[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JP3782523B2 - Substrate adsorption member and apparatus - Google Patents

Substrate adsorption member and apparatus Download PDF

Info

Publication number
JP3782523B2
JP3782523B2 JP24214196A JP24214196A JP3782523B2 JP 3782523 B2 JP3782523 B2 JP 3782523B2 JP 24214196 A JP24214196 A JP 24214196A JP 24214196 A JP24214196 A JP 24214196A JP 3782523 B2 JP3782523 B2 JP 3782523B2
Authority
JP
Japan
Prior art keywords
suction
substrate
pad
glass substrate
suction pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP24214196A
Other languages
Japanese (ja)
Other versions
JPH1086086A (en
Inventor
一也 伊藤
幸彦 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP24214196A priority Critical patent/JP3782523B2/en
Publication of JPH1086086A publication Critical patent/JPH1086086A/en
Application granted granted Critical
Publication of JP3782523B2 publication Critical patent/JP3782523B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、例えば液晶パネル用の大型ガラス基板の検査工程に用いられる基板吸着部材および装置に関するものである。
【0002】
【従来の技術】
最近、液晶技術の進歩にともない、液晶パネルなどの表示素子も大型化され、これとともに、マスター基板と呼ばれるガラス基板の大型化も進んでいる。
このようなガラス基板は、その大きさに対して厚さが極めて薄く、たわみ易いものになっているが、かかるガラス基板についても、品質管理の上から顕微鏡などを使用した各種の検査が行われており、これら検査を検査装置の大型ステージ上に載置した状態で行うようになっている。
【0003】
そこで、従来、特開平7−183366号公報に開示される大型ガラス基板のエア吸着方法が考えられている。図11は、載置台1の表面に複数の方形の吸着溝2a〜2dを、載置台1の中心点Oに対して対称的に、適当な間隔をおいて形成し、これら複数の方形の吸着溝2a〜2dに対して、中心点Oに近い吸着溝2aから遠い吸着溝2dの順で適当なタイムラグをなして順にエア吸着することにより、このように載置台1上に載置されるガラス基板3全面を、載置台1面に密着させ、安定に固定できるようにしたものである。
【0004】
【発明が解決しようとする課題】
ところが、このようなエア吸着方法によると、仮に、図12に示すようにガラス基板3に反りがあって、ガラス基板3の周縁部分が載置台1面から僅かに浮き上がっているような場合、載置台1面とガラス基板3面が密着状態にならず、安定した基板検査ができないことがある。このため、エア吸着力を増して強引にガラス基板3面を密着させようとすると、吸着時の大きな吸引力により極めて薄く壊れやすいガラス基板3が破損してしまうおそれがあった。
【0005】
また、最近の顕微鏡を使用した基板検査には、透過照明を使用して基板上の傷や埃を検出することが行われているが、上述した方法に適用される載置台1では、載置台1中央部分に穴部を形成していないことから、このような基板検査ができないという問題点もあった。
【0006】
本発明は、上記事情に鑑みてなされたもので、載置台への基板を確実に吸着でき、精度の高い安定した基板検査を実現できる基板吸着部材および装置を提供することを目的とする。
【0007】
【課題を解決するための手段】
本発明の基板吸着部材は、上部に基板吸着部を有し、上方周面に段部を形成した中空の吸着パッドと、前記基板吸着部の中央に形成され前記中空と連通する孔部と、前記吸着パッドの中空内に間隙をもって挿入され、前記基板吸着部の裏面に接する側の端部に吸盤を一体に形成するとともに前記基板吸着部の孔部に連通する筒状に形成され、前記吸着パッドを弾性的に支持する弾性部材からなるパッド支持部材と、前記基板吸着部より大きな孔部を有し、前記吸着パッドを所定範囲での動きを可能にして基板を載置する載置面に取付ける押え枠部とを具備したことを特徴としている。
【0008】
本発明の基板吸着装置は、薄い板状の基板を載置する載置台と、前記載置台上に配置され、エア吸着力を発生する基板吸着部を有する吸着パッドと、前記吸着パッドを支持するとともに、前記吸着パッドを前記載置台面より突出する方向に弾性力を作用させ、かつエア吸着力により前記基板吸着部材を収納する穴部内に引き込む方向に弾性力を作用させる吸着パッド支持部材と、前記吸着パッドの基板吸着部にエア吸着力を発生させるエア制御手段とを具備したことを特徴とする。
【0009】
この結果、本発明の基板吸着部材によれば、基板吸着部を有する吸着パッドは、弾性部材のパッド支持部材による支持により、所定範囲で自由に動けるようになっているので、基板の動きに対してもパッド支持部材の変形により、吸着部を吸着でき、さらにパッド支持部材の弾性力により外れにくい状態で保持できる。
【0010】
また、本発明の基板吸着部材によれば、基板吸着部に基板を吸着した状態で、吸着パッドが弾性部材に当接することにより、吸着パッドに対するバネ定数が急激に増加して基板側の振動を抑制することができる。
【0011】
また、本発明の基板吸着装置によれば、吸着パッドを載置台面より上方に突出させ弾性的に支持することにより基板に反りが生じても基板にパッドが近接し、かつ吸着時に基板の傾きに添うように吸着パッドが変形して基板に密着するので、吸着部での吸着を確実に行うことができ、基板に関する検査を安定した状態で精度よく行うことができる。
【0012】
【発明の実施の形態】
以下、本発明の実施の形態を図面に従い説明する。
(第1の実施の形態)
図1は、本発明が適用されるガラス基板を吸着保持する基板吸着装置の概略構成を示している。図において、11はガラス基板12を載置する載置台で、この載置台11は、長方形の枠状をなしていて、この長方形の枠部分にガラス基板12を載置するとともに、中央部分を透孔部に形成して、いわゆる中抜き載置台に構成している。
【0013】
また、載置台11には、複数の基板吸着部材13を設けている。この場合、基板吸着部材13は、載置台11の長手方向の周縁に2個づつ、幅方向の周縁に2個づつの合計8個を配置している。
【0014】
図2は、基板吸着部材13の概略構成の断面図を示している。この場合、図2は、左右対称形状の中心面から半分だけを図示したものである。
図において、14は合成樹脂などで形成される中空の吸着パッドで、この吸着パッド14は、上方に吸着部141を有し、この吸着部141の中央部には、中空部に連通する穴部142を形成している。また、この吸着パッド14の上方周面に、段部143を形成している。
【0015】
吸着パッド14の中空部に僅かな間隙16を介して筒状のパッド支持部材15を挿入している。このパッド支持部材15は、ゴムなどの比較的柔らかく変形し易い弾性部材からなるもので、先端部に吸盤151を形成し、この吸盤151面を吸着パッド14の吸着部141の裏面側に当接している。
【0016】
そして、このような吸着パッド14とパッド支持部材15を有する基板吸着部材13は、図3に示すように載置台11の吸着パッド取付け部111に取付けられる。この場合、吸着パッド取付け部111は、溝部112を形成し、この溝部112の底面に穴部113を有していて、この溝部112にパッド支持部材15を設けた吸着パッド14を僅かな間隙17を介して設けるとともに、溝部112底面の穴部113をパッド支持部材15の中空部、吸盤151を介して吸着パッド14の吸着部141中央部の穴部142に連通するようにしている。
【0017】
そして、吸着パッド14の先端部に、押え枠体18の穴部181を挿通するとともに、この穴部181周縁部に吸着パッド14の段部143を係合することで、吸着パッド14の抜落ちを防止して載置台11上に保持している。この場合、押え枠体18の穴部181と吸着パッド14の先端部との間にも僅かな間隙22を形成して、吸着パッド14の所定範囲での動きを可能にしている。また、押え枠体18は、図示しないネジなどにより載置台11に固定している。
【0018】
そして、このような基板吸着部材13を取付けた溝部112底面の穴部113に通気管19を連通するとともに、電磁弁20を介して真空ポンプ21を接続し、この真空ポンプ21でのエア引きによるエア駆動力によりパッド支持部材15を介して吸着パッド14の吸着部141にエア吸着力を得られるようにしている。
【0019】
次に、このように構成した実施の形態の動作を説明する。
いま、ガラス基板12の検査工程において、ガラス基板12が、中抜きの載置台11上に供給されるが、この時、ガラス基板12の周縁部が載置台11の長手方向および幅方向のそれぞれ周縁に設けられた基板吸着部材13上に位置するようにしている。
【0020】
そして、この状態から、真空ポンプ21でエア引きが行われると、それぞれの基板吸着部材13では、パッド支持部材15を介して吸着パッド14の吸着部141にエア吸着力が得られ、ガラス基板12は、載置台11上に吸着状態になって固定される。
【0021】
ここで、ガラス基板12面が全く平ならば、載置台11面と平行が保たれるので、何ら問題ないが、仮に、ガラス基板12に反りがあるような場合、載置台11面と平行でなくなることがある。この場合、本発明の基板吸着部材13では、吸着部141を有する吸着パッド14は、その中空部に弾性部材のパッド支持部材15で支持されており、ガラス基板12の反りによる傾きに対応してパッド支持部材15の変形により、吸着パッド14が載置台11の溝部112との間隙17および押え枠体18の穴部181と吸着パッド14の先端部との間隙22の範囲で自由に傾くようになっているので、ガラス基板12の反り面に対して吸着パッド14の吸着部141がガラス基板12に対してほぼ平行になり、ガラス基板12が良好に吸着され、さらにパッド支持部材15の弾性力により吸着の外れにくい状態で保持される。
【0022】
これにより、ガラス基板12は、多少の反りがあるような場合も、載置台11上の複数の基板吸着部材13により確実に吸着して載置するようにできるので、反りによる焦点ズレや基板の振動ズレが防止でき、安定した状態でガラス基板12の検査を実施することができる。しかも、吸着パッド14が載置台11上面より突出しているので、ガラス基板12に反りが生じても常に吸着パッド14にガラス基板12が近接して良好な吸着力が作用する。また、ガラス基板12を載置する載置台11は、中央部分を透孔部に形成した、いわゆる中抜き載置台に構成しているので、透過照明を使用した傷や埃の検出にも適用することができる。
(第2の実施の形態)
ところで、第1の実施の形態では、吸着パッド14を支持するパッド支持部材15の変形により吸着パッド14が載置台11の溝部112との間隙17の範囲で自由に傾くように構成しているが、パッド支持部材15には、ゴムなどの比較的柔らかく変形し易い弾性部材を用いているため、仮に床面から振動が侵入したり、クリーンルーム内のダウンブローなどによりガラス基板12に振動が伝わりたわみを生じたような場合、パッド支持部材15が共振し、ガラス基板12の振動を抑制することができなくおそれがある。特に、顕微鏡を使用した基板検査の場合に、ガラス基板12の光軸方向の振動、たわみにより顕微鏡像にブレやボケなどが生じ易くなって、検査精度か低下してしまう。
【0023】
そこで、この第2の実施の形態では、このようなパッド支持部材15自身の振動を防止するようにしている。図4は、本発明の第2の実施の形態の概略構成を示すもので、図3と同一部分には、同符号を付している。
【0024】
この場合、押え枠体18の穴部181の吸着パッド14の先端部と対向する周縁部に沿って弾性部材、例えばゴムブッシュ23を設けている。この場合、ゴムブッシュ23に代えて、ウレタンやシリコンなどの弾性部材を使用してもよい。
【0025】
この場合、ゴムブッシュ23と吸着パッド14の先端部との間隙22は、検査対称のガラス基板12のたわみ易さなどを考慮して調整する。
このようにすると、ガラス基板12の反りによる傾きに対応してパッド支持部材15の変形により吸着パッド14が傾いてガラス基板12の反り面に吸着された状態で、ガラス基板12に、床面からの振動やクリーンルーム内のダウンブローにより、たわみが生じたような場合、このたわみがある程度進むと吸着パッド14の傾きも大きくなって、押え枠体18の穴部181との間隙22が狭まり、ついには吸着パッド14の先端部がゴムブッシュ23に当接して、その動きが制限される。
【0026】
すると、この当接によりパッド支持部材15のバネ成分に、ゴムブッシュ23のバネ成分が並列結合され、この時点を境に吸着パッド14に対するバネ定数は、図5に示すように急激に増加するようになるので、吸着部141に吸着しているガラス基板12が振動しにくくなって、ガラス基板12自身のたわみが抑制される。
【0027】
このようにすれば、ガラス基板12に振動が伝わるような場合でも、ガラス基板12自身を振動しにくくして、ガラス基板12のたわみを抑制するようにできるので、顕微鏡を使用した基板検査の場合に、顕微鏡像のブレやボケなどを確実に防止でき、精度の高い基板検査を行うことができる。
【0028】
なお、パッド支持部材15の弾性力とゴムブッシュ23の弾性力のバランスを調整することにより、吸着パッド14による吸着し易さと、ガラス基板12の振動しにくさとのバランスを最良に設定することもできる。
(第3の実施の形態)
この第3の実施の形態では、第2の実施の形態で述べたゴムブッシュ23の働きをパッド支持部材15自身に持たせるようにしたものである。
【0029】
この場合、図6(a)(b)に示すようにゴムなどの比較的柔らかく変形し易い弾性部材からなる筒状のパッド支持部材15は、先端部に吸盤151を形成し、基端部側の周面の円周方向に沿って幅の狭い溝部152を形成している。この場合、溝部152は、周面のある点から直線状に形成してもよい。
【0030】
その他は、上述した図4と同様である。
この場合、ガラス基板12に、たわみが生じたような場合、このたわみがある程度進むと、吸着パッド14の傾きとともに、パッド支持部材15の傾きも大きくなって、溝部152の幅が狭まり、ついには、溝部152を挟んだ両端部は、図6(b)のように直接当接される。
【0031】
すると、この溝部152両端部の当接により、パッド支持部材15の溝部152部分でのバネ成分に、溝部152両端部の当接によるバネ成分が並列に結合されるようになって、この時点を境に吸着パッド14のたわみ方向のバネ定数は、上述した図5に似た急激な増加特性が得られるので、この場合も第2の実施の形態と同様な効果が得られる。
【0032】
また、ここでは、パッド支持部材15に溝部152を形成するようにしているで、第2実施の形態と比べて加工箇所、部品点数を少なくでき、コスト的に有利にできる。
(第4の実施の形態)
図7は、本発明の第4の実施の形態の概略構成を示している。
【0033】
この場合、基板載置台31に段部321を有する穴部32を形成し、この穴部32の段部321に弾性を有するダイヤフラム33を気密に取り付け、このダイヤフラム33で仕切られた穴部32下方を通気室322に形成している。
【0034】
ダイヤフラム33の中央部に連なる連通管34を介して吸着パッド35を取り付けている。この吸着パッド35は、吸着部351を有し、この吸着部351の中央部に連通管34を介して通気室322に連通する穴部352を形成している。また、吸着パッド35は、ダイヤフラム33に取り付けた状態で、載置台31面より上方に位置するようになっている。
【0035】
一方、穴部32下方のを通気室322には、通気管36を連通するとともに、電磁弁37を介して真空ポンプ38を接続し、この真空ポンプ38でのエア引きによるエア駆動力により、吸着パッド35の吸着部351にエア吸着力を得られるようにするとともに、さらに通気室322の排気をも可能にしている。
【0036】
しかして、いま、図7(a)に示すように吸着パッド35の吸着部351が載置台31面より上方に位置している状態から、ガラス基板39が載置された場合、吸着パッド35の吸着部351は、ダイヤフラム33の弾性により、図7(b)に示すようにガラス基板39に多少の反りが存在していても、ガラス基板39面に添うように密着される。
【0037】
この状態から、電磁弁37を開くと、真空ポンプ38から吸着パッド35の吸部351までのエア通路が確保され、真空ポンプ38でのエア引きにより吸着パッド35の吸着部351へのガラス基板39の吸着が成立する(図7(b))。
【0038】
さらに、真空ポンプ38によりエア引きを行うと、通気室322内の気圧が低下し、図7(c)に示すようにダイヤフラム33が通気室322側にたわむ。これにより吸着パッド35の吸着部351は、下方向に引き込まれるようになり、ガラス基板39は、載置台31面と面一の状態で固定される。
【0039】
この場合、吸着部351の面積をS1 、ダイヤフラム33の面積をS2 とし、真空ポンプ38により、これら吸着部351およびダイヤフラム33にかかる外気との差圧力をPとすると、吸着部351に作用する吸着力はS1 ・Pで、ダイヤフラム33に作用する引張り力は、S2 ・Pとなる。これにより、S1 ・P<S2 ・Pとすると、ガラス基板39を載置台31面まで引き込んだとき、ガラス基板39が吸着部351から外れるおそれがあるので、S1 ・P>S2 ・Pになるように設定する必要がある。
【0040】
これにより、ガラス基板39に多少の反りなどがあっても、ガラス基板39に対する吸着パッド35の吸着部351の吸着を確実に行い、載置台31上に固定するようにできるので、ガラス基板39に関する検査を安定した状態で精度よく行うことができる。
【0041】
また、吸着部351によりガラス基板39を吸着した状態から、ダイヤフラム33を通気室322側にたわませてガラス基板39を載置台31上に固定するようにしているが、このダイヤフラム33のたわみの時点から吸着部351に対するダイヤフラム33の弾性が急激に変化され、上述した図5に似た特性が得られるので、この場合も第2の実施の形態と同様な効果が得られる。
【0042】
その後、電磁弁37を閉じると、真空ポンプ38から吸着パッド35の吸着部351までのエア通路が遮断され、吸着部351によるガラス基板39の吸着状態が解除される。次いで、ガラス基板39を載置台31から取り除くと、ダイヤフラム33とともに吸着パッド35も図7(a)の状態に自動復帰される。
【0043】
なお、図8に示すように、載置台31上に上述した図7の構成のものに、さらに複数の吸着溝40を配置し、これら吸着溝40に通気管361を連通するとともに、電磁弁371を介して真空ポンプ38に接続するようにして、最初に電磁弁37を開いて上述したようにガラス基板39を載置台31面まで引き込んだ後、電磁弁371を開いて吸着溝40にエア吸着力を作用させるようにすれば、ガラス基板39を効率的に吸着でき、より強固にガラス基板39を固定することができる。
(第5の実施の形態)
図9は、本発明の第5の実施の形態の概略構成を示すもので、図7と同一部分には同符号を付している。
【0044】
この場合、載置台31の穴部32中に吸着部351を有する吸着パッド35をOリング41を介して上下動可能に設け、この吸着パッド35下方の穴部32を通気室322に形成している。そして、吸着部351中央部の穴部352を通気室322に連通している。
【0045】
そして、通気室322には、圧縮バネ42を設け、この圧縮バネ42の弾性力により、吸着パッド35を上方向に押し上げるようにしている。
しかして、この場合も、吸着パッド35は、圧縮バネ42の弾性力により載置台31面より上方に位置されており、載置台31上にガラス基板39が載置されると、このガラス基板39面に添うように密着される。この状態から、電磁弁37を開くと、真空ポンプ38から吸着パッド35の吸着部351までのエア通路が確保され、真空ポンプ38でのエア引きにより吸着パッド35の吸着部351へのガラス基板39の吸着が成立する。
【0046】
この状態から、さらに真空ポンプ38によりエア引きを行うと、通気室322内部が排気され、吸着パッド35は、圧縮バネ42の弾性力に抗して下方向に引き込まれるようになって、ガラス基板39は、載置台31面と面一の状態で固定される(図9)。
【0047】
この場合、吸着部351の面積をS11、通気室322の断面積をS12とし、真空ポンプ38により、これら吸着部351および通気室322にかかる外気との差圧力をPとすると、吸着部351に作用する吸着力はS11・Pで、圧縮バネ42に作用する引張り力は、S12・Pとなる。これにより、S11・P<S12・Pとすると、ガラス基板39を載置台31面まで引き込んだとき、ガラス基板39が吸着部351から外れるおそれがあるので、S11・P>S12・Pになるように設定する必要がある。
【0048】
このようにしても、第4の実施の形態と同様な効果を期待できる。
(第6の実施の形態)
図10は、本発明の第6の実施の形態の概略構成を示すもので、図7と同一部分には同符号を付している。
【0049】
この場合、載置台31の穴部32中に吸着パッド35の吸着部351中央部の穴部352に連通するベローズ管43を取り付け、このベローズ管43に通気管36を連通し、さらに電磁弁37を介して真空ポンプ38を接続している。また、この時のベローズ管43の弾性により吸着パッド35を上方向に押し上げるようにしている。
【0050】
しかして、この場合も、吸着パッド35は、ベローズ管43の弾性力により載置台31面より上方に位置されており、載置台31上にガラス基板39が載置されると、このガラス基板39面に添うように密着される。この状態から、電磁弁37を開くと、真空ポンプ38から吸着パッド35の吸着部351までのエア通路が確保され、真空ポンプ38でのエア引きにより吸着パッド35の吸着部351へのガラス基板39の吸着が成立する。
【0051】
この状態から、さらに真空ポンプ38によりエア引きを行うと、ベローズ管43内部が排気され、ベローズ管43の圧縮方向の変形とともに、吸着パッド35は、下方向に引き込まれるようになって、ガラス基板39は、載置台31面と面一の状態で固定される(図10)。
【0052】
この場合、吸着部351の面積をS21、ベローズ管43の断面積をS22とし、真空ポンプ38により、これら吸着部351およびベローズ管43にかかる外気との差圧力をPとすると、吸着部351に作用する吸着力はS21・Pで、ベローズ管43に作用する引張り力は、S22・Pとなる。これにより、S21・P<S22・Pとすると、ガラス基板39を載置台31面まで引き込んだとき、ガラス基板39が吸着部351から外れるおそれがあるので、S21・P>S22・Pになるように設定する必要がある。
【0053】
このようにしても、第4の実施の形態と同様な効果を期待できる。
なお、上述した第1乃至第6の実施の形態では、一貫してガラス基板について述べたが、ウェハなどの大型基板吸着にも適用することができる。また、第4の実施の形態では、吸着パッドを固定するための押え枠体を載置台11の上面に取り付けるようにしたが、吸着パッドだけが載置台上面より突出するように押え枠体を載置台に埋め込むこともできる。
【0054】
【発明の効果】
以上述べたように、本発明によれば、基板吸着部を有する吸着パッドは、弾性部材のパッド支持部材による支持により、所定範囲で自由に動けるようになっていて、基板の傾きに対してもパッド支持部材の変形により、吸着部を吸着でき、さらにパッド支持部材の弾性力により外れにくい状態で保持できるので、安定した状態での基板検査を実現できる。
【0055】
また、基板吸着部に基板を吸着した状態で、弾性部材のバネ定数の急激な増加により基板の振動を抑制できるので、顕微鏡を使用した基板検査の場合に、顕微鏡像のブレや焦点ズレによるボケなどを確実に防止でき、精度の高い検査を行うことができる。
【0056】
また、載置台上面より吸着パッドを突出させ、この吸着パッドを弾性的に支持することにより、基板に反りなどがあっても吸着部での吸着を確実に行うことができ、基板に関する検査を安定した状態で精度よく行うことができる。
【図面の簡単な説明】
【図1】本発明の第1の実施の形態の概略構成を示す図。
【図2】第1の実施の形態に用いられる基板吸着部材の概略構成を示す図。
【図3】第1の実施の形態に用いられる基板吸着部材の概略構成を示す図。
【図4】本発明の第2の実施の形態に用いられる基板吸着部材の概略構成を示す図。
【図5】第2の実施の形態を説明するための図。
【図6】本発明の第3の実施の形態に用いられる基板吸着部材を構成するパッド支持部材の概略構成を示す図。
【図7】本発明の第4実施の形態の概略構成を示す図。
【図8】第4実施の形態の概略構成を示す図。
【図9】本発明の第5実施の形態の概略構成を示す図。
【図10】本発明の第6実施の形態の概略構成を示す図。
【図11】従来の基板吸着装置の一例の概略構成を示す図。
【図12】載置台上のガラス基板の状態を説明するための図。
【符号の説明】
11…載置台、
111…吸着パッド取付け部、
112…溝部、
113…穴部、
12…ガラス基板、
13…基板吸着部材、
14…吸着パッド、
141…吸着部、
142…穴部、
143…段部、
15…パッド支持部材、
151…吸盤、
152…溝部、
16…間隙、
17…間隙、
18…押え枠体、
181…穴部、
19…通気管、
20…電磁弁、
21…真空ポンプ、
22…間隙、
23…ゴムブッシュ、
31…載置台、
32…穴部、
322…通気室、
33…ダイヤフラム、
34…連通管、
35…吸着パッド、
351…吸着部、
36…通気管、
37…電磁弁、
38…真空ポンプ、
39…ガラス基板、
41…Oリング、
42…圧縮バネ、
43…ベローズ管。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate adsorbing member and an apparatus used in, for example, an inspection process of a large glass substrate for a liquid crystal panel.
[0002]
[Prior art]
Recently, with the advancement of liquid crystal technology, display elements such as liquid crystal panels have also been increased in size, and at the same time, glass substrates called master substrates have been increased in size.
Such a glass substrate is extremely thin with respect to its size and is easy to bend. However, various inspections using a microscope or the like are performed on the glass substrate from the viewpoint of quality control. These inspections are performed in a state where they are placed on a large stage of an inspection apparatus.
[0003]
Therefore, conventionally, an air adsorption method for a large glass substrate disclosed in Japanese Patent Application Laid-Open No. 7-183366 has been considered. In FIG. 11, a plurality of rectangular suction grooves 2 a to 2 d are formed on the surface of the mounting table 1 symmetrically with respect to the center point O of the mounting table 1 at appropriate intervals. The glass placed on the mounting table 1 in this manner by adsorbing air in order with an appropriate time lag in the order of the suction groove 2d far from the suction groove 2a close to the center point O with respect to the grooves 2a to 2d. The entire surface of the substrate 3 is brought into close contact with the surface of the mounting table 1 so that it can be stably fixed.
[0004]
[Problems to be solved by the invention]
However, according to such an air adsorption method, if the glass substrate 3 is warped and the peripheral portion of the glass substrate 3 is slightly lifted from the surface of the mounting table 1 as shown in FIG. The surface of the table 1 and the surface of the glass substrate 3 are not in close contact, and stable substrate inspection may not be possible. For this reason, if the air adsorbing force is increased and the glass substrate 3 surface is forcibly brought into close contact, the glass substrate 3 that is extremely thin and fragile may be damaged by a large attraction force during the adsorption.
[0005]
Further, in recent substrate inspections using a microscope, it is performed to detect scratches and dust on the substrate using transmitted illumination. In the mounting table 1 applied to the above-described method, the mounting table There is also a problem that such a substrate inspection cannot be performed because no hole is formed in the central portion.
[0006]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate adsorbing member and an apparatus that can reliably adsorb a substrate to a mounting table and can realize highly accurate and stable substrate inspection.
[0007]
[Means for Solving the Problems]
The substrate adsorbing member of the present invention has a substrate adsorbing portion at the top, a hollow adsorbing pad having a stepped portion on the upper peripheral surface, a hole formed at the center of the substrate adsorbing portion and communicating with the hollow, The suction pad is inserted into the hollow of the suction pad with a gap, and a suction cup is integrally formed at an end of the suction side of the substrate that is in contact with the back surface of the suction pad, and is formed in a cylindrical shape that communicates with the hole of the substrate suction part. A pad support member made of an elastic member that elastically supports the pad, and a mounting surface on which a substrate is placed by allowing the suction pad to move within a predetermined range, having a hole larger than the substrate suction portion. And a presser frame portion to be attached.
[0008]
Substrate adsorption device of the present invention includes: a mounting table for mounting a thin plate-shaped substrate, placed on the mounting table, for supporting a suction pad having a substrate attracting portion for generating an air suction force, the suction pad A suction pad support member that causes an elastic force to act in a direction in which the suction pad protrudes from the mounting table surface , and that exerts an elastic force in a direction in which the suction force is drawn into the hole portion that houses the substrate suction member . And an air control means for generating an air suction force at the substrate suction portion of the suction pad .
[0009]
As a result, according to the substrate suction member of the present invention, the suction pad having the substrate suction portion can move freely within a predetermined range by the support of the elastic member by the pad support member. However, the suction portion can be sucked by the deformation of the pad support member, and can be held in a state where it is difficult to come off due to the elastic force of the pad support member.
[0010]
Further, according to the substrate suction member of the present invention , the suction pad abuts against the elastic member in a state where the substrate is attracted to the substrate suction portion, so that the spring constant for the suction pad increases rapidly and vibrations on the substrate side are reduced. Can be suppressed.
[0011]
Further, according to the substrate suction device of the present invention , the suction pad is projected upward from the mounting table surface and elastically supported so that even if the substrate is warped, the pad is close to the substrate and the substrate is tilted during suction. Since the suction pad is deformed to adhere to the substrate and adheres to the substrate, the suction at the suction portion can be performed reliably, and the inspection relating to the substrate can be performed accurately in a stable state.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 shows a schematic configuration of a substrate suction apparatus for sucking and holding a glass substrate to which the present invention is applied. In the figure, reference numeral 11 denotes a mounting table on which a glass substrate 12 is mounted. The mounting table 11 has a rectangular frame shape. The glass substrate 12 is mounted on the rectangular frame portion and the central portion is transparent. It forms in a hole and is comprised in what is called a hollow mounting base.
[0013]
The mounting table 11 is provided with a plurality of substrate adsorption members 13. In this case, a total of eight substrate adsorbing members 13 are arranged, two at the periphery in the longitudinal direction of the mounting table 11 and two at the periphery in the width direction.
[0014]
FIG. 2 shows a cross-sectional view of a schematic configuration of the substrate adsorption member 13. In this case, FIG. 2 illustrates only a half from the center plane of the symmetrical shape.
In the figure, reference numeral 14 denotes a hollow suction pad formed of a synthetic resin or the like. The suction pad 14 has a suction portion 141 on the upper side, and a hole portion communicating with the hollow portion is provided at the center of the suction portion 141. 142 is formed. A stepped portion 143 is formed on the upper peripheral surface of the suction pad 14.
[0015]
A cylindrical pad support member 15 is inserted into the hollow portion of the suction pad 14 through a slight gap 16. The pad support member 15 is made of a relatively soft and easily deformable elastic material such as rubber. A suction cup 151 is formed at the tip, and the surface of the suction cup 151 is brought into contact with the back side of the suction portion 141 of the suction pad 14. ing.
[0016]
And the board | substrate adsorption | suction member 13 which has such an adsorption | suction pad 14 and the pad support member 15 is attached to the adsorption | suction pad attachment part 111 of the mounting base 11, as shown in FIG. In this case, the suction pad mounting portion 111 forms a groove portion 112, and has a hole portion 113 on the bottom surface of the groove portion 112, and the suction pad 14 provided with the pad support member 15 is inserted into the groove portion 112 with a slight gap 17. And the hole 113 on the bottom surface of the groove 112 communicates with the hollow part of the pad support member 15 and the hole 142 at the center of the suction part 141 of the suction pad 14 via the suction cup 151.
[0017]
Then, the hole 181 of the presser frame 18 is inserted into the tip of the suction pad 14 and the suction pad 14 is removed by engaging the step 143 of the suction pad 14 with the peripheral edge of the hole 181. Is held on the mounting table 11. In this case, a slight gap 22 is also formed between the hole 181 of the presser frame 18 and the tip of the suction pad 14 to allow the suction pad 14 to move within a predetermined range. Further, the presser frame 18 is fixed to the mounting table 11 with screws or the like (not shown).
[0018]
Then, the vent pipe 19 is communicated with the hole 113 on the bottom surface of the groove 112 to which the substrate adsorbing member 13 is attached, and the vacuum pump 21 is connected via the electromagnetic valve 20, and air is pulled by the vacuum pump 21. The air suction force can be obtained at the suction portion 141 of the suction pad 14 via the pad support member 15 by the air driving force.
[0019]
Next, the operation of the embodiment configured as described above will be described.
Now, in the inspection process of the glass substrate 12, the glass substrate 12 is supplied onto the hollow mounting table 11. At this time, the peripheral part of the glass substrate 12 is the peripheral edge in the longitudinal direction and the width direction of the mounting table 11. It is made to be located on the board | substrate adsorption | suction member 13 provided in this.
[0020]
From this state, when air is drawn by the vacuum pump 21, each substrate suction member 13 obtains an air suction force on the suction portion 141 of the suction pad 14 via the pad support member 15, and the glass substrate 12. Is fixed on the mounting table 11 in an adsorbed state.
[0021]
Here, if the surface of the glass substrate 12 is completely flat, there is no problem because the surface of the glass substrate 12 is kept parallel to the surface of the mounting table 11, but if the glass substrate 12 is warped, it is parallel to the surface of the mounting table 11. It may disappear. In this case, in the substrate suction member 13 of the present invention, the suction pad 14 having the suction portion 141 is supported by the pad support member 15 of an elastic member in the hollow portion, and corresponds to the inclination due to the warp of the glass substrate 12. Due to the deformation of the pad support member 15, the suction pad 14 can freely tilt in the range of the gap 17 between the groove portion 112 of the mounting table 11 and the gap 22 between the hole portion 181 of the holding frame 18 and the tip portion of the suction pad 14. Therefore, the suction portion 141 of the suction pad 14 is substantially parallel to the glass substrate 12 with respect to the warped surface of the glass substrate 12, the glass substrate 12 is satisfactorily sucked, and the elastic force of the pad support member 15. Thus, it is held in a state where it is difficult to remove the adsorption.
[0022]
As a result, the glass substrate 12 can be surely adsorbed and placed by the plurality of substrate adsorbing members 13 on the mounting table 11 even when there is some warping. Vibration deviation can be prevented, and the glass substrate 12 can be inspected in a stable state. Moreover, since the suction pad 14 protrudes from the upper surface of the mounting table 11, even if the glass substrate 12 is warped, the glass substrate 12 is always close to the suction pad 14 and a good suction force acts. Further, since the mounting table 11 on which the glass substrate 12 is mounted is configured as a so-called hollow mounting table in which a central portion is formed in a through-hole portion, it is also applied to detection of scratches and dust using transmitted illumination. be able to.
(Second Embodiment)
By the way, in 1st Embodiment, although comprised by the deformation | transformation of the pad support member 15 which supports the suction pad 14, it is comprised so that the suction pad 14 may incline freely in the range of the clearance gap 17 with the groove part 112 of the mounting base 11. The pad support member 15 is made of an elastic member that is relatively soft and easily deformed, such as rubber. Therefore, if the vibration enters from the floor surface or the vibration is transmitted to the glass substrate 12 by a down blow in a clean room, etc. In such a case, the pad support member 15 may resonate and vibration of the glass substrate 12 may not be suppressed. In particular, in the case of substrate inspection using a microscope, vibration and deflection of the glass substrate 12 in the optical axis direction are likely to cause blurring or blurring in the microscope image, resulting in a decrease in inspection accuracy.
[0023]
Therefore, in the second embodiment, such vibration of the pad support member 15 itself is prevented. FIG. 4 shows a schematic configuration of the second embodiment of the present invention, and the same parts as those in FIG.
[0024]
In this case, an elastic member, for example, a rubber bush 23 is provided along the peripheral edge of the hole 181 of the presser frame 18 that faces the tip of the suction pad 14. In this case, instead of the rubber bush 23, an elastic member such as urethane or silicon may be used.
[0025]
In this case, the gap 22 between the rubber bush 23 and the tip of the suction pad 14 is adjusted in consideration of the ease of bending of the glass substrate 12 that is symmetrical to the inspection.
In this manner, the suction pad 14 is tilted by the deformation of the pad support member 15 and is attracted to the warped surface of the glass substrate 12 in response to the tilt due to the warp of the glass substrate 12. If the deflection is caused by the vibration or the down-blow in the clean room, the inclination of the suction pad 14 increases as the deflection progresses to some extent, and the gap 22 with the hole 181 of the presser frame 18 is narrowed. The tip of the suction pad 14 comes into contact with the rubber bush 23 and its movement is restricted.
[0026]
As a result, the spring component of the rubber bush 23 is coupled in parallel to the spring component of the pad support member 15 by this contact, and the spring constant for the suction pad 14 suddenly increases as shown in FIG. Therefore, the glass substrate 12 adsorbed on the adsorbing portion 141 is less likely to vibrate, and the deflection of the glass substrate 12 itself is suppressed.
[0027]
In this way, even when vibration is transmitted to the glass substrate 12, the glass substrate 12 itself can be made difficult to vibrate and the deflection of the glass substrate 12 can be suppressed, so that in the case of substrate inspection using a microscope. In addition, blurring and blurring of the microscopic image can be reliably prevented, and highly accurate substrate inspection can be performed.
[0028]
It should be noted that by adjusting the balance between the elastic force of the pad support member 15 and the elastic force of the rubber bush 23, the balance between the ease of adsorption by the adsorption pad 14 and the difficulty of vibration of the glass substrate 12 is set to the best. You can also.
(Third embodiment)
In the third embodiment, the pad support member 15 itself has the function of the rubber bush 23 described in the second embodiment.
[0029]
In this case, as shown in FIGS. 6 (a) and 6 (b), the cylindrical pad support member 15 made of a relatively soft and easily deformable elastic member such as rubber forms a suction cup 151 at the distal end, and the proximal end side. A narrow groove 152 is formed along the circumferential direction of the circumferential surface of the groove. In this case, the groove part 152 may be formed linearly from a certain point on the peripheral surface.
[0030]
Others are the same as FIG. 4 mentioned above.
In this case, when the deflection of the glass substrate 12 occurs, when the deflection proceeds to some extent, the inclination of the suction pad 14 and the inclination of the pad support member 15 increase, and the width of the groove portion 152 becomes narrow. The both end portions sandwiching the groove portion 152 are in direct contact with each other as shown in FIG.
[0031]
Then, due to the contact between both ends of the groove 152, the spring component due to the contact between both ends of the groove 152 is coupled in parallel to the spring component at the groove 152 of the pad support member 15. Since the spring constant in the deflection direction of the suction pad 14 has a sharp increase characteristic similar to that shown in FIG. 5 described above, the same effect as in the second embodiment can be obtained in this case as well.
[0032]
Further, here, since the groove portion 152 is formed in the pad support member 15, the number of parts to be processed and the number of parts can be reduced as compared with the second embodiment, which is advantageous in terms of cost.
(Fourth embodiment)
FIG. 7 shows a schematic configuration of the fourth embodiment of the present invention.
[0033]
In this case, a hole 32 having a step 321 is formed in the substrate mounting table 31, and an elastic diaphragm 33 is airtightly attached to the step 321 of the hole 32, and below the hole 32 partitioned by the diaphragm 33. Is formed in the ventilation chamber 322.
[0034]
A suction pad 35 is attached via a communication pipe 34 connected to the central portion of the diaphragm 33. The suction pad 35 has a suction portion 351, and a hole portion 352 that communicates with the ventilation chamber 322 via the communication pipe 34 is formed in the central portion of the suction portion 351. Further, the suction pad 35 is positioned above the surface of the mounting table 31 in a state of being attached to the diaphragm 33.
[0035]
On the other hand, a vent pipe 36 is connected to the vent chamber 322 below the hole 32 and a vacuum pump 38 is connected via an electromagnetic valve 37, and suction is performed by an air driving force generated by air suction by the vacuum pump 38. The air suction force can be obtained at the suction portion 351 of the pad 35, and the exhaust of the ventilation chamber 322 is also enabled.
[0036]
7A, when the glass substrate 39 is placed from the state in which the suction portion 351 of the suction pad 35 is positioned above the surface of the mounting table 31, the suction pad 35 Due to the elasticity of the diaphragm 33, the suction portion 351 is in close contact with the surface of the glass substrate 39 even if there is some warpage in the glass substrate 39 as shown in FIG.
[0037]
When the electromagnetic valve 37 is opened from this state, an air passage from the vacuum pump 38 to the suction portion 351 of the suction pad 35 is secured, and the glass substrate 39 to the suction portion 351 of the suction pad 35 is pulled by air suction by the vacuum pump 38. Is established (FIG. 7B).
[0038]
Further, when air is drawn by the vacuum pump 38, the air pressure in the ventilation chamber 322 decreases, and the diaphragm 33 bends toward the ventilation chamber 322 as shown in FIG. 7C. As a result, the suction portion 351 of the suction pad 35 is drawn downward, and the glass substrate 39 is fixed in a state flush with the surface of the mounting table 31.
[0039]
In this case, if the area of the adsorbing part 351 is S1, the area of the diaphragm 33 is S2, and the pressure difference between the adsorbing part 351 and the outside air applied to the diaphragm 33 by the vacuum pump 38 is P, the adsorbing that acts on the adsorbing part 351 The force is S1 · P, and the tensile force acting on the diaphragm 33 is S2 · P. Thus, if S1 · P <S2 · P, the glass substrate 39 may be detached from the suction portion 351 when the glass substrate 39 is pulled to the surface of the mounting table 31, so that S1 · P> S2 · P. Must be set to
[0040]
As a result, even if the glass substrate 39 is slightly warped, the suction portion 351 of the suction pad 35 can be reliably sucked and fixed onto the mounting table 31 with respect to the glass substrate 39. Inspection can be performed accurately in a stable state.
[0041]
In addition, from the state where the glass substrate 39 is adsorbed by the adsorbing portion 351, the diaphragm 33 is bent toward the ventilation chamber 322 side, and the glass substrate 39 is fixed on the mounting table 31. Since the elasticity of the diaphragm 33 with respect to the adsorbing portion 351 is suddenly changed from the time point, and the characteristics similar to those in FIG. 5 described above are obtained, the same effect as in the second embodiment can be obtained also in this case.
[0042]
Thereafter, when the electromagnetic valve 37 is closed, the air passage from the vacuum pump 38 to the suction portion 351 of the suction pad 35 is blocked, and the suction state of the glass substrate 39 by the suction portion 351 is released. Next, when the glass substrate 39 is removed from the mounting table 31, the suction pad 35 is automatically returned to the state shown in FIG.
[0043]
As shown in FIG. 8, a plurality of suction grooves 40 are further arranged on the mounting table 31 in the configuration of FIG. 7 described above, and a vent pipe 361 is communicated with these suction grooves 40 and an electromagnetic valve 371. The electromagnetic valve 37 is first opened and the glass substrate 39 is drawn to the surface of the mounting table 31 as described above, and then the electromagnetic valve 371 is opened and air is adsorbed in the adsorption groove 40. If the force is applied, the glass substrate 39 can be efficiently adsorbed and the glass substrate 39 can be fixed more firmly.
(Fifth embodiment)
FIG. 9 shows a schematic configuration of the fifth embodiment of the present invention, and the same components as those in FIG.
[0044]
In this case, a suction pad 35 having a suction portion 351 is provided in the hole portion 32 of the mounting table 31 so as to be movable up and down via the O-ring 41, and a hole portion 32 below the suction pad 35 is formed in the ventilation chamber 322. Yes. A hole 352 at the center of the suction portion 351 is communicated with the ventilation chamber 322.
[0045]
The ventilation chamber 322 is provided with a compression spring 42, and the suction pad 35 is pushed upward by the elastic force of the compression spring 42.
In this case as well, the suction pad 35 is positioned above the surface of the mounting table 31 by the elastic force of the compression spring 42, and when the glass substrate 39 is mounted on the mounting table 31, the glass substrate 39. Adhering to the surface. When the electromagnetic valve 37 is opened from this state, an air passage from the vacuum pump 38 to the suction portion 351 of the suction pad 35 is secured, and the glass substrate 39 to the suction portion 351 of the suction pad 35 is pulled by air suction by the vacuum pump 38. Adsorption is established.
[0046]
From this state, when the air is further pulled by the vacuum pump 38, the inside of the ventilation chamber 322 is exhausted, and the suction pad 35 is pulled downward against the elastic force of the compression spring 42, so that the glass substrate 39 is fixed in a state of being flush with the surface of the mounting table 31 (FIG. 9).
[0047]
In this case, if the area of the adsorption part 351 is S11, the cross-sectional area of the ventilation chamber 322 is S12, and the pressure difference between the adsorption part 351 and the outside air applied to the ventilation chamber 322 by the vacuum pump 38 is P, the adsorption part 351 The acting attractive force is S11 · P, and the tensile force acting on the compression spring 42 is S12 · P. As a result, when S11 · P <S12 · P, the glass substrate 39 may be detached from the suction portion 351 when the glass substrate 39 is pulled to the surface of the mounting table 31, so that S11 · P> S12 · P. Must be set to
[0048]
Even if it does in this way, the effect similar to 4th Embodiment can be anticipated.
(Sixth embodiment)
FIG. 10 shows a schematic configuration of the sixth embodiment of the present invention, and the same parts as those in FIG.
[0049]
In this case, a bellows pipe 43 communicating with the hole 352 in the central portion of the suction portion 351 of the suction pad 35 is attached in the hole 32 of the mounting table 31, the ventilation pipe 36 is communicated with the bellows pipe 43, and the solenoid valve 37 is further connected. A vacuum pump 38 is connected via Further, the suction pad 35 is pushed upward by the elasticity of the bellows tube 43 at this time.
[0050]
In this case as well, the suction pad 35 is positioned above the surface of the mounting table 31 by the elastic force of the bellows tube 43, and when the glass substrate 39 is mounted on the mounting table 31, the glass substrate 39. Adhering to the surface. When the electromagnetic valve 37 is opened from this state, an air passage from the vacuum pump 38 to the suction portion 351 of the suction pad 35 is secured, and the glass substrate 39 to the suction portion 351 of the suction pad 35 is pulled by air suction by the vacuum pump 38. Adsorption is established.
[0051]
From this state, when the air is further pulled by the vacuum pump 38, the inside of the bellows pipe 43 is exhausted, and the suction pad 35 is drawn downward along with the deformation of the bellows pipe 43 in the compression direction. 39 is fixed in a state of being flush with the surface of the mounting table 31 (FIG. 10).
[0052]
In this case, assuming that the area of the adsorbing part 351 is S21, the cross-sectional area of the bellows pipe 43 is S22, and the pressure difference between the adsorbing part 351 and the outside air applied to the bellows pipe 43 is P by the vacuum pump 38, the adsorbing part 351 The acting adsorption force is S21 · P, and the tensile force acting on the bellows tube 43 is S22 · P. As a result, if S21 · P <S22 · P, the glass substrate 39 may be detached from the suction portion 351 when the glass substrate 39 is pulled to the surface of the mounting table 31, so that S21 · P> S22 · P. Must be set to
[0053]
Even if it does in this way, the effect similar to 4th Embodiment can be anticipated.
In the first to sixth embodiments described above, the glass substrate has been described consistently, but it can also be applied to adsorption of a large substrate such as a wafer. In the fourth embodiment, the presser frame for fixing the suction pad is attached to the upper surface of the mounting table 11, but the presser frame is mounted so that only the suction pad protrudes from the upper surface of the mounting table. It can also be embedded in the table.
[0054]
【The invention's effect】
As described above, according to the present invention, the suction pad having the substrate suction portion can be freely moved within a predetermined range by the support of the elastic member by the pad support member, and also with respect to the inclination of the substrate. By deforming the pad support member, the adsorbing portion can be adsorbed and further held by the elastic force of the pad support member, so that it is possible to realize a substrate inspection in a stable state.
[0055]
In addition, since the vibration of the substrate can be suppressed by the rapid increase of the spring constant of the elastic member while the substrate is adsorbed on the substrate adsorbing part, in the case of inspecting the substrate using a microscope, the blur due to blurring or defocusing of the microscope image is caused. Etc. can be reliably prevented, and a highly accurate inspection can be performed.
[0056]
In addition, by making the suction pad protrude from the top surface of the mounting table and elastically supporting this suction pad, even if the substrate is warped, it is possible to reliably perform suction at the suction part, and stable substrate inspection Can be carried out with high accuracy.
[Brief description of the drawings]
FIG. 1 is a diagram showing a schematic configuration of a first embodiment of the present invention.
FIG. 2 is a diagram showing a schematic configuration of a substrate adsorption member used in the first embodiment.
FIG. 3 is a diagram showing a schematic configuration of a substrate adsorption member used in the first embodiment.
FIG. 4 is a diagram showing a schematic configuration of a substrate adsorption member used in a second embodiment of the present invention.
FIG. 5 is a diagram for explaining a second embodiment;
FIG. 6 is a diagram showing a schematic configuration of a pad support member that constitutes a substrate adsorbing member used in the third embodiment of the present invention.
FIG. 7 is a diagram showing a schematic configuration of a fourth embodiment of the present invention.
FIG. 8 is a diagram showing a schematic configuration of a fourth embodiment.
FIG. 9 is a diagram showing a schematic configuration of a fifth embodiment of the present invention.
FIG. 10 is a diagram showing a schematic configuration of a sixth embodiment of the present invention.
FIG. 11 is a diagram showing a schematic configuration of an example of a conventional substrate suction apparatus.
FIG. 12 is a view for explaining the state of the glass substrate on the mounting table.
[Explanation of symbols]
11 ... mounting table,
111 ... Adsorption pad mounting part,
112 ... groove,
113 ... hole,
12 ... Glass substrate,
13: Substrate adsorption member,
14 ... Suction pad,
141 ... Adsorption part,
142 ... hole,
143 ... a step,
15 ... Pad support member,
151 ... sucker,
152 ... groove part,
16 ... Gap,
17 ... Gap,
18 ... presser frame,
181 ... hole,
19 ... vent pipe,
20 ... Solenoid valve,
21 ... Vacuum pump,
22 ... Gap,
23 ... Rubber bush,
31 ... mounting table,
32 ... hole,
322: Ventilation chamber,
33 ... Diaphragm,
34 ... Communication pipe,
35 ... Suction pad,
351 ... Adsorption part,
36 ... vent pipe,
37 ... Solenoid valve,
38 ... vacuum pump,
39 ... Glass substrate,
41 ... O-ring,
42 ... compression spring,
43 ... Bellows tube.

Claims (3)

上部に基板吸着部を有し、上方周面に段部を形成した中空の吸着パッドと、
前記基板吸着部の中央に形成され前記中空と連通する孔部と、
前記吸着パッドの中空内に間隙をもって挿入され、前記基板吸着部の裏面に接する側の端部に吸盤を一体に形成するとともに前記基板吸着部の孔部に連通する筒状に形成され、前記吸着パッドを弾性的に支持する弾性部材からなるパッド支持部材と、
前記基板吸着部より大きな孔部を有し、前記吸着パッドを所定範囲での動きを可能にして基板を載置する載置面に取付ける押え枠部と
を具備したことを特徴とする基板吸着部材。
A hollow suction pad having a substrate suction part at the top and a stepped part on the upper peripheral surface;
A hole formed in the center of the substrate suction portion and communicating with the hollow;
The suction pad is inserted into the hollow of the suction pad with a gap, and a suction cup is integrally formed at an end of the suction side of the substrate that is in contact with the back surface of the suction pad, and is formed in a cylindrical shape that communicates with the hole of the substrate suction part. A pad support member made of an elastic member that elastically supports the pad;
A substrate suction member comprising: a holding frame portion that has a hole portion larger than the substrate suction portion and attaches the suction pad to a mounting surface on which the substrate is placed so as to be movable within a predetermined range. .
前記押え部材は、前記基板吸着部と対向する前記孔部の内周縁部に前記吸着パッドの振動を防止する弾性部材を設けたことを特徴とする請求項1記載の基板吸着部材。The substrate pressing member according to claim 1, wherein the pressing member is provided with an elastic member for preventing vibration of the suction pad at an inner peripheral edge portion of the hole portion facing the substrate suction portion. 前記パッド支持部材は、基端部に周面の円周方向に前記パッド支持部材の外径より細い外径を有する溝部を形成し、前記パッド部材の変形により前記溝部間の両端部が当接することによりバネ定数を増加させることを特徴とする請求項1記載の基板吸着部材。The pad support member forms a groove portion having an outer diameter smaller than the outer diameter of the pad support member in a circumferential direction of a peripheral surface at a base end portion, and both end portions between the groove portions are brought into contact with each other by deformation of the pad member. The substrate adsorbing member according to claim 1, wherein the spring constant is increased.
JP24214196A 1996-09-12 1996-09-12 Substrate adsorption member and apparatus Expired - Fee Related JP3782523B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24214196A JP3782523B2 (en) 1996-09-12 1996-09-12 Substrate adsorption member and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24214196A JP3782523B2 (en) 1996-09-12 1996-09-12 Substrate adsorption member and apparatus

Publications (2)

Publication Number Publication Date
JPH1086086A JPH1086086A (en) 1998-04-07
JP3782523B2 true JP3782523B2 (en) 2006-06-07

Family

ID=17084931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24214196A Expired - Fee Related JP3782523B2 (en) 1996-09-12 1996-09-12 Substrate adsorption member and apparatus

Country Status (1)

Country Link
JP (1) JP3782523B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3227912A4 (en) * 2014-12-06 2018-08-01 Kla-Tencor Corporation Chucking warped wafer with bellows
US11148258B2 (en) 2018-05-29 2021-10-19 Suss Microtec Lithography Gmbh Holding apparatus and method for holding a substrate

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4649066B2 (en) * 2001-06-14 2011-03-09 太平洋セメント株式会社 Vacuum chuck
JP3937979B2 (en) * 2002-08-23 2007-06-27 株式会社明電舎 Suction hand
SG125948A1 (en) * 2003-03-31 2006-10-30 Asml Netherlands Bv Supporting structure for use in a lithographic apparatus
CN100362643C (en) * 2003-05-06 2008-01-16 奥林巴斯株式会社 Substrate suction device
CN101426957A (en) * 2004-05-28 2009-05-06 得克萨斯州大学系统董事会 Substrate support system and method
JP4574453B2 (en) * 2005-06-02 2010-11-04 株式会社安川電機 Substrate adsorption device, substrate support and substrate transfer device
JP4899357B2 (en) * 2005-07-01 2012-03-21 株式会社Ihi Substrate adsorption device
JP4519743B2 (en) * 2005-09-20 2010-08-04 株式会社安川電機 A substrate suction device, a substrate support, a substrate transfer device, and a glass substrate transfer robot.
JP2008078304A (en) * 2006-09-20 2008-04-03 Olympus Corp Substrate holding mechanism and substrate inspection apparatus using the same
JP4962903B2 (en) * 2006-12-28 2012-06-27 株式会社ニコン Utility supply device, moving body system, pattern forming apparatus, and moving body device
JP4811882B2 (en) * 2009-03-27 2011-11-09 東京エレクトロン株式会社 Substrate heat treatment equipment
JP5352329B2 (en) * 2009-04-13 2013-11-27 株式会社日立ハイテクノロジーズ Mounting processing work apparatus, mounting processing work method, and display substrate module assembly line
JP5379589B2 (en) * 2009-07-24 2013-12-25 東京エレクトロン株式会社 Vacuum suction pad, transfer arm and substrate transfer device
JP5494369B2 (en) * 2010-09-07 2014-05-14 株式会社デンソー Adsorption device and transfer device
JP2012146783A (en) * 2011-01-11 2012-08-02 Murata Mfg Co Ltd Substrate sucking device
DE102013222377B3 (en) * 2013-11-04 2015-02-19 J. Schmalz Gmbh Suction gripper
JP6224437B2 (en) * 2013-11-26 2017-11-01 東京エレクトロン株式会社 Substrate transfer device
JP6535206B2 (en) * 2014-05-08 2019-06-26 株式会社ブイ・テクノロジー Exposure method and exposure apparatus
JP6316181B2 (en) * 2014-12-18 2018-04-25 東京エレクトロン株式会社 Substrate holding stage
JP6327374B2 (en) * 2017-02-21 2018-05-23 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port
CN108666251B (en) 2017-03-31 2020-11-20 上海微电子装备(集团)股份有限公司 Silicon wafer adsorption device, silicon wafer conveying device, silicon wafer transmission system and silicon wafer transmission method
GB2572016A (en) 2018-03-16 2019-09-18 Maxwell Wade Colin Vacuum plate
JP6519897B2 (en) * 2018-04-10 2019-05-29 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port
JP6882698B2 (en) * 2019-04-24 2021-06-02 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port
KR20210007327A (en) * 2019-07-11 2021-01-20 미래에이티 주식회사 An Absorption Apparatus for Flexible Printed Circuit Board Process
EP3851916A1 (en) * 2020-01-17 2021-07-21 ASML Netherlands B.V. Suction clamp, object handler, stage apparatus and lithographic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3227912A4 (en) * 2014-12-06 2018-08-01 Kla-Tencor Corporation Chucking warped wafer with bellows
US11148258B2 (en) 2018-05-29 2021-10-19 Suss Microtec Lithography Gmbh Holding apparatus and method for holding a substrate
US11504825B2 (en) 2018-05-29 2022-11-22 Suss Microtec Lithography Gmbh Holding apparatus and method for holding a substrate

Also Published As

Publication number Publication date
JPH1086086A (en) 1998-04-07

Similar Documents

Publication Publication Date Title
JP3782523B2 (en) Substrate adsorption member and apparatus
JP3422291B2 (en) How to assemble a liquid crystal substrate
US9829802B2 (en) Conveying hand and lithography apparatus
JP2691299B2 (en) Board holder
JP2004071729A (en) Method and unit for holding reticle and exposure system
JP2009010072A (en) Substrate-sticking device
JP2000228439A (en) Method of removing particles on stage and cleaning plate
JP5358239B2 (en) Wafer holding apparatus, semiconductor manufacturing apparatus, and wafer suction method
JP2003131388A (en) Mask holder having function to correct bending of mask
JP4086651B2 (en) Exposure apparatus and substrate holding apparatus
JP3349572B2 (en) Thin plate fixing device
JP2003283185A (en) Method and device for assembling board
JP3942318B2 (en) Board holding mechanism
JPH0936599A (en) Board holding method and device
JP2003232742A (en) Board supporting apparatus
JPH0620917A (en) Stage device
JP4366115B2 (en) Wafer holder and electron microscope
JP2004179472A (en) Workpiece fixing device
KR102696239B1 (en) Vacuum adsorption fixed base
JPH08167553A (en) Work fixing device
JPS60167245A (en) Sample holding device
JP2000323079A (en) Electron microscope and sample stage
US20060209289A1 (en) Exposure apparatus, and device manufacturing method
JPH03150863A (en) Wafer chuck
JPH1194755A (en) Vibration preventive mechanism for substrate

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20051208

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20051213

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060210

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060307

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060310

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090317

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100317

Year of fee payment: 4

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110317

Year of fee payment: 5

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110317

Year of fee payment: 5

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120317

Year of fee payment: 6

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120317

Year of fee payment: 6

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130317

Year of fee payment: 7

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140317

Year of fee payment: 8

LAPS Cancellation because of no payment of annual fees