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JP3672048B2 - Method for processing drive element for ink jet print head - Google Patents

Method for processing drive element for ink jet print head Download PDF

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Publication number
JP3672048B2
JP3672048B2 JP23093795A JP23093795A JP3672048B2 JP 3672048 B2 JP3672048 B2 JP 3672048B2 JP 23093795 A JP23093795 A JP 23093795A JP 23093795 A JP23093795 A JP 23093795A JP 3672048 B2 JP3672048 B2 JP 3672048B2
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JP
Japan
Prior art keywords
piezo
print head
drive element
cutting
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP23093795A
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Japanese (ja)
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JPH0970978A (en
Inventor
良昭 橘
政宣 出口
邦裕 玉橋
純 永田
和伸 林
健二 山田
健一 久貝
雅文 清水
Original Assignee
リコープリンティングシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to JP23093795A priority Critical patent/JP3672048B2/en
Publication of JPH0970978A publication Critical patent/JPH0970978A/en
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Description

【0001】
【産業上の利用分野】
本発明は、インクの吐出手段としての駆動素子、特に電気機械変換素子(以下ピエゾという)を用いるタイプのインクジェットプリントヘッド用の駆動素子の加工方法に関する。
【0002】
【従来の技術】
従来のインクジェットプリンタのピエゾの加工方法は、ピエゾの一端をセラミックなどに接着、固定し、これを切削して個別のピエゾとして働くようにしている。
【0003】
図1は従来の技術を示すものである。
【0004】
図において、積層されたピエゾ1はセラミック2の上のメッキで被覆されている側に導通接着されている。
【0005】
それを図2に示すように、1’、2’のように所定ピッチで切削加工して、個別の駆動素子として働くように加工を行う。
【0006】
次に、図3に示すように、セラミック2にフレキシブル基板3を取り付けて、個別電極、共通電極を設ける。
【0007】
図2の加工の際にピエゾ1は小さくカットされて1’の状態になるので、非常に強度が劣化して、折れ易い状態にある。
【0008】
ピエゾヘッドも、より微細ヘッドを要求してきているので、強度劣化の傾向は益々顕著になってきている。
【0009】
【発明が解決しようとする課題】
上述のように、図2の加工を行う時に切削されるピエゾ1の一端は固定されているが、他端はフリーである為に、ピエゾ1の加工をより微細化したいという要求に対応した場合、加工時、取扱い時にピエゾが破損してしまうなどの事故が発生する可能性が高くなってしまっていた。
【0010】
そこで、ピエゾをより微細加工する場合に、安全でしかも確実に行う加工方法を提案する。
【0011】
【課題を解決するための手段】
本発明は、基板上に電気機械変換素子を接着固定し、これを所定ピッチごとに切削加工し、更に前記電気機械変換素子をケーブルで接続することによって形成されるインクジェットプリントヘッド用駆動素子の加工方法において、切削加工の前工程として前記電気機械変換素子に切削補助部材を設ける工程を追加する。
【0012】
【作用】
インクジェットプリンタのヘッドの密度を上げてより多いノズルを作り、高速印刷を行なう目的のため、従来のような加工方法でピエゾをより精細に加工すると、切削加工後のピエゾの強度が落ちているため、取り扱い時にピエゾが破壊してしまう。しかし、上記した手段によれば、切削加工時及び切削加工後のピエゾを保護することができるので、ピエゾの破壊を防ぐと共に、接着工程でピエゾの接着が触れたりすることでずれたりするのを防ぐことも可能となる。
【0013】
【実施例】
以下、本発明を説明する。
【0014】
図4において、まず積層されたピエゾ4とセラミック5とを接着する。
【0015】
次に切削補助部材6を前記ピエゾ4に接着固定し、セラミック5の表面のメッキ面との導通も取る。
【0016】
図9に示すように、常温では固化し、若干の熱、例えば100℃以下の温度で溶け出すようなグリスまたはシリコン樹脂のようにピエゾの動作に悪影響を及ぼさないものを矢印Aの方向から注入し、切削加工時のピエゾの保持材料として使用する。これによりピエゾ4の切削が容易に行えるようになる。
【0017】
また、図6に示したように、切削補助部材6が切削加工時、および加工後のピエゾ4’のプロテクタとして働くので、個別電極、共通電極の作成時、すなわちフレキシブル基板7取り付けや、その他の工程での作業中において、ピエゾ4’の破壊を免れることができる。
【0018】
上述のようにして加工した駆動素子を複数個取り付けて図7のようにホルダ8にアセンブリし、これにインクチャンバ9を取り付けて図8に示すようなヘッドとすることができる。
【0019】
本実施例では切削補助部材6とセラミック基板5とは別部材であったが、これら切削補助部材6とセラミック基板5とが一体成形されたものを用いても効果は同じである。むしろ、一体にした方が接着固定する工程が少なくなるので、公差が拡大する要素を少なくすることができる。従って、一体成形しない場合と比して加工精度が上がり、性能の安定に寄与することができる。
【0020】
【発明の効果】
ピエゾを加工時にプロテクトする切削補助部材を設けることにより、微細加工されて強度を失っているピエゾの破壊を加工工程で発生させないようにすることができるので、従来より微細加工が容易になり、ヘッド数を増し、大型ヘッド化して高速印刷を可能にできる。
【0021】
また、製品の歩留まりも良くなる。
【図面の簡単な説明】
【図1】 従来のピエゾとセラミック基板との接着状態を示す斜視図。
【図2】 従来のピエゾの切削加工状態を示す斜視図。
【図3】 フレキシブル基板との接続状態を示す斜視図。
【図4】 本発明のピエゾとセラミック基板との接着状態を示す斜視図。
【図5】 本発明のピエゾの切削加工状態を示す斜視図。
【図6】 本発明のフレキシブル基板との接続状態を示す斜視図。
【図7】 アセンブリ状態図。
【図8】 ピエゾインクジェット用ヘッドとしての最終アセンブリ状態図。
【図9】 ピエゾをプロテクトした状態を示す斜視図。
[0001]
[Industrial application fields]
The present invention relates to a method of processing a drive element for an ink jet print head that uses a drive element as an ink discharge means, particularly an electromechanical conversion element (hereinafter referred to as piezo).
[0002]
[Prior art]
In a conventional piezo processing method of an ink jet printer, one end of a piezo is bonded and fixed to ceramic or the like, and this is cut to work as an individual piezo.
[0003]
FIG. 1 shows a conventional technique.
[0004]
In the figure, the laminated piezo 1 is conductively bonded to the side of the ceramic 2 covered with plating.
[0005]
As shown in FIG. 2, it is cut at a predetermined pitch, such as 1 ′ and 2 ′, so as to work as individual driving elements.
[0006]
Next, as shown in FIG. 3, the flexible substrate 3 is attached to the ceramic 2 to provide individual electrodes and common electrodes.
[0007]
In the processing of FIG. 2, the piezo 1 is cut into a small size and is in a 1 'state, so that the strength is very deteriorated and it is easily broken.
[0008]
Piezo heads are also demanding finer heads, so the tendency of strength deterioration is becoming more and more remarkable.
[0009]
[Problems to be solved by the invention]
As described above, when one end of the piezo 1 to be cut when performing the processing of FIG. 2 is fixed, but the other end is free, the case of meeting the demand for further miniaturizing the processing of the piezo 1 The possibility of accidents such as piezo breakage during processing and handling has increased.
[0010]
Therefore, a processing method is proposed that is safe and reliable when the piezo is finely processed.
[0011]
[Means for Solving the Problems]
The present invention relates to an inkjet printhead driving element formed by bonding and fixing an electromechanical conversion element on a substrate, cutting it at a predetermined pitch, and connecting the electromechanical conversion element with a cable. In the method, a step of providing a cutting auxiliary member on the electromechanical conversion element is added as a pre-process of cutting.
[0012]
[Action]
For the purpose of making more nozzles by increasing the density of the head of an inkjet printer and performing high-speed printing, if the piezo is processed more finely by the conventional processing method, the strength of the piezo after cutting will decrease. , Piezo will be destroyed during handling. However, according to the above means, the piezo can be protected at the time of cutting and after the cutting, so that the piezo is prevented from being destroyed and the piezo is not touched in the bonding process. It can also be prevented.
[0013]
【Example】
The present invention will be described below.
[0014]
In FIG. 4, first, the laminated piezo 4 and ceramic 5 are bonded.
[0015]
Next, the cutting assisting member 6 is bonded and fixed to the piezo 4 so as to be electrically connected to the plated surface of the ceramic 5 surface.
[0016]
As shown in FIG. 9, grease that does not adversely affect the operation of the piezo, such as grease or silicon resin that solidifies at room temperature and melts at a certain temperature, for example, 100 ° C. or less, is injected from the direction of arrow A. It is used as a piezo holding material during cutting. As a result, the piezo 4 can be easily cut.
[0017]
Further, as shown in FIG. 6, since the cutting assisting member 6 functions as a protector for the piezo 4 ′ after cutting and after processing, when the individual electrode and the common electrode are created, that is, the flexible substrate 7 is attached, During the work in the process, the destruction of the piezo 4 'can be avoided.
[0018]
A plurality of drive elements processed as described above are attached and assembled to the holder 8 as shown in FIG. 7, and an ink chamber 9 is attached to the holder 8 to obtain a head as shown in FIG.
[0019]
In this embodiment, the cutting assisting member 6 and the ceramic substrate 5 are separate members. However, the same effect can be obtained by using an integrally formed cutting assisting member 6 and the ceramic substrate 5. Rather, since the number of steps for bonding and fixing is reduced when they are integrated, it is possible to reduce elements that increase tolerance. Therefore, the machining accuracy can be increased as compared with the case where the integral molding is not performed, and the performance can be stabilized.
[0020]
【The invention's effect】
By providing a cutting assisting member that protects the piezo during processing, it is possible to prevent the piezo from being broken due to micromachining and losing strength in the machining process. The number can be increased and a large-sized head can be used to enable high-speed printing.
[0021]
Also, the product yield is improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a bonding state between a conventional piezo and a ceramic substrate.
FIG. 2 is a perspective view showing a cutting state of a conventional piezo.
FIG. 3 is a perspective view showing a connection state with a flexible substrate.
FIG. 4 is a perspective view showing an adhesive state between the piezo of the present invention and a ceramic substrate.
FIG. 5 is a perspective view showing a cutting state of the piezo according to the present invention.
FIG. 6 is a perspective view showing a connection state with the flexible substrate of the present invention.
FIG. 7 is an assembly state diagram.
FIG. 8 is a final assembly state diagram as a piezo inkjet head.
FIG. 9 is a perspective view showing a state where a piezo is protected.

Claims (4)

基板上に電気機械変換素子を接着固定し、これを所定ピッチごとに切削加工し、更に前記電気機械変換素子をケーブルで接続することによって形成されるインクジェットプリントヘッド用駆動素子の加工方法において、
切削加工の前工程として前記基板に切削補助部材を接着し、前記電気機械変換素子と前記切削補助部材間に、保持材料を注入する工程を追加することを特徴とするインクジェットプリントヘッド用駆動素子の加工方法。
In the processing method of the drive element for an inkjet print head formed by adhering and fixing the electromechanical conversion element on the substrate, cutting it at a predetermined pitch, and further connecting the electromechanical conversion element with a cable,
A drive element for an inkjet print head , comprising a step of bonding a cutting auxiliary member to the substrate as a pre-process of cutting , and adding a holding material between the electromechanical conversion element and the cutting auxiliary member . Processing method.
前記切削補助部材は、前記基板と一体成形で形成されることを特徴とする請求項1記載のインクジェットプリントヘッド用駆動素子の加工方法。2. The method for processing an ink jet print head drive element according to claim 1, wherein the cutting assisting member is formed integrally with the substrate. 前記保持材料は、常温では固化し100℃以下で溶融するグリスであることを特徴とする請求項1または2に記載のインクジェットプリントヘッド用駆動素子の加工方法。The method for processing a drive element for an inkjet print head according to claim 1, wherein the holding material is grease that is solidified at room temperature and melts at 100 ° C. or less. 前記保持材料は、シリコン樹脂であることを特徴とする請求項1または2に記載のインクジェットプリントヘッド用駆動素子の加工方法。The method for processing a drive element for an ink jet print head according to claim 1, wherein the holding material is a silicon resin.
JP23093795A 1995-09-08 1995-09-08 Method for processing drive element for ink jet print head Expired - Lifetime JP3672048B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23093795A JP3672048B2 (en) 1995-09-08 1995-09-08 Method for processing drive element for ink jet print head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23093795A JP3672048B2 (en) 1995-09-08 1995-09-08 Method for processing drive element for ink jet print head

Publications (2)

Publication Number Publication Date
JPH0970978A JPH0970978A (en) 1997-03-18
JP3672048B2 true JP3672048B2 (en) 2005-07-13

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