JP4180329B2 - Pickup method of semiconductor chip - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor chip pickup method for picking up a semiconductor chip that has been cut out from a wafer and attached to an adhesive sheet.
[0002]
[Prior art]
With the recent miniaturization of electronic components, semiconductor chips tend to be thinner, and ultra-thin semiconductor chips of 100 μm or less have come into practical use. However, such a thinned semiconductor chip is very easy to break, so that it is difficult to handle, and in particular, it is very difficult to take out individual semiconductor chips cut out from a wafer. In this work, the operation of picking up the semiconductor chip attached to the adhesive sheet by the suction nozzle while peeling the individual pieces from the adhesive sheet is repeatedly performed, but it is conventionally used for thin semiconductor chips. If the semiconductor chip peeling method, that is, the method of pushing up the semiconductor chip with a needle from the lower side of the adhesive sheet is used, problems such as cracking and chipping of the semiconductor chip occur frequently.
[0003]
In order to solve this problem, a method of peeling the adhesive sheet from the lower surface of the semiconductor chip by a vacuum suction force when the semiconductor chip is taken out from the adhesive sheet is used (for example, see Patent Document 1). According to this method, since there is no need to push up the semiconductor chip with the needle, it is possible to prevent problems such as cracking and chipping.
[0004]
[Patent Document 1]
JP 2001-118862 A
[0005]
[Problems to be solved by the invention]
However, in the above method, it is difficult to peel off the pressure-sensitive adhesive sheet only by vacuum suction of the pressure-sensitive adhesive sheet from below. Auxiliary means for promoting the peeling of the pressure-sensitive adhesive sheet, for example, the vacuum suction surface relative to the lower surface of the pressure-sensitive adhesive sheet It is necessary to use a peeling promotion operation such as lowering the adhesive strength by moving it. For this reason, complicated control of the mechanical system is required, and a delay in tact time due to repetition of complicated operations for each pickup operation is unavoidable, and high productivity cannot be realized.
[0006]
SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor chip pick-up method capable of preventing defects such as cracks and chips and realizing high productivity for thin semiconductor chips.
[0007]
[Means for Solving the Problems]
The method for picking up a semiconductor chip according to claim 1 is a method for picking up a semiconductor chip in which a semiconductor chip attached to an adhesive sheet is picked up by a pickup head, wherein the suction surface of the adhesive sheet peeling mechanism is provided on the lower surface of the adhesive sheet. A pressure-sensitive adhesive sheet peeling step for peeling the pressure-sensitive adhesive sheet from the semiconductor chip by abutting and vacuuming from the suction surface, and a suction holding for picking up and picking up the upper surface of the semiconductor chip from which the pressure-sensitive adhesive sheet has been peeled off The suction surface has a plurality of linear suction grooves and a boundary part that separates adjacent suction grooves and supports the lower surface of the pressure-sensitive adhesive sheet in vacuum suction, and In the adhesive sheet peeling step, the plurality of boundary portions that are the same surface as the suction surface of the semiconductor chip Therefore, while supporting through the adhesive sheet and vacuum suction from the suction groove, the semiconductor chip adhered to the adhesive sheet can be continuously bent from one outer edge to the other outer edge of the semiconductor chip. The adhesive sheet is bent and deformed with substantially the same bending shape, and the pressure-sensitive adhesive sheet is peeled off from the lower surface of the semiconductor chip by the bending deformation, and the shape of the semiconductor chip is rectangular, and the bending range is the rectangular shape. It is set in a direction that forms a predetermined angle with respect to one side of the semiconductor chip, and the bending range adjusts a relative position of the adhesive sheet peeling mechanism with respect to the adhesive sheet so as to include a corner end portion of the semiconductor chip. I made it .
[0011]
According to the present invention, in the pressure-sensitive adhesive sheet peeling step in which the pressure-sensitive adhesive sheet is peeled from the semiconductor chip by bringing the pressure-sensitive adhesive surface into contact with the lower surface of the pressure-sensitive adhesive sheet and vacuum-sucking from the pressure-sensitive adhesive surface, Highly productive pick-up operation without causing defects such as cracks and chipping by bending and deforming the semiconductor chip attached to the adhesive chip together with the adhesive sheet, and peeling the adhesive sheet from the lower surface of the semiconductor chip by this bending deformation Can be realized. In this case, the shape of the semiconductor chip is rectangular, and the bending range is set in a direction that forms a predetermined angle with respect to one side of the rectangular semiconductor chip. Opening is likely to occur. In particular, since the bending range includes the corner end portion of the semiconductor chip, the mouth opening is remarkably generated at the corner end portion that is projecting in the outer edge portion of the semiconductor chip. When the mouth opening occurs, the pressure difference between the pressure groove and the inside of the suction groove acts on this part of the adhesive sheet to further promote the mouth opening, and the vicinity of the corner end portion separated from the adhesive sheet by the mouth opening is: The flexure is reduced by the elastic restoring force of the chip, which further promotes the opening of the semiconductor chip and the adhesive sheet to promote the peeling, and consequently increases the opening area of the semiconductor chip. It can be separated adhesive sheet over the entire range of the lower surface.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a block diagram showing a configuration of a semiconductor chip pickup device according to an embodiment of the present invention, FIG. 2 is a perspective view of an adhesive sheet peeling mechanism of the semiconductor chip pickup device according to an embodiment of the present invention, and FIG. FIG. 4 is a partial cross-sectional view of an adhesive sheet peeling mechanism of a semiconductor chip pickup device according to an embodiment of the present invention. FIG. 4 is an explanatory view of the shape of an adsorption peeling tool of the semiconductor chip pickup device according to an embodiment of the present invention. 5, FIG. 6, FIG. 7 and FIG. 8 are diagrams for explaining the operation of peeling the adhesive sheet in the method for picking up a semiconductor chip according to one embodiment of the present invention. FIG. 9 is a pick-up device for a semiconductor chip according to one embodiment of the present invention. It is a top view of the adsorption peeling tool.
[0013]
First, the configuration of a semiconductor chip pickup device will be described with reference to FIG. In FIG. 1, the chip supply unit 1 is configured by connecting a holding table 4 on a bracket 3 erected on an XY table 2. The holding table 4 holds an adhesive sheet 5 to which a large number of rectangular semiconductor chips 6 (hereinafter simply referred to as “chips 6”) are attached.
[0014]
Here, the chip 6 is a thin chip that has been thinned, and has a characteristic that it has low rigidity and is easily bent. As the material of the pressure-sensitive adhesive sheet 5, a silicone-based resin that is easily bent is used, and the pressure-sensitive adhesive sheet 5 easily bends and deforms together with the chip 6 when the chip 6 is attached. In the pressure-sensitive adhesive sheet peeling operation described later, the pressure-sensitive adhesive sheet 5 is peeled off from the lower surface of the chip 6 by using this property to bend and deform the pressure-sensitive adhesive sheet 5 together with the chip 6.
[0015]
An adhesive sheet peeling mechanism 7 is disposed below the holding table 4. The pressure-sensitive adhesive sheet peeling mechanism 7 has a suction surface that contacts and sucks the lower surface of the pressure-sensitive adhesive sheet 5. In pressure-sensitive adhesive sheet peeling operation, the pressure-sensitive adhesive sheet 5 is bent together with the chip 6 by vacuum suction from the suction surface. Deform.
[0016]
Above the chip supply unit 1, a pickup head 8 mounted on a moving table 9 is disposed so as to be horizontally movable. The chip 6 from which the adhesive sheet 5 has been peeled is vacuum-sucked by a suction nozzle 8 a of the pickup head 8. Is picked up by. The picked-up chip 6 is mounted on the workpiece 11 placed on the substrate holding table 10 by the pickup head 8 that moves by the moving table 9.
[0017]
Above the holding table 4, an imaging unit 12 including a camera 13 is disposed. The imaging unit 12 images the chip 6 on the adhesive sheet 5, and the image data acquired by the imaging is transmitted to the image recognition unit 14. The image recognition unit 14 performs image processing on the image data and detects the position of the chip 6. The calculation unit 15 is a CPU, and performs various operation processes and calculations by executing a program stored in the storage unit 16. That is, in addition to receiving the recognition result of the image recognition unit 14, each unit described below is controlled.
[0018]
The storage unit 16 stores various data such as a program necessary for the operation of each unit, the size of the chip 6 to be recognized, and arrangement data on the adhesive sheet 5. The mechanism control unit 17 controls the pickup head 8, the moving table 9 that moves the pickup head, the adhesive sheet peeling mechanism 7, and the XY table 2. The display unit 18 displays a captured image of the chip 6 and a screen at the time of operation / input. The operation / input unit 19 is an input device such as a keyboard, and performs operation input and data input.
[0019]
Next, the configuration of the pressure-sensitive adhesive sheet peeling mechanism 7 will be described with reference to FIGS. As shown in FIG. 2, the adhesive sheet peeling mechanism 7 includes a mechanism main body 20, a support shaft 21 that is rotatably supported by the mechanism main body 20, and an adsorption peeling tool 22. The suction peeling tool 22 is prepared separately according to the shape and size of the target chip 6, and is attached to the upper surface of the support shaft portion 21 by bolts 23 using bolt holes 22e (see FIG. 4). The
[0020]
The upper surface of the suction peeling tool 22 is a suction surface 22a that abuts on the adhesive sheet 5 and vacuum-sucks. A plurality of linear suction grooves 22 b are formed on the suction surface 22 a, and suction holes 22 c provided at the bottom of each suction groove 22 b communicate with the inner holes 21 a of the support shaft portion 21. The internal hole 21a is connected to a vacuum suction source 25, and by driving the vacuum suction source 25, vacuum suction can be performed from the suction groove 22b. Here, a plurality of suction holes 22c are provided for one suction groove 22b, and vacuum suction in the suction groove 22b is possible even when one suction hole 22c is closed.
[0021]
A rotation drive mechanism 24 shown in FIG. 3 is built in the mechanism main body 20, and the adsorption peeling tool 22 can be rotated around the vertical axis by the rotation drive mechanism 24. Thereby, the plane angle around the vertical axis of the suction surface 22a of the suction peeling tool 22 can be set to an arbitrary angle, and the direction of the suction groove 22b is set to one side of the rectangular chip 6 to be peeled as will be described later. On the other hand, it can be set at a predetermined angle that is optimal for the adsorption and peeling operation. Instead of rotating the suction / peeling tool 22, a configuration in which the holding table 4 is rotated by θ may be used. Further, as will be described later, there is no need to provide a rotating mechanism at all.
[0022]
Next, the shape of the suction groove 22b formed on the suction surface 22a will be described with reference to FIG. As shown in FIG. 4, the suction surface 22a is provided with four rows of suction grooves 22b having a width B and a length L. Adjacent suction grooves are separated from each other by a boundary portion 22d, and no protrusions are provided in each suction groove 22b so that the deformation deformation of the adhesive sheet 5 is not hindered when the adhesive sheet 5 is adsorbed. It has become.
[0023]
The width B and length L of the suction grooves 22b and the number of grooves arranged are set according to the size of the target chip 6, and in the state where the suction surface 22a is in contact with the lower surface of the adhesive sheet 5, The width B of the suction groove 22d, the suction surface 22a, and the chip so that the range corresponding to one chip 6 is sucked by the plurality of suction grooves 22b and the end of the chip 6 is not located immediately above the boundary 22d. 6 is set (see FIG. 5).
[0024]
When vacuum suction is performed by the suction surface 22a, the boundary portion 22d is the same surface as the suction surface 22a. Therefore, the upper surfaces of the plurality of boundary portions 22d that divide the plurality of suction grooves 22b come into contact with the lower surface of the adhesive sheet 5. And support from below. That is, the tip 6 is similarly supported by the plurality of boundary portions 22d via the adhesive sheet 5, and the posture of the tip 6 is held horizontally during the suction process.
[0025]
Then, by performing vacuum suction in this state, the chip 6 attached to the adhesive sheet 5 is bent and deformed together with the adhesive sheet 5 as will be described later, and the adhesive sheet 5 is peeled off from the lower surface of the chip 6 by this bending deformation. . In addition, as the boundary part 22d, it is not necessary to completely divide each suction groove 22b with a continuous partition surface, and it may be a discontinuous shape in which the middle is interrupted. Further, the upper surface is located on the same surface as the suction surface 22a. The structure which provides the column-shaped partition part to perform in the shape of a point sequence may be sufficient.
[0026]
The semiconductor chip pick-up device is configured as described above. Next, the peeling operation of the adhesive sheet 5 in the pick-up process of the chip 6 will be described with reference to each drawing. First, the pressure-sensitive adhesive sheet 5 to which the chip 6 is attached is held on the holding table 4 (see FIG. 1). Next, the suction surface 22 a of the pressure-sensitive adhesive sheet peeling mechanism 7 is brought into contact with the lower surface of the pressure-sensitive adhesive sheet 5.
[0027]
At this time, as shown in FIG. 5, the adhesive sheet peeling mechanism is such that the suction groove 22b is set to a predetermined angle α (45 ° in this example) with respect to the side 6a of the chip 6 to be peeled. 7 is driven to adjust the rotation angle of the suction peeling tool 22. If no rotating mechanism is provided, the suction groove 22b is sucked so as to be at a predetermined angle α (45 ° in this example) with respect to the side 6a of the chip 6 to be peeled. The peeling tool 22 may be designed and manufactured and installed. Further, the relative position of the pressure-sensitive adhesive sheet peeling mechanism 7 with respect to the pressure-sensitive adhesive sheet 5 is adjusted so that the corner end portion 6b of the chip 6 is not located immediately above the boundary portion 22d but is positioned approximately in the middle of the suction groove 22b in the width direction. To do. In each drawing after FIG. 5, among the chips 6 attached to the adhesive sheet 5 in a grid pattern, only the target chip 6 is shown in the adsorption peeling operation, and the other chips are not shown. Yes.
[0028]
Next, an adsorption peeling operation is performed. First, the vacuum suction source 25 is driven, and as shown in FIG. 6A, vacuum suction is performed through the suction hole 22c, and the chip 6 adhered to the adhesive sheet 5 is recessed into the suction groove 22d. Bend and deform. The deformation behavior at this time will be described with reference to FIGS.
[0029]
FIG. 7A shows the support position and deformation range of the chip 6. In this example, the chip 6 is supported from below by three boundary portions 22d with the diagonal position as the center. Then, by vacuum suction in this state, as shown in FIG. 7B, a uniform pressure from above is applied to the chip 6 due to a pressure difference generated between the suction groove 22b and the outside by vacuum suction. . With this pressing force, the chip 6 is bent and deformed together with the adhesive sheet 5 into a convex shape. Further, the pressing force due to this pressure difference directly acts on the pressure-sensitive adhesive sheet 5b in the range corresponding to the dicing grooves on the outside of each side of the chip 6.
[0030]
The bending deformation of the chip 6 extends from the outer edge part of one side 6a of the chip 6 to the outer edge part of the other side 6a as shown by the hatched area between the boundary parts 22d in the plan view of FIG. In a continuous bending range, the same bending shape occurs. That is, the bending range is set in a direction that forms an angle α with respect to the side 6 a of the chip 6. In this bending deformation, the amount of displacement in the film direction differs due to the difference in mechanical properties between the chip 6 and the adhesive sheet 5, and as a result, a relative slip occurs at the bonding interface 5 a between the chip 6 and the adhesive sheet 5. .
[0031]
When the suction from the suction hole 22c is further continued, the deflection amount D increases and a large deflection deformation occurs. Thereby, the relative slip of the sticking interface 5a increases, and the adhesive force between the chip 6 and the adhesive sheet 5 decreases. As the adhesion decreases, as shown in FIG. 8B, a mouth opening (see a gap G indicated by an arrow in the figure) where the sticking interface 5a is partially separated at the outer edge portion of the chip 6 is likely to occur. .
[0032]
This mouth opening occurs remarkably in the corner end portion 6b which has a protruding shape in the outer edge portion of the chip 6. Once the mouth opening occurs, the pressure difference of the pressure difference from the inside of the suction groove 22b acts on the adhesive sheet 5 in this portion, and the mouth opening is further promoted. Then, in the vicinity of the corner end portion 6b separated from the adhesive sheet 5 by the opening, the flexure is reduced by the elastic restoring force of the chip 6, thereby promoting the opening of the chip 6 and the adhesive sheet 5 to promote the peeling. Acts as follows. Thus, by increasing the opening area, only the adhesive sheet 5 is pushed down by vacuum suction from the suction hole 22c, and as shown in FIG. The adhesive sheet 5 is peeled off.
[0033]
Thereafter, the peeling of the adhesive sheet 5 from the chip 6 further proceeds, and the chip 6 is elastically restored when the adhesive sheet 5 is adsorbed to the suction hole 22c in the suction groove 22b as shown in FIG. 6B. The deflection disappears due to the force, and the flat state is restored. At this time, since a plurality of suction holes 22c are provided in the suction groove 22b, vacuum suction is continued from the other suction holes 22c even when one suction hole 22c is closed by the adhesive sheet 5. it can. This adsorption peeling operation is completed within a short time of several tens of ms or less, and the adhesive sheet can be peeled off very efficiently. Then, as shown in FIG. 6C, the pickup of the chip 6 is completed by moving the suction nozzle 8a up and down with respect to the chip 6 and taking it out.
[0034]
As described above, in the pressure-sensitive adhesive sheet peeling operation shown in the present embodiment, the pressure-sensitive adhesive sheet is attached to the pressure-sensitive adhesive sheet to such an extent that the sticking force at the sticking interface of the chip 6 is reduced and a mouth opening occurs between the pressure-sensitive adhesive sheet 5. 5, the adhesive sheet 5 and the chip 6 are peeled off from the entire surface starting from the generated opening portion.
[0035]
Thereby, auxiliary means for promoting the peeling of the pressure-sensitive adhesive sheet, for example, a conventional technique requiring a combination of peeling-promoting operations such as reducing the adhesive force by moving the vacuum suction surface relative to the lower surface of the pressure-sensitive adhesive sheet in the surface direction. Compared with this method, an extremely excellent pressure-sensitive adhesive sheet peeling method is realized.
[0036]
That is, in the peeling operation, the suction surface 22a of the suction peeling tool 22 only needs to be brought into contact with the pressure-sensitive adhesive sheet 5 and vacuum suction is performed, so that complicated control of the mechanical system that is indispensable in the conventional method is not required. In addition, the tact time is not delayed by repeating a complicated operation for each pickup operation. This makes it possible to prevent defects such as cracks and chips and achieve high productivity for thin semiconductor chips.
[0037]
In the shape and arrangement of the suction grooves in the suction / peeling tool 22, instead of arranging a plurality of suction grooves having the same shape, suction grooves having different shapes may be combined as shown in FIG. In the example shown here, three suction grooves 32a having a width B1 are arranged on the upper surface of the suction peeling tool 32, and further, suction grooves 32b having a width B2 wider than B1 are arranged outside the suction grooves 32a. The example which provided the suction hole 32c in 32b is shown. As described above, by increasing the width of the suction groove 32b located on the outer side, it is possible to secure a large overhang of the corner end portion 6b of the chip 6 and to facilitate the opening of the mouth. is there.
[0038]
In the above embodiment, an example in which the diagonal direction of the chip 6 is aligned with the direction of the suction groove 22b and the side 6a of the chip 6 is set at an angle of 45 ° with respect to the suction groove 22b is shown. It turns out to be desirable. However, depending on the combination of conditions such as the rigidity of the chip 6 and the adhesive sheet 5, the width B of the suction groove 22b, and the vacuum suction force, the side 6a may be substantially aligned with the direction of the suction groove 22b. In short, it is only necessary to realize a condition for generating sufficient bending deformation to cause an opening at the bonding interface of the outer edge portion of the chip 6 by vacuum suction.
[0039]
Note that the suction nozzle 8a may be lowered with respect to the chip 6, and the suction of the chip 6 by the suction nozzle 8a may be performed during the operation of the adhesive sheet peeling mechanism shown in the present embodiment. In this case, the suction force of the chip 6 by the suction nozzle 8a is made not to exceed the pressing force generated in the chip 6 by vacuum suction from the suction hole 22c. Thereby, the bending deformation | transformation sufficient to produce a mouth opening in the sticking interface of the outer edge part of the chip | tip 6 can be generated.
[0040]
【The invention's effect】
According to the present invention, in the pressure-sensitive adhesive sheet peeling step in which the pressure-sensitive adhesive sheet is peeled from the semiconductor chip by bringing the pressure-sensitive adhesive surface into contact with the lower surface of the pressure-sensitive adhesive sheet and vacuum-sucking from the pressure-sensitive adhesive surface, Highly productive without causing defects such as cracks and chipping, because the adhesive chip is bent and deformed together with the adhesive sheet and the adhesive sheet is peeled off from the lower surface of the semiconductor chip by this deformation. A pickup operation can be realized. In this case, the shape of the semiconductor chip is rectangular, and the bending range is set in a direction that forms a predetermined angle with respect to one side of the rectangular semiconductor chip. Opening is likely to occur. In particular, since the bending range includes the corner end portion of the semiconductor chip, the mouth opening is remarkably generated at the corner end portion that is projecting in the outer edge portion of the semiconductor chip. When the mouth opening occurs, the pressure difference between the pressure groove and the inside of the suction groove acts on this part of the adhesive sheet to further promote the mouth opening, and the vicinity of the corner end portion separated from the adhesive sheet by the mouth opening is: The flexure is reduced by the elastic restoring force of the chip, which further promotes the opening of the semiconductor chip and the adhesive sheet to promote the peeling, and consequently increases the opening area of the semiconductor chip. It can be separated adhesive sheet over the entire range of the lower surface.
[Brief description of the drawings]
FIG. 1 is a block diagram showing a configuration of a semiconductor chip pickup device according to an embodiment of the present invention. FIG. 2 is a perspective view of an adhesive sheet peeling mechanism of a semiconductor chip pickup device according to an embodiment of the invention. 3 is a partial cross-sectional view of the adhesive sheet peeling mechanism of the semiconductor chip pickup device according to the embodiment of the present invention. FIG. 4 is an explanatory view of the shape of the adsorption peeling tool of the semiconductor chip pickup device according to the embodiment of the invention. FIG. 5 is an operation explanatory diagram of an adhesive sheet peeling operation in the semiconductor chip pickup method of one embodiment of the present invention. FIG. 6 is an operation explanation of an adhesive sheet peeling operation in the semiconductor chip pickup method of one embodiment of the present invention. FIG. 7 is an operation explanatory diagram of an adhesive sheet peeling operation in the semiconductor chip pickup method according to the embodiment of the present invention. Plan view of the suction exfoliation tool in the form of a semiconductor chip to an embodiment of the semiconductor chip pick-up apparatus operation explanatory diagrams [9] The present invention of the pressure-sensitive adhesive sheet peeling operation in the pickup method EXPLANATION OF REFERENCE NUMERALS
DESCRIPTION OF SYMBOLS 1 Chip supply part 4 Holding table 5 Adhesive sheet 6 Semiconductor chip 6a Side (outer edge part)
6b Corner end portion 7 Adhesive sheet peeling mechanism 8 Pickup head 22 Adsorption peeling tool 22a Adsorption surface 22b Suction groove 22c Suction hole 22d Boundary portion

Claims (1)

A semiconductor chip pickup method for picking up a semiconductor chip attached to an adhesive sheet with a pickup head, wherein the suction surface of the adhesive sheet peeling mechanism is brought into contact with the lower surface of the adhesive sheet and vacuum suction is performed from the suction surface A pressure sensitive adhesive sheet peeling step for peeling the pressure sensitive adhesive sheet from the semiconductor chip, and a suction holding step for picking up and picking up the upper surface of the semiconductor chip from which the pressure sensitive adhesive sheet has been peeled by the pickup head. And adsorbing the semiconductor chip in the pressure-sensitive adhesive sheet peeling step, and separating the adjacent suction grooves from each other and a boundary portion that contacts and supports the lower surface of the pressure-sensitive adhesive sheet during vacuum suction. While supporting the adhesive sheet via the plurality of boundary portions that are the same surface as the surface, By vacuum suction from the suction groove, the semiconductor chip attached to the adhesive sheet is bent and deformed together with the adhesive sheet in substantially the same bending shape in the continuous bending range from one outer edge part of the semiconductor chip to the other outer edge part. The pressure-sensitive adhesive sheet is peeled off from the lower surface of the semiconductor chip by the bending deformation, and the shape of the semiconductor chip is a rectangle, and the bending range has a predetermined angle with respect to one side of the rectangular semiconductor chip. A method for picking up a semiconductor chip, wherein the relative position of the adhesive sheet peeling mechanism with respect to the adhesive sheet is adjusted so that the bending range includes a corner end portion of the semiconductor chip.

Images