JP4183020B2 - Electronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component and a manufacturing method thereof, and more particularly, to an electronic component having a resistance element and a manufacturing method thereof.

  As a method of forming a resistance element such as a resistance film having a desired resistance value in a resistor or the like, for example, screen printing or an ink jet method is known.

  For example, in Patent Document 1, dot-shaped first resistance portions having different areas and intervals are formed in a substantially band shape on the surface of a substrate using screen printing, and a first resistor is formed on the first resistance portion. It is disclosed that a continuous layer-like second resistance portion having a different electrical resistance from that of the portion is formed.

Patent Document 2 discloses that a resistor is formed on an unfired ceramic sheet by attaching one type of resistive ink by an ink jet method.
Japanese Patent Laid-Open No. 60-30101 JP 10-189305 A

  However, when the resistance portion is formed by screen printing as in Patent Document 1, the screen plate is replaced when the resistance value changes. For this reason, a large amount of screen plate manufacturing cost is generated for each resistance value, and it takes a long time to manufacture the screen plate.

  In addition, when two or more types of conductive paste are printed using screen printing, two or more types of conductive paste cannot be printed at the same time, and each time one type of conductive paste is printed, it is dried. A process and a screen plate changing process are required. After printing the second type of conductive paste, it is necessary to position the screen plate with high accuracy at the printing position of the conductive paste printed before that. Furthermore, the second and subsequent types of conductive paste may not enter the gaps between the previously printed conductive pastes by screen printing, and voids may be formed. Therefore, it is difficult to simplify the process.

  When a resistor is formed using one type of resistive ink as in Patent Document 2, for example, in order to make the resistor have the same size and shape but different resistance values, the composition corresponding to the resistance value is used. Different resistance inks must be prepared in advance. For this reason, it is difficult to handle high-mix low-volume production.

  In view of such circumstances, the present invention intends to provide an electronic component and a method for manufacturing the same, which can efficiently produce resistance elements having various resistance values.

  In order to solve the above problems, the present invention provides an electronic component configured as follows.

  The electronic component is of a type including a pair of terminals facing each other and a resistance element disposed between the pair of terminals. The resistance element includes at least two resistance parts (hereinafter referred to as “first resistance part” and “second resistance part”) arranged in succession. The first resistance unit includes a plurality of first dots arranged to overlap each other. The second resistance portion includes a plurality of second dots having different electric resistances from the first dots arranged to overlap each other.

  In the above configuration, the first dots and the second dots are formed by, for example, using an ink jet method and ejecting fine particles of resistance ink having different compositions to adhere to the substrate. It is also possible to use a laser printing method to form fine particles of resistance toner having different compositions attached to a substrate. The resistance element is divided into at least two first resistance portions and second resistance portions, and each resistance portion includes a plurality of dots that overlap each other.

  According to the above configuration, since the screen plate is not required for forming the resistance element, the production cost and the management cost of the screen plate are not required, and the production period of the screen plate is eliminated, so that a short delivery time can be met. It is possible to form resistance elements having various resistance values by changing the size and number of dots in the resistance portion, the shape of the resistance portion, and the like without changing the resistance ink or resistance toner for forming dots. .

  Preferably, the first resistance part and the second resistance part are arranged in series between the terminals.

  In this case, it is easy to obtain a desired resistance value by calculation. When the resistance value of the formed resistance element is adjusted later, the resistance value having a relatively high resistance value is first partially removed to roughly adjust the resistance value, and then the resistance value is relatively adjusted. The resistance value can be finely adjusted by partially removing the lower resistance portion.

  Preferably, the first resistance part and the second resistance part are arranged in parallel between the terminals. Here, the term “parallel” may be used when the first resistance portion and the second resistance portion are in contact with each other or when they are apart from each other. Further, when they are in contact, they may be stacked one above the other. Further, in a state where they are stacked one above the other, the second resistance portion may be formed in a floating island shape within the first resistance portion.

  In this case, it is easy to obtain a desired resistance value by calculation. When the resistance value of the formed resistance element is adjusted later, the resistance value having a relatively high resistance value is first partially removed to roughly adjust the resistance value, and then the resistance value is relatively adjusted. The resistance value can be finely adjusted by partially removing the lower resistance portion.

  Preferably, at least one of the first resistance portion and the second resistance portion is a metal.

  Metals have various resistance values, such as those having a considerably high resistance value such as Ni-Cr, those having a slightly high resistance value such as Pd, and those having a low resistance value such as Ag. Resistive elements having various resistance values can be easily formed according to the application.

  Moreover, in order to solve the said subject, this invention provides the manufacturing method of the electronic component comprised as follows.

  In the method for manufacturing an electronic component, (1) using a first resistance ink containing a component that becomes a part of a resistance element in a first region of a substrate, a plurality of first dots that overlap each other are formed by an inkjet method. A first step of disposing, and (2) a second region adjacent to the first region that includes a component that is another part of the resistive element and has a composition different from that of the first resistive ink. A second step of arranging a plurality of second dots overlapping each other by an inkjet method using (2) the resistance ink of (2), and (3) the first dots of the first region and the second region of the second region A third step of heat-treating the second dots to form the resistance elements.

  In the above method, the first dots and the second dots are formed by ejecting fine ink droplets of the first resistance ink and the second resistance ink, respectively, and attaching them to the substrate. The resistance element is divided into at least two first regions and second regions, and each region includes a plurality of dots that overlap each other. The second step may be started before the first step is finished. The third step may include a plurality of steps having different heat treatment temperatures as the drying step and the firing step. Among these, the drying step may be started before the first step or the second step is completed.

  According to the above method, the screen plate is not required for forming the resistance element, the cost for producing and managing the screen plate becomes unnecessary, and the production period of the screen plate is also eliminated. By using the same resistance ink and changing the size and number of dots in the region, the shape of the region, and the like, resistance elements having various resistance values can be formed.

  Preferably, a dot drying step of drying the first dots is provided before the second step. This dot drying step may be provided independently between the first step and the second step, but is preferably performed in parallel with the first step. For example, in the first step, the dot drying step may be performed by setting the base material to a temperature higher than room temperature or by performing the first step in a dry atmosphere.

  In this case, the drying time of the first dots arranged on the substrate is shortened by setting the substrate to a temperature higher than room temperature (for example, 25 ° C. or more) or by performing the first step in a dry atmosphere. As a result, it is difficult to mix the two types of resistance inks even if they are overcoated or arranged, and a desired resistance value can be easily obtained.

  Moreover, in order to solve the said subject, this invention provides the manufacturing method of the electronic component comprised as follows.

  The manufacturing method of an electronic component includes: (1) a first step of arranging a plurality of first dots by an inkjet method using a first resistance ink containing a component serving as a resistance element on a substrate; and (2 ) Using a second resistance ink containing a component that becomes the resistance element and having a composition different from that of the first resistance ink, a plurality of second dots are arranged to overlap the first dots by an inkjet method. A second step of mixing the first resistance ink of the first dot and the second resistance ink of the second dot to form a mixing unit; and (3) the mixing unit. And a third step of forming the resistance element.

  In the above method, the second step may be started before the first step is finished.

  According to the above method, since the screen plate is not required for forming the resistance element, the production and management cost of the screen plate is not required, and the production period of the screen plate is also eliminated. Using the same resistance ink, adjusting the mixing ratio of the resistance ink by changing the size (the amount of ink liquid) and the number of the first dots and the second dots, the number of times of printing, etc., or changing the printing pattern Thus, various resistance values can be obtained.

  Preferably, in the first step and the second step, the temperature is set to room temperature or lower than room temperature.

  In this case, the resistance value of the resistance film is set by delaying the drying of the ink of the first dot by setting the base material to a normal temperature or a temperature lower than the normal temperature (for example, less than 25 ° C.) and increasing the ink mixing time. The variation in resistance can be reduced, and a stable resistance value can be obtained.

  According to the present invention, it is possible to efficiently produce resistance elements having various resistance values.

1 is an overall configuration diagram of an inkjet printer used for printing. Example 1 It is a schematic diagram for demonstrating a printing pattern. Example 1 It is a schematic diagram for demonstrating a printing pattern. Example 1 It is a schematic diagram for demonstrating the printing method. (Example 2) It is a schematic diagram for demonstrating a printing pattern. (Example 2) It is a schematic diagram for demonstrating a printing pattern. (Example 3)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a 1st dot 2a 2nd dot 3 Mixing part 4 Terminal 6 Terminal 8 Base material 10 Inkjet printer 14, 16, 18 Inkjet head 34, 36, 38 Resistive ink 35, 37, 39 Ink droplet

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example 1> Example 1 will be described with reference to FIGS.

  First, an ink jet printer 10 used for printing a pattern serving as a resistance film (resistance element) will be described with reference to the schematic diagram of FIG.

  The ink jet printer 10 generally includes a moving table 12 on which the base material 8 is placed, a plurality of (for example, three) ink jet heads 14, 16, and 18, and a control unit 11 that controls the entire apparatus.

  The moving table 12 is driven in the X direction indicated by reference numeral 23 by the motor 22, driven in the Y direction indicated by reference numeral 25 by the motor 24, and the θ direction indicated by reference numeral 27 by the motor 26 (Z axis perpendicular to the X and Y axes). Around). Driving of the motors 22, 24 and 26 of the moving table 12 is controlled by the control unit 11. The moving table 12 may be moved in directions other than X, Y, and θ, or conversely, may be moved only in any one or two directions of X, Y, and θ. If necessary, the moving table 12 may be provided with a vacuum suction hole for adsorbing the base material 8 or a heater for heating and keeping the base material 2.

  The inkjet heads 14, 16, and 18 are each disposed at a fixed position above the moving table 12. Resistive inks 34, 36, and 38 having different compositions are supplied from the tanks 15, 17, and 19 to the inkjet heads 14, 16, and 18, respectively. One or two or more minute holes are formed in the inkjet heads 14, 16, and 18, and ink droplets 35, 37, and 39 that are fine particles of the resistance inks 34, 36, and 38 are transferred from the holes to the moving table 12. Inject toward The inkjet heads 14, 16, and 18 change the size (the amount of ink droplets) and the number of ink droplets 35, 37, and 39 to be ejected under the control of the control unit 11.

  The resistance inks 34, 36, and 38 include a resistance material such as ruthenium oxide, glass, carbon, and metal particles. As a resistance material included in the resistance inks 34, 36, and 38, one having an arbitrary resistance value can be used. For example, metal particles have various resistance values such as Ni-Cr having a fairly high resistance value, Pd having a slightly high resistance value, Ag having a low resistance value, and the like. Any material can be used depending on the application. The base material 8 placed on the moving table 12 is a work such as a substrate or a ceramic green sheet for producing an electronic component.

  For the control unit 11, for example, a personal computer is used. The control unit 11 drives the ink jet heads 14, 16, 18 in synchronization with the movement of the moving table 12 in accordance with a predetermined program based on parameters input from a keyboard or the like (not shown), and the ink droplets 35, 37, 39 is discharged. As a result, a predetermined pattern is printed on the base material 8 placed on the moving table 12 with the resistance inks 34, 36, and 38.

  Preferably, the inkjet heads 14, 16, and 18 in which a plurality of holes for discharging the ink droplets 35, 37, and 39 are arranged in a row are arranged so that the rows of holes are parallel to each other. The moving table 12 is driven in the direction in which the inkjet heads 14, 16, 18 are arranged (perpendicular to the row of holes) or in an oblique direction. As a result, printing can be performed substantially simultaneously using the resistance inks 34, 36, and 38, and a pattern serving as a resistance element can be efficiently formed.

  Instead of arranging the inkjet heads 14, 16, 18 at fixed positions and moving the substrate 8, the inkjet heads 14, 16, 18 may be moved while the substrate 8 is fixed. And the inkjet heads 14, 16, and 18 may be moved.

  Using this ink jet printer 10, a resistance film is formed by separately applying a pattern to be a resistance film using a plurality of types of resistance inks, followed by drying and baking.

  For example, a pattern to be a resistance film is divided into a plurality of print areas (regions) in the plane direction, and each print area is applied almost simultaneously using different resistance inks using a plurality of inkjet heads. Thereby, it is possible to realize a resistance film having a resistance value different from that of the resistance film formed of one kind of resistance ink. Resistive films having different resistance values can be realized by changing the planar shape and cross-sectional shape of the pattern to be the resistive film.

  Preferably, at the time of printing, the base material 8 is set to a temperature higher than room temperature (for example, 25 ° C. or higher), or printing is performed in an atmosphere that is easily dried, such as dry air. For example, a heater is provided on the moving table 12 to heat and keep the substrate 8 warm. Even if the substrate 8 is heated in advance before printing, the substrate 8 may be heated to a temperature higher than room temperature by air conditioning during printing. Alternatively, the printing unit may be covered with a cover, and dry air with a predetermined humidity may be continuously sent from the outside into the cover to maintain an atmosphere that is easy to dry. Thereby, the drying time of the dots of the resistance ink printed on the base material 8 is shortened, and it becomes difficult to mix the two types of resistance inks even when over-coating or side-by-side coating is performed, and a desired resistance value is easily obtained.

  The pattern to be the resistance film is printed as shown in the schematic diagrams of FIGS. 2 and 3, for example. Between the terminals 4 and 6 formed in advance on the base material 8 (see FIG. 1), two types of resistance inks 1 and 2 of dots 1a and 2a are arranged. A pattern is formed.

  The pattern shown in the plan view of FIG. 2A includes a first group including a plurality (2 × 2 in the figure) of dots 1a of the resistive ink 1 between the terminals 4 and 6, and a plurality (2 in the figure). The second groups including the dots 2a of the (× 2) resistance inks 2 are alternately arranged in a staggered manner. The dots 1a and 2a overlap each other, and the first group and the second group are continuous.

  The pattern shown in the plan view of FIG. 2B is a plurality of (six in the figure) dots of resistive ink 1 arranged between the terminals 4 and 6 in a direction perpendicular to the direction connecting the terminals 4 and 6. The first group including 1a and the second group including a plurality (six in the figure) of dots 2a of the resistance ink 2 arranged in a direction perpendicular to the direction connecting the terminals 4 and 6 are the terminals 4. , 6 are alternately arranged in the direction connecting the two. The dots 1a and 2a overlap each other, and the first group and the second group are continuous.

  The pattern shown in the plan view of FIG. 2C is a first pattern including a plurality of (in the figure, ten) dots 1 a of resistive ink 1 arranged in a direction connecting the terminals 4 and 6 between the terminals 4 and 6. And a second group including a plurality of (10 in the figure) dots 2a of the resistance ink 2 arranged in the direction connecting the terminals 4 and 6 are perpendicular to the direction connecting the terminals 4 and 6 Are alternately arranged. The dots 1a and 2a overlap each other, and the first group and the second group are continuous.

  The pattern shown in the plan view of FIG. 2D includes a first group including a plurality of (5 × 6 in the figure) dots 1a of the resistive ink 1 arranged in a square between the terminals 4 and 6; A second group including a plurality (5 × 6 in the figure) of the resistive ink 2 dots 2 a arranged in a square is arranged in series between the terminals 4 and 6. The dots 1a and 2a overlap each other, and the first group and the second group are continuous.

  The pattern shown in the plan view of FIG. 2 (e) includes a first group including a plurality of (10 × 3 in the figure) dots 1a of the resistive ink 1 arranged in a square between the terminals 4 and 6; A second group including a plurality of (10 × 3 in the figure) resistive ink 2 dots 2a arranged in a square is arranged in parallel. The dots 1a and 2a overlap each other, and the first group and the second group are continuous.

  When the first group and the second group are arranged in parallel, as shown in FIG. 3A, a part of the first group including the dot 1a of the resistance ink 1 and the resistance ink 2 The first group including the dots 1a of the resistive ink 1 is formed so that a part of the second group including the dots 2a is overlapped with each other or as shown in FIG. All of the second group including the dots 2a of the resistance ink 2 may be formed in a state where they are overlapped in a floating island shape on a part of the ink, and may be partially arranged in parallel. . In these cases, the vertical relationship between the first group and the second group may be reversed. Further, as shown in FIG. 3C, the first first group including the dot 1 a of the resistance ink 1 and the second group including the dot 2 a of the resistance ink 2 may be separated from each other.

  The pattern shown in the plan view of FIG. 2F and the side view of FIG. 2G is a first layer between the terminals 4 and 6, and a plurality of (10 × 6 in the figure) resistive inks 1 are formed as a first layer. A first group including a plurality of dots 1a is disposed, and a second group including a plurality of (10 × 6 in the figure) dots 2a of the resistance ink 2 is disposed in a quadrangle on the first group. . The dots 1a and 2a overlap each other, and the first group and the second group are continuous.

  In each pattern shown in FIGS. 2 and 3, the first group of dots 1a is arranged in the first region, and the second group of dots 2a is arranged in the second region. The first group and the second group by the dots 1a and 2a are dried and fired to form a resistance film, and then become a first resistance portion and a second resistance portion, respectively.

  In the pattern shown in FIG. 2A, the first group of the resistance ink 1 and the second group of the resistance ink 2 are made to have a certain size, so that the resistance ink tends to cause variation in resistance value. The total extension of the overlapping portion of 1 and the resistance ink 2 (that is, the boundary line between the first region where the first dots 1a are arranged and the second region where the second dots 2a are arranged) is short. Thus, the resistance value of the resistance film between the terminals 4 and 6 can be easily predicted. In addition, the distribution of electrical resistance can be made substantially uniform between the terminals 4 and 6.

  In the patterns shown in FIGS. 2B to 2G and FIG. 3, the first group of the resistance ink 1 and the second group of the resistance ink 2 are connected in series between the terminals 4 and 6 or Since they are arranged in parallel, the resistance value of the resistance film between the terminals 4 and 6 can be easily predicted. When the resistance value of the formed resistance film is adjusted later, the resistance value is roughly adjusted by partially removing the group having a relatively high resistance value, and then the resistance value is relatively adjusted. The resistance value can be finely adjusted by partially removing the lower group.

  The resistance value of the resistance film between the terminals 4 and 6 is a pattern (size, shape and arrangement of each group) separately applied by the resistance inks 1 and 2, and the sizes of the dots 1a and 2a of the resistance inks 1 and 2 in each group. It can be changed by changing (amount of ink droplets) or number of ink droplets.

  If resistance ink printing is performed using a plurality of inkjet heads, two or more types of resistance ink can be applied separately. Thereby, a drying process can be carried out only once. Further, since the drying process does not enter in the middle and printing is performed at a time, printing with high alignment accuracy between the resistance inks can be easily performed without realigning the printing positions.

  Further, since the screen plate is not used, even when the interval between the printing patterns of the first type of resistance ink is narrow, it is possible to print the second and subsequent types of resistance ink printing patterns so that no gap is generated.

  Furthermore, the resistance value can be changed and adjusted by separately applying a plurality of types of resistance ink by changing the setting of software parameters.

  Next, a specific example will be described.

Two types of ink-jet resistance inks 1 and 2 having different compositions were prepared in advance by dispersing ruthenium oxide (RuO ₂ ), glass, or the like, which is a material for resistance films for electronic components, in an organic solvent.

The weight percentage of each component in the solid content of the resistance ink 1 is 30% by weight for RuO ₂ , 56% by weight for CaO—Al ₂ O ₃ —SiO ₂ —B ₂ O ₃ glass, and SiO ₂ —B ₂ O _3. -K ₂ O glass is 14 wt%. The weight percent of each component in the solid content of the resistance ink 2 is 50% by weight of RuO ₂ , 35% by weight of CaO—Al ₂ O ₃ —SiO ₂ —B ₂ O ₃ glass, and SiO ₂ —B ₂ O _3. -K ₂ O glass is 15 wt%. Resistance ink 1 has a viscosity of 89 mPa · s at room temperature, and resistance ink 2 has a viscosity of 109 mPa · s at room temperature. However, since the ink is heated before ink ejection, the viscosity before ink ejection is lower than that at room temperature, and is about 20 m · Pa · s.

  An inkjet printer having a movable table movable in the X and Y directions and a ceramic green sheet in which two separated silver electrodes are formed as a pair of terminals are prepared below two piezoelectric inkjet heads. . In the inkjet head, 256 holes having a hole diameter of 50 μm are formed in a line at a pitch of 280 μm in a SUS adhesive, and ink droplets of 10 to 100 pl (picoliter) can be ejected.

  Resistive inks 1 and 2 were discharged almost simultaneously from two ink jet heads of the ink jet printer, and a pattern as shown in the schematic diagram of FIG. 2A was printed on the ceramic green sheet. That is, a rectangular pattern in which a first group of a plurality of dots of the resistance ink 1 and a second group of a plurality of dots of the resistance ink 2 are alternately arranged in a staggered manner is printed between two silver electrodes. did.

  This ceramic green sheet was laminated, pressed and fired with other sheets to obtain a ceramic substrate in which a resistive film was formed between silver electrodes. When the resistance value of the resistance film on the ceramic substrate was measured, a resistance value of 5.4 kΩ was obtained.

  As Comparative Example 1, only the resistance ink 1 is ejected, and a square pattern for connecting two silver electrodes on the ceramic green sheet is printed. A ceramic substrate having a resistance film formed only with the resistance ink 1 was obtained. When the resistance value of the resistance film using only the resistance ink 1 was measured, a resistance value of 84 kΩ was obtained.

  As Comparative Example 2, only the resistance ink 2 is ejected, a square pattern connecting the two silver electrodes on the ceramic green sheet is printed, and laminated, pressed, and fired in the same manner as in Example 1, and then between the silver electrodes. A ceramic substrate having a resistance film formed only with the resistance ink 2 was obtained. When the resistance value of the resistance film using only the resistance ink 2 was measured, a resistance value of 2.3 kΩ was obtained.

  As can be seen from the above specific examples, the resistance value of the resistance film manufactured by separately applying the resistance ink 1 and the resistance ink 2 is the resistance value of the resistance film manufactured only by the resistance ink 1 and only by the resistance ink 2. The resistance value of the resistance film can be set to an intermediate value.

  <Example 2> Example 2 will be described with reference to FIGS.

  Also in Example 2, printing is performed using an inkjet printer.

  As schematically shown in FIG. 4, printing is performed substantially simultaneously at substantially the same position from the inkjet heads 14 and 16 on the substrate 8 placed on the moving table 12. At this time, printing is performed so that part or all of the dots 1a of the resistance ink 1 discharged from the inkjet head 14 and part or all of the dots 2a of the resistance ink 2 discharged from the inkjet head 16 overlap. Also, before the dots 1a of the resistance ink 1 are dried, the dots 2a of the resistance ink 2 are overlapped so that the resistance ink 1 of the dot 1a and the resistance ink 2 of the dot 2a are mixed. Ultrasound may be applied to facilitate mixing. By mixing, a part of the component of the resistance ink 1 and a part of the component of the resistance ink 2 may chemically react or an alloy may be formed.

  During printing, it is preferable to cool the moving table 12 to room temperature or a temperature lower than room temperature, for example, so that the substrate 8 is brought to a state at room temperature or a temperature lower than room temperature (for example, less than 25 ° C.). In this case, by delaying the drying of the resistance ink and lengthening the mixing time of the resistance ink, variation in the resistance value of the resistance film can be reduced, and a stable resistance value can be obtained.

  By mixing the resistance inks, as schematically shown in the plan view of FIG. 5, the mixing portion 3 in which the plurality of resistance inks 1 and 2 are mixed is formed between the terminals 4 and 6. A resistance film is formed between the terminals 4 and 6 by drying and firing the mixing portion 3.

  The resistance value of the resistance film between the terminals 4 and 6 can be changed, for example, by changing the program parameters of the control unit 11 to change the mixing ratio of the resistance inks 1 and 2, the printing area, the printing pattern (planar shape, cross-sectional shape), And you can change it. The mixing ratio of the resistance inks 1 and 2 can be changed by changing the size (the amount of ink droplets) and the number of dots 1a and 2a of the resistance inks 1 and 2 and the number of overprints.

  If the dots 1a and 2a are printed at a uniform pitch while keeping the mixing ratio of the resistance inks 1 and 2 constant, a substantially uniform resistance film can be formed between the electrodes 4 and 6.

  The mixing ratio of the resistance inks 1 and 2 for mixing the resistance inks 1 and 2 to obtain a resistance film having a desired electrical resistance is, for example, by using a law called “volume mixing rule” (the following formula (1)). Can be predicted.

In other words, the resistivity and dielectric constant of a composite material formed by mixing a plurality of component materials, when the two components are used, the following approximate expression holds.
V _total log ρ _total = V ₁ log ρ ₁ + V ₂ log ρ ₂ (1)
Here, V _total is the volume of the composite material. ρ _total is the resistivity of the composite material. V ₁ and V ₂ are volumes of the components 1 and 2 in the composite material. ρ ₁ and ρ ₂ are the resistivity of the components 1 and 2.

  Next, a specific example will be described.

  Using the same inkjet printer and resistive inks 1 and 2 as in the specific example of Example 1, the resistive inks 1 and 2 are ejected, and a plurality of dots of the resistive inks 1 and 2 are printed so as to overlap each other. A pattern to be a resistance film was formed while mixing the resistance inks 1 and 2. At that time, the moving table was not heated and was at room temperature (25 ° C.), the drying of the ink on the ceramic green sheet was delayed, and sufficient time was secured for mixing the resistance inks 1 and 2.

  When another sheet was laminated, pressed and fired on the green sheet on which the pattern to be the resistance film was printed in this way, and the resistance value of the resistance film was measured, a resistance value of 15.3 kΩ was obtained. This resistance value is an intermediate value between the resistance value of the resistance film manufactured only with the resistance ink 1 of Comparative Example 1 described above and the resistance value of the resistance film manufactured only with the resistance ink 2 of Comparative Example 2 described above. .

  <Example 3> Example 3 will be described with reference to FIG.

  The pattern shown in the plan view of FIG. 6A is a plurality of (4 × 6 in the figure) dots 1a of the resistive ink 1 arranged in a square on the terminal 4 side as in the pattern of FIG. The second group 2s including a plurality of (4 × 6 in the figure) resistive ink 2 dots 2a arranged in a square is arranged on the terminal 6 side. A third group including a plurality of dots 1a of a plurality of resistance inks 1 in a region 5s between the first group 1s and the second group 2s and a plurality of resistance inks as in the pattern of FIG. The fourth groups including the two dots 2a are alternately arranged in a staggered manner. The dots 1a and 2a overlap each other, and the first to fourth groups are continuous.

  The pattern shown in the plan view of FIG. 6B is a plurality of (4 × 6 in the figure) dots 1a of the resistive ink 1 arranged in a square on the terminal 4 side as in the pattern of FIG. 2D. The second group 2t including a plurality of (in the figure, 4 × 6) dots 2a of the resistance ink 2 arranged in a square is arranged on the terminal 6 side. In the region 5t between the first group 1t and the second group 2t, as shown in the pattern of FIG. A third group including six dots 1a of resistive ink 1 and a plurality (six in the figure) of dots 2a of resistive ink 2 arranged in a direction perpendicular to the direction connecting the terminals 4 and 6; The fourth group is alternately arranged in the direction connecting the terminals 4 and 6. The dots 1a and 2a overlap each other, and the first to fourth groups are continuous.

  If the dots 1a and 2a having different resistance values are arranged as shown in FIGS. 6A and 6B, a resistance inclination can be provided between the terminals 4 and 6. FIG. For example, when the dot 1a of the resistance ink 1 including Pd having a relatively large electric resistance and the dot 2a of the resistance ink 2 including Ag having a relatively small electric resistance are arranged, the lower terminal 4 is moved downward from the upper terminal 4 in the figure. The resistance can be inclined so that the electric resistance gradually decreases toward the terminal 6.

  By providing a resistance gradient in this way, impedance matching between the circuit side and the ground side can be achieved without providing a so-called shunt resistor separately, and the effect of grounding can be reliably obtained by a simple method.

  It should be noted that the terminal 4 is not limited to the case where both the dot 1a of the resistance ink 1 and the dot 2a of the resistance ink 2 are metal, and one of them is a metal and the other is other than a metal such as ruthenium oxide, glass or carbon. , 6 can be provided with a resistance gradient.

  <Summary> According to Examples 1 and 2 described above, resistance elements having various resistance values can be efficiently manufactured.

  That is, it is not necessary to prepare a large number of screen plates by printing the resistance ink using the ink jet. Thereby, since the plate manufacturing cost can be reduced, the electronic component can be manufactured at a low cost. In addition, since the plate production period is eliminated, it becomes possible to cope with short delivery times.

  In addition, since it is easy to change the printing pattern in the ink jet, it is possible to easily produce resistance films having different resistance values by changing the planar shape, cross-sectional shape, and the like of the pattern to be the resistance film.

  The present invention is not limited to the above-described embodiment, and can be implemented with various modifications.

  For example, three or more types of resistance ink may be used. It is also possible to produce a resistance element by arranging a plurality of types of dots having different electric resistances using a laser printer instead of ink jet.

Claims (10)

A pair of terminals facing each other;
In an electronic component comprising a resistance element disposed between the pair of terminals,
The resistance element includes at least two resistance parts (hereinafter referred to as “first resistance part” and “second resistance part”) arranged in succession,
The first resistance unit includes a plurality of first dots arranged to overlap each other,
The electronic component according to claim 1, wherein the second resistance portion includes a plurality of second dots having different electric resistances from the first dots arranged to overlap each other.   The electronic component according to claim 1, wherein the first resistor portion and the second resistor portion are arranged in series between the terminals.   The electronic component according to claim 1, wherein the first resistor portion and the second resistor portion are arranged in parallel between the terminals.   The electronic component according to claim 1, wherein at least one of the first resistance portion and the second resistance portion is a metal. A first step of disposing a plurality of first dots overlapping each other by an ink-jet method using a first resistive ink containing a component that becomes a part of a resistive element in a first region of the substrate;
In a second region adjacent to the first region, a second resistive ink containing a component that is another part of the resistive element and having a composition different from that of the first resistive ink is used. A second step of arranging a plurality of second dots overlapping each other;
A third step of heat-treating the first dot in the first region and the second dot in the second region to form the resistance element;
A method for producing an electronic component, comprising:   6. The method of manufacturing an electronic component according to claim 5, further comprising a dot drying step of drying the first dots before the second step.   The said dot drying process dries the said 1st dot by making the said base material into temperature higher than normal temperature in the said 1st process, The manufacturing method of the electronic component of Claim 6 characterized by the above-mentioned. .   8. The method of manufacturing an electronic component according to claim 6, wherein in the dot drying step, the first dot is dried by performing the first step in a dry atmosphere. 9. A first step of disposing a plurality of first dots by an inkjet method using a first resistance ink containing a component to be a resistance element on a substrate;
Using a second resistance ink containing a component that serves as the resistance element and having a composition different from that of the first resistance ink, a plurality of second dots are arranged so as to overlap the first dots by an inkjet method. A second step of mixing the first resistance ink of the first dot and the second resistance ink of the second dot to form a mixing unit;
A third step of heat-treating the mixing portion to form the resistance element;
A method for producing an electronic component, comprising:   10. The method of manufacturing an electronic component according to claim 9, wherein in the first step and the second step, the temperature is set to room temperature or lower than room temperature.

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