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JP3958725B2 - Surface mount thin capacitor and manufacturing method thereof - Google Patents

Surface mount thin capacitor and manufacturing method thereof Download PDF

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Publication number
JP3958725B2
JP3958725B2 JP2003296811A JP2003296811A JP3958725B2 JP 3958725 B2 JP3958725 B2 JP 3958725B2 JP 2003296811 A JP2003296811 A JP 2003296811A JP 2003296811 A JP2003296811 A JP 2003296811A JP 3958725 B2 JP3958725 B2 JP 3958725B2
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anode
layer
anode terminal
anode body
impregnated tape
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JP2005072106A (en
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陽洋 川合
寿久 長沢
雄一 丸子
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Tokin Corp
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NEC Tokin Corp
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Description

本発明は、高分子を電解質として用いた固体電解コンデンサに関し、特に表面実装薄型コンデンサ及びその製造方法に関する。   The present invention relates to a solid electrolytic capacitor using a polymer as an electrolyte, and more particularly to a surface mount thin capacitor and a method for manufacturing the same.

従来、この種のコンデンサとしては、図4及び図5に示すものが知られている(以下、それぞれ従来技術1及び2と呼ぶ)。   Conventionally, as this type of capacitor, those shown in FIG. 4 and FIG. 5 are known (hereinafter referred to as the prior arts 1 and 2, respectively).

図4に示す従来技術1による固体電解コンデンサは、3端子伝送線路素子タイプと呼ばれている(例えば、特許文献1、参照)。この従来技術1による固体電解コンデンサは、導電性機能高分子膜12を固体電解質としており、弁作用金属の表面に陽極酸化皮膜層を形成して、弁作用金属の陽極体10とし、この陽極体10の陽極酸化被膜層表面中央部を覆うように、導電性機能高分子膜12を形成し、さらにその周囲にグラファイト層13を形成し、さらに、陰極層14として銀ペ−スト層を順次形成した後、レジスト16が形成された部分を介して、更に外側に延在する陽極体10の両端に陽極端子11を接合している。陰極層14(銀ペースト層)の上側の周囲を熱接着性樹脂含浸テープ15aで覆い、更に、その上側を、素子補強用金属板17で覆い、陰極層14(銀ペースト層)の下側の周囲を、熱接着性樹脂含浸テープ15bに孔部15cを設け、そこに導電ペースト19を充填後、陰極端子18を形成して表面実装型コンデンサとしている。   The solid electrolytic capacitor according to the prior art 1 shown in FIG. 4 is called a three-terminal transmission line element type (for example, see Patent Document 1). In this solid electrolytic capacitor according to the prior art 1, the conductive functional polymer film 12 is a solid electrolyte, and an anodic oxide film layer is formed on the surface of the valve action metal to form an anode body 10 of the valve action metal. The conductive functional polymer film 12 is formed so as to cover the center part of the surface of the anodic oxide coating layer 10, the graphite layer 13 is formed around the conductive polymer film 12, and the silver paste layer is sequentially formed as the cathode layer 14. After that, the anode terminal 11 is joined to both ends of the anode body 10 extending further outward through the portion where the resist 16 is formed. The upper periphery of the cathode layer 14 (silver paste layer) is covered with a heat-adhesive resin-impregnated tape 15a, and the upper side thereof is covered with an element reinforcing metal plate 17, and the lower side of the cathode layer 14 (silver paste layer) is covered. Around the periphery, a hole 15c is provided in a heat-adhesive resin-impregnated tape 15b, and after filling with a conductive paste 19, a cathode terminal 18 is formed to form a surface-mounted capacitor.

従来技術2による固体電解コンデンサは、陽極体20と陽極端子21が図5に示すように超音波溶着(溶接)のみで接続されている。
特開2002−313676号公報
In the solid electrolytic capacitor according to Prior Art 2, the anode body 20 and the anode terminal 21 are connected only by ultrasonic welding (welding) as shown in FIG.
JP 2002-313676 A

しかしながら、陽極端子21は、陽極体20との超音波溶着(溶接)のみの接続であり、陽極端子21と熱接着性絶縁樹脂含浸テープ25とは接続されていないため接続強度が弱い。仮に、熱接着性絶緑樹脂含浸テープ25を陽極体20より長くした場合、高温加圧硬化時に樹脂が、端子実装面側(陽極体接続面と反対側)に付着する可能性が高く、実装不良の原因となる。   However, the anode terminal 21 is connected only by ultrasonic welding (welding) to the anode body 20, and the connection strength is weak because the anode terminal 21 and the thermoadhesive insulating resin impregnated tape 25 are not connected. If the heat-adhesive green resin-impregnated tape 25 is longer than the anode body 20, the resin is likely to adhere to the terminal mounting surface side (opposite to the anode body connection surface) during high-temperature pressure curing. It causes a defect.

本発明の技術的課題は、陽極端子接続強度の向上が図れ、容易に積層ができ、高容量及び低ESR品の表面実装薄型コンデンサを提供することにある。   The technical problem of the present invention is to provide a surface mount thin capacitor of a high capacity and low ESR product that can improve the anode terminal connection strength and can be easily laminated.

本発明によれば、板状または箔状の弁作用を有する拡面化した金属を陽極体とし、導電性高分子層/グラファイト層/銀層を陰極層とする固体電解コンデンサにおいて、陽極体の両側を覆おうように断面コの字状に曲げ加工され、前記陽極体に接続するための一対の陽極端子と、前記陽極端子及び前記陽極体の上に貼り付けられた熱接着性絶縁樹脂含浸テープ及び金属板とを備え、前記熱接着性絶縁樹脂含浸テープ及び前記金属板を高温加圧硬化することで、前記陽極端子と前記熱接着性絶縁樹脂含浸テープとの接続がなされることを特徴とする表面実装薄型コンデンサが得られる。   According to the present invention, in a solid electrolytic capacitor having a plate-like or foil-like surface-enhanced metal having an anode body and a conductive polymer layer / graphite layer / silver layer as a cathode layer, A pair of anode terminals that are bent into a U-shaped cross-section so as to cover both sides, and connected to the anode body, and impregnated with a heat-adhesive insulating resin attached on the anode terminal and the anode body A tape and a metal plate are provided, and the anode terminal and the heat-adhesive insulating resin-impregnated tape are connected by curing the heat-adhesive insulating resin-impregnated tape and the metal plate at high temperature and pressure. A surface mount thin capacitor is obtained.

又、本発明によれば、板状または箔状の弁作用を有する拡面化した金属からなる第1及び第2の陽極体と、導電性高分子層/グラファイト層/銀層からなる陰極層を備えた固体電解コンデンサにおいて、前記第1及び第2の陽極体にそれぞれ接続するために、陽極体の両側を覆おうように断面コの字状に曲げ加工された第1及び第2の陽極端子対と、前記第1及び前記第2の陽極端子対及び前記陽極体に貼り付けられた熱接着性絶縁樹脂含浸テープと、前記熱接着性絶縁樹脂含浸テープの上側を覆う素子補強用金属板とを備え、前記熱接着性絶縁樹脂含浸テープ及び前記金属板を高温加圧硬化することで、前記陽極端子と前記熱接着性絶縁樹脂含浸テープとの接続がなされ、前記第1及び前記第2の陽極端子の曲げ加工された部分同士を、はんだ、導電ペースト、又はメッキ工法を用いて接続され、前記第1の陽極端子及び第1の陽極端子対を含む第1の層と前記第2の陽極端子及び第2の陽極端子対を含む第2の層が積層されることを特徴とする表面実装薄型コンデンサが得られる。   Further, according to the present invention, the first and second anode bodies made of an enlarged metal having a plate-like or foil-like valve action, and the cathode layer made of conductive polymer layer / graphite layer / silver layer In the solid electrolytic capacitor having the first and second anodes, the first and second anodes are bent into a U-shaped cross section so as to cover both sides of the anode body in order to connect to the first and second anode bodies, respectively. A terminal pair, a heat-adhesive insulating resin-impregnated tape affixed to the first and second anode terminal pairs and the anode body, and an element reinforcing metal plate covering an upper side of the heat-adhesive insulating resin-impregnated tape And connecting the anode terminal and the thermally adhesive insulating resin impregnated tape by high-temperature pressurizing and curing the thermally adhesive insulating resin impregnated tape and the metal plate, the first and second The bent parts of the anode terminals of However, the first layer including the first anode terminal and the first anode terminal pair, and the second layer including the second anode terminal and the second anode terminal pair are connected using a conductive paste or a plating method. A surface-mount thin capacitor characterized in that two layers are laminated is obtained.

さらに、本発明によれば、前記陽極端子を断面コの字状に折り曲げた状態で形成される凹部の厚みが前記陽極体の厚さよりも大きくなるように、かつ該陽極体を覆うように曲げ加工が施され、該曲げ加工された陽極端子の両凸部の一方と前記陽極体とに隙間をもたせ、その隙間に前記熱接着性絶緑樹脂含浸テープ層が形成されることを特徴とする表面実装薄型コンデンサが得られる。   Further, according to the present invention, the concave portion formed in a state where the anode terminal is bent in a U-shape is bent so as to be larger than the thickness of the anode body and to cover the anode body. A gap is formed between one of the convex portions of the bent anode terminal and the anode body, and the thermoadhesive green resin-impregnated tape layer is formed in the gap. A surface mount thin capacitor is obtained.

又、本発明によれば、板状または箔状の弁作用を有する拡面化した金属を陽極体とし、導電性高分子層/グラファイト層/銀層を陰極層とする固体電解コンデンサの製造方法において、陽極端子を前記陽極体に接続するために、前記陽極端子を断面コの字状に折り曲げた状態で形成される凹部の厚みが前記陽極体の厚さよりも大きくなるように、かつ該陽極体を覆うように曲げ加工を施す工程と、その上に熱接着性絶縁樹脂含浸テープ及び金属板を貼り付ける工程と、高温加圧硬化することにより陽極端子と熱接着性絶縁樹脂含浸テープとの接続を行う工程と、前記曲げ加工された陽極端子の両凸部の一方と前記陽極体との間の隙間に、前記熱接着性絶緑樹脂含浸テープ層を形成する工程を有することを特徴とする表面実装薄型コンデンサの製造方法が得られる。 According to the present invention, there is also provided a method for producing a solid electrolytic capacitor having a plate-like or foil-like surface-enhanced metal having an anode body and a conductive polymer layer / graphite layer / silver layer as a cathode layer. In order to connect the anode terminal to the anode body, the thickness of the recess formed in a state where the anode terminal is folded in a U-shaped cross section is larger than the thickness of the anode body, and the anode A step of bending so as to cover the body, a step of attaching a heat-adhesive insulating resin-impregnated tape and a metal plate thereon, and an anode terminal and a heat-adhesive insulating resin-impregnated tape by curing at high temperature and pressure. A step of connecting, and a step of forming the thermoadhesive green resin-impregnated tape layer in a gap between one of the convex portions of the bent anode terminal and the anode body , Of surface mount thin capacitors Production method can be obtained.

本発明に係る表面実装薄型コンデンサによれば、板伏、または箔状の弁作用を有する拡面化した金属を陽極体とする固体電解コンデンサにおいて陽極端子を接続する際、超音波溶着(溶接)により電気的接続が行なわれ、かつ、端子側面が陽極体を覆うように曲げ加工を行い、その上から熱接着性絶縁樹脂含浸テープが貼り付けられるため、陽極端子の接続強度を保つことができる。   According to the surface mount thin capacitor according to the present invention, ultrasonic welding (welding) is performed when connecting the anode terminal in a solid electrolytic capacitor having a plate-like or foil-like surface-enhanced metal having a valve action as an anode body. In this way, electrical connection is performed, and bending is performed so that the side surface of the terminal covers the anode body, and a heat-adhesive insulating resin-impregnated tape is applied thereon, so that the connection strength of the anode terminal can be maintained. .

又、本発明に係る表面実装薄型コンデンサによれば、前記陽極端子曲げ加工部をはんだ、導電ペースト、メッキ工法等を用いて陽極端子同士を接続することにより、複数個積層することができるため、高容量及び低ESR品の表面実装薄型コンデンサが提供できる。   Further, according to the surface mount thin capacitor according to the present invention, a plurality of the anode terminal bending portions can be laminated by connecting the anode terminals with each other using solder, conductive paste, plating method, etc. High-capacity and low-ESR surface-mount thin capacitors can be provided.

以下,本発明の実施の形態について図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図1は本発明の一実施の形態による固体電解コンデンサの断面図である。図1を参照して本発明の一実施の形態による表面実装薄型コンデンサについて説明する。まず弁作用金属の表面に陽極酸化皮膜層を形成して、弁作用金属の陽極体1が形成される。陽極体1の中央部周囲に陰極層4として銀ペ−スト層を形成した後、外側に延在する陽極体1の両端を覆うように陽極端子11を接続している。尚、陰極層4は導電性高分子層、グラファイト層、銀層からなり、陽極体1の上側面積分と下側面積分は陽極端子3の曲げ加工部と超音波溶着(溶接)により、強固に接続される。   FIG. 1 is a cross-sectional view of a solid electrolytic capacitor according to an embodiment of the present invention. A surface-mount thin capacitor according to an embodiment of the present invention will be described with reference to FIG. First, an anodic oxide film layer is formed on the surface of the valve metal, thereby forming the anode 1 of the valve metal. After forming a silver paste layer as the cathode layer 4 around the center of the anode body 1, anode terminals 11 are connected so as to cover both ends of the anode body 1 extending outward. The cathode layer 4 is composed of a conductive polymer layer, a graphite layer, and a silver layer, and the upper side surface integration and lower side surface integration of the anode body 1 are strengthened by bending the anode terminal 3 and ultrasonic welding (welding). Connected.

ここで、陽極端子3と陽極体1の接続方法について他の接続方法も可能である。例えば図2に示すように、陽極端子3を断面コの字状に折り曲げた状態で形成される凹部の厚み(図2の高さ方向の厚み)が陽極体1の厚さよりも大きくなるように折り曲げ加工するのである。その凹部を、陽極体1を覆う方向に曲げ加工を行い、さらに陰極層4を覆うようにその上より熱接着性絶縁樹脂含浸テープ5を貼り付け、その後更に素子補強用の金属板7を貼り付け高温加圧硬化する。これにより、熱接着性絶縁樹脂含浸テープ5は、(陽極体1・陰極層4のみならず)陽極端子3とも接着し、陽極体1と陽極端子3界面の剥離防止となる。   Here, the connection method of the anode terminal 3 and the anode body 1 can also be other connection methods. For example, as shown in FIG. 2, the thickness of the concave portion (thickness in the height direction in FIG. 2) formed in a state where the anode terminal 3 is bent in a U-shape is larger than the thickness of the anode body 1. It is bent. The concave portion is bent in a direction covering the anode body 1, and a heat-adhesive insulating resin-impregnated tape 5 is further applied thereon so as to cover the cathode layer 4, and then a metal plate 7 for element reinforcement is further attached. Apply and cure at high temperature and pressure. As a result, the heat-adhesive insulating resin-impregnated tape 5 adheres to not only the anode body 1 and the cathode layer 4 but also the anode terminal 3, thereby preventing peeling of the interface between the anode body 1 and the anode terminal 3.

ここで、図1の説明に戻る。陽極端子3を接続する際、陽極体1と陽極端子3とを超音波溶着(溶接)により電気的に接続し、かつ、陽極端子3の側面が陽極体1を覆うように曲げ加工を行い、その上から熱接着性絶縁樹脂含浸テープ5を貼り付ける。上記した陽極端子3の曲げ加工は図1(a)を参照するとわかるように断面コの字状に曲げ加工が施されている。さらに、その上から熱接着性絶縁樹脂含浸テープ5を貼り付けているので陽極端子3と陽極体1の接続強度が向上することは容易に理解できる。   Here, the description returns to FIG. When connecting the anode terminal 3, the anode body 1 and the anode terminal 3 are electrically connected by ultrasonic welding (welding), and bending is performed so that the side surface of the anode terminal 3 covers the anode body 1. A thermal adhesive insulating resin impregnated tape 5 is attached from above. The bending of the anode terminal 3 described above is performed in a U-shaped cross section as can be seen with reference to FIG. Furthermore, it can be easily understood that the connection strength between the anode terminal 3 and the anode body 1 is improved because the heat-adhesive insulating resin-impregnated tape 5 is stuck thereon.

さらに、陰極層4(銀ペースト層)の上側の周囲を熱接着性絶縁樹脂含浸テープ5で覆い、更に、その上側を、素子補強用金属板7で覆う。陰極層4(銀ペースト層)の下側の周囲に導電ペースト9を充填後、陰極端子8を形成して単層型の表面実装薄型コンデンサを得る。   Further, the upper periphery of the cathode layer 4 (silver paste layer) is covered with a heat-adhesive insulating resin-impregnated tape 5, and the upper side thereof is covered with an element reinforcing metal plate 7. After the conductive paste 9 is filled around the lower side of the cathode layer 4 (silver paste layer), the cathode terminal 8 is formed to obtain a single-layer surface-mount thin capacitor.

図3は本発明の他の実施の形態による固体電解コンデンサの断面図である。図3を参照して本発明の他の実施の形態による表面実装薄型コンデンサについて説明する。本発明の他の実施の形態は陽極端子曲げ加工部が2つ設けられているという点以外は前記一実施の形態と基本的に同じであるのでその部分に関しての説明は省略する。以下、異なる点について説明する。まず陽極端子曲げ加工部が2つ設けられ、はんだ、導電ペースト、メッキ工法等を用いて、陽極端子3a,3bを互いに接続して複数個積層する。さらに陰極層(銀ペースト層)4においても、導電ペースト9等で陰極層4同士を接続することにより、複数個の積層を行い、積層型の表面実装薄型コンデンサを得る。   FIG. 3 is a cross-sectional view of a solid electrolytic capacitor according to another embodiment of the present invention. A surface mount thin capacitor according to another embodiment of the present invention will be described with reference to FIG. The other embodiment of the present invention is basically the same as the above-described one embodiment except that two anode terminal bending portions are provided, and thus the description thereof is omitted. Hereinafter, different points will be described. First, two anode terminal bending portions are provided, and a plurality of anode terminals 3a and 3b are connected to each other and stacked using solder, conductive paste, plating method, or the like. Further, in the cathode layer (silver paste layer) 4, a plurality of layers are laminated by connecting the cathode layers 4 with the conductive paste 9 or the like to obtain a multilayer surface mount thin capacitor.

本発明に係る表面実装薄型コンデンサは、電子部品や電気部品のプリント配線基板等の基板に表面実装されるタイプの電気コンデンサに適用することができる。   The surface-mount thin capacitor according to the present invention can be applied to a type of electric capacitor that is surface-mounted on a substrate such as a printed wiring board of an electronic component or an electric component.

(a)は本発明の一実施の形態による固体電解コンデンサの陽極−陰極側断面図であり、(b)は(a)のA−A線断面図である。(A) is the anode-cathode side sectional drawing of the solid electrolytic capacitor by one embodiment of this invention, (b) is the sectional view on the AA line of (a). 陽極端子の折り曲げ加工の他の実施の形態を説明するための陽極−陰極側断面図である。It is an anode-cathode side sectional view for explaining other embodiments of bending processing of an anode terminal. 本発明のさらに他の実施の形態による固体電解コンデンサの陽極−陰極側断面図であり、(b)は(a)のA−A線断面図である。It is the anode-cathode side sectional drawing of the solid electrolytic capacitor by further another embodiment of this invention, (b) is the sectional view on the AA line of (a). 従来技術1による固体電解コンデンサを示す断面図である。It is sectional drawing which shows the solid electrolytic capacitor by the prior art 1. FIG. (a)は従来技術2による固体電解コンデンサを示す陽極−陰極側断面図であり、(b)は(a)のA−A線断面図である。(A) is the anode-cathode side sectional drawing which shows the solid electrolytic capacitor by the prior art 2, (b) is the sectional view on the AA line of (a).

符号の説明Explanation of symbols

1,1a,1b,10,20 陽極体
3,3a,3b,11,21 陽極端子
4,14 陰極層
5,5a,5b,15a,15b,25 熱接着性絶縁樹脂含浸テープ
7,17 素子補強用金属板
8,18 陰極端子
9,19 導電ペースト
12 導電性機能高分子膜
12d,13d,14d 両端
13 グラファイト層
16 レジスト
1, 1a, 1b, 10, 20 Anode body 3, 3a, 3b, 11, 21 Anode terminal 4, 14 Cathode layer 5, 5a, 5b, 15a, 15b, 25 Thermal adhesive insulating resin impregnated tape 7, 17 Element reinforcement Metal plate 8, 18 Cathode terminal 9, 19 Conductive paste 12 Conductive functional polymer film 12d, 13d, 14d Both ends 13 Graphite layer 16 Resist

Claims (4)

板状または箔状の弁作用を有する拡面化した金属を陽極体とし、導電性高分子層/グラファイト層/銀層を陰極層とする固体電解コンデンサにおいて、
陽極体の両側を覆おうように断面コの字状に曲げ加工され、前記陽極体に接続するための一対の陽極端子と、
前記陽極端子及び前記陽極体の上に貼り付けられた熱接着性絶縁樹脂含浸テープ及び金属板とを備え、
前記熱接着性絶縁樹脂含浸テープ及び前記金属板を高温加圧硬化することで、前記陽極端子と前記熱接着性絶縁樹脂含浸テープとの接続がなされることを特徴とする表面実装薄型コンデンサ。
In a solid electrolytic capacitor having a plate-like or foil-like surface-enhanced metal having an anode body as an anode body and a conductive polymer layer / graphite layer / silver layer as a cathode layer,
A pair of anode terminals that are bent into a U-shaped cross section so as to cover both sides of the anode body, and connected to the anode body;
A heat-adhesive insulating resin-impregnated tape and a metal plate attached on the anode terminal and the anode body,
A surface-mounting thin capacitor characterized in that the anode terminal and the thermally adhesive insulating resin impregnated tape are connected by curing the thermally adhesive insulating resin impregnated tape and the metal plate at a high temperature and pressure.
板状または箔状の弁作用を有する拡面化した金属からなる第1及び第2の陽極体と、導電性高分子層/グラファイト層/銀層からなる陰極層を備えた固体電解コンデンサにおいて、
前記第1及び第2の陽極体にそれぞれ接続するために、陽極体の両側を覆おうように断面コの字状に曲げ加工された第1及び第2の陽極端子対と、
前記第1及び前記第2の陽極端子対及び前記陽極体に貼り付けられた熱接着性絶縁樹脂含浸テープと、
前記熱接着性絶縁樹脂含浸テープの上側を覆う素子補強用金属板とを備え、
前記熱接着性絶縁樹脂含浸テープ及び前記金属板を高温加圧硬化することで、前記陽極端子と前記熱接着性絶縁樹脂含浸テープとの接続がなされ、
前記第1及び前記第2の陽極端子の曲げ加工された部分同士を、はんだ、導電ペースト、又はメッキ工法を用いて接続され、前記第1の陽極端子及び第1の陽極端子対を含む第1の層と前記第2の陽極端子及び第2の陽極端子対を含む第2の層が積層される
ことを特徴とする表面実装薄型コンデンサ。
In a solid electrolytic capacitor comprising first and second anode bodies made of a metal having a plate-like or foil-like valve action and a cathode layer made of a conductive polymer layer / graphite layer / silver layer,
First and second anode terminal pairs bent into a U-shaped cross section so as to cover both sides of the anode body in order to connect to the first and second anode bodies, respectively;
A heat-adhesive insulating resin-impregnated tape affixed to the first and second anode terminal pairs and the anode body;
An element reinforcing metal plate covering the upper side of the thermally adhesive insulating resin impregnated tape;
By connecting the anode terminal and the thermal adhesive insulating resin impregnated tape by high-temperature pressurizing and curing the thermal adhesive insulating resin impregnated tape and the metal plate,
The bent portions of the first and second anode terminals are connected to each other using a solder, a conductive paste, or a plating method, and include a first anode terminal and a first anode terminal pair. And a second layer including the second anode terminal and the second anode terminal pair.
前記陽極端子を断面コの字状に折り曲げた状態で形成される凹部の厚みが前記陽極体の厚さよりも大きくなるように、かつ該陽極体を覆うように曲げ加工が施され、該曲げ加工された陽極端子の両凸部の一方と前記陽極体とに隙間をもたせ、その隙間に前記熱接着性絶緑樹脂含浸テープ層が形成されることを特徴とする請求項1又2記載の表面実装薄型コンデンサ。   Bending is performed so that the thickness of the concave portion formed in a state where the anode terminal is bent in a U-shaped cross section is larger than the thickness of the anode body, and the anode body is covered. 3. The surface according to claim 1, wherein a gap is formed between one of the convex portions of the anode terminal and the anode body, and the thermoadhesive green resin impregnated tape layer is formed in the gap. Mounting thin capacitor. 板状または箔状の弁作用を有する拡面化した金属を陽極体とし、導電性高分子層/グラファイト層/銀層を陰極層とする固体電解コンデンサの製造方法において、
陽極端子を前記陽極体に接続するために、前記陽極端子を断面コの字状に折り曲げた状態で形成される凹部の厚みが前記陽極体の厚さよりも大きくなるように、かつ該陽極体を覆うように曲げ加工を施す工程と、
その上に熱接着性絶縁樹脂含浸テープ及び金属板を貼り付ける工程と、
高温加圧硬化することにより陽極端子と熱接着性絶縁樹脂含浸テープとの接続を行う工程と、
前記曲げ加工された陽極端子の両凸部の一方と前記陽極体との間の隙間に、前記熱接着性絶緑樹脂含浸テープ層を形成する工程
を有することを特徴とする表面実装薄型コンデンサの製造方法。
In a method for producing a solid electrolytic capacitor having a plate-like or foil-like surface-enhanced metal having an anode body and a conductive polymer layer / graphite layer / silver layer as a cathode layer,
In order to connect the anode terminal to the anode body, the thickness of the concave portion formed in a state where the anode terminal is folded in a U-shape is larger than the thickness of the anode body, and the anode body is A process of bending to cover,
A step of attaching a heat-adhesive insulating resin impregnated tape and a metal plate thereon,
A step of connecting the anode terminal and the thermally adhesive insulating resin-impregnated tape by high-temperature pressure curing;
A surface mount thin capacitor comprising a step of forming the thermoadhesive green resin impregnated tape layer in a gap between one of both convex portions of the bent anode terminal and the anode body Production method.
JP2003296811A 2003-08-20 2003-08-20 Surface mount thin capacitor and manufacturing method thereof Expired - Fee Related JP3958725B2 (en)

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