JP3894410B2 - Adhesive composition for lignocellulosic material, hot-press molded body using the same, and method for producing hot-press molded body - Google Patents

Description

【００３７】
［Ａ液合成原料］

【００３８】
［接着剤組成物の調製及び評価］
上記、表１により得られた有機ポリイソシアネートＡ１〜Ａ５と下記に示す離型剤、触媒を組み合わせてリグノセルロース系材料用接着剤組成物を調整した。その各接着剤組成物の仕込み量を表２に示す。
なお、比較例１は、ワックスエマルジョンを用いなかったため成形体が熱盤に非常に強固に接着し、物性評価はできなかった。
【００３９】
【表２】

【００４０】
［Ｂ液原料］
ワックスエマルジョンＰ：
モンタン系のワックスエマルジョン（融点＝７８℃、酸価＝１ｍｇＫＯＨ／ｇ、ＧＰＣによるポリスチレン換算数平均子量１００〜１，０００の成分＝８８．８％、固形分＝３０％、ＩＲ分析による１７００〜１７６０ｃｍ^-1のピークと２９００〜２９６０ｃｍ^-1のピークとの吸光度比＝０．０３）
ワックスエマルジョンＱ：
パラフィン系のワックスエマルジョン（融点＝６０℃、酸価＝１ｍｇＫＯＨ／ｇ、ＧＰＣによるポリスチレン換算数平均子量１００〜１，０００の成分＝８２．３％、固形分＝３０％）
ワックスエマルジョンＲ：
モンタン系のワックスエマルジョン（融点＝８５℃、酸価＝９０ｍｇＫＯＨ／ｇ、ＧＰＣによるポリスチレン換算数平均子量１，０００以下の成分＝２３．１％、固形分＝３０％、ＩＲ分析による１７００〜１７６０ｃｍ^-1のピークと２９００〜２９６０ｃｍ^-1のピークとの吸光度比＝０．１７）
［Ｃ液原料］
触媒Ｓ：トリエチレンジアミン
触媒Ｔ：Ｎ，Ｎ−ジメチルエタノールアミン
触媒Ｕ：ジブチルチンジラウレート
【００４１】
［リグノセルロース系材料の熱圧成形体の成形方法］
（１）成形条件
ボードサイズ：４０ｃｍ×４０ｃｍ
ボード厚み：１５ｍｍ
設定密度：７２０ｋｇ／ｍ³
木質チップ又は木質繊維の含水率及び樹種：３％、針葉樹
製品含水率：９％
マット含水率：１４％
熱盤（プレス）温度：２００℃
熱盤（プレス）圧力：３ＭＰａ（面圧）
熱盤（プレス）時間：１５０秒
【００４２】
（２）成形方法
表２に記載の熱圧成形体の作成について、木質チップを用いて得られるパーティクルボード（実施例１、２、５、比較例１、２）については、下記の１）の方法にて作成し、木質繊維を用いて得られる中密度繊維板（実施例３、４、比較例３、４）については、下記の２）の方法にて作成した。
１）実施例１、２、５、比較例１、２の成形体の作成方法
表２に記載の量の針葉樹の木質チップを撹拌羽根のついた容積約０．５ｍ³のブレンダーに投入し、そこに表２に記載の量の有機ポリイソシアネート化合物、ワックスエマルジョン、触媒及びマット含水率用の水の混合物を、約５分間混合撹拌しながらスプレー塗布した。その後、その接着剤組成物が塗布された木質チップを取り出して、成形後の成形体の密度が設定密度になるように計量し、下記の鉄板上に前記ボードサイズになるようにフォーミングし、更に同形状の鉄板を上に載せ、前記条件で熱圧成形した。
２）実施例３、４、比較例３、４の成形体の作成方法
表２に記載の量の針葉樹の木質チップを加圧リファイナー（解繊機）を用いて、蒸解圧力＝０．７ＭＰａ、蒸解温度＝１５０℃の条件で解繊（繊維化）した。それを配管に通し、そこに表２に記載の量の有機ポリイソシアネート化合物、ワックスエマルジョン、触媒及びマット含水率用の水の混合物を同時に配管内に添加して、気流乾燥機にて前記マット含水率になるまで乾燥させた。その後、その接着剤組成物が塗布された木質繊維を取り出して、成形後の成形体の密度が設定密度になるように計量し、下記のステンレススチール板上に前記ボードサイズになるようにフォーミング成形装置を用いてフォーミングし、更に同形状のステンレススチール板を上に載せ、前記条件で熱圧成形した。
［離型性の確認］
ボード上下に高抗張力ステンレススチール板を置き、前記成形時に離型性の確認を行った。
［物性測定］
前記、表２の実施例１、２、５、比較例１、２の成形体の各種物性値については、ＪＩＳ Ａ−５９０８に準じて測定し、実施例３、４、比較例３、４の成形体の各種物性値については、ＪＩＳ Ａ−５９０５に準じて測定した。
【図面の簡単な説明】
【図１】：ワックスエマルジョンＰのＧＰＣチャート及びポリスチレン換算の分子量測定結果（抜粋）である。
【図２】：ワックスエマルジョンＰのＦＴ−ＩＲチャートである。
【図３】：ワックスエマルジョンＲのＧＰＣチャート及びポリスチレン換算の分子量測定結果（抜粋）である。
【図４】：ワックスエマルジョンＲのＦＴ−ＩＲチャートである。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesive composition for a lignocellulosic material comprising an organic polyisocyanate compound, a wax emulsion, and a catalyst, and a hot-press molded product having excellent physical properties such as releasability and hot water resistance, and heat The present invention relates to a method for producing a pressure-formed body.
[0002]
[Prior art]
Conventionally, urea resin, melamine resin, urea melamine as adhesives for hot-pressed bodies of lignocellulosic materials such as wood chips and wood fibers (particle boards, boards such as medium density fiber boards called MDF) Formalin adhesives such as resins, phenol resins, phenol melamine resins and the like have been used. However, from the viewpoint of improving the residential environment and improving safety in terms of health, it has become necessary to reduce the formalin released from the adhesive as seen in the recent problem of sick house syndrome, for example.
[0003]
As an adhesive that can cope with the above problems, organic polyisocyanate resin, which is a non-formalin adhesive, is used due to its excellent adhesive properties, hot water resistance, etc. in addition to the characteristic that it does not contain formalin in its structure originally Has been. However, when an organic polyisocyanate resin is used as an adhesive for the above-mentioned hot-press molded body, the metal surface (hereinafter referred to as a hot plate) that comes into contact when hot-press molding is performed with a continuous or batch press because of its excellent adhesion. In other words, the molded body cannot be stably and continuously manufactured.
[0004]
[Problems to be solved by the invention]
In order to solve the problem of adhesion to the hot platen, a method in which a mold release agent (hereinafter referred to as an external mold release agent) is directly applied before hot pressing with the hot platen is disclosed in JP-A-52-154875. Proposed in the Gazette.
[0005]
However, in the method using an external release agent, it is necessary to apply to a heating plate as appropriate in order to ensure continuous release properties, and there is a problem that workability and complexity of the application method are difficult.
[0006]
On the other hand, a method of mixing an additive (hereinafter referred to as an internal mold release agent) with organic polyisocyanate instead of such an external mold release coating method is disclosed in JP-A-57-113053 and JP-A-Sho. No. 55-160014 and the like. Japanese Patent Application Laid-Open No. 4-232004 proposes a method for hot-pressing a lignocellulosic material by adding an orthophosphoric acid neutral ester as a compatibilizing agent for an emulsion wax and an organic polyisocyanate.
[0007]
In the method using an internal mold release agent, it is necessary to use a large amount of the internal mold release agent in order to exert a sufficient mold release effect. The manufacturing process has difficulties in terms of long-term sustainability and economy, and has not been applied to the current production process as it is. In JP-A-4-232004, a liquid mixture of wax and neutral ester of orthophosphoric acid that is easy to operate at room temperature cannot be obtained, and there is a problem in handling the emulsion wax. Further, JP-A-57-113053 and JP-A-4-232004 disclose that various waxes are used, but there is no description suggesting the relationship between the molecular weight distribution of the wax component and the adhesive performance.
[0008]
As an improvement of the internal mold release agent method, JP-A-11-71566 discloses an adhesive composition containing an organic polyisocyanate compound, a low molecular weight low density polyethylene, water as essential components, and a method for producing a board using the same. Has been proposed.
[0009]
[Means for Solving the Problems]
As a result of diligent research, the present inventors have found that an adhesive composition comprising an organic polyisocyanate compound, a paraffin wax emulsion having a molecular weight, a melting point, and an acid value of a certain width and a catalyst is used for a hot-press molded product of lignocellulosic material. The present inventors have found that the above-mentioned problems can be solved as an adhesive composition, and have completed the present invention.
[0010]
That is, this invention is shown by the following (1)-(5).
(1) An adhesive composition comprising an organic polyisocyanate compound (A), a wax emulsion (B), and a catalyst (C),
The wax component of the wax emulsion (B) has an acid value of 10 mgKOH / g or less, a melting point of 40 to 160 ° C., and a polystyrene-reduced number average molecular weight of 100 to 1, as determined by gel permeation chromatography (GPC). An adhesive composition for a hot-pressed body of a lignocellulosic material, characterized in that the component of 000 is a GPC peak area ratio of 80% or more.
[0011]
(2) The adhesive composition according to (1), wherein the wax emulsion (B) is a paraffin wax emulsion.
[0012]
(3) The adhesive composition according to (1), wherein the wax emulsion (B) is a montan wax emulsion.
[0013]
(4) A hot-press molded body of lignocellulosic material using the adhesive composition according to any one of (1) to (3).
[0014]
(5) A method for producing a hot-press molded body of a lignocellulosic material using the adhesive composition according to any one of (1) to (3).
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the components of the adhesive composition of the present invention will be described.
Examples of the organic polyisocyanate compound used for the component (A) include diphenylmethane diisocyanate (hereinafter referred to as MDI), a mixture of MDI and an MDI-based multinuclear condensate (hereinafter referred to as polymeric MDI), and liquid. Single or two types of polyisocyanates such as MDI (carbodiimide-modified MDI), tolylene diisocyanate, xylylene diisocyanate, trimethylene xylylene diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate, naphthalene diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate A catalyst is added to the above mixture or the above polyisocyanate to form a dimer (uretdione-modified) or trimer (isocyanurate-modified). Etc. The. In the present invention, a type having good compatibility with the wax emulsion and catalyst defined in the present invention is preferable.
[0016]
In addition to the above, for example, methanol, ethanol, propanol, butanol, octanol, lauryl alcohol and other monools, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, butylene glycol, 1,3-butane Diols such as diol, 1,4-butanediol and 1,6-hexanediol, polyols such as glycerin, trimethylolpropane and pentaerythritol, alkanolamines such as monoethanolamine, diethanolamine and triethanolamine, An alkylene oxide such as ethylene oxide, propylene oxide, butylene oxide, styrene oxide, etc. alone or in a mixture of glycerin, sorbitol, sucrose, etc. A monool or polyol obtained by addition polymerization using a known method alone or in combination with an organic polyisocyanate compound, for example, an isocyanate group of an organic polyisocyanate compound and a hydroxyl group of the monool or polyol. The isocyanate group-containing urethane prepolymer obtained by reacting by a known method so that the equivalent ratio (isocyanate group / hydroxyl group) is in the range of 1.5 to 500, preferably 2.0 to 400 is also the component (A). As described above, the type having good compatibility with the wax emulsion and the catalyst is preferable.
[0017]
The isocyanate content of the organic polyisocyanate compound (A) is preferably 25 to 35% by mass, more preferably 28 to 33% by mass. The viscosity at 25 ° C. is 1,000 mPa · s or less, preferably 800 mPa · s or less.
[0018]
The organic polyisocyanate compound (A) preferred in the present invention is an isocyanate group-terminated prepolymer of polymeric MDI and polyether mono and / or diol. Furthermore, a preferable composition of this polymeric MDI is such that the MDI content is 50% by mass or less.
[0019]
The purpose of the wax emulsion (B) in the present invention is an effect as a release agent for avoiding adhesion to a hot platen, for example, paraffin wax, montan wax, carnauba wax, rice wax, etc. Natural waxes, and synthetic waxes such as paraffin wax derivatives, montan wax derivatives, hardened castor oil, stearamide, and the like in aqueous emulsions. Among these, paraffin wax, montan wax and derivatives thereof exhibit good releasability and, as a secondary effect, give a good effect on the hot water resistance of the hot-press molded body.
[0020]
A known emulsifier can be used for emulsification of the wax component. Examples of such emulsifiers include surfactants such as alkyl sulfonates, alkyl benzene sulfonates, dialkyl aryl sulfonates and the like, and esters with fatty acids such as polyoxyethylene alkyl ethers and polyoxyethylene aryl ethers. An agent can be mentioned.
[0021]
In the wax emulsion (B) used in the present invention, the acid value of the wax component is 10 mgKOH / g or less. When the acid value is larger than 10 mgKOH / g, the reaction between the organic polyisocyanate compound used in the component (A) and active hydrogen contained in water or lignocellulosic material is inhibited, and a molded article having high physical properties can be obtained. I can't.
[0022]
The melting point of the wax component is 40 to 160 ° C. When the melting point of the wax component is less than 40 ° C., it tends to evaporate and vaporize under the conditions of 100 to 200 ° C., which is a normal hot pressing temperature, and it is difficult to exhibit releasability. On the other hand, in the case where the melting point is 160 ° C. or higher, the temperature inside the molded body does not necessarily rise to that temperature within the molding time even if the hot pressing temperature is 200 ° C. It becomes difficult to transfer heat to the surface of the molded body, and it cannot exhibit releasability from the hot platen. It is also difficult to obtain a stable wax emulsion.
[0023]
Further, the wax component is a component having a converted number average molecular weight of 100 to 1,000 using polystyrene and having a peak area ratio of 80% or more in gel permeation chromatography (GPC). Although the number average molecular weight can be measured by various methods, in the present invention, it is based on GPC.
When the component of 80% or more in the peak area ratio of GPC in the wax component is less than 100, the number average molecular weight tends to evaporate and vaporize under conditions of 100 to 200 ° C., which is a normal hot pressing temperature. It becomes difficult to exhibit the releasability. Further, when the number average molecular weight of this component is 1,000 or more, the stability of the wax emulsion is deteriorated and the compatibility with the organic polyisocyanate compound is lowered, and the melting point is relatively high as described below. Therefore, it becomes difficult for the wax component to thermally transfer to the surface of the molded body, and the releasability from the hot platen cannot be exhibited.
When the component having a number average molecular weight of 100 to 1,000 is less than 80% in terms of the peak area ratio of GPC, the stability of the wax emulsion is deteriorated and the compatibility with the organic polyisocyanate compound is reduced. Since the melting point is relatively high, the wax component is difficult to transfer to the surface of the molded body, and the releasability from the hot platen cannot be exhibited.
[0024]
Further, the wax component infrared absorption analysis in (IR analysis), the absorbance ratio of the peak (methylene group) between the peak of 1700～1760Cm ^-1 (carbonyl group) 2900～2960Cm ^-1's (1700～1760Cm ^-1 Absorbance of peak / absorbance of peak of 2900-2960 cm ⁻¹ ) is 0.1 or less, preferably 0.05 or less. When this absorbance ratio is large, the releasability from the hot platen cannot be exhibited.
Further, the solid content of the wax emulsion (B) is preferably 10 to 60% by mass.
[0025]
The catalyst which is the component (C) used in the present invention also acts as a catalyst for promoting reaction hardening between the component (A), the component (B) and the lignocellulosic material.
[0026]
Examples of the catalyst include an amine catalyst and a metal catalyst. Specific examples of the amine catalyst include triethylamine, triethylenediamine, N-methylmorpholine, N-methylimidazole, 1-methylimidazole, 1-ethylimidazole, 1-propylimidazole, 1-cyanoimidazole, 1-cyanomethylimidazole, 1 , 2-dimethylimidazole, 1,4-dimethylimidazole, 1-methyl-2-ethylimidazole, 1-methyl-4-ethylimidazole, 1-ethyl-2-methylimidazole, 1-ethyl-4-methylimidazole, pyridine , Α-picoline and the like.
[0027]
Further, as amine-based catalysts having active hydrogen that reacts with organic polyisocyanate compounds, N, N-dialkylalkanolamines such as N, N-dimethylethanolamine, N-alkyldialkanolamines such as N-methyldiethanolamine, and triethanol Trialkanolamines such as amines, N, N, N′-trimethylaminoethylethanolamine, N, N, N ′, N′-tetramethylhydroxypropylenediamine and the like can also be used.
[0028]
The metal catalyst is not particularly limited as long as it is a metal compound that can exhibit catalytic activity, and examples thereof include esterified products such as tin, zinc, calcium, and titanium, metal salts, acid derivatives, oxides, and chlorides. Specific examples include dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin dichloride, tin octylate, zinc octylate, calcium naphthenate, tetrabutyl titanate, tetrastearyl titanate, tin oxide, tin chloride, magnesium chloride and the like. .
[0029]
Furthermore, 0.1-20 mass% is preferable with respect to (A) by mass ratio, and, as for the compounding quantity of a catalyst (C), 0.5-15 mass% is especially preferable. When the blending amount of the component (C) is less than the lower limit value, it is difficult to cure and the caking reaction is insufficient, and the intended molded product tends to be difficult to obtain, and exceeds the upper limit value. In this case, the curing reaction is too fast and the lignocellulosic material is reacted and solidified by the hot pressure on the hot platen, so that a normal molded product cannot be obtained.
[0030]
A hot-press molded body of a lignocellulosic material is obtained by applying the adhesive composition of the present invention to a lignocellulosic material and compressing it by heating. As this lignocellulosic material, it is used for particle board, oriented strand board (OSB), wafer board, laminated veneer lumber (LVL), laminated strand lumber (LSL), parallel strand lumber (PSL), etc. Strand chips, dust chips, flake chips that are wood chips, fibers used in hard boards, medium density fiberboard (MDF), insulation boards, sorghum, bagasse, chaff, hemp, straw, grass , Coconuts and trees, rubber trees, corn and sawdust. These may be used alone or in combination of two or more.
[0031]
As an application method of the adhesive composition, the organic polyisocyanate compound (A), the wax emulsion (B), and the catalyst (C) are used by mixing the above three components immediately before application to the lignocellulosic material. Or (A) to (C) are separately applied and used. At this time, 4 components which added water may be sufficient.
When producing by a continuous line, it is more preferable to use what was previously mixed with the wax emulsion (B) and the catalyst (C). The preliminary mixture, the organic polyisocyanate compound (A) and water are continuously mixed with a static mixer, and then applied to a lignocellulosic material and molded.
Any known molding conditions for the board can be applied.
[0032]
The amount of each added to the lignocellulosic material is 5 to 20% by mass in solid content of the organic polyisocyanate compound (A) and 0.5 to 10% in solid content of the wax emulsion (B) with respect to the lignocellulosic material. % By mass and the catalyst (C) in solid content is 0.005 to 4% by mass.
[0033]
【The invention's effect】
Thus, according to the present invention, an adhesive using a wax emulsion having a melting point range and a specific molecular weight distribution and having a specific acid value, and a method for producing a molded body using the same, a wood chip and a wood fiber In the hot press molding of lignocellulosic materials such as the above, it has become possible not only to prevent adhesion to the surface of the hot platen, but also to obtain a hot press molded product of lignocellulosic material excellent in physical properties.
[0034]
【Example】
Next, the adhesive composition for a lignocellulosic material of the present invention, and a hot-press molded body using the same and a manufacturing method thereof will be described in more detail based on manufacturing examples and examples. The present invention is not limited to the production examples and the examples. In the GPC analysis, “%” indicates a peak area ratio.
[0035]
Example 1
[Synthesis of solution A]
Using a reactor with a capacity of 2000 ml, equipped with a stirrer, thermometer, cooler and nitrogen gas inlet tube, charge the raw material isocyanate and the raw material mono or polyol in the amounts shown in Table 1, and then raise the temperature to 80 ° C. For 3 hours to synthesize organic polyisocyanate compounds A1 to A5.
Table 1 also shows the types of raw materials, the amounts used, and the analytical values.
[0036]
[Table 1]

[0037]
[Liquid A synthesis raw material]

[0038]
[Preparation and Evaluation of Adhesive Composition]
The lignocellulosic material adhesive composition was prepared by combining the organic polyisocyanates A1 to A5 obtained in Table 1 above with the release agents and catalysts shown below. The amount of each adhesive composition charged is shown in Table 2.
In Comparative Example 1, since the wax emulsion was not used, the molded body adhered very firmly to the hot platen, and physical properties could not be evaluated.
[0039]
[Table 2]

[0040]
[Liquid B raw material]
Wax emulsion P:
Montan wax emulsion (melting point = 78 ° C., acid value = 1 mg KOH / g, component of polystyrene-based number average molecular weight 100-1,000 by GPC = 88.8%, solid content = 30%, 1700 by IR analysis absorbance ratio = 0.03 between the peak of the peak and 2900～2960Cm ^-1 of 1760 cm ^-1)
Wax emulsion Q:
Paraffin wax emulsion (melting point = 60 ° C., acid value = 1 mg KOH / g, component of polystyrene-based number average molecular weight 100-1,000 by GPC = 82.3%, solid content = 30%)
Wax emulsion R:
Montan wax emulsion (melting point = 85 ° C., acid value = 90 mg KOH / g, component with polystyrene-reduced number average molecular weight of 1,000 or less by GPC = 23.1%, solid content = 30%, 1700-1760 cm by IR analysis ^-1 peak to 2900-2960 cm ^-1 peak ratio = 0.17)
[C liquid raw material]
Catalyst S: Triethylenediamine catalyst T: N, N-dimethylethanolamine catalyst U: Dibutyltin dilaurate
[Method of forming a hot-pressed body of lignocellulosic material]
(1) Molding conditions Board size: 40cm x 40cm
Board thickness: 15mm
Setting density: 720 kg / m ³
Moisture content of wood chips or wood fibers and tree species: 3%, moisture content of coniferous products: 9%
Matt moisture content: 14%
Hot plate (press) temperature: 200 ° C
Hot plate (press) pressure: 3 MPa (surface pressure)
Hot plate (press) time: 150 seconds [0042]
(2) Molding method Regarding the creation of the hot-press molded body described in Table 2, the particle board (Examples 1, 2, 5 and Comparative Examples 1 and 2) obtained using a wood chip is the following 1) The medium density fiberboard (Examples 3 and 4 and Comparative Examples 3 and 4) obtained by using the method and using wood fibers was prepared by the following method 2).
1) Method for producing molded bodies of Examples 1, 2, 5 and Comparative Examples 1 and 2 A wooden chip of the amount of coniferous tree described in Table 2 was put into a blender having a volume of about 0.5 m ³ with a stirring blade, A mixture of organic polyisocyanate compound, wax emulsion, catalyst and water for mat water content shown in Table 2 was spray-applied with mixing and stirring for about 5 minutes. Thereafter, the wood chip coated with the adhesive composition is taken out, weighed so that the density of the molded body after molding becomes the set density, and formed on the following iron plate to the board size, and further An iron plate of the same shape was placed on top and hot pressed under the above conditions.
2) Method for producing molded bodies of Examples 3 and 4 and Comparative Examples 3 and 4 Using a pressure refiner (disentangler), wood chips of the amount of coniferous wood described in Table 2 were used for cooking pressure = 0.7 MPa, cooking Defibration (fibrosis) was performed under the condition of temperature = 150 ° C. The mixture was passed through a pipe, and a mixture of the organic polyisocyanate compound, wax emulsion, catalyst and water for mat moisture content shown in Table 2 was added to the pipe at the same time, and the mat water was hydrated with a flash dryer. Dry to rate. Then, the wood fiber coated with the adhesive composition is taken out, weighed so that the density of the molded body after molding becomes the set density, and formed into the board size on the following stainless steel plate Forming was performed using an apparatus, and a stainless steel plate having the same shape was placed on top and hot-pressed under the above conditions.
[Confirmation of releasability]
High tensile strength stainless steel plates were placed on the top and bottom of the board, and the releasability was confirmed during the molding.
[Physical property measurement]
The various physical property values of the molded products of Examples 1, 2, 5 and Comparative Examples 1 and 2 in Table 2 were measured according to JIS A-5908. Various physical property values of the molded body were measured according to JIS A-5905.
[Brief description of the drawings]
FIG. 1 is a GPC chart of wax emulsion P and a molecular weight measurement result (extract) in terms of polystyrene.
FIG. 2 is an FT-IR chart of wax emulsion P.
FIG. 3 is a GPC chart of wax emulsion R and a molecular weight measurement result (extract) in terms of polystyrene.
FIG. 4 is an FT-IR chart of wax emulsion R.

Claims (3)

An adhesive composition comprising an organic polyisocyanate compound (A), a montan wax emulsion (B), and a catalyst (C),
The montan wax emulsion (B) has an acid value of 10 mg KOH / g or less, a melting point of 40 to 160 ° C., and a polystyrene-reduced number average molecular weight of 100 to 1 by gel permeation chromatography (GPC). An adhesive composition for a hot-press molded body of a lignocellulosic material, characterized in that the component of 1,000 is 80% or more in terms of GPC peak area ratio. A hot-press molded body of lignocellulosic material using the adhesive composition according to claim 1 . The manufacturing method of the hot-press-molding body of a lignocellulosic material using the adhesive composition of Claim 1 or 2 .

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