JP3979478B2 - Contact pin and socket for electrical parts using the contact pin - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrical component socket that is provided in an electrical component socket on which an electrical component such as an IC package is placed, and that is provided with contact pins that come into contact with terminals of the electrical component.
[0002]
[Prior art]
Conventionally, as an IC socket which is a “socket for electrical parts”, for example, there is one as shown in FIGS. 4 and 5 (see Japanese Utility Model Laid-Open No. 63-61788). In this IC socket 1, a floating plate 3 is urged upward by a spring 4 on a base 5 of a socket body 2 so as to be movable up and down, and an IC package 6 is placed on the floating plate 3. It is like that.
[0003]
The IC package 6 is called a so-called BGA (ball grid array), and a plurality of hemispherical solder balls 6b as “terminals” are provided adjacent to each other at a narrow pitch on the lower surface of the package body 6a.
[0004]
A contact pin 7 is connected to each of the solder balls 6b. These contact pins 7 are press-fitted into the socket body 2 and loosely inserted into the floating plate 3, and the lower side is inserted into the through hole 9 a of the circuit board 9 so as to be conductive. The socket body 2 is screwed to the circuit board 9 with bolts 10.
[0005]
As shown in FIG. 5, the contact pin 7 has an upper contact member 7b and a lower contact member 7c made of a conductive material inserted in a tubular member 7a, and a coil spring 7d made of a conductive material is disposed therebetween. It is installed. The upper contact member 7b is biased upward by the coil spring 7d.
[0006]
Further, on the upper side of the IC package 6, a heat radiating plate 11 that holds the IC package 6 from above is arranged, and both end portions of the heat radiating plate 11 are pressed by a rotatable pressing member 12. .
[0007]
In this way, the heat dissipation plate 11 is pressed by the pressing member 12, whereby the IC package 6 is pressed downward and the solder ball 6 b is pressed by the upper contact member 7 b of the contact pin 7. Thereby, the IC package 6 is electrically connected to the circuit board 9 through the upper contact member 7b, the coil spring 7d, and the lower contact member 7c. At this time, the upper contact member 7b is displaced in the vertical direction and is brought into pressure contact with the solder ball 6b of the IC package 6 by the urging force of the coil spring 7d to be in electrical contact therewith.
[0008]
[Problems to be solved by the invention]
However, in such a conventional one, since each contact member 7b, 7c has a cylindrical shape and the tubular member 7a has a tubular shape, it is necessary to manufacture them by machining. However, it is difficult and expensive.
[0009]
Accordingly, an object of the present invention is to provide an electrical component socket using contact pins that can be easily manufactured and can reduce costs.
[0010]
[Means for Solving the Problems]
In order to achieve such an object, in the invention described in claim 1, a plurality of contact pins are arranged adjacent to each other between the base of the socket body and the mounting portion, and the upper end of the contact pin is described above. An electrical component socket that is in contact with a terminal of an electrical component placed on the mounting portion and whose lower end of the contact pin is electrically connected to a printed circuit board, the contact pin having conductivity A contact member that is formed of a plate material and is inserted from below into a through hole provided in the mounting portion and protrudes upward is contacted with a terminal of the electrical component, and the contact member is separate and conductive. A board conductive member that is inserted from above into a through hole provided in the base and connected to the printed circuit board, and a conductive wire that is spirally formed, Is engaged with the hook portion formed on the contact member, and the lower end portion is engaged with the engagement portion formed on the substrate conducting member, thereby electrically connecting the contact member and the substrate conducting member. And a coil spring that urges the contact member upward, and the flange portion of the contact member is slidably accommodated in the slit portion formed on the lower surface side of the placement portion. The contact member is prevented from coming off from the placement portion, and the flange portions of the adjacent contact members are different in height from each other, and the directions are alternately different in the vertical direction and the horizontal direction. The contact member is pushed in contact with the terminal of the electrical component, and the contact member is displaced in the axial direction to electrically connect to the electrical component socket.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0017]
1 and 2 show an embodiment of the present invention.
[0018]
First, the configuration will be described. Reference numerals 30 and 40 are contact pins, and the contact pins 30 and 40 are disposed between the base 22 of the socket body 21 and the floating plate 23 which is a “mounting portion”. Has been.
[0019]
Specifically, the contact pins 30 and 40 are contact members 31 and 41 that are in contact with solder balls of an IC package (not shown) as “terminals of electrical components” and a board conduction member that is connected to a printed circuit board (not shown). and 32 and 42, and a benzalkonium yl spring 33, 43 disposed between the substrate conductive members 32, 42 and the contact member 31 and 41.
[0020]
The contact members 31 and 41 are formed in a substantially cross shape by punching a conductive plate material, and the contact end portions 31 a and 41 a formed on the upper portion are movable up and down in the insertion hole 23 a of the floating plate 23. In a state where the IC package is not inserted and inserted, the upper ends of the contact end portions 31 a and 41 a protrude upward from the upper surface of the floating plate 23.
[0021]
Insertion portions 31b and 41b are formed below the contact members 31 and 41, and the insertion portions 31b and 41b are inserted through the coil springs 33 and 43, respectively. Further, the contact members 31 and 41 are formed with flange portions 31 c and 41 c as “locking portions” protruding in the lateral direction, and the slit portion 23 b into which the flange portions 31 c and 41 c are inserted is formed in the floating plate 23. Is formed. When the flange portions 31c and 41c abut on the upper surface portion of the slit portion 23b, the raising of the contact members 31 and 41 is restricted, and a coil spring is provided below the flange portions 31c and 41c. 33 and 43 are locked.
[0022]
The substrate conducting members 32 and 42 are formed by punching a conductive plate material, and have press-fit portions 32a and 42a that are press-fitted into the through holes 22a formed in the base 22, and the press-fit portions 32a and 42a have the press-fit portions 32a and 42a. Are provided with press-fit protrusions 32b and 42b that bite into the inner wall of the socket body through hole 22a. Lead portions 32c and 42c extend below the press-fit portions 32a and 42a, and the lead portions 32c and 42c are connected to a printed circuit board (not shown).
[0023]
Furthermore, insertion portions 32d and 42d are formed on the upper portions of the substrate conducting members 32 and 42. The insertion portions 32d and 42d are inserted into the coil springs 33 and 43, and the insertion portions 32d and 42d and the press-fit portion 32a. , 42a are formed with wide portions 32e, 42e as "locking portions". The lower ends of the coil springs 33 and 43 are brought into contact with and locked with the upper edges 32f and 42f of the wide portions 32e and 42e, and the lower edges 32g and 42g are brought into contact with the upper surface of the base 22. It has become.
[0024]
Moreover, as shown in FIG. 1A, the direction of the flanges 31c and 41c between the adjacent contact pins 30 and 40 are alternately arranged in the vertical direction and the horizontal direction, and the adjacent contact pins 30 and 40 are arranged. The heights of the flange portions 31c and 41c are made different so that the flange portions 31c and 41c do not overlap each other. In this embodiment, the collar part 41c is formed lower than the collar part 31c.
[0025]
In such contact pins 30 and 40, the contact members 31 and 41 and the board conductive members 32 and 42 are formed by press-punching a plate material. Since it is not a structure, it does not require complicated machining, can be easily manufactured as compared with the conventional one, and can be inexpensive.
[0026]
In addition, when an IC package such as a BGA is placed on the floating plate 23, when the IC package is pressed from above with the heat radiating plate 11 or the like described in the conventional example, contacts with solder balls as terminals of the IC package are brought into contact. In a state where the contact end portions 31 a and 41 a of the pins 30 and 40 are in contact with each other, the contact members 31 and 41 are pushed downward in the direction of the axis O against the urging force of the coil springs 33 and 43. Therefore, the solder ball and the contact end portions 31a and 41a are pressed against each other with a predetermined force.
[0027]
When the contact members 31 and 41 move up and down, the contact end portion 31a slides in the insertion hole 23a of the floating plate 23, and the flange portions 31c and 41c slide in the slit portion 23b of the floating plate 23. Thus, the contact members 31 and 41 are guided in a predetermined posture in the vertical direction and moved up and down without tilting.
[0028]
Further, the adjacent contact pins 30 and 40 are arranged in the form of a matrix in which the contact pins 30 and 40 are arranged in a matrix by arranging the flange portions 31c and 41c alternately in the vertical direction and the horizontal direction. Even if the pitch between 30 and 40 is narrow, adjacent contact pins 30 and 40 do not contact each other.
[0029]
Moreover, since the flanges 31c and 41c between the adjacent contact pins 30 and 40 have different heights, as shown in FIG. 1A, the flange 31c on the contact pin 30 side and the contact pin 40 As a result of preventing contact with the coil spring 43 on the side, the arrangement is possible even when the pitch between the adjacent contact pins 30 and 40 is narrower.
[0030]
In addition, since the flanges 31c and 41c are formed on the contact members 31 and 41, the flanges 31c and 41c come into contact with the floating plate 23, so that the contact members 31 and 41 are detached upward. A stop will be made.
[0031]
Further, since the insertion portions 31b and 41b of the contact members 31 and 41 and the insertion portions 32d and 42d of the board conductive members 32 and 42 are inserted into the coil springs 30 and 40, these members and the coil springs 30 and 40 are inserted. Can be prevented from coming off.
[0032]
Incidentally, the contact end portions 31a and 41a of the contact members 31 and 41 of the contact pins 30 and 40 can be of various shapes as shown in FIG. 3A, V-shaped cuts are formed in the contact end portions 31a and 41a, FIG. 3B is a view in which the contact end portions 31a and 41a are formed in a mountain shape, and FIG. 3C is a view in which the contact end portions 31a and 41a are formed. It is formed in a semicircular shape, and in (d), W-shaped cuts are formed in the contact end portions 31a and 41a. Thus, by making the contact members 31 and 41 into a plate shape, the contact end portions 31a and 41a can be formed in various shapes as described above as compared with a conventional rod-shaped member, and these shapes are formed on the terminals of the IC package. By appropriately setting according to the shape, a wiping effect and the like can be obtained, and the conductivity can be further improved.
[0033]
In each of the above embodiments, the IC socket is applied as the “ electrical component socket”. However, the present invention is not limited to this and can be applied to other types.
[0034]
【The invention's effect】
As described above, according to the first aspect of the invention, the following effects can be obtained.
(1) By making the contact member into a plate shape, the contact end portion can be formed in various shapes as compared with the conventional rod-shaped one, and by appropriately setting these shapes corresponding to the shape of the terminal of the IC package In addition, a wiping effect and the like can be obtained, and the conductivity can be further improved.
(2) The contact member and the board conductive member do not require complicated machining such as a cylindrical shape or a tube-shaped structure, and can be easily manufactured simply by punching a plate material, and are inexpensive. can do.
(3) An insertion portion to be inserted into the coil spring is formed in the contact member, and a flange portion is formed. The flange portion between adjacent contact members is formed in the through hole on the lower surface side of the mounting portion. Since it is configured to be slidably accommodated in a slit portion formed so that the heights thereof coincide with each other and the directions are alternately different in the vertical direction and the horizontal direction, the contact member and the coil spring are prevented from coming off. Since the coil spring abuts on the collar part and the collar part abuts on the mounting part, the collar part prevents the contact member urged upward by the coil spring from being lifted upward. When the contact member moves up and down, the collar with a large area slides in the slit portion of the placement unit, so that the contact member is guided in a predetermined posture in the vertical direction and moved up and down without tilting. . In addition, adjacent contact pins are provided with eaves with different heights, and the orientation of eaves is arranged alternately in the vertical and horizontal directions so that the contact pins are arranged in a matrix. Even if the pitch between the contact pins is narrow, contact between the contact pin side flange where the flange is high and the contact pin coil spring where the flange is low is prevented from contacting each other. As a result, adjacent contact pins do not contact each other.
[Brief description of the drawings]
1A and 1B are views showing a state in which contact pins according to an embodiment of the present invention are arranged in an IC socket, wherein FIG. 1A is a longitudinal sectional view, and FIG. 1B is a plan view of FIG.
FIG. 2 is a longitudinal sectional view in a direction different from FIG. 1A, showing a state in which the contact pins according to the embodiment are arranged in the IC socket.
FIG. 3 is a view showing a modification of the contact end portion of the contact member according to the embodiment.
FIG. 4 is a cross-sectional view of an IC socket and a circuit board showing a conventional example.
FIG. 5 is a cross-sectional view showing a contact pin showing the conventional example.
[Explanation of symbols]
21 Socket body
22 base
23 Floating plate (mounting part)
30, 40 Contact pin
31, 41 Contact member
31a, 41a Contact end
31b, 41b Insertion section
31c, 41c collar (locking part)
32, 42 Board conduction member
32e, 42e Wide part (locking part)
33 , 43 coil spring O axis

Claims (1)

A plurality of contact pins are arranged adjacent to each other across the base of the socket body and the mounting portion, and the upper end of the contact pin is brought into contact with the terminal of the electrical component mounted on the mounting portion, A socket for an electrical component in which a lower end of the contact pin is electrically connected to a printed circuit board,
  The contact pin is
  A contact member that is formed of a conductive plate material, and that is inserted from below into a through-hole provided in the mounting portion and protrudes upward, and a contact member that contacts the terminal of the electrical component;
  A board conductive member that is formed of a conductive plate material that is separate from the contact member, is inserted from above into a through-hole provided in the base, and has a lower end connected to the printed circuit board;
  By being spirally formed with a conductive wire, the upper end portion is locked to the collar portion formed on the contact member, and the lower end portion is locked to the locking portion formed on the substrate conductive member, A coil spring for energizing the contact member upward and electrically connecting the contact member and the substrate conducting member;
  The flange portion of the contact member is slidably accommodated in the slit portion formed on the lower surface side of the placement portion, thereby preventing the contact member from coming off from the placement portion,
  The flanges of the contact members adjacent to each other are arranged so that their heights are different from each other and the directions are alternately different in the vertical direction and the horizontal direction,
  An electrical component socket, wherein the contact member is pushed in contact with a terminal of the electrical component, whereby the contact member is displaced in an axial direction to obtain electrical conduction.

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