JP4242118B2 - Thermoelectric conversion module - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention includes, for example, optical communication parts, physics and chemistry equipment, portable coolers, thermoelectric conversion modules that are used for process temperature management in semiconductor processes and the like, and thermoelectric modules that generate electricity using the Seebeck effect. It concerns the conversion module.
[0002]
[Background]
For example, thermoelectric conversion modules such as Peltier modules as shown in FIG. 4 are used in various fields such as the optical communication field. The thermoelectric conversion module is formed by vertically arranging a plurality of thermoelectric conversion elements 5 (5a, 5b) between two substrates 6 and 7 that are arranged to face each other with a gap therebetween.
[0003]
In the present specification, “up and down” in the expression “substrates arranged opposite to each other with a gap therebetween” means up and down in a posture state as shown in FIG. 4, and a thermoelectric conversion module is used. There is no limitation on the posture.
[0004]
The substrates 6 and 7 are ceramic substrates such as alumina (Al ₂ O ₃ ) having electrical insulation, and a plurality of conductive electrodes 2 are formed on the opposing surfaces of the substrates 6 and 7 with a space between each other. In addition, the electrode 2 on the surface of the upper substrate 6 and the electrode 2 on the surface of the lower substrate 7 are formed in a state where the positions of the forming electrodes 2 are shifted from each other.
[0005]
The thermoelectric conversion elements 5 are connected in series via the corresponding electrodes 2, and a connection circuit for the thermoelectric conversion elements 5 is formed. In addition, the thermoelectric conversion element 5 is being fixed to the electrode 2 with the solder which is not illustrated, for example.
[0006]
The thermoelectric conversion element 5 (5a, 5b) is generally known as a Peltier element, and a P-type thermoelectric conversion element 5a formed of a P-type semiconductor and an N-type thermoelectric conversion formed of an N-type semiconductor. And an element 5b. P-type thermoelectric conversion elements 5a and N-type thermoelectric conversion elements 5b are alternately arranged and connected in series via the electrode 2 to form a PN element pair.
[0007]
The P-type thermoelectric conversion element 5a and the N-type thermoelectric conversion element 5b are each formed by adding an element such as antimony or selenium to an intermetallic compound such as bismuth or tellurium. One thermoelectric conversion element 5 has a diameter of about 0.6 to 3 mm and a length of about 0.5 to 3 mm. Moreover, the said board | substrates 6 and 7 are formed in thickness about 3 mm, for example.
[0008]
For example, the lead wire 10 is soldered and connected to the electrode 2 (2 a) formed on the lower substrate 7 and located at the end of the connection circuit of the thermoelectric conversion element 5. In this thermoelectric conversion module, when a current is passed from the lead wire 10 to the electrode 2a by energization means (not shown), a current flows through the P-type thermoelectric conversion element 5a and the N-type thermoelectric conversion element 5b.
[0009]
And a cooling and heating effect arises in the junction part (interface) of thermoelectric conversion element 5 (5a, 5b) and electrode 2. FIG. That is, a so-called Peltier effect is generated in which one end portion of the thermoelectric conversion element 5 (5a, 5b) is heated while the other end portion is cooled depending on the direction of the current flowing through the junction.
[0010]
When one end, for example, the upper end of the thermoelectric conversion element 5 (5a, 5b) is caused to generate heat by the Peltier effect, this heat is transferred to the member provided on the upper side of the substrate 6 via the upper substrate 6. The member is heated. Conversely, when the upper end portion of the thermoelectric conversion element 5 (5a, 5b) is cooled by the Peltier effect, the member provided on the upper side of the substrate 6 is cooled (heat absorption) via the substrate 6. .
[0011]
[Problems to be solved by the invention]
By the way, the thermoelectric conversion module as shown in FIG. 3 is proposed in the above thermoelectric conversion modules. 3A is a plan view showing an electrode forming surface of the upper substrate 6 of the proposed thermoelectric conversion module, and FIG. 3B is a view showing the thermoelectric conversion module through the upper substrate 6 as a watermark. (C) of the figure is a side view of the thermoelectric conversion module.
[0012]
In the proposed thermoelectric conversion module, a current path 1a for passing a current to the electrode 2 and the thermoelectric conversion element 5 (5a, 5b) provided on one end of the substrates 6 and 7 and the remaining regions of the substrates 6 and 7 are provided. A current path 1b for passing a current is provided in the provided electrode 2 and thermoelectric conversion element 5 (5a, 5b), and these current paths 1a, 1b are connected in parallel.
[0013]
In FIG. 3B, for ease of explanation, the current path 1b is shown by a broken line, but the current path 1b is also a continuous path in the same manner as the current path 1a.
[0014]
However, the resistance value on the current path 1a side and the resistance value on the current path 1b side are slightly different due to subtle manufacturing errors of the electrode 2 and the thermoelectric conversion element 5, and the current flow due to this subtle difference. The difference occurs. Then, for example, the upper surface of the substrate 6 of the thermoelectric conversion module has a temperature distribution that is biased during operation of the thermoelectric conversion module.
[0015]
In addition, in the configuration shown in FIG. 3, when one of the current paths 1a and 1b fails, a remarkable temperature distribution failure or temperature distribution abnormality occurs, which may affect the equipment cooled by the thermoelectric conversion module. Thus, there arises a problem that reliability is impaired.
[0016]
The present invention has been made to solve the above problems, and an object of the present invention is to provide a thermoelectric conversion module having a highly uniform temperature distribution of a substrate and high reliability.
[0017]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration as means for solving the problems. That is, the present invention has two substrates that are vertically opposed to each other with a gap therebetween, and a plurality of electrodes are formed on the opposite surfaces of these substrates with a gap therebetween. The electrode and the electrode on the lower substrate surface are formed in a state where the positions of the forming electrodes are shifted from each other, and a plurality of thermoelectric conversion elements are arranged between the substrates, and adjacent thermoelectric conversion elements correspond to the corresponding electrodes. A plurality of independent current paths are formed that are sequentially connected to each other and flow currents to the electrodes and the thermoelectric conversion elements, and the current paths are arranged in parallel and connected in parallel to each other , and the electrode forming surface of the substrate It is a means for solving the problems with a configuration that is routed throughout.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of the present embodiment, the same reference numerals are assigned to the same names as those in the conventional example, and the duplicate description is omitted or simplified.
[0019]
FIG. 1 shows an embodiment of a thermoelectric conversion module according to the present invention. As shown in FIG. 1C, the thermoelectric conversion module of this embodiment is also similar to the conventional example. Two substrates 6, 7 disposed above and below at intervals, a plurality of electrodes 2 formed on the opposing surfaces of these substrates 6, 7, and a plurality of devices erected between the substrates 6, 7 Thermoelectric conversion element 5 (5a, 5b).
[0020]
1A is a plan view of the electrode forming surface of the substrate 6, and FIG. 1B is a plan view showing the thermoelectric conversion module in a state where the upper substrate 6 is seen through. (C) of a figure is a side view of the thermoelectric conversion module of this embodiment.
[0021]
As shown in FIG. 1B, the thermoelectric conversion module according to the present embodiment is characterized in that adjacent thermoelectric conversion elements 5 (5a, 5b) are sequentially connected via corresponding electrodes 2, A plurality of (in this case, two) independent current paths 1 (1a, 1b) for flowing current to the thermoelectric conversion elements 5 (5a, 5b) are formed, and the current paths 1 (1a, 1b) are arranged in parallel with each other. It is provided and routed over the entire electrode formation surface of the substrates 6 and 7.
[0022]
The current paths 1a and 1b are branched by electrodes 2a1 and 2a2 formed on the substrate 7, and are connected in parallel to each other . Further, the current paths 1a and 1b are arranged in parallel from one end side 11 to the other end side 12 of the substrates 6 and 7, and are formed by sequentially folding back at the one end side 11 and the other end side 12 of the substrates 6 and 7. .
[0023]
In FIG. 1B, for ease of explanation, the current path 1b is indicated by a broken line, but the current path 1b is also a continuous path in the same manner as the current path 1a.
[0024]
The present embodiment is configured as described above, and the two current paths 1a and 1b are arranged in parallel with each other and are routed over the entire electrode formation surface of the substrates 6 and 7, so that the current path 1a side And the resistance value on the current path 1b side are slightly different, and even if a difference in current flow occurs due to this delicate difference, for example, it is possible to suppress the deviation of the upper surface temperature of the substrate 6 of the thermoelectric conversion module. .
[0025]
Further, according to the present embodiment, even if either one of the current paths 1a and 1b fails, a remarkable temperature distribution failure or temperature distribution abnormality occurs as in the thermoelectric conversion module shown in FIG. There is nothing, and a highly reliable thermoelectric conversion module can be realized.
[0026]
In addition, this invention is not limited to the said embodiment example, Various aspects can be taken. For example, in the above embodiment, the two current paths 1a and 1b are provided, but three or more independent current paths 1 may be provided to form a thermoelectric conversion module. Again, by parallel connection of three or more independent current paths 1 and parallel to each other, the wire laying formed over the entire electrode formation surface of the substrate 6, to achieve the same effect as the above embodiment Can do.
[0027]
Further, the formation mode of the current path 1 is not limited to the above-described embodiment example, and is appropriately set. For example, in the mode as shown in FIG. You may arrange | position the electric current path | route 1 (here 1a, 1b).
[0028]
Furthermore, in the above description, the example in which the thermoelectric conversion module is cooled and heated by the Peltier effect has been described. However, the thermoelectric conversion module of the present invention is also applied to the thermoelectric conversion module that generates power using the Seebeck effect. it can.
[0029]
【The invention's effect】
According to the present invention, adjacent thermoelectric conversion elements provided between the upper and lower substrates of the thermoelectric conversion module are sequentially connected via the corresponding electrodes 2 to form a plurality of independent current paths. Since they are arranged side by side and connected in parallel and routed over the entire electrode formation surface of the substrate, the resistance values of each current path are slightly different, and this current difference causes a difference in current flow. Moreover, it can suppress that the temperature of the board | substrate of a thermoelectric conversion module is biased.
[0030]
Further, according to the present invention, even if any of the plurality of independent current paths fails, a remarkable temperature distribution failure or temperature distribution abnormality does not occur, and a highly reliable thermoelectric conversion module is realized. can do.
[Brief description of the drawings]
FIG. 1 is a main part configuration diagram schematically showing an embodiment of a thermoelectric conversion module according to the present invention.
FIG. 2 is an explanatory view schematically showing a current path formed in another embodiment of a thermoelectric conversion module according to the present invention.
FIG. 3 is an explanatory diagram showing a proposed example of a thermoelectric conversion module provided with two current paths for passing current to an electrode and a thermoelectric conversion element in the thermoelectric conversion module.
FIG. 4 is an explanatory view showing an example of a conventional thermoelectric conversion module in a side view.
[Explanation of symbols]
1, 1a, 1b Current path 2 Electrodes 5, 5a, 5b Thermoelectric conversion elements 6, 7 Substrate

Claims (1)

It has two substrates that are vertically opposed to each other with a gap between them, and a plurality of electrodes are formed on the opposite surfaces of these substrates with a gap between them. The electrodes on the upper substrate surface and the lower substrate surface The electrodes are formed in a state where the positions of the forming electrodes are shifted from each other, and a plurality of thermoelectric conversion elements are erected between the substrates, and adjacent thermoelectric conversion elements are sequentially connected via corresponding electrodes. A plurality of independent current paths for passing current to the electrode and the thermoelectric conversion element are formed, the current paths are arranged in parallel to each other, connected in parallel, and routed over the entire electrode formation surface of the substrate. A thermoelectric conversion module characterized by comprising:

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