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JP3711669B2 - Electronic component mounting board - Google Patents

Electronic component mounting board Download PDF

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Publication number
JP3711669B2
JP3711669B2 JP31020896A JP31020896A JP3711669B2 JP 3711669 B2 JP3711669 B2 JP 3711669B2 JP 31020896 A JP31020896 A JP 31020896A JP 31020896 A JP31020896 A JP 31020896A JP 3711669 B2 JP3711669 B2 JP 3711669B2
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Japan
Prior art keywords
substrate
electronic component
solder
lead
mounting
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Expired - Fee Related
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JP31020896A
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Japanese (ja)
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JPH10144823A (en
Inventor
晋 秋山
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Ibiden Co Ltd
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Ibiden Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【０００１】
【技術分野】
本発明は，リードを接続した電子部品搭載用基板に関し，特に，電子部品の封止方法に関する。
【０００２】
【従来技術】
クォードフラットパッケージ（以下，ＱＦＰという。）は，電子部品の四方向にワイヤーボンディングによりリードを接合した構造を有する。この中でも特に，リードを基板に接続して，基板に設けた導体回路を介して電子部品と電気的接続を図る構造を有するＱＦＰは，パッケージ特性が高いため，高機能ＱＦＰとして用いられている。
【０００３】
かかる高機能ＱＦＰとしては，例えば，図１２に示すごとく，基板９７の四方向にリード９２を接合した電子部品搭載用基板がある。基板９７は，その略中心に電子部品９３を搭載する搭載部９７３を設けて，該搭載部９７３の周囲に導体回路９４を有している。電子部品９３と導体回路９４との間は，ボンディングワイヤー９５１により接続されている。
【０００４】
電子部品９３は，搭載部９７３に搭載した後に封止される。その封止方法には，以下の方法がある。
まず，図１３に示すごとく，基板９７と同材質の材料からなるキャップ９６１により封止する方法がある。この方法は，基板がセラミックやアルミニウム等の非モールドタイプの場合に汎用されている。
また，図１４に示すごとく，ＱＦＰ９の全体を内包し得るキャビティ９６２を有する金型９６３を準備し，キャビティ９６２の中に封止用樹脂９６５を導入して，電子部品９３を封止する方法がある。
【０００５】
【解決しようとする課題】
しかしながら，上記従来の電子部品の封止方法においては，以下の問題がある。
まず，キャップを用いる前者の方法においては，キャップの製造コストが高い。また，キャップを用いるＱＦＰは，セラミック，アルミニウム等の材質のものが多い。更に，図１３に示すごとく，キャップ９６１内は空洞９６６であるため，基板９７に対するリード９２の接合強度が弱い。それ故，リード９２が動き易く，基板９７からはずれやすい。
【０００６】
また，金型を用いる後者の方法においては，新型の電子部品搭載用基板が開発された場合に，電子部品搭載用基板の形状が変わるため，既存の金型を使用することができない。金型の作製には，多大な費用がかかる。また，キャビティ内に射出する樹脂の条件設定にも，多大な実験を重ねなければならない。
【０００７】
本発明はかかる従来の問題点に鑑み，電子部品の封止作業を容易に行うことができ，かつリードの接合強度を高くすることができる電子部品搭載用基板を提供しようとするものである。
【０００８】
【課題の解決手段】
請求項１の発明は，電子部品を搭載するための搭載用開口部及び導体回路を有する基板と，該基板の下部に接着して上記搭載用開口部を覆うヒートスラッグと，上記導体回路の外周に接合したリードとを有する電子部品搭載用基板であって，
上記搭載用開口部の周囲の基板表面には，搭載用開口部内に充填する封止用樹脂の樹脂流れを防止するダムリングを設けてなるとともに，該ダムリングと上記基板との間において上記リードが挟着保持されており，
かつ，上記リードと上記基板との間には，接着剤が配設されていることを特徴とする電子部品搭載用基板である。
【０００９】
次に，本発明の作用及び効果について説明する。
本発明においては，搭載用開口部の周囲にダムリングを設けて，該ダムリングにより搭載用開口部内に充填した封止用樹脂の樹脂流れを防止する。そのため，ダムリングの中に封止用樹脂を滴下する簡易な操作で，電子部品を封止することができる。それ故，製造コストを大幅に削減できる。また，封止用樹脂の温度，流動状態等の条件も緩和されるため，封止用樹脂の開発コストを低くすることができ，封止用樹脂の開発期間を短縮化することができる。
【００１０】
また，ダムリングは，基板との間にリードを挟着保持している。そのため，リードがダムリングにより上方から押さえられる。それ故，リードの接合状態を補強して，リードの外れ及び横ズレを防止することができる。
【００１１】
更に，搭載用開口部を覆うヒートスラッグの上に，電子部品を直接搭載するため，電子部品の熱を効率良くヒートスラッグより放散させることができ，放熱性に優れている。
【００１２】
また，上記リードと上記基板との間には，接着剤が配設されている。これにより，リードの位置決めが容易となり，またリードの位置ズレを防止することができる。
【００１３】
また，請求項２の発明のように，上記基板は上記リードを接合する半田を充填するための半田用スルーホールを有し，上記ヒートスラッグは上記半田用スルーホールに対面する部分に凹部を有していることが好ましい。これにより，リードは，半田用スルーホールに充填した半田を介して，基板に設けた導体回路との間の電気的導通を行うことができる。また，ヒートスラッグには，半田用スルーホールに対面する部分に凹部が設けられているため，半田用スルーホールに充填した半田とヒートスラッグとの電気的絶縁を図ることができる。
【００１４】
【発明の実施の形態】
実施形態例１
本発明の実施形態例にかかる電子部品搭載用基板について，図１〜図９を用いて説明する。
本例の電子部品搭載用基板は，図１に示すごとく，電子部品３を搭載するための搭載用開口部７３及び導体回路４１，４２を有する基板７と，基板７の下部に接着して搭載用開口部７３を覆うヒートスラッグ６と，導体回路４１の外周に接合したリード２とを有する。
搭載用開口部７３の周囲における基板７の表面には，図１，図２に示すごとく，搭載用開口部７３内に充填する封止用樹脂８の樹脂流れを防止するダムリング１が設けられている。ダムリング１と基板７との間には，リード２が挟着保持されている。
【００１５】
また，基板７は，図１，図３に示すごとく，リード２を接合する半田５１を充填する半田用スルーホール７５を有している。ヒートスラッグ６における半田用スルーホール７５に対面する部分には凹部６１が設けられている。凹部６１は，図３に対すごとく，基板７の周縁部に設けた複数の半田用スルーホール７５に対応するように，連続する溝状に設けられている。凹部６１の深さは０．１〜０．８ｍｍである。
図１，図４に示すごとく，リード２と基板７との間には，接着剤５２が配設されている。
【００１６】
導体回路４１，４２の中，一方の導体回路４１は基板７の表面に，他方の導体回路４２は基板７の内部に設けられている。基板７は，上記半田用スルーホール７５のほかに，内部に設けた導体回路４２と接続するスルーホール７４を有している。
【００１７】
次に，上記電子部品搭載用基板の製造方法について説明する。
まず，ガラス・ビスマレイミドトリアジン樹脂からなる基板を準備する。次いで，図５に示すごとく，基板７の表面及び内部に導体回路４１，４２を形成する。また，基板７の略中心には搭載用開口部７３を穿設して，その周囲にスルーホール７４及びホンディングパッド４１１，４２１を形成する。また導体回路４１の外周には半田用スルーホール７５を形成する。スルーホール７４及び半田用スルーホール７５の内壁には金属めっき膜４を施す。
【００１８】
次いで，図６，図４に示すごとく，半田用スルーホール７５の外側に沿って接着剤５２を配設する。接着剤５２としては，エポキシ系接着剤を用いる。
次いで，半田用スルーホール７５の上にリード２の先端部を配置して，リード２を接着剤５２により位置決め，固定する。リード２は，例えば，四角枠状のフレームから中央に向けて各辺４０本ずつ合計１６０本が連結されている。
【００１９】
次いで，基板７の下方に溶融した半田を噴流させる。すると，溶融した半田５１は，図７に示すごとく，毛細管現象によって半田用スルーホール７５の中を上昇して半田用スルーホール７５の上方に位置するリード２に到達する。これにより，リード２が半田５１によって固定される。
【００２０】
次いで，基板７の上面に接着剤５３を配設し，その表面にダムリング１を配置して，基板７にダムリング１を接着する。ダムリング１は，エポキシ樹脂を枠状に成形したものであり，その外形寸法は基板７の外形寸法と同じにする。ダムリング１の厚みは０．１〜０．５ｍｍである。接着剤５３としては，エポキシ系接着剤を用いる。
【００２１】
次いで，図８に示すごとく，銅製のヒートスラッグ６を準備し，その半田用スルーホール７５に対面する部分に凹部６１を形成する。次いで，接着剤５４を基板７の下面に配設し，その表面にヒートスラッグ６を配置する。これにより，ヒートスラッグ６を基板７に接着する。
なお，本例においては上記のごとくダムリング，ヒートスラッグの順に接着しているが，逆にヒートスラッグ，ダムリングの順に接着してもよい。
【００２２】
次いで，図９に示すごとく，搭載用開口部７３の中に電子部品３を搭載する。次いで，電子部品３とボンディングパッド４１１との間にボンディングワイヤー３１を接続して，両者の電気導通を行う。次いで，搭載用開口部７３及びダムリング１の内径部１０の中に封止用樹脂８を滴下して，電子部品３を封止する。
その後，リードの突出先端部に半田めっきを施し，リードを基板とともにフレームから打ち抜いて単品とし，リードのフォーミングを行う。
以上により，上記電子部品搭載用基板が得られる。
【００２３】
次に，本例の作用及び効果について説明する。
本例の電子部品搭載用基板は，図１に示すごとく，搭載用開口部７３の周囲にダムリング１を設けて，ダムリング１により搭載用開口部７３内に充填した封止用樹脂８の樹脂流れを防止する。そのため，ダムリング１の中に封止用樹脂８を滴下する簡易な操作で，電子部品３を封止することができる。それ故，製造コストを大幅に削減できる。また，封止用樹脂８の温度，流動状態等の条件も緩和されるため，封止用樹脂の開発コストを低くすることができ，封止用樹脂の開発期間を短縮化することができる。
なお，本例のようにダムリング１の中に封止用樹脂８を滴下して，電子部品３を封止する方法を，ポッティング封止という。
【００２４】
また，ダムリング１は，基板７との間にリード２を挟着保持している。そのため，リード２がダムリング１により上方から押さえられる。それ故，リードの接合状態を補強して，リードの外れ及び横ズレを防止することができる。
【００２５】
更に，搭載用開口部７３を覆うヒートスラッグ６の上に，電子部品３を直接搭載するため，電子部品３の熱を効率良くヒートスラッグ６より放散させることができる。更に，ヒートスラッグ６は，基板７と同一形状の大きさを有し，広表面積を有するため，放熱性が良い。
【００２６】
また，リード２と基板７との間には，接着剤５２が配設されている。そのため，リード２の位置決めが容易となり，またリードの横ズレを防止することができる。
また，半田用スルーホール７５の上方にリード２を配置し，半田用スルーホール７５の中に半田５１を充填している。半田用スルーホール７５は導体回路４１，４２と接続している。そのため，リード２は，半田用スルーホール７５に充填した半田５１を介して，基板７に設けた導体回路４１，４２との間の電気的導通を行うことができる。
【００２７】
また，図１，図３に示すごとく，ヒートスラッグ６における半田用スルーホール７５に対面する部分には凹部６１が設けられている。そのため，半田用スルーホール７５に充填した半田５１とヒートスラッグ６との電気的絶縁を図ることができる。
【００２８】
なお，本例においては，基板７の内部に設けた導体回路４２は，図１，図４に示すごとく，スルーホール７４により基板７の表面に設けたボンディングパッド４２１と接続しているが，図９に示すごとく，搭載用開口部７３を階段状の層構造に形成してその段部にボンディングパッド４２１を設けて導体回路４２と直接接続することもできる。
【００２９】
また，ヒートスラッグ６に設けた凹部６１は図３に示すごとく溝状に設けているが，各半田用スルーホール７５に対応させて独立した複数の凹部を形成することもできる。
本例の電子部品搭載用基板は，リード２を基板７の四方向に接合した構造を有するため，パッケージ特性が高い高機能ＱＦＰである。
【００３０】
実施形態例２
本例においては，図１０，図１１に示すごとく，基板７とリード２とを半田５９により接合している。
リード２は，図１１に示すごとく，基板７の上に配置した接着剤５２により接着位置決めし，その状態で導体回路４１と半田５９により接合される。
また，ヒートスラッグ６における搭載用開口部７３を覆う部分に凸部６９を設けて，該凸部６９の上に電子部品３を搭載している。凸部６９は，搭載用開口部７３の略中央まで突出している。
その他は，実施形態例１と同様である。
本例においても，実施形態例１と同様の効果を得ることができる。
【００３１】
【発明の効果】
本発明によれば，電子部品の封止作業を容易に行うことができ，かつリードの接合強度を高くすることができる電子部品搭載用基板を提供することができる。
【図面の簡単な説明】
【図１】実施形態例１における，電子部品搭載用基板の断面図。
【図２】実施形態例１における，電子部品搭載用基板の平面図。
【図３】実施形態例１における，ヒートスラッグに設けた凹部と半田用スルーホールとの位置関係を示す説明図。
【図４】実施形態例１における，電子部品搭載用基板の斜視図。
【図５】実施形態例１における，電子部品搭載用基板の製造方法を示す基板の断面図。
【図６】図５に続く，リードを位置決め，固定した基板の断面図。
【図７】図６に続く，ダムリングを接着した基板の断面図。
【図８】図７に続く，ヒートスラッグを接着した基板の断面図。
【図９】実施形態例１における，階段状の搭載用開口部を有する電子部品搭載用基板の断面図。
【図１０】実施形態例２における，電子部品搭載用基板の断面図。
【図１１】実施形態例２における，リードと導体回路との接合方法を示す基板の断面図。
【図１２】従来例の電子部品搭載用基板の平面図。
【図１３】従来例における，キャップを用いた電子部品の封止方法を示す説明図。
【図１４】従来例における，金型を用いた電子部品の封止方法を示す説明図。
【符号の説明】
１．．．ダムリング，
２．．．リード，
３．．．電子部品，
４１，４２．．．導体回路，
５１．．．半田，
５２，５３，５４．．．接着剤，
６．．．ヒートスラッグ，
６１．．．凹部，
７．．．基板，
７３．．．搭載用開口部，
７５．．．半田用スルーホール，[0001]
【Technical field】
The present invention relates to an electronic component mounting substrate to which leads are connected, and more particularly to a method for sealing an electronic component.
[0002]
[Prior art]
A quad flat package (hereinafter referred to as QFP) has a structure in which leads are joined by wire bonding in four directions of an electronic component. Among them, QFP having a structure in which leads are connected to a substrate and electrically connected to an electronic component through a conductor circuit provided on the substrate is used as a high-function QFP because of its high package characteristics.
[0003]
As such a high function QFP, for example, as shown in FIG. 12, there is an electronic component mounting board in which leads 92 are joined in four directions of a board 97. The substrate 97 is provided with a mounting portion 973 for mounting the electronic component 93 at substantially the center thereof, and has a conductor circuit 94 around the mounting portion 973. The electronic component 93 and the conductor circuit 94 are connected by a bonding wire 951.
[0004]
The electronic component 93 is sealed after being mounted on the mounting portion 973. The sealing method includes the following methods.
First, as shown in FIG. 13, there is a method of sealing with a cap 961 made of the same material as the substrate 97. This method is widely used when the substrate is a non-mold type such as ceramic or aluminum.
Further, as shown in FIG. 14, there is a method in which a mold 963 having a cavity 962 that can enclose the entire QFP 9 is prepared, a sealing resin 965 is introduced into the cavity 962, and the electronic component 93 is sealed. is there.
[0005]
[Problems to be solved]
However, the conventional method for sealing an electronic component has the following problems.
First, in the former method using a cap, the manufacturing cost of the cap is high. Moreover, many QFPs using a cap are made of a material such as ceramic or aluminum. Furthermore, as shown in FIG. 13, since the cap 961 is a cavity 966, the bonding strength of the lead 92 to the substrate 97 is weak. Therefore, the lead 92 is easy to move and is easily detached from the substrate 97.
[0006]
In the latter method using a mold, when a new electronic component mounting substrate is developed, the shape of the electronic component mounting substrate changes, so that the existing mold cannot be used. Manufacturing the mold is very expensive. In addition, many experiments must be repeated to set the conditions for the resin injected into the cavity.
[0007]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide an electronic component mounting substrate that can easily perform the sealing operation of electronic components and can increase the bonding strength of leads.
[0008]
[Means for solving problems]
According to a first aspect of the present invention, there is provided a substrate having a mounting opening and a conductor circuit for mounting an electronic component, a heat slug that adheres to a lower portion of the substrate and covers the mounting opening, and an outer periphery of the conductor circuit. An electronic component mounting board having a lead joined to
A dam ring for preventing the resin flow of the sealing resin filling the mounting opening is provided on the surface of the substrate around the mounting opening, and the lead is provided between the dam ring and the substrate. Is held in place ,
The electronic component mounting board is characterized in that an adhesive is disposed between the lead and the board .
[0009]
Next, the operation and effect of the present invention will be described.
In the present invention, a dam ring is provided around the mounting opening, and the resin flow of the sealing resin filled in the mounting opening is prevented by the dam ring. Therefore, the electronic component can be sealed with a simple operation of dropping the sealing resin into the dam ring. Therefore, the manufacturing cost can be greatly reduced. Further, since the conditions such as the temperature and flow state of the sealing resin are eased, the development cost of the sealing resin can be reduced, and the development period of the sealing resin can be shortened.
[0010]
In addition, the dam ring holds the lead between the substrate and the dam ring. Therefore, the lead is pressed from above by the dam ring. Therefore, the lead joining state can be reinforced to prevent the lead from coming off and from being laterally displaced.
[0011]
Furthermore, since the electronic component is mounted directly on the heat slug covering the mounting opening, the heat of the electronic component can be efficiently dissipated from the heat slug, and the heat dissipation is excellent.
[0012]
An adhesive is disposed between the lead and the substrate . As a result, the positioning of the leads can be facilitated and the misalignment of the leads can be prevented.
[0013]
According to a second aspect of the present invention, the substrate has a solder through hole for filling the solder for joining the leads, and the heat slug has a recess in a portion facing the solder through hole. It is preferable. As a result, the lead can be electrically connected to the conductor circuit provided on the substrate via the solder filled in the solder through hole. In addition, since the heat slug is provided with a recess in the portion facing the solder through-hole, it is possible to achieve electrical insulation between the solder filled in the solder through-hole and the heat slug.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1
An electronic component mounting board according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the electronic component mounting board of this example is mounted by adhering to the substrate 7 having the mounting opening 73 for mounting the electronic component 3 and the conductor circuits 41 and 42, and the lower part of the substrate 7. The heat slug 6 covering the opening 73 for use and the lead 2 joined to the outer periphery of the conductor circuit 41 are provided.
As shown in FIGS. 1 and 2, a dam ring 1 for preventing the resin flow of the sealing resin 8 filling the mounting opening 73 is provided on the surface of the substrate 7 around the mounting opening 73. ing. A lead 2 is sandwiched and held between the dam ring 1 and the substrate 7.
[0015]
As shown in FIGS. 1 and 3, the substrate 7 has a solder through hole 75 for filling the solder 51 for joining the lead 2. A recess 61 is provided in a portion of the heat slug 6 facing the solder through hole 75. As shown in FIG. 3, the recess 61 is formed in a continuous groove shape so as to correspond to the plurality of solder through holes 75 provided in the peripheral portion of the substrate 7. The depth of the recess 61 is 0.1 to 0.8 mm.
As shown in FIGS. 1 and 4, an adhesive 52 is disposed between the lead 2 and the substrate 7.
[0016]
Of the conductor circuits 41, 42, one conductor circuit 41 is provided on the surface of the substrate 7, and the other conductor circuit 42 is provided inside the substrate 7. In addition to the solder through hole 75, the substrate 7 has a through hole 74 connected to the conductor circuit 42 provided inside.
[0017]
Next, a method for manufacturing the electronic component mounting board will be described.
First, a substrate made of glass / bismaleimide triazine resin is prepared. Next, as shown in FIG. 5, conductor circuits 41 and 42 are formed on the surface and inside of the substrate 7. Further, a mounting opening 73 is formed in the approximate center of the substrate 7, and through holes 74 and bonding pads 411, 421 are formed around the mounting opening 73. A solder through hole 75 is formed on the outer periphery of the conductor circuit 41. The metal plating film 4 is applied to the inner walls of the through hole 74 and the solder through hole 75.
[0018]
Next, as shown in FIGS. 6 and 4, an adhesive 52 is disposed along the outside of the solder through hole 75. An epoxy adhesive is used as the adhesive 52.
Next, the tip of the lead 2 is placed on the solder through hole 75, and the lead 2 is positioned and fixed by the adhesive 52. For example, a total of 160 leads 2 are connected to each of 40 leads from the square frame-shaped frame toward the center.
[0019]
Next, molten solder is jetted below the substrate 7. Then, as shown in FIG. 7, the melted solder 51 rises in the solder through hole 75 by capillary action and reaches the lead 2 positioned above the solder through hole 75. Thereby, the lead 2 is fixed by the solder 51.
[0020]
Next, the adhesive 53 is disposed on the upper surface of the substrate 7, the dam ring 1 is disposed on the surface, and the dam ring 1 is bonded to the substrate 7. The dam ring 1 is formed by molding an epoxy resin into a frame shape, and the external dimensions thereof are the same as the external dimensions of the substrate 7. The thickness of the dam ring 1 is 0.1 to 0.5 mm. An epoxy adhesive is used as the adhesive 53.
[0021]
Next, as shown in FIG. 8, a copper heat slug 6 is prepared, and a recess 61 is formed in a portion facing the solder through hole 75. Next, the adhesive 54 is disposed on the lower surface of the substrate 7, and the heat slug 6 is disposed on the surface thereof. As a result, the heat slug 6 is bonded to the substrate 7.
In this example, the dam ring and the heat slug are bonded in this order as described above, but conversely, the heat slug and the dam ring may be bonded in this order.
[0022]
Next, as shown in FIG. 9, the electronic component 3 is mounted in the mounting opening 73. Next, a bonding wire 31 is connected between the electronic component 3 and the bonding pad 411 to conduct electrical connection therebetween. Next, the sealing resin 8 is dropped into the mounting opening 73 and the inner diameter portion 10 of the dam ring 1 to seal the electronic component 3.
After that, solder plating is applied to the leading end of the lead, and the lead is punched out of the frame together with the substrate to form a single product, and the lead is formed.
Thus, the electronic component mounting board is obtained.
[0023]
Next, the operation and effect of this example will be described.
As shown in FIG. 1, the electronic component mounting substrate of this example is provided with a dam ring 1 around the mounting opening 73, and the sealing resin 8 filled in the mounting opening 73 by the dam ring 1. Prevent resin flow. Therefore, the electronic component 3 can be sealed by a simple operation of dropping the sealing resin 8 into the dam ring 1. Therefore, the manufacturing cost can be greatly reduced. Further, since the conditions such as the temperature and flow state of the sealing resin 8 are relaxed, the development cost of the sealing resin can be reduced, and the development period of the sealing resin can be shortened.
Note that the method of sealing the electronic component 3 by dropping the sealing resin 8 into the dam ring 1 as in this example is called potting sealing.
[0024]
In addition, the dam ring 1 holds the lead 2 between the dam ring 1 and the substrate 7. Therefore, the lead 2 is pressed from above by the dam ring 1. Therefore, the lead joining state can be reinforced to prevent the lead from coming off and from being laterally displaced.
[0025]
Furthermore, since the electronic component 3 is directly mounted on the heat slug 6 covering the mounting opening 73, the heat of the electronic component 3 can be efficiently dissipated from the heat slug 6. Furthermore, the heat slug 6 has the same shape as the substrate 7 and has a large surface area, so that it has good heat dissipation.
[0026]
Further, an adhesive 52 is disposed between the lead 2 and the substrate 7. Therefore, the positioning of the lead 2 is facilitated and the lateral displacement of the lead can be prevented.
Further, the lead 2 is disposed above the solder through hole 75, and the solder 51 is filled in the solder through hole 75. The solder through-hole 75 is connected to the conductor circuits 41 and 42. Therefore, the lead 2 can be electrically connected to the conductor circuits 41 and 42 provided on the substrate 7 through the solder 51 filled in the solder through hole 75.
[0027]
As shown in FIGS. 1 and 3, a recess 61 is provided in a portion of the heat slug 6 that faces the solder through hole 75. Therefore, electrical insulation between the solder 51 filled in the solder through-hole 75 and the heat slug 6 can be achieved.
[0028]
In this example, the conductor circuit 42 provided in the substrate 7 is connected to the bonding pad 421 provided on the surface of the substrate 7 through the through hole 74 as shown in FIGS. As shown in FIG. 9, the mounting opening 73 can be formed in a stepped layer structure, and a bonding pad 421 can be provided on the step to directly connect to the conductor circuit 42.
[0029]
Further, although the recess 61 provided in the heat slug 6 is provided in a groove shape as shown in FIG. 3, a plurality of independent recesses can be formed corresponding to each solder through hole 75.
Since the electronic component mounting board of this example has a structure in which the leads 2 are joined in the four directions of the board 7, it is a high-function QFP with high package characteristics.
[0030]
Embodiment 2
In this example, as shown in FIGS. 10 and 11, the substrate 7 and the lead 2 are joined by solder 59.
As shown in FIG. 11, the lead 2 is bonded and positioned by an adhesive 52 disposed on the substrate 7, and in this state, is joined to the conductor circuit 41 and the solder 59.
Further, a convex portion 69 is provided in a portion covering the mounting opening 73 in the heat slug 6, and the electronic component 3 is mounted on the convex portion 69. The convex portion 69 projects to the approximate center of the mounting opening 73.
Others are the same as in the first embodiment.
Also in this example, the same effects as those of the first embodiment can be obtained.
[0031]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the electronic component mounting board | substrate which can perform the sealing operation | work of an electronic component easily and can make joint strength of a lead high can be provided.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an electronic component mounting board in Embodiment 1;
2 is a plan view of an electronic component mounting board in Embodiment 1. FIG.
3 is an explanatory diagram showing a positional relationship between a recess provided in a heat slug and a solder through hole in Embodiment 1. FIG.
4 is a perspective view of an electronic component mounting board in Embodiment 1. FIG.
5 is a cross-sectional view of a substrate illustrating a method for manufacturing an electronic component mounting substrate in Embodiment 1. FIG.
6 is a cross-sectional view of a substrate on which leads are positioned and fixed, following FIG. 5;
FIG. 7 is a cross-sectional view of the substrate to which the dam ring is bonded following FIG. 6;
FIG. 8 is a cross-sectional view of a substrate to which heat slug is bonded, following FIG. 7;
FIG. 9 is a cross-sectional view of an electronic component mounting board having a staircase mounting opening according to the first embodiment.
10 is a cross-sectional view of an electronic component mounting board in Embodiment 2. FIG.
11 is a cross-sectional view of a substrate showing a method for joining leads and conductor circuits in Embodiment 2. FIG.
FIG. 12 is a plan view of a conventional electronic component mounting board.
FIG. 13 is an explanatory view showing a method for sealing an electronic component using a cap in a conventional example.
FIG. 14 is an explanatory view showing a method of sealing an electronic component using a mold in a conventional example.
[Explanation of symbols]
1. . . Dam ring,
2. . . Lead,
3. . . Electronic components,
41, 42. . . Conductor circuit,
51. . . solder,
52, 53, 54. . . adhesive,
6). . . Heat slug,
61. . . Recess,
7. . . substrate,
73. . . Mounting opening,
75. . . Through hole for solder,

Claims (3)

電子部品を搭載するための搭載用開口部及び導体回路を有する基板と，該基板の下部に接着して上記搭載用開口部を覆うヒートスラッグと，上記導体回路の外周に接合したリードとを有する電子部品搭載用基板であって，
上記搭載用開口部の周囲の基板表面には，搭載用開口部内に充填する封止用樹脂の樹脂流れを防止するダムリングを設けてなるとともに，該ダムリングと上記基板との間において上記リードが挟着保持されており，
かつ，上記リードと上記基板との間には，接着剤が配設されていることを特徴とする電子部品搭載用基板。A board having a mounting opening and a conductor circuit for mounting an electronic component, a heat slug that adheres to the lower part of the board and covers the mounting opening, and a lead that is joined to the outer periphery of the conductor circuit A board for mounting electronic components,
A dam ring for preventing resin flow of the sealing resin filling the mounting opening is provided on the surface of the substrate around the mounting opening, and the lead is interposed between the dam ring and the substrate. Is held in place ,
An electronic component mounting board , wherein an adhesive is disposed between the lead and the board. 請求項１において，上記基板は上記リードを電気的に接続する半田を充填するための半田用スルーホールを有し，上記ヒートスラッグは上記半田用スルーホールに対面する部分に凹部を有していることを特徴とする電子部品搭載用基板。2. The substrate according to claim 1, wherein the substrate has a solder through hole for filling with solder for electrically connecting the leads, and the heat slug has a recess in a portion facing the solder through hole. An electronic component mounting board characterized by the above. 電子部品を搭載するための搭載用開口部及び導体回路を有する基板と，該基板の下部に接着して上記搭載用開口部を覆うヒートスラッグと，上記導体回路の外周に接合したリードとを有する電子部品搭載用基板であって，
上記搭載用開口部の周囲の基板表面には，搭載用開口部内に充填する封止用樹脂の樹脂流れを防止するダムリングを設けてなるとともに，該ダムリングと上記基板との間において上記リードが挟着保持されており，
かつ，上記基板は上記リードを電気的に接続する半田を充填するための半田用スルーホールを有し，上記ヒートスラッグは上記半田用スルーホールに対面する部分に凹部を有していることを特徴とする電子部品搭載用基板。 A board having a mounting opening and a conductor circuit for mounting an electronic component, a heat slug that adheres to the lower part of the board and covers the mounting opening, and a lead that is joined to the outer periphery of the conductor circuit A board for mounting electronic components,
A dam ring for preventing resin flow of the sealing resin filling the mounting opening is provided on the surface of the substrate around the mounting opening, and the lead is interposed between the dam ring and the substrate. Is held in place,
The substrate has a solder through hole for filling with solder for electrically connecting the leads, and the heat slug has a recess in a portion facing the solder through hole. An electronic component mounting board .
JP31020896A 1996-11-05 1996-11-05 Electronic component mounting board Expired - Fee Related JP3711669B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31020896A JP3711669B2 (en) 1996-11-05 1996-11-05 Electronic component mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31020896A JP3711669B2 (en) 1996-11-05 1996-11-05 Electronic component mounting board

Publications (2)

Publication Number Publication Date
JPH10144823A JPH10144823A (en) 1998-05-29
JP3711669B2 true JP3711669B2 (en) 2005-11-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP31020896A Expired - Fee Related JP3711669B2 (en) 1996-11-05 1996-11-05 Electronic component mounting board

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