JP3991743B2 - Polishing pad, polishing apparatus, and semiconductor device manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polishing pad used for forming a flat surface in a semiconductor, a dielectric / metal composite, an integrated circuit, etc., a polishing apparatus provided with the polishing pad, and a semiconductor device manufacturing method using the polishing apparatus. It is about.
[0002]
[Prior art]
As the density of semiconductor devices increases, the importance of multilayer wiring and the accompanying interlayer insulation film formation, electrode formation of plugs, damascene, and the like is increasing. Along with this, the importance of the flattening process of these interlayer insulating films and electrode metal films has increased, and a polishing technique called CMP (Chemical Mechanical Polishing) has become widespread as an efficient technique for this flattening process. is doing. In this polishing apparatus using CMP technology, as introduced in Japanese Patent Laid-Open No. 9-7985, while polishing a substrate such as a wafer, the substrate is irradiated with laser light or visible light from the back side (the surface plate side) of the polishing pad. An apparatus that irradiates the surface to be polished and measures the polishing state is attracting attention as an important technique. As a polishing pad used in this polishing apparatus, JP-A-11-512977 discloses a pad useful for polishing an integrated circuit mounted wafer, and at least a part of the pad has an essential ability to absorb and transport slurry particles. It is made of a hard uniform resin sheet, and this resin sheet has been introduced as a polishing pad through which light passes through a wavelength in the range of 190-3500 nanometers. This polishing pad has a polishing layer and a cushion layer laminated on the polishing layer via a double-sided adhesive tape or the like, and an opening is formed at a predetermined position of the polishing pad, and a transparent hard A window member made of a uniform resin is fitted. However, a polishing pad using such a transparent hard uniform resin as a window member has a problem that scratches are likely to occur on the substrate surface because the window member contacts the substrate surface, which is the surface to be polished.
[0003]
[Problems to be solved by the invention]
An object of the present invention is to provide a polishing pad used for forming a flat surface in glass, semiconductor, dielectric / metal composite, integrated circuit, etc., a polishing apparatus provided with the polishing pad, and a semiconductor using the polishing apparatus. An object of the present invention is to provide a polishing pad, a polishing apparatus, and a method for manufacturing a semiconductor device, which can reduce the scratch on the substrate surface and optically measure the polishing state during polishing.
[0004]
[Means for Solving the Problems]
As means for solving the problems, the present invention has the following configuration.
[0005]
(1) A polishing pad having a polishing layer and one or more light-transmitting window members for optically measuring a polishing state formed integrally with a part of the polishing layer, A polishing pad, wherein at least the outermost layer on the polishing surface side of the window member is composed of a transparent resin composition having a phase separation structure, and the transparent resin composition contains a transparent rubber-reinforced styrene resin .
[0009]
( 2 ) The polishing pad according to (1 ), wherein the transparent rubber-reinforced styrene-based resin contains a transparent acrylonitrile-styrene-butadiene copolymer.
[0010]
( 3 ) The polishing pad according to (1), wherein the transparent resin composition is melt-kneaded.
[0011]
( 4 ) The polishing pad according to any one of (1) to ( 3 ) and a measuring device that optically measures a polishing state, and the polishing is performed with a slurry interposed between the polishing pad and the substrate. Polishing the substrate by applying a load between the pad and the substrate and moving the substrate and the polishing pad relative to each other, and irradiating the substrate with light, optically changes the polishing state of the substrate. A polishing apparatus characterized in that the measurement is performed.
[0012]
( 5 ) A method for manufacturing a semiconductor device, comprising a process of polishing at least a surface using the polishing apparatus according to ( 4 ).
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the invention will be described.
[0014]
First, the polishing pad in the present invention indicates a structure having a polishing layer alone and an adhesive tape or a laminated structure comprising a polishing layer, a cushion layer and an adhesive tape. The polishing layer is not particularly limited as long as it is a layer having a polishing function by holding a slurry. For example, a hard foam structure having closed cells described in JP-A-8-500622 and WO00 / 12262 is used. Abrasive layer, a non-foamed structure abrasive layer provided with a fine slurry flow path on the surface described in JP-A-8-511210, a foamed structure abrasive layer having continuous pores obtained by impregnating a nonwoven fabric with polyurethane, etc. Can be mentioned. A polishing pad having one or more light-transmissive window members for optically measuring a polishing state formed integrally with a part of the polishing layer is as shown in FIGS. 1, 2, and 3. The polishing pad 4 has a polishing layer 2 and a light-transmissive window member 2 formed integrally with a part of the polishing layer. The translucent window member has a haze of 90% or less, preferably 70% or less, more preferably 50% or less with respect to the wavelength of light for measuring the substrate that is the surface to be polished. Haze value (%) = diffuse light transmittance / total light transmittance, and the smaller the haze value, the more easily light rays are transmitted, which is preferable because the amount of light applied to the substrate can be increased. Similarly, the transparent resin composition also has a haze value of 90% or less, preferably 70% or less, and more preferably 50% or less with respect to the wavelength of light for measuring the substrate that is the surface to be polished. Haze value (%) = diffuse light transmittance / total light transmittance, and the smaller the haze value, the more easily light rays are transmitted, which is preferable because the amount of light applied to the substrate can be increased. As a method of integrating the light transmissive window member with the polishing layer, the polishing layer is opened with a window having the same size as that of the light transmissive window member, and an adhesive tape is bonded to the bottom surface of the polishing layer. Cut the adhesive tape part slightly smaller than the window member, fit the window member into the abrasive layer window opening, and adhere to the shoulder part of the adhesive tape to integrate them, and as a means, the abrasive layer is almost the same as the window member After opening the window in size and pasting the cushion layer to the bottom of the polishing layer via adhesive tape, cut the adhesive tape / cushion layer part of the window opening slightly smaller than the window member to form the polishing layer window opening For example, the window member may be fitted and bonded to the shoulder portion of the adhesive tape / cushion layer to be integrated. As the cushion layer, a foamed structure sheet having continuous pores obtained by impregnating a nonwoven fabric with polyurethane, foamed rubber having closed cells, or non-foamed rubber can be used.
[0015]
The translucent window member of the present invention is composed of at least the outermost layer of a transparent resin composition having a phase separation structure. As the transparent resin composition having a phase separation structure, among the multi-component resin compositions obtained by blending two or more kinds of polymers or (co) polymers, different polymers form a multiphase. The transparent resin composition having a heterogeneous structure is preferably a transparent resin composition obtained by melt-kneading two or more kinds of polymers or (co) polymers. Among them, rubber may be used a transparent resin composition comprising, it is necessary from the point of scratches due to light-transmissive window member becomes possible inhibition.
[0016]
In the translucent window member in the present invention, a transparent resin composition in which a rubber and other transparent resin components are phase-separated to form a non-uniform structure is preferably used. Examples of the morphology include those having a sea-island structure in which rubber particles form a dispersed phase in a transparent resin matrix, and those having a lamellar structure in which transparent resin and rubber are separated into layers, among which a continuous phase is a transparent resin matrix. Thus, those having a sea-island structure in which the dispersed phase is rubber particles are preferable. Here, the rubber particles refer to polymers or (co) polymers whose main component is a rubbery polymer, and the shape of the particles is not particularly limited, but is preferably spherical or elliptical. Further, the rubber particle diameter is not particularly limited, but the rubber particles preferably have a number average particle diameter of 0.1 to 100 μm, more preferably 0.1 to 10 μm, and particularly preferably 0.2 to 5 μm. The number average particle diameter of the rubber particles is obtained by digital image analysis of an image observed with an optical microscope, a transmission electron microscope, a scanning electron microscope, a phase contrast microscope, or the like.
[0017]
The rubber used in the present invention preferably has a glass transition temperature of 0 ° C. or less. Specifically, butadiene rubber, styrene-butadiene copolymer, acrylonitrile-butadiene copolymer, and styrene-butadiene block copolymer are used. Polymers, diene rubbers such as butyl acrylate-butadiene copolymer, acrylic rubbers such as polybutyl acrylate, natural rubber, graft natural rubber, natural trans-polyisoprene, chloroprene rubber, polyisoprene rubber, ethylene-propylene Copolymer, ethylene-propylene-diene terpolymer, ethylene-acrylic copolymer, chlorosulfonated rubber, epichlorohydrin rubber, epichlorohydrin-ethylene oxide copolymer, polyether urethane rubber, polyester urethane rubber, nitrile rubber, The Rugomu, silicone rubber, and fluorine rubber. Of these, olefin rubbers such as diene rubbers such as butadiene rubber or butadiene copolymer, ethylene-propylene copolymers, and ethylene-propylene-diene terpolymers are preferred because of their excellent transparency.
[0018]
It is desirable that the rubber particles are uniformly dispersed in the transparent resin matrix that is a continuous phase. For this reason, the rubbery polymer contains a monomer constituting the transparent resin matrix, a polymer thereof, or a (co) weight containing the monomer. Those obtained by grafting the polymer, and other rubbery polymers such as epoxy group, isocyanate group, acid halide, carboxylic acid group, hydroxyl group-free, amide group, amino group, imino group, nitrile group, aldehyde group, hydroxyl group, It is preferably modified with a monomer having at least one functional group such as an ester group.
[0019]
In the transparent resin composition, a transparent resin component other than rubber is usually contained, and as such a material, either a thermoplastic transparent resin or a thermosetting transparent resin can be used. Among them, thermoplastic resins are preferred from the molding processability of the point of light-transmissive window member, and specific examples thereof include polystyrene resins.
[0020]
The transparent window member of the present invention preferably comprises a transparent resin composition having a heterogeneous structure in which rubber particles are dispersed in the above-described transparent resin matrix. The transparent resin composition is not particularly limited as long as it is a transparent resin composition having a heterogeneous structure. Preferred examples include rubber particles on a matrix of a transparent resin obtained by copolymerizing an unsaturated carboxylic acid alkyl ester with a styrene monomer. As a transparent resin composition having a dispersed phase, transparent high-impact polystyrene (HI-PS), a transparent resin composition containing acrylonitrile-butadiene-styrene copolymer (transparent ABS resin), acrylonitrile-acrylic rubber-styrene copolymer Transparent resin composition (transparent AAS resin), transparent resin composition (acrylic AES resin) containing acrylonitrile-ethylenepropylene rubber-styrene copolymer, transparent resin composition containing methyl methacrylate-butadiene-styrene copolymer ( Transparent MBS resin), acrylonitrile-chlorinated polyethylene-styrene Transparent resin composition comprising an emission copolymer transparent resin composition comprising a rubber-reinforced styrene resins such as (transparent ACS resin) and the like. Among these transparent resin composition, the transparent resin composition containing a particular copolymerizing an unsaturated carboxylic acid alkyl ester rubber-reinforced styrene resin, greatly suppressing the occurrence of scratches is excellent in transparency Therefore, it is used more suitably.
[0021]
(A) A transparent resin composition in which rubber particles are dispersed in a matrix of a transparent resin obtained by copolymerizing an unsaturated carboxylic acid alkyl ester with a styrene monomer, includes a styrene monomer and an unsaturated carboxylic acid alkyl ester system. A (co) polymer obtained from a monomer and a vinyl cyanide monomer and another vinyl monomer copolymerizable therewith has a structure in which a rubber polymer is grafted; Obtained from (co) polymer styrene monomer obtained from monomer, unsaturated carboxylic acid alkyl ester monomer, vinyl cyanide monomer and other vinyl monomers copolymerizable therewith The (co) polymer includes a non-grafted structure on a rubbery polymer. Specifically, in the presence of 10 to 80 parts by weight of rubbery polymer, unsaturated carboxylic acid alkyl ester monomer (a), styrene monomer (b), vinyl cyanide monomer (c). And a graft copolymer (A) obtained by copolymerizing 20 to 90 parts by weight of a monomer mixture comprising other vinyl monomers (d) copolymerizable therewith, an unsaturated carboxylic acid alkyl ester monomer A vinyl copolymer (B) comprising a polymer (a), a styrene monomer (b), a vinyl cyanide monomer (c) and another vinyl monomer (d) copolymerizable therewith A thermoplastic transparent resin having a rubber polymer content of 0 to 90 parts by weight of 5 to 30% by weight is preferable because scratches are suppressed and transparency is high.
[0022]
As the (a1) rubbery polymer, those having a glass transition temperature of 0 ° C. or lower are suitable, and diene rubber is preferably used. Specifically, polybutadiene, styrene-butadiene copolymer, acrylonitrile-butadiene copolymer, styrene-butadiene block copolymer, diene rubber such as butyl acrylate-butadiene copolymer, acrylic such as polybutyl acrylate, etc. Rubber, polyisoprene, ethylene-propylene-diene terpolymer, and the like. Of these, polybutadiene or butadiene copolymer is preferred.
[0023]
The rubber particle diameter of the rubber polymer is not particularly limited, but those having a weight average particle diameter of 0.1 to 10 μm, particularly 0.2 to 5 μm are preferable. The average weight particle size of the rubber particles is determined by the sodium alginate method described in “Rubber Age Vol. 88 p. 484 to 490 (1960) by E. Schmidt, PH Biddison” (polybutadiene creamed by the concentration of sodium alginate). By using the fact that the particle size is different, the particle size of 50% cumulative weight fraction is obtained from the weight ratio of creamed weight and the cumulative weight fraction of sodium alginate concentration. The number average particle diameter of the particles can be determined by digital image analysis of an image observed with an optical microscope, a transmission electron microscope, a scanning electron microscope, or a phase contrast microscope.
[0024]
In the present invention, the transparent window composition of the transparent window member having the above-described phase separation structure is configured on the outermost layer on the polishing surface side, but if the resin composition is configured on the outermost layer on the polishing surface side, Even if it is this resin composition single layer, the lamination | stacking with other resin, an inorganic material, etc. may be sufficient, and the material from which a composition changes gradually may be sufficient.
[0025]
In the present invention, the transparent window member is a mixture of a transparent resin matrix and rubber particles, or a composition obtained by melt-kneading a composition obtained by polymerizing a transparent resin in the presence of rubber particles with a hot blender or an extruder in advance. The mixture obtained by mixing the resin matrix and the rubber particles with a mill can be molded into a desired size as required by molding a resin sheet with an injection molding machine, an injection press molding machine, an extrusion molding machine or the like.
[0026]
The size of the translucent window member is measured by irradiating the surface to be polished of the substrate with laser light or visible light from the back side (surface plate side) of the polishing pad while polishing the substrate such as a wafer. It can be determined according to the device.
[0027]
It is preferable to provide a light scattering layer or an antireflection layer on the back surface of the translucent window member of the present invention so that measurement light from the back surface of the platen is not directly reflected, because good measurement can be performed. As a method for forming the light scattering layer, there are a method for roughening the light-transmitting window member by chemical etching or a method for forming a light scattering layer by coating a solution containing silica sol having a particle size of about 1 to 30 μm. Can be mentioned. As a method for forming the antireflection layer, for example, a coating having a lower refractive index than that of the light-transmitting window member is applied by wet coating or vacuum deposition so that the optical film thickness is 1/4 or an odd multiple of the light wavelength. The method of giving the minimum reflectance, ie, the maximum transmittance | permeability, by forming by etc. is mentioned. Here, the optical film thickness is given by the product of the refractive index of the film and the film thickness of the film. The antireflection film may be a single layer or a multilayer, and the optimum combination is determined in consideration of the refractive index, the antireflection property and the adhesiveness of the light transmitting window member.
[0028]
The polishing pad of the present invention and a measuring device for optically measuring a polishing state are provided, and a load is applied between the polishing pad and the substrate in a state where a slurry is interposed between the polishing pad and the substrate. And a polishing apparatus for polishing the substrate by relatively moving the substrate and the polishing pad, and optically measuring the polishing state of the substrate by irradiating the substrate with light. FIG. 4 shows an apparatus configured as shown in FIG. A hole 11 is formed in the surface plate 8, and the light-transmitting window member 2 of the polishing pad is installed on the hole 11. While the platen 8 is rotating, the position of the hole 11 is determined so that it can be seen from the wafer 9 held by the polishing head 10. When the light source 13 is under the surface plate 8 and the hole 11 is close to the wafer 9, the incident light 15 emitted from the light source 13 passes through the hole 11 of the surface plate 8 and the transparent window member 2 and above it. The wafer 9 is fixed at a position so as to hit the surface of the wafer 9. The reflected light 16 on the surface of the wafer 9 is guided to the light detection unit 14 by the beam splitter 12, and the polished state of the wafer surface is measured by analyzing the waveform of the light intensity detected by the light detection unit 14. be able to.
[0029]
Using the polishing pad of the present invention, the unevenness of the insulating film and the unevenness of the metal wiring on the semiconductor wafer are locally planarized using silica-based slurry, aluminum oxide-based slurry, cerium oxide-based slurry, etc. as the slurry. Can be reduced, global steps can be reduced, and dishing can be suppressed. As specific examples of the slurry, CAB-O-SPERSE SC-1 for CMP, CAB-O-SPERSE SC-112 for CMP, SEMI-SPERSE AM100 for CMP, SEMI-SPERSE AM100C for CMP, SEMI-CMP for CMP manufactured by CABO Examples include, but are not limited to, SPERSE 12, SEMI-SPERSE 25 for CMP, SEMI-SPERSE W2000 for CMP, SEMI-SPERSE W-A400 for CMP, and the like.
[0030]
The object of the polishing pad of the present invention is, for example, the surface of an insulating layer or metal wiring formed on a semiconductor wafer. As the insulating layer, an interlayer insulating film of metal wiring, a lower insulating film of metal wiring or element isolation The metal wiring is aluminum, tungsten, copper or the like, and there are structurally damascene, dual damascene, plug, and the like. When copper is used as the metal wiring, a barrier metal such as silicon nitride is also subject to polishing. As the insulating film, silicon oxide is mainly used at present, but a low dielectric constant insulating film is used due to the problem of delay time. With the polishing pad of the present invention, it is possible to satisfactorily measure the polishing state while polishing in a state where scratches are difficult to enter. In addition to semiconductor wafers, it can also be used for polishing magnetic heads, hard disks, sapphire and the like.
[0031]
The surface of the polishing layer of the polishing pad of the present invention is used in a shape that can be taken by a normal polishing pad, such as a grooving shape, a dimple shape, a spiral shape, or a concentric shape, in order to suppress the hydroplane phenomenon.
[0032]
In the polishing pad of the present invention, dressing is usually performed on the polishing layer surface with a conditioner to which diamond abrasive grains are attached by electrodeposition before or during polishing. As the dressing method, either batch dressing performed before polishing or in-situ dressing performed simultaneously with polishing can be performed. During dressing, the translucent window member of the present invention is also ground by contacting the conditioner, but selecting the same grindability as the polishing layer or a material that is difficult to grind is part of the surface of the translucent window member. Is preferably located above the polishing layer surface and can contact the substrate surface.
[0033]
【Example】
Hereinafter, the details of the present invention will be further described with reference to examples. In this example, each characteristic was measured by the following method.
[0034]
1. Scratch evaluation: Using the polishing apparatus of FIG. 4, the surface plate diameter: 51 (cm), the surface plate rotation speed: 60 (rpm), the polishing head rotation speed: 60 (rpm), the polishing pressure: 0.05 ( As a polishing condition of (MPa), a conditioner ("CMP-M") of Asahi Diamond Industry Co., Ltd. was used, and in-situ dressing with a pressing pressure of 0.04 (MPa) and a conditioner rotation speed of 25 rpm was made as a slurry by Cabot Corporation. SC-1 was supplied at 200 (cc / min) and polished for 2 minutes. After thoroughly polishing the polished 6-inch silicon wafer with an oxide film, scratches of 0.5 μm or more were measured with a dust inspection apparatus WM-3 manufactured by Topcon Corporation.
[0035]
2. Method for investigating how well the light transmission window member of the polishing pad can measure the polishing state: Using the wafer polishing apparatus of FIG. 4 and using the laser beam of 532 nm, the surface plate diameter: 51 (cm), the surface plate rotation speed : 60 (rpm), polishing head rotation speed: 60 (rpm), polishing pressure: 0.05 (MPa) polishing conditions, using a conditioner ("CMP-M") from Asahi Diamond Industrial Co., Ltd., and pressing pressure Polishing was performed with in-situ dressing at 0.04 (MPa) and a conditioner rotation speed of 25 rpm. While supplying a 90 ppm aqueous solution of xanthan gum (polysaccharide) that is a transparent solution and the viscosity is almost the same as that of the slurry, the light detection unit detects the reflected light of the laser beam when polished under the above polishing conditions. The reflected light intensity was measured, and the ratio to the incident light intensity was used as a reflectance, which was an index of how well the transparent window member could measure the polished state.
[0036]
3. Method for producing polishing pad with transparent window member: So-called XY having a width of 2.0 mm, a depth of 0.5 mm, and a pitch of 45 mm on a Rodel IC-1000 polishing layer (thickness 1.25 mm, diameter 51 cm) Groove processing (lattice groove processing) was performed. A rectangular opening of 19 × 57 mm is cut out at a predetermined position of the polishing layer. A 1 mm rubber sheet is bonded to the polishing layer with a double-sided adhesive tape, and a double-sided adhesive tape is bonded to the back side of the rubber. Thereafter, the rubber sheet portion at the opening of the polishing layer is cut out in a 13 × 50 mm rectangle. Prepare the light-transmissive window member described in the following examples in advance, fit into the opening from the polishing layer side, bond and fix with double-sided adhesive tape on the shoulder of the rubber sheet, polishing with light-transmissive window member Create a pad. The prepared polishing pad with a light transmitting window member is fixed to the surface plate of the polishing apparatus of FIG. 4 so that the hole of the surface plate and the light transmitting window member of the polishing pad coincide.
[0037]
Example 1
A light-transmitting window member having the shape shown in FIG. 5 was prepared using Toyolac “920” (transparent ABS) manufactured by Toray Industries, Inc. The fog value of the translucent window member was 4%. Using the light transmissive window member, a polishing pad with a light transmissive window member was prepared, and a silicon wafer with a 6-inch oxide film was polished. The number of scratches was as small as two. The reflectance during polishing with an aqueous solution of xanthan gum was 53%, and it was found that good observation was possible.
[0039]
Comparative Example 1
Mixing 300 g of uni-royal adiprene L-325, which is a polyether-based urethane polymer, and 76 g of 4,4′-methylene-bis-2-chloroaniline, and casting the mixture into a mold, a transparent window having the shape of FIG. Create a member. The haze value of the translucent window member was 65%. A polishing pad with a transparent window member was prepared using the transparent window member. The silicon wafer with a 6-inch oxide film was polished using the translucent window member pad. The number of scratches was as large as 110. The blank reflectance during polishing with an aqueous xanthan gum solution was 55%, which was observed well.
[0040]
Comparative Example 2
A translucent window member having the shape shown in FIG. 5 is formed using a 1.25 mm nylon plate. The haze value of the translucent window member was 65%. A polishing pad with a transparent window member was prepared using the transparent window member. A polishing pad with a transparent window member was prepared using the transparent window member. The silicon wafer with a 6-inch oxide film was polished using the translucent window member pad. The number of scratches was as high as 250. The blank reflectivity during polishing with xanthan gum aqueous solution was 50%, and could be observed well.
[Brief description of the drawings]
1 is a cross-sectional view of a single-layer polishing pad having a transparent window member. FIG. 2 is a cross-sectional view of a laminated polishing pad having a transparent window member. FIG. 3 is a top view of a polishing pad having a transparent window member. 4] Polishing apparatus capable of optically measuring the polishing state [FIG. 5] Example of shape of translucent window member of the present invention [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Polishing layer 2 Translucent window member 3 Adhesive layer 4 Polishing pad 5 Cushion layer 8 Surface plate 9 Wafer 10 Polishing head 11 Hall 12 Beam splitter 13 Light source 14 Light detection part 15 Incident light 16 Reflected light
In the present invention, a polishing pad used for forming a flat surface on a glass, a semiconductor, a dielectric / metal composite, an integrated circuit, etc., a polishing apparatus provided with the polishing pad, and a semiconductor device using the polishing apparatus. In the manufacturing method, it was possible to provide a polishing pad, a polishing apparatus, and a method for manufacturing a semiconductor device, which have few scratches on the substrate surface and can optically measure the polishing state during polishing.

Claims (5)

A polishing pad comprising: a polishing layer; and one or more light-transmitting window members for optically measuring a polishing state formed integrally with a part of the polishing layer, wherein the light-transmitting window member includes: A polishing pad, wherein at least the outermost layer on the polishing surface side is composed of a transparent resin composition having a phase separation structure, and the transparent resin composition contains a transparent rubber-reinforced styrene resin . Transparent rubber-reinforced styrene resin transparent acrylonitrile - styrene - polishing pad according to claim 1 is a butadiene copolymer.  The polishing pad according to claim 1, wherein the transparent resin composition is melt-kneaded. A polishing pad according to any one of claims 1 to 3 and a measuring device for optically measuring a polishing state, and in a state where a slurry is interposed between the polishing pad and the substrate, And polishing the substrate by moving the substrate and the polishing pad relative to each other, and optically measuring the polishing state of the substrate by irradiating the substrate with light. A characteristic polishing apparatus. A manufacturing method of a semiconductor device including a process of polishing at least a surface using the polishing apparatus according to claim 4 .

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