JP4036933B2

JP4036933B2 - Resistance / temperature fuse and manufacturing method thereof

Info

Publication number: JP4036933B2
Application number: JP27509197A
Authority: JP
Inventors: 充明植村
Original assignee: Uchihashi Estec Co Ltd
Current assignee: Uchihashi Estec Co Ltd
Priority date: 1997-09-22
Filing date: 1997-09-22
Publication date: 2008-01-23
Anticipated expiration: 2017-09-22
Also published as: JPH1196871A

Description

【０００１】
【発明の属する技術分野】
回路保護素子の一つとして、温度ヒュ−ズエレメントと抵抗エレメントとを近接配置でユニット化した抵抗・温度ヒュ−ズが使用されており、回路に異常検出器と共に組み込み、回路の異常発生時、異常検出器による回路の異常検出で抵抗エレメントを通電発熱させ、その発生熱で温度ヒュ−ズエレメントを溶断させて回路を電源から遮断している。
かかる抵抗・温度ヒュ−ズとして、セラミックス基板の片面に膜抵抗と低融点可溶合金片とを併設し、その片面をエポキシ樹脂等の封止材で封止した、基板型が公知である。
【０００２】
【発明が解決しようとする課題】
しかしながら、この基板型抵抗・温度ヒュ−ズでは、セラミックス基板の片面に膜抵抗を設けてあり、膜抵抗の通電発熱時、セラミックス基板が不均一に加熱されるため、セラミックス基板に熱曲げモ−メントが作用し、膜抵抗の通電電力が大きい場合は、セラミックス基板に反りによる亀裂が発生し破片が周囲に飛散して危険である。
【０００３】
抵抗・温度ヒュ−ズとして、図３の（イ）に示すように未焼成セラミックス基板１１’上に膜抵抗パタ−ン２０’と膜電極パタ−ン２１’，２２’とを印刷して第１構体１ａ’を成形し、図３の（ロ）に示すように上記膜電極パタ−ン２１’，２２’を露出させるように切り欠いた未焼成セラミックス基板１２’上にヒュ−ズ取付用膜電極３１’，３２’を印刷して第２構体１ｂ’を成形し、図３の（ハ）に示すように第１構体１ａ’に第２構体１ｂ’を加圧積層し焼成して両構体を焼結一体化し、而るのち、図３の（ニ）に示すように、ヒュ−ズ取付用膜電極間に低融点可溶合金片３０’を接続し、各膜電極にリ−ド線ｅを接続し、低融点可溶合金片３０’にフラックス４’を塗布し、その上に封止材層（図示せず）を設けたものが提案されている（特開平９−６３４４２号）。
しかしながら、このようにして製作された抵抗・温度ヒュ−ズでも、第２構体の切り欠け部の部分が第１構体のセラミックス板のみの一枚部分となっており、この一枚部分における膜抵抗近傍箇所が膜抵抗の通電発熱で亀裂し易い。
【０００４】
本発明の目的は、基板型抵抗・温度ヒュ−ズにおいて、抵抗の通電発熱電力が大であっても、薄い基板厚さのもとで、基板の熱亀裂を良好に防止できる抵抗・温度ヒュ−ズ及びその製作方法を提供することにある。
【０００５】
【課題を解決するための手段】
本発明に係る抵抗・温度ヒュ−ズは、下側セラミックス基板と上側セラミックス基板とが焼成により積層一体化され、下側セラミックス基板の上面に配設された一対の抵抗取付用膜電極と膜抵抗とが前記の両セラミックス基板に焼結一体化され、前記の各抵抗取付用膜電極が下側セラミックス基板の下面に各スルーホ−ルにより電気的に導出され、上側セラミックス基板の上面に一対のヒューズ取付用膜電極が設けられ、これらのヒューズ取付用膜電極の一方と前記両スルーホ−ルの一方のスルーホ−ルの導出下端との間を導通したはんだ付着用電極、他方のスルーホ−ルの導出下端に導通したはんだ付着用電極、前記両ヒューズ取付用膜電極の他方に導通したはんだ付着用電極が積層体に設けられ、前記一対のヒューズ取付用膜電極間に温度ヒューズエレメントが接続されていることを特徴とする。
請求項２に係る抵抗・温度ヒューズの製作方法は、未焼成の下側セラミックス基板ａに上面から下面に至る一対のスルーホ−ルを形成し、その基板の上面に導電ペーストにより一対の抵抗取付用膜電極を印刷すると共に前記の各スルーホ−ルに導電ペーストを充填し、前記一対の抵抗取付用膜電極間に抵抗ペーストにより膜抵抗を印刷し、該未焼成の下側セラミックス基板ａ上に該基板と同一寸法の未焼成の上側セラミックス基板ｂを積層し、該上側セラミックス基板ｂの上面に一対のヒューズ取付用膜電極を導電ペーストにより印刷し、而るのち、基板ａ，ｂを焼成して焼結すると共に前記の各膜電極及びスルーホ−ルの導電ペースト並びに抵抗ヘーストを焼成し、次で、前記ヒューズ取付用膜電極の一方と前記両スルーホ−ルの一方のスルーホ−ルの導出下端との間を導通するはんだ付着用電極、他方のスルーホ−ルの導出下端に導通するたはんだ付着用電極、前記両ヒューズ取付用膜電極に導通したはんだ付着用電極を設け、次で、前記一対のヒューズ取付用膜電極間に温度ヒューズエレメントを接続することを特徴とする。
【０００６】
【発明の実施の形態】
以下、図面を参照しつつ本発明の実施の形態について説明する。
図１の（イ）は本発明に係る抵抗・温度ヒュ−ズの一例を示す平面図、図１の（ロ）は図１の（イ）におけるロ−ロ断面を示す図面、図１の（ハ）は図１の（ロ）におけるハ−ハ断面を示す図面である。
図１において、１は同一平面寸法の二枚のセラミックス基板１１，１２の積層体であり、焼成により積層界面が焼結一体化されている。２１，２２は積層界面に設けた抵抗取付用膜電極、２０はこれらの膜電極２１，２２間に橋設した膜抵抗である。２１１，２２１は各膜電極２１，２２を積層体１の裏面に電気的に導出するために設けたスルーホ−ルであり、導電材が充填されている。このスルーホ−ル充填導電材は膜電極２１，２２と同一材質、別材質の何れであってもよい。
３１，３２は上側セラミックス基板１２の上面に設けたヒュ−ズ取付用膜電極である。３０はヒュ−ズ取付用膜電極３１，３２間に橋設した温度ヒュ−ズエレメントとしての低融点可溶合金片、４は低融点可溶合金片３０上に塗布したフラックスである。３３は上側セラミックス基板１２に設けた補助膜電極である。３１０，３２０及び３３０は実装はんだ付着用電極、例えば銀電極である。
５は積層体の上面に温度ヒュ−ズエレメント３０を覆って被覆したエポキシ樹脂等の封止材であり、この封止材に代え、キャップ、例えばセラミックスキャップで封止することもでき、キャップ内を封止材で充填することもできる。
【０００７】
図２は図１に示した抵抗・温度ヒュ−ズの使用形態を示している。
図２において、Ａは本発明に係る温度ヒュ−ズ・抵抗体を、３０は温度ヒュ−ズエレメントとしての低融点可溶合金片を、２０は抵抗エレメントとしての膜抵抗を、３１０〜３３０は実装用電極をそれぞれ示し、回路ｚと電源ｓとの間に上記温度ヒュ−ズ・抵抗体Ａと過電圧検出通電器Ｆ（トランジスタ−Ｔｒのベ−ス側にツエナダイオ−ドＤを接続）とを挿入し、回路ｚにツエナダイオ−ドＤの降伏電圧以上の逆電圧が作用すると、ベ−ス電流が流れ、このベ−ス電流に応じてコレクタ電流が流れて抵抗エレメント２０が通電発熱され、この発生熱が温度ヒュ−ズエレメント３０に伝達されて温度ヒュ−ズエレメントとしての低融点可溶合金片３０が溶断され、回路ｚが電源ｓから遮断されるに至る。
【０００８】
この場合、温度ヒュ−ズ・抵抗体Ａのセラミックス積層体１が加熱されるが、発熱源である膜抵抗２０が積層体１の厚さのほぼ中央に存在しているので、セラミックス積層体１がその中央位置を基準として上下対称的に加熱され、熱曲げモ−メントの作用が充分に抑えられること、セラミックス基板１１，１２の積層体の積層界面が焼結一体化されかつ全体が二枚板構造とされて全体の曲げ剛性が充分に大きくされていること等のために、反りによる亀裂の発生をよく防止できる。
【０００９】
本発明に係る温度ヒュ−ズ・抵抗体おいて、電極やスルーホ−ル、温度ヒュ−ズエレメントや抵抗エレメントの個数や配置は、使用形態に応じて設定される。
また、本発明に係る抵抗・温度ヒュ−ズの上記の例は、実装面に実装はんだ付用電極において直接はんだ付けする構成とされているが、リ−ド線を取付けてラジアルまたはアクシャルタイプで使用することもできる。
【００１０】
本発明に係る上記抵抗・温度ヒュ−ズは次ぎのようにして製作できる。
（１）積層下側用の未焼成セラミックス基板にスルーホ−ルを形成し、上面に抵抗取付用膜電極パタ−ンを導電ペ−ストでスクリ−ン印刷すると共にそのスルーホ−ルを導電ペ−ストで充填し、更に上面に膜抵抗パタ−ンを抵抗ペ−ストでスクリ−ン印刷する。（２）更に、（１）の各種パタ−ン印刷の積層下側用の未焼成セラミックス基板に積層上側用の未焼成セラミックス基板を積層加圧し、この上側用未焼成セラミックス基板にヒュ−ズ取付用膜電極及び補助膜電極パタ−ンを導電ペ−ストで印刷する。（３）而るのち、積層体を焼成する。この焼成により各基板が焼結されると共に積層界面が焼結一体化され、各電極パタ−ンや膜抵抗ペ−ストと各基板との間が焼結一体化される。（４）更に、実装用のはんだ付け用電極を形成する。（５）更に、ヒュ−ズ取付用膜電極間に温度ヒュ−ズエレメントとしての低融点可溶合金片を橋設し、この低融点可溶合金片上にフラックスを塗布し、封止材を塗着するかキャップを装着し、これにて、抵抗・温度ヒュ−ズの製作を終了する。
上記において、積層上側用の未焼成セラミックス基板にスルーホ−ルを形成し、上面にヒュ−ズ取付用膜電極及び補助膜電極パタ−ンを導電ペ−ストで印刷すると共にスルーホ−ルを導電ペ−ストで充填したのち、この上側用未焼成セラミックス基板を上記（１）の未焼成セラミックス基板上に積層加圧し、而るのち、焼成することもできる。
【００１１】
上記の未焼成セラミックス基板にはアルミナ粉末にバインダ−、例えばブチラ−ルやアクリル樹脂を加えてテ−プ状に成形した、いわゆるグリ−ンシ−トを使用でき、抵抗ペ−ストには酸化ルテニウム等のペ−ストを使用でき、導電ぺ−ストにはＡｇペ−スト、Ａｇ−Ｐｄペ−スト、Ａｕペ−スト、Ｃｕペ−スト等を使用できる。
【００１２】
【発明の効果】
本発明に係る抵抗・温度ヒュ−ズにおいては、積層セラミックス基板の厚さのほぼ中央に膜抵抗を設けてあるから、膜抵抗の通電発熱による積層セラミックス基板の加熱を厚さ中央を基準として上下対称に行なわせ得て熱曲げ応力を充分に抑制でき、更に、積層セラミックス基板の積層界面とその界面の膜抵抗及び膜電極との焼結一体化により全体の曲げ剛性が充分に高くされているから、熱曲げモ−メントによるセラミックス基板の亀裂発生をよく防止できる。
従って、本発明によれば、充分に薄い基板厚さの大電力用の抵抗・温度ヒュ−ズを提供できる。
【図面の簡単な説明】
【図１】本発明に係る抵抗・温度ヒュ−ズを示す図面である。
【図２】本発明に係る抵抗・温度ヒュ−ズの使用状態を示す図面である。
【図３】従来の抵抗・温度ヒュ−ズを示す図面である。
【符号の説明】
１セラミックス基板積層体
１１セラミックス基板
１２セラミックス基板
２０膜抵抗
２１抵抗取付用膜電極
２２抵抗取付用膜電極
２１１スルーホ−ル
２２１スルーホ−ル
３０温度ヒュ−ズエレメント
３１ヒュ−ズ取付用膜電極
３２ヒュ−ズ取付用膜電極
３２１スルーホ−ル
４フラックス
５封止材層[0001]
BACKGROUND OF THE INVENTION
As one of the circuit protection elements, a resistance / temperature fuse in which a temperature fuse element and a resistance element are unitized in a close arrangement is used, and it is incorporated in the circuit together with an abnormality detector. When the abnormality of the circuit is detected by the abnormality detector, the resistance element is energized to generate heat, and the generated heat is used to blow the temperature fuse element to cut off the circuit from the power source.
As such a resistance / temperature fuse, a substrate type in which a film resistance and a low-melting-point soluble alloy piece are provided on one side of a ceramic substrate and the one side is sealed with a sealing material such as an epoxy resin is known.
[0002]
[Problems to be solved by the invention]
However, in this substrate type resistance / temperature fuse, a film resistance is provided on one surface of the ceramic substrate, and the ceramic substrate is heated non-uniformly during energization heat generation of the film resistance. When the membrane action is applied and the energization power of the membrane resistance is large, the ceramic substrate is cracked due to warpage, and fragments are scattered around and dangerous.
[0003]
As a resistance / temperature fuse, a film resistance pattern 20 'and film electrode patterns 21' and 22 'are printed on an unfired ceramic substrate 11' as shown in FIG. A single structure 1a ′ is formed, and a fuse is mounted on an unfired ceramic substrate 12 ′ cut out so as to expose the membrane electrode patterns 21 ′ and 22 ′ as shown in FIG. The membrane electrode 31 ′, 32 ′ is printed to form the second structure 1b ′, and as shown in FIG. 3C, the second structure 1b ′ is pressure-laminated and fired on the first structure 1a ′. After the structure is sintered and integrated, as shown in FIG. 3 (d), a low melting point soluble alloy piece 30 'is connected between the fuse mounting membrane electrodes, and the lead is connected to each membrane electrode. There has been proposed one in which a wire e is connected, a flux 4 'is applied to a low melting point soluble alloy piece 30', and a sealing material layer (not shown) is provided thereon (JP-A-9-6). 3442).
However, even in the resistance / temperature fuse manufactured in this way, the notch portion of the second structure is only one piece of the ceramic plate of the first structure, and the film resistance in this one piece portion Nearby parts are easily cracked by energization heat generation of film resistance.
[0004]
The object of the present invention is to provide a resistance / temperature fuse that can prevent thermal cracking of the substrate satisfactorily even under a thin substrate thickness even when the resistance heating power of the resistor is large. -To provide a manufacturing method thereof.
[0005]
[Means for Solving the Problems]
The resistance / temperature fuse according to the present invention includes a pair of resistance-attaching film electrodes and a film resistance, in which a lower ceramic substrate and an upper ceramic substrate are laminated and integrated by firing, and are arranged on the upper surface of the lower ceramic substrate. Are sintered and integrated with the two ceramic substrates, and each of the resistance mounting film electrodes is electrically led to the lower surface of the lower ceramic substrate by each through hole, and a pair of fuses are formed on the upper surface of the upper ceramic substrate. Mounting film electrodes are provided, and a solder adhesion electrode that is electrically connected between one of these fuse mounting film electrodes and a leading lower end of one of the through holes, and the other through hole is led out. An electrode for solder attachment conducted to the lower end and an electrode for solder attachment conducted to the other of the fuse attachment film electrodes are provided in the laminate, and a temperature is provided between the pair of fuse attachment film electrodes. Wherein the fuse element is connected.
According to a second aspect of the present invention, a pair of through-holes are formed on an unfired lower ceramic substrate a from the upper surface to the lower surface, and a pair of resistors is attached to the upper surface of the substrate by a conductive paste. A film electrode is printed and each through hole is filled with a conductive paste, a film resistance is printed with a resistance paste between the pair of resistance mounting film electrodes, and the unfired lower ceramic substrate a An unfired upper ceramic substrate b having the same dimensions as the substrate is laminated, and a pair of fuse-attaching film electrodes are printed on the upper surface of the upper ceramic substrate b with a conductive paste, and then the substrates a and b are fired. Sintering and firing the conductive paste of each of the above-mentioned film electrodes and through holes and the resistance hust, and then, one of the above-mentioned film electrodes for mounting the fuse and one of the through-holes of each of the through holes. An electrode for solder attachment that conducts between the lead-out lower end of the hole, a solder attachment electrode that conducts to the lead-out lower end of the other through hole, and a solder attachment electrode that conducts to both the fuse mounting film electrodes. Next, a thermal fuse element is connected between the pair of fuse mounting film electrodes.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1A is a plan view showing an example of a resistance / temperature fuse according to the present invention, FIG. 1B is a drawing showing a cross section of FIG. (C) is a cross-sectional view taken along line (b) of FIG.
In FIG. 1, 1 is a laminated body of two ceramic substrates 11 and 12 having the same plane dimensions, and the laminated interface is sintered and integrated by firing. Reference numerals 21 and 22 denote resistance-attaching membrane electrodes provided at the laminated interface, and reference numeral 20 denotes a membrane resistance bridged between these membrane electrodes 21 and 22. Reference numerals 211 and 221 denote through holes provided for electrically leading the respective membrane electrodes 21 and 22 to the back surface of the multilayer body 1 and are filled with a conductive material. This through-hole filling conductive material may be either the same material as the membrane electrodes 21 and 22 or a different material.
31 and 32 fuse provided on the upper surface of the upper ceramic substrate 12 - Ru's mounting membrane electrode der. Reference numeral 30 denotes a low melting point soluble alloy piece as a temperature fuse element bridged between the fuse mounting membrane electrodes 31 and 32, and 4 denotes a flux applied on the low melting point soluble alloy piece 30. Reference numeral 33 denotes an auxiliary film electrode provided on the upper ceramic substrate 12. Reference numerals 310, 320 and 330 denote mounting solder attaching electrodes, for example, silver electrodes.
5 is a sealing material, such as an epoxy resin, which covers the temperature fuse element 30 on the top surface of the laminate, and can be sealed with a cap, for example, a ceramic cap, instead of this sealing material. Can be filled with a sealing material.
[0007]
FIG. 2 shows how the resistance / temperature fuse shown in FIG. 1 is used.
In FIG. 2, A is a temperature fuse / resistor according to the present invention, 30 is a low melting point soluble alloy piece as a temperature fuse element, 20 is a membrane resistance as a resistance element, and 310 to 330 are The mounting electrodes are respectively shown, and the temperature fuse / resistor A and the overvoltage detection energizer F (the Zener diode D is connected to the base side of the transistor Tr) between the circuit z and the power source s. When a reverse voltage higher than the breakdown voltage of the Zener diode D is applied to the circuit z, a base current flows, and a collector current flows according to the base current, and the resistance element 20 is energized and heated. The generated heat is transmitted to the temperature fuse element 30, the low melting point soluble alloy piece 30 as the temperature fuse element is melted, and the circuit z is cut off from the power source s.
[0008]
In this case, the ceramic laminate 1 of the temperature fuse / resistor A is heated, but the film resistor 20 that is a heat source is present at the approximate center of the thickness of the laminate 1. Is heated symmetrically with respect to the center position, the action of the thermal bending moment is sufficiently suppressed, the laminated interface of the laminated body of the ceramic substrates 11 and 12 is sintered and integrated, and the whole is two sheets. Due to the plate structure and the overall bending rigidity being sufficiently large, the occurrence of cracks due to warpage can be well prevented.
[0009]
In the temperature fuse / resistor according to the present invention, the number and arrangement of electrodes, through-holes, temperature fuse elements and resistance elements are set in accordance with the usage pattern.
Further, the above-described example of the resistance / temperature fuse according to the present invention is configured to be directly soldered to the mounting surface with the mounting soldering electrode. However, the lead wire is attached to the radial or axial type. Can also be used.
[0010]
The resistance / temperature fuse according to the present invention can be manufactured as follows.
(1) A through hole is formed on an unfired ceramic substrate for the lower layer of the laminate, and a film electrode pattern for resistance attachment is screen-printed with a conductive paste on the upper surface, and the through hole is applied to the conductive pattern. The film resistance pattern is screen-printed with a resistance paste on the upper surface. (2) Further, the unfired ceramic substrate for the upper side of the laminate is pressed on the unfired ceramic substrate for the lower side of the various pattern printing in (1), and the fuse is attached to the unfired ceramic substrate for the upper side. The membrane electrode pattern and the auxiliary membrane electrode pattern are printed with a conductive paste. (3) After that, the laminate is fired. This firing sinters each substrate and sinters and integrates the laminated interface, and sinters and integrates each electrode pattern and film resistance paste with each substrate. (4) Further, a soldering electrode for mounting is formed. (5) Further, a low melting point soluble alloy piece as a temperature fuse element is bridged between the fuse mounting membrane electrodes, a flux is applied onto the low melting point soluble alloy piece, and a sealing material is applied. Wear or put on a cap, and the production of the resistance / temperature fuse is completed.
In the above, a through hole is formed on the unfired ceramic substrate for the upper side of the laminate, the fuse mounting film electrode and the auxiliary film electrode pattern are printed on the upper surface with the conductive paste, and the through hole is formed on the conductive pattern. After filling with the strike, this unfired ceramic substrate for the upper side can be laminated and pressed on the unfired ceramic substrate of (1) above, and then fired.
[0011]
The green ceramic substrate may be a so-called green sheet formed by adding a binder such as butyral or acrylic resin to alumina powder to form a tape, and the resistance paste includes ruthenium oxide. A paste such as Ag paste, Ag-Pd paste, Au paste, and Cu paste can be used as the conductive paste.
[0012]
【The invention's effect】
In the resistance / temperature fuse according to the present invention, the film resistance is provided at the center of the thickness of the multilayer ceramic substrate. The thermal bending stress can be sufficiently suppressed by making it symmetrical, and the overall bending rigidity is sufficiently increased by the laminated interface of the laminated ceramic substrate, the film resistance of the interface, and the sintering integration with the membrane electrode. Therefore, the generation of cracks in the ceramic substrate due to the thermal bending moment can be well prevented.
Therefore, according to the present invention, a resistance / temperature fuse for high power with a sufficiently thin substrate thickness can be provided.
[Brief description of the drawings]
FIG. 1 is a view showing a resistance / temperature fuse according to the present invention.
FIG. 2 is a view showing a usage state of a resistance / temperature fuse according to the present invention.
FIG. 3 is a diagram showing a conventional resistance / temperature fuse.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Ceramic substrate laminated body 11 Ceramic substrate 12 Ceramic substrate 20 Membrane resistance 21 Membrane electrode for resistance attachment 22 Membrane electrode for resistance attachment 211 Through hole 221 Through hole 30 Temperature fuse element 31 Membrane electrode for fuse attachment 32 Hue -Mounting membrane electrode 321 Through hole 4 Flux 5 Sealing material layer

Claims

The lower ceramic substrate and upper ceramic substrate are laminated and integrated by firing, and a pair of resistance-attaching film electrodes and film resistors disposed on the upper surface of the lower ceramic substrate are sintered and integrated with both ceramic substrates. Each of the resistance mounting film electrodes is electrically led to the lower surface of the lower ceramic substrate by each through hole, and a pair of fuse mounting film electrodes is provided on the upper surface of the upper ceramic substrate. An electrode for solder adhesion conducted between one of the membrane electrodes and a leading lower end of one through hole of the two through holes, an electrode for solder adhesion conducted to the leading lower end of the other through hole, and both the fuses An electrode for solder attachment conducted to the other of the mounting film electrodes is provided in the laminate, and a thermal fuse element is connected between the pair of fuse mounting film electrodes. Resistance and temperature fuse, characterized in that.

A pair of through holes extending from the upper surface to the lower surface is formed on the unfired lower ceramic substrate a, and a pair of resistance attachment film electrodes are printed on the upper surface of the substrate with a conductive paste, and the through holes are electrically conductive. Fill the paste, print the film resistance with a resistance paste between the pair of resistance mounting film electrodes, and laminate the unfired upper ceramic substrate b having the same dimensions as the substrate on the unfired lower ceramic substrate a Then, a pair of fuse-mounting film electrodes is printed on the upper surface of the upper ceramic substrate b with a conductive paste. After that, the substrates a and b are fired and sintered, and each of the film electrodes and through holes are formed. The conductive paste and the resistance hest are fired, and then the solder adheres between the one of the fuse-mounting film electrodes and the leading lower end of one of the through holes. An electrode, a solder adhesion electrode that conducts to the lower end of the other through hole, and a solder adhesion electrode that conducts to the other of the fuse attachment film electrodes, and then between the pair of fuse attachment film electrodes. A method of manufacturing a resistance / thermal fuse, comprising connecting a thermal fuse element to the element .