JP3780240B2

JP3780240B2 - Manufacturing method of wiring board and manufacturing method of reinforcing plate with adhesive sheet piece

Info

Publication number: JP3780240B2
Application number: JP2002259610A
Authority: JP
Inventors: 琢也半戸; 聖二森
Original assignee: NGK Spark Plug Co Ltd
Current assignee: Niterra Co Ltd
Priority date: 2002-09-05
Filing date: 2002-09-05
Publication date: 2006-05-31
Anticipated expiration: 2019-02-09
Also published as: JP2003086729A

Description

【０００１】
【発明の属する技術分野】
本発明は、配線基板本体と補強板とその間に配置された接着層とを備える配線基板の製造方法、及び補強板と接着シート片とを備える接着シート片付補強板の製造方法に関し、特に、容易に製造することができ、接着剤の濡れ拡がりを防止することのできる配線基板の製造方法、及び接着シート片付補強板の製造方法に関する。
【０００２】
【従来の技術】
従来より、接着層を介して補強板と配線基板本体とを接着した配線基板が知られている。この補強板、いわゆるスティフナは、配線基板の剛性を向上させ、その平坦性を維持するために用いられる。
このような配線基板１０１は、例えば、図８に示すようにして製造されていた。即ち、図８（ａ）に示すように、予め、配線層（図示しない）や集積回路チップを搭載するための接続パッド１０３や配線基板１０１を他の基板等に接続するための電極パッド１０５などを備える配線基板本体１０２を作製しておく。
【０００３】
そして、この配線基板本体１０２の表面１０２Ａに、図８（ｂ）に示すように、所定の形状（図では略口字状）にされた半硬化の樹脂フィルムからなる接着シート片１２２を位置合わせをして貼り付け、仮接着する。一方で、図８（ｃ）に示すように、集積回路チップ（図示しない）を搭載するために、略中央に四角形の透孔１１３が形成された口字状の補強板１１２を用意する。次に、この補強板１１２を接着シート片１２２が貼られた配線基板本体１０２上に位置合わせをして載置する。その後、図８（ｄ）に示すように、これを加熱圧着して、接着層１２５を介して補強板１１２と配線基板本体１０２とを接着して、配線基板１０１を製作する。
【０００４】
【発明が解決しようとする課題】
しかしながら、このようにして配線基板１０１を製造する場合には、接着シート片１２２は非常に薄いため、その取り扱いが難しく、接着シート片１２２を配線基板本体１０２の上面１０２Ａに貼り付ける際に、皺や破れなどが発生し易い。
また、その貼り付けの際に、位置合わせをするのが難しい。特に、接着の際に、軟化した接着シート片（接着剤）が、配線基板１０１の側面や集積回路チップを搭載する領域に流れ出るのを防止するために、図８（ｂ）に示すように、接着シート片１２２を配線基板本体１０２の周縁よりも内側に引き下がった形状にすると、接着シート片１２２と配線基板本体１０２との外周縁同士で位置合わせをすることができないため、その位置合わせが困難である。
【０００５】
このため、接着シート片１２２を貼り付ける際に位置がずれて、接着シート片１２２が配線基板１０１の外側へはみ出した状態で接着されることがある。また、接着の際に、接着剤が配線基板本体１０２の側面１０２Ｃや補強板１１２の側面１１２Ｃ、あるいは、集積回路チップを搭載する接続パッド１０３近傍の領域に濡れ拡がって、外観不良となったり、集積回路チップ搭載の妨げとなることがある。
【０００６】
本発明はかかる現状に鑑みてなされたものであって、容易に製造できる、更には、接着剤の濡れ拡がりを防止することのできる配線基板の製造方法、また、接着剤の濡れ拡がりを防止できる接着シート片付補強板の製造方法を提供することを目的とする。
【０００７】
【課題を解決するための手段、作用及び効果】
その解決手段は、第１基板主面及び第２基板主面を有する配線基板本体と、第１主面及び第２主面を有する補強板と、上記配線基板本体の第１基板主面と上記補強板の第２主面との間に配置された接着層と、を備える配線基板の製造方法であって、予め所定形状とされた上記補強板の第２主面に接着シートを貼り付ける貼付工程と、上記補強板までも切断することなく、上記補強板の第２主面に貼り付けられた上記接着シートを切断して所定形状の接着シート片とするシート切断工程と、上記補強板に貼り付けられた上記接着シート片を、上記配線基板本体の第１基板主面に重ね、加熱して、上記接着層を介して上記補強板と上記配線基板本体とを接着する接着工程と、を備えることを特徴とする配線基板の製造方法である。
【０００８】
本発明によれば、まず、補強板の第２主面に接着シートを貼り付けておき、その後、接着シートを切断して所定形状の接着シート片とする。そして、接着シート片を介して補強板と配線基板本体とを重ね、加熱して接着する。
このように、接着シートを一旦補強板に貼り付けてから切断するので、それ以降は、接着シート片のみを取り扱うことなく、補強板とともに取り扱うことができる。このため、接着シート片の位置決めをする必要もなく、その取り扱いが容易となり、皺や破れなどが発生し難い。
【０００９】
また、接着シート片を補強板の周縁よりも内側に引き下がった形状にしながら、確実に、補強板の所定の位置に接着シート片を貼り付けることができる。従って、従来のように、接着シート片を貼り付ける際に位置がずれて、接着シート片が配線基板の外側へはみ出した状態で接着されたり、あるいは、接着の際、接着剤が配線基板の側面や電子部品の搭載領域等に濡れ拡がったりするのを防止することができる。
【００１０】
ここで、配線基板本体としては、絶縁層と配線層とを有するものであれば良く、例えば、コア基板の片面あるいは両面に絶縁層と配線層とを交互に複数層積層した積層配線基板等が挙げられる。
配線基板本体には、その第１、第２主面上に集積回路チップやその他の電子部品等を接続するための接続パッドやハンダバンプ等の端子が形成されていても良い。また、配線基板を他のプリント配線基板に接続するための接続パッドやハンダバンプ等の端子が形成されていても良いし、またピンが立設されていても良い。
【００１１】
補強板としては、剛性、熱膨張率等を考慮してその材質を適宜選択すれば良いが、例えば、銅、銅合金、アルミニウム、ステンレス等の金属板の他、セラミック板、樹脂板などが挙げられる。また、補強板には、集積回路チップその他の電子部品を搭載するために、それらに対応した透孔等が形成されていても良い。
接着シートとしては、補強板及び配線基板本体との接着性や熱膨張率等を考慮して選択すれば良く、例えば、半硬化状態のエポキシ樹脂やポリイミド樹脂などのフィルムや、エポキシ樹脂やポリイミド樹脂などをガラス繊維や連続多孔質ＰＴＦＥ等の三次元網目状フッ素系樹脂基材に含浸させたフィルム状のものなどが挙げられる。
さらに、上記の配線基板の製造方法であって、前記配線基板本体は、コア基板の片面あるいは両面に絶縁層と配線層とを交互に複数層積層してなることを特徴とする配線基板の製造方法とすると良い。
さらに、上記のいずれかに記載の配線基板の製造方法であって、前記配線基板本体は、前記補強板と同形状の外周を有する板状であることを特徴とする配線基板の製造方法とすると良い。
【００１２】
さらに、上記の配線基板の製造方法であって、前記シート切断工程は、前記補強板の第２主面に貼り付けられた前記接着シートを上記補強板の周縁よりも内側に引き下げて切断して所定形状の前記接着シート片とすることを特徴とする配線基板の製造方法とすると良い。
【００１３】
本発明では、補強板の第２主面に接着シートを貼り付けておき、その後、接着シートを切断して、接着シート片を補強板の周縁よりも内側に引き下がった形状にしているので、確実に、補強板の所定の位置に接着シート片を貼り付けることができる。従って、従来のように、接着シート片を貼り付ける際に位置がずれて、接着シート片が配線基板の外側へはみ出した状態で接着されたり、あるいは、接着の際、接着剤が配線基板の側面や電子部品の搭載領域等に濡れ拡がったりするのを防止することができる。
【００１４】
さらに、上記のいずれかに記載の配線基板の製造方法であって、前記貼付工程において、複数枚の前記補強板を並べ、大判の前記接着シートをそれらの前記第２主面上に貼り付け、前記シート切断工程において、上記大判の接着シートを複数の所定形状の前記接着シート片に切断することを特徴とする配線基板の製造方法とすると良い。
【００１５】
貼付工程及びシート切断工程については、補強板毎に接着シートを１枚ずつ貼り付け、１枚ずつ所定の形状に切断するようにしても良いが、貼付工程において、複数枚の補強板を並べておき、大判の接着シートをそれらの第２主面上に一挙に貼り付け、その後、切断工程において、所定形状の接着シート片に切断するようにしても良い。このようにすると、接着シートの取り扱いがさらに容易になり、また、生産性も高くなる。
【００１６】
また、他の解決手段は、第１主面及び第２主面を有する、配線基板を補強するための補強板と、上記第２主面に貼り付けられた接着シート片と、を備える接着シート片付補強板の製造方法であって、予め所定形状とされた上記補強板の第２主面に接着シートを貼り付ける貼付工程と、上記補強板までも切断することなく、貼り付けられた上記接着シートを切断して所定形状の接着シート片とするシート切断工程と、を備えることを特徴とする接着シート片付補強板の製造方法である。
【００１７】
本発明によれば、まず、補強板の第２主面に接着シートを貼り付けておき、その後、接着シートを切断して所定形状の接着シート片とする。
このように、接着シートを一旦補強板に貼り付けてから切断するので、それ以降は、接着シート片のみを取り扱うことなく、補強板とともに取り扱うことができる。このため、接着シート片の位置決めをする必要もなく、その取り扱いが容易となり、皺や破れなどが発生し難い。
【００１８】
また、接着シート片を補強板の周縁よりも内側に引き下がった形状にしながら、確実に、補強板の所定の位置に接着シート片を貼り付けることができる。従って、従来のように、接着シート片を貼り付ける際に位置がずれて、接着シート片が配線基板の外側へはみ出した状態で接着されたり、あるいは、接着の際、接着剤が配線基板の側面や電子部品の搭載領域等に濡れ拡がったりするのを防止することができる。
【００１９】
さらに、上記の接着シート片付補強板の製造方法であって、前記シート切断工程は、前記補強板の第２主面に貼り付けられた前記接着シートを上記補強板の周縁よりも内側に引き下げて切断して所定形状の前記接着シート片とすることを特徴とする接着シート片付補強板の製造方法とすると良い。
【００２０】
本発明では、補強板の第２主面に接着シートを貼り付けておき、その後、接着シートを切断して、接着シート片を補強板の周縁よりも内側に引き下がった形状にしているので、確実に、補強板の所定の位置に接着シート片を貼り付けることができる。従って、従来のように、接着シート片を貼り付ける際に位置がずれて、接着シート片が配線基板の外側へはみ出した状態で接着されたり、あるいは、接着の際、接着剤が配線基板の側面や電子部品の搭載領域等に濡れ拡がったりするのを防止することができる。
【００２１】
さらに、上記のいずれかに記載の接着シート片付補強板の製造方法であって、前記貼付工程において、複数枚の前記補強板を並べておき、大判の前記接着シートをそれらの前記第２主面上に一挙に貼り付け、前記シート切断工程において、大判の上記接着シートを所定形状の前記接着シート片に切断することを特徴とする接着シート片付補強板の製造方法とすると良い。
【００２２】
貼付工程及びシート切断工程については、補強板毎に接着シートを１枚ずつ貼り付け、１枚ずつ所定の形状に切断するようにしても良いが、貼付工程において、複数枚の補強板を並べておき、大判の接着シートをそれらの第２主面上に一挙に貼り付け、その後、切断工程において、所定形状の接着シート片に切断するようにしても良い。このようにすると、接着シートの取り扱いがさらに容易になり、また、生産性も高くなる。
【００２３】
【発明の実施の形態】
（実施形態１）
以下、本発明の実施の形態を、図を参照しつつ説明する。
本実施形態で製造する配線基板１について、図１（ａ）に補強板１２の第１主面１２Ａからみた平面図を、図１（ｂ）にその断面図を示す。
この配線基板１は、平面視４０×４０ｍｍの略正方形の板状であり、補強板１２と配線基板本体２とを備える。補強板１２と配線基板本体２とは、接着層２５を介して接着されている。
【００２４】
このうち補強板１２は、その表面に厚さ３〜５μｍのＮｉメッキ（図示しない）、及びその上に厚さ０．１μｍのＡｕメッキ（図示しない）が形成された銅板からなり、第１主面１２Ａ（図１（ｂ）では図中上方）と第２主面１２Ｂ（図１（ｂ）では図中下方）とを有する４０×４０×０．７ｍｍの略口字状板である。その略中央には、搭載するフリップチップ型集積回路チップ（図示しない）に対応して、１７．５×１７．５ｍｍの略正方形状の透孔１３が形成されている。また、第２主面１２Ｂには、接着層２５の外周縁２５Ｄ及び内周縁２５Ｅと略一致した形状の第１凹溝１５及び第２凹溝１６がそれぞれ形成されている。第１凹溝１５及び第２凹溝１６は、それぞれ第２主面１２Ｂ上で幅が３０μｍ、深さが３０μｍの略Ｖ字型に形成されている。また、補強板１２の外周の角部１２Ｇは、Ｃ面取りされている。
【００２５】
配線基板本体２は、連続多孔質ＰＴＦＥ基材にエポキシ樹脂を含浸させた複合材からなる樹脂絶縁層からなり、第１基板主面２Ａ（図１（ｂ）では図中上方）と第２基板主面２Ｂ（図１（ｂ）では図中下方）とを有する４０×４０ｍｍの略正方形の板状である。
その第１基板主面２Ａには、搭載する集積回路チップに対応して、直径１１５μｍの接続パッド３が略格子状に多数配置されている。各々の接続パッド３には、共晶ハンダからなるハンダバンプ４が形成されている。また、第２基板主面２Ｂには、この配線基板１を他の基板（図示しない）に接続するための電極パッド５が多数配置されている。さらに、配線基板本体２の内部には、接続パッド３と電極パッド５を接続する配線層（図示しない）が形成されている。なお、配線基板本体２の外周の角部２Ｇも、補強板１２と同様にＣ面取りされている。
【００２６】
一方、接着層２５は、配線基板本体２の樹脂絶縁層と同様の連続多孔質ＰＴＦＥ基材にエポキシ樹脂を含浸させた複合材で、樹脂絶縁層よりもエポキシ樹脂の含有量が少なくされた複合材からなり、補強板１２の第２主面１２Ｂと配線基板本体２の第１基板主面２Ａとを接着している。その形状は、補強板１２の外周縁１２Ｄ及び内周縁１２Ｅよりもわずかに内側に引き下がった外周縁２５Ｄ及び内周縁２５Ｅをなし、それら外周縁２５Ｄ及び内周縁２５Ｅは、補強板１２に形成された第１凹溝１５及び第２凹溝１６の形状とそれぞれ略一致している。
【００２７】
次に、本実施形態で製造する接着シート片付補強板１１について、図２（ａ）に補強板１２の第２主面１２Ｂからみた平面図を、図２（ｂ）にその断面図を示す。
この接着シート付補強板１１は、平面視略口字状板であり、上記の補強板１２と、その第２主面１２Ａ（図２（ｂ）では図中上方）に仮接着された接着シート片２２とを備える。
【００２８】
接着シート片２２は、連続多孔質ＰＴＦＥ基材にエポキシ樹脂を含浸させ、このエポキシ樹脂を半硬化させた複合材からなり、厚さ０．１ｍｍのシート状である。その形状は、補強板１２の外周縁１２Ｄ及び内周縁１２Ｅよりも０．２ｍｍ内側に引き下がった外周縁２２Ｄ及び内周縁２２Ｅをなし、それら外周縁２２Ｄ及び内周縁２２Ｅは、補強板１２に形成された第１凹溝１５及び第２凹溝１６の形状とそれぞれ略一致している。
【００２９】
なお、補強板１２の内周縁１２Ｅのうち角部においては、後述するように、この接着シート片付補強板１１を配線基板本体２に接着する際に、接着シート片２２からしみ出したエポキシ樹脂（接着剤）が集まり易く、集積回路チップを搭載する接続パッド３近傍の領域内へ濡れ拡がり易いので、この部分の接着シート片２２には、他の部分よりも更に内側に引き下がった逃げ部２２ＥＡ（４ヶ所）が形成されている。また、これに伴い、補強板の第２凹溝１６にも同様に、逃げ部１６Ａが形成されている。
【００３０】
次に、この接着シート片付配線基板１１及び配線基板１の製造方法について、図３〜図５を参照しつつ説明する。
まず、公知の手法により、圧延されてなる厚さ０．７ｍｍの銅板をプレスで打ち抜き、さらに、Ｎｉメッキ（３〜５μｍ）及びＡｕメッキ（０．１μｍ）を施して、透孔１３を有する補強板１２を予め用意する。
次に、貼付工程において、図３に示すように、補強板１２を治具（図示しない）等の上に複数個並べ、それらの上に、連続多孔質ＰＴＦＥ基材にエポキシ樹脂を含浸させた大判の接着シート２１を載置する。そして、これを１００〜１２０℃に加熱して、補強板１２の第２主面１２Ｂ上に仮接着する。
【００３１】
この貼付工程において、接着シート２１は、まだ個々の接着シート片に切断されていないので、その取り扱いが比較的容易であり、接着シート２１を補強板１２上に貼り付ける際に、皺や破れ等が生じ難い。また、接着シート２１は、並べられた補強板１２の第２主面１２Ａ全体を覆うように載置するだけよいので、従来のように、接着シートを貼り付ける段階で、精度良く位置合わせをする必要がない。
また、ここでは、図３に示すように、わずかに間隔を開けて各補強板１２を並べているが、隙間なく並べるようにしても良い。また、補強板１２毎に１枚ずつ接着シートを貼り付けるようにしても良い。ただし、上記のように複数個の補強板１２に一挙に接着シート２１を貼り付けるようにした方が、接着シート２１の取り扱いが容易で、生産性も高い。
【００３２】
次に、シート切断・凹溝形成工程において、図４に示すように、レーザ（ＹＡＧ第４高調波）によって、接着シート２１を切断して所定形状の接着シート片２２とすると同時に、補強板１２に第１凹溝１５及び第２凹溝１６を形成する。
具体的には、補強板１２の第２主面１２Ｂ側からレーザを照射し、図２（ａ）に示したように、接着シート２１を補強板１２の外周縁１２Ｄ及び内周縁１２Ｅよりも内側に０．２ｍｍ引き下がった形状に切断する。それと同時に、接着シート２１を切断する切断線に略一致した第１凹溝１５及び第２凹溝１６を補強板の第２主面に形成する。このようにして、接着シート片２２の外周縁２２Ｄ及び内周縁２２Ｅと略一致した形状の第１凹溝１５及び第２凹溝１６がそれぞれ形成される。なお、切断された不要な接着シート片は、ピンセット等で取り除く。
ここで、第１凹溝１５及び第２凹溝１６の内部は、レーザによってメッキ層がそれぞれ除去され、銅板がむき出しの状態となる。
このようにして、図２に示す接着シート片付補強板１１を作製する。
【００３３】
一方、図５（ａ）に示すように、公知の手法により、連続多孔質ＰＴＦＥ基材にエポキシ樹脂を含浸させ樹脂絶縁層と配線層とを交互に複数層積層し、さらに、第１基板主面２Ａに集積回路チップを搭載するための接続パッド３及びハンダバンプ４を形成し、また、第２基板主面２Ｂに他の基板に接続するための電極パッド５等を形成するなどして、配線基板本体２を作製する。
本実施形態のように、配線基板本体２の樹脂絶縁層と接着シート片２２の材質を近似したものにすると、これらの間で熱膨張率等が適合するので好ましい。
【００３４】
次に、接着工程において、図５（ｂ）に示すように、配線基板本体２の第１基板主面２Ａに、接着シート片付補強板１１の接着シート片２２を位置合わせをして載置する。
次に、図６に示すように、接着シート片２２を介して重ねた補強板１２及び配線基板本体２を、接着治具３０の接着平面３０Ａ上に、配線基板本体２の第２主面２Ｂが接するように載置する。この接着治具３０は、接着平面３０Ａを底面とした凹部を有し、その側壁３０Ｂには、排気管３１が形成されている。
【００３５】
さらに、シリコンゴム製の柔軟シート３５で補強板１２の第１主面１２Ａを覆い、この柔軟シート３５と接着治具３０で、接着シート片２２を介して重ねた補強板１２及び配線基板本体２を包囲する。そして、排気管３１から、柔軟シート３５と接着治具３０とで囲まれた空間を減圧する。そして、減圧下で、１００℃、３０分間の予備加熱を行った後、１７０℃、６０分間加熱して接着シート片２２を硬化させ、減圧による柔軟シート３５からの加圧を利用しつつ、補強板１２と配線基板本体２とを接着する。
【００３６】
このように、減圧下で補強板１２と配線基板本体２とを接着させると、接着シート２１を補強板１２に貼り付ける際や、接着シート片付補強板１１を配線基板本体２に載置する際に、補強板１２と配線基板本体２との間に気泡が閉じ込められても、これを脱泡しながら接着することができるので、接着層２５中に気泡が残らない。
さらに、上記のように、加圧のために柔軟シート３５を利用すると、減圧の際、柔軟シート３５は補強板１２の第１主面１２Ａと高い密着性をもって接し、補強板１２全体を均一に加圧することができるので、接着後の配線基板１に変形などが生じ難い。
また、上記の予備加熱を行うと、接着シート片２２から出る溶剤等のアウトガスにより、補強板１２等に形成されたＡｕメッキ等のメッキが変色するのを防止することができる。
このようにして、図１に示す配線基板１が完成する。
【００３７】
図７に、上記のようにして製造した配線基板１のうち、第１凹溝１５近傍の部分拡大断面図を示す。
接着工程において、接着シート片２２からしみ出したエポキシ樹脂（接着剤）は、補強板１２の側面１２Ｃや配線基板本体２の側面２Ｃ、すなわち配線基板１の側面１Ｃまで濡れ拡がることなく、補強板１２の第２主面１２に形成された第１凹溝１５に留まっている。
第１凹溝１５の内部は、その形成の際、レーザによって、Ｎｉ（３〜５μｍ）−Ａｕ（０．１μｍ）からなるＮｉ−Ａｕメッキ層１７が除去され、酸化されやすい銅板１８がむき出しとなっているので、メッキ層１７が形成されている部分に比べて接着剤の濡れ性が低い。このため、接着剤が配線基板１の側面１Ｃまで濡れ拡がるのを確実に防止している。
また、補強板１２の内周縁１２Ｅの角部においては、しみ出した接着剤が集まり易く、特に濡れ拡がり易いが、前述したように、他の部分よりも更に大きく接着シート片２２及び第２凹溝１６が引き下がっているので（図２（ａ）参照）、接着剤が集積回路チップを搭載する接続パッド３近傍の領域に流れ出すことはない。
【００３８】
以上のように、本実施形態では、貼付工程において、まず、補強板１２の第２主面１２Ｂに接着シート２１を貼り付けておき、その後、シート切断・凹溝形成工程において、接着シート２１を切断して所定形状の接着シート片２２とする。このため、この工程以降は、接着シート片２２のみを取り扱うことなく、補強板１２とともに取り扱うことができるので、その取り扱いが容易となり、皺や破れなどが発生し難い。
また、接着シート片２２を補強板１２の外周縁１２Ｄ及び内周縁１２Ｅよりも内側に引き下がった形状にしながら、接着シート片２２がずれて、配線基板１の外側へはみ出した状態で接着されたりすることなく、補強板１２の所定の位置に、確実に接着シート片２２を貼り付けることができる。
【００３９】
また、本実施形態では、シート切断・凹溝形成工程において、補強板１２の第２主面１２Ｂに貼り付けられた接着シート２１を切断して所定形状の接着シート片２２とするのと同時に、補強板１２の第２主面１２Ｂにその切断線に略一致した第１凹溝１５及び第２凹溝１６を形成する。このため、後の接着工程において、接着シート片２２の内部からエポキシ樹脂がしみ出しても、接着シート片２２の外周縁２２Ｄ及び内周縁２２Ｅに略一致して形成された第１凹溝１５及び第２凹溝１６で濡れ拡がりを防止することができるので、配線基板１の側面１Ｃや集積回路チップを搭載する接続パッド３の近傍の領域へ流れ出すのを確実に防止することができる。
【００４０】
しかも、これらの凹溝１５，１６は、接着シート２１を切断するのと同時に形成されるので、凹溝１５，１６を形成するための新たな作業工程を必要とせず、配線基板１を安価に製造することができる。
さらに、接着シート２１を切断し、同時に凹溝１５，１６を形成するのに、レーザを用いているので、補強板１２を構成する金属組織に歪み等の変化が残り難く、補強板１２を配線基板本体２に接着した場合に、配線基板１に残留歪みによる変形なども生じ難い。
また、凹溝１５，１６の形成の際、レーザでＮｉ−Ａｕメッキ層１７が除去され、凹溝１５，１６内に酸化されやすい銅板１８がむき出しとなっているので、Ｎｉ−Ａｕメッキ層１７をもつ他の部分に比して、エポキシ樹脂（接着剤）の濡れ性が低い。このため、その後の接着工程において、この凹溝１５，１６で、接着剤が濡れ拡がるのをより確実に防止することができる。
【００４１】
以上において、本発明を実施形態に即して説明したが、本発明は上記実施形態に限定されるものではなく、その要旨を逸脱しない範囲で、適宜変更して適用できることはいうまでもない。
例えば、上記実施形態では、幅３０μｍ、深さ３０μｍのＶ字型の凹溝１５，１６を形成しているが、凹溝１５，１６の大きさについては、接着の際に濡れ拡がろうとする接着剤の量を考慮して適宜変更すれば良い。また、接着剤が特に集まり易い部分があるときは、接着シート片の形状を補強板の周縁よりも大きく引き下げるなどして濡れ拡がりを防止することもできる。
【図面の簡単な説明】
【図１】実施形態に係り、配線基板を示す図であり、（ａ）は補強板の第１主面側から見た平面図を示し、（ｂ）は断面図を示す。
【図２】実施形態に係る接着シート片付補強板を示す図であり、（ａ）は補強板の第２主面側から見た平面図を示し、（ｂ）は断面図を示す。
【図３】実施形態に係る配線基板の製造方法を示す図であり、補強板に接着シートを貼り付けた状態を示す。
【図４】実施形態に係る配線基板の製造方法を示す図であり、接着シートを切断し、凹溝を形成した状態を示す。
【図５】実施形態に係る配線基板の製造方法を示す図であり、（ａ）は配線基板本体を示し、（ｂ）は配線基板本体に、補強板に貼り付けられた接着シート片を載置した状態を示す。
【図６】実施形態に係る配線基板の製造方法を示す図であり、接着治具内で補強板と配線基板本体とを接着した状態を示す。
【図７】実施形態に係り、配線基板のうち、凹溝の近傍付近の部分拡大断面図を示す。
【図８】従来技術に係る配線基板の製造方法を示す図であり、（ａ）は配線基板本体を示し、（ｂ）は配線基板本体に接着シート片を貼り付けた状態を示し、（ｃ）は補強板を示し、（ｄ）は配線基板を示す。
【符号の説明】
１配線基板
２配線基板本体
２Ａ第１基板主面
２Ｂ第２基板主面
１１接着シート片付補強板
１２補強板
１２Ａ第１主面
１２Ｂ第２主面
１２Ｄ（補強板の）外周縁
１２Ｅ（補強板の）内周縁
１５第１凹溝
１６第２凹溝
２１接着シート
２２接着シート片
２２Ｄ（接着シート片の）外周縁
２２Ｅ（接着シート片の）内周縁[0001]
BACKGROUND OF THE INVENTION
 The present invention relates to a method for manufacturing a wiring board comprising a wiring board body, a reinforcing plate, and an adhesive layer disposed therebetween, and a method for producing a reinforcing plate with an adhesive sheet piece comprising a reinforcing plate and an adhesive sheet piece. The present invention relates to a method for manufacturing a wiring board that can be easily manufactured and can prevent wetting and spreading of an adhesive, and a method for manufacturing a reinforcing plate with an adhesive sheet piece.
[0002]
[Prior art]
 Conventionally, a wiring board in which a reinforcing plate and a wiring board main body are bonded via an adhesive layer is known. This reinforcing plate, so-called stiffener, is used to improve the rigidity of the wiring board and maintain its flatness.
 Such a wiring board 101 is manufactured as shown in FIG. 8, for example. That is, as shown in FIG. 8A, a wiring layer (not shown), a connection pad 103 for mounting an integrated circuit chip, an electrode pad 105 for connecting the wiring board 101 to another board, etc. The wiring board main body 102 provided with is prepared.
[0003]
 Then, as shown in FIG. 8B, an adhesive sheet piece 122 made of a semi-cured resin film having a predetermined shape (substantially a square shape in the figure) is aligned with the surface 102A of the wiring board main body 102. And paste and temporarily bond. On the other hand, as shown in FIG. 8C, in order to mount an integrated circuit chip (not shown), a square-shaped reinforcing plate 112 having a square through-hole 113 formed at the substantially center is prepared. Next, the reinforcing plate 112 is positioned and placed on the wiring board main body 102 to which the adhesive sheet piece 122 is attached. Thereafter, as shown in FIG. 8D, this is thermocompression bonded, and the reinforcing plate 112 and the wiring board main body 102 are bonded via the adhesive layer 125 to manufacture the wiring board 101.
[0004]
[Problems to be solved by the invention]
 However, when the wiring board 101 is manufactured in this way, the adhesive sheet piece 122 is very thin and is difficult to handle. When the adhesive sheet piece 122 is attached to the upper surface 102A of the wiring board body 102, the And tears are likely to occur.
 In addition, it is difficult to align the positions when pasting. In particular, as shown in FIG. 8B, in order to prevent the softened adhesive sheet piece (adhesive) from flowing out to the side surface of the wiring substrate 101 or the area where the integrated circuit chip is mounted during bonding, If the adhesive sheet piece 122 is pulled inward from the periphery of the wiring board main body 102, the outer peripheral edges of the adhesive sheet piece 122 and the wiring board main body 102 cannot be aligned with each other. It is.
[0005]
 For this reason, when the adhesive sheet piece 122 is stuck, the position may be shifted, and the adhesive sheet piece 122 may be bonded in a state of protruding to the outside of the wiring substrate 101. Further, during bonding, the adhesive spreads wet on the side surface 102C of the wiring board main body 102, the side surface 112C of the reinforcing plate 112, or the region in the vicinity of the connection pad 103 on which the integrated circuit chip is mounted. May interfere with the mounting of the integrated circuit chip.
[0006]
 The present invention has been made in view of the current situation, and can be easily manufactured. Further, the method for manufacturing a wiring board capable of preventing the adhesive from spreading and the adhesive can be prevented from spreading. It aims at providing the manufacturing method of the reinforcement board with an adhesive sheet piece.
[0007]
[Means, actions and effects for solving the problems]
 The solution includes: a wiring board body having a first board main surface and a second board main surface; a reinforcing plate having a first main surface and a second main surface; the first board main surface of the wiring board body; An adhesive layer disposed between the second main surface of the reinforcing plate, and a method of manufacturing a wiring board comprising:Pre-defined shapeAn attaching step of attaching an adhesive sheet to the second main surface of the reinforcing plate;Without cutting even the reinforcing plate,Cutting the adhesive sheet affixed to the second main surface of the reinforcing plate into an adhesive sheet piece of a predetermined shape; and connecting the adhesive sheet piece affixed to the reinforcing plate to the wiring board A method of manufacturing a wiring board, comprising: an adhesion step of adhering the reinforcing plate and the wiring board body through the adhesive layer by overlapping and heating the first substrate main surface of the body. .
[0008]
 According to the present invention, first, an adhesive sheet is attached to the second main surface of the reinforcing plate, and then the adhesive sheet is cut into an adhesive sheet piece having a predetermined shape. And a reinforcement board and a wiring board main body are piled up through an adhesive sheet piece, and it heats and adheres.
 In this way, since the adhesive sheet is once attached to the reinforcing plate and then cut, it can be handled together with the reinforcing plate without handling only the adhesive sheet piece thereafter. For this reason, it is not necessary to position the adhesive sheet piece, the handling becomes easy, and wrinkles and tears are unlikely to occur.
[0009]
 Further, the adhesive sheet piece can be reliably attached to a predetermined position of the reinforcing plate while the adhesive sheet piece is drawn inward from the periphery of the reinforcing plate. Therefore, as in the past, when the adhesive sheet piece is pasted, the position is shifted, and the adhesive sheet piece is adhered in a state of protruding to the outside of the wiring board. Alternatively, the adhesive is attached to the side surface of the wiring board. In addition, it is possible to prevent wetting and spreading in the mounting area of the electronic parts.
[0010]
 Here, the wiring board body may be any body having an insulating layer and a wiring layer, for example, a laminated wiring board in which a plurality of insulating layers and wiring layers are alternately laminated on one or both sides of the core substrate. Can be mentioned.
 Terminals such as connection pads and solder bumps for connecting an integrated circuit chip and other electronic components may be formed on the first and second main surfaces of the wiring board main body. Further, terminals such as connection pads and solder bumps for connecting the wiring board to another printed wiring board may be formed, or pins may be erected.
[0011]
 The material of the reinforcing plate may be appropriately selected in consideration of the rigidity, the coefficient of thermal expansion, etc. For example, in addition to a metal plate such as copper, copper alloy, aluminum, stainless steel, a ceramic plate, a resin plate, etc. It is done. Moreover, in order to mount an integrated circuit chip and other electronic components, the reinforcing plate may be formed with through holes corresponding to them.
 The adhesive sheet may be selected in consideration of the adhesiveness between the reinforcing plate and the wiring board body, the coefficient of thermal expansion, and the like. For example, a film such as a semi-cured epoxy resin or a polyimide resin, or an epoxy resin or a polyimide resin For example, a film-like material obtained by impregnating a three-dimensional network fluorine-based resin base material such as glass fiber or continuous porous PTFE.
 Furthermore, in the method for manufacturing a wiring board as described above, the wiring board body is formed by alternately laminating a plurality of insulating layers and wiring layers on one side or both sides of a core substrate. It would be better to do it.
 Furthermore, in the method for manufacturing a wiring board according to any one of the above, the wiring board main body has a plate shape having the same outer periphery as the reinforcing plate. good.
[0012]
 Further, in the method for manufacturing a wiring board, the sheet cutting step includes cutting the adhesive sheet attached to the second main surface of the reinforcing plate by pulling it down from the periphery of the reinforcing plate. A method of manufacturing a wiring board, characterized in that the adhesive sheet piece has a predetermined shape.
[0013]
 In the present invention, the adhesive sheet is pasted on the second main surface of the reinforcing plate, and then the adhesive sheet is cut to form the adhesive sheet piece inward from the peripheral edge of the reinforcing plate. In addition, an adhesive sheet piece can be attached to a predetermined position of the reinforcing plate. Therefore, as in the past, when the adhesive sheet piece is pasted, the position is shifted, and the adhesive sheet piece is adhered in a state of protruding to the outside of the wiring board. Alternatively, the adhesive is attached to the side surface of the wiring board. In addition, it is possible to prevent wetting and spreading in the mounting area of the electronic parts.
[0014]
 Furthermore, in the method for manufacturing a wiring board according to any one of the above, in the pasting step, a plurality of the reinforcing plates are arranged, and the large-sized adhesive sheet is pasted on the second main surface, In the sheet cutting step, the large-sized adhesive sheet may be cut into a plurality of adhesive sheet pieces having a predetermined shape.
[0015]
 As for the attaching step and the sheet cutting step, one adhesive sheet may be attached to each reinforcing plate and cut into a predetermined shape one by one. In the attaching step, a plurality of reinforcing plates are arranged side by side. A large-sized adhesive sheet may be pasted on the second main surface all at once, and then cut into adhesive sheet pieces of a predetermined shape in the cutting step. If it does in this way, handling of an adhesive sheet will become still easier and productivity will also become high.
[0016]
 Another solution is an adhesive sheet comprising a reinforcing plate for reinforcing a wiring board, having a first main surface and a second main surface, and an adhesive sheet piece attached to the second main surface. A method for manufacturing a reinforced plate with a piece,Pre-defined shapeAn attaching step of attaching an adhesive sheet to the second main surface of the reinforcing plate;Without cutting even the reinforcing plate,And a sheet cutting step of cutting the adhered adhesive sheet into an adhesive sheet piece of a predetermined shape.
[0017]
 According to the present invention, first, an adhesive sheet is attached to the second main surface of the reinforcing plate, and then the adhesive sheet is cut into an adhesive sheet piece having a predetermined shape.
 In this way, since the adhesive sheet is once attached to the reinforcing plate and then cut, it can be handled together with the reinforcing plate without handling only the adhesive sheet piece thereafter. For this reason, it is not necessary to position the adhesive sheet piece, the handling becomes easy, and wrinkles and tears are unlikely to occur.
[0018]
 Further, the adhesive sheet piece can be reliably attached to a predetermined position of the reinforcing plate while the adhesive sheet piece is drawn inward from the periphery of the reinforcing plate. Therefore, as in the past, when the adhesive sheet piece is pasted, the position is shifted, and the adhesive sheet piece is adhered in a state of protruding to the outside of the wiring board. Alternatively, the adhesive is attached to the side surface of the wiring board. In addition, it is possible to prevent wetting and spreading in the mounting area of the electronic parts.
[0019]
 Further, in the above method for manufacturing a reinforcing plate with an adhesive sheet piece, the sheet cutting step lowers the adhesive sheet attached to the second main surface of the reinforcing plate to the inside of the periphery of the reinforcing plate. It is preferable to use a method of manufacturing a reinforcing plate with an adhesive sheet piece, wherein the adhesive sheet piece has a predetermined shape.
[0020]
 In the present invention, the adhesive sheet is attached to the second main surface of the reinforcing plate, and then the adhesive sheet is cut into a shape in which the adhesive sheet piece is pulled inward from the periphery of the reinforcing plate. In addition, an adhesive sheet piece can be attached to a predetermined position of the reinforcing plate. Therefore, as in the past, when the adhesive sheet piece is pasted, the position is shifted, and the adhesive sheet piece is adhered in a state of protruding to the outside of the wiring board. Alternatively, the adhesive is attached to the side surface of the wiring board. In addition, it is possible to prevent wetting and spreading in the mounting area of the electronic parts.
[0021]
 Further, in the method for manufacturing a reinforcing plate with an adhesive sheet piece according to any one of the above, in the attaching step, a plurality of the reinforcing plates are arranged, and the large-sized adhesive sheet is used as the second main surface thereof. It is good to make it the manufacturing method of the reinforcement sheet | seat with an adhesive sheet piece characterized by affixing at a stretch and cutting the said large-sized adhesive sheet into the said adhesive sheet piece of a predetermined shape in the said sheet cutting process.
[0022]
 As for the sticking step and the sheet cutting step, one adhesive sheet may be attached to each reinforcing plate, and the sheets may be cut into a predetermined shape one by one. In the sticking step, a plurality of reinforcing plates are arranged side by side. A large-sized adhesive sheet may be pasted on the second main surface all at once, and then cut into adhesive sheet pieces of a predetermined shape in the cutting step. If it does in this way, handling of an adhesive sheet will become still easier and productivity will also become high.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
 Embodiments of the present invention will be described below with reference to the drawings.
 With respect to the wiring board 1 manufactured in the present embodiment, FIG. 1A shows a plan view seen from the first main surface 12A of the reinforcing plate 12, and FIG. 1B shows a cross-sectional view thereof.
 The wiring board 1 has a substantially square plate shape with a plan view of 40 × 40 mm, and includes a reinforcing plate 12 and a wiring board body 2. The reinforcing plate 12 and the wiring board body 2 are bonded via an adhesive layer 25.
[0024]
 Among them, the reinforcing plate 12 is made of a copper plate having a Ni plating (not shown) having a thickness of 3 to 5 μm on the surface thereof and an Au plating (not shown) having a thickness of 0.1 μm formed thereon. It is a 40 × 40 × 0.7 mm substantially square plate having a surface 12A (upper in the drawing in FIG. 1B) and a second main surface 12B (lower in the drawing in FIG. 1B). A substantially square-shaped through-hole 13 of 17.5 × 17.5 mm is formed at the approximate center corresponding to the flip-chip type integrated circuit chip (not shown) to be mounted. Further, on the second main surface 12B, a first concave groove 15 and a second concave groove 16 having shapes substantially coincident with the outer peripheral edge 25D and the inner peripheral edge 25E of the adhesive layer 25 are formed, respectively. The first concave groove 15 and the second concave groove 16 are each formed in a substantially V shape having a width of 30 μm and a depth of 30 μm on the second main surface 12B. Further, the corner portion 12G on the outer periphery of the reinforcing plate 12 is chamfered.
[0025]
 The wiring board body 2 is composed of a resin insulating layer made of a composite material in which a continuous porous PTFE base material is impregnated with an epoxy resin, and includes a first substrate main surface 2A (upper in FIG. 1B) and a second substrate. It is a 40 × 40 mm substantially square plate shape having a main surface 2B (downward in FIG. 1B).
 On the first substrate main surface 2A, a large number of connection pads 3 having a diameter of 115 μm are arranged in a substantially lattice shape corresponding to the integrated circuit chip to be mounted. A solder bump 4 made of eutectic solder is formed on each connection pad 3. A large number of electrode pads 5 for connecting the wiring substrate 1 to another substrate (not shown) are arranged on the second substrate main surface 2B. Furthermore, a wiring layer (not shown) for connecting the connection pads 3 and the electrode pads 5 is formed inside the wiring board body 2. The outer peripheral corner 2G of the wiring board body 2 is also chamfered in the same manner as the reinforcing plate 12.
[0026]
 On the other hand, the adhesive layer 25 is a composite material in which a continuous porous PTFE base material similar to the resin insulation layer of the wiring board body 2 is impregnated with an epoxy resin, and a composite in which the epoxy resin content is less than that of the resin insulation layer. The second main surface 12B of the reinforcing plate 12 and the first substrate main surface 2A of the wiring board body 2 are bonded to each other. The shape of the reinforcing plate 12 includes an outer peripheral edge 25D and an inner peripheral edge 25E slightly pulled inward from the outer peripheral edge 12D and the inner peripheral edge 12E. The outer peripheral edge 25D and the inner peripheral edge 25E are formed on the reinforcing plate 12. The shapes of the first concave groove 15 and the second concave groove 16 substantially coincide with each other.
[0027]
 Next, with respect to the reinforcing plate 11 with the adhesive sheet piece manufactured in the present embodiment, FIG. 2A shows a plan view seen from the second main surface 12B of the reinforcing plate 12, and FIG. .
 This reinforcing plate 11 with an adhesive sheet is a substantially square plate in plan view, and is an adhesive sheet temporarily bonded to the reinforcing plate 12 and its second main surface 12A (upper in FIG. 2B). And a piece 22.
[0028]
 The adhesive sheet piece 22 is made of a composite material obtained by impregnating an epoxy resin into a continuous porous PTFE base material and semi-curing the epoxy resin, and has a sheet shape with a thickness of 0.1 mm. The shape of the reinforcing plate 12 includes an outer peripheral edge 22D and an inner peripheral edge 22E that are pulled down 0.2 mm inside from the outer peripheral edge 12D and the inner peripheral edge 12E. The outer peripheral edge 22D and the inner peripheral edge 22E are formed on the reinforcing plate 12. The shapes of the first concave groove 15 and the second concave groove 16 substantially coincide with each other.
[0029]
 In addition, in the corner | angular part among the inner periphery 12E of the reinforcement board 12, when bonding this reinforcement board 11 with an adhesive sheet piece to the wiring board main body 2, the epoxy resin which exuded from the adhesive sheet piece 22 is mentioned later. Since the (adhesive) easily collects and easily wets and spreads in the area near the connection pad 3 on which the integrated circuit chip is mounted, the adhesive sheet piece 22 in this portion has a relief portion 22EA that is further pulled down inward than the other portions. (4 places) are formed. Accordingly, a relief portion 16A is also formed in the second concave groove 16 of the reinforcing plate.
[0030]
 Next, the manufacturing method of this wiring board 11 with an adhesive sheet piece and the wiring board 1 is demonstrated, referring FIGS.
 First, a 0.7 mm-thick rolled copper plate is punched out by a known method with a press, and further subjected to Ni plating (3 to 5 μm) and Au plating (0.1 μm) to reinforce the through holes 13. A plate 12 is prepared in advance.
 Next, in the attaching step, as shown in FIG. 3, a plurality of reinforcing plates 12 are arranged on a jig (not shown) or the like, and a continuous porous PTFE base material is impregnated with an epoxy resin on them. A large-sized adhesive sheet 21 is placed. And this is heated at 100-120 degreeC, and temporarily adhere | attached on the 2nd main surface 12B of the reinforcement board 12. FIG.
[0031]
 In this sticking step, since the adhesive sheet 21 is not yet cut into individual adhesive sheet pieces, it is relatively easy to handle, and when the adhesive sheet 21 is stuck on the reinforcing plate 12, it may be wrinkled or torn. Is unlikely to occur. Further, since the adhesive sheet 21 only needs to be placed so as to cover the entire second main surface 12A of the arranged reinforcing plates 12, the positioning is performed with high precision at the stage of attaching the adhesive sheet as in the prior art. There is no need.
 Further, here, as shown in FIG. 3, the reinforcing plates 12 are arranged at a slight interval, but may be arranged without a gap. Alternatively, one adhesive sheet may be attached to each reinforcing plate 12. However, it is easier to handle the adhesive sheet 21 and the productivity is higher when the adhesive sheet 21 is attached to the plurality of reinforcing plates 12 at once.
[0032]
 Next, in the sheet cutting / groove forming step, as shown in FIG. 4, the adhesive sheet 21 is cut by a laser (YAG fourth harmonic) to form an adhesive sheet piece 22 having a predetermined shape, and at the same time, the reinforcing plate 12 The first concave groove 15 and the second concave groove 16 are formed.
 Specifically, the laser is irradiated from the second main surface 12B side of the reinforcing plate 12, and as shown in FIG. 2A, the adhesive sheet 21 is located inside the outer peripheral edge 12D and the inner peripheral edge 12E of the reinforcing plate 12. And cut into a shape pulled down 0.2 mm. At the same time, the first concave groove 15 and the second concave groove 16 that substantially coincide with the cutting line for cutting the adhesive sheet 21 are formed on the second main surface of the reinforcing plate. Thus, the 1st ditch | groove 15 and the 2nd ditch | groove 16 of the shape substantially corresponded with the outer periphery 22D and the inner periphery 22E of the adhesive sheet piece 22 are each formed. The cut unnecessary adhesive sheet piece is removed with tweezers or the like.
 Here, the plating layers are respectively removed by the laser inside the first concave grooves 15 and the second concave grooves 16, and the copper plate is exposed.
 In this way, the reinforcing plate 11 with the adhesive sheet piece shown in FIG. 2 is produced.
[0033]
 On the other hand, as shown in FIG. 5A, a continuous porous PTFE base material is impregnated with an epoxy resin and a plurality of resin insulation layers and wiring layers are alternately laminated by a known method. The connection pads 3 and the solder bumps 4 for mounting the integrated circuit chip are formed on the surface 2A, and the electrode pads 5 and the like for connecting to other substrates are formed on the second substrate main surface 2B. The substrate body 2 is produced.
 It is preferable that the resin insulating layer of the wiring board main body 2 and the material of the adhesive sheet piece 22 are approximated as in this embodiment because the coefficient of thermal expansion and the like match between them.
[0034]
 Next, in the bonding process, as shown in FIG. 5B, the adhesive sheet piece 22 of the reinforcing plate 11 with the adhesive sheet piece is aligned and placed on the first board main surface 2 A of the wiring board body 2. To do.
 Next, as shown in FIG. 6, the reinforcing plate 12 and the wiring board main body 2 stacked via the adhesive sheet piece 22 are placed on the bonding plane 30 A of the bonding jig 30 on the second main surface 2 B of the wiring board main body 2. Place it so that it touches. The bonding jig 30 has a recess having a bonding plane 30A as a bottom surface, and an exhaust pipe 31 is formed on the side wall 30B.
[0035]
 Further, the first main surface 12A of the reinforcing plate 12 is covered with a flexible sheet 35 made of silicon rubber, and the reinforcing plate 12 and the wiring board main body 2 are overlapped with the flexible sheet 35 and the bonding jig 30 via the adhesive sheet piece 22. Besiege. Then, the space surrounded by the flexible sheet 35 and the bonding jig 30 is decompressed from the exhaust pipe 31. Then, after preheating at 100 ° C. for 30 minutes under reduced pressure, the adhesive sheet piece 22 is cured by heating at 170 ° C. for 60 minutes, and reinforcement is performed using the pressure from the flexible sheet 35 by the reduced pressure. The board 12 and the wiring board body 2 are bonded.
[0036]
 As described above, when the reinforcing plate 12 and the wiring board main body 2 are bonded under reduced pressure, the reinforcing sheet 11 with the adhesive sheet piece is placed on the wiring board main body 2 when the adhesive sheet 21 is attached to the reinforcing plate 12. At this time, even if air bubbles are trapped between the reinforcing plate 12 and the wiring board body 2, the air bubbles can be adhered while defoaming, so that no air bubbles remain in the adhesive layer 25.
 Furthermore, as described above, when the flexible sheet 35 is used for pressurization, the flexible sheet 35 comes into contact with the first main surface 12A of the reinforcing plate 12 with high adhesion during decompression, and the entire reinforcing plate 12 is made uniform. Since pressurization can be performed, deformation or the like hardly occurs in the wiring substrate 1 after bonding.
 Further, when the above preheating is performed, it is possible to prevent the plating such as Au plating formed on the reinforcing plate 12 from being discolored by the outgas such as the solvent coming out of the adhesive sheet piece 22.
 In this way, the wiring board 1 shown in FIG. 1 is completed.
[0037]
 FIG. 7 shows a partially enlarged sectional view of the vicinity of the first groove 15 in the wiring board 1 manufactured as described above.
 In the bonding step, the epoxy resin (adhesive) that has oozed out of the adhesive sheet piece 22 does not spread to the side surface 12C of the reinforcing plate 12 or the side surface 2C of the wiring board main body 2, that is, the side surface 1C of the wiring substrate 1, and the reinforcing plate It remains in the first concave groove 15 formed in the 12 second main surface 12.
 When the inside of the first concave groove 15 is formed, the Ni—Au plating layer 17 made of Ni (3 to 5 μm) —Au (0.1 μm) is removed by a laser, and the copper plate 18 that is easily oxidized is exposed. Therefore, the wettability of the adhesive is lower than that of the portion where the plating layer 17 is formed. This reliably prevents the adhesive from spreading to the side surface 1C of the wiring board 1.
 Further, at the corner portion of the inner peripheral edge 12E of the reinforcing plate 12, the exuding adhesive is likely to gather and particularly easily wet and spread. However, as described above, the adhesive sheet piece 22 and the second concave portion are larger than other portions. Since the groove 16 is pulled down (see FIG. 2A), the adhesive does not flow out to the region near the connection pad 3 on which the integrated circuit chip is mounted.
[0038]
 As described above, in the present embodiment, in the attaching step, first, the adhesive sheet 21 is attached to the second main surface 12B of the reinforcing plate 12, and then the adhesive sheet 21 is attached in the sheet cutting / concave forming step. The adhesive sheet piece 22 having a predetermined shape is cut. For this reason, after this process, since it can handle with the reinforcement board 12 without handling only the adhesive sheet piece 22, the handling becomes easy and it is hard to generate | occur | produce a wrinkle or a tear.
 Further, the adhesive sheet piece 22 is displaced inwardly from the outer peripheral edge 12 D and the inner peripheral edge 12 E of the reinforcing plate 12, and the adhesive sheet piece 22 is displaced and bonded in a state of protruding outside the wiring substrate 1. The adhesive sheet piece 22 can be reliably adhered to a predetermined position of the reinforcing plate 12 without any problem.
[0039]
 In the present embodiment, in the sheet cutting / groove forming step, the adhesive sheet 21 attached to the second main surface 12B of the reinforcing plate 12 is cut into the adhesive sheet piece 22 having a predetermined shape, A first concave groove 15 and a second concave groove 16 that substantially coincide with the cutting line are formed on the second main surface 12B of the reinforcing plate 12. For this reason, even if the epoxy resin oozes out from the inside of the adhesive sheet piece 22 in the subsequent bonding step, the first concave groove 15 formed substantially coincident with the outer peripheral edge 22D and the inner peripheral edge 22E of the adhesive sheet piece 22 and Since wetting and spreading can be prevented by the second concave groove 16, it is possible to reliably prevent the flow from flowing to the side surface 1C of the wiring substrate 1 and the region in the vicinity of the connection pad 3 on which the integrated circuit chip is mounted.
[0040]
 Moreover, since these concave grooves 15 and 16 are formed at the same time as the adhesive sheet 21 is cut, a new operation process for forming the concave grooves 15 and 16 is not required, and the wiring board 1 can be made inexpensive. Can be manufactured.
 In addition, since the laser is used to cut the adhesive sheet 21 and simultaneously form the concave grooves 15 and 16, changes such as distortion hardly remain in the metal structure constituting the reinforcing plate 12, and the reinforcing plate 12 is wired. When bonded to the substrate body 2, the wiring substrate 1 is not easily deformed due to residual strain.
 Further, when the concave grooves 15 and 16 are formed, the Ni—Au plating layer 17 is removed by a laser, and the copper plate 18 that is easily oxidized is exposed in the concave grooves 15 and 16. The wettability of the epoxy resin (adhesive) is low as compared with other portions having the. For this reason, it is possible to more reliably prevent the adhesive from spreading by the concave grooves 15 and 16 in the subsequent bonding step.
[0041]
 In the above, the present invention has been described with reference to the embodiments. However, the present invention is not limited to the above embodiments, and it is needless to say that the present invention can be appropriately modified and applied without departing from the gist thereof.
 For example, in the above-described embodiment, the V-shaped concave grooves 15 and 16 having a width of 30 μm and a depth of 30 μm are formed. However, the size of the concave grooves 15 and 16 tends to wet and spread during bonding. What is necessary is just to change suitably in consideration of the quantity of an adhesive agent. In addition, when there is a portion where the adhesive is particularly likely to gather, wetting and spreading can be prevented by lowering the shape of the adhesive sheet piece to be larger than the peripheral edge of the reinforcing plate.
[Brief description of the drawings]
1A and 1B are diagrams showing a wiring board according to an embodiment, wherein FIG. 1A is a plan view seen from a first main surface side of a reinforcing plate, and FIG. 1B is a cross-sectional view;
2A and 2B are views showing a reinforcing plate with an adhesive sheet piece according to the embodiment, wherein FIG. 2A is a plan view seen from the second main surface side of the reinforcing plate, and FIG. 2B is a cross-sectional view.
FIG. 3 is a diagram illustrating a method for manufacturing a wiring board according to an embodiment, and shows a state where an adhesive sheet is attached to a reinforcing plate.
FIG. 4 is a diagram illustrating a method for manufacturing a wiring board according to an embodiment, and shows a state in which an adhesive sheet is cut to form a concave groove.
5A and 5B are diagrams illustrating a method of manufacturing a wiring board according to the embodiment, in which FIG. 5A illustrates a wiring board main body, and FIG. 5B illustrates an adhesive sheet piece attached to a reinforcing plate on the wiring board main body. The state that was placed.
FIG. 6 is a diagram showing a method for manufacturing a wiring board according to an embodiment, and shows a state in which a reinforcing plate and a wiring board main body are bonded in an adhesive jig.
FIG. 7 is a partial enlarged cross-sectional view of the vicinity of the vicinity of the groove in the wiring board according to the embodiment.
8A and 8B are diagrams showing a method for manufacturing a wiring board according to the prior art, where FIG. 8A shows a wiring board main body, FIG. 8B shows a state where an adhesive sheet piece is attached to the wiring board main body, ) Shows a reinforcing plate, and (d) shows a wiring board.
[Explanation of symbols]
1 Wiring board
2 Wiring board body
2A First board main surface
2B 2nd substrate main surface
11 Reinforcement plate with adhesive sheet
12 Reinforcement plate
12A 1st main surface
12B 2nd main surface
12D outer edge (of reinforcing plate)
12E Inner peripheral edge (of reinforcing plate)
15 1st groove
16 Second groove
21 Adhesive sheet
22 Adhesive sheet pieces
22D outer peripheral edge (of adhesive sheet piece)
22E Inner peripheral edge (of adhesive sheet piece)

Claims

A wiring board main body having a first substrate main surface and a second substrate main surface, a reinforcing plate having a first main surface and a second main surface, a first substrate main surface of the wiring substrate main body, and a second of the reinforcing plate. An adhesive layer disposed between the main surface, and a manufacturing method of a wiring board comprising:
A pasting step of pasting an adhesive sheet on the second main surface of the reinforcing plate, which is in a predetermined shape in advance ;
Without cutting even the reinforcing plate, a sheet cutting step to cut the adhesive sheet attached to the second main surface of the reinforcing plate to form an adhesive sheet piece of a predetermined shape;
The adhesive sheet piece attached to the reinforcing plate is superposed on the first substrate main surface of the wiring board main body and heated to bond the reinforcing plate and the wiring board main body via the adhesive layer. Process,
A method for manufacturing a wiring board, comprising:

It is a manufacturing method of the wiring board according to claim 1,
The wiring board body is formed by alternately laminating a plurality of insulating layers and wiring layers on one side or both sides of the core substrate.
A method of manufacturing a wiring board.

It is a manufacturing method of the wiring board according to claim 1 or 2,
The wiring board body has a plate shape having the same outer periphery as the reinforcing plate.
A method of manufacturing a wiring board.

It is a manufacturing method of the wiring board according to any one of claims 1 to 3 ,
The sheet cutting step is characterized in that the adhesive sheet affixed to the second main surface of the reinforcing plate is cut by lowering the inner side of the periphery of the reinforcing plate to form the adhesive sheet piece having a predetermined shape. A method of manufacturing a wiring board.

It is a manufacturing method of the wiring board according to any one of claims 1 to 4 ,
In the affixing step, a plurality of the reinforcing plates are arranged, and the large-sized adhesive sheet is affixed on the second main surface thereof,
In the sheet cutting step, the large-sized adhesive sheet is cut into a plurality of adhesive sheet pieces having a predetermined shape.

A method for manufacturing a reinforcing plate with an adhesive sheet piece, comprising: a reinforcing plate for reinforcing a wiring board having a first main surface and a second main surface; and an adhesive sheet piece attached to the second main surface. There,
A pasting step of pasting an adhesive sheet on the second main surface of the reinforcing plate, which is in a predetermined shape in advance ;
Without cutting up to the reinforcing plate , a sheet cutting step to cut the adhered adhesive sheet to a predetermined shape adhesive sheet piece,
The manufacturing method of the reinforcement board with an adhesive sheet piece characterized by providing.

It is a manufacturing method of the reinforcing sheet with an adhesive sheet piece according to claim 6 ,
The sheet cutting step is characterized in that the adhesive sheet affixed to the second main surface of the reinforcing plate is cut by lowering the inner side of the periphery of the reinforcing plate to form the adhesive sheet piece having a predetermined shape. The manufacturing method of the reinforcement board with an adhesive sheet piece to perform.

It is a manufacturing method of the reinforcement sheet with an adhesive sheet piece of Claim 6 or Claim 7 ,
In the affixing step, a plurality of the reinforcing plates are arranged, and the large-sized adhesive sheet is affixed on the second main surface thereof,
In the sheet cutting step, the large-sized adhesive sheet is cut into a plurality of adhesive sheet pieces having a predetermined shape.