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JP4122791B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP4122791B2
JP4122791B2 JP2002037290A JP2002037290A JP4122791B2 JP 4122791 B2 JP4122791 B2 JP 4122791B2 JP 2002037290 A JP2002037290 A JP 2002037290A JP 2002037290 A JP2002037290 A JP 2002037290A JP 4122791 B2 JP4122791 B2 JP 4122791B2
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JP
Japan
Prior art keywords
light
light emitting
ceramic substrate
emitting element
wavelength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002037290A
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Japanese (ja)
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JP2003243717A (en
Inventor
拓磨 橋本
渉 野田
勝 杉本
英二 塩濱
秀吉 木村
良幸 内野々
俊之 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
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Publication date
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Priority to JP2002037290A priority Critical patent/JP4122791B2/en
Publication of JP2003243717A publication Critical patent/JP2003243717A/en
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Publication of JP4122791B2 publication Critical patent/JP4122791B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Led Devices (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、発光ダイオードのような発光素子を用いた発光装置に関するものである。
【0002】
【従来の技術】
近年、小型、軽量、省電力といった特徴を生かして、表示用光源や小型電流の代替、あるいは液晶パネル用光源等に発光素子(例えば、発光ダイオード)を用いた発光装置が普及してきている。また、発光素子として窒化ガリウム系化合物半導体からなる青色発光ダイオードや紫外光を放射する発光ダイオードが開発され、それらの発光素子を種々の波長変換物質(例えば、蛍光体)や光吸収体と組み合わせることにより、発光素子本来の発する色と異なる色、例えば白色やその他の色の光を放射する発光装置も提供されている。なお、このような発光装置において、上記波長変換物質や光吸収体の保持方法としては発光素子が実装される部位にそれらを含有した樹脂を充填する方法が一般的である。
【0003】
【発明が解決しようとする課題】
上記従来例では、波長変換物質や光吸収体を保持する母材として樹脂を用いているが、発光素子の発する光や熱によって樹脂が劣化、着色することにより、光の色合いや光量が低下するという問題があった。また、上記従来例では多数の発光素子を用いる場合、個々の発光素子が実装される部位に波長変換物質や光吸収体を含有する少量の樹脂をそれぞれ滴下充填した後に硬化させているため、工程が煩雑で時間を要するという問題があった。さらに、樹脂の滴下量の制御が困難であり、しかも、樹脂が硬化する時間内に樹脂よりも比重の大きい波長変換物質や光吸収体が沈下する傾向がみられ、その沈下度合いにも差異が生じやすく、結果的に個々の発光素子毎で発光色や発光量のばらつきが大きいという問題があった。
【0004】
本発明は上記問題に鑑みて為されたものであり、その目的は、発光色や発光量の経年変化並びにばらつきを抑制することができる発光装置を提供することにある。
【0005】
【課題を解決するための手段】
請求項1の発明は、上記目的を達成するために、1乃至複数の収納凹所が表面に形成されたセラミック基板と、前記収納凹所の底面に実装される発光素子とを備えた発光装置において、受けた光と波長が異なる光を放射する波長変換物質、あるいは所定の波長の光を吸収する光吸収物質の少なくとも一方を前記セラミック基板内に含有し、前記収納凹所底面と背向するセラミック基板の裏面を光放射面としたことを特徴とし、波長変換物質や光吸収を保持する母材として耐光性、耐熱性、放熱性に優れたセラミックを用いるため、樹脂を母材とする従来例に比較して、発光色や発光量の経年変化並びにばらつきを抑制することができる。しかも、発光素子から放射される光が全てセラミック基板内を通過することになって光の混色性を高めることができ、光放射面の観察方向に依存する色むらをさらに低減することができる。
【0007】
請求項の発明は、上記目的を達成するために、1乃至複数の収納凹所が表面に形成されたセラミック基板と、前記収納凹所の底面に実装される発光素子とを備えた発光装置において、受けた光と波長が異なる光を放射する波長変換物質、あるいは所定の波長の光を吸収する光吸収物質の少なくとも一方を前記セラミック基板内に含有し、前記収納凹所の開口面を光放射面とし、発光素子の発する光を前記光放射面に向けて反射する反射部材をセラミック基板内に配置したことを特徴とし、波長変換物質や光吸収を保持する母材として耐光性、耐熱性、放熱性に優れたセラミックを用いるため、樹脂を母材とする従来例に比較して、発光色や発光量の経年変化並びにばらつきを抑制することができる。しかも、発光素子の発する光及び波長変換物質や光吸収体からの光が反射部材によって光放射面(収納凹所の開口面)に向けて反射されるために発光効率の向上が図れる。
【0008】
【発明の実施の形態】
本発明の実施形態を説明する前に、本発明の参考例について説明する。
参考例は、図1に示すように1乃至複数の収納凹所3が表面に形成されたセラミック基板2と、収納凹所3の底面に実装される発光素子1と、セラミック基板2が表面(図1における上面)に実装される配線基板10とを備えている。
【0009】
セラミック基板2は可視光領域における透光性を有し、波長変換物質である、例えばYAG(イットリウム・アルミニウム・ガーネット)蛍光体6を含有して形成されており、表面(図1における上面)には1乃至複数の円柱状の突台2aが前方(図1における上方)へ向けて突設されている。そして、突台2aの前面には平面視略円形に開口するすり鉢状の収納凹所3が形成されている。収納凹所3の底面は平坦面となっており、この平坦な底面に発光素子(発光ダイオードチップ)1がフェースダウン実装される。また、収納凹所3の内周面及び中心部を除く底面を含めたセラミック基板2の表面には銅箔よりなる配線部(配線パターン)4が形成されている。
【0010】
発光素子1は、例えばサファイア基板上に窒化ガリウム系の発光層が形成された青色発光ダイオードであって、各層には電極部5が接合されている。そして、各電極部5が配線部4と電気的に接続され、配線部4を介して発光素子1に電力が供給される。
【0011】
配線基板10は平板状であって、表面には銅箔よりなる配線パターン11が形成されている。そして、収納凹所3の底面と背向するセラミック基板2の裏面(図1における下面)を配線基板10に対向させ、裏面端部に設けられた配線部4を配線パターン11に接合することで配線基板10の表面にセラミック基板2が実装される。
【0012】
ここで、本参考例におけるセラミック基板2は下記の工程からなる製造方法によって製造される。
【0013】
1)セラミック材料とバインダと蛍光体とを混合する工程
2)射出成型によってセラミック基板2の形状に成型する工程
3)脱脂・焼結工程
4)MID(Molded Inter-connected Device)工法を用いて回路(配線部4)を形成する工程
上記製造方法によれば、YAG蛍光体6がセラミック材料内に均一に分散された状態のままでセラミック基板2を製造することができるとともに、セラミック基板2の形状や肉厚の制御が容易に行える。したがって、蛍光体の母材に樹脂を用いた従来例に比較して、YAG蛍光体6の分量や濃度を均一化することが可能となる。
【0014】
而して、配線基板10の配線パターン11を通して発光素子1に電流を流すことで発光素子1が発光し、発光素子1の発する光の一部がセラミック基板2内に入射してYAG蛍光体6によって吸収され、発光素子1の発する光(青色光)と波長が異なる光(黄色光)に変換される。そして、YAG蛍光体6によって波長変換された光(黄色光)と発光素子1の発する光(青色光)との混色によっておおよそ白色の光が前方へ放射されることになる。
【0015】
上述のように本参考例によれば、YAG蛍光体6を保持する母材として耐光性、耐熱性、放熱性に優れたセラミックを用いているので、樹脂を母材とする従来例に比較して、発光色や発光量の経年変化並びにばらつきを抑制することができる。
【0016】
(実施形態
本実施形態は、図2に示すように収納凹所3の底面と背向するセラミック基板2の裏面(図2における上面)を光放射面とした点に特徴がある。但し、本実施形態の基本構成は参考例と共通であるから、共通の構成要素には同一の符号を付して説明を省略する。
【0017】
セラミック基板2は参考例と同一の製造方法によって製造されるものである。但し、収納凹所3はすり鉢状ではなく、幅寸法(図2における左右の幅寸法)が均一に形成されており、底面には青色発光ダイオードからなる発光素子1がワイヤボンディングによってフェースダウン実装されている。
【0018】
そして、収納凹所3の開口面を配線基板10に対向させ、開口面周縁に設けられた配線部4を配線パターン11に接合することで配線基板10の表面にセラミック基板2が実装され、収納凹所3の底面と背向するセラミック基板2の裏面が光放射面となる。なお、配線基板10表面における発光素子1と対向する位置には、発光素子1の発する光を前方へ反射する反射板12が形成されている。
【0019】
而して、本実施形態によれば、発光素子1の主発光面(図2における上面)から放射される光が全てセラミック基板2内を通過することになるから、YAG蛍光体6によって波長変換されなかった青色光と、YAG蛍光体6によって波長変換された黄色光との混色性を高めることができる。したがって、参考例に比較して光放射面の観察方向に依存する色むらを低減することができる。
【0020】
(実施形態
本実施形態は、図3に示すように発光素子1の発する光を光放射面に向けて反射する反射部材13をセラミック基板2内に配置した点に特徴がある。但し、本実施形態の基本構成は参考例と共通であるから、共通の構成要素には同一の符号を付して説明を省略する。
【0021】
反射部材13は、アルミニウムのような反射率の高い金属によって椀状に形成され、その内周面を収納凹所3の内周面と対向させるようにしてセラミック基板2と一体に成型されている。
【0022】
而して、本実施形態によれば、発光素子1の発する光(青色光)及びYAG蛍光体6によって波長変換された光(黄色光)が反射部材13によって収納凹所3の開口面、すなわち光放射面に向けて反射されることになり、参考例及び実施形態1に比較して発光効率の向上が図れるものである。
【0023】
なお、上述の実施形態1,2では発光素子1として窒化ガリウム系化合物半導体からなる青色発光ダイオードを用いたが、これに限定する趣旨ではなく、波長変換物質や光吸収体が機能し得る波長域の光を放射するものであればよい。また、セラミック基板2に用いるセラミック材料として可視光領域において透光性を有するものを用いたが、発光素子1の発する光の波長領域、並びに波長変換物質によって変換された光を透過する性質を有するものであればよい。さらに、セラミック基板2内に波長変換物質であるYAG蛍光体6を含有させているが、これに限定する趣旨ではなく、発光素子1の発する光によって励起され、励起波長と異なる波長の光を放射する他の波長変換物質を含有させてもよい。また、波長変換物質ではなく(あるいは波長変換物質とともに用いてもよいが)、発光素子1(又は波長変換物質)の発する光のうちの所定の波長の光を吸収する顔料や染料等の光吸収体を含有させてもよい。さらに、発光素子1の実装の形態(フェースアップ又はフェースダウン)についても実施形態に限定されるものではないし、発光素子1と配線部4との電気的な接続方法についてもワイヤボンディングやバンプ等を用いた方法の何れでも構わない。
【0024】
また、セラミック基板2の外形や収納凹所3の形状も実施形態の形状に限定されるものではない。例えば実施形態において、図4に示すように収納凹所3の底面に実装される発光素子1からセラミック基板2の光放射面(外周面)までの距離を略同一とした略ドーム形状にセラミック基板2を形成すれば、観察方向による色むらをさらに低減することができる。
【0025】
【発明の効果】
請求項1の発明は、1乃至複数の収納凹所が表面に形成されたセラミック基板と、前記収納凹所の底面に実装される発光素子とを備えた発光装置において、受けた光と波長が異なる光を放射する波長変換物質、あるいは所定の波長の光を吸収する光吸収物質の少なくとも一方を前記セラミック基板内に含有し、前記収納凹所底面と背向するセラミック基板の裏面を光放射面としたので、波長変換物質や光吸収を保持する母材として耐光性、耐熱性、放熱性に優れたセラミックを用いるため、樹脂を母材とする従来例に比較して、発光色や発光量の経年変化並びにばらつきを抑制することができ、しかも、発光素子から放射される光が全てセラミック基板内を通過することになって光の混色性を高めることができ、光放射面の観察方向に依存する色むらをさらに低減することができるという効果がある。
【0027】
請求項の発明は、1乃至複数の収納凹所が表面に形成されたセラミック基板と、前記収納凹所の底面に実装される発光素子とを備えた発光装置において、受けた光と波長が異なる光を放射する波長変換物質、あるいは所定の波長の光を吸収する光吸収物質の少なくとも一方を前記セラミック基板内に含有し、前記収納凹所の開口面を光放射面とし、発光素子の発する光を前記光放射面に向けて反射する反射部材をセラミック基板内に配置したので、波長変換物質や光吸収を保持する母材として耐光性、耐熱性、放熱性に優れたセラミックを用いるため、樹脂を母材とする従来例に比較して、発光色や発光量の経年変化並びにばらつきを抑制することができ、しかも、発光素子の発する光及び波長変換物質や光吸収体からの光が反射部材によって光放射面(収納凹所の開口面)に向けて反射されるために発光効率の向上が図れるという効果がある。
【図面の簡単な説明】
【図1】本発明の参考例の要部を示す断面図である。
【図2】実施形態の要部を示す断面図である。
【図3】実施形態の要部を示す断面図である。
【図4】同上の他の構成の要部を示す断面図である。
【符号の説明】
1 発光素子
2 セラミック基板
3 収納凹所
6 蛍光体
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light emitting device using a light emitting element such as a light emitting diode.
[0002]
[Prior art]
In recent years, light-emitting devices using light-emitting elements (for example, light-emitting diodes) as a light source for display, a substitute for a small current, or a light source for a liquid crystal panel have become widespread taking advantage of features such as small size, light weight, and power saving. In addition, blue light-emitting diodes made of gallium nitride compound semiconductors and light-emitting diodes that emit ultraviolet light have been developed as light-emitting elements, and these light-emitting elements are combined with various wavelength conversion substances (for example, phosphors) and light absorbers. Accordingly, a light-emitting device that emits light of a color different from the original color of the light-emitting element, for example, white or other light is also provided. In such a light emitting device, as a method for holding the wavelength converting substance or the light absorber, a method of filling a resin containing them in a portion where the light emitting element is mounted is common.
[0003]
[Problems to be solved by the invention]
In the above conventional example, a resin is used as a base material for holding a wavelength conversion substance or a light absorber. However, the color and light amount of the light is reduced due to deterioration and coloring of the resin due to light and heat emitted from the light emitting element. There was a problem. Further, in the case of using a large number of light emitting elements in the above-mentioned conventional example, since a small amount of resin containing a wavelength converting substance or a light absorber is dropped and filled in a portion where each light emitting element is mounted, the process is performed. However, there was a problem that it was complicated and time-consuming. Furthermore, it is difficult to control the dripping amount of the resin, and there is a tendency that the wavelength converting substance or light absorber having a higher specific gravity than the resin sinks within the curing time of the resin, and there is a difference in the sinking degree. As a result, there is a problem that variations in emission color and emission amount are large among individual light emitting elements.
[0004]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a light emitting device capable of suppressing the secular change and variation of the light emission color and the light emission amount.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, a light emitting device comprising a ceramic substrate having one or more housing recesses formed on a surface thereof, and a light emitting element mounted on a bottom surface of the housing recess. In the ceramic substrate, the ceramic substrate contains at least one of a wavelength conversion material that emits light having a wavelength different from that of the received light or a light absorption material that absorbs light of a predetermined wavelength, and faces away from the bottom surface of the housing recess. The backside of the ceramic substrate is a light-emitting surface, and a ceramic with excellent light resistance, heat resistance, and heat dissipation is used as a wavelength conversion material and a base material that retains light absorption. Compared to the example, it is possible to suppress the secular change and variation of the emission color and the emission amount. In addition, since all the light emitted from the light emitting element passes through the ceramic substrate, the color mixing property of the light can be improved, and the color unevenness depending on the observation direction of the light emitting surface can be further reduced.
[0007]
According to a second aspect of the present invention, in order to achieve the above object, a light emitting device comprising a ceramic substrate having one or more housing recesses formed on a surface thereof, and a light emitting element mounted on a bottom surface of the housing recesses. In the ceramic substrate, at least one of a wavelength converting material that emits light having a wavelength different from the received light or a light absorbing material that absorbs light of a predetermined wavelength is contained in the ceramic substrate, and the opening surface of the housing recess is made light A light emitting surface, and a reflecting member that reflects light emitted from the light emitting element toward the light emitting surface is disposed in the ceramic substrate, and is a light-resistant and heat-resistant material as a wavelength conversion substance and a base material that retains light absorption. Since ceramics having excellent heat dissipation properties are used, it is possible to suppress changes over time and variations in emission color and emission amount as compared with conventional examples using a resin as a base material. In addition, the light emitted from the light emitting element and the light from the wavelength converting substance or light absorber are reflected by the reflecting member toward the light emitting surface (opening surface of the housing recess), so that the light emission efficiency can be improved.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Before describing embodiments of the present invention, reference examples of the present invention will be described.
As shown in FIG. 1, the present reference example has a ceramic substrate 2 having one or more housing recesses 3 formed on the surface, a light emitting element 1 mounted on the bottom surface of the housing recess 3, and a ceramic substrate 2 on the surface. And a wiring board 10 mounted on the upper surface in FIG.
[0009]
The ceramic substrate 2 has translucency in the visible light region and is formed by containing, for example, a YAG (yttrium, aluminum, garnet) phosphor 6 that is a wavelength conversion substance, and is formed on the surface (upper surface in FIG. 1). One or a plurality of columnar protrusions 2a project forward (upward in FIG. 1). In addition, a mortar-shaped storage recess 3 that is opened in a substantially circular shape in plan view is formed on the front surface of the protrusion 2a. The bottom surface of the housing recess 3 is a flat surface, and the light emitting element (light emitting diode chip) 1 is face-down mounted on the flat bottom surface. A wiring portion (wiring pattern) 4 made of copper foil is formed on the surface of the ceramic substrate 2 including the inner peripheral surface of the housing recess 3 and the bottom surface excluding the central portion.
[0010]
The light emitting element 1 is a blue light emitting diode in which a gallium nitride based light emitting layer is formed on a sapphire substrate, for example, and an electrode portion 5 is bonded to each layer. Each electrode unit 5 is electrically connected to the wiring unit 4, and power is supplied to the light emitting element 1 through the wiring unit 4.
[0011]
The wiring substrate 10 has a flat plate shape, and a wiring pattern 11 made of copper foil is formed on the surface. Then, the back surface (the lower surface in FIG. 1) of the ceramic substrate 2 facing away from the bottom surface of the housing recess 3 is opposed to the wiring substrate 10, and the wiring portion 4 provided at the back surface end is joined to the wiring pattern 11. The ceramic substrate 2 is mounted on the surface of the wiring substrate 10.
[0012]
Here, the ceramic substrate 2 in this reference example is manufactured by a manufacturing method including the following steps.
[0013]
1) Step of mixing ceramic material, binder and phosphor 2) Step of molding into shape of ceramic substrate 2 by injection molding 3) Degreasing and sintering step 4) Circuit using MID (Molded Inter-connected Device) method Step of Forming (Wiring Portion 4) According to the above manufacturing method, the ceramic substrate 2 can be manufactured while the YAG phosphor 6 is uniformly dispersed in the ceramic material, and the shape of the ceramic substrate 2 And wall thickness can be controlled easily. Therefore, the amount and concentration of the YAG phosphor 6 can be made uniform as compared with the conventional example using a resin as the phosphor base material.
[0014]
Thus, when a current is passed through the light emitting element 1 through the wiring pattern 11 of the wiring substrate 10, the light emitting element 1 emits light, and a part of the light emitted from the light emitting element 1 enters the ceramic substrate 2 to enter the YAG phosphor 6. Is converted into light (yellow light) having a wavelength different from that of the light (blue light) emitted from the light emitting element 1. Then, approximately white light is radiated forward by the color mixture of light (yellow light) wavelength-converted by the YAG phosphor 6 and light (blue light) emitted from the light emitting element 1.
[0015]
As described above, according to this reference example , since the ceramic that is excellent in light resistance, heat resistance, and heat dissipation is used as a base material for holding the YAG phosphor 6, it is compared with a conventional example using a resin as a base material. Thus, it is possible to suppress the secular change and variation of the emission color and the emission amount.
[0016]
(Embodiment 1 )
As shown in FIG. 2, the present embodiment is characterized in that the bottom surface of the housing recess 3 and the back surface (the top surface in FIG. 2) of the ceramic substrate 2 facing away are used as the light emission surface. However, since the basic configuration of this embodiment is the same as that of the reference example , the same components are denoted by the same reference numerals and description thereof is omitted.
[0017]
The ceramic substrate 2 is manufactured by the same manufacturing method as the reference example . However, the storage recess 3 is not mortar-shaped and has a uniform width dimension (the width dimension on the left and right in FIG. 2), and the light-emitting element 1 made of a blue light-emitting diode is mounted face-down on the bottom by wire bonding. ing.
[0018]
Then, the ceramic substrate 2 is mounted on the surface of the wiring substrate 10 by making the opening surface of the storage recess 3 face the wiring substrate 10 and bonding the wiring portion 4 provided at the periphery of the opening surface to the wiring pattern 11. The back surface of the ceramic substrate 2 facing away from the bottom surface of the recess 3 is a light emitting surface. A reflective plate 12 that reflects light emitted from the light emitting element 1 forward is formed at a position facing the light emitting element 1 on the surface of the wiring substrate 10.
[0019]
Thus, according to the present embodiment, since all the light emitted from the main light emitting surface (the upper surface in FIG. 2) of the light emitting element 1 passes through the ceramic substrate 2, the wavelength conversion is performed by the YAG phosphor 6. The color mixing property between the blue light that has not been changed and the yellow light that has been wavelength-converted by the YAG phosphor 6 can be improved. Therefore, color unevenness depending on the observation direction of the light emitting surface can be reduced as compared with the reference example .
[0020]
(Embodiment 2 )
As shown in FIG. 3, the present embodiment is characterized in that a reflecting member 13 that reflects light emitted from the light emitting element 1 toward the light emitting surface is disposed in the ceramic substrate 2. However, since the basic configuration of this embodiment is the same as that of the reference example , the same components are denoted by the same reference numerals and description thereof is omitted.
[0021]
The reflecting member 13 is formed in a bowl shape with a metal having high reflectivity such as aluminum, and is molded integrally with the ceramic substrate 2 so that its inner peripheral surface faces the inner peripheral surface of the housing recess 3. .
[0022]
Thus, according to the present embodiment, the light (blue light) emitted from the light emitting element 1 and the light (yellow light) wavelength-converted by the YAG phosphor 6 are reflected by the reflecting member 13 on the opening surface of the housing recess 3, that is, The light is reflected toward the light emitting surface, and the light emission efficiency can be improved as compared with the reference example and the first embodiment .
[0023]
In the first and second embodiments described above, a blue light emitting diode made of a gallium nitride compound semiconductor is used as the light emitting element 1. However, the present invention is not limited to this, and a wavelength region in which a wavelength conversion substance or a light absorber can function is used. As long as it emits the light. Further, although a ceramic material having translucency in the visible light region is used as the ceramic material used for the ceramic substrate 2, it has the property of transmitting the wavelength region of light emitted from the light emitting element 1 and the light converted by the wavelength converting substance. Anything is acceptable. Further, the YAG phosphor 6 which is a wavelength conversion substance is contained in the ceramic substrate 2, but the purpose is not limited to this, and the pump is excited by the light emitted from the light emitting element 1 and emits light having a wavelength different from the excitation wavelength. Other wavelength converting substances may be included. Further, light absorption of a pigment or dye that absorbs light of a predetermined wavelength out of light emitted from the light-emitting element 1 (or the wavelength conversion material) is not a wavelength conversion material (or may be used together with the wavelength conversion material). The body may be included. Furthermore, the mounting mode (face-up or face-down) of the light-emitting element 1 is not limited to the embodiment, and the method of electrical connection between the light-emitting element 1 and the wiring portion 4 includes wire bonding and bumps. Any of the methods used may be used.
[0024]
Further, the outer shape of the ceramic substrate 2 and the shape of the storage recess 3 are not limited to the shapes of the embodiments. For example, in the first embodiment, as shown in FIG. 4, the ceramic has a substantially dome shape in which the distance from the light emitting element 1 mounted on the bottom surface of the housing recess 3 to the light emitting surface (outer peripheral surface) of the ceramic substrate 2 is substantially the same. If the substrate 2 is formed, the color unevenness due to the observation direction can be further reduced.
[0025]
【The invention's effect】
The invention according to claim 1 is a light emitting device comprising a ceramic substrate having one or more housing recesses formed on the surface and a light emitting element mounted on the bottom surface of the housing recesses. The ceramic substrate contains at least one of a wavelength converting material that emits different light or a light absorbing material that absorbs light of a predetermined wavelength, and the back surface of the ceramic substrate facing away from the bottom surface of the housing recess is a light emitting surface. since the light resistance as a base material for holding the wavelength converting material and the light absorption, heat resistance, for using the excellent ceramic heat dissipation, a resin as compared with the conventional example in which a base material, the emission color and light emission amount In addition, all the light emitted from the light emitting element passes through the ceramic substrate, so that the color mixing property of the light can be improved and the light emitting surface is observed in the observation direction. Depend on There is an effect of Ru can be further reduced color unevenness.
[0027]
According to a second aspect of the present invention, there is provided a light emitting device including a ceramic substrate having one or more storage recesses formed on a surface thereof and a light emitting element mounted on a bottom surface of the storage recess. At least one of a wavelength converting material that emits different light or a light absorbing material that absorbs light of a predetermined wavelength is contained in the ceramic substrate, and the light emitting surface emits light from the opening surface of the housing recess. Since a reflecting member that reflects light toward the light emitting surface is disposed in the ceramic substrate, a ceramic that is excellent in light resistance, heat resistance, and heat dissipation is used as a wavelength conversion material and a base material that retains light absorption. Compared to conventional examples using resin as a base material, it is possible to suppress aging changes and variations in emission color and emission amount, and reflect light emitted from light emitting elements and light from wavelength conversion substances and light absorbers. Depending on the member Thus, since the light is reflected toward the light emitting surface (the opening surface of the housing recess), the light emission efficiency can be improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a main part of a reference example of the present invention .
FIG. 2 is a cross-sectional view showing a main part of the first embodiment.
FIG. 3 is a cross-sectional view showing a main part of the second embodiment.
FIG. 4 is a cross-sectional view showing a main part of another configuration of the above.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Ceramic substrate 3 Storage recess 6 Phosphor

Claims (2)

1乃至複数の収納凹所が表面に形成されたセラミック基板と、前記収納凹所の底面に実装される発光素子とを備えた発光装置において、受けた光と波長が異なる光を放射する波長変換物質、あるいは所定の波長の光を吸収する光吸収物質の少なくとも一方を前記セラミック基板内に含有し、前記収納凹所底面と背向するセラミック基板の裏面を光放射面としたことを特徴とする発光装置。Wavelength conversion for emitting light having a wavelength different from that of received light in a light emitting device including a ceramic substrate having one or more housing recesses formed on a surface thereof and a light emitting element mounted on a bottom surface of the housing recesses The ceramic substrate contains at least one of a material or a light absorbing material that absorbs light of a predetermined wavelength, and the back surface of the ceramic substrate facing away from the bottom of the housing recess is a light emitting surface. Light emitting device. 1乃至複数の収納凹所が表面に形成されたセラミック基板と、前記収納凹所の底面に実装される発光素子とを備えた発光装置において、受けた光と波長が異なる光を放射する波長変換物質、あるいは所定の波長の光を吸収する光吸収物質の少なくとも一方を前記セラミック基板内に含有し、前記収納凹所の開口面を光放射面とし、発光素子の発する光を前記光放射面に向けて反射する反射部材をセラミック基板内に配置したことを特徴とする発光装置 Wavelength conversion for emitting light having a wavelength different from that of received light in a light emitting device including a ceramic substrate having one or more housing recesses formed on a surface thereof and a light emitting element mounted on a bottom surface of the housing recesses At least one of a substance or a light absorbing substance that absorbs light of a predetermined wavelength is contained in the ceramic substrate, the opening surface of the housing recess is used as a light emitting surface, and the light emitted from the light emitting element is used as the light emitting surface. A light-emitting device, characterized in that a reflective member that reflects toward a surface is disposed in a ceramic substrate .
JP2002037290A 2002-02-14 2002-02-14 Light emitting device Expired - Fee Related JP4122791B2 (en)

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