JP3810905B2 - Gas supply device for injection molding - Google Patents
Gas supply device for injection molding Download PDFInfo
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- JP3810905B2 JP3810905B2 JP30074997A JP30074997A JP3810905B2 JP 3810905 B2 JP3810905 B2 JP 3810905B2 JP 30074997 A JP30074997 A JP 30074997A JP 30074997 A JP30074997 A JP 30074997A JP 3810905 B2 JP3810905 B2 JP 3810905B2
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- gas
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- gas supply
- injection
- injection molding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1703—Introducing an auxiliary fluid into the mould
- B29C45/1732—Control circuits therefor
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- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、ガス注入を行う熱可塑性樹脂射出成形のためのガス供給装置に関するものであり、詳しくは、高圧から低圧までのガスを所定の圧力に制御しながら供給できる射出成形用ガス供給装置に関するものである。
【０００２】
【従来の技術】
従来より、軽量にして高剛性で外観が良好な樹脂射出成形品を得るために、金型内の溶融樹脂中にガスを注入する方法が知られている。この方法によれば、溶融樹脂の内部にガスチャンネル等の中空部が形成され、中空部内の高圧ガスが溶融樹脂を金型の内面に密着させるので、成形品の表面に「ひけ」等の不具合が発生することを防止でき、軽量でありながら充分な強度および剛性を有するうえ、外観品質が良好な成形品が得られる。
【０００３】
ここにおける注入ガスの供給設備は、専ら金型内の溶融樹脂中に注入する高圧ガス（たとえば、１０ＭＰａ程度）の供給設備であり、図２に示すように、ガス供給源（１）、ガス昇圧機器（２）およびガス注入制御機器（３）を直列に接続したものである。その接続路には、それぞれ減圧弁（Ａ）、（Ｂ）が設けられており、所定の圧力が保たれるようになっている。
【０００４】
ところが、近年、比較的低圧のガスを用いて樹脂の射出成形をおこなう技術が開発されている。たとえば、特開平９−１６４５４７号公報には、ガスの注入を射出シリンダー中の可塑化溶融樹脂に対して行い、ガスを含んだ溶融樹脂を射出成形して中空部を有する樹脂成形品を得る方法が開示されている。この方法によれば、比較的低圧のガスで樹脂の射出成形が可能である。
【０００５】
また、本出願人は、特願平９−１１６９２０号において、補強用繊維を含有する溶融樹脂を繊維のスプリングバック現象を利用して金型内で膨張させて成形するに際し、金型内にガスを注入して、型の転写性を向上させる方法を提案した。この場合においても、注入するガスの圧力は比較的低圧でよい。
このように、ガス注入を行う射出成形の技術は多様化しており、そのためのガスは高圧のみでなく低圧のものも要求されるようになっている。ところが、上記したような従来の高圧ガスの供給設備では、これに十分に対応できない。たとえば、１ＭＰａ程度の低圧ガスを従来のガス供給設備から得ようとすれば、ガス昇圧機器（２）の負荷を逓減した状態で運転し、減圧弁（Ｂ）を経由してガスを取り出すことになるが、比較的高圧領域での圧力制御を意図したこの減圧弁（Ｂ）からは、低圧領域で圧力の安定したガスが得られ難く、ガスの注入操作が不安定となるのを避けることができない。
【０００６】
【発明が解決しようとする課題】
本発明は、ガス注入を行う熱可塑性樹脂射出成形技術の多様化に対応して、高圧から低圧までのガスを所定の圧力に制御しながら供給できる射出成形用ガス供給装置を提供することを目的とする。
【０００７】
【課題を解決するための手段】
本発明者らは、上記課題につき鋭意検討した結果、従来の高圧ガスの供給設備において特定のガス流路を併設することによりこれが解決できることを見出し、本発明を完成させるにいたった。
すなわち、本発明は、
ガス注入を行う熱可塑性樹脂射出成形のためのガス供給装置であって、
ガス供給源（１）、ガス昇圧機器（２）およびガス注入制御機器（３）がそれぞれの間の減圧弁（Ａ）、（Ｂ）を介して直列に接続されると共に、
ガス供給源（１）の出口後の減圧弁（Ａ）の下流からガス昇圧機器（２）をバイパスしてガス注入制御機器（３）に通ずるガス流路（４）を有し、
前記ガス供給源（１）のガス圧より高圧ガスの注入時には、前記ガス供給源（１）からのガスを減圧弁（Ａ）、ガス昇圧機器（２）、減圧弁（Ｂ）およびガス注入制御機器（３）を通して行うとともに、前記ガス流路（４）をブロックし、前記ガス供給源（１）のガス圧より低圧ガスの注入時には、前記ガス供給源（１）からのガスを減圧弁（Ａ）、前記ガス流路（４）およびガス注入制御機器（３）を通して行うとともに、前記ガス昇圧機器（２）をブロックした状態とすることを特徴とする射出成形用ガス供給装置を提供するものである。
【０００８】
【発明の実施の形態】
以下、本発明について詳細に説明する。
本発明の対象とする「ガス注入を行う熱可塑性樹脂射出成形」とは、熱可塑性樹脂の射出成形であって溶融樹脂中にガス注入を行うものであれば特に限定されるものではない。前記したような、金型内の溶融樹脂中に比較的高圧のガスを注入する成形や、射出シリンダー中の可塑化溶融樹脂中に比較的低圧のガスを注入する成形、金型内の強化繊維含有の溶融樹脂中に比較的低圧のガスを注入する成形等、高圧から低圧まで（たとえば、１０ＭＰａ〜１ＭＰａ程度）のガスを用いる各種の射出成形に対応できるのが、本発明の利点である。
【０００９】
本発明の、射出成形用ガス供給装置は、図１に例示されるように、ガス供給源（１）、ガス昇圧機器（２）およびガス注入制御機器（３）がそれぞれの間の減圧弁（Ａ）、（Ｂ）を介して直列に接続されると共に、ガス供給源（１）の出口後の減圧弁（Ａ）の下流からガス昇圧機器（２）をバイパスしてガス注入制御機器（３）に通ずるガス流路（４）を有するものである。
【００１０】
本発明のガス供給装置を構成するガス供給源（１）は、射出成形に用いられる窒素等のガスを提供するものであり、具体的には、窒素ガスボンベ、液体窒素タンク、窒素ガス製造設備等である。中でも簡便に使用できる窒素ガスボンベが好適である。
また、本発明におけるガス昇圧機（２）は、射出成形のために比較的高圧のガスを注入する場合に、ガス供給源（１）から提供されるガスの圧力を所要の圧力にまで高めるためのものであり、レシプロタイプのコンプレッサー等が用いられる。ガス昇圧機（２）の入口と出口に位置する減圧弁（Ａ）、（Ｂ）は、ガス昇圧機（２）の安定した操作と所望の圧力でのガス注入ができるように機能する。
【００１１】
さらに、本発明におけるガス注入制御機器（３）は、射出成形機に連動して、溶融樹脂中へのガス注入のタイミング制御等を行うものであり、たとえば、空気圧制御されたシャット・オフバルブ等が用いられる。
なお、射出成形機におけるガスの注入箇所は、各種成形法に応じて、射出ノズル、金型内ランナー、金型キャビティ、可塑化スクリュー先端部、射出シリンダー等である。
【００１２】
本発明のガス供給装置を用いて、比較的高圧のガスを射出成形に供する場合には、ガス供給源（１）から供給される低圧ガス（たとえば、２〜３ＭＰａ程度）を減圧弁（Ａ）を介してガス昇圧機器（２）に導入し、次いで昇圧した高圧ガス（たとえば、３０ＭＰａ程度）を減圧弁（Ｂ）を介して所望の圧力（たとえば、１０ＭＰａ程度）に調整し、ガス注入制御機器（３）を通して、ガス注入を行う。なお、この際、ガス昇圧機器（２）をバイパスするガス流路（４）はブロックされた状態とする。
【００１３】
一方、本発明のガス供給装置を用いて、比較的低圧のガスを射出成形に供する場合には、ガス供給源（１）から供給される低圧ガス（たとえば、２〜３ＭＰａ程度）を減圧弁（Ａ）により所望の圧力（たとえば、１ＭＰａ程度）に調節し、これをガス昇圧機器（２）をバイパスするガス流路（４）によりガス注入制御機器（３）に導き、ガス注入を行う。なお、この際、ガス昇圧機器（２）はブロックされた状態とする。
【００１４】
このように、射出成形で注入するガスの圧力がガス供給源（１）のガス圧よりも高い場合には、ガス昇圧機器（２）によりガス圧を高めて供給され、逆に、射出成形で注入するガスの圧力がガス供給源（１）のガス圧よりも低い場合には、ガス昇圧機器（２）をバイパスしてガスの供給がなされる。（なお、この選択に際しては、ガス供給源（１）からガス注入箇所に至るまでの圧力損失も考慮する必要がある。）前者の場合、注入ガスの圧力は比較的高圧領域での圧力制御に好適な減圧弁（Ｂ）によりなされ、後者の場合、注入ガスの圧力は比較的低圧領域での圧力制御に好適な減圧弁（Ａ）によりなされるので、本発明のガス供給装置によれば、高圧から低圧に至るまで圧力が安定に制御されたガスの注入が可能となる。また、注入ガスの圧力を減圧弁に付帯した圧力計により視覚で確認する場合にも、適切な表示範囲を有する圧力計で正確に確認することができる。
【００１５】
【実施例】
本発明について、更に、実施例により詳細に説明する。
〔実施例１〕
図１に示す射出成形用ガス供給装置を用い、ガス供給源としての窒素ガスボンベ（１）から出た減圧弁（Ａ）の下流から、ガス昇圧機器としてのレシプロ・コンプレッサー（２）をバイパスするガス流路（４）を経由し、ガス注入制御機器（３）に通ずる流れにより、射出成形機金型内へ低圧ガスを供給する実験を行った。
金型内に注入されるガスの圧力設定は２ＭＰａとし、減圧弁（Ａ）の出口設定圧を２．５ＭＰａとして、ガス供給装置を運転した。なお、減圧弁（Ａ）における圧力計の仕様は、入口１５ＭＰａ／出口３ＭＰａである。
ガス注入制御機器（３）から排出されるガス圧を圧力計（５）で測定したところ、１．９〜２．１ＭＰａであり、ガス圧の変動はほとんど見られず安定していた。
【００１６】
〔比較例１〕
図２に示す射出成形用ガス供給装置で、ガス供給源として窒素ガスボンベ（１）、ガス昇圧機器としてレシプロ・コンプレッサー（２）を有するものを用い、コンプレッサー（２）の負荷を逓減した状態で運転し、実施例１と同様に金型内に注入されるガスの圧力設定を２ＭＰａとし、コンプレッサー出口の減圧弁（Ｂ）により注入ガスの圧力制御を行いながらガス供給装置を運転した。なお、減圧弁（Ｂ）における圧力計の仕様は、入口３０ＭＰａ／出口１０ＭＰａである。
ガス注入制御機器（３）から排出されるガス圧を圧力計（５）で測定したところ、１．０〜２．５ＭＰａであり、ガス圧の変動は大きく不安定であった。
【００１７】
【発明の効果】
本発明によれば、ガス注入を行う熱可塑性樹脂射出成形のためのガス供給装置において、高圧のガス以外は安定した圧力で供給することができなかった従来のガス供給装置に、特別のガス流路を付設するという改造をするだけで、高圧ガスから低圧ガスまで広範囲に、安定した圧力のガスを供給することが可能となる。したがって、多様化するガス注入射出成形法に対しても、１つのガス供給装置で賄うことができる。
【００１８】
【図面の簡単な説明】
【図１】本発明の一例としての射出成形用ガス供給装置
【図２】従来の射出成形用ガス供給装置
【符号の説明】
１：ガス供給源
２：ガス昇圧機器
３：ガス注入制御機器
４：バイパス用ガス流路
５：圧力計
Ａ：減圧弁
Ｂ：減圧弁[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a gas supply device for injection molding of a thermoplastic resin that performs gas injection, and more particularly, relates to a gas supply device for injection molding that can supply gas from a high pressure to a low pressure while controlling the gas to a predetermined pressure. Is.
[0002]
[Prior art]
Conventionally, a method of injecting gas into a molten resin in a mold has been known in order to obtain a resin injection molded product that is lightweight, has high rigidity, and has a good appearance. According to this method, a hollow portion such as a gas channel is formed inside the molten resin, and the high-pressure gas in the hollow portion causes the molten resin to adhere to the inner surface of the mold. Can be prevented, and it is possible to obtain a molded product having a sufficient appearance and quality in addition to having sufficient strength and rigidity while being lightweight.
[0003]
The injection gas supply facility here is a supply facility for high-pressure gas (for example, about 10 MPa) exclusively injected into the molten resin in the mold, and as shown in FIG. A device (2) and a gas injection control device (3) are connected in series. The connecting passages are provided with pressure reducing valves (A) and (B), respectively, so that a predetermined pressure is maintained.
[0004]
However, in recent years, a technique for performing resin injection molding using a relatively low pressure gas has been developed. For example, Japanese Patent Laid-Open No. 9-164547 discloses a method of obtaining a resin molded product having a hollow portion by performing gas injection on a plasticized molten resin in an injection cylinder and injection molding the molten resin containing gas. Is disclosed. According to this method, the resin can be injection-molded with a relatively low pressure gas.
[0005]
In addition, in Japanese Patent Application No. Hei 9-116920, the applicant of the present application applied a gas in the mold when the molten resin containing the reinforcing fiber was expanded in the mold using the springback phenomenon of the fiber. Proposed a method to improve the transferability of the mold. Even in this case, the pressure of the injected gas may be relatively low.
As described above, injection molding techniques for injecting gas are diversified, and not only high pressure but also low pressure gas is required. However, the conventional high-pressure gas supply equipment as described above cannot sufficiently cope with this. For example, if a low pressure gas of about 1 MPa is to be obtained from a conventional gas supply facility, the gas booster (2) is operated with the load reduced, and the gas is taken out via the pressure reducing valve (B). However, it is difficult to obtain a gas whose pressure is stable in the low pressure region from the pressure reducing valve (B) intended to control the pressure in a relatively high pressure region, and it is avoided that the gas injection operation becomes unstable. Can not.
[0006]
[Problems to be solved by the invention]
An object of the present invention is to provide an injection molding gas supply device capable of supplying a gas from a high pressure to a low pressure while controlling to a predetermined pressure in response to diversification of thermoplastic resin injection molding technology for performing gas injection. And
[0007]
[Means for Solving the Problems]
As a result of intensive studies on the above problems, the present inventors have found that this can be solved by providing a specific gas flow path in a conventional high-pressure gas supply facility, and have completed the present invention.
That is, the present invention
A gas supply device for injection molding of a thermoplastic resin for gas injection,
A gas supply source (1), a gas booster (2), and a gas injection controller (3) are connected in series via pressure reducing valves (A) and (B) between them,
Possess a gas supply source (1) gas flow passage communicating the pressure reducing valve after the outlet, bypassing the gas booster device (2) from the downstream of (A) to the gas injection control device (3) of the (4),
At the time of injecting high-pressure gas from the gas pressure of the gas supply source (1), the gas from the gas supply source (1) is supplied to the pressure reducing valve (A), the gas pressure increasing device (2), the pressure reducing valve (B), and the gas injection control. While performing through the device (3), the gas flow path (4) is blocked, and when a gas having a pressure lower than the gas pressure of the gas supply source (1) is injected, the gas from the gas supply source (1) is reduced by a pressure reducing valve ( A) Providing a gas supply device for injection molding characterized in that it is performed through the gas flow path (4) and the gas injection control device (3), and the gas pressure increasing device (2) is blocked. It is.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail.
“Thermoplastic resin injection molding for gas injection” which is an object of the present invention is not particularly limited as long as it is injection molding of a thermoplastic resin and gas injection is performed in a molten resin. Molding for injecting a relatively high pressure gas into the molten resin in the mold as described above, molding for injecting a relatively low pressure gas into the plasticized molten resin in the injection cylinder, and reinforcing fibers in the mold It is an advantage of the present invention that it can cope with various types of injection molding using gas from high pressure to low pressure (for example, about 10 MPa to 1 MPa), such as molding in which a relatively low pressure gas is injected into the molten resin.
[0009]
As illustrated in FIG. 1, the gas supply apparatus for injection molding according to the present invention includes a pressure reducing valve (1), a gas pressure increasing device (2), and a gas injection control device (3), The gas injection control device (3) is connected in series via A) and (B), and bypasses the gas pressure-increasing device (2) from the downstream of the pressure-reducing valve (A) after the outlet of the gas supply source (1). ) To the gas flow path (4).
[0010]
The gas supply source (1) constituting the gas supply apparatus of the present invention provides a gas such as nitrogen used for injection molding. Specifically, a nitrogen gas cylinder, a liquid nitrogen tank, a nitrogen gas production facility, etc. It is. Among these, a nitrogen gas cylinder that can be easily used is preferable.
The gas booster (2) according to the present invention increases the pressure of the gas provided from the gas supply source (1) to a required pressure when injecting a relatively high pressure gas for injection molding. A reciprocating type compressor or the like is used. The pressure reducing valves (A) and (B) located at the inlet and outlet of the gas booster (2) function so that the gas booster (2) can be stably operated and gas can be injected at a desired pressure.
[0011]
Further, the gas injection control device (3) according to the present invention performs timing control of gas injection into the molten resin in conjunction with the injection molding machine. For example, a pneumatically controlled shut-off valve, etc. Used.
In addition, the injection | pouring location of the gas in an injection molding machine is an injection nozzle, a runner in a mold, a mold cavity, a plasticizing screw tip, an injection cylinder, etc. according to various molding methods.
[0012]
When a relatively high pressure gas is used for injection molding using the gas supply device of the present invention, a low pressure gas (for example, about 2 to 3 MPa) supplied from a gas supply source (1) is supplied to a pressure reducing valve (A). Is introduced into the gas pressure-increasing device (2), and then the pressurized high-pressure gas (for example, about 30 MPa) is adjusted to a desired pressure (for example, about 10 MPa) through the pressure-reducing valve (B). Gas injection is performed through (3). At this time, the gas flow path (4) bypassing the gas booster (2) is in a blocked state.
[0013]
On the other hand, when a relatively low pressure gas is used for injection molding using the gas supply device of the present invention, a low pressure gas (for example, about 2 to 3 MPa) supplied from the gas supply source (1) is supplied to a pressure reducing valve ( The pressure is adjusted to a desired pressure (for example, about 1 MPa) by A), and this is guided to the gas injection control device (3) by the gas flow path (4) bypassing the gas booster (2), and gas injection is performed. At this time, the gas booster (2) is in a blocked state.
[0014]
Thus, when the pressure of the gas injected by injection molding is higher than the gas pressure of the gas supply source (1), the gas pressure is increased by the gas booster (2), and conversely, by injection molding. When the pressure of the gas to be injected is lower than the gas pressure of the gas supply source (1), the gas is supplied bypassing the gas booster (2). (Note that in this selection, it is necessary to consider the pressure loss from the gas supply source (1) to the gas injection point.) In the former case, the pressure of the injection gas is used for pressure control in a relatively high pressure region. In the latter case, the pressure of the injection gas is made by the pressure reducing valve (A) suitable for pressure control in a relatively low pressure region. Therefore, according to the gas supply device of the present invention, It is possible to inject gas whose pressure is stably controlled from high pressure to low pressure. Further, when the pressure of the injected gas is visually confirmed by a pressure gauge attached to the pressure reducing valve, it can be accurately confirmed by a pressure gauge having an appropriate display range.
[0015]
【Example】
The present invention will be further described in detail with reference to examples.
[Example 1]
Gas that bypasses the reciprocating compressor (2) as the gas booster from the downstream side of the pressure reducing valve (A) that has come out of the nitrogen gas cylinder (1) as the gas supply source, using the gas supply apparatus for injection molding shown in FIG. An experiment was conducted in which low-pressure gas was supplied into the mold of the injection molding machine through the flow path (4) and the flow leading to the gas injection control device (3).
The gas supply apparatus was operated by setting the pressure of the gas injected into the mold to 2 MPa and the outlet set pressure of the pressure reducing valve (A) to 2.5 MPa. In addition, the specification of the pressure gauge in the pressure reducing valve (A) is inlet 15 MPa / outlet 3 MPa.
When the gas pressure discharged from the gas injection control device (3) was measured with the pressure gauge (5), it was 1.9 to 2.1 MPa, and the fluctuation of the gas pressure was hardly seen and was stable.
[0016]
[Comparative Example 1]
The gas supply device for injection molding shown in FIG. 2 is operated with a nitrogen gas cylinder (1) as a gas supply source and a reciprocating compressor (2) as a gas booster, and the load on the compressor (2) is reduced. Then, similarly to Example 1, the pressure setting of the gas injected into the mold was set to 2 MPa, and the gas supply apparatus was operated while controlling the pressure of the injected gas by the pressure reducing valve (B) at the compressor outlet. In addition, the specification of the pressure gauge in the pressure reducing valve (B) is an inlet 30 MPa / an outlet 10 MPa.
When the gas pressure discharged | emitted from a gas injection control apparatus (3) was measured with the pressure gauge (5), it was 1.0-2.5 Mpa, and the fluctuation | variation of gas pressure was large and unstable.
[0017]
【The invention's effect】
According to the present invention, in a gas supply apparatus for injection molding of a thermoplastic resin that performs gas injection, a special gas flow is added to a conventional gas supply apparatus that cannot supply a gas other than high-pressure gas at a stable pressure. It is possible to supply gas with a stable pressure over a wide range from high pressure gas to low pressure gas by simply modifying the road. Therefore, even a diversified gas injection molding method can be covered with a single gas supply device.
[0018]
[Brief description of the drawings]
FIG. 1 shows an injection molding gas supply device as an example of the present invention. FIG. 2 shows a conventional injection molding gas supply device.
1: Gas supply source 2: Gas boosting device 3: Gas injection control device 4: Gas flow path for bypass 5: Pressure gauge A: Pressure reducing valve B: Pressure reducing valve
Claims (1)
ガス供給源（１）、ガス昇圧機器（２）およびガス注入制御機器（３）がそれぞれの間の減圧弁（Ａ）、（Ｂ）を介して直列に接続されると共に、
ガス供給源（１）の出口後の減圧弁（Ａ）の下流からガス昇圧機器（２）をバイパスしてガス注入制御機器（３）に通ずるガス流路（４）を有し、
前記ガス供給源（１）のガス圧より高圧ガスの注入時には、前記ガス供給源（１）からのガスを減圧弁（Ａ）、ガス昇圧機器（２）、減圧弁（Ｂ）およびガス注入制御機器（３）を通して行うとともに、前記ガス流路（４）をブロックし、前記ガス供給源（１）のガス圧より低圧ガスの注入時には、前記ガス供給源（１）からのガスを減圧弁（Ａ）、前記ガス流路（４）およびガス注入制御機器（３）を通して行うとともに、前記ガス昇圧機器（２）をブロックした状態とすることを特徴とする射出成形用ガス供給装置。A gas supply device for injection molding of a thermoplastic resin for gas injection,
A gas supply source (1), a gas booster (2), and a gas injection controller (3) are connected in series via pressure reducing valves (A) and (B) between them,
Possess a gas supply source (1) gas flow passage communicating the pressure reducing valve after the outlet, bypassing the gas booster device (2) from the downstream of (A) to the gas injection control device (3) of the (4),
At the time of injecting high-pressure gas from the gas pressure of the gas supply source (1), the gas from the gas supply source (1) is supplied to the pressure reducing valve (A), the gas pressure increasing device (2), the pressure reducing valve (B), and the gas injection control. While performing through the device (3), the gas flow path (4) is blocked, and when a gas having a pressure lower than the gas pressure of the gas supply source (1) is injected, the gas from the gas supply source (1) is reduced by a pressure reducing valve ( A) A gas supply apparatus for injection molding , which is performed through the gas flow path (4) and the gas injection control device (3), and the gas pressure increasing device (2) is blocked .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30074997A JP3810905B2 (en) | 1997-10-31 | 1997-10-31 | Gas supply device for injection molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30074997A JP3810905B2 (en) | 1997-10-31 | 1997-10-31 | Gas supply device for injection molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11129279A JPH11129279A (en) | 1999-05-18 |
| JP3810905B2 true JP3810905B2 (en) | 2006-08-16 |
Family
ID=17888644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30074997A Expired - Lifetime JP3810905B2 (en) | 1997-10-31 | 1997-10-31 | Gas supply device for injection molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3810905B2 (en) |
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1997
- 1997-10-31 JP JP30074997A patent/JP3810905B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11129279A (en) | 1999-05-18 |
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