JP3991608B2 - LASER CUTTING METHOD, ELECTRO-OPTICAL DEVICE MANUFACTURING METHOD, ELECTRO-OPTICAL DEVICE, ELECTRONIC DEVICE, AND LASER CUTTING DEVICE - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser cutting method for cutting a glass substrate used for a liquid crystal panel and the like, a method for manufacturing an electro-optical device using the laser cutting method, an electro-optical device, an electronic apparatus, and a cutting device.
[0002]
[Prior art]
In recent years, electro-optical devices such as liquid crystal devices have been widely used as display units of electronic devices such as portable electric machines, portable computers, and video cameras. In a liquid crystal device, two glass substrates are stacked and bonded together with a sealing material to form an empty panel called an empty cell, and then a liquid crystal as an electro-optical material is sealed in a region partitioned by the sealing material. .
[0003]
The glass substrate used in such a liquid crystal device may be cut and bonded to a size corresponding to each panel, and then the two substrates may be stacked and bonded together, especially when manufacturing a small liquid crystal device, For example, forming wiring patterns for multiple liquid crystal devices on a large original substrate (large glass substrate) on which multiple panels can be formed. In many cases, the original substrate is cut and divided into individual substrates.
[0004]
In any of these manufacturing methods, conventionally, after a scribe line is formed on the surface of the glass substrate with a diamond chip or the like, a bending stress is applied from the back surface side of the glass substrate by a jig for breakage (for example, a rubber roller). Disconnect by.
[0005]
However, in this cutting method, since the microcracks in the cross section of the substrate caused by scribing cannot be controlled, the cutting becomes unstable. In addition, many chippings from the microcracks occur from the cross section of the substrate. When such a lot of chipping occurs, there is a problem that the strength of the glass substrate is weakened and cleaning for removing the fragments must be performed. Moreover, since it is a contact type, if the foreign material has adhered to the rubber roller, there exists a possibility of scratching a glass substrate.
[0006]
On the other hand, Japanese Patent Application Laid-Open No. 11-104869 has proposed a method using laser light as a method for cutting a glass substrate.
[0007]
[Problems to be solved by the invention]
However, when the glass substrate is cut by the cutting method disclosed in Japanese Patent Application Laid-Open No. 11-104869, problems such as excessive heating of the glass substrate at the cutting start location and cracks are likely to occur. Therefore, instead of reducing the power of the laser beam so that cracks do not occur, measures such as cutting the glass substrate while slowly heating it by slowing the moving speed of the laser beam irradiation position on the glass substrate have been studied. However, under such conditions, the cutting speed is too slow and productivity is reduced.
[0008]
In view of the above-described problems, an object of the present invention is to provide a laser cutting method and an electro-optical device capable of efficiently cutting a glass substrate or a panel on which a glass substrate is bonded without causing defects such as cracks. A manufacturing method, an electro-optical device, an electronic apparatus, and a laser cutting device are proposed.
[0009]
[Means for Solving the Problems]
  In order to solve the above-described problems, a laser cutting method of the present invention is for irradiating a glass substrate with laser light, and for cutting the glass substrate by relatively moving the positions of the glass substrate and the laser light. A laser cutting method, wherein (a) the laser light is cut from the cutting start position of the glass substrate while increasing the relative movement speed of the laser light from a predetermined start speed to a cutting speed higher than the start speed. A step of relatively moving toward the end position, (b) a step of relatively moving the laser beam while maintaining the cutting speed until the laser beam reaches the vicinity of the cutting end position, and (c) a speed of relative movement is set to the cutting speed. And gradually moving the laser beam to the cutting end position while gradually decreasing from the step, and in the step (a), as the speed of the relative movement increases The irradiation intensity of the laser light is gradually increased from the first irradiation intensity that is a predetermined irradiation intensity to the second irradiation intensity that is higher than the first irradiation intensity, and the second irradiation intensity is maintained in step (b), and step (c) Is characterized in that the irradiation intensity is gradually decreased from the second irradiation intensity as the speed of relative movement decreases.
[0010]
  According to this laser cutting method, in step (a), the speed of relative movement is increased, and the irradiation intensity of the laser light is increased from the first irradiation intensity to the second irradiation intensity, and in step (b), the speed is high. The cutting speed and the second irradiation intensity are maintained, and in the step (c), the relative movement speed is gradually decreased, and the irradiation intensity is gradually decreased from the second irradiation intensity. It can cut efficiently.
  Specifically, in the vicinity of the cutting start position, by irradiating the cooled glass substrate while increasing the irradiation intensity of the laser light from the first irradiation intensity to the second irradiation intensity in the step (a), Since the glass substrate is gradually heated, generation of cracks can be prevented.
  In addition, in the vicinity of the cutting end position, even if the temperature of the glass substrate has already risen, excessive heating of the glass substrate is prevented by reducing the irradiation intensity from the second irradiation intensity in the step (c), thereby preventing cracks. Can be prevented.
  Furthermore, since the cutting is performed in the state of maintaining the high cutting speed and the second irradiation intensity in the step (b) until the vicinity of the cutting end position, the glass substrate can be cut efficiently.
[0011]
  According to the laser cutting method of the present invention, the method further includes the step of forming a scribe line from the cutting start position to the cutting end position before the step (a), and the first irradiation intensity is determined by the laser beam starting speed. When the irradiation is performed while moving relatively from the cutting start position, the irradiation intensity is set so as not to cause cracks, and the irradiation intensity can be obtained to obtain the amount of heat necessary for cutting the glass substrate. preferable.
  Moreover, after the step (c), (d) a step of imaging and inspecting the cutting state of the glass substrate;(E)
Feeding back the inspection result to the cutting conditions including the irradiation intensity of the laser light on the glass substrate to be cut next and / or the relative moving speed of the laser light,It is preferable that it is further included.
[0012]
  In order to solve the above problems, a laser cutting device according to the present invention provides a large-sized panel in which a plurality of electro-optic panels each having an electro-optic material sandwiched between a first glass substrate and a second glass substrate are provided. The laser beam is irradiated from the first glass substrate side and the second glass substrate side, and the large panel is moved relative to the irradiation position of the laser beam to cut out the electro-optical panel from the large panel. A laser cutting device for irradiating a laser beam from the first glass substrate side, a second laser irradiating the laser beam from the second glass substrate side, and a panel support unit for supporting a large panel A panel support unit, and a robot unit that moves the position of the panel support unit relative to the irradiation position of the laser light in a planar manner. Each has an opening in a portion along a plurality of scheduled cutting lines in the large panel, and the first and second lasers respectively calculate the irradiation intensity of the laser light at the cutting start position and the cutting end position of the planned cutting line, It is characterized by being lower than the irradiation intensity at the center of the planned cutting line.
[0013]
  According to this laser cutting device, the first and second lasers that irradiate laser beams from the first glass substrate side and the second glass substrate side of the large-sized panel, respectively, are cut. By making the irradiation intensity of the laser beam at the cutting start position and the cutting end position of the planned line lower than the irradiation intensity at the center of the planned cutting line, the glass substrate can be efficiently cut without generating a crack. .
  Specifically, the first and second glass substrates forming both surfaces of the large panel can be efficiently cut in parallel by the first and second lasers. In addition, since the large panel is supported by the panel support portion having the opening at the portion along the planned cutting line including the cutting start position and the cutting end position located at the end of the large substrate, the first and second Laser light from both sides of the laser can be irradiated evenly to the end of the large substrate without obstruction.
  Furthermore, by making the irradiation intensity of the laser light by the first and second lasers at the cutting start position and the cutting end position of the planned cutting line lower than the irradiation intensity at the center of the planned cutting line, at the cutting start position and the cutting end position Since excessive heating can be prevented, generation of cracks in the part can be prevented.
[0014]
In the present invention, for example, the power of the laser beam is changed between a cutting start position and a cutting end position with respect to the glass substrate.
[0015]
In this case, it is preferable to gradually increase the power of the laser light in the vicinity of the cutting start position with respect to the glass substrate. If comprised in this way, in a cutting start position, since a glass substrate is heated gradually from the cold state, a crack does not generate | occur | produce. In addition, since the power is increased as the cutting progresses, the moving speed of the irradiation position of the laser beam on the glass substrate can be increased after the vicinity of the cutting start position, so that one glass substrate or panel It is possible to efficiently cut a panel in which glass substrates that are stacked and bonded in a shape are bonded.
[0016]
Further, it is preferable that the power of the laser beam is gradually reduced in the vicinity of the cutting end position with respect to the glass substrate. With this configuration, even if the temperature of the glass substrate has already risen because there is no place for the heat to escape even if the heat generated by the previous laser irradiation is transmitted at the cutting end position, the power of the laser beam is reduced. Since the glass substrate is gradually lowered, the glass substrate is not overheated, so that no cracks are generated. In addition, since the power is large up to the cutting end position, the moving speed of the laser light irradiation position on the glass substrate can be increased, so that a single glass substrate or a glass substrate bonded in a panel shape can be efficiently cut. can do.
[0017]
In this invention, you may change the moving speed of the irradiation position of the said laser beam on the said glass substrate between the cutting start position with respect to the said glass substrate to a cutting end position.
[0018]
For example, in the vicinity of the cutting start position with respect to the glass substrate, the moving speed of the irradiation position of the laser beam on the glass substrate is gradually increased. Even if the amount of heat is insufficient when the laser beam power is lowered near the cutting start position on the glass substrate, the amount of heat is insufficient because the moving speed of the laser beam irradiation position on the glass substrate is slow while this part is being cut. There is nothing to do. In addition, after the vicinity of the cutting start position, the moving speed of the laser light irradiation position on the glass substrate is increased, so that a single glass substrate or a glass substrate laminated in a panel shape is efficiently cut. be able to.
[0019]
Moreover, the moving speed of the irradiation position of the laser beam on the glass substrate may be gradually decreased in the vicinity of the cutting end position with respect to the glass substrate. Even if the amount of heat is insufficient when the power of the laser beam is lowered near the cutting end position on the glass substrate, the amount of heat is insufficient because the moving speed of the laser beam irradiation position on the glass substrate is slow while cutting this part. There is nothing to do. In addition, since the moving speed of the laser light irradiation position on the glass substrate is fast up to the vicinity of the cutting end position, it is possible to efficiently cut a single glass substrate or a glass substrate bonded in a panel shape. .
[0020]
In the present invention, the glass substrate may constitute a panel in which two sheets are laminated and bonded together. In this case, the cut line is cut with respect to both the front side and the back side of the panel. The panel is cut by irradiating each of the laser beams along.
[0021]
When a glass substrate bonded in a panel shape is cut with a laser beam, the two glass substrates cannot be cut into an appropriate state even if the laser beam is irradiated only from one substrate side. If both sides are irradiated with laser light, the two glass substrates can be cut into an appropriate state. That is, since the glass substrate has a relatively high light absorption rate, when the laser beam is irradiated only from the upper glass substrate side, the upper glass substrate is heated, but the lower glass substrate is not heated. Therefore, the thermal stress acts only on the upper glass substrate and does not act on the lower glass substrate, but if the present invention is applied, the thermal stress can be exerted on both of the two glass substrates. Further, when two glass substrates bonded with a sealing material are cut in a region sandwiched by the sealing materials, the two glass substrates are simply irradiated with laser light only from the upper glass substrate side. Even if it tries to break, the lower glass substrate works to suppress cracking and cannot be cut under the same conditions as a single substrate, but such a problem can also be avoided by applying the present invention. it can. Furthermore, when the laser beam is irradiated only from the upper glass substrate side, increasing the thermal energy increases the force to break the upper glass substrate, but the lower glass substrate exerts that force. It is only received through the sealing material. Therefore, even if the lower glass substrate is cracked by such a force, the force depends on the structure of the panel, the adhesion state of the sealing material, etc., and there is a problem that the reproducibility is poor. Problems can also be avoided by applying the present invention.
[0022]
In the present invention, the glass substrate is a substrate for holding an electro-optical material such as liquid crystal.
[0023]
The laser cutting method according to the present invention is used when cutting a glass substrate for holding an electro-optical material in a method for manufacturing an electro-optical device. The electro-optical device manufactured as described above is used as a display unit of an electronic device such as a mobile phone or a mobile computer.
[0024]
A laser cutting apparatus for carrying out the laser cutting method according to the present invention includes a laser light source unit, a driving unit that moves an irradiation position of the laser light emitted from the laser light source unit on the glass substrate, the driving unit, Control means for controlling the laser light source unit to change a cutting condition by the laser light between a cutting start position and a cutting end position with respect to the glass substrate.
[0025]
In this invention, it is preferable to have a test | inspection means for test | inspecting the cutting result with respect to the said glass substrate, and feeding back the test result to the cutting conditions with respect to the glass substrate performed after that.
[0026]
In the present invention, the control unit changes the power of the laser beam between a cutting start position and a cutting end position with respect to the glass substrate, for example. In this case, it is preferable that the control means gradually increases the power of the laser light in the vicinity of the cutting start position with respect to the glass substrate. Moreover, it is preferable that the control means gradually decreases the power of the laser light in the vicinity of the cutting end position with respect to the glass substrate.
[0027]
In this invention, the said control means may change the moving speed of the irradiation position of the said laser beam on the said glass substrate between the cutting start position with respect to the said glass substrate to a cutting end position. For example, the control means gradually increases the moving speed of the irradiation position of the laser beam on the glass substrate in the vicinity of the cutting start position with respect to the glass substrate. Moreover, the said control means may reduce the moving speed of the irradiation position of the said laser beam on the said glass substrate in the vicinity of the cutting completion position with respect to the said glass substrate.
[0028]
In the present invention, when cutting a panel in which two glass substrates are laminated and bonded together, the laser irradiation means irradiates both the front side and the back side of the panel with the laser beam.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings. In the following description, an example in which the laser cutting method according to the present invention is applied to a method for manufacturing a passive matrix electro-optical device will be described.
[0030]
(overall structure)
1 and 2 are a perspective view and an exploded perspective view, respectively, of an electro-optical device to which the present invention is applied. 3 is a cross-sectional view of the end portion on the I side when the electro-optical device to which the present invention is applied is cut along the line II ′ of FIG. FIGS. 1 and 2 only schematically show electrode patterns and terminals. In an actual electro-optical device, a larger number of electrode patterns and terminals are formed.
[0031]
1 and 2, an electro-optical device 1 according to this embodiment is a passive matrix type liquid crystal display device mounted on an electronic device such as a mobile phone, and is bonded by a sealing material 30 with a predetermined gap therebetween. A liquid crystal sealing region 35 is defined by a sealing material 30 between a pair of transparent substrates 10 and 20 made of a glass substrate such as rectangular non-alkali glass, heat-resistant glass, quartz glass, and the like. Liquid crystal as a substance is enclosed.
[0032]
The electro-optical device 1 shown here is a transmission type example, and a polarizing plate 61 is pasted on the outer surface of the second transparent substrate 20, and a polarizing plate 62 is pasted on the outer surface of the first transparent substrate 10. Yes. A backlight device 9 is disposed outside the second transparent substrate 20.
[0033]
As shown in FIG. 3, the first transparent substrate 10 has red (R), green (G), and blue (B) in a region corresponding to the intersection of the first electrode pattern 40 and the second electrode pattern 50. ) Color filters 7R, 7G, and 7B are formed, and an insulating planarizing film 13, a first electrode pattern 40, and an alignment film 12 are formed in this order on the surface side of these color filters 7R, 7G, and 7B. Yes. On the other hand, the second electrode pattern 50, the overcoat film 29, and the alignment film 22 are formed in this order on the second transparent substrate 20.
[0034]
In this embodiment, in the electro-optical device 1, both the first electrode pattern 40 and the second electrode pattern 50 are formed of a transparent conductive film typified by an ITO film (Indium Tin Oxide). If a film of aluminum or the like patterned through an insulating film is formed under the second electrode pattern 50, the semi-transmissive / semi-reflective electro-optical device 1 can be configured. It is also possible to laminate a transflective plate outside the deflection plate 61 on the outer surface. Further, if the reflective layer formed under the second electrode pattern 50 is formed of a reflective film, the reflective electro-optical device 1 can be configured. In this case, the back surface of the second transparent substrate 20 The backlight device 9 may be omitted from the side.
[0035]
(Electrode pattern and terminal configuration)
1 and 2 again, in the electro-optical device 1 of the present embodiment, the same direction of the first transparent substrate 10 and the second transparent substrate 20 is used for both external signal input and conduction between the substrates. The first terminal forming region 11 and the second terminal forming region 21 formed on the first transparent substrate 10 and the second transparent substrate 20 in the vicinity of the substrate sides 101 and 201 located at the same position are used. Therefore, a substrate larger than the first transparent substrate 10 is used as the second transparent substrate 20, and the first transparent substrate 10 is bonded to the first transparent substrate 10 when the first transparent substrate 10 and the second transparent substrate 20 are bonded together. Using the portion 25 where the second transparent substrate 20 protrudes from the ten substrate sides 101, the flexible substrate 90 on which the driving IC 7 is COF mounted is connected.
[0036]
For this reason, in the second transparent substrate 20, the second terminal formation region 21 is formed in a portion 25 that protrudes from the first transparent substrate 10 in a portion that is close to the substrate side 201, and a terminal that is close to the substrate side 201 is formed. The surface of the region portion is in an open state. On the other hand, in the second transparent substrate 20, the portion located on the liquid crystal sealing region 35 side of the second terminal forming region 21 is used for inter-substrate conduction with the first transparent substrate 10 side. Therefore, a portion of the second terminal formation region 21 located on the liquid crystal sealing region 35 side is formed in an overlapping portion with the first transparent substrate 10.
[0037]
Further, in the first transparent substrate 10, the first terminal formation region 11 is used for inter-substrate conduction with the second transparent substrate 20 side, so that it is formed in an overlapping portion with the second transparent substrate 20. ing.
[0038]
In constructing such a connection structure, in this embodiment, in the first transparent substrate 10, the first terminal formation region 11 is formed along the central portion of the substrate side 101 of the first transparent substrate 10, In the first terminal formation region 11, a plurality of first inter-substrate conduction terminals 60 are arranged at a predetermined interval along the substrate side 101. Further, in the first transparent substrate 10, after the first electrode patterns 40 for driving a plurality of columns of liquid crystal are obliquely extended on both sides from the first inter-substrate conduction terminal 60 toward the opposite substrate side 102, The liquid crystal sealing region 35 extends in a direction orthogonal to the substrate sides 101 and 102.
[0039]
In the second transparent substrate 20, the second terminal formation region 21 is also formed along the substrate side 201, but this second terminal formation region 21 extends over a relatively wide range excluding both ends of the substrate side 201. Is formed. In the second terminal formation region 21, a plurality of first external input terminals 81 arranged at a predetermined interval along the substrate side 201 in the central region, and these first external input terminals 81 are formed. A plurality of second external input terminals 82 are formed along the substrate side 201 at two positions on both sides of the region.
[0040]
Also, from the first external input terminal 81, a plurality of second substrates that overlap with the first inter-substrate conduction terminal 60 when the first transparent substrate 10 and the second transparent substrate 20 are bonded together. The inter-conduction terminal 70 extends linearly toward the substrate side 202.
[0041]
Further, in the second transparent substrate 20, a region where the first electrode pattern 40 is formed from the second external input terminal 82 when the first transparent substrate 10 and the second transparent substrate 20 are bonded together. A plurality of columns of second electrode patterns 50 for driving a liquid crystal are formed so as to wrap around regions corresponding to both sides of the first electrode pattern 40 and the second electrode pattern 50. It extends to intersect.
[0042]
When the electro-optical device 1 is configured using the first transparent substrate 10 and the second transparent substrate 20 configured as described above, in the present embodiment, the first transparent substrate 10 and the second transparent substrate 20 are sealed. When the material 30 is bonded together, the gap material and the conductive material are blended in the seal material 30, and the first inter-substrate conduction terminal 60 and the second inter-substrate conduction terminal 70 are combined with the seal material 30. They are formed in overlapping areas. Here, the conductive material included in the sealing material 30 is, for example, particles obtained by plating the surface of an elastically deformable plastic bead, and the particle size thereof is larger than the particle size of the gap material included in the sealing material 30. Slightly bigger. Therefore, when the sealing material 30 is melted and cured while applying a force that narrows the gap with the first transparent substrate 10 and the second transparent substrate 20 overlapped, the conductive material becomes the first transparent substrate. In a state of being crushed between the substrate 10 and the second transparent substrate 20, the first inter-substrate conduction terminal 60 and the second inter-substrate conduction terminal 70 are made conductive.
[0043]
In addition, when the first transparent substrate 10 and the second transparent substrate 20 are bonded to each other through the sealing material 30, the pixels are arranged in a matrix by the intersection of the first electrode pattern 40 and the second electrode pattern 50. It is formed. For this reason, after mounting the flexible substrate 90 to the end of the second terminal formation region 21 of the second transparent substrate 20 on the substrate side 201 side using an anisotropic conductive material, the flexible substrate 90 is mounted. When a signal is input to the first external input terminal 81 and the second external input terminal 82 of the second transparent substrate 20 through the second electrode pattern 50 formed on the second transparent substrate 20, A scanning signal can be directly applied via the second external input terminal 82, and the first electrode pattern 40 formed on the first transparent substrate 10 includes the first external input terminal. Image data can be input as a signal through the terminal 81, the second inter-substrate conduction terminal 70, the conducting material and the first inter-substrate conduction terminal 60. Therefore, the alignment state of the liquid crystal positioned between the first electrode pattern 40 and the second electrode pattern 50 in each pixel 5 can be controlled by these image data and scanning signals, so that a predetermined image can be displayed. Can be displayed.
[0044]
(Method of manufacturing electro-optical device 1)
4 and 5 are a process diagram and an explanatory diagram, respectively, showing a method for manufacturing an electro-optical device. FIGS. 6A and 6B are a cross-sectional view showing a position for cutting a large panel, and a cross-sectional view showing a state where an excessive portion of the substrate is removed after the strip-like panel is cut into a single panel. is there.
[0045]
In manufacturing the electro-optical device 1 of the present embodiment, both the first transparent substrate 10 and the second transparent substrate 20 are used as the substrates 10 and 20 in the step (A) shown in FIGS. The formation process of the electrode patterns 40, 50, etc. is performed in the state of the large substrates 100, 200 that can be obtained in large numbers.
[0046]
Then, after the alignment films 12 and 22 are formed and rubbed in the step (B) shown in FIGS. 4 and 5 for each of the large substrates 100 and 200, for example, in FIGS. In the step (C) shown, the sealing material 30 is applied to the first large substrate 100, while the gap material 28 is dispersed on the second large substrate 200.
[0047]
Next, in step (D) shown in FIGS. 4 and 5, the large substrates 100 and 200 are bonded together with a predetermined positional relationship to form the large panel 300.
[0048]
Next, in the step (E) shown in FIGS. 4 and 5, as a cutting step (primary breaking step) for the large panel 300, a scribe line 301 for cutting the large panel 300 into a strip-shaped panel is formed on the large panel 300. After forming on each of the front surface and the back surface, the large panel 300 is cut into strip-shaped panels 400 by irradiating the front and back surfaces of the large panel 300 with laser beams L1 and L2 along the scribe line 301.
[0049]
At this time, as shown in FIG. 6A, the large panel 300 is cut along the application region of the sealing material 30. That is, according to the present embodiment, since it is possible to cut at the application region of the sealing material 30, for example, if the large panel 300 is cut at a position overlapping the application region of the sealing material 30, the strip-shaped panel 400 is cut. On the surface, the substrate is closed with the sealing material 30 except for the liquid crystal injection port 31. Accordingly, when the cut panel is cleaned in a subsequent process, an event such as the cleaning liquid collecting between the substrates outside the application region of the seal 30 does not occur.
[0050]
In this state, since the liquid crystal injection port 31 (see FIG. 2) is opened in the cut portion of the strip-shaped panel 400, the liquid crystal is supplied from the liquid crystal injection port 31 in the step (F) shown in FIGS. After the injection, the liquid crystal injection port 31 is sealed with a sealing material 32 (see FIG. 2).
[0051]
Next, in the step (G) shown in FIGS. 4 and 5, as a cutting step (secondary breaking step) for the strip-shaped panel 400, a scribe for cutting the strip-shaped panel 400 into a single panel for each electro-optic. After the line 401 is formed on each of the front and back surfaces of the strip-shaped panel 400, both sides of the strip-shaped panel 400 are irradiated with the laser beams L1 and L2 along the scribe line 401, so that the strip-shaped panel 100 is made as a single item. Cut into panel 1 '.
[0052]
For the single panel 1 ′, as shown in FIGS. 1 and 2, it is necessary to finish the first transparent substrate 10 smaller than the second transparent substrate 20 to expose each terminal region. In this case, a scribe line 403 is formed on a single panel, and a laser beam L is applied to the scribe line 403 to expose the terminal region from the second transparent substrate 20 (material removal from the strip). Process). Also at this time, as shown in FIG. 6B, the large panel 300 is cut along the application region of the sealing material 30.
[0053]
Thereafter, the flexible substrate 90 and the like are mounted in the step (G) shown in FIGS. 4 and 5.
[0054]
(Configuration of laser cutting device)
As described above, in order to manufacture the electro-optical device 1, it is necessary to cut the large panel 300 or the strip-shaped panel 400 in which two substrates are stacked and bonded together. Then, the cutting device described below is used.
[0055]
FIG. 7 is an explanatory diagram showing a configuration of a main part of a laser irradiation apparatus of a laser cutting apparatus to which the present invention is applied. FIG. 8 is an explanatory diagram of a panel support used in the laser cutting apparatus to which the present invention is applied and its drive mechanism.
[0056]
As shown in FIG. 7, the cutting apparatus 500 of this embodiment includes a laser irradiation apparatus 501 that irradiates laser light L <b> 1 and L <b> 2 on both the front side and the rear side toward the large panel 300 or the strip-shaped panel 400, and the large panel. The robot unit moves the irradiation position while adjusting the irradiation position of the laser beams L1 and L2 emitted from the laser irradiation apparatus 501 to the large panel 300 or the strip panel 400 by moving the 300 or the strip panel 400. 550 (driving means), the robot unit 550, and the laser irradiation apparatus 501 are controlled, and the cutting conditions by the laser beams L1 and L2 are set between the cutting start position and the cutting end position with respect to the large panel 300 or the strip-shaped panel 400. It has a controller 541 (control means) to changeFurther, the strip-shaped panel 400 or a single panel after cutting is imaged and inspected, and the imaged and inspected results are output to the controller and fed back to the subsequent cutting conditions for the large-sized panel 300 or the strip-shaped panel 400. Therefore, an inspection imaging device 560 (inspection means) is provided.
[0057]
First, the controller 541 controls the carbon dioxide lasers 541 and 542 in the laser irradiation apparatus 501, and the carbon dioxide lasers 542 and 543 emit laser beams L1 and L2, respectively. The laser beam L 1 from the carbon dioxide laser 542 is reflected by the total reflection mirror 544 and is irradiated on the surface of the large panel 300 or the strip-shaped panel 400 through the condenser lens 546. Similarly to the laser beam L1, the laser beam L2 from the carbon dioxide laser 543 is reflected by the total reflection mirror 545 and then irradiated to the back surface of the large panel 300 or the strip-shaped panel 400 via the condenser lens 547. .
[0058]
As a result, the regions irradiated with the laser beams L1 and L2 rise in temperature, the thermal stress generated due to the temperature gradient increases, and each of the two substrates constituting the large panel 300 and the strip-shaped panel 400 Cracks occur in the thickness direction, and the two substrates are each broken. For this reason, cutting accuracy is high and reproducibility is excellent. Further, since the cutting is performed in a non-contact manner, there is no possibility that the large panel 300 and the strip-shaped panel 400 are damaged.
[0059]
The total reflection mirrors 544 and 545 are supported so that the reflection angle and the mounting position thereof can be adjusted arbitrarily, so that the laser light L1 does not reach the carbon dioxide laser 543 and the laser light L2 is directed to the carbon dioxide laser 542. The laser beams L 1 and L 2 are incident on the large panel 300 or the strip-shaped panel 400 obliquely with a predetermined inclination so as not to reach.
[0060]
Here, the large panel 300 and the strip-shaped panel 400 are supported by a panel support 600, and the position of the panel support 600 is controlled by a robot unit 550 that operates under the control of the controller 541. The robot unit 550 includes an X-direction slide mechanism 551 and a Y-direction slide mechanism 552.
[0061]
In FIG. 8, the X-direction slide mechanism 551 is equipped with an X stage 553, a pulse motor 554, and a shaft (not shown) driven by the pulse motor 554. The outer surface of the shaft is threaded, and is screwed with the connecting member 549 connected to the panel support 600, and the shaft is rotated to move the connecting member 549, so that the panel support 600 is moved in the X direction. The Y-direction slide mechanism 552 is equipped with a Y stage 556, a pulse motor 557, and a shaft (not shown) driven by this pulse motor. The outer surface of the shaft is also threaded, and is screwed with a connecting member (not shown) formed on the back side of the X stage 553 to move the connecting member. As a result, the X stage 553 moves in the Y direction, and the panel support 600 moves in the Y direction.
[0062]
In the laser cutting device 500 configured as described above, first, the panel support 600 holds the large panel 300 or the strip-shaped panel 400 in which the scribe line is formed at the planned shearing portion.
[0063]
Then, the controller 541 controls the carbon dioxide lasers 542 and 543 to emit the laser beams L1 and L2. The laser beams L1 and L2 from the carbon dioxide lasers 542 and 543 are reflected by total reflection mirrors 544 and 545, and are respectively provided on the front side and the back side of the large panel 300 or the strip-shaped panel 400 via the condenser lenses 546 and 547. Is irradiated.
[0064]
In this manner, the laser beams L1 and L2 are irradiated, and the robot unit 550 moves the panel support 600 in the X direction and the Y direction under the control of the controller 541, thereby causing the laser beams L1 and L2 to be emitted from the large panel. While irradiating a predetermined position on 300 or the strip-shaped panel 400, the irradiation position is moved along the planned cutting line. As a result, since the crack propagates with the movement of the irradiation position of the laser beams L1 and L2, the accuracy such as the linearity of the cut portion is high.
[0065]
The panels 300 and 400 may be fixed and the laser beams L1 and L2 may be moved.
[0066]
Here, the panel support 600 has a rectangular opening 601 that holds the large panel 300 and a plurality of strip-shaped panels 400, and the large-sized panel 300 and the strip-shaped panel 400 are disposed inside the rectangular opening 601. A stepped portion 602 is formed on which the film is placed. Accordingly, in a state where the large panel 300 or the strip-shaped panel 400 is placed inside the opening 601, both the front surface side and the back surface side of the large panel 300 or the strip-shaped panel 400 are completely open. Therefore, there is no problem in simultaneously irradiating the front and back sides of the large panel 300 or the strip-shaped panel 400 with the laser beams L1 and L2. Therefore, the laser cutting device 500 can be configured with a simple configuration without adopting a complicated mechanism. According to the laser cutting device 500, the large panel 300 or the strip-shaped panel 400 can be efficiently cut.
[0067]
[Configuration of another panel support]
FIGS. 9A, 9B, and 9C are respectively a plan view of a panel support for supporting a large panel in another laser cutting apparatus to which the present invention is applied, a sectional view taken along line II-II ′ thereof, and FIGS. It is III-III 'sectional drawing. FIGS. 10A, 10B, and 10C are respectively a plan view of a panel support for supporting a strip-shaped panel in another laser cutting apparatus to which the present invention is applied, a IV-IV ′ sectional view thereof, And VV ′ sectional view.
[0068]
When cutting the panels 300 and 400 by irradiating the front and back surfaces of the panels 300 and 400 with the laser beams L1 and L2, FIGS. 9A, 9B, and 10A are performed. You may use the panel support 650 which consists of a suction head as shown to (B) and (C). The panel support 650 shown in FIGS. 9A, 9B, and 10A, 10B, 10C has a large number of holes 652 on the upper surface of the hollow block 651. When the inside of the block 651 is evacuated in a state where the panels 300 and 400 are placed on the surface of the block 651, the panels 300 and 400 are vacuum-adsorbed from the numerous holes 652 opened on the upper surface. Further, knock pins 653 for abutting the edges of the panels 300 and 400 and positioning the panels 300 and 400 at predetermined positions on the block 651 are formed at predetermined positions on the surface of the block 651. Further, a joint 654 for connecting a pipe for evacuating the inside of the block is formed on the side surface of the block 651.
[0069]
Here, the block 651 is provided with an opening 655 formed of a long hole at a position corresponding to the planned cutting lines 301 and 401 of the panels 300 and 400 that are sucked and held.
[0070]
That is, in the block 651 of the panel support 650 shown in FIGS. 9A, 9 </ b> B, and 8 </ b> C, eight rows of openings are formed along the planned cutting line 301 for cutting the large panel 300 into the strip-shaped panel 400. 655 is formed, and suction holes 652 are arranged between these openings 655. Therefore, when the large panel 300 is placed on the block 651 and the large panel 300 is sucked by the block 651 in this state, the large panel 300 is held on the block 651, but the panel surface side is in a fully open state. In the back side, at least a portion corresponding to the planned cutting line 301 is in an open state through the opening 655. Therefore, both the front surface side and the back surface side of the large panel 300 can be simultaneously irradiated with the laser beams L1 and L2 while the large panel 300 is held on the block 651 of the panel support 650.
[0071]
Further, in the block 651 of the panel support 650 shown in FIGS. 10A, 10B, and 10C, four rows are formed along the planned cutting line 401 for cutting the strip-shaped panel 400 into a single panel 1 ′. The openings 655 are formed, and suction holes 652 are arranged between the openings 655. For this reason, when the strip-shaped panel 400 is placed on the block 651 and the strip-shaped panel 400 is attracted to the block 651 in this state, the strip-shaped panel 400 is held on the block 651, but the panel surface side is in a fully open state. On the other hand, at least the portion corresponding to the planned cutting line 401 is open through the opening 655 on the rear surface side. Therefore, both the front surface side and the back surface side of the strip-shaped panel 400 can be irradiated simultaneously with the strip-shaped panel 400 held on the block 651 of the panel support 650.
[0072]
(Details of laser cutting conditions)
11A and 11B are explanatory diagrams showing the power of the laser beams L1 and L2 and the moving speed of the irradiation positions of the laser beams L1 and L2 in the laser cutting method to which the present invention is applied.
[0073]
In the laser cutting device 500 described with reference to FIGS. 7 to 10, in this embodiment, the controller 541 cuts from the cutting start position with respect to the large panel 300 or the strip-shaped panel 400 in which two substrates are stacked and bonded. As shown in FIGS. 11A and 11B, the cutting conditions by the laser beam up to the end position (the laser beam power, the moving speed of the irradiation position of the laser beam in the large panel 300 or the strip-shaped panel 400) are as shown in FIGS. change.
[0074]
That is, as shown in FIG. 11A, the controller 541 controls the laser irradiation device 501 so that the power of the laser beams L1 and L2 is near the cutting start position (period T1) with respect to the large panel 300 or the strip-shaped panel 400. In the period T2 in which the steady state is reached after increasing the power, the powers of the laser beams L1 and L2 are maintained in the high state, and thereafter, near the cutting end position for the large panel 300 or the strip-shaped panel 400 (period T3). Then, the powers of the laser beams L1 and L2 are gradually decreased.
[0075]
As shown in FIG. 11B, the controller 541 controls the robot unit 550 so that the large panel 300 or the strip-shaped panel 400 is near the cutting start position (period T1) with respect to the large panel 300 or the strip-shaped panel 400. In the period T2 in which the moving speed (moving speed of the irradiation positions of the laser beams L1 and L2 on the large panel 300 or the strip panel 400) is gradually increased, the large panel 300 or the strip panel 400 is increased. The moving speed of the large panel 300 or the strip-shaped panel 400 is then gradually decreased in the vicinity of the cutting end position (period T3) with respect to the large panel 300 or the strip-shaped panel 400.
[0076]
Further, in this embodiment, the strip-shaped panel 400 or a single panel after cutting is imaged and inspected by the imaging device for inspection 560, and the imaging and inspection results are output to the controller. Feedback is made to the cutting conditions for the strip-shaped panel 400.
[0077]
As described above, in this embodiment, the power of the laser beams L1 and L2 is increased in the vicinity of the cutting start position (period T1) with respect to the large panel 300 or the strip-shaped panel 400. Since the substrate is gradually heated from the cold state, no cracks are generated. Further, since the power is increased as the cutting progresses, the moving speed of the irradiation position of the laser beams L1 and L2 on the large panel 300 or the strip-shaped panel 400 can be increased thereafter. Panel 400 can be cut efficiently.
[0078]
Further, in the vicinity of the cutting start position for the large panel 300 or the strip-shaped panel 400 (period T1), the moving speed of the large panel 300 or the strip-shaped panel 400 is gradually increased. Even when the amount of heat is insufficient when the power of the laser beam is lowered, the moving speed of the irradiation position of the laser beams L1 and L2 on the large panel 300 or the strip-shaped panel 400 is slow while this portion is cut. , There is no shortage of heat. Further, since the moving speed of the large panel 300 or the strip-shaped panel 400 is increased after the vicinity of the cutting start position, the large panel 300 or the strip-shaped panel 400 can be efficiently cut.
[0079]
Further, in this embodiment, the power of the laser beams L1 and L2 is gradually reduced in the vicinity of the cutting end position (period T3) with respect to the large panel 300 or the strip-shaped panel 400, so that the heat generated by the laser irradiation so far is transmitted. However, even if the temperature of the glass substrate of the large panel 300 or the strip-shaped panel 400 has already risen in the vicinity of the cutting end position where there is no place for heat to escape, the glass substrate is not overheated, so that cracks do not occur.
[0080]
Furthermore, since the moving speed of the large panel 300 or the strip panel 400 is gradually reduced near the cutting end position (period T3) with respect to the large panel 300 or the strip panel 400, the cutting of the large panel 300 or the strip panel 400 is completed. Even if the amount of heat is insufficient when the power of the laser beams L1 and L2 is reduced near the position, the moving speed of the large panel 300 or the strip-shaped panel 400 is slow while this portion is cut, so the amount of heat is insufficient. There is nothing to do. Further, since the moving speed of the large panel 300 or the strip-shaped panel 400 is increased up to the vicinity of the cutting end position, the large panel 300 or the strip-shaped panel 400 can be efficiently cut.
[0081]
Furthermore, in this embodiment, the strip-shaped panel 400 after cutting and a single panel are imaged and inspected by the inspection imaging device 560, the imaging and inspection results are output to the controller, and then the large panel 300 is performed. Alternatively, since the feedback is made to the cutting conditions for the strip-shaped panel 400, the yield can be improved.
[0082]
(Other embodiments)
In the above embodiment, in the step (G), the single liquid crystal panel 1 ′ is cut out from the strip-shaped panel 400, and then the terminal region is exposed from the second transparent substrate 20, but in the case of the structure shown in FIG. In the step (G), the liquid crystal panel 1 ′ is cut out so that the portion corresponding to the terminal region of the second transparent substrate 20 is exposed in the state of the strip-shaped panel 400, and the end material is removed. The present invention may be applied to. That is, as shown in FIG. 12, in the step (G) shown in FIG. 4, in the strip-like panel 400, the planned cutting line 403 of the first transparent substrate 10 and the planned cutting line 402 of the second transparent substrate 20. A laser beam is irradiated along the line. As a result, the strip-shaped panel 400 is divided into individual liquid crystal panels with the overhanging region 25 exposed. In this case, since the end material 60 remains in each liquid crystal panel, the division and the removal of the end material 60 may be performed simultaneously by irradiating laser light along the planned cutting line 401.
[0083]
Further, in the above embodiment, the present invention is applied when cutting a panel on which two glass substrates are bonded with laser light. However, the present invention is applied when cutting one glass substrate with laser light. Also good.
[0084]
Further, in the above-described embodiment, the example in which the present invention is applied to the manufacture of the passive matrix type electro-optical device 1 has been described. However, the active matrix type liquid crystal device 1 using a TFD element as an active element, or the thin film transistor as an active element The present invention may be applied to the manufacture of various electro-optical devices such as an active matrix type liquid crystal device using the above.
[0085]
(Embodiment of electronic device)
FIG. 13 shows an embodiment in which the electro-optical device (liquid crystal device) according to the present invention is used as a display device of various electronic apparatuses. The electronic device shown here includes a display information output source 70, a display information processing circuit 71, a power supply circuit 72, a timing generator 73, and a liquid crystal device 74. The liquid crystal device 74 includes a liquid crystal display panel 75 and a drive circuit 76. As the liquid crystal device 74 and the liquid crystal panel 75, the electro-optical device 1 described above and the single panel 1 ′ can be used.
[0086]
The display information output source 70 includes a storage unit such as a ROM (Read Only Memory) and a RAM (Random Access Memory), a storage unit such as various disks, a tuning circuit that tunes and outputs a digital image signal, and the like, and is generated by a timing generator 73. Display information such as an image signal in a predetermined format is supplied to the display information processing circuit 71 based on the various clock signals.
[0087]
The display information processing circuit 71 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, a clamp circuit, and the like, executes processing of input display information, The signal is supplied to the drive circuit 76 together with the clock signal CLK. The drive circuit 76 is a general term for the scanning line drive circuit 57, the data line drive circuit 58, the inspection circuit, and the like in FIG. The power supply circuit 72 supplies a predetermined voltage to each component.
[0088]
FIG. 14 shows a mobile personal computer which is an embodiment of an electronic apparatus according to the present invention. The personal computer 80 shown here has a main body 87 having a keyboard 86 and a liquid crystal display unit 88. The liquid crystal display unit 88 includes the electro-optical device 1 described above.
[0089]
FIG. 15 shows a mobile phone which is another embodiment of the electronic apparatus according to the invention. A cellular phone 90 shown here includes a plurality of operation buttons 91 and the electro-optical device 1 including a liquid crystal device.
[0090]
【The invention's effect】
As described above, in the present invention, when a glass substrate is irradiated with laser light, the temperature of the region irradiated with the laser light rises and the thermal stress generated due to the temperature gradient increases. A crack occurs in the thickness direction, and the crack propagates with the movement of the irradiation position of the laser beam, so that the glass substrate is cracked with high accuracy along the planned cutting line. For this reason, cutting accuracy is high and reproducibility is excellent. Further, since the cutting is performed in a non-contact manner, there is no possibility of scratching the substrate. In addition, at the start of cutting the glass substrate, the glass substrate is heated rapidly from the cold state, while at the end of cutting the glass substrate, the heat has already been transferred to the cutting end position and heated, etc. The temperature state is different between the cutting start point and the cutting end point. Therefore, if the glass substrate is cut under certain conditions from the start of cutting to the end of cutting, the glass substrate is heated too quickly and cracks occur, but in the present invention, from the start of cutting to the end of cutting to the glass substrate. In order to change the cutting conditions according to the temperature state of the glass substrate, a single glass substrate or a panel laminated with a glass substrate laminated in a panel form without causing defects such as cracks Can be cut efficiently.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electro-optical device to which the invention is applied.
FIG. 2 is an exploded perspective view of the electro-optical device shown in FIG.
3 is a cross-sectional view of an end portion on the I side when the electro-optical device shown in FIG. 1 is cut along the line II ′ of FIG. 1;
4 is a process diagram illustrating a manufacturing method of the electro-optical device shown in FIG. 1. FIG.
5 is an explanatory view showing a method for manufacturing the electro-optical device shown in FIG. 1; FIG.
FIGS. 6A and 6B are cross-sectional views showing positions where large panels are cut, and cross-sections showing how excess portions of a substrate are removed after cutting a strip-shaped panel into a single panel, respectively. FIG.
FIG. 7 is an explanatory diagram showing a configuration of a main part of a laser irradiation apparatus of a laser cutting apparatus to which the present invention is applied.
FIG. 8 is an explanatory diagram of a panel support of a laser cutting apparatus to which the present invention is applied and its drive mechanism.
FIGS. 9A, 9B, and 9C are plan views of a panel support for supporting a large panel in another laser cutting apparatus to which the present invention is applied, and a sectional view taken along line II-II ′ in FIGS. And III-III ′ cross-sectional view.
FIGS. 10A, 10B, and 10C are plan views of a panel support for supporting a strip-shaped panel in another laser cutting apparatus to which the present invention is applied, and a cross section taken along line IV-IV ′ of FIGS. It is a figure and VV 'sectional drawing.
FIGS. 11A and 11B are explanatory views showing the power of the laser beam and the moving speed of the irradiation position of the laser beam in the laser cutting method to which the present invention is applied, respectively.
FIG. 12 is an explanatory diagram showing a state in which a strip-shaped panel having another structure is cut into a single panel in the present invention.
FIG. 13 is a block diagram showing a configuration of various electronic devices using the liquid crystal device according to the invention.
FIG. 14 is an explanatory diagram showing a mobile personal computer as an embodiment of an electronic apparatus using the liquid crystal device according to the invention.
FIG. 15 is an explanatory diagram of a mobile phone as an embodiment of an electronic apparatus using the liquid crystal device according to the invention.
[Explanation of symbols]
1 Electro-optical device
10 First transparent substrate
20 Second transparent substrate
30 Sealing material
35 Liquid crystal sealing area (image display area)
40 First electrode pattern
50 Second electrode pattern
100, 200 large substrate
300 Large panel
301, 401 Scribe line
400 strip panel
500 Laser cutting device
501 Laser irradiation device (laser irradiation means)
541 Controller (control means)
550 Robot part (drive means)
560 Imaging device for inspection (inspection means)
600, 650 Panel support
L1, L2 Laser light

Claims (3)

A laser cutting method for cutting the glass substrate by irradiating the glass substrate with laser light and relatively moving the position of the glass substrate and the laser light,
(A) While gradually increasing the speed of the relative movement of the laser light from a predetermined start speed to a cutting speed higher than the start speed, the laser light is cut from a cutting start position of the glass substrate to a cutting end position. The relative movement toward
(B) a step of relatively moving the laser light while maintaining the cutting speed until the laser light reaches near the cutting end position;
(C) moving the laser beam relative to the cutting end position while gradually decreasing the speed of the relative movement from the cutting speed,
In the step (a), as the speed of the relative movement increases, the irradiation intensity of the laser beam is gradually increased from a first irradiation intensity that is a predetermined irradiation intensity to a second irradiation intensity that is higher than the first irradiation intensity. ,
In the step (b), the second irradiation intensity is maintained,
In the step (c), the irradiation intensity is gradually decreased from the second irradiation intensity with a decrease in the speed of the relative movement. Before the step (a), further comprising a step of forming a scribe line from the cutting start position to the cutting end position,
The first irradiation intensity is an irradiation intensity that does not cause cracks when the laser beam is irradiated while moving relative to the cutting start position at the start speed, and is necessary for cutting the glass substrate. The laser cutting method according to claim 1, wherein the laser cutting method is set so as to obtain an irradiation intensity at which a sufficient amount of heat is obtained. After step (c)
(D) imaging and inspecting the cutting state of the glass substrate;
(E) feeding back the inspection result to a cutting condition including the irradiation intensity of the laser beam on the glass substrate to be cut next and / or the relative moving speed of the laser beam. The laser cutting method according to claim 1 or 2.

Images