JP4071043B2 - Electronic equipment cooling structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling structure for an electronic device.
[0002]
[Prior art]
With the development of computers in recent years, the modules of electronic devices that constitute computer systems have become denser. For example, a large-sized disk array device using a RAID (Redundant Array of Independent Disks) method is a good example. In order to further increase the storage capacity per unit volume of the disk array device, a larger number of fixed magnetic disk devices (HDDs) are accommodated in the housing. Here, it is well known that a part of the current applied to operate each magnetic disk device causes heat generation of the magnetic disk device, and the heat generation amount increases as the density of the magnetic disk device increases. It is. If the temperature of the magnetic disk device becomes high, its operating characteristics deteriorate and there is a possibility of damage. Therefore, it is necessary to cool the magnetic disk device while applying a current to the magnetic disk device.
[0003]
As an example of a conventional cooling method for an electronic apparatus device, air cooling of a disk array device will be described. According to the conventional air-cooling method, the disk array device is housed in a case with good ventilation, and an air-cooling exhaust fan is provided inside the case so that air flows around the individual magnetic disk devices. This is cooling. The structure of the cooling structure is as follows. At the same time as storing a plurality of magnetic disk devices, an exhaust fan is provided on the back or top surface of the disk box that supplies power to each magnetic disk device, and the rear surfaces of the disk boxes are arranged in parallel with each other. One unit is arranged in a plurality of stages above and below, and this unit is housed in a housing having vents on the side and top surfaces. Here, when the exhaust fan operates, air is sucked from the side surface of the housing, this air is passed around each magnetic disk device to cool it, and the cooled air is sent to the back of the disk box. The air is collected in the ventilation path at the center of the casing formed by the gap between the two, and further exhausted from the vent on the upper surface of the casing.
[0004]
If an exhaust fan is installed on the back of the disk box, exhaust air pressure from the exhaust fan that is opposed across the ventilation path will be mixed, resulting in a pressure loss of the exhaust pressure. The air flow is stagnant. Here, the air exhausted from the exhaust fan located at the lower stage of the casing is more mixed and the stagnation is also increased. When the exhaust fan is provided on the upper surface of each disk box, the air resistance exhausted from the exhaust fan located at the lower stage of the casing has a higher pipe resistance when flowing to the vent on the upper surface of the casing. Air stagnation becomes larger.
[0005]
Any of the above air stagnation results in non-uniform cooling inside the housing. In other words, the flow of air to cool the magnetic disk device housed in the disk box located at the lower stage of the casing is stagnant compared to the upper stage, so that the temperature of the lower magnetic disk apparatus becomes higher. In order to eliminate this non-uniformity, the static pressure of the lower exhaust fan must be increased. However, the upper limit of the maximum static pressure (approximately 25 mmAq) that can be increased while maintaining the stable operation of the exhaust fan can reduce the non-uniform cooling. It is known that there is a limit to eliminating the static pressure of the exhaust fan.
[0006]
Methods other than increasing the static pressure of the lower exhaust fan are also employed, and two examples are shown below. In the invention disclosed in Japanese Patent Laid-Open No. Hei 5-99465 in which an exhaust fan is provided on the back of the disk box, a partition plate is provided in the ventilation path, and this is arranged along a flow shape with a small pressure loss of the exhaust flow. As a shape, the collision between the exhausts facing each other was prevented, and the non-uniformity of the exhaust in the vertical direction of the casing was reduced.
[0007]
In the invention disclosed in Japanese Patent Laid-Open No. 2001-307474 in which an exhaust fan is provided on the upper surface of the disc box, the arrangement of the disc box is adjusted for each unit so that the ventilation path is An attempt was made to correct the non-uniform cooling efficiency at the top and bottom of the casing by increasing the pipe resistance of the lower exhaust fan by using the same partition plate as described above.
[0008]
[Problems to be solved by the invention]
However, exhaust air non-uniformity in the housing has not been completely eliminated only by devising the shape of the partition plate and the ventilation path. Further, the installation of the partition plate has a disadvantage that the occupied length in the horizontal direction of the entire disk array device becomes long. Further, as disclosed in Japanese Patent Laid-Open No. 5-99465, the structure of the partition plate considering the fluid shape of the exhaust flow is complicated, and as a result, the structure of the entire disk array device is complicated. Similarly, the idea of the shape of the ventilation path in Japanese Patent Application Laid-Open No. 2001-307474 also increases the horizontal occupation length of the entire apparatus.
[0009]
Thus, if the uneven cooling in the vertical direction in the casing is not completely eliminated, the lower exhaust fan must increase the air volume from the exhaust fan in order to increase its static pressure. In addition, it requires a lot of noise during operation and power consumption.
For this reason, the disk array device becomes a large-sized, high-cost, high-noise and high-power-consumption device due to the partition plate, the ventilation path and the high-power fan.
[0010]
The present invention has been made in view of such problems, and an object of the present invention is to realize a cooling structure for an electronic device such as a disk array device.
[0011]
[Means for Solving the Problems]
  In order to achieve this object, a main invention of the present invention is a cooling structure for an electronic device, in which the electronic device is housed, and a plurality of boxes having an intake surface and an exhaust surface provided to face the intake surface Housing the boxes in a plurality of rows so that the exhaust surfaces of the boxes belonging to one row face the exhaust surfaces of the boxes belonging to the other row with a gap. And an exhaust fan that is provided on the upper end side of the gap and exhausts air flowing into the gap from the exhaust surface to the outside of the housing, and the exhaust fan that is provided on the exhaust surface and is close to the exhaust fan. The exhaust surface is provided with an air flow resistance plate having a vent hole for reducing a ventilation region of air flowing into the gap from the exhaust surface.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
=== Summary of disclosure ===
The following disclosure will reveal at least the following.
According to the cooling structure as described above, the closer the resistor is to the exhaust fan, the greater the flow resistance of the resistor to the air. For this reason, as the electronic device corresponding to the resistor is closer to the exhaust fan, the air flow in the vicinity of the electronic device is suppressed and reaches a predetermined flow rate. On the other hand, the farther away from the exhaust fan, the air flow is promoted to reach the predetermined flow rate. Therefore, it is possible to suppress a tendency that the temperature of the electronic device becomes higher as the temperature of the electronic device is further away from the exhaust fan.
[0013]
The ventilation path is formed by a gap between the boxes or a gap between the box and the casing, and is not a special structure. In addition, the exhaust fan is not disposed in each of the boxes, but only disposed on the ceiling side of the casing. Therefore, it is possible to realize a cooling structure for an electronic device that enables small size, low cost, low noise, and low power consumption.
[0014]
In the resistor, the vent hole may be formed in a minute and large number. According to such a cooling structure, in the resistor, it is easy to change the total area of each vent hole, and thus it is easy to control the flow rate of air passing through the vent hole.
[0015]
Further, a resistor may not be disposed in the box having the longest distance from the exhaust fan.
According to such a cooling structure, the flow of air in the box farthest from the exhaust fan is not suppressed. Therefore, it is possible to suppress a tendency that the temperature of the electronic device becomes higher as the electronic device is further away from the exhaust fan without applying an unnecessary load to the exhaust fan.
[0016]
Moreover, the said resistor may be arrange | positioned by the said exhaust surface for every said box.
According to such a cooling structure, it is possible to make the temperature of the electronic device approximately uniform without depending on the position of the box in which the electronic device is housed.
[0017]
The resistor may be disposed on the exhaust surface inside the box.
According to such a cooling structure, the temperature of the electronic device can be set to a substantially uniform temperature that does not depend on the position of the box in which the electronic device is housed without reducing the width of the ventilation path. Become.
[0018]
=== First Embodiment ===
<<< Structure of cooling structure >>>
In the present embodiment, a cooling structure of the disk array device will be described. Here, the cooling structure of the present embodiment is intended for the entire disk array device and only the housing of the disk array device.
[0019]
FIG. 1 is a perspective view of the disk array device 1, and FIG. 2 is a schematic cross-sectional view of the disk array device 1 to which a pair of disk boxes 10 face each other. The disk box 10 houses a magnetic disk device 20 as an electronic device and supplies power to the magnetic disk device 20. The two disk boxes 10 are arranged symmetrically while maintaining a gap relative to the back as an exhaust surface, forming a unit 30, and four units 30 are arranged vertically. Here, the first unit 31, the second unit 32, the third unit 33, and the fourth unit 34 are designated from the bottom. From the first unit 31 to the fourth unit 34, the gaps are added to form the ventilation path 30a. Under the four-stage unit 30, two distribution boxes 40 for distributing AC power to a driving power source and a fan assembly described later are disposed. That is, the four-stage unit 30, the two distribution boxes 40, and a fan assembly (exhaust fan) described later are housed in the housing 50. The housing 50 includes two doors (not shown) in which a louver (not shown) is provided on the side opposite to the front as the air intake surface of the disk box 10 and a filter (not shown) is provided on the inside. A ceiling surface 50c is provided.
[0020]
As shown in the perspective view of one disk box 10 inserted in FIG. 1, the disk box 10 accommodates 32 magnetic disk devices 20 from the front by 16 in the left-right direction and 16 at the left end. Two power sources 60 for the magnetic disk devices 20 are provided in parallel, and four interface boards 65 for the eight magnetic disk devices 20 are provided in parallel in the center. The platter 70 on the back surface of the disk box 10 is provided with a connector (not shown), and the magnetic disk device 20 can be electrically controlled by plugging the magnetic disk device 20 into this connector. The platter 70 as an exhaust surface in the disk box 10 has a polygonal ventilation window 75 at a position substantially corresponding to the magnetic disk device 20 and the driving power supply 60 in order to ensure air permeability as much as possible. Further, in order to increase the gap between the magnetic disk devices 20, the disk box 10 includes beams and platters 70 that support the disk box 10.
[0021]
As described above, since eight disk boxes 10 are stored in one casing 50, and 32 magnetic disk devices 20 are stored in each disk box 10, as a whole, one casing 50 has 256 disks. The magnetic disk device 20 is accommodated.
[0022]
The magnetic disk device 20 includes a magnetic disk (not shown) for storing information, a magnetic head (not shown) for reading and writing this information, a head arm (not shown) for positioning the magnetic head, an actuator (not shown), etc. It has a sealed structure. The magnetic disk is rotated at high speed by a motor (not shown) through a spindle (not shown). As shown in the perspective view of one disk box 10 inserted in FIG. 1, when the magnetic disk device 20 is viewed from the side positioned in front of the disk box 10 in a narrow direction, the magnetic disk device 20 Is arranged so that it is perpendicular to the front surface of the magnetic disk device 20 and the magnetic disk surface is parallel to the left and right surfaces of the magnetic disk device 20. In the present embodiment, the drive power supply 60 is mounted in the disk box 10, but a configuration provided inside the magnetic disk device 20 may be employed.
[0023]
As shown in the perspective view of one disc box 10 inserted in FIG. 1 and FIG. 2, the surface of the platter 70, which is the exhaust surface of the disc box 10, faces the ventilation path 30 a from the platter 70. An airflow resistance plate 80 is provided as a resistor for adjusting the airflow, with a distance of 10 mm. By passing the air flow resistance plate 80, the flow rate of air passing through the platter 70 can be suppressed and controlled.
[0024]
As shown in FIGS. 1 and 3, in the present embodiment, each air flow resistance plate 80 corresponding to the platter 70 having the polygonal ventilation window 75 has a region corresponding to the polygon. A plurality of vent holes 80a having an outer diameter of about 4.5 mm are formed unevenly. A unit in which the non-uniformly formed vent holes 80a are substantially associated with each magnetic disk device 20 and each drive power source 60 is defined as a vent area 80b. The flow resistance indicating the difficulty of air flow in the air flow resistance plate 80 can be adjusted by the area of the ventilation region 80b. That is, when the area of the ventilation window 75 of the platter 70 is 100%, the area of the ventilation region 80b corresponding to this is adjusted, for example, between approximately 10% and 90%.
[0025]
  The two airflow resistance plates 80 in the same unit 30 are the same. The first unit 31 has an air flow resistance plate 80.ButIn addition, the flow of air on the exhaust surface of the disk box 10 is not suppressed at all. As shown in FIG. 3, the air flow resistance plate 80 corresponding to the second unit 32 corresponds to the second resistance plate 82, and the air flow resistance plate 80 corresponding to the third unit 33 corresponds to the third resistance plate 83 and the fourth unit 34. When the air flow resistance plate 80 to be used is the fourth resistance plate 84, the area of the ventilation region 80b is reduced from the second resistance plate 82 to the fourth resistance plate 84. The configuration of the second resistor plate 82 to the fourth resistor plate 84 is conceptually shown in FIG. The airflow resistance plates 85 in FIGS. 4A, 4B, and 4C correspond to the fourth resistance plate 84, the third resistance plate 83, and the second resistance plate 82, respectively. Each airflow resistance plate 85 is provided with uniform vent holes 85a in six rectangular areas. The area of the rectangular area of each airflow resistance plate 85 is shown in FIGS. It becomes smaller toward (A). It may be considered that the second resistance plate 82 to the fourth resistance plate 84 correspond to this.
[0026]
Further, each of the second resistance plate 82 to the fourth resistance plate 84 has a ventilation region 80b corresponding to each of the magnetic disk device 20 having two upper and lower stages. In FIG. 3, the area of the lower ventilation region 821 b of the second resistance plate 82 is the largest, the upper ventilation region 822 b of the second resistance plate 82, the lower ventilation region 831 b of the third resistance plate 83, and the third resistance plate 83. The area decreases in the order of the upper ventilation region 832b, the lower ventilation region 841b of the fourth resistance plate 84, and the upper ventilation region 842b of the fourth resistance plate 84 in this order.
[0027]
As shown in FIG. 3, in the ventilation regions 822b, 832b, and 842b, there is a portion in which the ventilation holes 80a are not evenly formed in the horizontal direction, but the temperature uniformity of the magnetic disk device 20 described later is uniform. This will not be harmed.
[0028]
As shown in FIG. 1 and FIG. 2, a fan having an electric fan 90 as an exhaust fan on the upper part of the fourth unit 34 located at the uppermost stage so as to bridge the upper surfaces of the two disk boxes 10. Four assemblies 100 are provided in close contact with each other. Since one fan assembly 100 has two electric fans 90, the disk array apparatus 1 in the present embodiment is provided with a total of eight electric fans 90. The intake surface of the electric fan 90 faces the ventilation path 30a, and the exhaust surface faces the ceiling surface 50c of the housing 50 having air permeability.
[0029]
As described above, the air passages in the disk array apparatus 1 having the entire surface suction / central duct top surface discharge structure in which the fan assembly 100 is concentrated on the upper side are as follows. That is, the louver (not shown) on the left and right doors (not shown) of the casing 50, the filter (not shown), the front surface of the magnetic disk device 20 as the intake surface, the front surface of the drive power supply 60, the front surface of the controller 65, and the front frame of the disk box 10. The clearance, the side surfaces of the magnetic disk device 20 and the driving power supply 60, the ventilation window 75 of the platter 70, the ventilation region 80b of the airflow resistance plate 80, the ventilation path 30a, the fan assembly 100, and the ceiling surface (not shown).
[0030]
<<< Operation of cooling structure >>>
The air flow in the housing 50 of the present embodiment is schematically shown by arrows in FIG. When electric power is supplied and the electric fan 90 of the fan assembly 100 rotates, the air flow in the housing 50 is formed as follows. The air passes through the louver (not shown) and the filter (not shown) of the doors (not shown) on the left and right sides of the housing 50 and passes through the front of the disk box 10 to cool the inside. After the cooled air passes through the platter 70, its flow rate is suppressed by the air flow resistance plate 80, and the air from the individual disk boxes 10 is concentrated in the ventilation path 30a, and the electric fan 90 and the ceiling of the fan assembly 100 are collected. It passes through the surface 50 c and is discharged out of the housing 50.
[0031]
When the area of the ventilation window 75 of the platter 70 is 100%, if the area of the ventilation region 80b corresponding to this is adjusted to a value of 100% or less, the air flow resistance plate 80 is provided in the disk box 10. As a result, the pipe resistance against air sucked into each disk box 10 and exhausted from a ceiling surface (not shown) can be set to a value that is one or more times greater than when the airflow resistance plate 80 is not provided. Therefore, the flow rate of air for each upper and lower stage of each unit 30 can be changed by appropriately setting the pipe resistance of the air passing therethrough for each upper and lower stage of each unit 30.
[0032]
The effect of the airflow resistance plate 80 in the present embodiment on the air flow will be described. FIG. 5 shows a histogram of the air flow rate in the upper and lower stages of each of the first unit 31 to the fourth unit 34 when the airflow resistance plate 80 is provided as the present embodiment and when it is not, and the disk The value of the average air flow required to cool the magnetic disk device 20 in the array device 1 is shown. In the present embodiment in which the air flow resistance plate 80 is provided, the air flow rate in the upper and lower stages of each of the first unit 31 to the fourth unit 34 is approximately uniform, which is the magnetic disk device 20 in the disk array device 1. The value of the average flow rate of air necessary for cooling is satisfied. On the other hand, when the airflow resistance plate 80 is not provided, the flow rate decreases sharply from the upper stage of the fourth unit 34 to the lower stage of the first unit 31.
[0033]
In the present embodiment, as this area decreases from the lower ventilation region 821b of the second resistance plate 82 to the upper ventilation region 842b of the fourth resistance plate 84, the flow resistance at the respective exhaust surfaces becomes smaller. Since the line resistance in the overall flow of air increases, and thus the trend of the hatched histogram in FIG. 5 is corrected, the lower surface of the first unit 31 to the upper surface of the fourth unit 34 on the exhaust surface. Air flow is uniform. As a specific and extreme example, the airflow resistance plate 80 is not provided for the first unit 31 having the highest pressure loss of the exhaust pressure of air and the largest pipe resistance against air among the four units 30. On the other hand, a fourth resistance plate 84 having the smallest area of the upper ventilation region 842b is provided on the upper stage of the fourth unit 34 having the lowest pressure loss of the exhaust pressure of air and the smallest pipe resistance against air.
[0034]
The uniformity of the air flow rate in each unit 30 will be described in more detail with reference to FIG. The flow rate resistance plate 80 is provided from the lower stage of the second unit 32 to the upper stage of the fourth unit 34, and the flow resistance of the second unit 32 is increased by gradually increasing the flow resistance. The flow rate of the upper and lower stages of the third unit 33 increases, the flow rate of the upper and lower stages of the third unit 33 decreases, and the flow rate of the upper and lower stages of the fourth unit 34 is increased on the third unit 33 by the air flow resistance plate 80. Decreasing at a higher rate than the rate of decrease in the lower flow rate. Therefore, the flow rates of the four units 30 including the upper and lower stages are approximately uniform.
[0035]
From the above, it is possible to eliminate uneven cooling of the lower stage of the first unit 31 to the upper stage of the fourth unit 34. Accordingly, the temperature around the magnetic disk device 20 is approximately the same regardless of which disk box 10 the magnetic disk device 20 is plugged into.
[0036]
Further, according to the exhaust method of the present embodiment, the method disclosed in Japanese Patent Laid-Open No. 5-99465, in which an exhaust fan is provided on the back of each disk box, is not adopted. In comparison, the air exhausted from the left and right disk boxes 10 at the center of the ventilation path 30a is prevented from colliding strongly, the air mixing in the ventilation path 30a is less mixed, and the pressure loss of the exhaust pressure in the disk box 10 is also small. Further, according to the exhaust method of the present embodiment, the method of providing an exhaust fan on the upper surface of each disk box disclosed in Japanese Patent Application Laid-Open No. 2001-307474 is not adopted, so that the disk box 10 is cooled. The air once used is not used again for cooling the other disk boxes 10, and the cooling efficiency in each disk box 10 is high.
[0037]
Furthermore, in the present embodiment, there is no special structure such as a partition plate in the ventilation path 30a, and the fan assembly 100 is only on the ceiling surface (not shown) of the casing 50. is there. Therefore, compared to the devices disclosed in JP-A-5-99465 and JP-A-2001-307474, each disk box has an exhaust fan, and the ventilation path has a partition plate. It is possible to realize a disk array device that enables lower cost, lower noise, and lower power consumption.
[0038]
=== Second Embodiment ===
The airflow resistance plate 80 described in the first embodiment is disposed at a distance of about 10 mm on the air passage 30a side of the platter 70 of each disk box 10, but in the second embodiment, The air flow resistance plate is disposed inside the disk box 10 of the platter 70. In this case, since there is no airflow resistance plate in the ventilation path 30a, there is an effect that the width of the ventilation path 30a is not reduced.
[0039]
The airflow resistance plate 85 in the second embodiment brings about the effect of realizing the air flow uniformity shown in FIG. 5 of the first embodiment in the same manner. It becomes possible to eliminate the uneven cooling of the upper stage of the unit 34, and the temperature around the magnetic disk device 20 becomes approximately the same no matter which disk box 10 is plugged in the magnetic disk device 20.
[0040]
=== Other Embodiments ===
The electronic device cooling structure and the like according to the present invention have been described based on some embodiments. However, the above-described embodiments of the present invention are for facilitating the understanding of the present invention. The invention is not limited. The present invention can be changed and improved without departing from the gist thereof, and the present invention includes the equivalents thereof.
[0041]
In the above embodiment, the ventilation holes 80a forming the ventilation region 80b are plural, have an outer diameter of about 4.5 mm, and are perforated unevenly. However, the present invention is not limited to this. Instead, for example, if the total area is smaller than the area corresponding to the ventilation window 75 of the platter 70 on the airflow resistance plate 80, one or a plurality of irregular holes may be used. May be perforated uniformly in a region corresponding to the ventilation window 75. However, it is easier to control the total area of the ventilation region 80b and to control the flow rate of the air passing through the ventilation region 80b when the ventilation region 80b is formed by a large number of ventilation holes 80a having a fixed shape. It is.
[0042]
In the above embodiment, the first unit 31 is not provided with the airflow resistance plate 80. However, the present invention is not limited to this. For example, the first unit 31 includes the airflow resistance plate 80. The air flow rate at the lower exhaust surface of the first unit 31 to the upper exhaust surface of the fourth unit 34 satisfies the value of the average air flow rate required to cool the magnetic disk device 20 in the disk array device 1. It only has to be. However, if the first unit 31 does not have the air flow resistance plate 80, the above-described average flow rate can be satisfied without applying an unnecessary load to the electric fan 90.
[0043]
In the above embodiment, the airflow resistance plate 80 is provided for each disk box 10, but is not limited to this. For example, the second unit 32 to the fourth unit 34 include three stages. Further, it may be divided into six stages from the lower stage of the second unit 32 to the upper stage of the fourth unit 34, and an air flow resistance plate may be provided at each stage. Further, the area of the ventilation region 80b may be continuously changed from the second unit 32 to the fourth unit 34 without distinction of the units 30.
[0044]
In the above-described embodiment, the resistor for adjusting the air flow is the air flow resistor plate 80. However, the resistor is not limited to this and may be a sheet-like resistor.
[0045]
According to such a cooling structure for an electronic device, it is possible to make the temperature of the electronic device approximately uniform without depending on the position where the electronic device is housed in the housing.
[0046]
【The invention's effect】
An electronic device cooling structure that is small in size, low in cost, low in noise, and low in power consumption can be realized.
[Brief description of the drawings]
FIG. 1 is a perspective view of a disk array device.
FIG. 2 is a schematic diagram showing a side cross section of a disk array device.
FIG. 3 is a view showing the front of the air flow resistance plate.
FIG. 4 is a conceptual diagram showing the front of the air flow resistance plate.
FIG. 5 is a diagram showing a histogram of the air flow rate in the lower stage of the first unit to the upper stage of the fourth unit.
[Explanation of symbols]
1 Disk array device
10 Disc box
20 Magnetic disk unit
30 units
30a Ventilation route
31 1st unit
32 Second unit
33 3rd unit
34 4th unit
50 cases
50c ceiling surface
70 platters
75 Ventilation window
80, 85 Airflow resistance plate
80a, 85a Vent
80b, 821b, 822b, 831b, 832b, 841b, 842b Ventilation area
82 2nd resistance plate
83 3rd resistance plate
84 4th resistance plate
90 Electric fan

Claims (4)

A plurality of boxes containing electronic equipment and having an intake surface and an exhaust surface provided to face the intake surface;
A housing that accommodates the boxes in a plurality of rows so that the exhaust surfaces of the boxes belonging to one row face the exhaust surfaces of the boxes belonging to the other row with a gap;
An exhaust fan that is provided on the upper end side of the gap and discharges air flowing into the gap from the exhaust surface to the outside of the housing;
An air flow resistance plate having a vent hole provided on the exhaust surface and configured to reduce a ventilation region of air flowing into the gap from the exhaust surface as the exhaust surface is located closer to the exhaust fan;
A cooling structure for an electronic device, comprising: The electronic device cooling structure according to claim 1,
The airflow resistance plate is provided for each exhaust surface of each box,
The air flow resistance plate provided closer to the exhaust fan has a smaller total area of the vent hole.
Electronic device cooling structure characterized by The electronic device cooling structure according to claim 2,
Do not provide the airflow resistance plate on the exhaust surface that is farthest from the exhaust fan.
Electronic device cooling structure characterized by A plurality of boxes containing a magnetic disk device and having an air intake surface and a platter having a ventilation window provided to face the air intake surface;
A housing that accommodates the boxes in a state of being vertically stacked in a plurality of rows so that the platters of the boxes belonging to one row are opposed to the platters of the boxes belonging to the other row with a gap; ,
An exhaust fan that is provided on the upper end side of the gap and discharges air flowing into the gap from the platter to the outside of the housing;
An air flow resistance plate having a vent hole provided on the exhaust surface and configured to reduce a ventilation region of air flowing into the gap from the exhaust surface as the exhaust surface is located closer to the exhaust fan;
A cooling structure for an electronic device, comprising:

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