JP3832460B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components such as flip chips on a substrate.

Along with the advancement of the required position accuracy when mounting electronic components on a substrate, a method of correcting the positional deviation between the electronic component and the substrate at the time of mounting by image recognition has been widely used. As such an electronic component mounting device, it has a front / back reversing device that takes out an electronic component from a supply unit, reverses it, and transfers it to a predetermined delivery position, and a mounting head that receives the electronic component that has been reversed and mounted on a substrate. The thing of the structure which was comprised is known (for example, refer patent document 1).
Japanese Patent No. 2725701

  In recent years, miniaturization of electronic devices has progressed, and higher positioning accuracy is required in electronic component mounting apparatuses. However, in the above-described prior art, no consideration has been given to a position error at the time of taking out from the supply unit, a position shift that occurs in the middle of transfer, and the like. For this reason, when electronic components are received by the mounting head, they are delivered in a misaligned state, preventing problems caused by positional accuracy such as instability of the component holding state caused by misalignment of the electronic components during the mounting operation. It was difficult to do.

  Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of delivering electronic components with high positional accuracy.

  An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that receives an electronic component taken out by a take-out transfer head and mounts it on a substrate, and supplies the electronic component to the take-out transfer head at a predetermined supply position. A supply unit, a substrate holding unit for holding a substrate on which the electronic component is mounted, an electronic component is taken out from the supply position by the take-out transfer head and transferred to a receiving position for the electronic component. A take-out and transfer means that performs a take-out and transfer operation that reverses the front and back, a mounting head drive mechanism that drives the mounting head, and a take-out and transfer head imaging means that images the electronic components held by the take-out and transfer head during the take-out and transfer operation The take-out transfer means is provided at a predetermined position in a specific positional relationship with the take-out transfer head. The position detection mark that can be imaged by the take-out and transfer head imaging means, and the electronic component and position detection mark that are obtained by recognizing the imaging results of the electronic component and the position detection mark by the take-out and transfer head imaging means. Receiving for positioning the mounting head relative to the electronic component held by the take-out and transfer head at the receiving position by controlling the take-out transfer means and / or the mounting head drive mechanism based on the position detection result. Positioning control means.

The electronic component mounting method of the present invention is an electronic component mounting method in which an electronic component is taken out from a supply position of a supply unit by a take-out transfer head and transferred to a receiving position of the electronic component, and the electronic component is received by a mounting head and mounted on a substrate. An electronic component is taken out from the supply position by the take-out and transfer head and transferred to the receiving position of the electronic component, and a take-out and transfer step for performing the take-out and transfer operation of reversing the electronic component in the transfer process, and the take-out and transfer operation In the middle of the process, an electronic component held by the take-out and transfer head is taken out by the take-out and transfer head imaging means, and the take-out and transfer head provided with the take-out and transfer head is in a specific positional relationship with the take-out and transfer head. Take out the position detection mark provided at the predetermined position and image the transfer head A position detection mark imaging step for imaging by a stage, and a position detection step for detecting the positions of the electronic component and the position detection mark by recognizing the imaging results of the take-out and transfer head imaging step and the position detection mark imaging step; Based on the position detection result, by controlling the take-out transfer means and / or the mounting head drive mechanism that drives the mounting head, the mounting head is taken out at the receiving position with respect to the electronic component held by the transfer head. A receiving positioning step of relatively positioning the electronic component and a component receiving step of receiving the positioned electronic component by the mounting head at the receiving position.

  According to the present invention, a position detection mark is provided at a predetermined position in a specific positional relationship with the take-out and transfer head in the take-out and transfer means, and the electronic component and the position detection mark held on the take-out and transfer head during the take-out and transfer operation At the time of parts delivery, the position of the electronic component and the position detection mark is detected by taking out the image by the take-out and transfer head imaging means, and the relative position between the take-out and transfer head and the mounting head is adjusted based on the position detection result. The positional accuracy can be improved.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a partial front view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. 4 is a side view of the electronic component mounting apparatus, FIG. 4 is a partial perspective view of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 5 is a functional block showing processing functions of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 6 is an explanatory diagram of the configuration of the mark jig in the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 7 is a flowchart of the precenter recognition position correction process in the electronic component mounting method according to the embodiment of the present invention. FIG. 8 is a flowchart of pre-center recognition camera pixel rate calculation processing in the electronic component mounting method according to the embodiment of the present invention.

  First, the configuration of the electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a supply unit 2 is disposed on the upper surface of the base unit 1. The supply unit 2 is configured by mounting a chip holding unit 4 on an upper surface of a chip holding unit moving table 3 having a structure in which a linear motion table is combined. The chip holding unit 4 holds a wafer sheet 5 on which a large number of chips 6 that are electronic components are attached.

  The chip 6 is a chip with bumps on which bumps for external connection are formed, and the lower surface side is attached to the wafer sheet 5 with the bump formation surface facing upward. By driving the chip holding unit moving table 3, the chip holding unit 4 moves in a horizontal plane together with the chips 6 attached to the wafer sheet 5.

  A base 7 is disposed at a position adjacent to the supply unit 2 on the base 1, and a substrate holding unit moving table 8 is disposed on the top plate 7 a of the base 7. The substrate holding unit moving table 8 is a combination of linear motion tables, and a substrate holding unit 9 for holding a substrate 10 on which the chip 6 is mounted is mounted on the upper surface. By driving the substrate holding part moving table 8, the substrate holding part 9 moves in the horizontal plane together with the held substrate 10.

A chip take-out and transfer mechanism 15 (take-out and transfer means) held on the top plate 7 a is disposed above the supply unit 2 so as to protrude above the chip holder 4. The chip take-out and transfer mechanism 15 is a rotary type chip take-out unit in which a plurality (three in this case) of take-out and transfer heads 16 are arranged radially around a horizontal rotation shaft so as to be rotatable. The supply unit 2 supplies the chip 6 in a posture in which the bump forming surface is directed upward to the take-out and transfer head 16 at a predetermined supply position.

  That is, the chip take-out transfer mechanism 15 transfers the chip 6 taken out from the supply position of the supply unit 2 by the take-out transfer head 16 in the downward posture to the receiving position by the mounting head 14 described below, When the transfer head 16 rotates about the rotation axis, the posture of the chip 6 is reversed so that the bump forming surface faces downward.

  Side frames 11a and 11b are erected on the back side of the supply unit 2 and on the base 7, respectively, and the upper portions of the side frames 11a and 11b are connected by a top plate 11c. A mounting mechanism 12 having a mounting head 14 is provided between the side frame 11a and the side frame 11b. The mounting head 14 is horizontally mounted by a mounting head moving table 13 installed between the side frames 11a and 11b. It moves and rotates in the θ direction around the vertical axis by the mounting head rotating mechanism 14a.

  The chip 6 taken out from the supply unit 2 by the take-out transfer head 16 and transferred to the above-described receiving position and turned upside down is received by the mounting head 14 in a face-down posture with the bump forming surface facing downward. Then, the mounting head 14 that has received the chip 6 moves onto the substrate 10 held by the substrate holding unit 9, and the mounting head 14 performs a mounting operation, whereby the chip 6 is mounted on the substrate 10 in a face-down posture. The

  A component imaging unit 17 is provided on the side frame 11a so as to extend to the side surface of the chip take-out and transfer mechanism 15. When the chip 6 is taken out from the supply unit 2 by the take-out and transfer head 16 as will be described later, After the chip 6 is received by the mounting head 14, the component imaging unit 17 images the chip 6 and recognizes the position.

  Next, the detailed structure of each part will be described with reference to FIG. 2, FIG. 3, and FIG. First, the structure of the chip removal / transfer mechanism 15 will be described. As shown in FIG. 3, the take-out and transfer head base member 20 is held on the upper surface of the top plate 7a via a bracket 19 so as to be rotatable around a horizontal rotation shaft 20a. The take-out and transfer head base member 20 is driven via a transmission belt 18b by a motor 18a of a take-out and transfer head base rotation mechanism 18 (see FIG. 5) as rotation driving means, and stops at a predetermined index position or at a rotation stop position. It can be rotated in any operation pattern including fine adjustment.

  The take-out and transfer head base member 20 is provided with three take-out and transfer heads 16 and one mark holding portion 28. The take-out and transfer heads 16 are radially arranged at three equal positions around the rotation axis 20a, and the take-out and transfer head lifting / lowering mechanism 16a causes the head axis directions (normal direction of the take-out and transfer head base member 20). ) And can be rotated around the head axis. Each take-out and transfer head 16 has a suction nozzle at the tip, and the chip 6 is sucked and held by the suction nozzle.

  The mark holding portion 28 is mounted separately from the take-out and transfer head 16 at a position that forms a fixed angle α with the axis of one take-out and transfer head 16 in the take-out and transfer head base member 20, that is, at a predetermined position in a specific positional relationship. The mark holding unit 28 holds a mark jig 27 shown in FIG. The mark jig 27 held by the mark holding unit 28 can be imaged by a take-out and transfer head imaging means described later. 1 and 4, the mark holding unit 28 is not shown.

As shown in FIG. 6, the mark jig 27 has a configuration in which a square frame mark M is deposited on a transparent glass plate, and diagonal points A, B, C, and D of the mark M are characteristic points. Diagonal point A ~
Dimensions between B and between B and C (distance between feature points) are known. The mark portion may be vapor-deposited and the background transparent, or the mark portion may be transparent and the background vapor-deposited. Of course, you may form a mark by methods other than vapor deposition.

  By capturing the mark M and recognizing the diagonal points A, B, C, and D as feature points, the position of the center point P of the mark jig 27 can be obtained. Further, the number of pixels on the image between the diagonal points A and B and between B and C is obtained, and this is compared with the distance between the feature points described above, thereby obtaining a pixel that is a conversion rate between the unit pixel size and the actual size. The rate can be determined. That is, the mark jig 27 serves as a position detection mark for detecting the position of the mark holding unit 28 and also serves as a calibration mark for obtaining the pixel rate of the take-out and transfer head imaging means.

  When the mark jig 27 is attached to the mark holding portion 28, the mark jig 27 is attached via a spacer corresponding to the thickness of the corresponding chip 6. That is, the imaging distance is adjusted so that the distance from the pre-center recognition camera 23 to the mark jig 27 is always equal to the distance to the imaging surface of the chip 6. Thereby, even when the thicknesses of the chips 6 held by the take-out and transfer head 16 are different, there is no focus shift of the pre-center recognition camera 23, and the difference in image size caused by the difference in thickness is corrected by the pixel rate. Can do.

  In the above example, the mark holding unit 28 is provided separately from the take-out and transfer head 16. However, one of the plurality of take-out and transfer heads 16 is held by suction and used as a mark holding unit. Also good. This configuration can similarly correct the rotation error of the take-out and transfer head base member 20, but in this case, the original function of the take-out and transfer head 16 diverted for holding the mark is stopped. It is desirable to provide a part.

  As shown in FIGS. 2 and 3, in the state where the take-out and transfer head 16 is positioned in the vertically downward direction, the take-out and transfer head 16 is located at a predetermined supply position [A] set in the supply unit 2. The take-out and transfer head 16 is lowered by the take-up and transfer head raising / lowering / rotating mechanism 16a, and vacuum suction is performed from the suction nozzle, whereby the take-out and transfer head 16 holds the bump forming surface of the chip 6 on the wafer sheet 5 by vacuum suction. In this state, the chip 6 is taken out from the supply unit 2 by raising the take-out transfer head 16.

  Thus, the take-out and transfer head 16 holding the chip 6 is rotated 60 degrees counterclockwise, so that the take-out and transfer head 16 moves to the chip presence / absence detection position [B]. A chip presence / absence detection sensor 26 is disposed outside the chip presence / absence detection position [B], and the chip presence / absence detection sensor 26 detects the presence / absence of the chip 6 in the suction nozzle of the take-out transfer head 16.

  The position rotated further 60 degrees counterclockwise from the chip presence / absence detection position [B] is the pre-center recognition position [C]. A pre-center recognition camera 23 is disposed outside the pre-center recognition position [C] (see also FIG. 4). The pre-center recognition camera 23 takes an image of the chip 6 held by the take-out transfer head 16, and also has a mark holding unit. The mark jig 27 held by 28 is imaged.

  That is, the pre-center recognition camera 23 serves as a take-out head imaging unit that takes an image of the chip 6 held by the take-out / transfer head 16 during the take-out / transfer operation. By recognizing the imaging result, the position of the chip 6 held by the take-out and transfer head 16 is recognized, and the position of the mark jig 27 held by the mark holding unit 28 is specified. The current position of the take-out and transfer head 16 in a specific positional relationship with the mark holding unit 28 is detected.

  When the take-out / transfer head 16 is imaged by the pre-center recognition camera 23, the chip take-out / transfer mechanism 15 is driven based on the position detection result of the mark jig 27, and the take-out / transfer head 16 is moved to the pre-center during the take-out / transfer operation. The camera is moved to an imaging position by the recognition camera 23. As a result, the rotation error of the take-out and transfer head base member 20 that is rotationally driven by the transmission belt 18b with low transfer accuracy can be detected and the rotation error can be corrected, and the stop position accuracy of the take-out and transfer head 16 can always be high. Can keep.

  A position rotated 60 degrees counterclockwise from the pre-center recognition position [C], that is, a position in the vertically upward direction is a receiving position [D] where the mounting head 14 receives the chip 6 from the take-out transfer head 16. The mounting head 14 receives the chip 6 held by the take-out and transfer head 16 in a face-down posture by raising and lowering the take-out and transfer head 16 while the take-out and transfer head 16 holding the chip 6 is positioned upward. Note that the chip 6 may be received by moving the mounting head 14 up and down.

  In the chip receiving operation by the mounting head 14, based on the position detection result of the chip 6 at the pre-center recognition position [C], the chip take-out transfer mechanism 15, the mounting head driving mechanism (the mounting head moving table 13, the mounting head rotating mechanism 14a). In addition, the relative positioning of the chip 6 and the mounting head 14 is performed by controlling the mounting head lifting mechanism. That is, by fine adjustment of the rotation stop position of the take-out transfer head base member 20 in the X direction, by the movement of the mounting head 14 by the mounting head moving table 13 in the Y direction, and by the mounting head rotating mechanism 14a in the θ direction. , Alignment in each direction is performed.

  The relative positioning between the chip 6 and the mounting head 14 at the receiving position [D] is, in other words, the position recognition result of the chip 6 at the pre-center recognition position [C] and the position detection mark held by the mark holding unit 28. This is performed by controlling the chip take-out transfer mechanism 15 and the mounting head drive mechanism based on the position recognition result.

  Next, the component imaging unit 17 will be described. As shown in FIG. 4, a supply unit recognition camera 21 and a mounted head recognition camera 22 are arranged in the component imaging unit 17 in a posture in which the imaging optical axis is horizontal, and the supply unit recognition camera 21 and the mounted head recognition camera 22 are arranged. Is a fixed focus camera, and includes a supply portion imaging optical system 21a and a mounting head imaging optical system 22a each extending horizontally to the side surface of the take-out transfer head base member 20. The supply unit imaging optical system 21a and the mounted head imaging optical system 22a are both L-type imaging optical systems having a function of refracting the imaging optical axis from the imaging port at right angles.

  The imaging port (supply unit imaging port 21b) of the supply unit imaging optical system 21a is positioned vertically above the supply position [A], and causes the imaging light from the supply position [A] to enter the supply unit recognition camera 21. Accordingly, the supply unit recognition camera 21 images the chip 6 positioned at the supply position [A] on the wafer sheet 5 of the supply unit 2 from above. The supply unit recognition camera 21 and the supply unit imaging optical system 21 a constitute a supply unit imaging unit that images the chip 6 of the supply unit 2. The supply portion imaging means picks up the chip 6 at the supply position in a state where all of the three take-out transfer heads 16 are rotated from the supply position [A]. It is performed in a state where it is moved to a position that does not interfere with the above.

The imaging port (mounted head imaging port 22b) of the mounted head imaging optical system 22a is positioned vertically below the receiving position [D] with the imaging direction facing upward, and mounts imaging light from the receiving position [D]. Incident light is incident on the head recognition camera 22. Thereby, the mounting head recognition camera 22 images the chip 6 held by the mounting head 14 at the receiving position [D]. The mounted head recognition camera 22 and the mounted head imaging optical system 22a constitute a mounted head imaging means. The imaging of the chip 6 by the mounting head imaging means does not disturb the imaging of the chip 6 by the mounting head imaging means, in which all of the three take-out transfer heads 16 are rotating from the receiving position [D]. It is performed in the state moved to the position.

  In the above-described configuration, the supply unit imaging optical system 21a and the mounted head imaging optical system 22a are positioned so as to overlap each other because the supply position [A] and the receiving position [D] are on the same vertical line. . That is, the supply unit imaging unit and the mounting head imaging unit are arranged so that the respective imaging ports overlap in the vertical direction. As a result, two recognition means for recognizing the chip 6 at two different positions can be arranged one above the other, and compared with a conventional device in which the two recognition means are arranged in parallel, Can be made compact.

  Next, the mounting head 14 will be described. As shown in FIG. 4, the mounting head 14 is mounted on the moving base 13 a, and the moving base 13 a is horizontally moved in the Y direction by the mounting head moving table 13. The mounting head 14 can be rotated around the head axis by a mounting head rotating mechanism 14a, and can be moved up and down by a built-in mounting head lifting mechanism. The mounting head 14 that has received the chip 6 from the take-out and transfer head 16 at the receiving position [D] moves onto the substrate 10 held by the substrate holding unit 9 by the mounting head moving table 13, and the chip 6 held here is transferred to the substrate. 10 is installed.

  A substrate recognition camera 24 is disposed at a fixed position above the substrate holding unit 9. The board recognition camera 24 is a fixed focus position camera, and includes a board imaging optical system 24a with the imaging direction extending in the horizontal direction downward. The substrate imaging optical system 24 a is positioned above the substrate 10 by moving the substrate 10 to the imaging position by the substrate recognition camera 24 by the substrate holding unit moving table 8. In this state, the board recognition camera 24 takes an image of the board 10 to pick up an image of the mounting point [E] of the chip 6 on the board 10 and recognizes the position of the mounting point [E] by recognizing the imaging result. Is done.

  In the mounting operation of the chip 6 on the substrate 10 by the mounting head 14, the position recognition result of the mounting point [E] of the substrate 10 thus obtained and the chip 6 are imaged by the mounting head recognition camera 22. The chip 6 is positioned relative to the substrate 10 based on the obtained position recognition result of the chip 6. This positioning is performed by moving the substrate 10 by the substrate holding unit moving table 8 in the XY directions and moving the mounting point [E] to a position just below the mounting position by the mounting head 14, and in the θ direction, This is performed by rotating the mounting head 14 by θ by the head rotating mechanism 14a.

  Next, the processing function of the control system of the electronic component mounting apparatus will be described with reference to FIG. The supply unit recognition camera 21, the pre-center recognition camera 23, the mounted head recognition camera 22, and the board recognition camera 24 are respectively a first component recognition unit 31, a second component recognition unit 32, a third component recognition unit 33, and a board recognition. Connected to the unit 34. The first component recognizing unit 31, the second component recognizing unit 32, the third component recognizing unit 33, and the substrate recognizing unit 34 are a supply unit recognizing camera 21, a pre-center recognizing camera 23, a mounted head recognizing camera 22, and a substrate recognizing unit, respectively. Image processing is performed on imaging data obtained by the camera 24 to recognize the position of the imaging target.

  Recognition results obtained by the first component recognition unit 31, the second component recognition unit 32, the third component recognition unit 33, and the board recognition unit 34 are sent to the control unit 30. The control unit 30 is provided with a control program for receiving these recognition results and outputting a positioning command necessary for each drive mechanism. By executing these control programs, the positioning control described below is performed. Done.

  Hereinafter, each recognition target item will be described individually. The recognition result of the chip 6 on the wafer sheet 5 by the first component recognition unit 31 is sent to the first positioning control means 35. The first positioning control unit 35 takes out the chip 6 based on the recognition result of the chip 6 at the supply position [A] and moves it relative to the transfer head 16 (X1), (Y1). , (Θ1) is calculated.

  Of these movement amounts, (X1) and (Y1) are output to the drive circuit 41. Then, the driving circuit 41 drives the chip holding unit moving table 3 based on the movement amounts (X1) and (Y1) and the control command from the control unit 30 to perform alignment in the XY directions. The movement amount (θ1) is output to the drive circuit 42. Then, the drive circuit 42 drives the take-out and transfer head elevating / rotating mechanism 16a based on the movement amount (θ1) and the control command from the control unit 30, thereby performing alignment in the θ direction as necessary. That is, the first positioning control unit 35 and the chip holding unit moving table 3 are arranged on the take-out and transfer head 16 on the basis of the position detection result of the chip 6 obtained by recognizing the imaging result of the supply unit imaging unit. A take-out positioning means for relatively positioning the chip 6 is configured.

  The recognition result by the second component recognition unit 32 is sent to the second positioning control means 36 and the calculation unit 37. The second positioning control means 36 is held by the take-out and transfer head 16 at the receiving position [D] based on the data indicating the amount of displacement of the chip 6 held by the take-out and transfer head 16 at the pre-center recognition position [C]. Data indicating movement amounts (X2), (Y2), and (θ2) when the chip 6 in the state is positioned relative to the mounting head 14 is output.

  The calculation unit 37 holds the mark jig 27 held by the mark holding unit 28 by the second component recognition unit 32 by recognizing the imaging result obtained by imaging the mark jig 27 by the pre-center recognition camera 23, thereby holding the mark jig 28. The position of the center point P of the mark jig 27 is detected, and calculation processing for calculating the pixel rate from the image detection result of the mark jig 27 is performed. The calculation unit 37 is a pixel rate calculation unit that calculates the pixel rate of the take-out and transfer head imaging unit based on the imaging result of the mark jig 28 that also serves as a calibration mark.

  The calculation unit 37 is connected to the storage unit 39, and the position recognition processing program and the pixel rate calculation program stored in the program storage unit 39a are executed in the calculation process by the calculation unit 37. The pixel rate, pre-center recognition position, and deviation amount obtained by the calculation are stored in the data storage unit 39b. When calculating the movement amounts (X2), (Y2), and (θ2) by the second positioning control means 36, the calculation unit 37 calculates the pixel rate, precenter recognition position, and positional deviation amount stored in the data storage unit 39b. Is transmitted to the second positioning control means 36.

  Of the movement amounts (X2), (Y2), and (θ2), the movement amount (X2) is sent to the drive circuit 43, the movement amount (Y2) is output to the drive circuit 45, and the movement amount (θ2) is further driven. It is output to the circuit 46. The drive circuit 43 drives the take-out and transfer head base rotation mechanism 18 based on the movement amount (X2) and the control command from the control unit 30, so that the rotation stop position of the take-out and transfer head base member 20 is slightly changed according to the shift amount. This adjusts the position in the X direction. Then, the drive circuits 45 and 46 drive the mounting head moving table 13 and the mounting head rotating mechanism 14a based on the movement amounts (Y2) and (θ2), respectively, thereby performing alignment in the Y direction and θ direction.

Therefore, the second positioning control means 36 and the calculation unit 37 recognize the chip 6 and the position detection obtained by recognizing the imaging result of the chip 6 and the mark jig 27 which is a position detection mark by the take-out and transfer head imaging means. By controlling the take-out transfer means and / or the mounting head drive mechanism on the basis of the position detection result of the mark for use, the mounting head 14 is removed relative to the chip 6 held by the taking-out head 16 at the receiving position [D]. The receiving positioning control means for positioning to the position is configured.

  Next, among the recognition results of the third component recognition unit 33, the position recognition information of the chip 6 held by the mounting head 14 is sent to the third positioning control means 38. The recognition result of the mounting point [E] of the substrate 10 is also sent from the substrate recognition unit 34 to the third positioning control means 38. The third positioning control means 38 adds the positional deviation of the chip 6 with respect to the mounting head 14 and the positional deviation of the mounting point [E] of the substrate 10, and moves when the mounting head 14 mounts the chip 6 on the substrate 10. Data of the quantities (X3), (Y3), and (θ3) are output.

  The movement amounts (X3) and (Y3) in the X direction and the Y direction are sent to the drive circuit 44, and the movement of the substrate holding unit is performed based on the data of the movement amounts (X3) and (Y3) and the control command from the control unit 30. The table 8 is driven. Further, the moving amount (θ3) in the θ direction is output to the drive circuit 46, and the mounted head rotating mechanism 14a is driven based on the data of the moving amount (θ3) and a control command from the control unit 30. A control command from the control unit 30 is output to the drive circuit 47, and the mounting head lifting mechanism 25 is driven in accordance with this driving command, so that the mounting head 14 moves up and down with respect to the substrate 10 on the substrate holding unit 9.

  Therefore, the third positioning control means 38, the board holding unit moving table 8, and the mounting head rotating mechanism 14a are held by the mounting head 14 based on the board recognition result by the board recognition means and the component recognition result by the mounting head recognition means. A mounting positioning means for positioning the chip 6 relative to the substrate 10 held by the substrate holder 9 is configured.

  An electronic component mounting method by the electronic component mounting apparatus having the above configuration will be described. In this electronic component mounting method, the chip 6 is taken out from the supply position of the supply unit 2 by the transfer head 16, received by the mounting head 14, and held on the upper surface of the substrate holding unit 9 at the substrate recognition height. It is mounted on the substrate 10.

  In the electronic component mounting method, the chip 6 is taken out from the supply position [A] by the take-out and transfer head 16 and transferred to the receiving position [D], and in the transfer process, the chip 6 is turned upside down. A take-out and transfer step, a take-out and transfer head imaging step in which the chip 6 held by the take-out and transfer head 16 is imaged by the pre-center recognition camera 23 in the middle of the take-out and transfer step, and a mark jig 27 held by the mark holding unit 28 The chip 6 and the mark jig are recognized by recognizing the imaging results of the position detection mark imaging process for imaging the (position detection mark) by the pre-center recognition camera 23, the take-out transfer head imaging process, and the position detection mark imaging process. Based on the position detection process for detecting each of the 27 positions and the position detection result, A receiving positioning step of positioning the mounting head 14 at the receiving position [D] relative to the chip 6 held by the transporting head 16 by controlling the pop-up picking / transferring mechanism 15 and / or the mounting head driving mechanism. And a component receiving step of receiving the positioned chip 6 by the mounting head 14 at the receiving position [D].

  Next, in the electronic component mounting method described above, pre-center recognition position correction processing when the take-out transfer head 16 is moved to the pre-center recognition position [C]. This will be described with reference to the flow of FIG. First, the take-out transfer head base rotation mechanism is rotationally driven to move the mark holding unit 28 with the pre-center recognition position [C] as a target (ST1). When the mark holding unit 28 reaches the pre-center recognition position [C], the mark jig 27 is imaged by the pre-center recognition camera 23 (ST2).

  Next, the imaging result is subjected to image processing, thereby calculating a deviation amount between the precenter recognition position [C] and the center point P of the mark jig 27 (ST3), and storing the calculated deviation amount in the data storage unit 39b ( ST4). Then, the take-out transfer head 19 is moved to the pre-center recognition position [C] by correcting the shift amount and rotationally driving the take-out transfer head base rotation mechanism (ST5).

  Next, with reference to FIG. 8, the pre-center recognition camera pixel rate calculation processing for calculating the pixel rate used for the recognition processing by the pre-center recognition camera 23 will be described with reference to FIG. First, the mark holding unit 28 is moved to the pre-center recognition position [C] (ST10). Next, the mark jig 27 is imaged by the pre-center recognition camera 23 (ST11).

  Then, by performing image processing on the imaging result, the pixel rate is calculated based on the number of pixels between the two feature points of the mark M and the actual distance (pixel rate calculating step) (ST12). Next, the obtained pixel rate is stored in the data storage unit 39b (ST13). When the chip 6 is recognized by the second component recognition unit 32, position detection is performed based on this pixel rate.

  As described above, in the electronic component mounting apparatus shown in the present embodiment, the mark holding portion 28 is provided at a predetermined position that is in a specific positional relationship with the take-out and transfer head 12 in the take-out and transfer head base member 20, and the take-out and transfer operation is performed. On the way, the mark jig 27 mounted on the mark holding unit 28 and the chip 6 held on the take-out and transfer head 16 are imaged by the pre-center recognition camera 23, and the positions of the mark jig 27 and the chip 6 are detected. Based on the detection result, the relative position of the take-out transfer head 16 and the mounting head 14 is adjusted.

  As a result, when the chip 6 is received by the mounting head 14, the chip 6 can be stably received in a normal state without positional deviation, and the position of the component holding state is unstable due to the positional deviation of the electronic component in the mounting operation. Problems due to accuracy can be prevented.

  Further, the mark jig 27 mounted on the mark holding unit 28 is imaged by the pre-center recognition camera 23, the position of the mark jig 27 is detected, and the take-out transfer head base rotation mechanism 18 is driven based on the detection result. Therefore, the positioning error of the take-out and transfer head 16 due to the extension of the transmission belt 18b or the like can be corrected. As a result, the take-out and transfer head 16 can be accurately positioned with respect to the chip 6 positioned on the chip holding unit 4, and the chip 6 can be reliably picked up.

  INDUSTRIAL APPLICABILITY The electronic component mounting apparatus and electronic component mounting method of the present invention have the effect of improving the positional accuracy during component delivery from the take-out transfer head to the mounting head, and mount electronic components such as flip chips on the substrate. It is useful for the application.

The perspective view of the electronic component mounting apparatus of one embodiment of this invention The partial front view of the electronic component mounting apparatus of one embodiment of this invention The side view of the electronic component mounting apparatus of one embodiment of this invention The fragmentary perspective view of the electronic component mounting apparatus of one embodiment of this invention The functional block diagram which shows the processing function of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the mark jig in the electronic component mounting apparatus of one embodiment of this invention FIG. 5 is a flowchart of pre-center recognition position correction processing in the electronic component mounting method according to the embodiment of the present invention. Flowchart of pre-center recognition camera pixel rate calculation processing in the electronic component mounting method according to the embodiment of the present invention

Explanation of symbols

2 Supply unit 6 Chip 9 Substrate holding unit 10 Substrate 14 Mounting head 17 Component imaging unit 21 Supply unit recognition camera 22 Mounted head recognition camera 23 Pre-center recognition camera 24 Substrate recognition camera 27 Mark jig
28 Mark holder

Claims (7)

  An electronic component mounting apparatus for receiving an electronic component taken out by a take-out transfer head by a mounting head and mounting the electronic component on a substrate, wherein the electronic component is mounted on the substrate at a predetermined supply position and supplying the electronic component to the take-out transfer head A substrate holding unit for holding the substrate to be carried out, and taking out the electronic component from the supply position by the take-out and transfer head and transferring it to the receiving position of the electronic component, and performing the take-out and transfer operation of reversing the electronic component in the transfer process A transfer means, a mounting head drive mechanism for driving the mounting head, a take-out transfer head imaging means for imaging an electronic component held by the take-out transfer head during the take-out transfer operation, and a take-out transfer head in the take-out transfer means The take-out transfer head imaging hand provided at a predetermined position in a specific positional relationship with Based on the position detection mark that can be imaged by the image pickup device and the position detection result of the electronic component and the position detection mark obtained by recognizing the imaging result of the electronic component and the position detection mark by the take-out and transfer head imaging means. Receiving positioning control means for positioning the mounting head relative to the electronic component held by the picking and transferring head at the receiving position by controlling the picking and transferring means and / or the mounting head driving mechanism; An electronic component mounting apparatus characterized by that.   The take-out and transfer means is driven based on the position detection result of the position detection mark, and the take-out and transfer head is moved to an imaging position by the take-out and transfer head imaging means in the middle of the take-out and transfer operation. Item 2. The electronic component mounting apparatus according to Item 1.   The position detection mark also serves as a calibration mark for obtaining the pixel rate of the take-out and transfer head imaging means, and pixel rate calculation for calculating the pixel rate of the take-out and transfer head imaging means based on the imaging result of the calibration mark The electronic component mounting apparatus according to claim 1, further comprising means.   The take-out and transfer means includes a take-out and transfer head base member in which a plurality of the take-out and transfer heads are arranged radially around a horizontal rotation axis, and a rotation drive means that drives the take-out and transfer head base member via a transmission belt. The electronic component mounting apparatus according to claim 1, wherein the calibration mark is held by a mark holding portion that is mounted on the take-out and transfer head base member separately from the take-out and transfer head.   An electronic component mounting method in which an electronic component is taken out from a supply position of a supply unit by a take-out transfer head and transferred to a receiving position of the electronic component, and the electronic component is received by a mounting head and mounted on a substrate. An electronic component is taken out by the transfer head and transferred to the receiving position of the electronic component, and in the transfer process, the electronic component is taken out and transferred in the reverse direction, and held in the take-out and transfer head in the middle of the take-out and transfer step. A picking-up and picking-up head imaging step for picking up the picked-up electronic component by a picking-up and picking-up head pick-up means; Position detection for picking up a mark and picking up an image with a transfer head image pickup means A mark imaging process, a position detection process for detecting the positions of the electronic component and the position detection mark by recognizing the imaging results of the take-out and transfer head imaging process and the position detection mark imaging process, and based on the position detection results Receiving the positioning unit relative to the electronic component held by the take-out and transfer head at the receiving position by controlling the take-out transfer means and / or the mounting head drive mechanism that drives the mounting head. An electronic component mounting method comprising: a positioning step; and a component receiving step of receiving a positioned electronic component by a mounting head at a receiving position. The take-out and transfer means is driven based on the position detection result of the position detection mark, and the take-out and transfer head is moved to an imaging position by the take-out and transfer head imaging means in the middle of the take-out and transfer operation. Item 6. The electronic component mounting method according to Item 5. The position detection mark also serves as a calibration mark for obtaining the pixel rate of the take-out and transfer head imaging means, and pixel rate calculation for calculating the pixel rate of the take-out and transfer head imaging means based on the imaging result of the calibration mark 6. The electronic component mounting method according to claim 5, further comprising a step.

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