JP3687506B2 - Multilayer metal printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the packaging density of parts by efficient cooling. SOLUTION: A metal printed-circuit board 1 is formed by laminating an insulation layer 3 on the upper surface of a metal plate 2 that is a base, and electronic components 7 are packaged on a conductor pattern being formed on the upper surface of the insulation layer 3. A double-sided printed-circuit board 4, where the electronic components 7 are packaged is arranged at the upper portion of the metal printed-circuit board 1 in parallel. By filling an insulation resin 5 between the metal printed-circuit board 1 and the double-sided printed-circuit board 4 for curing, both the boards 1 and 4 are supported and fixed in one piece. Furthermore, an insulation resin 6 is laminated for curing onto the upper surface of both the printed-circuit boards 4, so that the packaged electronic parts 7 can be covered. By using a resin with a large thermal conductivity for the insulation resins 5 and 6, heat being generated from the electronic components 7 can be efficiently transferred and absorbed to the insulation resins 5 and 6 and is discharged from the surface of the metal plate 2 or the insulation resin 6.

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer metal printed board having a high mounting density of components.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a metal printed board is known in which two or more types of insulating layers are formed on a metal base and a conductor pattern is formed thereon in order to increase the mounting density of components. One example thereof is described in JP-A-4-332188. This is to increase the mounting density by providing an insulating layer corresponding to the characteristics of the electric circuit to be mounted.
[0003]
[Problems to be solved by the invention]
However, these conventional metal printed boards have an upper limit in improving the mounting density of electronic components because the arrangement of electronic components is on one plane, and a sufficient mounting density is not always obtained.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a multilayer metal printed circuit board on which electronic components can be mounted at a higher density.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, the present invention mounts a component on a metal printed circuit board formed by laminating an insulating layer on a base metal plate, and mounts the component on the component mounting side of the metal printed circuit board. One or more mounted printed boards are filled with insulating resin between the boards, and a part of the printed board stacked above is cut out, and a board in which through holes and connection electrode patterns are formed in the cut portions It is characterized by being fitted and buried.
[0005]
In the present invention, an insulating layer is laminated on a base metal plate to form a metal printed board, and components are mounted on the metal printed board. One or more printed circuit boards on which components are mounted are stacked with an insulating resin filled between the substrates above the component mounting side of the metal printed circuit board. As a result, the components are mounted over a plurality of layers to increase the mounting density, and heat generated from the components is efficiently released through the insulating resin layer and the metal plate.
[0006]
In addition, a part of the printed circuit board stacked above is cut out, and a board in which through holes and connection electrode patterns are formed is fitted and embedded in the cut portion, so that the connection between the upper and lower conductor patterns is achieved. It becomes easy.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a cross-sectional view showing an example of a multilayer metal printed board.
In the figure, reference numeral 1 denotes a metal printed circuit board, which is formed by laminating an insulating layer 3 on the upper surface of a metal plate 2 as a base. Although not shown, a conductive pattern is formed on the upper surface of the insulating layer 3 to mount the electronic component 7.
[0008]
A double-sided printed board 4 is disposed in parallel above the metal printed board 1. Although not shown, a conductive pattern is formed on both sides of the double-sided printed circuit board 4 and the electronic component 7 is mounted.
Between the metal printed circuit board 1 and the double-sided printed circuit board 4, the insulating resin 5 is filled and cured, so that both the boards are integrally supported and fixed.
[0009]
Further, an insulating resin 6 is laminated on the upper surface of the double-sided printed board 4 so as to cover the mounted electronic component 7 and cured.
In this example, since the double-sided printed circuit board 4 is disposed in parallel above the metal printed circuit board 1, the electronic component 7 is mounted over three layers, and the mounting density is increased accordingly. Further, since the mounting density is increased, the amount of heat generated per unit area by the electronic component 7 is increased. However, since the insulating resin 5 and 6 are filled around the electronic component 7, the amount of heat generated from the electronic component 7 is increased. Efficiently transmitted and absorbed to the insulating resins 5 and 6.
[0010]
The amount of heat transferred to the insulating resins 5 and 6 is efficiently released to the outside from the surface of the lower metal plate 2 or the surface of the upper insulating resin 6. Thereby, the mounted electronic component 7 is kept below a certain temperature.
The insulating resins 5 and 6 are desirably resins having a high thermal conductivity.
The insulating resins 5 and 6 may be resins having different thermal conductivities.
[0011]
Furthermore, the printed circuit board laminated above the metal printed circuit board 1 can be a single-sided printed circuit board, or two or more printed circuit boards can be stacked.
It is also possible to divide the metal printed board 1 or the double-sided printed board 4 into a plurality of parts and to dispose and form insulating layers having different physical characteristics.
[0012]
2A and 2B show an embodiment of the present invention, in which FIG. 2A is a cross-sectional view, and FIG. 2B is a view taken along the line A-A in FIG.
In this embodiment, a part of the double-sided printed circuit board 4 and the insulating resin 5 layer in the multilayer metal printed circuit board of FIG. 1 is changed, and the other parts are the same as in FIG. A description will be omitted with reference numerals, and only different parts will be described.
[0013]
In the figure, when it is necessary to connect each conductor pattern (not shown) between the metal printed circuit board 1 and the upper surface of the double-sided printed circuit board 54, the corresponding position of the double-sided printed circuit board 54 is cut out, The through hole substrate 55 having the same shape is fitted and fixed. The through-hole substrate 55 has a thickness such that the lower end abuts against the metal printed circuit board 1 in a stacked assembly state, and a through-hole 56 is formed in the thickness direction. Further, on the upper and lower surfaces of the through-hole substrate 55, connection electrode patterns 57 are formed radially from the through-hole 56 to the outer peripheral portion.
[0014]
Similarly, a connection electrode pattern 58 connected to the outer peripheral end of the electrode pattern 57 is formed on the upper surface of the metal printed circuit board 1 and the double-sided printed circuit board 54 in contact with the outer peripheral edge of the electrode pattern 57. Thereby, at the time of assembly, the double-sided printed board 54 fitted with the through-hole board 55 is placed on the metal printed board 1, the electrode pattern 57 of the through-hole board 55, and the upper surfaces of the board 1 and the board 54. The electrode pattern 58 formed on the substrate is connected by soldering. Next, the insulating resin 5 is filled between the substrates 1 and 54 and fixed by being cured. Further, the insulating resin 6 is similarly laminated on the upper surface of the double-sided printed board 54 and cured.
[0015]
In this embodiment, the upper and lower substrates 1 and 54 are supported by the through-hole substrate 55 and the electrode pattern 57 and the electrode pattern 58 are soldered to mechanically connect the stacked substrates 1 and 54. Stability is obtained. At the same time, since the electrode patterns 57 and 58 are also electrically connected, the circuit connection between the stacked substrates 1 and 54 is facilitated.
[0016]
The number of through-hole substrates 55 can be three or more, and the shape and size can be changed according to the electronic component 7 and the circuit configuration to be mounted.
[0017]
【The invention's effect】
As described above, according to the present invention, by stacking one or more printed boards on a metal printed board formed using a metal plate as a base via an insulating resin, components can be mounted over a plurality of layers, and the mounting density is reduced. Increase.
Also, by cutting out a part of the printed circuit board that is stacked above, and fitting and embedding a substrate in which the through-hole and connection electrode pattern are formed in the cut-out portion, the space between the conductor pattern of the other substrate Connection becomes easy and workability of circuit connection is improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of a multilayer metal printed board.
FIG. 2 is a cross-sectional view and an arrow view showing an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal printed board 2 Metal plate 3 Insulating layer 4 Double-sided printed board 5,6 Insulation resin 7 Electronic component 54 Double-sided printed board 55 Through-hole board 56 Through-hole 57,58 Electrode pattern

Claims (1)

  Components are mounted on a metal printed circuit board formed by laminating an insulating layer on a base metal plate, and one or more printed circuit boards on which components are mounted are insulated between the substrates above the component mounting side of the metal printed circuit board. A multilayer metal characterized by filling and laminating a resin, cutting off a part of a printed circuit board laminated above, and fitting and embedding a substrate on which a through hole and a connection electrode pattern are formed. Printed board.

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