JP3617483B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to that electronic component mounting method to mount electronic components such as semiconductor chips in a state of being adhered to the wafer sheet to the substrate.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device, a semiconductor chip is cut out from a wafer made up of a number of individual chips, and the cut-out individual semiconductor chips are peeled off from the wafer sheet and picked up. In this pick-up process, the position of each semiconductor is detected by recognizing each semiconductor element with a camera arranged above the wafer sheet. When the semiconductor element is taken out by the transfer head and mounted on the substrate, the position of the transfer head is adjusted based on the position detection result.
[0003]
By the way, the center of the outer shape of the semiconductor chip and the center of the active surface such as the circuit pattern do not always coincide with each other due to a position error at the time of dicing for cutting the semiconductor wafer into individual pieces, and there is a case where a positional deviation occurs. is there. Since the active surface is based on the active surface for mounting accuracy of the semiconductor element on the substrate, the position of the active surface is detected by detecting the position of the active surface in the above-described semiconductor element position recognition, and this element center position It is desirable to align the suction nozzles of the transfer head for the purpose.
[0004]
[Problems to be solved by the invention]
However, during the pick-up operation in which the upper surface of the semiconductor element is vacuum-sucked by the suction nozzle and taken out, the semiconductor element is likely to be displaced with respect to the suction nozzle, and even if the suction nozzle is aligned with the detected center position of the element, In many cases, the semiconductor element is displaced after the pickup. After the pickup, the active surface of the semiconductor element is hidden by the suction nozzle, so that the element center position cannot be detected again. For this reason, in the conventional electronic component mounting apparatus, if the relative position between the outer shape of the electronic component such as a semiconductor element and the active surface such as the circuit pattern is misaligned, this misalignment directly improves the mounting position accuracy. It was a factor to decrease.
[0005]
The present invention includes a purpose that the relative position between the outer and the active surface of the electronic component in a case that misaligned also provide correct mounting position accuracy Ru electronic component mounting method it is possible to ensure To do.
[0007]
[Means for Solving the Problems]
The electronic component mounting method of the present invention is an electronic component mounting method in which an electronic component is picked up by a transfer head and mounted on a substrate, and the electronic component before being held by the transfer head is placed on the active surface side of the electronic component From the first imaging step of imaging by the first camera and the imaging result of the first imaging step, the outer position of the electronic component, the active surface position of the electronic component, and the outer center C1 and the active surface center C2. positional deviation amount [Delta] x, a first recognition step of detecting the [Delta] y, controls the center of the nozzle of the transfer head based on the detection result of the first recognition step to align the active surface in center C2 of the electronic component And picking up the electronic component, a second imaging step of imaging the electronic component held on the active surface side by the transfer head from the back side with a second camera, and a second imaging step A second recognition step of detecting the contour position of the electronic component by recognizing an image pickup result, the first of the positional shift amount in the recognizing step [Delta] x, [Delta] y of the detection result and the detection of the outer position in the second recognition step The active surface of the electronic component is aligned with the substrate by controlling the transfer head drive mechanism that drives the transfer head based on the result and correcting the misalignment error of the electronic component that occurs during the pickup. and a mounting step of mounting the substrate Te.
[0008]
According to the present invention, the external position of the electronic component and the active surface position of the electronic component are detected in the first recognition process in which the electronic component is imaged and recognized by the component supply unit, and the electronic component is taken out from the component supply unit by the transfer head. The external position of the electronic component is detected again in the second recognition step for recognizing the electronic component held by the transfer head from below, and the position detection result of the first recognition step and the second recognition step are detected. By controlling the transfer head drive mechanism based on the position detection result, the active surface of the electronic component held by the transfer head can be aligned with the substrate and then mounted on the substrate.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are process explanatory diagrams of an electronic component mounting method according to an embodiment of the present invention.
[0010]
First, the configuration of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, the component supply unit 1 includes a wafer holding table 2 that is moved by a wafer positioning mechanism 3. The wafer holding table 2 holds a semiconductor wafer 4 in a state in which semiconductor chips 5 that are electronic components are cut out. ing. The semiconductor chip 5 is mounted on the wafer holding table 2 in a state where the circuit forming surface side (active surface side) is bonded upward to the adhesive sheet 2a (see FIG. 2).
[0011]
A first camera 12 is disposed above the wafer holding table 2, and the first camera 12 images the semiconductor wafer 4 held on the wafer holding table 2 from the active surface side. The first recognition unit 13 recognizes the image data captured from above by the first camera 12 to recognize the semiconductor chip 5. In the recognition of the semiconductor chip 5, the first recognition unit 13 recognizes the outer position of the semiconductor chip 5 and detects the active surface position of the circuit formation surface of the semiconductor chip 5. The detection result by the first recognition unit is transmitted to the control unit 16.
[0012]
A substrate positioning unit 6 is disposed on the side of the component supply unit 1. The substrate positioning unit 6 includes a substrate holding table 7 that is moved by a substrate positioning mechanism 8, and a substrate 9 is held on the substrate holding table 7. Above the component supply unit 1 and the substrate positioning unit 6, a transfer head 10 including the component supply unit 1 and the substrate positioning unit 6 within the movement stroke range is disposed. The transfer head 10 is moved by the transfer head drive mechanism 11, picks up the semiconductor chip 5 held on the wafer holding table 2 by sucking the active surface side, and mounts it on the substrate 9 held on the substrate holding table 7. To do.
[0013]
A second camera 14 is disposed in a path along which the transfer head 10 moves from the component supply unit 1 toward the substrate positioning unit 6. The second camera 14 images the semiconductor chip 5 held by the transfer head 10 from the back side opposite to the active surface (from below), and the image data is recognized by the second recognition unit 15. By doing so, the semiconductor chip 5 is recognized again. In the recognition of the semiconductor chip 5, the outer position of the semiconductor chip 5 is detected, and the detection result by the second recognition unit 15 is transmitted to the control unit 16.
[0014]
The control unit 16 controls the wafer positioning mechanism 3 and the substrate positioning mechanism 8, and the control unit 16 drives the transfer head based on the position detection result of the semiconductor chip 5 by the first recognition unit 13 and the second recognition unit 15. By controlling the mechanism 11, the wafer positioning mechanism 3 and the substrate positioning mechanism 8, the semiconductor chip 5 is aligned in the electronic component mounting operation as described below.
[0015]
Next, an electronic component mounting method will be described with reference to FIGS. In FIG. 2A, the semiconductor chip 5 adhered to the adhesive sheet 2a is imaged by the upper first camera 12. Then, by performing recognition processing on the imaging result by the first recognition unit 13, as shown in FIG. 2B, the outer position of the semiconductor chip 5 and the position of the active surface 5a are detected (first recognition step). ).
[0016]
As a result, the outer shape center C1 of the semiconductor chip 5 and the active surface center C2 of the semiconductor chip 5 are detected, and based on the detection result, the positional deviation amount (Δx, Δy) between the outer shape center C1 and the active surface center C2 is detected. Desired. These detection results are transmitted to the control unit 16. Here, the misregistration amounts (Δx, Δy) are caused by an alignment error or the like in dicing of the semiconductor wafer 4.
[0017]
Next, the control unit 16 controls the transfer head drive mechanism 11 and the wafer positioning mechanism 3 based on the position detection result, whereby the semiconductor chip 5 is taken out by the transfer head 10. At this time, as shown in FIG. 2C, the control unit 16 controls the nozzle center of the transfer head 10 to be aligned with the active surface center C <b> 2 of the semiconductor chip 5.
[0018]
When the upper surface of the semiconductor chip 5 is sucked by the transfer head 10, as shown in FIG. 2D, the transfer head 10 is raised to peel the semiconductor chip 5 from the adhesive sheet 2a. In this take-out operation, the semiconductor chip 5 is likely to be displaced with respect to the transfer head 10, and in a state after the transfer head 10 is raised, the active surface center C2 and the nozzle center of the transfer head 10 are different from each other. Does not necessarily match.
[0019]
Next, the transfer head 10 holding the semiconductor chip 5 moves above the substrate positioning unit 6. In this movement path, as shown in FIG. 3A, the semiconductor chip 5 held by the transfer head 10 is imaged from the back side by the second camera 14. The external position of the semiconductor chip 5 is detected by performing recognition processing on the imaging result by the second recognition unit 15 (second recognition step).
[0020]
Thereafter, the semiconductor chip 5 is mounted on the substrate 9. That is, as shown in FIG. 3B, the transfer head 10 is lowered onto the substrate 9 on which the resin adhesive 17 is previously applied at the mounting position, and the semiconductor chip 5 is mounted on the resin adhesive 17 on the substrate 9. In this mounting operation, based on the outer shape position detection result by the second recognition unit 15 and the positional deviation amounts (Δx, Δy) between the outer shape center C1 and the active surface center C2 detected in FIG. That is, based on the position detection result of the first recognition process and the position detection result of the second recognition process, the control unit 16 determines the exact position of the active surface of the semiconductor chip 5 held by the transfer head 10. Calculate and control the transfer head moving mechanism 11.
[0021]
As a result, even when the nozzle center of the transfer head 10 and the active surface center C2 of the semiconductor chip 5 are displaced, as shown in FIG. The semiconductor chip 5 can be mounted with the center position of the active surface 5a correctly aligned with the mounting position of the substrate 9 after correcting the misalignment error.
[0022]
【The invention's effect】
According to the present invention, the external position of the electronic component and the active surface position of the electronic component are detected in the first recognition process in which the electronic component is imaged and recognized by the component supply unit, and the electronic component is taken out from the component supply unit by the transfer head. The external position of the electronic component is detected again in the second recognition step for recognizing the electronic component held by the transfer head by imaging from below, and the position detection result of the first recognition step and the second recognition step are detected. By controlling the transfer head drive mechanism that drives the transfer head based on the position detection result, the active surface of the electronic component held by the transfer head is aligned with the mounting position of the substrate and Can be installed.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention. Process explanation diagram of electronic component mounting method [Description of symbols]
DESCRIPTION OF SYMBOLS 1 Component supply part 3 Wafer positioning mechanism 4 Semiconductor wafer 5 Semiconductor chip 5a Active surface 6 Substrate positioning part 8 Substrate positioning mechanism 9 Substrate 10 Transfer head 11 Transfer head drive mechanism 12 First camera 13 First recognition part 14 First Second camera 15 Second recognition unit 16 Control unit

Claims (1)

An electronic component mounting method in which an electronic component is picked up by a transfer head and mounted on a substrate, wherein the electronic component before being held by the transfer head is imaged by a first camera from the active surface side of the electronic component. By recognizing the imaging results of the first imaging process and the first imaging process, the outer position of the electronic component, the active surface position of the electronic component, and the positional deviation amounts Δx and Δy between the outer center C1 and the active surface center C2 are detected. a first recognition step, a step of picking up the electronic component controlled to so as to align the center of the nozzle of the transfer head on the active surface of center C2 of the electronic component on the basis of the detection result of the first recognition step By recognizing the imaging result of the second imaging step and the second imaging step of imaging the electronic component held on the active surface side by the transfer head from the back side by the second camera A second recognition step of detecting the contour position of the electronic component, the first of the positional shift amount in the recognizing step [Delta] x, wherein based on the detection result of the outer positions in the detection result and the second recognition step of Δy shift A mounting step of aligning the active surface of the electronic component with the substrate and mounting the substrate on the substrate by controlling a transfer head driving mechanism for driving the mounting head and correcting the positional deviation error of the electronic component generated during the pickup. An electronic component mounting method comprising:

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