JP3899806B2 - Electro-optical device manufacturing method, electro-optical device, and electronic apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electro-optical device using a substrate cut out from an original substrate, and an electronic apparatus using the electro-optical device. More specifically, the present invention relates to a technique for instructing a cutting position with respect to an original substrate.
[0002]
[Prior art]
In recent years, electro-optical devices such as liquid crystal devices have been widely used as display units of electronic devices such as mobile phones, portable computers, video cameras, and the like. In a liquid crystal device, after a first substrate and a second substrate are bonded together with a sealing material to form an empty panel called an empty cell, liquid crystal as an electro-optical material is formed in a region partitioned by the sealing material. Is enclosed.
[0003]
The panel used for such a liquid crystal device may be formed by bonding the first and second substrates corresponding to the individual panels one by one. In particular, when a small liquid crystal device is manufactured, a plurality of panels are used. For example, wiring patterns for multiple liquid crystal devices can be formed on a large original substrate that can be used to form panels, and processing is performed with the large original substrate up to the middle of the manufacturing process. It is often divided into
[0004]
In addition, when an original substrate for one panel is prepared and a manufacturing process such as a wiring pattern is performed on the original substrate, liquid crystal is injected after removing the peripheral portion of the original substrate in the latter half of the manufacturing process. A process may be performed.
[0005]
In any of these cases, as a cutting method for the original substrate, a method using a cutter or the like, or forming a groove-like scratch on the surface of the original substrate, and applying a stress to the portion where the scratch is formed, A method of breaking is adopted.
[0006]
[Problems to be solved by the invention]
In the process of cutting out the substrate constituting the liquid crystal device from the original substrate, if the cutting position with respect to the original substrate is deviated and the dimensions and cutting position of the substrate are not within the specified tolerance, there is a risk that defects will occur in the subsequent mounting process etc. Therefore, it is necessary to inspect the cut substrate.
[0007]
However, in order to know whether or not the original substrate has been cut accurately, it is necessary to measure the dimensions of the substrate cut out from the original substrate. There is.
[0008]
In view of the above problems, the object of the present invention is to easily inspect the cutting position with respect to the original substrate, and after injecting the electro-optic material between the substrates from the injection port, the sealing material for the injection port is appropriately set. It is an object of the present invention to provide an electro-optical device manufacturing method, an electro-optical device, and an electronic apparatus using the electro-optical device that can be applied over a wide range.
[0009]
Another object of the present invention is to provide a configuration capable of realizing such a method of manufacturing an electro-optical device without adding a new process.
[0010]
[Means for Solving the Problems]
In order to solve the above problems, in the present invention, a cutting step of cutting an original substrate for forming a first substrate along a planned cutting line, and an empty space in which a second substrate is bonded to the first substrate. An injection step of injecting an electro-optical material between the substrates through an injection port that opens at a cutting position with respect to the original substrate in the panel, and a sealing step of sealing the injection port by applying a sealing material to the injection port And forming a mark having a predetermined width at a position of the original substrate that overlaps the planned cutting line and that indicates the coating range of the sealing material. In the cutting step, the original substrate is cut along the planned cutting line so that a part of the mark remains on both sides of the cut portion, and in the sealing step, the sealing material is used with reference to the mark. It is characterized by applying to a predetermined range .
[0011]
In the present invention, since a mark having a width corresponding to the tolerance when the original substrate is cut is formed on the original substrate, when the original substrate is cut along the planned cutting line, one mark is formed on both sides of the cut portion. If it is confirmed whether or not each part remains, it can be easily inspected whether or not cutting has been performed with high accuracy. In other words, if cutting is performed with high accuracy, a part of the mark remains on both sides of the cutting point, whereas if cutting accuracy is poor, the mark remains only on one side of the cutting point and the mark on the other side. This is because there is no remaining. In addition, in the empty panel in which the first substrate and the second substrate are bonded together, the injection port for injecting the electro-optical material into the substrate is opened at the cutting position with respect to the original substrate, so that the cutting step If the mark used to inspect the quality of the substrate is formed at a position that indicates the application range of the sealing material to be applied to the injection port, the sealing material is applied based on the mark. it can. Therefore, it is possible to avoid the occurrence of problems due to the large amount of sealing material applied.
[0012]
In the present invention, the mark may be formed, for example, at two locations on both sides of the injection port. In this case, the mark is formed at two locations on both sides of the injection port in the sealing step. What is necessary is just to apply | coat the said sealing material in the range which does not overlap with the edge part by the side of the said injection hole of the said mark. If comprised in this way, application | coating of a sealing material can be prevented too much.
[0013]
In the present invention, it is preferable that the mark is formed simultaneously with a wiring formed on the original substrate or a thin film constituting an electric element. With this configuration, it is not necessary to add a new process even if the mark is formed on the original substrate.
[0014]
Here, the configuration of the wiring or electric element formed on the original substrate varies depending on the type of the electro-optical device, but in the electro-optical device using the TFD element as the active element for pixel switching, the wiring or the electric element is configured. Since a Ta (tantalum) film or a Cr (chromium) film is used as the thin film to be formed, the mark may be formed from a Ta film or a Cr film.
[0015]
In the present invention, a first pattern and a second pattern are formed opposite to each other with a predetermined distance on both sides of the original cutting line with respect to the original substrate, and the first pattern and the A step of forming a boundary pattern different in form from these patterns between the second pattern, and in the cutting step, the original substrate is disposed so that a part of the boundary pattern remains on both sides of the cut portion. It is preferable to cut along the planned cutting line. In such a configuration, the first pattern and the second pattern are formed at a distance corresponding to a tolerance when the original substrate is cut, and a boundary pattern is formed therebetween. Therefore, when the original substrate is cut along the planned cutting line, whether or not the original substrate is cut accurately is confirmed by checking whether or not part of the boundary pattern remains on both sides of the cut portion. Can be easily inspected. That is, if the cutting is performed with high accuracy, a part of the boundary pattern remains on both sides of the cutting portion, whereas if the cutting accuracy is poor, the boundary pattern remains only on one of the cutting portions, and the other This is because no boundary pattern is left in the pattern.
[0016]
In the present invention, the first pattern is formed as ends of a plurality of wirings formed in a substrate forming region cut out as the first substrate, while the second pattern is separated from the substrate forming region. The boundary pattern is formed as a relay pattern that electrically connects each of the first patterns to the second pattern, and before performing the cutting step, the boundary pattern is formed as a power supply pattern. It is preferable that the first pattern or the conductive film electrically connected to the first pattern is subjected to anodic oxidation treatment by supplying power to the first pattern from the second pattern through the boundary pattern. The anodizing treatment performed here is, for example, an anodizing treatment in which an electrical element such as a diode element or a capacitor element is formed using the conductive film and an insulating film formed on the surface of the conductive film. The configuration of the wiring or electric element formed on the original substrate varies depending on the type of the electro-optical device. In an electro-optical device using a TFD element as an active element for pixel switching, the conductive film constituting the wiring or the electric element is used. A Ta film is formed as follows, and the Ta film is subjected to anodic oxidation by supplying power via a relay pattern and wiring from a power supply pattern (second pattern) formed in a peripheral region cut out as a substrate. The power supply pattern and the wiring are cut by cutting the original substrate at the relay pattern portion. Therefore, since a relay pattern is formed in a region across the planned cutting line with respect to the original substrate, this relay pattern is used as a boundary pattern for inspecting the quality of the cutting process as the first pattern or the second pattern. If it is formed in a form that can be easily distinguished from the above, it is not necessary to add a mark or the like for inspecting the quality of the cutting process in a region where such a pattern is densely formed.
[0017]
The present invention comprises a step of forming a first pattern and a second pattern that are opposed to the original substrate with a predetermined distance on both sides of the planned cutting line, and in the cutting step, The original substrate may be cut along the planned cutting line so that the first pattern and the second pattern are not chipped on both sides of the cut portion. In this configuration, the first pattern and the second pattern are formed at a distance corresponding to the tolerance when the original substrate is cut. Therefore, when the original substrate is cut along the planned cutting line, it is possible to accurately cut the original substrate by checking whether the first pattern and the second pattern remain without being cut on both sides of the cut portion. It can be easily inspected whether it has been performed or not. That is, if the cutting is performed with high accuracy, the first pattern and the second pattern remain on both sides of the cutting portion without being lost. This is because the first pattern or the second pattern is lost.
[0018]
In the present invention, the method includes a step of forming a boundary pattern across the planned cutting line with a predetermined width with respect to the original substrate, and in the cutting step, a part of the boundary pattern remains on both sides of the cut portion. The original substrate may be cut along the planned cutting line. In such a configuration, the width of the boundary pattern is set to a dimension corresponding to a tolerance when the original substrate is cut. Therefore, when the original substrate is cut along the planned cutting line, whether or not the original substrate is cut accurately is confirmed by checking whether or not a part of the boundary pattern remains on both sides of the cut portion. Can be easily inspected. That is, if the cutting is performed with high accuracy, a part of the boundary pattern remains on both sides of the cutting portion, whereas if the cutting accuracy is poor, the boundary pattern remains only on one of the cutting portions and the other This is because no boundary pattern remains.
[0019]
Such a pattern is also preferably formed simultaneously with a thin film, for example, a Ta film or a Cr film, which forms a wiring or an electric element formed on the original substrate, like the mark.
[0020]
An electro-optical device manufactured using such a manufacturing method has, for example, the following configuration. That is, in the electro-optical device in which the first substrate and the second substrate are bonded to each other with a sealing material, and the injection port formed by the cut portion of the sealing material is sealed with the sealing material, A mark for inspecting a cutting position when the first substrate is cut out from the original substrate is attached to an edge portion of the substrate while showing an application range of the sealing material.
[0021]
Further, in the electro-optical device according to the present invention, the first substrate and the second substrate are bonded together with a sealing material, and the injection port composed of a cut-off portion of the sealing material is sealed with the sealing material, The inlet is open at an edge portion of the first substrate, and the edge portion of the first substrate is provided with marks on both sides of the inlet along the edge portion. Features.
[0022]
In the present invention, the mark is formed at two locations on both sides of the injection port, and the sealing material does not overlap the end portion on the injection port side of the mark formed at two locations on both sides of the injection port. Has been applied to the area.
[0023]
In the present invention, the mark is made of the same composition as that of the thin film forming the wiring or electric element formed on the first substrate, for example, a Ta film or a Cr film.
[0024]
Such an electro-optical device is used as a display unit of an electronic device such as a mobile phone, a portable computer, a video camera, and the like.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, an active matrix liquid crystal device using a TFD element (Thin Film Diode) as an active element among various electro-optical devices will be described as an example.
[0026]
[Configuration of LCD panel]
FIG. 1 is a block diagram schematically showing the electrical configuration of the liquid crystal device. 2A and 2B are respectively a plan view of one pixel in the element substrate of the pair of substrates sandwiching the liquid crystal layer in the liquid crystal panel, and a cross-sectional view taken along the line AA in FIG. It is.
[0027]
As shown in FIG. 1, in the liquid crystal panel 2 used in the liquid crystal device, scanning lines 51 as a plurality of wirings are formed in the row direction (X direction), and a plurality of data lines 52 are formed in the column direction (Y direction). Has been. A pixel 53 is formed at a position corresponding to each intersection of the scanning line 51 and the data line 52. In this pixel 53, a liquid crystal layer 54 and a TFD element 56 for pixel switching are connected in series. Each scanning line 51 is driven by a scanning line driving circuit 57, and each data line 52 is driven by a data line driving circuit 58. In the present embodiment, the scanning line driving circuit 57 and the data line driving circuit 58 are respectively configured as a liquid crystal driving IC 8a and a liquid crystal driving IC 8b described later with reference to FIG.
[0028]
2A and 2B, the TFD element 56 includes two TFD elements composed of a first TFD element 56a and a second TFD element 56b formed on the base layer 61 formed on the surface of the element substrate 7a. Depending on the elements, it is configured as a so-called Back-to-Back structure. Therefore, in the TFD element 56, the current-voltage nonlinear characteristic is symmetric in both positive and negative directions. The underlayer 61 is made of, for example, tantalum oxide (Ta ₂ O _Five ). The first TFD element 56a and the second TFD element 56b include a first metal layer 62, an insulating layer 63 formed on the surface of the first metal layer 62, and a second metal layer formed on the surface of the insulating film 63 so as to be separated from each other. The metal layers 64a and 64b are configured. The first metal layer 62 is formed of, for example, a Ta single film or a Ta alloy film having a thickness of about 100 to 500 nm, and the insulating layer 63 oxidizes the surface of the first metal layer 62 by, for example, an anodic oxidation method. Tantalum oxide (Ta) having a thickness of 10 to 35 nm ₂ O _Five ).
[0029]
The second metal layers 64a and 64b are formed to a thickness of about 50 to 300 nm by a metal film such as chromium (Cr). The second metal layer 64a becomes the scanning line 51 as it is, and the other second metal layer 64b is connected to the pixel electrode 66 made of a transparent conductive material such as ITO (Indium Tin Oxide). The pixel electrode 66 may be formed of a light reflective material such as Al (aluminum).
[0030]
The substrate 17a constituting the element substrate 7a is formed of, for example, quartz, glass, plastic, or the like, similarly to the substrate 17b (see FIG. 4) constituting the counter substrate 7a. Here, in the case of a simple reflection type, it is not essential that the element substrate substrate 17a is transparent, but in the case of a transmission type as in this embodiment, the element substrate substrate 17a is transparent. Is an essential requirement.
[0031]
[Configuration of liquid crystal device]
In the element substrate 7a on which the scanning lines 51 and the TFD elements 56 are thus formed, the data lines 52 made of a transparent conductive material such as ITO are formed in a stripe shape, as will be described with reference to FIGS. The counter substrate 7b is arranged to face the counter substrate 7b. Here, the element substrate 7a and the counter substrate 7b are bonded to each other so that the pixel electrodes 66 for one column and the single data line 52 are in a positional relationship facing each other.
[0032]
3 and 4 are an exploded perspective view and a cross-sectional view of the liquid crystal device, respectively.
[0033]
As shown in FIGS. 3 and 4, the liquid crystal device 1 has, for example, FPCs (Flexible Printed Circuits) 3 a and 3 b connected to the liquid crystal panel 2 and further guided to the back side of the liquid crystal panel 2. It is formed by attaching the body 4 and further providing a control substrate 5 on the back side of the light guide 4.
[0034]
In the liquid crystal panel 2, the element substrate 7 a and the counter substrate 7 b are bonded to each other by a sealing material 6 applied in an annular shape to one of these substrates. Further, the liquid crystal injection port 6 a is formed by the discontinuous portion of the sealing material 6, and the liquid crystal injection port 6 a is closed by the sealing material 60.
[0035]
A liquid crystal driving IC 8a is mounted by COG (Chip On Glass) by an ACF (Anisotropic Conductive Film) 9 on the surface of the element substrate 7a protruding from the counter substrate 7b. In addition, a liquid crystal driving IC 8b is COG-mounted by an ACF 9 on a portion of the counter substrate 7b that protrudes from the element substrate 7a.
[0036]
As shown in FIG. 4, a plurality of pixel electrodes 66 are formed in a matrix on the inner surface of the element substrate 7a, and a polarizing plate 12a is bonded to the outer surface thereof. A plurality of data lines 52 are formed in stripes on the inner surface of the counter substrate 7b, and a polarizing plate 12b is attached to the outer surface thereof. Then, a liquid crystal L as an electro-optical material is sealed in a gap (cell gap) defined by the sealant 6 between the element substrate 7a and the counter substrate 7b.
[0037]
Although not shown in FIG. 4, various optical elements other than the above are provided on the element substrate 7a and the counter substrate 7b as necessary. For example, an alignment film for aligning the alignment of the liquid crystal L is provided on the inner surface of each substrate. These alignment films are formed, for example, by baking after applying a polyimide solution. The polymer main chain of the polyimide is stretched in a predetermined direction by rubbing treatment, and the liquid crystal molecules in the liquid crystal L sealed between the substrates are aligned along the stretching direction of the alignment film. When performing color display, R (red), G (green), and B (blue) color filters (not shown) are provided in a region facing the pixel electrode 66 with respect to the counter substrate 7b. A black matrix (not shown) is formed in a region that is formed in the arrangement of FIG. Further, the surface on which the color filter and the black matrix are formed is coated with a planarization layer for planarization and protection, and the data line 52 is formed on the surface of the planarization layer.
[0038]
In FIG. 3, a plurality of terminals 13a are formed on the projecting portion of the element substrate 7a, and these terminals are simultaneously formed when the pixel electrode 66 is formed on the surface of the element substrate 7a. A plurality of terminals 13b are also formed on the protruding portion of the counter substrate 7b, and these terminals are formed at the same time when the data lines 52 are formed on the surface of the counter substrate 7b. A plurality of terminals 22 are provided at the end of the FPC 3b, and these terminals are conductively connected to the terminals 13b of the counter substrate 7b using ACF or the like. A plurality of terminals 23 formed at the other end of the FPC 3 b are connected to terminals (not shown) of the control board 5. In the FPC 3a, a plurality of panel-side terminals 14 are formed at the back surface side end portion, and a plurality of control board side terminals 16 are formed on the surface side at the opposite end portion. Here, a wiring pattern 18 is appropriately formed on the surface of the FPC 3a. The wiring pattern 18 is directly connected to the control board side terminal 16 at one end, and the other end is connected through the through hole 19. It is connected to the panel terminal 14.
[0039]
A diffusion plate 27 is attached to the surface of the light guide 4 on the liquid crystal panel 2 side by sticking or the like, and a reflector 28 is attached to the surface of the light guide 4 opposite to the liquid crystal panel 2 by sticking or the like. Is done. In addition, a plurality of LEDs (Light Emitting Diodes) 21 as light emitting means are supported by an LED substrate 38 so as to face a light capturing surface 4 a set on one side surface of the light guide 4.
[0040]
As shown in FIG. 4, the light guide 4 is attached to the back side of the liquid crystal panel 2 with a cushioning material 32 formed of rubber, plastic or the like interposed therebetween. The control board 5 is disposed so as to face the surface of the light guide 4 on which the reflection plate 28 is mounted. A terminal 33 for connecting to an external circuit is formed at the end of the control board 5.
[0041]
In the liquid crystal device 1 configured as described above, when the LED 21 emits light, the light is introduced into the light guide 4, and the introduced light is reflected by the reflecting plate 28 and proceeds in the direction of the liquid crystal panel 2. 27 is supplied to the liquid crystal panel 2 in a diffused state so as to have a uniform intensity in a plane. In the supplied light, the component that has passed through the polarizing plate 12a on the light guide is supplied to the liquid crystal layer, and the orientation is controlled for each pixel according to the change in the voltage applied between the pixel electrode 66 and the data line 52. The modulated liquid crystal modulates each pixel, and further passes the modulated light through the polarizing plate 12b on the display side, thereby displaying an image outside.
[0042]
[Method of manufacturing liquid crystal device]
FIG. 5 is a process diagram showing an example of a method for manufacturing the liquid crystal device 1 of the present embodiment. FIG. 6 is a perspective view schematically showing an original substrate used for manufacturing a pair of substrates constituting the liquid crystal panel 2. FIG. 7 is a process sectional view showing an element substrate forming process. FIG. 8 is a perspective view schematically showing a state in which the sealing material printing process for the element substrate forming original substrate and the rubbing process for the counter substrate forming original substrate are completed. FIG. 9 is a plan view schematically showing a state in which an empty panel is configured by bonding an original substrate for forming an element substrate and an original substrate for forming a counter substrate. FIGS. 10A and 10B are explanatory diagrams showing a state in which an empty panel is cut into a strip shape by a primary cutting process, and after injecting liquid crystal into the strip-shaped panel, the inlet is sealed. It is explanatory drawing which shows the state sealed with the stopping material.
[0043]
In this embodiment, in manufacturing the liquid crystal device 1 and the liquid crystal panel 2, an element substrate forming process including an active element forming process P1 to a sealing material printing process P5 shown in FIG. 5 and a color filter forming process P6 to a rubbing process P10 are performed. The counter substrate forming step is performed separately.
[0044]
First, in the element substrate forming process (active element forming process P1 to sealing material printing process P5), a large-area original substrate 24a as shown in FIG. 6 is prepared. The original substrate 24a is formed of a translucent material such as glass or plastic. Here, the original substrate 24a is cut along a virtual primary cutting planned line L11 indicated by a one-dot chain line and a virtual secondary cutting planned line L12 indicated by a two-dot chain line, and a plurality of element substrates 7a are taken later. The peripheral area 7c is discarded.
[0045]
In the present embodiment, first, the active element formation step P1 is performed on the original substrate 24a, thereby forming a plurality of liquid crystal panel wirings 51 and TFD elements 56. For convenience, FIG. 6 shows a state in which patterns for six liquid crystal panels are formed on the surface of the original substrate 24a. However, in an actual process, patterns for a larger number of liquid crystal panels are formed on the original substrate 24a. It is formed.
[0046]
The active element formation process P1 is performed as shown in FIG. 7, for example. That is, in the base layer forming step (a), a Ta oxide, for example, Ta is formed on the surface of the original substrate 24a. ₂ O _Five The underlayer 61 is formed by forming a film with a uniform thickness.
[0047]
Next, in the first metal layer forming step (b), for example, Ta is formed into a film with a uniform thickness by sputtering or the like, and further, the first layer of the scanning line 51 and the first metal are formed using photolithography technology. The layer 62 and the like are formed at the same time. At this time, the first layer of the scanning line 51 and the first metal layer 62 are connected by a bridge portion (not shown).
[0048]
Next, in the insulating layer forming step (c), anodization is performed using the first layer of the scanning line 51 as an anode terminal, and anodization that acts as an insulating film 63 on the surface of the scanning line 51 and the first metal layer 52. A film is formed with a uniform thickness. Thereby, an insulating layer (second layer) is formed on the surface of the scanning line 51, and an insulating layer 63 of the first TFD element 56a and the second TFD element 56b is formed. Note that, in performing the insulating layer forming step (c), the scanning line 51 has 2 to the power supply pattern 59 formed in the peripheral region 7c, as will be described later with reference to FIGS. 8 and 13A. They are connected via a relay pattern 55 formed along the next cutting planned line L12, and voltage is supplied from the power feeding pattern 59 to each scanning line 51.
[0049]
Next, in the bridge portion removing step (d), for example, the bridge portion is removed from the original substrate 24a by dry etching. Thereby, the first metal layer 62 and the insulating layer 63 of the first TFD element 56a and the second TFD element 56b are separated from the scanning line 51 in an island shape.
[0050]
Next, in the second metal layer forming step (e), after Cr is formed with a uniform thickness by sputtering or the like, the third layer of the scanning line 51, the first TFD element 56a is used by using a photolithography technique. The second metal layer 64a and the second metal layer 64b of the second TFD element 56b are formed. As described above, TFD elements 56 as active elements are formed on the surface of the original substrate 24a by the number of liquid crystal panels.
[0051]
Next, the pixel electrode formation process P2 of FIG. 5 is performed. Specifically, first, in the base layer forming step (f) of FIG. 7, the base layer 61 in the region corresponding to the pixel electrode 66 is removed to expose the original substrate 24a, and then in the electrode step (g). ITO for forming the pixel electrode 66 is formed with a uniform thickness by sputtering or the like, and a part of the pixel electrode 66 having a predetermined shape corresponding to the size of one pixel is formed by photolithography. The second metal layer 64b is formed so as to overlap. Through the series of steps, the TFD element 56 and the pixel electrode 66 shown in FIG. 2 are formed. The state of the original substrate 7a in this state is as shown in FIG.
[0052]
Thereafter, in the alignment film process P3 of FIG. 5, an alignment film is formed on the surface of the original substrate 24a by forming a uniform thickness of polyimide, polyvinyl alcohol, etc., and then in the rubbing process P4, the alignment film is processed. A rubbing treatment or other orientation treatment is performed on the substrate.
[0053]
Next, in the sealing material printing process P5, as shown in FIG. 8, the sealing material 6 is annularly applied by a dispenser, screen printing, or the like. A liquid crystal injection port 6 a is formed in a part of the seal material 6.
[0054]
Separately from the above element substrate forming process, an opposing substrate forming process (color filter forming process P6 to rubbing process P10) is performed. For this purpose, first, in FIG. 6, after preparing a large substrate 24b having a large area formed of a translucent material such as glass or plastic, a liquid crystal is formed on the surface of the original substrate 24b in a color filter forming step P6. Color filters are formed for the number of panels.
[0055]
The original substrate 24b is cut along a virtual primary cutting planned line L21 indicated by a one-dot chain line and a virtual secondary cutting planned line L22 indicated by a two-dot chain line, and a plurality of counter substrates 7b are taken later. . In FIG. 6, for the sake of convenience, six liquid crystal devices are shown on the surface of the original substrate 24b. However, in the actual process, a larger number of liquid crystal devices are formed. Here, when color display is not necessary, it is not necessary to form a color filter.
[0056]
Next, in a flattening layer forming step P7, a flattening layer (not shown) is formed on the color filter with a uniform thickness to flatten the surface.
[0057]
Next, in the counter electrode forming step P8, a stripe-shaped counter electrode, that is, the data line 52 is formed using an ITO film or the like.
[0058]
Next, after an alignment film having a uniform thickness is formed on the data line 52 or the like with polyimide or the like in the alignment film formation process P9, an alignment process such as a rubbing process is performed on the alignment film in the rubbing process P10. Apply. Thus, the original substrate 24b on the counter substrate side is completed.
[0059]
Then, as shown in FIGS. 8 and 9, the original substrate 24a for element substrate formation and the original substrate 24b for counter substrate formation are aligned, and the sealing material 6 is sandwiched between the original substrates 24a and 24b. They are bonded together (bonding step P11), and the sealing material 6 is further cured by ultraviolet curing, heat curing or other methods (sealing material curing step P12). Thereby, an empty panel structure 2a including a plurality of liquid crystal devices is formed.
[0060]
After that, for the empty panel structure 2a, a cutting groove is formed along the first planned cutting lines L11 and L21 described with reference to FIG. 6, and the panel structure 2a is further defined based on the cutting groove. Cut into a strip-shaped panel structure 2b as shown in FIG. 10A (primary cutting step P13). In this strip-shaped panel structure 2b, a liquid crystal injection port 6a formed by a discontinuous portion of the sealing material 6 is opened to the outside at a cutting position with respect to the original substrates 24a and 24b.
[0061]
Next, after injecting liquid crystal under reduced pressure from the exposed liquid crystal injection port 6a to the inside of the panel structure 2b (liquid crystal injection step P14), as shown in FIG. The sealing material 60 is applied to seal each liquid crystal inlet 6a (injector sealing step P15). In addition, since a liquid crystal adheres to the panel structure 2b by this process, the panel structure 2b which finished injecting the liquid crystal is subjected to a cleaning process (cleaning process P16).
[0062]
Thereafter, for the panel structure 2b, a cutting groove is formed along the second planned cutting lines L12 and L22 described with reference to FIG. 6, and then a strip-shaped panel structure is formed along the cutting groove. A plurality of liquid crystal panels 2 are cut out by cutting the original substrates 24a and 24b in 2b (secondary cutting step P17).
[0063]
Thereafter, the liquid crystal device 1 is completed by mounting the liquid crystal driving ICs 8a and 8b, the control board 5 and the like on the liquid crystal panel 2, and further connecting the FPCs 3a and 3b (mounting process P18).
[0064]
(Features of this form)
11 (a) and 11 (b) are respectively a plan view showing a region surrounded by a circle A in FIG. 8 in an enlarged manner, and an explanatory diagram showing a state when the original substrate is accurately cut at this portion, 11 (c) and 11 (d) are explanatory views showing a state when the accuracy when the original substrate is cut is low. FIG. 12 is an explanatory diagram showing a state in which the liquid crystal injection port is sealed with a sealing material after the liquid crystal is injected into the strip-shaped panel in the manufacturing method of the liquid crystal device to which the present invention is applied. 13 (a) and 13 (b) are respectively a plan view showing an enlarged area surrounded by a circle B in FIG. 8 and an explanatory diagram showing a state when the original substrate is cut with high precision at this portion. FIGS. 13C and 13D are explanatory views showing a state when the accuracy when the original substrate is cut is low. 14 (a) and 14 (b) are respectively a plan view showing a region surrounded by a circle C in FIG. 8 in an enlarged manner, and an explanatory diagram showing a state when the original substrate is accurately cut at this portion, FIGS. 14C and 14D are explanatory views showing a state when the accuracy when the original substrate is cut is low.
[0065]
In the manufacturing method of the liquid crystal device 1 according to the present invention, the original substrate 24a immediately before performing the bonding step P11 is configured as shown in FIG. 8, and in FIG. 8, in the region surrounded by the circle A of the original substrate 24a. As shown in FIG. 11A, a rectangular solid mark 100 that overlaps the primary cutting planned line L11 with a predetermined width is formed along the primary cutting planned line L11. This mark 100 is a Ta film and a second metal that are simultaneously formed with the first metal layer 52 in the first metal layer forming step (b) in the active element forming step P1 performed before the primary cutting step P13. It is a Cr film formed simultaneously with the second metal layers 64a and 64b in the layer forming step (e), or a multilayer film in which these films are laminated.
[0066]
Here, the marks 100 are formed at two locations on both sides of the liquid crystal injection port 6 a formed by the discontinuous portion of the sealing material 6.
[0067]
After forming the panel structure 2a by bonding the original substrate 24b for forming the counter substrate to the original substrate 24a for forming the element substrate thus configured, in the primary cutting step P13, the panel structure 2a is changed to 1 When cutting along the next planned cutting lines L11 and L21, a cutting groove is formed so as to pass through the center in the width direction of the mark 100 to cut the panel structure 2a. Here, the width dimension W1 of the mark 100 is set to a width dimension corresponding to the tolerance of the cut portion.
[0068]
Therefore, when the panel structure 2a is cut into the strip-shaped panel structure 2b, if it is confirmed whether or not a part of the mark 100 remains on both sides of the cut portion, the cutting is performed with an accuracy that clears the tolerance. It is possible to easily inspect whether or not it has been broken. That is, if cutting is performed with high accuracy, as shown in FIG. 11B, a part of the mark 100 remains on both sides of the cutting portion, whereas if cutting accuracy is poor, FIG. As shown in (c) and (d), the mark 100 remains only in one of the cut portions, and the mark 100 does not remain in the other.
[0069]
After such a primary cutting step P13, in the strip-shaped panel structure 2b, as shown in 10 (a) and FIG. Part of the mark 100 remains at two places on both sides of the inlet 6a.
[0070]
Therefore, in the liquid crystal injection step P14, after the liquid crystal is injected from the liquid crystal injection port 6a in the state of the strip-shaped panel structure 3b, in the sealing step P15, the liquid crystal injection port 6a is sealed with the mark 100 as a reference. Stop material 60 is applied. That is, as shown in FIG. 12, the sealing material 60 is not applied to the end portions of the mark 100 located on both sides of the liquid crystal injection port 6a, that is, from the end portions of the mark 100 located on both sides of the liquid crystal injection port 6a. The sealing material 60 is applied so as not to protrude, and then the sealing material 60 is cured. Therefore, the liquid crystal injection port 6a can be reliably sealed, and the sealing material 60 is not excessively applied.
[0071]
In the present embodiment, the mark 100 is a Ta film formed simultaneously with the first metal layer 52 in the first metal layer forming step (b) in the element substrate forming step described with reference to FIG. A Cr film formed simultaneously with the second metal layers 64a and 64b in the two metal layer forming step (e). Such a film is formed by patterning using a photolithography technique in the process of forming the TFD element 56. Therefore, even if the mark 100 is formed, it is not necessary to add a new process. Furthermore, since such a Ta film or Cr film is conspicuous from the base substrate, inspection with respect to the primary cutting process P13 or application of the sealing material 60 with reference to the mark 100 is performed based on this Ta film or Cr film. Easy to do.
[0072]
Further, in this embodiment, a configuration is employed in which cutting accuracy can be easily inspected at other cutting locations.
[0073]
First, in an area surrounded by a circle B in FIG. 8, as shown in FIG. 13, the end of each scanning line 51 is connected to the power feeding pattern 59 via a relay pattern 55 corresponding to the scanning line 51 on a one-to-one basis. The planned secondary cutting line L12 passes through the relay pattern 55. Therefore, in the original substrate 24a, the end portion of the scanning line 51 and the power supply pattern 59 are opposed to each other with a predetermined distance as the first pattern 201 and the second pattern 202 on both sides of the secondary cutting planned line L12. In addition, between the first pattern 201 and the second pattern 202, the relay pattern 55 has a form such as a width dimension, a shape, a color, a formation position, and the like with the first pattern 201 and the second pattern 202. Different boundary patterns 203 are formed. In addition, the width dimension W2 of the region where the boundary pattern 203 is formed is a dimension corresponding to the tolerance at the cut portion.
[0074]
Therefore, in the secondary cutting step P17, when the original substrate 24a is cut along the planned secondary cutting line L12 with respect to the strip-shaped panel structure 2b, the boundary pattern 203 (relay pattern 55) is formed on both sides of the cut portion. After cutting the original substrate 24a so that a part of the original substrate 24a remains, if it is checked whether or not a part of the boundary pattern 203 remains on both sides of the cut portion, the cutting with respect to the original substrate 24a can be performed with an accuracy that clears the tolerance. It can be easily inspected whether it has been performed or not. That is, if cutting is performed with high accuracy, as shown in FIG. 13B, a part of the boundary pattern remains on both sides of the cutting portion, whereas if cutting accuracy is poor, FIG. As shown in (c) and (d), the boundary pattern 203 remains only at one of the cut portions, and the boundary pattern 203 does not remain at the other.
[0075]
Here, the first pattern 201 composed of the end of the scanning line 51, the second pattern 202 composed of the power feeding pattern 59, and the boundary pattern 203 composed of the relay pattern 55 are composed of the primary cutting step P13 and the secondary cutting step P17. In the active element forming step P1 performed before performing the step, the Ta film formed simultaneously with the first metal layer 52 in the first metal layer forming step (b), or after the anodic oxidation treatment, on the surface of the Ta film On the other hand, the second metal layer forming step (e) is a multilayer film in which Cr films simultaneously formed with the second metal layers 64a and 64b are laminated. Such a film is formed in the process of forming the TFD element 56. It is formed by patterning using a lithography technique. Therefore, it is not necessary to add a new process even if the boundary pattern 203 for cutting inspection is formed. Furthermore, since such a Ta film or Cr film is conspicuous from the substrate as a base, it is possible to easily inspect the secondary cutting process P17 based on this.
[0076]
Further, in this embodiment, in the region surrounded by a circle C in FIG. 8, as shown in FIG. 14A, the first pattern 301 composed of the terminal 13a and the second pattern 302 formed in the peripheral region Are opposed to each other with a predetermined distance between both sides of the planned secondary cutting line L12, and between the first pattern 301 and the second pattern 302, these patterns 301, 302 and the width dimension , Different boundary patterns 303 are formed. Here, the width dimension W3 of the region where the boundary pattern 303 is formed is a dimension corresponding to a tolerance when the original substrate 24a is cut along the secondary cutting planned line L12.
[0077]
Accordingly, in the secondary cutting step P13, when the strip-shaped panel structure 2b is cut along the planned secondary cutting line L12, the original substrate 24a is placed so that a part of the boundary pattern 303 remains on both sides of the cut portion. After cutting, if it is confirmed whether or not a part of the boundary pattern 303 remains on both sides of the cut portion, it can be easily determined whether or not the cut to the original substrate 24a has been performed with an accuracy that clears the tolerance. Can be inspected. That is, if cutting is performed with high accuracy, as shown in FIG. 14B, a part of the boundary pattern 303 remains on both sides of the cutting portion, whereas if the cutting accuracy is low, 14 (c) and 14 (d), the boundary pattern 303 remains only at one of the cut portions, and the boundary pattern 303 does not remain at the other.
[0078]
Here, the first pattern 301, the second pattern 302, and the boundary pattern 303 including the terminals 13a are formed in the active element formation process P1 that is performed before the primary cutting process P13 and the secondary cutting process P17 are performed. Ta film formed simultaneously with the first metal layer 52 in the first metal layer forming step (b), Cr film formed simultaneously with the second metal layers 64a and 64b in the second metal layer forming step (e), or these These films can be formed by patterning using a photolithography technique in the process of forming the TFD element 56. Therefore, it is not necessary to add a new process even if the boundary pattern 303 for cutting inspection is formed. Furthermore, since such a Ta film or Cr film is conspicuous from the substrate as the base, it is possible to easily inspect the secondary cutting process P17 based on this.
[0079]
[Other embodiments]
FIGS. 15A and 15B are a plan view and an explanatory view showing a configuration in the vicinity of a planned cutting line that can be employed instead of the configuration shown in FIG. 13 or FIG. FIG. 16 is a plan view showing another configuration near the planned cutting line that can be used instead of the configuration shown in FIG. 13 or FIG. FIG. 17 is a plan view showing still another configuration in the vicinity of the planned cutting line that can be employed instead of the configuration shown in FIG. 13 or FIG.
[0080]
As shown in FIGS. 15A and 15B, in the original substrate 24a, since the terminal 13a is often formed as a two-layer structure of a Ta film and a Cr film, for example, the first pattern 401 and the first pattern 401 The second pattern 402 may be a two-layer structure of a Ta film and a Cr film, and the boundary pattern 403 may be composed of only a Ta film. In such a configuration, since the hues of the Cr film and the Ta film are different, whether or not a part of the boundary pattern 403 remains on both sides of the cut portion even if the shapes of these patterns 401, 402, and 403 are the same. It is possible to confirm whether or not.
[0081]
In addition, as shown in FIG. 16, when the power supply pattern 59 and the like are formed on the original substrate 24a, this pattern is formed as a boundary pattern 503 having a predetermined width and straddling the planned secondary cutting line L12. In the cutting step, the original substrate 24a may be cut along the planned secondary cutting line L12 so that a part of the boundary pattern 503 remains on both sides of the cut portion.
[0082]
At this time, the width dimension W5 of the region where the boundary pattern 403 is formed is set to a dimension corresponding to a tolerance when cutting this portion. Accordingly, when the original substrate 24a is cut along the planned secondary cutting line L12, it is possible to accurately cut the original substrate 24a by checking whether or not a part of the boundary pattern remains on both sides of the cut portion. It is possible to easily inspect whether or not it has been broken. That is, if cutting is performed with high accuracy, a part of the boundary pattern 503 remains on both sides of the cutting portion, whereas if the cutting accuracy is poor, the boundary pattern 503 remains only on one of the cutting portions, This is because the boundary pattern 503 does not remain on the other side. Such a pattern can also be formed simultaneously with a thin film forming a wiring or an electric element formed on the original substrate 24a, for example, a Ta film or a Cr film.
[0083]
Further, as shown in FIG. 17, a first pattern 601 and a second pattern 602 are formed opposite to each other with a predetermined distance on both sides of the original substrate 24a across the secondary cutting planned line L12. Alternatively, in the cutting step P17, the original substrate 24a may be cut along the planned secondary cutting line L12 so that the first pattern 301 and the second pattern 302 are not missing on both sides of the cut portion.
[0084]
Such a configuration occurs, for example, in the configuration described with reference to FIG. 13A by removing the relay pattern 55 after the anodizing process and before performing the cutting process, and in the cutting process. This corresponds to the case where the static electricity entered into the substrate through the relay pattern 55.
[0085]
In such a configuration, the first pattern 601 and the second pattern 602 are formed with a distance W6 corresponding to a tolerance when the original substrate 24a is cut. Therefore, when the original substrate 24a is cut along the planned secondary cutting line L12, if it is confirmed whether or not the first pattern 601 and the second pattern 602 remain on both sides of the cut portion, It can be easily inspected whether or not the substrate 24a has been cut accurately. That is, if cutting is performed with high accuracy, the first pattern 601 and the second pattern 602 remain intact on both sides of the cutting portion, whereas if cutting accuracy is low, one of the cutting portions This is because the first pattern 601 or the second pattern 602 is lost.
[0086]
In the above embodiment, the active matrix type liquid crystal device 1 using a TFD element as an active element has been described as an example. However, the active matrix type liquid crystal device using a thin film transistor as an active element or other electro-optical device may be used. The present invention may be applied in various ways within the scope of the invention described in the claims.
[0087]
(Embodiment of electronic device)
FIG. 18 shows an embodiment in which the liquid crystal device according to the present invention is used as a display device of various electronic devices. The electronic device shown here includes a display information output source 70, a display information processing circuit 71, a power supply circuit 72, a timing generator 73, and a liquid crystal device 74. The liquid crystal device 74 includes a liquid crystal display panel 75 and a drive circuit 76. As the liquid crystal device 74 and the liquid crystal panel 75, the liquid crystal device 1 and the liquid crystal panel 2 described above can be used.
[0088]
The display information output source 70 includes a memory such as a ROM (Read Only Memory) and a RAM (Random Access Memory), a storage unit such as various disks, a tuning circuit that tunes and outputs a digital image signal, and the like, and is generated by a timing generator 73. Display information such as an image signal in a predetermined format is supplied to the display information processing circuit 71 based on the various clock signals.
[0089]
The display information processing circuit 71 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, a clamp circuit, and the like, executes processing of input display information, The signal is supplied to the drive circuit 76 together with the clock signal CLK. The drive circuit 76 is a general term for the scanning line drive circuit 57, the data line drive circuit 58, the inspection circuit, and the like in FIG. The power supply circuit 72 supplies a predetermined voltage to each component.
[0090]
FIG. 19 shows a mobile personal computer that is an embodiment of an electronic apparatus according to the invention. The personal computer shown here has a main body 82 having a keyboard 81 and a liquid crystal display unit 83. The liquid crystal display unit 83 includes the liquid crystal device 1 described above.
[0091]
FIG. 20 shows a mobile phone which is another embodiment of the electronic apparatus according to the invention. The cellular phone 90 shown here has a plurality of operation buttons 91 and the liquid crystal device 1.
[0092]
【The invention's effect】
As described above, in the present invention, since a mark having a width corresponding to the tolerance when cutting the original substrate is formed on the original substrate, when the original substrate is cut along the planned cutting line, If it is confirmed whether or not a part of the mark remains on both sides, it can be easily inspected whether or not the cutting has been performed with high accuracy. In other words, if cutting is performed with high accuracy, a part of the mark remains on both sides of the cutting point, whereas if cutting accuracy is poor, the mark remains only on one side of the cutting point and the mark on the other side. This is because there is no remaining. In addition, in the empty panel in which the first substrate and the second substrate are bonded together, the injection port for injecting the electro-optical material into the substrate is opened at the cutting position with respect to the original substrate, so that the cutting step If the mark used to inspect the quality of the substrate is formed at a position that indicates the application range of the sealing material to be applied to the injection port, the sealing material is applied based on the mark. it can. Therefore, it is possible to avoid the occurrence of problems due to the large amount of sealing material applied.
[Brief description of the drawings]
FIG. 1 is a block diagram schematically showing an electrical configuration of a liquid crystal device to which the present invention is applied.
FIGS. 2A and 2B are a plan view of one pixel in an element substrate among a pair of substrates sandwiching a liquid crystal layer in a liquid crystal panel of a liquid crystal device to which the present invention is applied, and FIG. It is AA sectional view taken on the line of (a).
FIG. 3 is an exploded perspective view of a liquid crystal device to which the present invention is applied.
FIG. 4 is a cross-sectional view of a liquid crystal device to which the present invention is applied.
FIG. 5 is a process diagram showing an example of a manufacturing method of a liquid crystal device to which the present invention is applied.
FIG. 6 is an explanatory diagram of an original substrate used to manufacture a pair of substrates constituting a liquid crystal panel of a liquid crystal device to which the present invention is applied.
FIG. 7 is a process cross-sectional view showing an element substrate forming process in the manufacturing process of a liquid crystal device to which the present invention is applied.
FIG. 8 schematically shows a state in which a sealing material printing process for an original substrate for forming a process element substrate and a rubbing process for an original substrate for forming a counter substrate are finished in a method for manufacturing a liquid crystal device to which the present invention is applied. It is a perspective view shown.
FIG. 9 is a plan view schematically showing a state in which an empty panel is formed by bonding an element substrate forming original substrate and a counter substrate forming original substrate in a liquid crystal device manufacturing method to which the present invention is applied; FIG.
FIGS. 10A and 10B are explanatory views showing a state in which the empty panel shown in FIG. 9 is cut into strips by a primary cutting process, and after injecting liquid crystal into the strip-like panel; It is explanatory drawing which shows the state which sealed the injection hole with the sealing material.
FIGS. 11A and 11B are a plan view showing a region surrounded by a circle A in FIG. 8 in an enlarged manner, and an explanatory view showing a state when the original substrate is cut accurately at this portion. Yes, both (c) and (d) are explanatory views showing a state when the accuracy when the original substrate is cut is low.
FIG. 12 is an explanatory diagram showing a state in which a liquid crystal injection port is sealed with a sealing material after liquid crystal is injected into a strip-shaped panel in a method for manufacturing a liquid crystal device to which the present invention is applied.
FIGS. 13A and 13B are a plan view showing a region surrounded by a circle B in FIG. 8 in an enlarged manner, and an explanatory view showing a state when the original substrate is accurately cut at this portion. Yes, both (c) and (d) are explanatory views showing a state when the accuracy when the original substrate is cut is low.
FIGS. 14A and 14B are a plan view showing an enlarged area surrounded by a circle C in FIG. 8 and an explanatory view showing a state when the original substrate is cut accurately at this portion. Yes, both (c) and (d) are explanatory views showing a situation when the accuracy when the original substrate is cut is low.
FIGS. 15A and 15B are a plan view and an explanatory view showing a configuration in the vicinity of a planned cutting line that can be employed instead of the configuration shown in FIG. 13 or FIG.
16 is a plan view showing another configuration in the vicinity of a planned cutting line that can be used instead of the configuration shown in FIG. 13 or FIG. 14;
17 is a plan view showing still another configuration in the vicinity of a planned cutting line that can be employed instead of the configuration shown in FIG. 13 or FIG. 14;
FIG. 18 is a block diagram illustrating a configuration of various electronic devices using the liquid crystal device according to the invention.
FIG. 19 is an explanatory diagram showing a mobile personal computer as an embodiment of an electronic apparatus using the liquid crystal device according to the invention.
FIG. 20 is an explanatory diagram of a mobile phone as an embodiment of an electronic apparatus using the liquid crystal device according to the invention.
[Explanation of symbols]
1 Liquid crystal device (electro-optical device)
2 LCD panel
2a Large panel structure
2b Strip-shaped panel structure
6 Sealing material
6a Liquid crystal injection port
7a Element substrate
7b Counter substrate
8a, 8b Liquid crystal drive IC
12a, 12b Polarizing plate
17a Substrate constituting the element substrate
17b Substrate constituting the counter substrate
24a Original substrate for element substrate formation
24b Original substrate for counter substrate formation
51 scan lines
52 data lines
53 pixels
54 Liquid crystal layer
55 Relay pattern
56 TFD element
57 Scanning line drive circuit
58 Data line drive circuit
59 Power supply pattern
60 Sealant
61 Underlayer
62 1st metal layer
63 Insulation layer
64a, 64b second metal layer
66 Pixel electrode
100 mark
201, 301, 401, 601 First pattern
202, 302, 402, 602 second pattern
203, 303, 403 Border pattern
L11, L21 Primary cutting schedule line
L12, L22 Secondary cutting schedule line

Claims (12)

A cutting step of cutting the original substrate for forming the first substrate along a planned cutting line, and an opening in the empty panel in which the second substrate is bonded to the first substrate, an opening is made at a cutting position with respect to the original substrate. In an electro-optical device manufacturing method having an injection step of injecting an electro-optical material between substrates via an inlet, and a sealing step of sealing the injection port by applying a sealing material to the injection port.
A step of forming a mark having a predetermined width at a position that overlaps the planned cutting line of the original substrate and that indicates a coating range of the sealing material;
In the cutting step, the original substrate is cut along the planned cutting line so that a part of the mark remains on both sides of the cut portion,
In the sealing step, the sealing material is applied in a predetermined range with the mark as a reference.   2. The mark according to claim 1, wherein the mark is formed at two locations on both sides of the injection port, and in the sealing step, at the end of the mark formed at two locations on both sides of the injection port. A method of manufacturing an electro-optical device, wherein the sealing material is applied in a range that does not overlap.   3. The method of manufacturing an electro-optical device according to claim 1, wherein the mark is formed simultaneously with a wiring formed on the original substrate or a thin film constituting an electric element.   3. The method of manufacturing an electro-optical device according to claim 1, wherein the mark is formed from a Ta film or a Cr film. In any one of Claims 1 thru | or 4, While forming the 1st pattern and 2nd pattern which oppose a predetermined distance on both sides which pinched | interposed the said cutting plan line with respect to the said original substrate, The said Between the first pattern and the second pattern, comprising a step of forming a boundary pattern different in form from these patterns,
In the cutting step, the original substrate is cut along the planned cutting line so that a part of the boundary pattern remains on both sides of the cut portion. 6. The method according to claim 5, wherein the first pattern is formed as ends of a plurality of wirings formed in a substrate formation region cut out as the first substrate, while the second pattern is formed from the substrate formation region. Forming a power feeding pattern in a peripheral region to be separated, and forming the boundary pattern as a relay pattern that electrically connects each of the first patterns to the second pattern;
Before performing the cutting step, the first pattern or the conductive film electrically connected to the first pattern is fed from the second pattern through the boundary pattern to the first pattern. An electro-optical device manufacturing method comprising performing anodizing treatment.   7. The electro-optical device according to claim 6, wherein the anodizing treatment is an anodizing treatment for forming an electric element using the conductive film and an insulating film formed on a surface of the conductive film. Manufacturing method.   8. The method of manufacturing an electro-optical device according to claim 7, wherein the electric element is a TFD element for pixel switching. In any one of Claim 1 thru | or 4, Comprising: The process which forms the pattern which straddles the said cutting plan line with a predetermined width with respect to the said original substrate,
In the cutting step, the original substrate is cut along the planned cutting line so that a part of the pattern remains on both sides of the cut portion. 5. The method according to claim 1, further comprising: forming a first pattern and a second pattern that are opposed to each other with a predetermined distance on both sides of the planned cutting line with respect to the original substrate. And
In the cutting step, the original substrate is cut along the planned cutting line so that the first pattern and the second pattern are not cut off on both sides of the cut portion.   11. The method of manufacturing an electro-optical device according to claim 5, wherein each of the patterns is formed simultaneously with a thin film that forms a wiring or an electric element formed on the original substrate.   11. The method of manufacturing an electro-optical device according to claim 5, wherein each of the patterns is formed from a Ta film or a Cr film.

Images