JP3968887B2 - heatsink - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat sink. More specifically, the present invention relates to a heat sink used for cooling an electronic component such as a semiconductor element.
[0002]
[Prior art]
A heat sink is used to cool heat generated from electronic components such as semiconductor elements. 2A and 2B are external views of a conventional heat sink, where FIG. 2A is a front view and FIG. 2B is a perspective view. The heat sink is usually made of a metal material having excellent thermal conductivity such as aluminum, and the base 11 has a mounting surface 12 for mounting an electronic component (not shown) to be cooled, as shown in the drawing, and the back side thereof is parallel to the back side. A plurality of fins 13 are formed to protrude. Heat generated from an electronic component such as a semiconductor element is radiated from the surface of the fin 13.
[0003]
[Problems to be solved by the invention]
However, since fins have a natural frequency that is a fixed frequency determined by physical properties such as length, elasticity, strength, and mass, a heat sink formed by projecting multiple fins from the base is used for audio equipment. For example, the fins resonate and vibrate according to the frequency of sound or the like. In this case, if there are a plurality of fins of the same shape on the base as in the prior art, these fins have the same natural frequency, so that the fins resonate with each other like a tuning fork to generate a large resonance sound, Become. Moreover, once it vibrates, it takes time to attenuate the vibration of the fin. As a result, the sound quality of speakers and the like is particularly impaired, and the reproduced sound is deteriorated.
[0004]
In order to cope with such a point, it has been proposed that the heights of the fins are different from each other, or the thickness of the fin is changed to vary the natural frequency of the fin. However, if the height of the fin is lowered, the heat radiation area is reduced, and if the fin thickness is increased, the fin interval is narrowed and air circulation for heat radiation is hindered, and the heat radiation effect of the fin is lowered.
[0005]
The present invention takes the above-described prior art into consideration, and an object thereof is to provide a heat sink that does not have the same natural frequency and does not generate resonance between fins while maintaining a sufficient heat dissipation effect.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, in the present invention, in an electronic component heat sink heat sink comprising a base and a plurality of fins projecting from the base in parallel and substantially the same length and height, each of the plurality of fins includes the above-described heat sink. A heat sink characterized in that continuous projecting thick ribs are integrally formed on both sides of the fin at positions different from the base, and the ends of the fins facing the base are open ends. provide.
[0007]
According to this configuration, since the ribs are formed at different positions of the fins, there are no fins having the same natural frequency, so that they do not resonate with each other. Further, since the fin is reinforced by the rib, the vibration of the fin is suppressed.
[0008]
In a preferred configuration example, the above SL rib is characterized in that which has been extruded together with the base and fins.
[0009]
According to this configuration, since the rib can be formed together with the extrusion forming of the heat sink, it can be easily formed.
[0010]
In order to achieve the above object, in the present invention, in the heat sink for heat dissipating an electronic component including a base and a plurality of fins protruding from the base in parallel with substantially the same length and height, each of the plurality of fins includes A heat sink is provided in which thick ribs having different natural vibration frequencies are integrally formed on both sides of the fin, and an end of each fin facing the base is an open end.
[0011]
According to this configuration, since the resonance frequency that is the frequency at the time of the resonance phenomenon is different, resonance can be prevented.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
1A and 1B show a heat sink according to an embodiment of the present invention, where FIG. 1A is a front view and FIG. 1B is a perspective view. The base 1 has a mounting surface 2 for mounting an electronic component such as a semiconductor element, and a plurality of fins 3 protrude from the back surface of the mounting surface 2. These are made of a metal material having excellent thermal conductivity such as aluminum, and heat generated from the electronic component is conducted from the base 1 to the fin 3 and is radiated from the surface (heat radiation surface) of the fin 3.
[0013]
In the present embodiment, continuous protruding ribs 4 are formed on the fins 3 at positions where the distances from the base 1 are different. The natural frequency of each fin 3 differs depending on the position of the rib 4 on the fin 3. Therefore, the resonance frequency that is the frequency at the time of the resonance phenomenon is also different. Therefore, mutual resonance is prevented. For example, f1 and f2 do not resonate because the resonance frequency of f2 is higher than that of f1 in FIG. As a result, when the heat sink according to the present invention is used in an audio device or the like, a large vibration sound due to resonance of a large number of fins is not generated, and sound quality from a speaker or the like is not harmed.
[0014]
Moreover, since the fin 3 is reinforced by the rib 4, the vibration of the fin 3 itself can also be suppressed. Further, since the rib 4 is extruded together with the base 1 and the fins 3, it can be easily formed when manufacturing.
[0015]
Moreover, since the rib 4 is shape | molded in the flow direction of the air for heat radiation, heat radiation efficiency does not fall. According to experiments, when the temperature of the present invention and the conventional heat sink were increased at 120 W and compared, there was no difference in the heat dissipation effect between the two.
[0016]
【The invention's effect】
As described above, in the present invention, each of the plurality of fins are integrally formed on both sides of the wall thickness ribs fins continuous projecting to a position where the distance from the base are different, each of the base facing Since the end of the fin is an open end, the fin having the same natural frequency can be eliminated without reducing the heat dissipation effect, and resonance can be prevented.
Further, the thickness ribs from forming one body on both sides of the fin, the thickness rib with extrusion of the heat sink can also be easily formed, Ru can improve the strength of the fin. In addition, the vibration of the fin can be suppressed.
As a result, when used in an audio device or the like , it is possible to prevent the deterioration of the sound quality of the speaker and the reproduction sound.
[0017]
Further, in the present invention, a plurality of fins are formed with thick ribs for different natural vibration frequencies on both sides of the fin, and the ends of the fins facing the base are open ends, so that heat is dissipated. Resonance of the fin can be prevented without reducing the effect .
As a result, when used in an audio device or the like, a large vibration sound due to resonance of a large number of fins is not generated, and sound quality from a speaker or the like is not harmed.
[Brief description of the drawings]
FIG. 1 shows a heat sink according to an embodiment of the present invention, in which (A) is a front view and (B) is a perspective view.
FIG. 2 shows a conventional heat sink, (A) is a front view, and (B) is a perspective view.
[Explanation of symbols]
1: Base, 2: Mounting surface, 3: Fin, 4: Rib

Claims (3)

In a heat sink for heat dissipating an electronic component comprising a base and a plurality of fins projecting from the base in parallel and substantially the same length and height,
Each of the plurality of fins is formed integrally with both sides of the fins with continuous protruding thick ribs at different positions from the base.
The heat sink according to claim 1, wherein an end of each fin facing the base is an open end. In a heat sink for heat dissipating an electronic component comprising a base and a plurality of fins projecting from the base in parallel and substantially the same length and height,
Each of the plurality of fins is formed integrally with both sides of the fin with a thick rib that varies the natural vibration frequency,
The heat sink according to claim 1, wherein an end of each fin facing the base is an open end. The heat sink according to claim 2, wherein the thick ribs are formed at different positions from the base by a plurality of fins.

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