the substrate 1 by the driving unit (step S1).
[0039]
Next, as shown in FIG. 4, when the inspection plate 4 moves and the inspection electrodes 41 and 42 are positioned to face the wiring 101, the inspection electrodes 41 and 42, the power feeding electrodes 31 and 32, and the wiring 101 are connected. Electrostatic coupling occurs. Then, signals induced in the wiring 101 by the inspection signals 21 a and 22 a supplied from the power supply electrodes 31 and 32 to the wiring 102 are guided to the amplifiers 61 and 62 through the inspection electrodes 41 and 42 and from the amplifiers 61 and 62. Since the signals are output to the position detection processing unit 8, the signals output from the amplifiers 61 and 62 are signals having substantially the same frequency as the inspection signal 21a and the inspection signal 22a. Therefore, the position detection processing unit 8 detects signals having substantially the same frequency as the inspection signal 21 a and the inspection signal 22 a from the output signals of both the amplifier 61 and the amplifier 62 and outputs a positioning signal to the control unit 5.
[0040]
Next, when the positioning signal is received by the control unit 5 (YES in step S2), the control unit 5 determines that the inspection plate 4 is disposed at the correct inspection position, and stops the driving of the driving unit. A signal is output and the inspection plate 4 is stopped (step S3).
[0041]
In this case, for example, if the inspection electrodes 41 and 42 are not correctly disposed at the inspection position facing the wiring 101 due to the positional relationship between the substrate 1 and the inspection plate 4 being inclined, the inspection electrode 41 and A signal having substantially the same frequency as that of the inspection signal 21a and the inspection signal 22a is not led from both of the inspection electrodes 42. Therefore, as described above, the inspection plate 4 can be positioned at the correct inspection position by stopping the inspection plate 4 in a state where the positioning signal is output from the position detection processing unit 8.
[0042]
Next, the control unit 5 determines whether or not the wiring pattern to be inspected is the wiring pattern to be inspected first. If it is the first wiring pattern (YES in step S4), the end wiring signal is set to the high level (step S4). On the other hand, if the wiring pattern is the second or later wiring pattern to be inspected (NO in step S4), after the end wiring signal is set to the low level (step S6), step S7 is performed to inspect the inspection target wiring pattern. Migrate to Therefore, when the wiring 101 is the inspection target, the end wiring signal is set to the high level.
[0043]
Next, a continuity test of the wiring 101 is performed in step S7. FIG. 5 is a diagram for explaining signal waveforms of the inspection signals 21a and 22a and the detection signals 41a, 42a, 43a, and 44a. First, a sinusoidal inspection signal 21a is output from the inspection signal source 21 to the power supply electrode 31, and an inspection signal 22a obtained by delaying the phase angle of the inspection signal 21a from the inspection signal source 22 by 90 degrees is the power supply electrode 32.
Is output.
[0044]
When the wiring 101 is conductive, the electrostatic coupling is performed from the feeding electrode 31 and the feeding electrode 32.
Then, the inspection signal 21a and the inspection signal 22a are supplied to the wiring 101, and the inspection signal 21a and the inspection signal 22a are combined in the wiring 101, that is, the inspection signal 21a has a phase angle approximately 45 degrees ahead of the inspection signal 21a. A signal having a waveform indicated by a waveform A in FIG. 5 having a phase angle approximately 45 degrees behind 22a is induced.
[0045]
Next, the waveform A signal induced in the wiring 101 is guided to the amplifiers 61 and 62 as the detection signals 41a and 42a through the electrostatic coupling by the inspection electrodes 41 and 42, respectively. At this time, the detection signals 41a and 42a are signals having the same phase shown by the waveform A. Accordingly, the signals output from the amplifiers 61 and 62 to the phase difference detection unit 65 are also in phase with each other. As a result, a low level phase difference detection signal 65 a is output from the phase difference detection unit 65 to the determination processing unit 7. .
[0046]
Next, since the determination processing unit 7 receives the high-level end wiring signal and receives the low-level phase difference detection signal 65a from the phase difference detection unit 65, the wiring 101 is determined to be non-defective, and the pass / fail determination signal Is output to the control unit 5 at a high level.
[0047]
On the other hand, when the wiring 101 is disconnected at the position of the broken line X shown in FIG. 4, for example, the inspection electrode 21 a supplied from the power supply electrode 31 to the wiring 101 via the electrostatic coupling causes the power supply electrode 31 from the disconnected position. A signal having the same phase as the inspection signal 21 a, that is, a signal indicated by the waveform B in FIG. 5 is induced in the wiring 101 on the side, while the inspection signal 22 a supplied from the power supply electrode 32 to the wiring 101 through electrostatic coupling is induced. Then, a signal having the same phase as the inspection signal 22a, that is, a signal indicated by the waveform C in FIG.
[0048]
Next, the inspection electrode 41 disposed on the power supply electrode 31 side from the disconnection point guides the signal of the waveform B to the amplifier 61 as the detection signal 41a, and on the other hand, the inspection electrode 42 disposed on the power supply electrode 32 side from the disconnection point. Thus, the signal of the waveform C is guided to the amplifier 62 as the detection signal 42a. Therefore, the signal output from the amplifier 61 to the phase difference detection unit 65 is a waveform B signal, and the signal output from the amplifier 62 to the phase difference detection unit 65 is a waveform C signal. Since the signal is 90 degrees out of phase, the phase difference detection signal 65a is output from the phase difference detection unit 65 to the determination processing unit 7 at a high level.
[0049]
Next, since the determination processing unit 7 receives the high-level end wiring signal from the control unit 5 and the phase difference detection unit 65 receives the high-level phase difference detection signal 65a, the wiring 101 is determined to be defective. Then, the pass / fail judgment signal is output to the control unit 5 at a low level indicating failure.
[0050]
Next, the process proceeds to step S8, and when the pass / fail determination signal obtained by the determination processing unit 7 is at a low level (NO in step S8), the control unit 5 displays data indicating that the wiring 101 is defective. A display screen indicating that the substrate 1 is defective is displayed on the display unit 9 (step S9), and the inspection of the substrate 1 is finished.
[0051]
On the other hand, when the pass / fail determination signal obtained by the determination processing unit 7 is at a high level (YES in step S8), the control unit 5 determines whether the inspection target pattern is the last wiring pattern of the substrate 1, and the last wiring If it is a pattern (YES in step S10), data indicating that the wiring 101 is non-defective is transmitted from the control unit 5 to the display unit 9, and a display screen indicating that the substrate 1 is non-defective is displayed on the display unit 9. Displayed (step S11), the inspection of the substrate 1 is finished.
[0052]
If it is not the last wiring pattern (NO in step S10), the process proceeds to step S1 to inspect the next wiring pattern. Now, since the wiring pattern to be inspected is the wiring 101, the process proceeds to step S1, and the processing of steps S1 to S3 moves the inspection plate 4 in parallel to further inspect the wiring 102 to be inspected next. As shown in FIG. 1, the inspection plate 4 is disposed at the inspection position of the wiring 102. Further, since the wiring 102 is the wiring pattern to be inspected second, the end wiring signal is set to the low level by the processing in steps S4 and S6.
[0053]
Next, in step S7, the inspection is executed with the wiring 102 as an inspection target. First, the operation will be described for a case where the wiring 102 is a non-defective product, that is, a case where the wiring 102 is not disconnected and there is no short circuit between the wiring 101 and the wiring 102.
[0054]
First, the phase difference detection signal 65a is output at a low level from the phase difference detection unit 65 to the determination processing unit 7 by the same operation as in the case of the continuity inspection of the wiring 101 described above. Further, the following operation is performed in order to confirm the presence or absence of a short circuit between the wiring 102 and the wiring 101. That is, the inspection signal source 21 outputs a sinusoidal inspection signal 21 a to the power supply electrode 31, and the inspection signal source 22 outputs an inspection signal 22 a obtained by delaying the phase angle of the inspection signal 21 a by 90 degrees to the power supply electrode 32.
[0055]
Then, the inspection signal 21 a and the inspection signal 22 a are supplied from the power supply electrode 31 and the power supply electrode 32 to the wiring 102 through electrostatic coupling, respectively, and a signal of the waveform A obtained by synthesizing the two signal waveforms is induced on the wiring 102. Is done. Further, the inspection signal 21 a is supplied from the power supply electrode 31 to the wiring 101 through electrostatic coupling, and a signal having a waveform B having the same phase as the inspection signal 21 a is induced in the wiring 101.
[0056]
Next, the signal of the waveform A induced in the wiring 102 is received by the phase difference detection unit 66 via the inspection electrode 41 and the amplifier 61, and at the phase difference detection unit 67 via the inspection electrode 42 and the amplifier 62. Received. On the other hand, the signal of the waveform B induced in the wiring 101 is received by the phase difference detection unit 66 through the inspection electrode 43 and the amplifier 63, and is received by the phase difference detection unit 67 through the inspection electrode 44 and the amplifier 64. Is done.
[0057]
As a result, the phase difference detection unit 66 and the phase difference detection unit 67 receive the signal indicated by the waveform A and the signal indicated by the waveform B, respectively. Since there is a phase difference of 45 degrees between the signal indicated by waveform A and the signal indicated by waveform B, the phase difference detection signal 66a is set to the high level by the phase difference detection unit 66. The phase difference detection signal 67a is output to the determination processing unit 7 at a high level by the phase difference detection unit 67.
[0058]
Next, the determination processing unit 7 determines the quality of the wiring 102. That is, the determination processing unit 7 receives the low-level end wiring signal, the low-level phase difference detection signal 65a, and the high-level phase difference detection signals 66a and 67a. A high level pass / fail judgment signal indicating that the wiring 102 is non-defective is output.
[0059]
Next, the operation will be described for the case where the wiring 102 is disconnected at the position indicated by the broken line Y. When the wiring 102 is disconnected at the position indicated by the broken line Y, first, similarly to the case where the wiring 101 is disconnected at the position indicated by the broken line X, the phase difference detection signal 65a is output from the phase difference detection unit 65. Is output to the determination processing unit 7 at a high level.
[0060]
Further, the inspection signal 21a is supplied from the power supply electrode 31 to the wiring 102 on the power supply electrode 31 side from the disconnection position indicated by the broken line Y, and a signal having a waveform B having the same phase as that of the inspection signal 21a is induced. Is done. Then, the signal having the waveform B is received by the phase difference detection unit 66 via the inspection electrode 41 and the amplifier 61. In addition, the inspection signal 22a is supplied from the power supply electrode 32 to the wiring 102 on the power supply electrode 32 side from the disconnection position indicated by the broken line Y, and a signal having a waveform C having the same phase as that of the inspection signal 22a is induced. Is done. Then, the signal having the waveform C is received by the phase difference detection unit 67 via the inspection electrode 42 and the amplifier 62.
[0061]
In addition, the inspection signal 21a is supplied to the wiring 101 from the power supply electrode 31 via electrostatic coupling, and a signal having a waveform B having the same phase as that of the inspection signal 21a is induced. The waveform B signal is received by the phase difference detection unit 66 via the inspection electrode 43 and the amplifier 63, and is also received by the phase difference detection unit 67 via the inspection electrode 44 and the amplifier 64.
[0062]
Thereby, in the phase difference detection unit 66, the signal of the waveform B is received from both the amplifier 61 and the amplifier 63, and there is no phase difference between the two signals. The phase difference detection signal 66a is output at a low level. The phase difference detection unit 67 receives the waveform C signal and the waveform B signal. Since there is a phase difference of 90 degrees between the two signals, the phase difference detection unit 67 sends the signal to the determination processing unit 7. The phase difference detection signal 67a is output at a high level.
[0063]
Next, the determination processing unit 7 determines the quality of the wiring 102. That is, the determination processing unit 7 receives the low-level end wiring signal, the high-level phase difference detection signal 65a, the low-level phase difference detection signal 66a, and the high-level phase difference detection signal 67a, and receives the phase difference detection signal. Since 65a is at a high level, disconnection of the wiring 102 is detected, and a low-level pass / fail judgment signal indicating that the wiring 102 is defective is output from the determination processing unit 7 to the control unit 5.
[0064]
Next, the operation will be described for the case where the wiring 101 and the wiring 102 are short-circuited at the position indicated by the broken line Z. First, as in the case where the wiring 102 is a non-defective product, the inspection signal 21a and the inspection signal 22a are supplied to the wiring 102 from the power supply electrode 31 and the power supply electrode 32 via electrostatic coupling, respectively, and the two signal waveforms are obtained. A combined waveform A signal is induced on the wiring 102. Since the wiring 102 and the wiring 101 are short-circuited at the position indicated by the broken line Z, a signal having the same waveform A as that of the wiring 102 is also induced in the wiring 101.
[0065]
For this reason, the signals input from the inspection electrodes 41, 42, 43, 44 to the phase difference detectors 65, 66, 67 via the amplifiers 61, 62, 63, 64 are all signals having the same waveform A. Therefore, the phase difference detection signals 65a, 66a, and 67a output from the phase difference detection units 65, 66, and 67 are all output at a low level.
[0066]
Next, the determination processing unit 7 determines the quality of the wiring 102. That is, the determination processing unit 7 receives the low-level end wiring signal and the low-level phase difference detection signals 65a, 66a, and 67a, and the phase difference detection signals 66a and 67a are at the low level. A short circuit with the wiring 102 is detected, and a low-level quality determination signal indicating that the wiring 102 is defective is output from the determination processing unit 7 to the control unit 5. The determination processing unit 7 detects a short circuit between the wiring 101 and the wiring 102 without checking the level of the phase difference detection signal 67a by detecting that the phase difference detection signal 66a is at a low level. It is good also as a structure.
[0067]
Next, when the disconnection failure and the short-circuit failure of the wiring 102 are combined, for example, the wiring 102 is disconnected at the position indicated by the broken line Y, and the wiring 101 and the wiring 102 are short-circuited at the position indicated by the broken line Z. For the case, the operation will be described.
[0068]
First, the inspection signal 21a is supplied from the power supply electrode 31 through the electrostatic coupling to the wiring 102 on the power supply electrode 31 side from the disconnection position indicated by the broken line Y, and a signal having a waveform B having the same phase as that of the inspection signal 21a is induced. Is done. The waveform B signal is received by the phase difference detection units 65 and 66 via the inspection electrode 41 and the amplifier 61.
[0069]
On the other hand, the wiring 102 on the power supply electrode 32 side from the disconnection position indicated by the broken line Y and the wiring 101 are broken lines.
Conduction is caused by a short circuit at a position indicated by Z, and the same potential is obtained. Accordingly, the inspection signal 21a supplied from the power supply electrode 31 to the wiring 101 via the electrostatic coupling and the power supply electrode 32 to the wiring 102 on the power supply electrode 32 side from the disconnection position indicated by the broken line Y via the electrostatic coupling. The inspection signal 22a is synthesized through a short-circuit portion indicated by a broken line Z, and the signal of the waveform A obtained by synthesizing the two signals is connected to the wiring 102 and the wiring 101 on the power supply electrode 32 side from the disconnection position indicated by the broken line Y. Induced by
[0070]
As a result, the signals input from the inspection electrodes 42, 43, 44 to the phase difference detection units 65, 66, 67 via the amplifiers 62, 63, 64, respectively, are signals having the same waveform A. Therefore, the phase difference detection unit 65 receives the waveform B signal from the amplifier 61 and the waveform A signal from the amplifier 62, and there is a 45 degree phase difference between the two signals. The detection unit 65 outputs the phase difference detection signal 65a to the determination processing unit 7 at a high level.
[0071]
The phase difference detector 66 receives the waveform B signal from the amplifier 61 and the waveform A signal from the amplifier 63, and there is a 45 degree phase difference between the two signals. The detection unit 66 outputs the phase difference detection signal 66a to the determination processing unit 7 at a high level.
[0072]
Further, in the phase difference detection unit 67, the signal of the waveform A is received from the amplifier 62 and the amplifier 64, and both of them become signals of the same waveform A. Therefore, the phase difference detection unit 67 sends the phase difference to the determination processing unit 7. The detection signal 67a is output at a low level.
[0073]
Next, the determination processing unit 7 determines the quality of the wiring 102. That is, the determination processing unit 7 receives the low-level end wiring signal, the high-level phase difference detection signals 65a and 66a, and the low-level phase difference detection signal 67a, and the phase difference detection signal 65a is at the high level. As a result, disconnection of the wiring 101 is detected, and since the phase difference detection signal 67a is at a low level, a short circuit between the wiring 101 and the wiring 102 is detected, and the determination processing unit 7 transfers the wiring to the control unit 5. A low-level pass / fail judgment signal indicating that 102 is a defective product is output.
[0074]
As a result, even if the defect state of the wiring 102 is any one of a defect of only disconnection, a defect of only a short circuit with the wiring 101, and a defect in which a short circuit with the wiring 101 and a disconnection of the wiring 102 are combined. The presence or absence of can be detected.
[0075]
In addition, since a disconnection failure is detected by detecting a phase difference between signals detected by the inspection electrodes 41 and 42 at substantially both end positions of the wiring 102, the wiring 102 is adjacent to the wiring 102 via electrostatic coupling. Even when a signal is supplied to the wiring 102, the phase of the signal induced in the wiring 102 is not changed by the influence thereof, so that the quality of the conduction state of the wiring 102 can be more reliably determined. It becomes possible.
[0076]
In addition, since the short circuit failure between the wirings is detected by detecting the phase difference between the signals induced in the wiring 102 and the wiring 101, the wiring 102 and the wiring adjacent to the wiring 102 are connected via electrostatic coupling. Even when a signal is supplied to the wiring 102, the phase of the signal induced in the wiring 101 and the wiring 102 is not matched due to the influence thereof, so that the wiring 102 and the wiring 101 are more reliably connected. It is possible to determine whether or not there is a short circuit.
[0077]
In addition, the quality of the wiring 102 is determined using the phase of the signal instead of the voltage level of the signal obtained from the inspection electrodes 41, 42, 43, 44. The distance between the wirings 101 and 102 and the inspection electrodes 41, 42, 43, 44 is less affected by the change in capacitance due to the change in the distance between the inspection electrodes 41, 42, 43, 44. The positioning accuracy can be reduced.
[0078]
Next, returning to FIG. 2, the processes of steps S8 to S11 are executed, and the inspection of the substrate 1 is completed.
[0079]
In addition, although the example which uses the signal of the sine wave from which the phase mutually differed as the test | inspection signal 21a and the test | inspection signal 22a was shown, the test | inspection signal 21a and the test | inspection signal 22a should just synthesize | combine and become a mutually different signal. For example, a signal such as a triangular wave having different phase angles may be used. Further, signals having different frequencies are used as the inspection signal 21a and the inspection signal 22a, and whether or not the signal obtained from the wiring pattern includes a signal component having substantially the same frequency as that of the inspection signal 21a and the inspection signal 22a is, for example, a bandpass filter. For example, the difference between signals may be detected based on the presence or absence of the frequency component.
[0080]
The inspection signal 21a and the inspection signal 22a are not limited to periodic signals. For example, a signal whose voltage changes sharply is used as the inspection signal 21a, and a signal whose change timing is shifted is used as the inspection signal 22a. A difference between the signals may be detected according to the presence / absence of a signal induced in the pattern and the timing thereof.
[0081]
For example, when the wiring 102 is an inspection target, the feeding electrode 31 is configured by two electrodes, an electrode facing the wiring 102 and an electrode facing the wiring 101, and an inspection signal 21 a is sent to each of the two electrodes. The structure which supplies may be sufficient.
[0082]
【The invention's effect】
According to the first aspect of the present invention, it is possible to eliminate the influence of the capacitance between adjacent wirings, so that it is possible to more reliably determine whether the first wiring is conductive.
[0083]
Also The presence or absence of a short circuit between the first wiring and the second wiring can be determined according to the difference in the detection signal from each inspection electrode.
[0084]
Also Since an electrode having a larger size can be used as the feeding electrode, the feeding electrode can be easily manufactured and handled.
[0085]
Also Since the same thing can be used as the first feeding electrode and the second feeding electrode, the manufacturing cost of the feeding electrode can be reduced.
[0086]
Claim 2 According to the invention described above, since the difference between the detection signals is obtained as the presence or absence of a phase shift of the periodic signal, the difference between the detection signals is detected based on the presence or absence of a phase difference between the detection signals. can do.
[0087]
Claim 3 According to the invention described in (1), since the determination can be performed when both the first and second inspection electrodes are arranged at positions facing the first wiring, the first with respect to the determination The influence of the positional relationship between the second inspection electrode and the first wiring can be reduced.
[0088]
Claim 6 Since the influence by the electrostatic capacitance between adjacent wiring can be excluded according to invention described in (1), the presence or absence of conduction | electrical_connection of a 1st wiring can be determined more reliably.
[Brief description of the drawings]
FIG. 1 is a schematic diagram for explaining a configuration of a substrate inspection apparatus according to an embodiment of the present invention.
FIG. 2 is a flowchart for explaining the operation of the substrate inspection apparatus shown in FIG.
FIG. 3 is a plan view showing a positional relationship between a substrate 1 and an inspection plate 4;
FIG. 4 is a plan view showing the positional relationship between a substrate 1 and an inspection plate 4;
FIG. 5 is a diagram for explaining signal waveforms of inspection signals 21a and 22a and detection signals 41a, 42a, 43a, and 44a.
[Explanation of symbols]
1 Substrate
21 and 22 inspection signal source (inspection signal supply means)
31 Feeding electrode (first feeding electrode)
32 Feeding electrode (second feeding electrode)
4 Inspection plate
41 Inspection electrode (first inspection electrode)
42 Inspection electrode (second inspection electrode)
43,44 inspection electrode (third inspection electrode)
5 Control unit
61, 62, 63, 64 Amplifier
65, 66, 67 Phase difference detector
7 Judgment processing part (first and second inspection means)
8 Position detection processing unit
9 Display

Claims (6)

A substrate inspection apparatus for inspecting a wiring formed on a substrate surface, wherein first and second power supply electrodes disposed opposite to the first wiring in the vicinity of both ends of the first wiring to be inspected, An inspection for supplying a first inspection signal having a predetermined signal waveform to the first power supply electrode and simultaneously supplying a second inspection signal having a waveform different from that of the first inspection signal to the second power supply electrode. Signal detection means, first and second inspection electrodes arranged opposite to the first wiring in the vicinity of the first and second power supply electrodes, and each detection from the first and second inspection electrodes First inspection means for determining whether or not the first wiring is conductive according to the difference in signal;
The second test signal, if it is combined with the first test signal in the line state, and are not made to different signals and the first and second test signal and without cancel each other,
A third power supply electrode disposed opposite to the second wiring adjacent to the first wiring and supplied with one of the first and second inspection signals; and the second wiring and the first inspection. A third inspection electrode opposed to the second wiring in the vicinity of the end on the end side where the electrode is opposed; the first inspection electrode; the third inspection electrode; the second inspection electrode; Second inspection means for determining whether or not there is a short circuit between the first wiring and the second wiring in accordance with the difference in detection signal from each inspection electrode in any one of the three inspection electrodes,
The third feeding electrode is integral with the first feeding electrode;
A plurality of the wirings are formed on the substrate surface at a constant pitch, and the second power supply electrode has the same shape as the first power supply electrode, and the second power supply electrode is sandwiched between the second power supply electrode and the second power supply electrode. A board inspection apparatus, wherein the board inspection apparatus is arranged to be shifted by one pitch on the side opposite to the wiring . 2. The substrate inspection apparatus according to claim 1, wherein the first and second inspection signals are obtained by shifting the phase of the periodic signal by a predetermined angle. The first and second inspection signals are periodic signals having different frequencies.
  The substrate inspection apparatus according to claim 1. The first and second inspection signals are signals whose voltage changes abruptly, and the second inspection signal is a signal whose change timing is shifted from that of the first inspection signal.
  The substrate inspection apparatus according to claim 1. The said 1st test | inspection means performs the said determination, when a signal is detected by both the said 1st and 2nd test | inspection electrodes, The one in any one of Claims 1-4 characterized by the above-mentioned. Board inspection equipment. A substrate inspection method for inspecting a wiring formed on a substrate surface, wherein first and second power supply electrodes are arranged opposite to the first wiring in the vicinity of both ends of the first wiring to be inspected, Supplying a first inspection signal having a predetermined signal waveform to the first power supply electrode and simultaneously supplying a second inspection signal having a waveform different from that of the first inspection signal to the second power supply electrode; In the vicinity of the first and second power supply electrodes, the first and second inspection electrodes are arranged opposite to the first wiring, and according to the difference between the detection signals from the first and second inspection electrodes. Determining whether or not the first wiring is conductive;
When the second inspection signal is combined with the first inspection signal in the wiring, the second inspection signal does not cancel each other and is different from the first and second inspection signals.
A third feeding electrode to which one of the first and second inspection signals is supplied is disposed opposite to the second wiring adjacent to the first wiring;
The third inspection electrode is opposed to the second wiring in the vicinity of the end portion on the end portion side of the second wiring where the first inspection electrode is opposed,
The first wiring and the second inspection electrode according to the difference in detection signal from each inspection electrode in any one of the first inspection electrode, the third inspection electrode, and the second inspection electrode and the third inspection electrode. To determine whether there is a short circuit between
The third feeding electrode is integral with the first feeding electrode;
A plurality of the wirings are formed on the substrate surface at a constant pitch, the second power supply electrode has the same shape as the first power supply electrode, and the second power supply electrode is connected to the first power supply electrode. A substrate inspection method characterized by disposing the first wiring on the opposite side of the second wiring by one pitch .

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