JP3685399B2 - Heat dissipation structure for axial components mounted on the board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat radiating structure for an axial component in which the heat radiating efficiency is increased in a state where axial components having both leg portions extending on both sides of a main body are mounted on a substrate.
[0002]
[Prior art]
In general, in order to dissipate so-called axial parts in which both legs such as diodes and metal oxide film resistors are extended on both sides of the main body, it is difficult to attach a heat sink because of its structure.
[0003]
Japanese Unexamined Patent Publication No. 2000-174181 describes a heat dissipation mechanism for an electronic device. As shown in FIGS. 3, 4, and 5 , in an electronic device that is mounted on the substrate 101 and the lead portions 102 a, 102 b, and 102 c are bonded to the conductive material (solder) of the substrate 101, Among the portions 102a, 102b, and 102c, the heat sinks 103 and 113 that are directly attached to the lead portion 102c that becomes high temperature are provided. However, in this case, the lead portions 102a, 102b, and 102c are provided in a suspended state with respect to the main body portion.
[0004]
Japanese Patent Laid-Open No. 2001-24371 discloses a heat dissipation device for a printed circuit board. As shown in FIGS. 6A and 6B , the metal piece 204 is attached to the legs 203a and 205a of the electronic components 203 and 205 to be mounted on the printed circuit board 201. As shown in FIG. As shown, a pattern 202 is formed on the lower surface side of the printed circuit board 201 into which the legs 203a of the electronic component 203 are inserted, and the vicinity of the electronic component 203 on the printed circuit board 201 so that the legs 206a are in contact with the pattern 202. The metal piece 206 is erected at the place, and the electronic component 203 is radiated by the metal piece 206 from the legs 203a of the electronic component 203 through the pattern 202.
[0005]
However, in the case shown in FIGS. 6A and 6B, the metal piece 204 is attached to the legs 203a and 205a of the electronic components 203 and 205, and heat is not directly radiated from the main body of the electronic components 203 and 205. 6 (c), the heat generated by the electronic component 203 is radiated by the metal piece 206 through the legs 203a, the patterns 202, and the legs 206a. Since the heat generated by the electronic component 203 is not sufficiently transmitted to the metal piece 206, there is a problem that the heat radiation cannot be sufficiently performed.
[0006]
[Problems to be solved by the invention]
The present invention is to solve the conventional problems described above, the two legs are mounted to the substrate is able to contact the heat radiating plate to the body of the axial component that extends on both sides of the body, directly radiating plate Axial parts of the body An object of the present invention is to provide a heat dissipation structure for an axial component mounted on a substrate that can dissipate heat and improve the heat dissipation effect.
[0007]
[Means for Solving the Problems]
The present invention has been proposed in order to solve the above-mentioned problems, and the invention according to claim 1 radiates heat in a state in which axial parts having both leg portions extending on both sides of the main body are mounted on a substrate. A heat dissipation structure for an axial component designed to increase efficiency, wherein both legs of the axial component mounted on the substrate are penetrated and a tip portion thereof has a horizontal piece in contact with a lower surface portion of the axial component. It is characterized in that a heat radiating plate is erected in the vicinity of the outside of both legs of the axial part on the substrate.
[0008]
The invention according to claim 2, legs is a heat radiation structure of an axial component so as to increase the heat radiation efficiency in a state of mounting an axial component that extends on both sides of the body to the substrate, the heat radiating plate In a state where the legs of the axial component are inserted into a through hole formed in a substantially central portion of the main body, the heat sink is disposed on the substrate so that one surface of the main body is in contact with both side surfaces of the axial component. It is characterized by being erected above .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a heat dissipation structure for an axial component mounted on a substrate according to the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a heat dissipation structure of an axial component mounted on a substrate according to the first embodiment of the present invention, and FIG. 2 is a perspective view showing a heat dissipation structure of an axial component mounted on the substrate according to a second embodiment of the present invention. FIG.
[0010]
The axial component heat dissipation structure mounted on the substrate of the first embodiment shown in FIG. 1 has two heat dissipating plates 3 that are substantially T-shaped sideways when the legs 2a and 2a of the axial component 2 are mounted on the substrate 1. 3 is arranged so as to face both outer sides of the axial component 2, and the legs 2a, 2a of the axial component 2 are inserted into the through holes 3b, 3b formed in the horizontal pieces 3a, 3a. The front end portions of the horizontal pieces 3a and 3a of the heat sinks 3 and 3 are in contact with the lower surface portions on both sides of the main body 2b of the axial component 2, and the axial component 2 and both heat sinks 3 and 3 are mounted on the substrate 1 in this state. Is.
[0011]
According to the heat dissipation structure of the first embodiment, the horizontal pieces 3a and 3a of the heat sinks 3 and 3 are in direct contact with the main body 2b of the axial component 2, and the heat generation of the main body 2b of the axial component 2 is generated by the heat sink 3. 3 is directly transmitted to 3 and radiated from the heat radiating plates 3 and 3, so that the heat radiation effect can be improved.
[0012]
The axial component heat dissipation structure mounted on the substrate of the second embodiment shown in FIG. 2 is the main body portions 3e, 3e of the two vertical plate heat dissipation plates 3B, 3B when the axial component 2 is mounted on the substrate 1. The both leg portions 2a and 2a of the axial component 2 are inserted into through holes 3f and 3f drilled in substantially the central portion, and both side surfaces of the main body portion 2b of the axial component 2 are connected to the main body portions 3e of the heat sinks 3B and 3B. 3e, the axial component 2 and both heat radiation plates 3B, 3B are mounted on the substrate 1. According to the heat dissipation structure of the second embodiment , the main body portions 3e and 3e of the heat sink plates 3B and 3B are in direct contact with the main body portion 2b of the axial component 2, and the heat generation of the main body portion 2b of the axial component 2 is generated by the heat sink plate 3B. Since it is directly transmitted to 3B and radiated from the heat radiating plates 3B and 3B, the heat radiation effect can be improved.
[0013]
【The invention's effect】
As described above, the invention according to claim 1 is a heat dissipation structure for an axial component in which the heat dissipation efficiency is increased in a state where the axial components having both leg portions extending on both sides of the main body are mounted on the substrate. A laterally substantially T-shaped heat radiation plate having a horizontal piece in which both legs of the axial component mounted on the board penetrate and the tip part contacts the lower surface part of the axial part is located near the outside of both legs of the axial part on the board. The following effects are achieved. That is, since the horizontal piece of the heat sink is in direct contact with the axial component and the heat generated by the axial component is directly transmitted to the heat sink and is radiated from the heat sink, the heat dissipation effect can be improved.
[0014]
The invention according to claim 2, legs is a heat radiation structure of an axial component so as to increase the heat radiation efficiency in a state of mounting an axial component that extends on both sides of the body to the substrate, the heat radiating plate In a state where the legs of the axial component are inserted into a through hole formed in a substantially central portion of the main body, the heat sink is disposed on the substrate so that one surface of the main body is in contact with both side surfaces of the axial component. Since the main part of the heat sink is in direct contact with the main part of the axial part, the heat generated in the main part of the axial part is directly transmitted to the heat sink and is dissipated from this heat sink. The heat dissipation effect can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a heat dissipation structure of an axial component mounted on a substrate according to a first embodiment of the present invention.
FIG. 2 is a perspective view showing a heat dissipation structure for an axial component mounted on a substrate according to a second embodiment of the present invention.
FIG. 3 is a perspective view showing an example of a heat dissipation mechanism of a conventional electronic device.
FIG. 4 is a perspective view showing another example of a conventional electronic device heat dissipation mechanism.
FIG. 5 is a perspective view showing another example of a conventional electronic device heat dissipation mechanism.
6A and 6B show a conventional heat dissipating device for a printed circuit board, wherein FIG. 6A is a perspective view of the first example, FIG. 6B is a second perspective view thereof, and FIG. 6C is a cross-sectional view of the third example. .
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Axial component 2a Leg part 2b Main body part 3 Heat sink 3a Horizontal piece 3B Heat sink 3e Main body part 3f Through-hole

Claims (2)

  A heat dissipation structure for an axial component in which the heat dissipation efficiency is increased in a state where the axial components with both legs extending on both sides of the main body are mounted on the substrate, and both the legs of the axial components mounted on the substrate are A board, characterized in that a transversely substantially T-shaped heat sink having a horizontal piece penetrating therethrough and having a horizontal piece in contact with the lower surface part of the axial part is erected in the vicinity of the outside of both legs of the axial part on the board. Heat dissipating structure for mounted axial components. Axial component heat dissipation structure that increases the heat dissipation efficiency with axial parts mounted on the board with both legs extending on both sides of the main body. The heat sink is erected on the substrate so that one surface of the main body part is in contact with both side surfaces of the axial component in a state where the leg portion of the axial component is inserted into the through hole formed. A heat dissipation structure for axial components mounted on the board.

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