JP4001182B2 - Support unit for microfluidic system - Google Patents

Description

  The present invention relates to a support unit for a microfluidic system in which a hollow filament is laid and fixed in a predetermined shape on a support.

  In the field of chemistry and biochemistry, research on the miniaturization of reaction systems and analyzers using micro electro mechanical system (MEMS) technology is underway. In conventional research and development, there are micromachined elements (micromachines) having a single function of a micromotor and a micropump that are one of the constituent elements (see, for example, Non-Patent Documents 1 and 2).

In order to perform a target chemical reaction or chemical analysis, it is necessary to systematize a plurality of various parts such as micromachines. In general, a completed form of such a system is called a microreactor system, a micro total analysis system (μTAS), or the like. Usually, a micromachine is formed on a silicon chip by applying a semiconductor manufacturing process. It is possible in principle to form (integrate) a plurality of elements on a single chip and systematize them, and such efforts are actually being carried out (for example, see Non-Patent Document 3). However, the manufacturing process is complicated, and it is expected that it is difficult to manufacture it at the mass production level. As a method for forming a fluid circuit (system) by connecting a plurality of micromachines or the like, a chip type substrate (nanoreactor) has been proposed in which a groove is formed by etching or the like at a predetermined position of a silicon substrate to form a flow path. There is a merit that the manufacturing is much easier than the above-mentioned integration method. However, the channel cross-sectional area is small, the interface resistance between the fluid and the groove side is large, and the channel length is at most mm units. In the actual synthesis reaction and chemical analysis, the reaction and analysis steps are performed. Number and amount will be limited.
Shoko, “Chemical Industry”, April 2001, Vol. 52, No. 4, pp. 45-55 Maeda, “Journal of Japan Institute of Electronics Packaging”, January 2002, Vol. 5, No. 1, pp. 25-26 Inaga, “Proceedings of the 50th Anniversary of the Environmental Sciences Conference of the Japan Society of Science”, 1999, No. 14, p.25-32

  However, the manufacturing process is complicated, and it is expected that it is difficult to manufacture it at the mass production level. Therefore, in recent years, as a method for forming a fluid circuit by connecting a plurality of micromachines or the like, a chip type substrate has been proposed in which a groove is formed by etching or the like at a predetermined position of a silicon substrate to form a flow path. This method has the merit that it is much easier to manufacture a chip-type substrate than the above integration method. However, with this method, the cross-sectional area of the flow path is small and the interface resistance between the fluid and the groove side is large, and the length of the flow path is at most mm units. In actual synthesis reactions and chemical analysis, There is a problem that the number and amount of reaction and analysis steps are limited.

  The present invention has been made to solve the above problems. That is, an object of the present invention is to provide a support unit for a microfluidic system having a long distance of cm, which is easy to manufacture and does not limit the number of steps of reaction and analysis.

  Another object of the present invention is to provide a support unit for a small microfluidic system that does not require a place even in a complicated fluid circuit.

  In order to achieve the above object, the present invention is characterized by a first support, a first adhesive layer provided on the surface of the first support, and a surface of the first adhesive layer. The microfluidic system support unit includes at least two equal-length hollow filaments that function as flow path layers of the microfluidic system laid in an arbitrary shape.

  According to the present invention, it is possible to provide a support unit for a microfluidic system having a long distance of cm, which is easy to manufacture and does not limit the number and amount of reaction and analysis steps.

  As a result, according to the present invention, it is possible to provide a fluid circuit (microfluidic system) with high accuracy and less manufacturing variation. Furthermore, since a first hollow filament group consisting of a plurality of hollow filaments in a three-dimensional manner and a second hollow filament group consisting of a plurality of hollow filaments orthogonal to the first hollow filament group can be laid, even in a complicated fluid circuit, a small microfluid A system can be provided.

  Embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in light of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

(First embodiment)
(Support unit for microfluidic system)
As shown in FIG. 1, the microfluidic system support unit according to the first embodiment of the present invention includes a first support 2 and a first support 2 provided on the surface of the first support 2. A first hollow filament group composed of an adhesive layer 1a and a plurality of hollow filaments 501, 502, 503,..., 508 laid in an arbitrary shape on the surface of the first adhesive layer 1a; A second hollow filament group consisting of a plurality of hollow filaments 511, 512, 513,..., 518 laid in a direction crossing the first hollow filament group; A second adhesive layer 1b provided on the surface and a second support 6 provided on the surface of the second adhesive layer 1b are provided. A first hollow filament group composed of a plurality of hollow filaments 501, 502, 503,..., 508, and a second hollow composed of a plurality of hollow filaments 511, 512, 513,. Each filament group constitutes a flow path layer for a chemical solution of the support unit for the microfluidic system according to the first embodiment of the present invention.

  The inner and outer diameters of the plurality of hollow filaments 501 to 508 and 511 to 518 may be selected according to the purpose. However, since a fluid in units of milliliters (mL) to microliters (μL) flows, the inner diameter is φ0. The thing of about 05 mm-0.5 mm is preferable. When producing hollow filaments 501 to 508 and 511 to 518 having such diameters, polyimide (PI), polyether ether ketone (PEEK), polyether imide (PEI), polyphenylene sulfide (PPS), tetrafluoroethylene -Materials such as perfluoroalkoxyethylene copolymer (PFA) are particularly suitable. If the inner diameter is φ0.05 mm or less, the influence of the interface resistance between the inner wall surfaces of the hollow filaments 501 to 508 and 511 to 518 and the fluid cannot be ignored. On the other hand, if the inner diameter is larger than φ0.5 mm, a high pressure is required to continuously flow the fluid, which increases the burden on other components, and bubbles are mixed into the fluid. When a chemical reaction is caused in the fluid flowing through the first hollow filament group composed of the plurality of hollow filaments 501 to 508 and the second hollow filament group composed of the plurality of hollow filaments 511 to 518, the hollow filaments 501 to 508, 511 to 518 are preferably provided with chemical resistance. Further, when light is irradiated to the fluid flowing through the hollow filaments 501 to 508 and 511 to 518 to cause photochemical reaction or spectroscopic analysis, the hollow filaments 501 to 508 and 511 to 518 have light transmittance. Good to have. The light transmittance may be a value according to the purpose, but is preferably 80% or more at the target wavelength, and more preferably 90% or more. That is, as shown in FIG. 9 (a), the second support 6, the second adhesive layer 1b, and the hollow filament 58 at a predetermined location are transparent, or the hollow filament 58 is exposed, and at least The hollow filament 58 at this location is preferably transparent.

  Fixing the hollow filaments 501 to 508 and 511 to 518 to the first support 2 is excellent in that it is easy to control various environments such as ambient temperature, electric field, and magnetic field as compared with the free state. There are benefits. This is advantageous when a chemical reaction or chemical analysis is performed, and is indispensable particularly in a micro reaction system and an analysis system. In addition, there is an advantage that alignment with parts is easy and easy to connect, and a large number of hollow filaments 501 to 508 and 511 to 518 can be accommodated in a compact manner.

  Moreover, when performing a chemical analysis, the point which has several hollow filaments 501-508,511-518 is good at the point which improves work efficiency. In this case, the plurality of hollow filaments 501 to 508 constituting the first hollow filament group are required to have the same length from the viewpoint that the analysis result should be obtained almost simultaneously when the analysis is started at the same time. It is done. Similarly, the plurality of hollow filaments 511 to 518 constituting the second hollow filament group are also required to have the same length. That is, it is important that the amount of energy received from the outside from the inflow portion to the outflow portion of the sample is uniform and that there is almost no difference from the amount of energy received by other hollow filaments. From such a viewpoint, the hollow filaments 501 to 508 and 511 to 518 are sandwiched between two or more supports so that the distribution of heat transmitted to the hollow filaments 501 to 508 and 511 to 518 is uniform. preferable.

  The plurality of hollow filaments 501 to 508 constituting the first hollow filament group and the plurality of hollow filaments 511 to 518 constituting the second hollow filament group are preferably arranged at equal intervals. Moreover, it is better that the thicknesses of the plurality of hollow filaments 501 to 508 constituting the first hollow filament group and the plurality of hollow filaments 511 to 518 constituting the second hollow filament group are uniform.

  As the plurality of hollow filaments 501 to 508 and 511 to 518, commercially available tubes of various materials can be used, and arbitrary materials may be selected according to the purpose. For example, polyvinyl chloride resin (PVC), polyvinylidene chloride resin, polyvinyl acetate resin, polyvinyl alcohol resin (PVA), polystyrene resin (PS), styrene / acrylonitrile / butadiene copolymer (ABS), polyethylene resin (PE) , Ethylene-vinyl acetate copolymer (EVA), polypropylene resin (PP), poly-4-methylpentene (TPX), polymethyl methacrylate (PMMA), PEEK, PI, PEI, PPS, cellulose acetate, tetrafluoroethylene resin (PTFE), tetrafluoride / hexafluoropropylene resin (FEP), PFA, tetrafluoroethylene / ethylene copolymer (ETFE), trifluoroethylene chloride (PCTFE), vinylidene fluoride (PVDF), polyethylene terephthalate Resin (PET), Polyamide Organic materials such as resin (nylon), polyacetal (POM), polyphenylene terephthalate (PPO), polycarbonate resin (PC), polyurethane resin, polyester elastomer, polyolefin resin, silicone resin, polyimide resin, and inorganic materials such as glass, quartz, and carbon There is material.

  What is necessary is just to select the material, shape, size, etc. of the 1st support body 2 according to the objective. Further, the appropriate range of the plate thickness and film thickness of the first support 2 varies depending on the purpose and the required function. For example, when electrical insulation is required for the first support 2, an epoxy resin plate or a polyimide resin plate used for a printed wiring board or the like, a DuPont Kapton film used for a flexible wiring board, etc. A PET film as represented by a polyimide film as represented and a Lumirror film made by Toray Industries, Inc. is selected. The plate thickness (film thickness) of the first support 2 is preferably thick, and is particularly preferably 0.05 mm or more. Further, when heat dissipation is required for the first support 2, a metal plate such as an aluminum (Al) plate, a copper (Cu) plate, a stainless steel plate, or a titanium (Ti) plate is selected. The plate thickness of the first support 2 is preferably thicker, and particularly preferably 0.5 mm or more. When the first support 2 is required to have optical transparency, a transparent inorganic material plate such as glass or quartz plate, or a transparent organic material plate or film such as polycarbonate or acrylic is selected. The plate thickness (film thickness) of the first support 2 is preferably thin, and particularly preferably 0.5 mm or less. Further, a so-called flexible circuit board or printed circuit board in which a metal pattern such as copper is formed on the surface of the first support 2 by etching or plating may be used. This enables micromachines, heating elements, piezoelectric elements, various sensors such as temperature, pressure, strain, vibration, voltage, and magnetic field, electronic components such as resistors, capacitors, coils, transistors, and ICs, as well as semiconductor lasers (LD) and light emission. Terminals and circuits for mounting various components and elements such as optical components such as a diode (LED) and a photodiode (PD) can be formed, and systemization is facilitated.

  The first adhesive layer 1a formed on the surface of the first support 2 is preferably an adhesive having pressure sensitivity or photosensitivity. These materials are suitable for laying hollow filaments (hollow capillaries) mechanically because they exhibit adhesiveness and adhesiveness by applying pressure, light, and the like. For the pressure sensitive adhesive, a high molecular weight synthetic rubber or a silicone resin adhesive is suitable. Examples of the high molecular weight synthetic rubber adhesive include polyisobutylene such as Vistanex MML-120 manufactured by Tonex, acrylonitrile butadiene rubber such as Nipol N1432 manufactured by Nippon Zeon, and Hypalon 20 manufactured by DuPont. For example, chlorosulfonated polyethylene can be used. In this case, the first adhesive layer 1a can be formed by dissolving these materials in a solvent and directly coating and drying the first support 2. Furthermore, a crosslinking agent can be added to these materials as necessary. Also, acrylic resin-based double-sided adhesive tapes such as No. 500 manufactured by Nitto Denko Corporation and A-10, A-20, and A-30 manufactured by 3M may be used. Silicone resin-based adhesives are silicones mainly composed of high molecular weight polydimethylsiloxane or polymethylphenylsiloxane and having a silanol group at the terminal and a silicone resin such as methylsilicone resin or methylphenylsilicone. Adhesive is suitable. Various cross-linkings may be performed to control the cohesive force. For example, the crosslinking can be performed by a silane addition reaction, an alkoxy condensation reaction, an acetoxy condensation reaction, a radical reaction with a peroxide, or the like. Commercially available adhesives such as YR3286 (manufactured by GE Toshiba Silicone Co., Ltd., trade name), TSR1521 (manufactured by GE Toshiba Silicone Co., Ltd., trade name), DKQ9-9909 (manufactured by Dow Corning Co., Ltd., trade name), etc. There is. As the photosensitive adhesive, for example, a dry film resist, a solder resist ink used as an etching resist for a printed board, a photosensitive build-up material for a printed board, or the like can be applied. Specifically, there are H-K440 manufactured by Hitachi Chemical Co., Ltd. and Provimer manufactured by Ciba Geigy. In particular, a photovia material provided as a build-up wiring board application can withstand a printed wiring board manufacturing process and a component mounting process using solder. Such materials include compositions containing copolymers or monomers having functional groups that can be crosslinked by light and / or mixing functional groups and thermal polymerization initiators that can be crosslinked by heat in addition to light. Any composition can be used.

  Examples of the first adhesive layer 1a include alicyclic epoxy resins such as epoxy resins, brominated epoxy resins, rubber-modified epoxy resins, rubber-dispersed epoxy resins, bisphenol-A epoxy resins, and acid-modified products of these epoxy resins. Is mentioned. In particular, when photocuring is performed by light irradiation, modified products of these epoxy resins and unsaturated acids are preferred. Examples of the unsaturated acid include maleic anhydride, tetrahydrophthalic anhydride, itaconic anhydride, acrylic acid, and methacrylic acid. These can be obtained by reacting an unsaturated carboxylic acid with an equal amount or less than an equal amount of the epoxy group of the epoxy resin. In addition, thermosetting materials such as melamine resins and cyanate ester resins, or combinations of these with phenol resins are also preferable applications. In addition, the use of a flexibility imparting material is also a suitable combination. Examples thereof include butadiene acrylonitrile rubber, natural rubber, acrylic rubber, SBR, carboxylic acid-modified butadiene acrylonitrile rubber, carboxylic acid-modified acrylic rubber, and crosslinked NBR. Particles, carboxylic acid-modified crosslinked NBR particles, and the like. By adding such various resin components, it is possible to impart various properties to the cured product while maintaining the basic performance of photocuring property and thermosetting property. For example, a combination with an epoxy resin or a phenol resin makes it possible to impart good electrical insulation to the cured product. When a rubber component is blended, tough properties are imparted to the cured product, and the surface of the cured product can be easily roughened by surface treatment with an oxidizing chemical solution. Ordinarily used additives (polymerization stabilizer, leveling agent, pigment, dye, etc.) may be added. Also, there is no problem with blending a filler. As fillers, inorganic fine particles such as silica, fused silica, talc, alumina, hydrated alumina, barium sulfate, calcium hydroxide, aerosil, calcium carbonate, organic fine particles such as powdered epoxy resin and powdered polyimide particles, powdered polytetra Examples include fluoroethylene particles. These fillers may be subjected to a coupling treatment in advance. These dispersions are achieved by a known kneading method such as a kneader, ball mill, bead mill, or three rolls. As a method for forming such a photosensitive resin, a method in which a liquid resin is applied by a method such as roll coating, curtain coating, or dip coating, or a method in which an insulating resin is formed on a carrier film and laminated with a laminate is used. I can do it. Specifically, there is a photo via film BF-8000 manufactured by Hitachi Chemical Co., Ltd.

  For the second support 6, various materials shown in the first support 2 can be used. Further, the second adhesive layer 1b is inserted between the second support 6 and the second hollow filament group composed of the plurality of hollow filaments 511 to 518, thereby comprising the plurality of hollow filaments 501 to 508. Since the effect | action which protects the 1st hollow filament group and the 2nd hollow filament group which consists of several hollow filaments 511-518 increases further, it is preferable. If a mesh-like or porous film is selected as the second support 6, it is difficult to cause a problem such as embedding bubbles during lamination. Examples of the mesh-like film or woven fabric include Tokyo Mesh's polyester mesh TB-70, and examples of the porous film include Celanese's Juraguard and Daicel Chemical Industries' Cellguard 2400.

  Various materials shown in the first adhesive layer 1a can be used for the second adhesive layer 1b.

(Method for manufacturing support unit for microfluidic system)
Next, the manufacturing method of the support unit for microfluidic systems which concerns on the 1st Embodiment of this invention is demonstrated using FIGS.

  (A) First, as shown in FIG. 2, a first adhesive layer 1 a having the same shape and the same size as the first support 2 is formed on the surface of the first support 2. Then, as shown in FIG. 3, four rectangular release layers 3a, 3b, 3c, and 3d are uniformly formed on the periphery of the surface of the first adhesive layer 1a. In order to form such release layers 3a, 3b, 3c, 3d on the surface of the first adhesive layer 1a, a commercially available release agent is applied to a predetermined portion of the surface of the first adhesive layer 1a. There are a method of applying in advance and a method of attaching a release film. Next, slits 4a, 4b, 4c and 4d are provided on the first support 2 with a cutter or the like. As shown in FIG. 3B, the slits 4a, 4b, 4c, and 4d are formed, for example, at positions in the vicinity of the inner sides of the four release layers 3a, 3b, 3c, and 3d.

  (B) Next, as shown in FIG. 4, on the surface of the first support 2 on which the first adhesive layer 1a is formed, a plurality of layers are arranged in the vertical direction from the release layer 3b to the release layer 3d. A first hollow filament group consisting of hollow filaments 501 to 508 is laid. At the time of this laying, although not shown, an NC laying machine 61 similar to that shown in FIG. 5A is used (as such a laying machine, disclosed in Japanese Patent Laid-Open No. 2001-59910). In addition, the device disclosed in Japanese Patent Publication No. 50-9346 can apply a load and ultrasonic vibration during wiring, and further disclosed in Japanese Patent Publication No. 7-95622. The device is capable of applying a load and irradiating a laser beam.) The NC wiring machine 61 is numerically controlled and can control the output of ultrasonic vibration and load. By using the NC wiring machine 61, the first hollow filament group composed of a plurality of hollow filaments 501 to 508 is laid. The pattern can be precisely controlled. Specifically, a load and ultrasonic vibration are applied to the first hollow filament group composed of the hollow filaments 501 to 508 while moving the NC wiring device 61 horizontally with respect to the first support 2.

  (C) Next, as shown in FIG. 5, the second hollow filament group composed of the plurality of hollow filaments 511 to 518 is changed to the first hollow filament group composed of the plurality of hollow filaments 501 to 508 already laid. Laying in the direction from the release layer 3a toward the release layer 3c so as to intersect. At the time of this laying, an NC wiring machine 61 is used as shown in FIG. The laying pattern of the second hollow filament group composed of the plurality of hollow filaments 511 to 518 can be precisely controlled. Specifically, a load and ultrasonic vibration are applied to a second hollow filament group composed of a plurality of hollow filaments 511 to 518 while moving the NC wiring device 61 horizontally with respect to the first support 2. . However, this NC wiring machine 61 seems to stop the load and ultrasonic vibration at the portion where the first hollow filament group consisting of hollow filaments 501 to 508 and the second hollow filament group consisting of hollow filaments 511 to 518 intersect. Set to. By stopping the load and / or ultrasonic vibration in the vicinity of the intersection between the first hollow filament group and the second hollow filament group, the stress on the hollow filaments 501 to 508 and 511 to 518 is reduced, and the hollow Breakage of the filaments 501 to 508 and 511 to 518 can be prevented.

  (D) Next, as shown in FIG. 6, a first hollow filament group composed of a plurality of hollow filaments 501 to 508 and a second hollow filament group composed of a plurality of hollow filaments 511 to 518 are already laid. A second adhesive layer 1b having the same shape and the same size as that of the first support 2 is formed so as to cover it. Furthermore, a second support 6 having the same shape and the same size as that of the first support 2 is prepared, and the second support 6 is bonded (laminated) on the second adhesive layer 1b. Various methods are conceivable for laminating the second support 6. At this time, when the second support 6 is a mesh-like or porous film, the protective film is brought into close contact with the second adhesive layer 1b without applying air or the like to the interface by applying a slight pressure. I can do it. However, if the second support 6 is a uniform film, residual bubbles are inevitable. In this case, a method of pressing at high pressure is also conceivable, but a large force is applied to the hollow filaments 501 to 508 and 511 to 518 to cause deformation of the hollow portion. Furthermore, there is a problem that a large force is locally applied and damaged at the intersection of the first hollow filament group and the second hollow filament group. In such a case, a vacuum laminating apparatus is used to bring the air into the interface by applying a vacuum before the second support 6 is brought into intimate contact with the second adhesive layer 1b, and then pressing at a low pressure. The hollow filaments 501 to 508 and 511 to 518 are preferable because large stress does not remain and there is no breakage.

  (E) Thereafter, the workpiece is cut along a cutting line 7 having a desired shape indicated by a dotted line in FIG. After laminating the second support 6, the microfluidic system support unit can be processed into a desired shape by cutting with a cutter or by pressing a metal blade that has been prepared in advance into the desired shape. There are methods such as processing. However, since it is difficult to automate with a cutter, and the blade type is time-consuming to manufacture jigs and tools, an NC-driven laser processing machine is preferable because it can be operated only by preparing data. Also in the laser processing machine, a laser drilling machine for small-diameter drilling for printed circuit boards is preferable to a processing machine with a large output dedicated for cutting. The laser drilling machine for printed circuit boards has a large energy output per unit time, drills the same place with multiple shots and moves it by about half the hole diameter, and the laser burns very little. preferable. As shown in FIG. 7B, the cutting line 7 is cut so as to overlap the position 4a where the slits 4a, 4b, 4c, and 4d have been previously inserted. As shown in FIG. 7A, the first adhesive layer 1a and the second adhesive layer 1b are provided in the vicinity of the end of the hollow filament 518 by inserting slits 4a, 4b, 4c, and 4d in advance. Will come off automatically. Although not shown, the end portions of the other hollow filaments 501 to 508, 511, 512, 513,... 517 are similarly formed with the first adhesive layer 1a and the second adhesive layer. 1b automatically peels off. A first hollow filament group composed of a plurality of hollow filaments 501 to 508 and a second hollow filament group composed of a plurality of hollow filaments 511 to 518 are laid on the first adhesive layer 1a, and then a second adhesion is performed. In the structure in which the second support 6 is bonded through the agent layer 1b, the process of exposing the ends of the plurality of hollow filaments 501-508, 511-518 becomes complicated. For this reason, if slits 4a, 4b, 4c, and 4d are provided in advance at the boundary between the part that is unnecessary and finally removed and the part that remains as the first support 2, the hollow filament 501 is provided. The process which exposes the edge part of -508,511-518 becomes easy.

  (F) After cutting along the cutting line 7 indicated by the dotted line in FIG. 7B, the release layer 3b and the release layer 3d disposed near the ends of the hollow filaments 501 to 508, and further the hollow filament If the release layer 3a and the release layer 3c arranged in the vicinity of the ends of 511 to 518 are removed, the microfluidic system support unit shown in FIG. 1 is completed.

  As described above, if the release layers 3a, 3b, 3c, 3d are provided on the surface of the end portion of the first support 2 which is unnecessary and finally removed, as shown in FIG. The process of taking out the first hollow filament group composed of a plurality of hollow filaments 501 to 508 and the second hollow filament group composed of a plurality of hollow filaments 511 to 518 from the end of the support unit for the microfluidic system, respectively, is further facilitated. Can be done. However, it is necessary to pay attention to the length of the exposed portions of the hollow filaments 501 to 508 and 511 to 518. The unexposed portions of the hollow filaments 501 to 508 and 511 to 518 are fixed, and the factors such as temperature, flow velocity distribution, migration velocity distribution, and applied voltage are controlled for the fluid in the hollow filaments 501 to 508 and 511 to 518. Easy to do. On the other hand, the exposed portions of the hollow filaments 501 to 508 and 511 to 518 are not fixed and are in a free state, so it is difficult to control the above-described factors. Further, the exposed portions of the hollow filaments 501 to 508 and 511 to 518 are likely to be broken due to carelessness. Therefore, it is important to make the exposed length as short as possible, and at least the length of the exposed portion is desirably shorter than the length of the non-exposed portion.

  Moreover, in the manufacturing method of the support unit for microfluidic systems which concerns on the 1st Embodiment of this invention, since the hollow member (hollow filament) 501-508, 511-518 is used, for design and manufacture Appropriate ingenuity is required. In addition to the laying conditions at the intersection between the first hollow filament group and the second hollow filament group described above, the formation conditions of the second support 6 serving as the protective film layer are also devised. Furthermore, the laying conditions of the respective straight portions of the first hollow filament group composed of the plurality of hollow filaments 501 to 508 and the second hollow filament group composed of the plurality of hollow filaments 511 to 518, and the hollow filaments 501 to 508 and 511, respectively. A curvature condition of .about.518 must also be considered. Since these conditions largely depend on the materials of the hollow filaments 501 to 508 and 511 to 518 and the specifications of the first adhesive layer 1a, they cannot generally be set. That is, it is necessary to set design / manufacturing conditions suitable for the hollow filaments 501 to 508 and 511 to 518 and the first adhesive layer 1a to be used. If this operation is neglected, not only a good hollow portion cannot be secured, but also an accident such as a fluid leaking due to a defect in the hollow filaments 501 to 508 and 511 to 518 occurs.

(Second Embodiment)
The microfluidic system support unit according to the second embodiment of the present invention includes a first adhesive layer 1a, a second adhesive layer 1b, and a second support 6 as shown in FIG. Unlike the support unit for the microfluidic system according to the first embodiment of the present invention shown in FIG. 1, the other is the present invention except that the wall portion and the relay portion 8 having the first support 2 as the bottom portion are provided. Since it is the same as that of the first embodiment, redundant description is omitted.

  As shown in FIG. 8, the relay part 8 has a structure in which the hollow filament 58 is exposed from between the first adhesive layer 1a and the second adhesive layer 1b. The exposed hollow filament 58 discharges the fluid. The relay unit 8 mixes or branches the discharged fluid. What is necessary is just to determine the shape and size of the relay part 8 according to the flow volume of the fluid. For example, the total thickness of the flow path formed by two to three hollow filaments 58 having an inner diameter of φ200 μm and the first adhesive layer 1 a and the second adhesive layer 1 b holding the hollow filament 58 is 200 μm. In this case, the relay portion 8 may have a cylindrical shape of about φ2 mm to φ7 mm.

Laser processing is preferable for removing the first adhesive layer 1a, the second adhesive layer 1b, and the hollow filament 58 at predetermined locations to be the relay portion 8. In particular, when the volume of the portion to be removed, that is, the volume of the relay portion 8 is as small as ³ mm ³ or less, laser processing is suitable. The laser used for laser processing is a carbon dioxide laser, YAG laser, excimer laser, or the like, and may be selected according to the materials of the first adhesive layer 1a, the second adhesive layer 1b, and the hollow filament 58. In addition, when processing the relay part 8 with a laser, it is good to use what formed metal thin films, such as copper and aluminum used as the laser stopper, on the surface of the 1st support body 2. FIG. When removing a large range where the volume of the relay portion 8 is equal to or more than cm ^3, machining such as a drill may be applied. In the case of machining, a desmear process for removing resin waste generated during cutting is added.

  As a method of using the second support 6 as a part of the relay portion 8, the second support 6 is bonded to the second adhesive layer 1 b, and then the second support 6 is attached to the second support 6. There is a step of processing the shape to be a part. In this case, a method of piercing the second support 6 with a needle such as an injection needle is suitable.

  As another method, when the relay portion 8 is formed on the first adhesive layer 1a and the second adhesive layer 1b, the second support 6 also forms a part of the relay portion 8 at the same time. There is a method of processing. In this case, the above-described method of batch processing with the laser is suitable.

  Furthermore, as another method, there is a method in which the second support 6 is processed in advance into a shape that becomes a part of the relay portion 8, and this is bonded to the second adhesive layer 1b. Examples of processing methods applied to the second support 6 include drilling, punching, and laser processing.

  According to the microfluidic system support unit according to the second embodiment of the present invention, the fluid flowing through the hollow filament 58 can be mixed or branched by providing the relay portion 8. Further, by making the second support 6 a part of the relay unit 8, the relay unit 8 can be opened, so that a new fluid is injected from the outside into the relay unit, or the fluid in the relay unit 8. Can be taken out.

Example 1
A DuPont Kapton 300H having a thickness of 75 μm is used for the first support 2, and the surface thereof has a thickness of 250 μm and is sticky at room temperature as a first adhesive layer 1 a as shown in FIG. 2. 3M VBH A-10 film is roll laminated. As shown in FIG. 3, a single-sided release paper is provided as a release layer 3a, 3b, 3c, 3d at a desired position of the first support 2 so that the release surface is in close contact with the adhesive surface. Further, as shown in FIG. 4, slits 4 a, 4 b, 4 c, and 4 d are put at desired positions of the first support 2 with a cutter. As shown in FIG. 5 (a), a high-performance engineering plastic tube manufactured by Nirei Kogyo Co., Ltd. is used by using an NC wiring machine 61 capable of controlling the output of ultrasonic vibration and load and moving an XY table by NC control. Hollow filaments 501 to 508 and 511 to 518 made of 62 (material: PEEK, inner diameter 0.2 mm, outer diameter 0.4 mm) are laid. The hollow filaments 501 to 508 and 511 to 518 to be laid are subjected to vibration by an ultrasonic wave having a load of 80 g and a frequency of 30 kHz. As shown in FIG. 5 (b), the hollow filaments 501 to 508 and 511 to 518 are laid in an arc shape with a radius of 5 mm, and an intersecting portion is also provided. In the vicinity of the intersecting portion, the load and the ultrasonic vibration are stopped. As the second support 6, a roll-laminated 3M VBH A-10 film was used on the surface of DuPont Kapton 300H, and as shown in FIG. 6, from a plurality of hollow filaments 511 to 518 by vacuum lamination. The second hollow filament group is laminated on the laid surface. In the subsequent outline processing, a laser drilling machine for small-diameter drilling for printed circuit boards was used, and a hole having a pulse width of 5 ms and a shot number of 4 shots was moved at 0.1 mm intervals to obtain a desired shape shown in FIG. Cut along the cutting line 7 into a wide cross shape. At this time, it is processed so as to overlap with the portions in which slits 4a, 4b, 4c, and 4d have been put in advance in a portion that becomes a flat cable shape at a pitch of 0.4 mm. Thereafter, the portions where the release layers 3a, 3b, 3c, 3d are attached to the first support 2 near the ends of the hollow filaments 501-508, 511-518 can be easily removed. Then, the first hollow filament group consisting of eight hollow filaments 501 to 508 having a total length of 20 cm and the second hollow filament group consisting of eight hollow filaments 511 to 518 having a total length of 20 cm are each 10 mm at the end. A support unit for a microfluidic system is manufactured in a shape in which the length is exposed. There is no breakage of the hollow filament in the entire laying part, especially in the intersecting part.

  As a result, the positional variation of the flow path formed by the first hollow filament group consisting of a plurality of hollow filaments 501 to 508 and the second hollow filament group consisting of a plurality of hollow filaments 511 to 518 is as follows: Within ± 10 μm. When the microfluidic support unit is placed in a temperature controller and kept at 80 ° C., liquid colored ink flows in from one end, and the time until outflow is measured with a measuring device such as a stopwatch, all eight It flows out from the other end at approximately the same timing (± 1 second or less).

(Example 2)
An aluminum plate having a thickness of 0.5 mm is used for the first support 2 and a non-adhesive pressure-sensitive adhesive Dow Corning Asia is used as a first adhesive layer 1a having a thickness of 100 μm on the surface as shown in FIG. Roll-laminate S9009 made by the company. Also, as shown in FIG. 3, release layers 3a, 3b, 3c, 3d made of single-sided release paper as non-adhesive films are formed on the surface near the end of the hollow filament as a release surface. Is provided in close contact with the adhesive surface. As shown in FIGS. 4 and 5, an NC wiring machine 61 capable of controlling the output of ultrasonic vibration and load and moving the XY table by NC control is used, and a glass tube ESG-2 manufactured by Hagitec Corporation is used. (Inner diameter 0.8 mm, outer diameter 1 mm) is laid. The hollow filaments 501 to 508 and 511 to 518 to be laid are subjected to vibration by an ultrasonic wave having a load of 100 g and a frequency of 20 kHz. As shown in FIG. 5B, the hollow filaments 501 to 508 and 511 to 518 are laid in a circular arc shape having a radius of 10 mm, and intersecting portions are also provided. In the vicinity of the intersecting portion, the load and the ultrasonic vibration are stopped. For the second support 6, the same DuPont Kapton 200H as the film support is used, and as shown in FIG. 6, on the support unit provided with hollow filaments 501 to 508 and 511 to 518 using a vacuum laminate. Laminate. At that time, a thermocouple for temperature measurement is embedded in the vicinity of the hollow filaments 501 to 508 and 511 to 518 at the inflow portion, the outflow portion, and the intersecting portion. In the subsequent contour processing shown in FIG. 7, the substrate is cut into a desired shape using a contour processing machine for a printed circuit board. At this time, it is processed so as to overlap with the portions in which slits 4a, 4b, 4c, and 4d have been previously inserted in the portion of the flat cable shape that is twelve at a pitch of 1 mm. Then, the part which has stuck the film which does not adhere to the support body of the vicinity of the edge part of several hollow filaments 501-508 and 511-518 can be removed easily, and the hollow filaments 501-508 of 12 total length 40cm, A support unit for a microfluidic system having a shape in which a length of 511 to 518 is exposed to 50 mm can be manufactured. The positional variation of the flow path formed by the hollow filaments 501 to 508 and 511 to 518 is within ± 20 μm with respect to the design drawing. There is no breakage of the hollow filaments 501 to 508 and 511 to 518 in the entire laid portion, particularly in the cross wiring portion.

  A film heat FTH-40 manufactured by Kyoritsu Electronics Industry is attached to the entire back surface of the aluminum plate and set to 90 ° C. About 20 ° C. water was introduced from one end, and the temperature of the water flowing out from the other end was measured to be 88 ± 1 ° C. Moreover, each temperature of an inflow part, an outflow part, and a cross | intersection part is 89 +/- 0.5 degreeC, and accurate temperature control is possible.

(Example 3)
As shown in FIG. 8, a copper clad laminate (plate thickness 0.2 mm) having 18 μm thick copper on the surface is used for the first support 2, and the first adhesive layer 1 a and the first adhesive layer 1 a are formed on the surface. As the second adhesive layer 1b, S9009 (thickness: 200 μm) manufactured by Dow Corning Asia, which is a non-tacky adhesive at room temperature, is roll-laminated. A high-performance engineering plastic tube (material: PEEK, inner diameter 0.2 mm) manufactured by Nirei Industry Co., Ltd. was used for this, using a multi-wire wiring machine that can control the output of ultrasonic vibration and load and move the XY table by NC control. , The outer diameter is 0.4 mm). The hollow filament 58 to be laid is subjected to vibration by an ultrasonic wave having a load of 80 g and a frequency of 30 kHz. The hollow filament 58 is laid in an arc shape having a radius of 5 mm, and an intersecting portion is also provided. In the vicinity of the intersection, the load and ultrasonic vibration are stopped. As the second support 6, a product obtained by roll laminating S9009 (thickness: 200 μm) manufactured by Dow Corning Asia Co., Ltd. on the surface of Kapton 200H manufactured by DuPont is used, and is laminated on the surface where the hollow filament 58 is laid by vacuum lamination.

  Thereafter, laser drilling for small-diameter drilling for printed circuit boards is performed on the second support 6, the first adhesive layer 1 a, the second adhesive layer 1 b, and the hollow filament 58 at the location to be the relay unit 8. Using a machine, drill a hole of φ 0.2 mm with a pulse width of 5 ms and a shot number of 4 shots. Thereafter, the support unit for the microfluidic system having the relay portion 8 to which a plurality of flow paths are connected can be manufactured by external processing with a router.

(Other embodiments)
Although the present invention has been described in the above form, it should not be understood that the parts and drawings that form a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

For example, as shown in FIG. 9A, a through hole is provided in a part of the support unit for the microfluidic system, and a time-periodic force is applied to a part of the hollow filament 58 by a motor with a cam or the like, so that the hollow part at this part is hollow. When the microfilament or the microvalve which deforms the filament and moves the fluid at this location to generate a pulsating flow is used, the hollow filament 58 is preferably elastic. In particular, the hollow filament 58 preferably has a Young's modulus of 10 ₃ MPa or less.

  Further, as shown in FIG. 9B, a metal film 59 can be formed on a part of the exposed hollow filament 58 to form a terminal for applying a voltage or the like. In this case, Cu, Al, nickel (Ni), chromium (Cr), gold (Au), or the like may be formed as a single layer or multiple layers by plating or vapor deposition.

  Further, as shown in FIGS. 8 (a) and 8 (b), the microfluidic system support unit includes the relay part 8 as an opening, but the relay part 8 only mixes or branches the fluid. When performing, as shown in FIG. 10, you may make it the structure closed without removing the 2nd support body 6. FIG.

  Furthermore, the first hollow filament group and the second hollow filament group do not necessarily need to be orthogonal to each other at 90 degrees, and may be crossed. Therefore, for example, not only the first and second hollow filament groups but also a third hollow filament group can be laid.

  On the other hand, the hollow filaments do not necessarily need to cross each other, and as shown in FIGS. 11 and 12, the hollow filaments may be composed of only a first hollow filament group composed of a plurality of hollow filaments 501 to 508 running in one direction.

Moreover, as shown in FIG. 13, a plurality of hollow filaments 511 to 518 that draw a curve may be laid.

  Note that a plurality of hollow filaments do not necessarily have to be laid, that is, a single hollow filament may be provided.

FIG. 1A is a cross-sectional view of the microfluidic system support unit according to the first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken from the direction of arrows AA in FIG. It is a top view corresponding to (a). It is process sectional drawing (the 1) explaining the manufacturing method of the support unit for microfluidic systems which concerns on the 1st Embodiment of this invention. FIG. 3A is a process cross-sectional view (part 2) for explaining the manufacturing method of the microfluidic system support unit according to the first embodiment of the present invention, and FIG. 3B is a line AA. A cross-sectional view seen from the arrow direction is a plan view corresponding to FIG. FIG. 4A is a process cross-sectional view (part 3) for explaining the manufacturing method of the microfluidic system support unit according to the first embodiment of the present invention, and FIG. 4B is a line AA. A cross-sectional view seen from the arrow direction is a plan view corresponding to FIG. FIG. 5A is a process cross-sectional view (part 4) for explaining the manufacturing method of the microfluidic system support unit according to the first embodiment of the present invention, and FIG. A cross-sectional view seen from the direction of the arrow is a plan view corresponding to FIG. FIG. 6A is a process cross-sectional view (No. 5) for explaining the manufacturing method of the microfluidic system support unit according to the first embodiment of the present invention, and FIG. 6B is a line AA. A cross-sectional view seen from the arrow direction is a plan view corresponding to FIG. FIG. 7A is a process cross-sectional view (No. 6) for explaining the manufacturing method of the microfluidic system support unit according to the first embodiment of the present invention, and FIG. A cross-sectional view seen from the direction of the arrow is a plan view corresponding to FIG. Fig.8 (a) is a bird's-eye view of the support unit for microfluidic systems provided with the relay part based on the 2nd Embodiment of this invention, FIG.8 (b) is the AA line direction of Fig.8 (a). FIG. It is a bird's-eye view explaining the structure of the hollow filament for support units for microfluidic systems concerning other embodiments of the present invention. It is sectional drawing of the support unit for microfluidic systems provided with the relay part which concerns on other embodiment of this invention. FIG. 11A is a cross-sectional view of the microfluidic system support unit according to still another embodiment of the present invention shown in FIG. FIG. 11B is a cross-sectional view of the plan view shown in FIG. It is a bird's-eye view of the support unit for microfluidic systems which concerns on other embodiment of this invention shown in FIG. It is a bird's-eye view which shows the modification of the support unit for microfluidic systems which concerns on other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a ... 1st adhesive bond layer 1b ... 2nd adhesive bond layer 2 ... 1st support body 3a, 3b, 3c, 3d ... Release layer 4a, 4b, 4c, 4d ... Slit 6 ... 2nd support body DESCRIPTION OF SYMBOLS 7 ... Cutting line 8 ... Relay part 58,501-508,511-518 ... Hollow filament 59 ... Metal film 61 ... NC wiring machine

Claims (11)

A first support;
A first adhesive layer provided on the surface of the first support;
A support for a microfluidic system comprising: at least two isometric hollow filaments functioning as a flow path layer of the microfluidic system laid in an arbitrary shape on the surface of the first adhesive layer unit.   2. The support unit for a microfluidic system according to claim 1, wherein there are two or more sets of the isometric hollow filaments.   3. The support unit for a microfluidic system according to claim 1, wherein a part of the hollow filament is exposed from the first support.   The support unit for a microfluidic system according to any one of claims 1 to 3, wherein an end of the hollow filament is exposed from the first support.   The support unit for a microfluidic system according to any one of claims 1 to 4, wherein a metal film is formed on a part of at least one of the hollow filaments.   6. The support unit for a microfluidic system according to claim 1, wherein a part of at least one of the hollow filaments includes a light transmitting portion formed of a light transmitting material. .   The support unit for a microfluidic system according to any one of claims 1 to 6, wherein a part of at least one of the hollow filaments has optical transparency.   The support unit for a microfluidic system according to any one of claims 1 to 7, wherein the laying shape of the hollow filament is fixed by the first adhesive layer.   The support unit for a microfluidic system according to any one of claims 1 to 8, wherein there is a void around the hollow filament.   The support unit for a microfluidic system according to any one of claims 1 to 9, wherein a terminal or a circuit is formed on a surface of the first support.   11. The device according to claim 1, wherein at least one selected from a micromachine, a heating element, a piezoelectric element, a sensor, an electronic component, and an optical component is mounted on the surface of the first support. The support unit for a microfluidic system as described.

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