JP3842852B2 - Method for manufacturing semiconductor device - Google Patents

Description

[0001]
[Technical field to which the invention belongs]
The invention disclosed in this specification relates to a method for manufacturing a semiconductor device using a thin film semiconductor having crystallinity. In particular, the present invention relates to a method for manufacturing a planar thin film transistor.
[0002]
[Prior art]
Recently, a technique for manufacturing a thin film transistor (TFT) on an inexpensive glass substrate has been rapidly developed. The reason is that the demand for active matrix liquid crystal display devices has increased.
[0003]
In an active matrix liquid crystal display device, a TFT is arranged in each of millions of pixels arranged in a matrix, and charges entering and exiting each pixel electrode are controlled by a switching function of the TFT.
[0004]
Therefore, if one TFT does not operate, the pixel electrode connected to the TFT loses its function as a display element. This causes so-called point defects.
For example, in the case of a normally black liquid crystal display device, a point defect appears as a black point when displaying white, which is very bad for the appearance.
[0005]
Further, it is required to integrate a circuit for driving the pixel electrode display TFT (referred to as a peripheral drive circuit) with the TFT on the same glass substrate.
[0006]
In this case, if the driving TFT does not operate, all TFTs to which a driving voltage is applied from the TFT do not function as switching elements. This causes a so-called line defect and becomes a fatal obstacle for the liquid crystal display device.
[0007]
Therefore, the active matrix type liquid crystal display device must be capable of maintaining normal and stable operation of millions of TFTs in the long term.
[0008]
However, it is very difficult to completely eliminate point defects and line defects. One of the causes is a contact failure.
[0009]
The contact failure is an operation failure that occurs when a connection failure occurs at an electrical connection point (hereinafter referred to as a contact) between the wiring electrode and the TFT. In particular, in a planar type TFT, since the wiring electrode and the TFT are electrically connected through a narrow hole (contact hole), contact failure is a serious problem.
[0010]
Contact failure is a major cause of early deterioration of semiconductor element characteristics, and the deterioration is accelerated particularly when a large current flows or during high-temperature operation. Therefore, it is said that the reliability of the contact determines the reliability of the semiconductor element.
[0011]
Generally, in the case of a pixel display region in an active matrix liquid crystal display device, there is no contact because the gate electrode is directly pulled out of the pixel display region. That is, the contact with the pixel electrode is very important for the reliability of the liquid crystal display device.
[0012]
In the case of a peripheral drive circuit, there are hundreds of thousands to millions of contacts. In particular, the presence of a gate electrode contact and the increase in temperature associated with a large current operation mean that the contact is required to have a reliability higher than that of the pixel display region.
[0013]
There are three main causes of contact failure.
One of them is that the conductive film forming the wiring electrode and the semiconductor film forming the source / drain of the TFT are not in contact with each other by ohmic junction.
[0014]
This is because an insulating film such as a metal oxide is formed on the bonding surface. Further, the state in the vicinity of the semiconductor film surface (impurity concentration, defect level density, cleanliness, etc.) greatly affects the performance of the contact.
[0015]
The second cause is that the conductive film forming the wiring electrode has poor coverage and is broken in the contact hole.
In this case, improvement is required depending on the film forming method and film forming conditions of the wiring electrode.
[0016]
The third cause is the disconnection of the wiring electrode due to the cross-sectional shape of the contact hole. The cross-sectional shape of the contact hole strongly depends on the etching conditions of the insulator (SiN, SiO _2, etc.) covered with the contact portion.
[0017]
In order to form a contact with good coverage, a gradual cross-sectional shape (called a taper) that changes continuously is desirable.
Further, the over-etching of the lower layer film often seen in the case of the multilayer interlayer insulating film significantly deteriorates the coverage.
[0018]
[Problems to be solved by the invention]
An object of the invention disclosed in this specification is to improve the cross-sectional shape of a contact hole serving as an electrical connection path between a wiring electrode and a TFT, and reduce malfunction of the TFT due to contact failure.
[0019]
That is, it is an object to improve contact reliability and improve long-term reliability as a device or a liquid crystal display device.
Another object is to improve the yield of the manufacturing process by eliminating point defects and line defects.
[0020]
[Means for Solving the Problems]
One of the inventions disclosed in this specification is:
A gate portion having a gate electrode made of an anodizable material;
A source part or a drain part made of a semiconductor;
In the manufacturing process of the thin film transistor having
Laminating at least two layers of the same main insulating film covering the gate portion, the source portion and the drain portion;
A step of forming a taper so that the inclination angle gradually decreases from the uppermost layer to the lowermost layer of the insulating coating when the insulating coating is opened by dry etching;
It is characterized by having.
[0021]
The above invention is characterized in that the cross-sectional shape of the contact hole is tapered so that the inclination angle gradually decreases from the uppermost layer to the lowermost layer by controlling the dry etching rate of the insulating film as the interlayer insulating film. And The taper angle is defined by the accuracy indicated by α and β in FIG.
[0022]
Since the insulating film only needs to have a function as an interlayer insulating film, various materials such as a silicon oxide film, a silicon nitride film, and an organic resin can be used.
[0023]
At this time, a material that can easily control the dry etching rate is desirable. This is because a desired taper can be easily formed by making the upper layer etching rate faster than the lower layer etching rate.
[0024]
In general, when a contact hole is formed by dry etching, a reactive ion etching method (RIE method) is used.
[0025]
However, a drawback of the RIE method is that if the time point when etching is finished (called an end point) is not clear, a conductive thin film to be contacted is also dug.
[0026]
In the case of the RIE method, endpoint detection is generally performed by plasma emission measurement. This is done by monitoring specific radicals and ions generated during etching.
[0027]
In this case, for example, in the etching of the interlayer insulating film made of the silicon oxide film formed on the gate insulating film made of the silicon oxide film, the luminescent species to be monitored are confused and it is difficult to confirm the end point.
[0028]
In consideration of the above, it is necessary to select an insulating film used as an interlayer insulating film in consideration of the structure of a TFT to be manufactured.
[0029]
Other inventions disclosed in this specification are:
A gate portion having a gate electrode made of an anodizable material;
A source part or a drain part made of a semiconductor;
In the manufacturing process of the thin film transistor having
Forming an insulating film covering the gate portion, the source portion and the drain portion;
A step of opening the insulating film by a dry etching method;
Etching a thin film in contact with the lower surface of the insulating coating;
A step of light-etching the hole formed by the above-mentioned step;
It is characterized by having.
[0030]
The above invention is characterized in that the contact hole is expanded by light etching and a taper is formed on the contact hole.
[0031]
When the thin film in contact with the lower surface of the insulating coating is wet-etched, the hole pierces under the insulating coating for isotropic etching to form a hole.
At that time, the portion that wraps around becomes a gap and causes the wiring electrode to be disconnected later.
[0032]
According to the present invention, by performing the light etching, the inner wall surface of the contact hole can be expanded by the amount of void, and the void portion can be eliminated.
[0033]
At this time, the gas composition ratio at the time of the light etching is set so that the amount of O ₂ added is larger than the gas composition ratio at the time of forming the contact hole.
[0034]
This is because the resist mask that forms the opening region of the contact hole is retracted at the same time as the gap portion is eliminated, and the edge of the contact hole (in this specification, the outer frame of the contact hole entrance is referred to as the edge). This is for rounding.
[0035]
That is, by this light etching, a contact hole having a cross-sectional shape that falls along a gentle curve is obtained.
Therefore, the coverage of the wiring electrode is very good.
[0036]
【Example】
[Example 1]
An example of a manufacturing process of a thin film transistor (TFT) using the present invention is shown in FIG.
[0037]
First, a glass substrate 101 having an insulating film such as a silicon oxide film on the surface is prepared. An amorphous silicon film having a thickness of 500 mm (not shown) is formed thereon by a plasma CVD method or a low pressure thermal CVD method, and is crystallized by an appropriate crystallization method. This crystallization may be performed by heating or laser light irradiation.
[0038]
Next, the crystalline silicon film obtained by crystallizing the amorphous silicon film is patterned to form the island-shaped semiconductor layer 102 constituting the active layer.
[0039]
On top of this, a silicon oxide film 103 which will later function as a gate insulating film is formed to a thickness of 1200 mm. The silicon oxide film 103 may be formed by a plasma CVD method or a low pressure thermal CVD method.
[0040]
Next, a film 104 made of aluminum or a material containing aluminum as a main component is formed to a thickness of 4000 mm. This aluminum film 104 will later function as a gate electrode. Of course, in addition to aluminum, an anodizable material such as tantalum or niobium may be used.
[0041]
Next, anodization is performed in the electrolytic solution using the aluminum film 104 as an anode. As the electrolytic solution, an ethylene glycol solution of 3% tartaric acid neutralized with aqueous ammonia and adjusted to PH = 6.92 is used.
Moreover, it processes as a formation current 5mA and the ultimate voltage 10V by using platinum as a cathode.
[0042]
The dense anodic oxide film 105 formed in this way has the effect of improving the adhesion to the photoresist later. Further, the thickness of the anodic oxide film 105 can be controlled by controlling the voltage application time. (Fig. 1 (A))
[0043]
In this way, when the state of FIG. 1A is obtained, the aluminum film 104 is patterned to form a gate electrode (not shown).
[0044]
Next, a second anodic oxidation is performed to form a porous anodic oxide film 106. The electrolytic solution is a 3% oxalic acid aqueous solution, which is treated with platinum as a cathode at a formation current of 2 to 3 mA and an ultimate voltage of 8V.
[0045]
At this time, anodic oxidation proceeds in a direction parallel to the substrate. Further, the length of the porous anodic oxide film 106 can be controlled by controlling the voltage application time.
[0046]
Further, after removing the photoresist with a dedicated stripping solution, a third anodic oxidation is performed to obtain the state of FIG.
[0047]
At this time, an electrolytic solution is used in which 3% of an ethylene glycol solution of tartaric acid is neutralized with ammonia water and adjusted to PH = 6.92. And it processes as a formation current 5-6mA and the ultimate voltage 100V by using platinum as a cathode.
[0048]
The anodic oxide film 107 formed at this time is very dense and strong. Therefore, it has an effect of protecting the gate electrode 108 from damage caused in a subsequent process such as a doping process.
[0049]
Further, since the strong anodic oxide film 107 is difficult to be etched, there is a problem that the etching time becomes long when the contact hole is opened. Therefore, it is desirable that the thickness is 1000 mm or less.
[0050]
Next, an impurity is implanted into the island-shaped semiconductor layer 102 by an ion doping method. For example, when an N-channel TFT is manufactured, P (phosphorus) may be used as an impurity.
[0051]
First, the first ion doping is performed in the state of FIG. P (phosphorus) is implanted at an acceleration voltage of 60 to 90 kV and a dose of 0.2 to 5 × 10 ¹⁵ atoms / cm ² .
In this embodiment, the acceleration voltage is 80 kV and the dose is 1 × 10 ¹⁵ atoms / cm ² .
[0052]
As a result, the gate electrode 108 and the porous anodic oxide film 106 serve as a mask, and regions 109 and 110 to be the source / drain later are formed in a self-aligned manner.
[0053]
Next, as shown in FIG. 1C, the porous anodic oxide film 106 is removed and a second doping is performed. The second implantation of P (phosphorus) is performed at an acceleration voltage of 60 to 90 kV and a dose of 0.1 to 5 × 10 ¹⁴ atoms / cm ² .
In this embodiment, the acceleration voltage is 80 kV and the dose is 1 × 10 ¹⁴ atoms / cm ² .
[0054]
Then, the gate electrode 108 serves as a mask, and low-concentration impurity regions 111 and 112 having a lower impurity concentration than the source region 109 and the drain region 110 are formed in a self-aligned manner.
[0055]
At the same time, since no impurities are implanted immediately below the gate electrode 108, a region 113 functioning as a TFT channel is formed in a self-aligned manner.
[0056]
The low concentration impurity region (or LDD region) 112 formed in this manner has an effect of suppressing the formation of a high electric field between the channel region 113 and the drain region 110.
[0057]
Next, irradiation with KrF excimer laser light and thermal annealing are performed. In this embodiment, the energy density of the laser light is 250 to 300 mJ / cm ² and the thermal annealing is performed at 300 to 450 ° C. for 1 hour.
[0058]
Through this step, the crystallinity of the island-shaped semiconductor layer 102 damaged by the ion doping step can be improved.
[0059]
Next, as shown in FIG. 1D, interlayer insulating films 114 and 115 each having a two-layer structure are formed by a plasma CVD method. In this embodiment, the interlayer insulating films 114 and 115 are made of silicon nitride films having different composition ratios.
[0060]
At this time, a silicon nitride film having a composition ratio that has a property that the dry etching rate is faster than that of the first interlayer insulating film 114 is used for the second interlayer insulating film 115.
For example, a film having a high etching rate can be formed by increasing the pressure of the deposition gas or the deposition temperature or decreasing the RF power.
[0061]
Specifically, if the film formation temperature of the first layer is 250 ° C. and the film formation temperature of the second layer is 350 ° C., the dry etching rate of the second layer is about twice as fast as that of the first layer.
Further, the first layer deposition gas pressure is set to 0.3 torr, and the second layer deposition gas pressure is set to 0.7 torr. In this way, the dry etching rate of the second layer is about 1.5 times faster than that of the first layer.
[0062]
This is a factor necessary for making the inclination angle α of the first interlayer insulating film 114 smaller than the inclination angle β of the second interlayer insulating film 115 in the shape of the contact hole shown in FIG. It is.
[0063]
The total thickness of the first and second interlayer insulating films is set to be 1 to 3 times the thickness of the gate electrode 108. This is to prevent leakage current through the interlayer insulating film by improving the coverage of the interlayer insulating film.
[0064]
However, the thickness of the first interlayer insulating film 114 is preferably 1/3 or less of the total film thickness. Above that, the inclination angle α becomes large, and inconvenience occurs in the later light etching process.
[0065]
Next, a resist mask indicated by 201 in FIG. 2A is formed, and a contact hole is formed by a dry etching method.
The composition ratio of the etching gas is set to CF ₄ : O ₂ = 40: 60.
[0066]
Etching is finished 150 seconds after the end point is confirmed. The end point is detected as the time when the signal intensity of nitrogen ions becomes constant as shown in FIG.
The reason why the signal intensity of nitrogen ions is increased in the first layer is that the first layer is denser than the second layer.
[0067]
At this time, in the source / drain contact portions 202 and 203, the gate insulating film 103 functions as a stopper film for dry etching. In the gate electrode portion 204, the anodic oxide film 107 serves as a stopper film for dry etching.
[0068]
Further, since the second interlayer insulating film 115 has a higher etching rate than the first interlayer insulating film 114, a taper is formed as shown in FIG.
[0069]
Next, the gate insulating film 103 on the bottom surface of the contact hole is etched using buffer hydrofluoric acid to complete the source / drain portions 109 and 110 contact holes.
[0070]
Next, the anodic oxide film 107 is etched using a chromium mixed acid solution having a composition in which chromic acid, acetic acid, phosphoric acid, and nitric acid are mixed to complete a contact hole of the gate electrode portion 204.
[0071]
Thus, if the gate insulating film 103 is etched first, the anodic oxide film 107 is excellent in buffer hydrofluoric acid resistance, so that the gate electrode 108 can be protected.
Further, the chromium mixed acid solution hardly etches the surfaces of the source region 109 and the drain region 110.
[0072]
The state shown in FIG. 2B is obtained as described above. However, in wet etching using buffer hydrofluoric acid or chromium mixed acid, etching progresses isotropically, so that a hollow portion as shown in a circle in FIG. 2B is formed.
[0073]
Therefore, the interlayer insulating film is made to recede by light etching so that there is no gap portion as shown in FIG. At this time, the first interlayer insulating film 114 is easily retracted as the inclination angle α is smaller.
[0074]
This light etching is performed by a dry etching method so that the composition ratio of the etching gas is CF ₄ : O ₂ = 25: 75. At this composition ratio, since the selection ratio of silicon nitride to silicon is 10 or more, the surfaces of the source region 109 and the drain region 110 are hardly etched.
[0075]
Further, since this light etching is performed at a gas composition ratio with a high O ₂ addition rate, the resist mask 201 is also retracted simultaneously. Therefore, as shown in the circle of FIG. 4, the cross-sectional shape at the edge of the contact hole becomes a curve with the corners etched.
[0076]
When the formation of the contact holes is completed, wiring electrodes 205, 206, and 207 are formed, and annealing treatment is performed at 350 ° C. for 2 hours in a hydrogen atmosphere.
[0077]
Through the above steps, a thin film transistor as shown in FIG. 2D is manufactured.
[0078]
[Example 2]
In this embodiment, the invention disclosed in this specification is applied to an IC process using a single crystal silicon wafer. Specifically, an example in which a MOS transistor is manufactured using a silicon wafer is shown.
[0079]
6 to 8 show a manufacturing process of this example. First, as shown in FIG. 6A, a thermal oxide film and a silicon nitride film are stacked on an N-type single crystal silicon wafer 601 and patterned to form a stack of a thermal oxide film 602 and a silicon nitride film 603. A pattern made of a film is formed.
[0080]
Next, field oxide films 604 and 605 are formed by a selective thermal oxidation method. In this way, the state shown in FIG.
[0081]
Next, the thermal oxide film 602 and the silicon nitride film 603 are removed, and a thermal oxide film 606 is formed again by a thermal oxidation method. This thermal oxide film 606 constitutes a gate insulating film.
[0082]
Next, the gate electrode 607 is formed of an appropriate metal material, silicide material, or semiconductor material. After the gate electrode 607 is formed, impurities are doped to form source / drain regions.
[0083]
Here, in order to manufacture a P-channel MOS transistor, doping of B (boron) is performed by an ion implantation method. Note that if an N-channel MOS transistor is manufactured, P (phosphorus) doping may be performed.
[0084]
After the above doping, heat treatment is performed to activate the implanted impurities and anneal the semiconductor layer during the doping.
[0085]
Thus, as shown in FIG. 6B, a source region 608 and a drain region 609 having a P-type are formed in a self-aligning manner.
[0086]
Next, silicon nitride films 610 and 611 are formed as interlayer insulating films. Here again, the silicon nitride film of 611 has a film quality such that the etching rate is faster than that of 610 by the same method as in the first embodiment.
[0087]
In this way, the state shown in FIG. Next, as shown in FIG. 7A, a resist mask 612 is provided, and contact holes 613 and 614 are formed by dry etching.
[0088]
In this way, the state shown in FIG. At this time, the gate insulating film 606 made of a thermal oxide film functions as an etching stopper.
[0089]
Next, contact holes indicated by 615 and 616 are formed by using a wet etching method.
[0090]
In this way, the state shown in FIG. At this time, since isotropic etching proceeds by the wet etching method, the contact holes 615 and 616 are such that the bottoms of the contact holes indicated by 613 and 614 are expanded.
[0091]
Next, the interlayer insulating film and the resist mask are retracted by light dry etching. The dry etching here is performed using a mixture of CF ₄ and O ₂ . Here, oxygen is mixed in order to recede the resist mask.
[0092]
Thus, a contact having a cross-sectional shape as shown in FIG. 8A can be obtained.
[0093]
When the state shown in FIG. 8A is obtained, a source electrode 619 and a drain electrode 620 are formed. Thus, a MOS transistor is completed.
[0094]
【The invention's effect】
According to the present invention, the interlayer insulating film has a multilayer structure of two or more layers, and the etching rate of the upper layer is higher than that of the lower layer, so that the inclination angle gradually decreases from the uppermost layer to the lowermost layer of the interlayer insulating film. A taper can be formed.
[0095]
Further, by performing light etching, it is possible to eliminate the gaps in the gate insulating film 103 and the anodic oxide film 107 as shown in the circle of FIG. Furthermore, the upper cross-sectional shape of the contact hole can also be improved.
[0096]
Due to the above effects, the cross-sectional shape of the contact hole is greatly improved, and the yield of TFT fabrication and the reliability of the wiring contact are improved.
Accordingly, long-term reliability of the device or the display system can be improved.
[Brief description of the drawings]
FIGS. 1A to 1C illustrate a manufacturing process of a thin film transistor. FIGS.
FIGS. 2A and 2B illustrate a manufacturing process of a thin film transistor. FIGS.
FIG. 3 is a diagram showing a cross-sectional shape of a contact hole.
FIG. 4 is a diagram showing a cross-sectional shape of a contact hole.
FIG. 5 is a diagram showing an end point at the time of dry etching.
FIG. 6 is a diagram showing an IC process using the invention.
FIG. 7 is a diagram showing an IC process using the invention.
FIG. 8 is a diagram showing an IC process using the invention.
[Explanation of symbols]
101 glass substrate 102 island-like semiconductor layer 103 silicon oxide film 104 aluminum film 105 dense anodic oxide film 106 porous anodic oxide film 107 strong anodic oxide film 108 gate electrode 109 source region 110 drain region 111 low concentration impurity region 112 Low-concentration impurity region 113 Channel region 114 First layer interlayer insulating film 115 Second layer interlayer insulating film 201 Resist mask 202 Source contact portion 203 Drain contact portion 204 Gate contact portion 205 Wiring electrode 206 Wiring electrode 207 Wiring electrode

Claims (27)

On the substrate, a gate electrode, a semiconductor layer having a channel region, a source region, and a drain region, and a first insulating film in contact with the semiconductor layer are formed,
Forming a second insulating film covering the gate electrode, the semiconductor layer and the first insulating film;
Forming a first contact hole in the second insulating film by dry etching;
The first insulating film that is in contact with the lower surface of the second insulating film and is exposed by forming the first contact hole is isotropically etched to form a second contact hole in the first insulating film. it allows to form a portion of the first and the Contact Keru the sectional shape of the second contact hole second insulation film protruding from the first insulating film,
A method for manufacturing a semiconductor device, wherein the protruding portion is removed. On the substrate, a gate electrode, a semiconductor layer having a channel region, a source region, and a drain region, and a first insulating film in contact with the semiconductor layer are formed,
Covering the gate electrode, the semiconductor layer and the first insulating film, forming a second insulating film having the same main component of at least two layers;
The at least two second insulating films are sequentially etched from the uppermost second insulating film to the lowermost second insulating film among the at least two second insulating films by dry etching. Forming a first contact hole having a cross-sectional shape having a taper that reduces an inclination angle with respect to the substrate ;
The first insulating film that is in contact with the lower surface of the at least two layers of the second insulating film and is exposed by forming the first contact hole is isotropically etched, and a second contact is formed on the first insulating film. by forming the hole to form a portion where the second insulating film in our Keru the sectional shape of the first and second contact holes at least two layers projecting from the first insulating film,
The method for manufacturing a semiconductor device characterized by removing the protruding portion.   3. The method of manufacturing a semiconductor device according to claim 2, wherein the at least two layers of the second insulating film have a higher dry etching rate as an upper layer. In Claim 1 or Claim 2, the gas used when removing the protruding portion is:
A method for manufacturing a semiconductor device, wherein a ratio of O 2 is higher than a gas used when forming a first contact hole in the second insulating film.   3. The method for manufacturing a semiconductor device according to claim 1, wherein the edge of the first contact hole is rounded simultaneously with the removal of the protruding portion. On the substrate, a gate electrode, a semiconductor layer having a channel region, a source region and a drain region, and a silicon oxide film in contact with the semiconductor layer are formed,
Forming at least two layers of silicon nitride films covering the gate electrode, the semiconductor layer and the silicon oxide film;
The inclination angle with respect to the substrate is sequentially reduced from the uppermost silicon nitride film to the lowermost silicon nitride film of the at least two silicon nitride films by dry etching on the at least two silicon nitride films. Forming a first contact hole having a cross-sectional shape having an appropriate taper ;
By isotropically etching the silicon oxide film exposed to the lower surface of the at least two layers of silicon nitride film and exposed by forming the first contact hole, thereby forming a second contact hole in the silicon oxide film the first and second contact holes in our Keru the cross-sectional shape at least two layers silicon nitride film to form a portion protruding from the silicon oxide film,
The method for manufacturing a semiconductor device characterized by removing the protruding portion.   7. The method for manufacturing a semiconductor device according to claim 6, wherein the dry etching rate of the at least two silicon nitride films is higher in the upper layer. In Claim 6 or Claim 7, the gas used when removing the protruding portion is:
A method of manufacturing a semiconductor device, wherein the ratio of O2 is higher than a gas used when forming a first contact hole in the at least two silicon nitride films.   9. The method for manufacturing a semiconductor device according to claim 6, wherein a total thickness of the at least two silicon nitride films is 1 to 3 times a thickness of the gate electrode.   10. The method for manufacturing a semiconductor device according to claim 6, wherein a corner of the edge of the first contact hole is rounded simultaneously with the removal of the protruding portion. On a substrate having an insulating surface, a semiconductor layer having a channel region, a source region and a drain region, a first insulating film on the semiconductor layer, and a gate electrode are formed,
Forming a second insulating film made of a material different from the first insulating film on the semiconductor layer, the first insulating film, and the gate electrode;
Forming a first contact hole by etching in the second insulating film, exposing a part of the first insulating film;
Wet etching the first insulating film exposed by forming the first contact hole, and forming a second contact hole in the first insulating film, thereby exposing a part of the semiconductor layer; and forming a portion said first and Contact Keru the sectional shape of the second contact hole second insulation film protruding from the first insulating film,
A method for manufacturing a semiconductor device, wherein the protruding portion is removed. On a substrate having an insulating surface, a semiconductor layer having a channel region, a source region and a drain region, a first insulating film on the semiconductor layer, and a gate electrode are formed,
Forming a second insulating film made of a material different from the first insulating film on the semiconductor layer, the first insulating film, and the gate electrode;
The second insulating film is dry etched using a first etching gas containing oxygen, a first contact hole is formed in the second insulating film, and a part of the first insulating film is exposed. ,
Wet etching the first insulating film exposed by forming the first contact hole, and forming a second contact hole in the first insulating film, thereby exposing a part of the semiconductor layer; and forming a portion said first and Contact Keru the sectional shape of the second contact hole second insulation film protruding from the first insulating film,
And dry-etched using the second etching gas containing oxygen the protruding portion,
Removing the protruding part,
The method for manufacturing a semiconductor device is characterized in that the proportion of oxygen in the second etching gas is higher than the proportion of oxygen in the first etching gas.   13. The method for manufacturing a semiconductor device according to claim 11, wherein the second insulating film includes at least two layers. According to claim 13, when forming the first contact hole in the second insulating layer of said at least two layers, the uppermost layer of the second insulating film of the second insulating layer of said at least two layers outermost A method for manufacturing a semiconductor device, comprising: forming a first contact hole having a cross-sectional shape having a taper such that an inclination angle with respect to the substrate is sequentially reduced toward a lower second insulating film . On a substrate having an insulating surface, a semiconductor layer having a channel region, a source region and a drain region, a first insulating film on the semiconductor layer, and a gate electrode are formed,
Forming a multilayer second insulating film made of a material different from the first insulating film on the semiconductor layer, the first insulating film, and the gate electrode;
Forming a first contact hole by etching in the multilayer second insulating film, exposing a part of the first insulating film;
Etching the first insulating film exposed by forming the first contact hole;
By forming a second contact hole in the first insulating film, the exposed portions of the semiconductor layer, and the contact Keru the cross-sectional shape of the first and second contact holes second of the multilayer Forming an insulating film protruding from the first insulating film ;
Removing said projecting portion,
A method for manufacturing a semiconductor device, wherein at least one layer of the multilayer second insulating film is made of an organic resin.   16. The method for manufacturing a semiconductor device according to claim 11, wherein the second insulating film is an interlayer insulating film.   17. The method for manufacturing a semiconductor device according to claim 11, wherein the first insulating film is a gate insulating film.   18. The method for manufacturing a semiconductor device according to claim 11, wherein the second insulating film is formed to cover the semiconductor layer and the first insulating film.   19. The method for manufacturing a semiconductor device according to claim 11, wherein the first insulating film is made of silicon oxide.   13. The method for manufacturing a semiconductor device according to claim 11, wherein the second insulating film is made of silicon nitride or an organic resin.   13. The method for manufacturing a semiconductor device according to claim 11, wherein the wet etching is performed using buffer hydrofluoric acid.   22. The method for manufacturing a semiconductor device according to claim 11, wherein the protruding portion is removed by a dry etching method, and an etching gas is a mixture of CF4 and O2. Forming a source region and a drain region on the silicon wafer, a first insulating film on the silicon wafer, and a gate electrode;
Forming a second insulating film covering the source region, the drain region, the first insulating film and the gate electrode;
Forming a first contact hole in the second insulating film by dry etching;
The first insulating film that is in contact with the lower surface of the second insulating film and is exposed by forming the first contact hole is isotropically etched to form a second contact hole in the first insulating film. it allows to form a portion of the first and the Contact Keru the sectional shape of the second contact hole second insulation film protruding from the first insulating film,
A method for manufacturing a semiconductor device, wherein the protruding portion is removed. Forming a source region and a drain region on the silicon wafer, a first insulating film on the silicon wafer, and a gate electrode;
Covering the source region, the drain region, the first insulating film, and the gate electrode, and forming a second insulating film having the same main component of at least two layers;
The at least two second insulating films are sequentially etched from the uppermost second insulating film to the lowermost second insulating film among the at least two second insulating films by dry etching. Forming a first contact hole having a cross-sectional shape having a taper that reduces an inclination angle with respect to the substrate ;
The first insulating film that is in contact with the lower surface of the at least two layers of the second insulating film and is exposed by forming the first contact hole is isotropically etched, and a second contact is formed on the first insulating film. by forming the hole to form a portion where the second insulating film in our Keru the sectional shape of the first and second contact holes at least two layers projecting from the first insulating film,
The method for manufacturing a semiconductor device characterized by removing the protruding portion.   25. The method for manufacturing a semiconductor device according to claim 23, wherein the upper insulating layer of the at least two layers of the second insulating film has a higher dry etching rate.   25. The method for manufacturing a semiconductor device according to claim 23, wherein a corner of the edge of the first contact hole is rounded simultaneously with the removal of the protruding portion.   25. The method for manufacturing a semiconductor device according to claim 23, wherein the protruding portion is removed by a dry etching method, and an etching gas is a mixture of CF4 and O2.

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