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JP4080149B2 - Work head moving device - Google Patents

Work head moving device Download PDF

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Publication number
JP4080149B2
JP4080149B2 JP2000209425A JP2000209425A JP4080149B2 JP 4080149 B2 JP4080149 B2 JP 4080149B2 JP 2000209425 A JP2000209425 A JP 2000209425A JP 2000209425 A JP2000209425 A JP 2000209425A JP 4080149 B2 JP4080149 B2 JP 4080149B2
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Prior art keywords
linear motion
linear
working head
drive mechanism
detecting means
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JP2002026596A (en
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亮一 入田
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品実装用装置に用いられ、電子部品移載ヘッドなどの作業ヘッドを直動方向に移動させる作業ヘッドの移動装置に関するものである。
【０００２】
【従来の技術】
電子部品実装用装置においては、電子部品を移送する移載ヘッドなどの各種の作業ヘッドが用いられ、これらの作業ヘッドは一般に移動テーブルによって駆動される。これらの移動テーブルの大部分は直線状のスライドガイドによる直動機構を備えている。この直動機構によって駆動される作業ヘッドなどの被駆動部が直動方向と直交する方向に長いスパンを有する場合には、直動機構には通常複数のスライドガイドが用いられる。そしてこの被駆動部を、ボールねじなどの直動駆動機構によって駆動することにより、作業ヘッドが複数のスライドガイドによってガイドされ直動方向に移動する。
【０００３】
【発明が解決しようとする課題】
ところが上記複数のスライドガイドを用いた直動機構においては、直動駆動手段を必ずしも被駆動部の重心位置、すなわちスライドガイドに対する直動負荷が均一となる位置に配置できない場合が発生する。このような場合には、各スライドガイドに作用する荷重が不均一となる結果、直動方向に対して被駆動部は水平面内でわずかに傾いた状態で移動する。このため、直動駆動機構への位置指示値と作業ヘッドの実際の位置とは正しく一致せず、位置決め精度が低下することとなっていた。
【０００４】
そこで本発明は、位置決め精度を確保することができる作業ヘッドの移動装置を提供することを目的とする。
【０００５】
【課題を解決するための手段】
請求項１記載の作業ヘッドの移動装置は、電子部品実装用装置において作業ヘッドを水平面内でＸＹ方向に移動させる作業ヘッドの移動装置であって、前記水平面内のＹ方向に相互に平行に配列された第１直動ガイド部および第２直動ガイド部と、これらの第１直動ガイド部および第２直動ガイド部に沿ってそれぞれ水平面内で移動する第１直動スライド部および第２直動スライド部と、これらの第１直動スライド部および第２直動スライド部のＹ方向の位置ＹＬ，ＹＲをそれぞれ検出する第１位置検出手段および第２位置検出手段と、第１直動スライド部および第２直動スライド部を連結し前記作業ヘッドが結合された連結部と、この連結部のＸ方向における一方の側に偏った位置に結合されてこの連結部をＹ方向に駆動する第１直動駆動機構と、前記第１位置検出手段と第２位置検出手段の配設ピッチＰ、前記作業ヘッドのＸ方向の位置である前記第１位置検出手段からの距離Ｘ並びに前記第１位置検出手段および第２位置検出手段の位置検出結果ＹＬ，ＹＲに基づいて前記作業ヘッドのＹ方向の位置補正量ΔｙをΔｙ＝（ＹＬ−ＹＲ）×Ｘ／Ｐから求め、この位置補正量Δｙだけ前記作業ヘッドをＹ方向に移動させるように前記第１直動駆動機構を制御する制御手段とを備えた。
【０００６】
請求項２記載の作業ヘッドの移動装置は、請求項１記載の作業ヘッドの移動装置であって、前記連結部は、前記Ｙ方向と直交するＸ方向に移動する第２直動駆動機構を備え、前記作業ヘッドはこの第２直動駆動機構を介して連結部と結合されている。
請求項３記載の作業ヘッドの移動装置は、電子部品実装用装置において作業ヘッドを水平面内でＸＹ方向に移動させる作業ヘッドの移動装置であって、前記水平面内のＹ方向に相互に平行に配列された第１直動ガイド部および第２直動ガイド部と、これらの第１直動ガイド部および第２直動ガイド部に沿ってそれぞれ水平面内で移動する第１直動スライド部および第２直動スライド部と、これらの第１直動スライド部又は第２直動スライド部のＹ方向の位置ＹＬ’，ＹＲを検出する位置検出手段と、第１直動スライド部および第２直動スライド部を連結し前記作業ヘッドが結合された連結部と、前記第１直動スライド部に近接して設けられ前記連結部をＹ方向に駆動する第１直動駆動機構と、前記位置検出手段と前記第１直動駆動機構の距離Ｐ’、前記作業ヘッドの前記第１直動駆動機構からのＸ方向の距離Ｘ’並びに前記第１直動駆動機構および前記位置検出手段の位置検出結果ＹＬ’，ＹＲに基づいて前記作業ヘッドのＹ方向の位置補正量Δｙ’をΔｙ’＝（ＹＬ’−ＹＲ）×Ｘ’／Ｐから求め、この位置補正量Δｙ’だけ前記作業ヘッドをＹ方向に移動させるように前記第１直動駆動機構を制御する制御手段とを備えた。
【０００９】
本発明によれば、相互に平行に配列された第１直動ガイド部および第２直動ガイド部に沿って水平面内で移動する第１直動スライド部および第２直動スライド部の位置をそれぞれ第１位置検出手段および第２位置検出手段によって検出し、作業ヘッドが結合され前記第１直動スライド部および第２直動スライド部を連結する連結部を第１直動駆動手段によってＹ方向に駆動する際に、位置検出結果に基づいて直動駆動手段を制御して前記作業ヘッドのＹ方向の位置ずれ誤差を補正することにより、直動駆動機構が被駆動部の重心位置に配置されていない場合においても作業ヘッドの位置決め精度を確保することができる。
【００１０】
【発明の実施の形態】
まず本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の電子部品実装装置の平面図、図２、図３は本発明の一実施の形態の電子部品実装装置の移載ヘッド移動機構の位置補正の説明図である。
【００１１】
まず図１、図２を参照して電子部品実装装置について説明する。図１において、基台１の中央部には、Ｘ方向に搬送路２が配設されている。搬送路２は、基板３を搬送し位置決めする位置決め部となっている。搬送路２の手前側には、電子部品の供給部４が配置されており、供給部４にはテーピングされた電子部品を供給するテープフィーダ５が多数並設されている。
【００１２】
基台１上面の両端部には、それぞれガイドレール６Ａ，６ＢがＹ方向に水平に配設されている。ガイドレール６Ａ，６Ｂは、それぞれ第１方向（Ｙ方向）に相互に平行に配列された第１直動ガイド部および第２直動ガイド部となっている。ガイドレール６Ａ，６Ｂには、それぞれスライドブロック７Ａ，７Ｂが摺動自在に嵌合している。スライドブロック７Ａ，７Ｂは、第１直動ガイド部および第２直動ガイド部に沿って水平面内で移動する第１直動スライド部および第２直動スライド部となっている。
【００１３】
スライドブロック７Ａ，７Ｂは、連結部８によって連結されており、連結部８には中心線から左側に偏った位置に、ナット部材９が結合されており、ナット部材９にはモータ１０によって回転駆動される送りねじ１１が螺合している。したがって、モータ１０を駆動することにより連結部８はＹ方向に移動する。モータ１０、送りねじ１１及びナット部材９は、連結部８を第１方向に駆動する第１直動駆動機構となっている。
【００１４】
ガイドレール６Ａ，６Ｂに沿って、リニアスケール１７Ａ，１７Ｂが配設されており、リニアスケール１７Ａ，１７Ｂは、スライドブロック７Ａ，７ＢのＹ方向の位置をそれぞれ検出する。したがってリニアスケール１７Ａ，１７Ｂは、それぞれ第１直動スライド部および第２直動スライド部の第１方向の位置を検出する第１位置検出手段、第２位置検出手段となっている。リニアスケール１７Ａ，１７Ｂは、原点位置が厳密に一致するように設定され、機械座標系に対して正しいＹ方向の位置を検出できるようになっている。位置検出結果は、制御部１８（制御手段）に送られる。制御部１８は、これらの位置検出結果に基づいて、モータ１０を制御する。
【００１５】
連結部８にはＸ方向にスライド自在に移動ブロック１２が設けられており、移動ブロック１２には作業ヘッドである移載ヘッド１６が装着されている。移動ブロック１２を挿通して設けられたナット部材１３には、モータ１５によって回転駆動される送りねじ１４が螺合している。モータ１５を駆動することにより、移載ヘッド１６はＸ方向に移動する。したがって、モータ１５、送りねじ１４及びナット部材１３は、連結部８に備えられ、移載ヘッド１６をＸ方向（第２方向）に移動させる第２直動駆動機構となっている。
【００１６】
上記構成により、移載ヘッド１６は供給部４及び搬送路２上をＸＹ方向に移動し、供給部４のテープフィーダ５から電子部品を取り出して、搬送路２上に位置決めされた基板３上に移動し、基板３の実装点に電子部品を実装する実装動作が可能となっている。この実装動作において、移載ヘッド１６がＹ方向に移動する際には、連結部８のＸ方向における一方の側である左側部分に偏った位置に結合された第１直動駆動機構によって駆動される。このため、Ｙ方向の直動駆動力は、連結部８が連結されたスライドブロック７Ａ，７Ｂに対して左右対称には伝達されない。
【００１７】
この結果図２に示すように、スライドブロック７Ａ，７ＢのＹ方向の位置ＹＬ，ＹＲは必ずしも一致せず、連結部８に結合された移載ヘッド１６の実際の位置は、指令位置からΔｙだけずれる。この位置ずれは、スライドブロック７Ａ，７Ｂとガイドレール６Ａ，６Ｂとの嵌合隙間に起因するガタや、連結部８の撓み変形などによって生じるものである。
【００１８】
この位置ずれを補正するため、本実施の形態では以下に説明する方法で位置補正を行う。すなわち、モータ１０を駆動して移載ヘッド１６のＹ方向移動を行う際には、リニアスケール１７Ａ，１７Ｂによってスライドブロック７Ａ，７Ｂの位置ＹＬ，ＹＲを検出し、位置検出結果を制御部１８に送る。制御部１８は、モータ１５に設けられたエンコーダからのパルス信号によって移載ヘッド１６のＸ方向の位置（一方のリニアスケール１７Ａからの距離）Ｘを常に把握しており、Ｙ方向の位置計測点間寸法、すなわちリニアスケール１７Ａ，１７Ｂの配設ピッチＰと、これらの位置検出結果ＹＬ，ＹＲ，Ｘから、（数１）によって移載ヘッド１６のＹ方向の位置補正量Δｙを計算によって求める。
【００１９】
【数１】

Figure 0004080149
【００２０】
そしてモータ１０を駆動して、求められた位置補正量Δｙだけスライドブロック７Ａ、７Ｂを移動させる。すなわち移載ヘッド１６が結合された連結部８をモータ１０を駆動してＹ方向に駆動する際に、前記位置検出結果に基づいてモータ１０を制御部１８によって制御することにより、移載ヘッド１６のＹ方向の位置ずれ誤差を補正する。これにより、駆動力の伝達位置が左右対称でないことによるＹ方向の位置ずれを正しく補正することができる。
【００２１】
上記実施の形態では、移載ヘッド１６は連結部８に備えられた第２直動駆動機構によってＸ方向に移動可能となっており、Ｙ方向の位置ずれ誤差の補正量は、移載ヘッド１６のＸ方向の位置に応じて自動的に変えられるようになっている。移載ヘッド１６が連結部８に固定的に結合されている場合には、上記Ｘ寸法は固定寸法となる。
【００２２】
なお、上記実施の形態では、位置検出手段として２つのリニアスケール１７Ａ，１７Ｂを用いる例を示したが、連結部８における第１直動駆動機構の配設位置が、いずれかのスライドブロックに近接して設けられている場合には、モータ１０のエンコーダからのパルス信号をＹ方向の位置検出手段からの検出信号の代用として用いてもよい。
【００２３】
すなわち、図３に示すように、送りねじ１１とリニアスケール１７Ｂとの距離Ｐ’、送りねじ１１からの移載ヘッド１６のＸ方向との距離Ｘ’を、それぞれ前述のＰ，Ｘとして置き換え、移載ヘッド１６のＹ方向の位置補正量Δｙ’を上記（数１）と同様にΔｙ’＝（ＹＬ’−ＹＲ）×Ｘ’／Ｐより求める。ＹＬ’は、上記のようにモータ１０のエンコーダからのパルス信号から送られた送りねじ１１の位置検出結果であって、図２に示すリニアスケール１７Ａによる上記検出結果ＹＬの代用となるものである。これにより、Ｙ方向位置検出用のリニアスケールはモータ１０による直動駆動機構の反対側のみに設ければよく、機構の簡略化を図ることができる。
【００２４】
なお、上記実施の形態では、作業ヘッドとして電子部品実装装置における移載ヘッドの例を示したが、本発明の適用対象はこれに限定されず、ボンド塗布装置や印刷装置など、直動機構を備えた装置であればよい。
【００２５】
【発明の効果】
本発明によれば、相互に平行に配列された第１直動ガイド部および第２直動ガイド部に沿って水平面内で移動する第１直動スライド部および第２直動スライド部の位置をそれぞれ第１位置検出手段および第２位置検出手段によって検出し、作業ヘッドが結合され第１直動スライド部および第２直動スライド部を連結する連結部を直動駆動手段によって第１方向に駆動する際に、位置検出結果に基づいて直動駆動手段を制御して作業ヘッドの第１方向の位置ずれ誤差を補正するようにしたので、直動駆動手段が被駆動部の重心位置に配置されていない場合においても作業ヘッドの位置決め精度を確保することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品実装装置の平面図
【図２】本発明の一実施の形態の電子部品実装装置の移載ヘッド移動機構の位置補正の説明図
【図３】本発明の一実施の形態の電子部品実装装置の移載ヘッド移動機構の位置補正の説明図
【符号の説明】
６Ａ，６Ｂ ガイドレール
７Ａ，７Ｂ スライドブロック
８ 連結部
９ ナット
１０ モータ
１１ 送りねじ
１６ 移載ヘッド
１８ 制御部[0001]
BACKGROUND OF THE INVENTION
The present invention is used in the electronic component mounting apparatus, in which relates the working head of an electronic component transfer head to move equipment of the working head is moved in linear direction.
[0002]
[Prior art]
In an electronic component mounting apparatus, various working heads such as a transfer head for transferring electronic components are used, and these working heads are generally driven by a moving table. Most of these moving tables are provided with a linear motion mechanism using a linear slide guide. When a driven part such as a work head driven by the linear motion mechanism has a long span in a direction orthogonal to the linear motion direction, a plurality of slide guides are usually used for the linear motion mechanism. Then, by driving the driven portion by a linear motion drive mechanism such as a ball screw, the work head is guided by a plurality of slide guides and moves in the linear motion direction.
[0003]
[Problems to be solved by the invention]
However, in the linear motion mechanism using the plurality of slide guides, there are cases where the linear motion driving means cannot always be arranged at the position of the center of gravity of the driven portion, that is, the position where the linear motion load on the slide guide is uniform. In such a case, as a result of non-uniform loads acting on the slide guides, the driven part moves with a slight inclination in the horizontal plane with respect to the linear movement direction. For this reason, the position instruction value for the linear drive mechanism and the actual position of the work head do not match correctly, and the positioning accuracy is reduced.
[0004]
The present invention aims to provide a mobile equipment working head can be secured positioning accuracy.
[0005]
[Means for Solving the Problems]
The working head moving device according to claim 1, wherein the working head moving device in the electronic component mounting device moves the working head in the X and Y directions in a horizontal plane, and is arranged in parallel to the Y direction in the horizontal plane. The first linear motion guide portion and the second linear motion guide portion, and the first linear motion slide portion and the second linear motion guide portion that move in the horizontal plane along the first linear motion guide portion and the second linear motion guide portion, respectively. Linear motion slide parts, first position detection means and second position detection means for detecting Y-direction positions YL and YR of the first linear motion slide part and the second linear motion slide part, respectively, and first linear motion A connecting portion where the slide head and the second linearly moving slide portion are connected and the working head is connected, and the connecting portion is connected to a position biased to one side in the X direction of the connecting portion to drive the connecting portion in the Y direction. First linear motion drive And structure, arrangement pitch P of the first position detecting means and the second position detecting means, a distance X and the first position detection means from the first position detecting means X is the direction of the position of the working head and the The position correction amount Δy in the Y direction of the working head is obtained from Δy = (YL−YR) × X / P based on the position detection results YL and YR of the two position detecting means, and the working head is moved by this position correction amount Δy. And control means for controlling the first linear drive mechanism so as to move in the Y direction.
[0006]
The working head moving device according to claim 2 is the working head moving device according to claim 1, wherein the connecting portion includes a second linear drive mechanism that moves in an X direction orthogonal to the Y direction. The working head is coupled to the connecting portion through the second linear drive mechanism.
The working head moving device according to claim 3, wherein the working head moving device in the electronic component mounting device moves the working head in the XY direction in a horizontal plane, and is arranged parallel to the Y direction in the horizontal plane. The first linear motion guide portion and the second linear motion guide portion, and the first linear motion slide portion and the second linear motion guide portion that move in the horizontal plane along the first linear motion guide portion and the second linear motion guide portion, respectively. Linear motion slide portions, position detection means for detecting Y-direction positions YL ′ and YR of the first linear motion slide portion or the second linear motion slide portion, the first linear motion slide portion and the second linear motion slide A connecting portion in which the working heads are connected to each other, a first linear drive mechanism that is provided in the vicinity of the first linear slide portion and drives the connecting portion in the Y direction, and the position detecting means. The distance P of the first linear drive mechanism ', Based on the X-direction distance X' of the working head from the first linear drive mechanism and the position detection results YL 'and YR of the first linear drive mechanism and the position detecting means. The first linear drive mechanism is obtained so that a position correction amount Δy ′ in the direction is obtained from Δy ′ = (YL′−YR) × X ′ / P, and the work head is moved in the Y direction by this position correction amount Δy ′. And control means for controlling.
[0009]
According to the present invention, the positions of the first linear motion slide portion and the second linear motion slide portion that move in the horizontal plane along the first linear motion guide portion and the second linear motion guide portion arranged in parallel to each other are determined. Detected by the first position detecting means and the second position detecting means, respectively, and a connecting portion to which the work head is coupled and connects the first linear motion slide portion and the second linear motion slide portion is connected to the Y direction by the first linear motion driving device. When driving, the linear drive mechanism is arranged at the center of gravity of the driven part by controlling the linear drive means based on the position detection result to correct the positional deviation error of the working head in the Y direction. Even when not, the positioning accuracy of the work head can be ensured.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
First, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are explanatory diagrams of position correction of a transfer head moving mechanism of the electronic component mounting apparatus according to an embodiment of the present invention. is there.
[0011]
First, an electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a transport path 2 is arranged in the X direction at the center of a base 1. The transport path 2 is a positioning unit that transports and positions the substrate 3. An electronic component supply unit 4 is disposed on the front side of the transport path 2, and a number of tape feeders 5 for supplying the taped electronic components are arranged in parallel in the supply unit 4.
[0012]
Guide rails 6A and 6B are horizontally disposed in the Y direction at both ends of the upper surface of the base 1, respectively. The guide rails 6A and 6B are a first linear motion guide portion and a second linear motion guide portion that are arranged in parallel to each other in the first direction (Y direction). Slide blocks 7A and 7B are slidably fitted to the guide rails 6A and 6B, respectively. The slide blocks 7A and 7B are a first linear motion slide portion and a second linear motion slide portion that move in a horizontal plane along the first linear motion guide portion and the second linear motion guide portion.
[0013]
The slide blocks 7 </ b> A and 7 </ b> B are connected by a connecting portion 8, and a nut member 9 is coupled to the connecting portion 8 at a position deviated to the left from the center line. The nut member 9 is rotationally driven by a motor 10. The feed screw 11 is screwed. Accordingly, by driving the motor 10, the connecting portion 8 moves in the Y direction. The motor 10, the feed screw 11 and the nut member 9 form a first linear motion drive mechanism that drives the connecting portion 8 in the first direction.
[0014]
Linear scales 17A and 17B are disposed along the guide rails 6A and 6B, and the linear scales 17A and 17B detect the positions of the slide blocks 7A and 7B in the Y direction, respectively. Accordingly, the linear scales 17A and 17B serve as a first position detection unit and a second position detection unit that detect the positions of the first linear slide part and the second linear slide part in the first direction, respectively. The linear scales 17A and 17B are set so that the origin positions exactly coincide with each other, and can detect a correct position in the Y direction with respect to the machine coordinate system. The position detection result is sent to the control unit 18 (control means). The control unit 18 controls the motor 10 based on these position detection results.
[0015]
The connecting portion 8 is provided with a moving block 12 slidable in the X direction, and a moving head 16 as a work head is mounted on the moving block 12. A feed screw 14 that is rotationally driven by a motor 15 is screwed into a nut member 13 that is inserted through the moving block 12. By driving the motor 15, the transfer head 16 moves in the X direction. Therefore, the motor 15, the feed screw 14, and the nut member 13 are provided in the connecting portion 8, and serve as a second linear drive mechanism that moves the transfer head 16 in the X direction (second direction).
[0016]
With the above configuration, the transfer head 16 moves in the X and Y directions on the supply unit 4 and the conveyance path 2, takes out the electronic components from the tape feeder 5 of the supply unit 4, and is placed on the substrate 3 positioned on the conveyance path 2. The mounting operation of moving and mounting the electronic component on the mounting point of the substrate 3 is possible. In this mounting operation, when the transfer head 16 moves in the Y direction, the transfer head 16 is driven by a first linear drive mechanism coupled to a position biased to the left side portion, which is one side of the connecting portion 8 in the X direction. The For this reason, the linear motion driving force in the Y direction is not transmitted symmetrically with respect to the slide blocks 7A and 7B to which the connecting portion 8 is connected.
[0017]
As a result, as shown in FIG. 2, the Y-direction positions YL and YR of the slide blocks 7A and 7B do not necessarily coincide with each other, and the actual position of the transfer head 16 coupled to the connecting portion 8 is only Δy from the command position. Shift. This misalignment is caused by looseness caused by the fitting gap between the slide blocks 7A and 7B and the guide rails 6A and 6B, bending deformation of the connecting portion 8, and the like.
[0018]
In order to correct this misalignment, the present embodiment performs position correction by the method described below. That is, when the motor 10 is driven to move the transfer head 16 in the Y direction, the positions YL and YR of the slide blocks 7A and 7B are detected by the linear scales 17A and 17B, and the position detection result is sent to the control unit 18. send. The control unit 18 always knows the X-direction position (distance from one linear scale 17A) X of the transfer head 16 based on the pulse signal from the encoder provided in the motor 15, and the Y-direction position measurement point. A position correction amount Δy in the Y direction of the transfer head 16 is calculated by (Equation 1) from the space dimension, that is, the arrangement pitch P of the linear scales 17A and 17B and the position detection results YL, YR, and X.
[0019]
[Expression 1]
Figure 0004080149
[0020]
Then, the motor 10 is driven to move the slide blocks 7A and 7B by the obtained position correction amount Δy. That is, when the connecting portion 8 to which the transfer head 16 is coupled is driven in the Y direction by driving the motor 10, the transfer head 16 is controlled by the control unit 18 based on the position detection result. The Y position misalignment error is corrected. As a result, it is possible to correctly correct the positional deviation in the Y direction due to the fact that the transmission position of the driving force is not symmetrical.
[0021]
In the above embodiment, the transfer head 16 can be moved in the X direction by the second linear drive mechanism provided in the connecting portion 8, and the correction amount of the misalignment error in the Y direction is the transfer head 16. It can be automatically changed according to the position in the X direction. When the transfer head 16 is fixedly coupled to the connecting portion 8, the X dimension is a fixed dimension.
[0022]
In the above-described embodiment, an example in which the two linear scales 17A and 17B are used as the position detection unit has been described. However, the arrangement position of the first linear drive mechanism in the connecting portion 8 is close to one of the slide blocks. In this case, the pulse signal from the encoder of the motor 10 may be used as a substitute for the detection signal from the position detection means in the Y direction.
[0023]
That is, as shown in FIG. 3, the distance P ′ between the feed screw 11 and the linear scale 17B and the distance X ′ from the feed screw 11 to the X direction of the transfer head 16 are replaced with the aforementioned P and X, respectively. The position correction amount Δy ′ in the Y direction of the transfer head 16 is obtained from Δy ′ = (YL′−YR) × X ′ / P in the same manner as in (Expression 1). YL ′ is a position detection result of the feed screw 11 sent from the pulse signal from the encoder of the motor 10 as described above, and is a substitute for the detection result YL by the linear scale 17A shown in FIG. . As a result, the linear scale for detecting the Y-direction position only needs to be provided on the opposite side of the linear drive mechanism by the motor 10, and the mechanism can be simplified.
[0024]
In the above embodiment, an example of the transfer head in the electronic component mounting apparatus is shown as the work head. However, the application target of the present invention is not limited to this, and a linear motion mechanism such as a bond coating apparatus or a printing apparatus is used. Any device may be used.
[0025]
【The invention's effect】
According to the present invention, the positions of the first linear motion slide portion and the second linear motion slide portion that move in the horizontal plane along the first linear motion guide portion and the second linear motion guide portion arranged in parallel to each other are determined. Detected by the first position detecting means and the second position detecting means, respectively, and the connecting portion connecting the work head and connecting the first linear motion slide portion and the second linear motion slide portion is driven in the first direction by the linear motion driving device. In this case, since the linear motion driving means is controlled based on the position detection result to correct the positional deviation error in the first direction of the work head, the linear motion driving means is arranged at the center of gravity of the driven part. Even when not, the positioning accuracy of the work head can be ensured.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is an explanatory diagram of position correction of a transfer head moving mechanism of the electronic component mounting apparatus according to an embodiment of the present invention. An explanatory diagram of position correction of a transfer head moving mechanism of an electronic component mounting apparatus according to an embodiment of the present invention
6A, 6B Guide rails 7A, 7B Slide block 8 Connecting part 9 Nut 10 Motor 11 Feed screw 16 Transfer head 18 Control part

Claims (3)

電子部品実装用装置において作業ヘッドを水平面内でＸＹ方向に移動させる作業ヘッドの移動装置であって、前記水平面内のＹ方向に相互に平行に配列された第１直動ガイド部および第２直動ガイド部と、これらの第１直動ガイド部および第２直動ガイド部に沿ってそれぞれ水平面内で移動する第１直動スライド部および第２直動スライド部と、これらの第１直動スライド部および第２直動スライド部のＹ方向の位置ＹＬ，ＹＲをそれぞれ検出する第１位置検出手段および第２位置検出手段と、第１直動スライド部および第２直動スライド部を連結し前記作業ヘッドが結合された連結部と、この連結部のＸ方向における一方の側に偏った位置に結合されてこの連結部をＹ方向に駆動する第１直動駆動機構と、前記第１位置検出手段と第２位置検出手段の配設ピッチＰ、前記作業ヘッドのＸ方向の位置である前記第１位置検出手段からの距離Ｘ並びに前記第１位置検出手段および第２位置検出手段の位置検出結果ＹＬ，ＹＲに基づいて前記作業ヘッドのＹ方向の位置補正量ΔｙをΔｙ＝（ＹＬ−ＹＲ）×Ｘ／Ｐから求め、この位置補正量Δｙだけ前記作業ヘッドをＹ方向に移動させるように前記第１直動駆動機構を制御する制御手段とを備えたことを特徴とする作業ヘッドの移動装置。A working head moving device for moving a working head in an XY direction in a horizontal plane in an electronic component mounting apparatus, wherein the first linear motion guide unit and the second linear guide unit are arranged in parallel to each other in the Y direction in the horizontal plane. The first linear motion slide portion and the second linear motion slide portion that move in the horizontal plane along the first linear motion guide portion and the second linear motion guide portion, respectively, and the first linear motion The first position detecting means and the second position detecting means for detecting the Y-direction positions YL and YR of the slide portion and the second linear motion slide portion, respectively, and the first linear motion slide portion and the second linear motion slide portion are connected. A coupling portion to which the working head is coupled, a first linear drive mechanism coupled to a position biased to one side of the coupling portion in the X direction and driving the coupling portion in the Y direction, and the first position. Detection means and second position Arrangement pitch P in detecting means, the position detection result of the distance X and the first position detection means and the second position detecting means from the first position detecting means X is the direction of the position of the working head YL, based on YR The position correction amount Δy in the Y direction of the work head is obtained from Δy = (YL−YR) × X / P, and the first linear drive is performed so that the work head is moved in the Y direction by the position correction amount Δy. A working head moving device comprising: control means for controlling the mechanism. 前記連結部は、前記Ｙ方向と直交するＸ方向に移動する第２直動駆動機構を備え、前記作業ヘッドはこの第２直動駆動機構を介して連結部と結合されていることを特徴とする請求項１記載の作業ヘッドの移動装置。The connecting portion includes a second linear drive mechanism that moves in an X direction orthogonal to the Y direction, and the working head is coupled to the connecting portion via the second linear drive mechanism. The working head moving device according to claim 1. 電子部品実装用装置において作業ヘッドを水平面内でＸＹ方向に移動させる作業ヘッドの移動装置であって、前記水平面内のＹ方向に相互に平行に配列された第１直動ガイド部および第２直動ガイド部と、これらの第１直動ガイド部および第２直動ガイド部に沿ってそれぞれ水平面内で移動する第１直動スライド部および第２直動スライド部と、これらの第１直動スライド部又は第２直動スライド部のＹ方向の位置ＹＬ’，ＹＲを検出する位置検出手段と、第１直動スライド部および第２直動スライド部を連結し前記作業ヘッドが結合された連結部と、前記第１直動スライド部に近接して設けられ前記連結部をＹ方向に駆動する第１直動駆動機構と、前記位置検出手段と前記第１直動駆動機構の距離Ｐ’、前記作業ヘッドの前記第１直動駆動機構からのＸ方向の距離Ｘ’並びに前記第１直動駆動機構および前記位置検出手段の位置検出結果ＹＬ’，ＹＲに基づいて前記作業ヘッドのＹ方向の位置補正量Δｙ’をΔｙ’＝（ＹＬ’−ＹＲ）×Ｘ’／Ｐから求め、この位置補正量Δｙ’だけ前記作業ヘッドをＹ方向に移動させるように前記第１直動駆動機構を制御する制御手段とを備えたことを特徴とする作業ヘッドの移動装置。A working head moving device for moving a working head in an XY direction in a horizontal plane in an electronic component mounting apparatus, wherein the first linear motion guide unit and the second linear guide unit are arranged in parallel to each other in the Y direction in the horizontal plane. The first linear motion slide portion and the second linear motion slide portion that move in the horizontal plane along the first linear motion guide portion and the second linear motion guide portion, respectively, and the first linear motion A position detecting means for detecting Y-direction positions YL ′ and YR of the slide part or the second linear motion slide part, and a connection in which the first linear motion slide part and the second linear motion slide part are coupled and the working head is coupled. A first linear motion drive mechanism provided in the vicinity of the first linear motion slide portion and driving the connecting portion in the Y direction, a distance P ′ between the position detection means and the first linear motion drive mechanism, The first linear drive machine of the working head The position correction amount Δy ′ in the Y direction of the working head is expressed as Δy ′ = (YL) based on the distance X ′ in the X direction from the position X and the position detection results YL ′ and YR of the first linear drive mechanism and the position detecting means. And a control means for controlling the first linear drive mechanism so as to move the working head in the Y direction by the position correction amount Δy obtained from “−YR) × X ′ / P. To move the working head.
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