JP4055856B2 - Manufacturing method of large pellicle membrane - Google Patents
Manufacturing method of large pellicle membrane Download PDFInfo
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- JP4055856B2 JP4055856B2 JP2003278263A JP2003278263A JP4055856B2 JP 4055856 B2 JP4055856 B2 JP 4055856B2 JP 2003278263 A JP2003278263 A JP 2003278263A JP 2003278263 A JP2003278263 A JP 2003278263A JP 4055856 B2 JP4055856 B2 JP 4055856B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000012528 membrane Substances 0.000 title description 6
- 239000000758 substrate Substances 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 11
- 239000010408 film Substances 0.000 description 114
- 230000015572 biosynthetic process Effects 0.000 description 34
- 238000000034 method Methods 0.000 description 19
- 239000000428 dust Substances 0.000 description 10
- 239000010409 thin film Substances 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000000020 Nitrocellulose Substances 0.000 description 4
- 229920001220 nitrocellulos Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229920005601 base polymer Polymers 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- BOFLDKIFLIFLJA-UHFFFAOYSA-N 2-methylbut-1-en-3-yne Chemical group CC(=C)C#C BOFLDKIFLIFLJA-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
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- Preparing Plates And Mask In Photomechanical Process (AREA)
Description
本発明は、ＬＳＩ、超ＬＳＩ等の半導体素子または液晶ディスプレイ（ＬＣＤ）表示用デバイスの製造において使用される一括露光機用のフォトマスクの防塵保護膜として使用されるペリクル膜を成膜するための、大型ペリクル用成膜基板の製造方法に関するものである。 The present invention is for forming a pellicle film used as a dust-proof protective film for a photomask for a batch exposure machine used in the manufacture of semiconductor elements such as LSI and VLSI or liquid crystal display (LCD) display devices. relates to a method for manufacturing a large-sized pellicle formed Makumoto plate.
半導体や液晶ディスプレイの製造時において、レチクルやフォトマスク（以下、マスクという）上に形成されるＩＣのパターンをウェハー上に焼き付ける露光工程がある。露光工程では、微細パターンが描かれたマスクへ露光光を照射し、この露光光をレンズによりウェハー上に結像させて焼き付けを行っている。 When manufacturing a semiconductor or a liquid crystal display, there is an exposure process in which an IC pattern formed on a reticle or photomask (hereinafter referred to as a mask) is printed on a wafer. In the exposure process, exposure light is irradiated to a mask on which a fine pattern is drawn, and the exposure light is imaged on a wafer by a lens to perform printing.
ここで、マスク上に塵が付着すると、塵に当たった露光光がウェハー上で結像してしまい、パターン欠陥の原因となる。このため、露光工程においては、塵がマスクに付くことや塵に当たった露光光がウェハー上で結像することを防止する保護膜として、露光光を透過する材質から構成されるペリクル膜をマスク上に載置する。 Here, when dust adheres to the mask, the exposure light that hits the dust forms an image on the wafer, causing a pattern defect. For this reason, in the exposure process, a pellicle film made of a material that transmits the exposure light is used as a protective film to prevent dust from attaching to the mask and exposure light hitting the dust from forming an image on the wafer. Place on top.
従来の、ペリクル膜及びペリクル膜の製造方法として、例えば特許文献１、特許文献２、特許文献３、特許文献４、特許文献５、特許文献６、特許文献７等が知られている。 Conventional, as a manufacturing method of a pellicle film and the pellicle film, for example, Patent Document 1, Patent Document 2, Patent Document 3, Patent Document 4, Patent Document 5, Patent Document 6, it has been known such as Patent Document 7.
後述の特許文献１には、少なくとも１箇所の切断部と、この切断部に配置されたフィルターとを有する構成とすることで、フィルターがペリクル貼付用冶具等に接触することによるフィルターの損傷・摩耗等が生じることがなく、これによる異物が発生しないペリクル及びこのようなペリクルの製造方法が詳細に記載されている。 Patent Document 1 to be described later has at least one cut portion and a filter disposed in the cut portion, so that the filter is damaged or worn by contact with the pellicle sticking jig or the like. A pellicle that does not cause the occurrence of foreign matter and a method for manufacturing such a pellicle is described in detail.
後述の特許文献２には、上下面の平坦度、平行度の高いペリクルを得るための製造方法が詳細に記載されている。 Patent Document 2 to be described later describes in detail a manufacturing method for obtaining a pellicle having high flatness and parallelism on the upper and lower surfaces.
後述の特許文献３には、回転塗布方法を用いて表面が平滑なガラス、プラスチック等の基材上に水溶性のゾル−ゲル変換が可能な材料をゾル状態で塗布しゲル化させてなる分離膜上に、さらに回転塗布方法を用いてフォトマスク用保護膜材料を所望の膜厚となるように塗布した後、該分離膜材料のゲル化温度以上の温水中に浸漬することにより該分離膜のゾル−ゲル変換を促し、最上部のフォトマスク用保護膜を温水中に浮上させ、次いで所望の形状及び厚みを有するフレームにより該フォトマスク用保護膜を温水中からすくい上げ、加熱、乾燥することにより良好な被膜を形成することを特徴とする高精度パターン板用保護膜の製造方法が詳細に記載されている。 In Patent Document 3 to be described later, separation is carried out by applying a water-soluble sol-gel conversion material in a sol state to a gel such as glass or plastic having a smooth surface using a spin coating method. The separation membrane is further coated on the membrane using a spin coating method so that the protective film material for the photomask has a desired thickness, and then immersed in warm water at a temperature equal to or higher than the gelation temperature of the separation membrane material. Sol-gel conversion is promoted, the uppermost photomask protective film is floated in warm water, and then the photomask protective film is scooped up from the warm water by a frame having a desired shape and thickness, and heated and dried. Describes a method for producing a protective film for a high-precision pattern board, which is characterized by forming a better film.
後述の特許文献４には、溶液キャスト法によりニトロセルロース薄膜を平滑板状に形成せしめ、該薄膜にフレームを接着せしめた後、水中に浸して薄膜を剥離し、次いで乾燥することを特徴とするフォトマスク用防塵カバーの製造方法が記載されている。 Patent Document 4 described later is characterized in that a nitrocellulose thin film is formed into a smooth plate by a solution casting method, a frame is adhered to the thin film, then immersed in water to peel the thin film, and then dried. A method for manufacturing a dust cover for a photomask is described.
後述の特許文献５には、ベースポリマー層に異種のポリマー薄膜を固着させ、該ポリマー薄膜に枠を接着した後、該薄膜を溶解せず、ベースポリマーを溶解する溶剤を用いて、ベースポリマー層を溶解、除去することを特徴とする枠に接着固定されたポリマー薄膜の製造方法が記載されている。 In Patent Document 5 to be described later, a different polymer thin film is fixed to a base polymer layer, a frame is adhered to the polymer thin film, and then the base polymer layer is dissolved using a solvent that dissolves the base polymer without dissolving the thin film. A method for producing a polymer thin film bonded and fixed to a frame is described, which is characterized by dissolving and removing the material.
後述の特許文献６には、ペリクル膜を製造するに当たっては、ペリクル膜の成膜する基板の表面成膜面にクロム又はクロム合金をコーティングすることによって、基板の表面に極めて平滑な面を形成し、その平滑面に成膜したペリクルの薄膜を抵抗を少なくスムーズに剥離することができるようにし、ペリクル膜に延び、シワ、傷、破れ等が発生することを防止するようにした技術が記載されている。 In Patent Document 6 described later, in manufacturing a pellicle film, a very smooth surface is formed on the surface of the substrate by coating the surface film-forming surface of the substrate on which the pellicle film is formed with chromium or a chromium alloy. Describes a technology that enables the thin film of the pellicle formed on the smooth surface to be peeled off smoothly with less resistance, and prevents the wrinkle, scratches, tears, etc. from occurring on the pellicle film. ing.
後述の特許文献７には、特にペリクル膜の成膜用基板に、シリコン又はＳｉＣ−Ｓｉを使用し、体積抵抗率が１０５Ω・ｃｍ以上のような体積抵抗率の高いペリクル膜を成膜する際に用いる成膜用基板を、体積抵抗率が１０３Ω・ｃｍ以下のものとし、これによって基板上に成膜された膜を剥離する際に基板と膜との間で発生する静電気を低く抑えることができ、膜が基板に引きつけられる力を弱くし、したがって膜を剥離するときの膜のシワ、破れが発生することを防止するようにした技術である。 In Patent Document 7 described later, a pellicle film having a high volume resistivity such as a volume resistivity of 10 5 Ω · cm or more is formed using silicon or SiC-Si on the substrate for forming a pellicle film. The substrate for film formation used in the process is one having a volume resistivity of 10 3 Ω · cm or less, and static electricity generated between the substrate and the film when the film formed on the substrate is peeled off. This is a technique that can be kept low and weakens the force with which the film is attracted to the substrate, and therefore prevents the film from being wrinkled or broken when the film is peeled off.
しかしながら、前述の特許文献１乃至特許文献７等の技術によって使用されるペリクル膜の成膜基板は、一般的にペリクル膜の面積が１，０００ｃｍ２以下のペリクル膜を製造することを目的としている。このため、そのペリクル膜の成膜基板は、短辺側の最大幅が１ｍ以下の寸法を有する小型のものでよい。しかし、液晶モニター、液晶ＴＶなどに使用されている液晶ディスプレイは大型化の傾向にあるため、これに伴ってペリクル膜も大型化が望まれている。 However, the substrate for forming a pellicle film used by the techniques of Patent Document 1 to Patent Document 7 described above is generally intended to produce a pellicle film having a pellicle film area of 1,000 cm 2 or less. . Therefore, the substrate for forming the pellicle film may be a small substrate having a maximum width of 1 m or less on the short side. However, liquid crystal displays used in liquid crystal monitors, liquid crystal TVs and the like tend to be large, and accordingly, the pellicle film is also required to be large.
ペリクル膜を成膜基板から剥離するためには、図５（ｂ）に示すように、成膜基板51上に形成されたペリクル膜に対し、仮枠53といわれるペリクル膜の剥離用冶具を粘着剤54にて粘着固定した後、仮枠53を上方（矢印方向）に移動させてペリクル膜52を剥離する。 In order to peel the pellicle film from the film formation substrate, as shown in FIG. 5B, a pellicle film peeling tool called a temporary frame 53 is adhered to the pellicle film formed on the film formation substrate 51. After being adhesively fixed with the agent 54, the temporary frame 53 is moved upward (in the direction of the arrow) to peel off the pellicle film 52.
ここで、１，０００ｃｍ２以上の大型のペリクル膜を製造すると、図５（ａ）に示すように短辺側の最大幅が１ｍ以上と大きくなるため、作業員Ａが成膜基板51からペリクル膜52を剥離する際に両手を広げた格好になり、成膜基板51と作業員Ａとの距離Ｄ１が極めて小さくなる。 Here, when a large pellicle film of 1,000 cm 2 or more is manufactured, the maximum width on the short side becomes as large as 1 m or more as shown in FIG. When peeling the film 52, both hands are spread out, and the distance D1 between the film formation substrate 51 and the worker A becomes extremely small.
作業員Ａは両手を広げた状態で剥離作業をしなければならないため、剥離作業時の操作性が悪くなり、作業員Ａの剥離作業中にペリクル膜52が破損したり、しわの発生が起こったりするおそれがあった。また、作業員Ａが成膜基板51に接近することで、作業員Ａからの発塵がペリクル膜52に付着して、ペリクル膜52の品質を低下させるおそれがあった。 Since the worker A must perform the peeling work with both hands open, the operability during the peeling work is deteriorated, and the pellicle film 52 is damaged or wrinkles occur during the peeling work of the worker A. There was a risk of it. Further, when the worker A approaches the film formation substrate 51, dust generated from the worker A may adhere to the pellicle film 52, and the quality of the pellicle film 52 may be deteriorated.
本発明の目的は、ペリクル膜の成膜基板からの剥離作業を容易にすると共に、ペリクル膜に発塵が付着して品質を低下させることを防止することである。 An object of the present invention is to facilitate the peeling operation of the pellicle film from the film formation substrate and to prevent the dust from adhering to the pellicle film and degrading the quality.
前記目的を達成するための本発明の大型ペリクル膜の製造方法は、少なくとも一つの隅にペリクル膜の剥離を開始するための、幅が２０ｃｍ以上１００ｃｍ以下のコーナーカットを有する、短辺側の最大幅が１２０ｃｍ以上の大型ペリクル用成膜基板の表面に、ペリクル膜成形材料を塗布してペリクル膜を成形した後、該大型ペリクル用成膜基板と同じ外形の仮枠を前記ペリクル膜上に粘着固定し、更に該仮枠をコーナーカットのある部分から剥離して、ペリクル膜を製造することを特徴とする。 Method for producing large pellicle film of the present invention for achieving the above object, having at least one corner to start peeling the pellicle film of the following corner cutting width is 20cm or more 100 cm, shorter side uppermost After forming a pellicle film by applying a pellicle film molding material on the surface of a large pellicle film formation substrate of 120 cm or more, a temporary frame having the same outer shape as the large pellicle film formation substrate is adhered onto the pellicle film fixed, and further separating the tentative frame from one portion of a corner cut, characterized in that to produce a pellicle film.
本発明によれば、作業員が両手を大きく広げることなく剥離作業を行うことができる。これにより、仮枠と共にペリクル膜を剥離する際の操作性が向上すると共に、大型ペリクル膜への粉塵の付着による品質の低下を防止することができる。 According to the present invention, an operator can perform a peeling operation without greatly spreading both hands. As a result, the operability when peeling the pellicle film together with the temporary frame can be improved, and quality deterioration due to the adhesion of dust to the large pellicle film can be prevented.
図を用いて本発明の大型ペリクル膜の製造方法について説明する。図１は本発明の実施例１の大型ペリクル用成膜基板の平面図であり、図２は本発明の実施例２及び実施例３に係る大型ペリクル用成膜基板の説明図であり、図３は本発明の大型ペリクル用成膜基板の表面に大型ペリクル膜を成膜する状態を示す説明図であり、図４は本発明の大型ペリクル膜を剥離する工程の説明図である。 A method for manufacturing a large-scale pellicle film of the present invention will be described with reference to FIG. FIG. 1 is a plan view of a large-sized pellicle film-forming substrate of Example 1 of the present invention, and FIG. 2 is an explanatory view of a large-sized pellicle film-forming substrate according to Examples 2 and 3 of the present invention. 3 is an explanatory view showing a state in which a large pellicle film is formed on the surface of a film forming substrate for a large pellicle of the present invention, and FIG. 4 is an explanatory view of a process of peeling the large pellicle film of the present invention.
（大型ペリクル用成膜基板の構成）
本発明の大型ペリクル用成膜基板は、全て面積が１，０００ｃｍ２以上であり、この上に同面積の大型ペリクル膜を生成することができる。また、各成膜基板の短辺側の幅Ｗ１は、１２０ｃｍ以上に形成されている。これに伴い剥離を行うための仮枠の長さも１２０ｃｍ以上で構成されるため、仮枠の両端を持って剥離作業を行うとペリクル膜の破損等の問題が生ずるおそれがある。以下、実施例１乃至３の特徴を説明する。
(Configuration of deposition substrate for large pellicles)
The large pellicle deposition substrates of the present invention all have an area of 1,000 cm 2 or more, and a large pellicle film having the same area can be formed thereon. The width W1 on the short side of each film formation substrate is 120 cm or more. Along with this, the length of the temporary frame for performing the peeling is also configured to be 120 cm or more. Therefore, if the peeling operation is performed with both ends of the temporary frame, problems such as damage to the pellicle film may occur. Hereinafter, features of the first to third embodiments will be described.
図１に本発明の実施例１の大型ペリクル用成膜基板（以下、単に成膜基板という）１を示す。基板材料としては、ガラス基板等を使用することができる。 FIG. 1 shows a film forming substrate (hereinafter simply referred to as a film forming substrate) 1 for a large pellicle according to Example 1 of the present invention. As the substrate material, a glass substrate or the like can be used.
図１において、成膜基板１の左下隅にはコーナーカットＣが施されている。尚、ここでコーナーカットＣの幅Ｗ２は、剥離作業がしやすいように、２０ｃｍ以上１００ｃｍ以下が好ましい。２０ｃｍ未満になると、作業員が両手で仮枠を成膜基板から剥離する際に仮枠を持ちにくくなるため好ましくなく、１００ｃｍより大きくなると、作業員が仮枠を成膜基板から剥離する際に両手を広げてペリクル膜に近接するため好ましくないからである。 In FIG. 1, a corner cut C is applied to the lower left corner of the film formation substrate 1. Here, the width W2 of the corner cut C is preferably 20 cm or more and 100 cm or less so that the peeling work can be easily performed. When it is less than 20 cm, it is not preferable because it is difficult for an operator to hold the temporary frame with both hands when peeling the temporary frame from the film formation substrate. This is because both hands are spread out and close to the pellicle film.
図２（ａ）に本発明の実施例２の成膜基板２を示す。前述した実施例においては、成膜基板１の１箇所の隅にコーナーカットＣを施したが、成膜基板の２箇所の隅にコーナーカットＣを施した成膜基板２とすることも可能である。 FIG. 2A shows a film formation substrate 2 of Example 2 of the present invention. In the above-described embodiment, the corner cut C is made at one corner of the film formation substrate 1, but the film formation substrate 2 having the corner cut C at two corners of the film formation substrate can be used. is there.
図２（ｂ）に本発明の実施例３の成膜基板３を示す。本実施例のように、成膜基板の４隅にコーナーカットＣを施した成膜基板３とすることも可能である。 FIG. 2B shows a film formation substrate 3 of Example 3 of the present invention. As in this embodiment, it is possible to form the film formation substrate 3 in which the corner cuts C are provided at the four corners of the film formation substrate.
（大型ペリクル膜の製造方法）
前述した実施例１乃至３の成膜基板により、ペリクル膜を製造する方法について説明する。ここでは実施例１の成膜基板１を例示して説明する。
(Manufacturing method of large pellicle film)
A method of manufacturing a pellicle film using the film formation substrates of Examples 1 to 3 will be described. Here, the film formation substrate 1 of Example 1 will be described as an example.
まず、成膜基板１上に大型ペリクル膜４を形成する。大型ペリクル膜４を形成する際には、図３（ａ）に示すような成膜基板１の表面に対して、ニトロセルロース等の膜成形材料を塗布する。すると、図３（ｂ）及び（ｃ）に示すように、成膜基板１上に大型ペリクル膜４が形成される。尚、ニトロセルロース以外の膜成形材料として、その他にポリビニルプロビオナール、ポリビニルブチラール、酢酸セルロース、ポリエチレンテレフタレート、ポリプロピレン、バリレン、ポリメチルメタクリレート、セルロースエステル、フッ素系ポリマー等を、それぞれ使用することができる。 First, the large pellicle film 4 is formed on the film formation substrate 1. When the large pellicle film 4 is formed, a film molding material such as nitrocellulose is applied to the surface of the film formation substrate 1 as shown in FIG. Then, as shown in FIGS. 3B and 3C, the large pellicle film 4 is formed on the film formation substrate 1. In addition, as a film forming material other than nitrocellulose, polyvinyl propional, polyvinyl butyral, cellulose acetate, polyethylene terephthalate, polypropylene, valylene, polymethyl methacrylate, cellulose ester, fluorine-based polymer, and the like can be used.
成膜基板１上に大型ペリクル膜４を形成する方法としては、スピンコート法が好ましい。スピンコート法は、成膜基板１の表面にニトロセルロース等の膜成形材料を溶液吐出ノズルより滴下すると共に、成膜基板１をスピンコータ等を用いて回転軸を中心に回転させながら、成膜基板１の表面に大型ペリクル膜４を成膜する方法である。 As a method of forming the large pellicle film 4 on the film formation substrate 1, a spin coating method is preferable. In the spin coating method, a film forming material such as nitrocellulose is dropped from the solution discharge nozzle onto the surface of the film forming substrate 1 and the film forming substrate 1 is rotated around a rotation axis by using a spin coater or the like. 1 is a method of forming a large pellicle film 4 on the surface of 1.
このように大型ペリクル膜４を成膜する場合、成膜基板１は重心を軸として高速回転されるため、成膜基板１を回転させる際に重心が回転軸からずれていると、回転中にブレが生じることがあり、膜成形材料が均一に拡がらない。このため、成膜基板にコーナーカットＣを２箇所又は４箇所に設ける場合には、図２に示すように、対向する隅に設けることが好ましい。このように成膜基板の対向する隅にコーナーカットＣを設けることにより、成膜基板が点対称に構成されるため、重心の位置を把握しやすいという利点がある。 When the large pellicle film 4 is formed in this way, the film formation substrate 1 is rotated at high speed around the center of gravity. Therefore, if the center of gravity is shifted from the rotation axis when the film formation substrate 1 is rotated, Blur may occur, and the film forming material does not spread uniformly. For this reason, when the corner cut C is provided in two or four places on the film formation substrate, it is preferably provided in the opposite corner as shown in FIG. By providing the corner cuts C at the opposite corners of the film formation substrate in this way, the film formation substrate is configured to be point-symmetric, and thus there is an advantage that it is easy to grasp the position of the center of gravity.
次に、成膜基板１上から、形成された大型ペリクル膜４を剥離する。大型ペリクル膜４を剥離する際には、前作業として、図４（ａ）に示すように、大型ペリクル膜４の上に成膜基板１と同形状の仮枠５を、粘着材６を介して粘着固定する。続いて、図４（ｂ）に示すように、作業員ＡはコーナーカットＣのある部分から剥離作業を開始する。剥離作業は、作業員Ａの手前側から仮枠５を徐々に上昇させることにより行い、この結果、大型ペリクル膜４を成膜基板１から剥離させることができる。 Next, the formed large pellicle film 4 is peeled off from the film formation substrate 1. When the large pellicle film 4 is peeled off, as a pre-operation, a temporary frame 5 having the same shape as the film formation substrate 1 is placed on the large pellicle film 4 with an adhesive 6 as shown in FIG. To fix. Subsequently, as shown in FIG. 4B, the worker A starts the peeling operation from a portion where the corner cut C is present. The peeling operation is performed by gradually raising the temporary frame 5 from the front side of the worker A. As a result, the large pellicle film 4 can be peeled from the film formation substrate 1.
ここで前述のように、コーナーカットの幅Ｗ２は２０ｃｍ以上１００ｃｍ以下に構成されている。このため、作業員ＡがコーナーカットＣの両端部を保持する場合でも、両手を大きく広げることなく剥離作業をすることができる。 Here, as described above, the width W2 of the corner cut is 20 cm or more and 100 cm or less. For this reason, even when the worker A holds both ends of the corner cut C, the peeling operation can be performed without greatly spreading both hands.
このように構成すると、作業員Ａが仮枠５をハンドリングした時に均一に力を入れることができるため、スムーズに剥離作業を行うことができる。この結果、剥離作業中に大型ペリクル膜４が破損したり、しわの発生が起こったりすることを防止することができる。 If comprised in this way, since the operator A can apply force uniformly, when handling the temporary frame 5, a peeling operation | work can be performed smoothly. As a result, it is possible to prevent the large pellicle film 4 from being damaged or wrinkling from occurring during the peeling operation.
また、作業員Ａと成膜基板１との距離Ｄ２を大きくとることができ、作業員Ａからの発塵が大型ペリクル膜４に付着しにくくなるため、塵埃の付着による大型ペリクル膜４の品質低下を防止することができる。 In addition, since the distance D2 between the worker A and the film formation substrate 1 can be increased and the dust generation from the worker A is difficult to adhere to the large pellicle film 4, the quality of the large pellicle film 4 due to the adhesion of dust is reduced. A decrease can be prevented.
本発明は、作業員がペリクル膜を剥離することを前提とした成膜基板に利用することができる。 The present invention can be used for a film formation substrate on the premise that an operator peels off the pellicle film.
Ａ …作業員、Ｃ …コーナーカット、Ｄ２ …距離、
Ｗ１ …短辺側の幅、Ｗ２ …コーナーカットの幅、
１ …成膜基板、２ …成膜基板、３ …成膜基板、４ …大型ペリクル膜、
５ …仮枠、６ …粘着材
A ... Worker, C ... Corner cut, D2 ... Distance,
W1 ... the width on the short side, W2 ... the width of the corner cut,
DESCRIPTION OF SYMBOLS 1 ... Film-forming substrate, 2 ... Film-forming substrate, 3 ... Film-forming substrate, 4 ... Large pellicle film,
5 ... Temporary frame, 6 ... Adhesive material
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