JP3654256B2 - Thermal storage floor heating system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat storage floor heating device that performs floor heating by radiating stored heat, and more particularly to a structure that controls heat release according to the amount of heat stored in a heat storage board.
[0002]
[Prior art]
The heat storage floor heating apparatus is formed by combining a heater block (not shown), a heat storage board 1 and a floor plate 2 as shown in FIG. The heat storage board 1 is provided with a rising wall 4 at the periphery of a synthetic resin casing 3 having a flat rectangular box shape and a space inside, and a heat storage material 5 such as a latent heat storage material is loaded in the space of the casing 3. Is formed. A heater block is laminated on the lower surface of the housing 3 of the heat storage board 1 so that the heater block can generate heat using midnight power or the like, and this heat can be stored in the heat storage material 5. On the upper end of the rising wall 4 of the heat storage board 1, a floor board 2 such as a plywood is arranged so as to cover the entire upper surface of the heat storage board 1, and the heat storage board 1 and the floor board 2 are integrated. .
[0003]
The housing 3 of the heat storage board 1 is formed by blow molding or the like. As shown in FIG. 7, an overlapping portion 6 in which the upper surface plate portion 3a and the lower surface plate portion 3b are polymerized and bonded is disposed at an appropriate position of the housing 3. It is formed. In other words, the bottom plate-shaped inverted truncated cone cylindrical concave curved portion 7 is provided on the upper surface plate portion 3 a, and the bottom-shaped truncated cone cylindrical convex curved portion 8 is provided on the lower surface plate portion 3 b. The bottom portion and the bottom portion of the convex curved portion 8 are fused to each other. Thus, by providing the concave curved portion 7 and the convex curved portion 8 and providing the overlapped portion 6 in which the bottom portions are fused together, the reinforcing rib 6 functions.
[0004]
[Problems to be solved by the invention]
By the way, in the said thermal storage floor heating apparatus, a heater block is heated using late-night electric power etc., heat is stored in the thermal storage material 5 at midnight etc., and this thermal storage heat is radiated from the thermal storage material 5 to the floor surface board 2, and floor heating is carried out. However, in order to dissipate the heat stored in the heat storage material 5 in a relaxed manner, a large amount of heat is dissipated when the heat is stored most (for example, in the morning), and the amount of heat stored is decreased (for example, at night). ) Does not dissipate much heat. Therefore, there is a problem that the temperature difference becomes large depending on the time zone like morning and evening.
[0005]
This invention is made | formed in view of said point, and makes it a subject to provide the thermal storage floor heating apparatus which can control heat radiation so that a temperature difference may not be made by a time slot | zone.
[0006]
[Means for Solving the Problems]
The heat storage floor heating apparatus of the present invention for solving the above-mentioned problems is the heat storage floor heating apparatus in which the heat storage board 1 is laminated on the heater block and the floor plate 2 is pasted on the heat storage board 1. The housing 3 is formed by filling the heat storage material 5, and the housing 3 is formed with a plurality of recesses 9 that open at least the upper surface, and between the heat storage board 1 and the floor plate 2, A heat dissipation control plate 10 covering the upper surface is slidably mounted on the upper surface, and through holes 11 are provided in the heat dissipation control plate 10 so as to correspond to the respective recesses 9, and the heat dissipation control plate 10 is slid. It is characterized in that the heat dissipation control is switched to a heat dissipation promotion state in which the recess 9 and the through hole 11 are matched and a heat dissipation suppression state in which the recess 9 and the through hole 11 do not match. When the heat storage amount of the heat storage material 5 is large, the heat dissipation area of the housing 3 exposed to the through hole 11 can be reduced by making the recess 9 and the through hole 11 unmatched, and the heat storage of the heat storage material 5 can be suppressed. When the amount decreases, the recess 9 and the through-hole 11 are matched to increase the heat-dissipating area of the housing 3 exposed to the through-hole 11 so that the heat dissipation is promoted. As a result, when the amount of heat stored in the heat storage material 5 is large, heat dissipation can be suppressed, and when the amount of heat stored in the heat storage material 5 is small, heat dissipation can be promoted, and temperature differences due to time zones cannot be made, reducing the temperature difference of the day. Can do.
[0007]
It is also preferable that the heat dissipation control plate 10 is slid by changing the shape of the shape memory alloy. In this case, the heat dissipation control plate 10 is driven by the temperature change of the heat storage material 5 and when the amount of stored heat is large, the heat dissipation can be suppressed, and when the amount of stored heat is small, the heat dissipation can be accelerated. As a result, the heat radiation control plate 10 is appropriately activated according to the temperature change of the heat storage material 5, and the heat radiation control plate 10 is automatically activated.
[0008]
It is also preferable that the recess 9 is provided so as to penetrate vertically between the upper surface and the lower surface of the housing 3 of the heat storage board 1. In this case, the heat radiation area when the through hole 11 and the recess 9 are matched can be increased, and when heat is taken out in the heat radiation promotion state, it can be taken out evenly in the thickness direction of the housing 3.
[0009]
The housing 3 of the heat storage board 1 includes an upper surface plate portion 3a and a lower surface plate portion 3b. The bottom surface of the concave curved portion 7 provided on the upper surface plate portion 3a and the bottom surface of the convex curved portion 8 provided on the lower surface plate portion 3b. It is also preferable that a recess 9 penetrating vertically is formed by forming a hole 12 in the overlapping portion 6. In this way, by providing the concave curved portion 7 and the convex curved portion 8 and providing the overlapped portion 6 in which the bottom portions are fused, the reinforcing rib functions and becomes strong. Moreover, the recessed part 9 penetrated up and down for heat dissipation can be easily formed using the part for reinforcement.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
The floor heating device is formed as shown in FIG. 1 by combining a heater block (not shown), a heat storage board 1 and a floor plate 2 into a panel. The heat storage board 1 is formed by providing a rising wall 4 at the periphery of a housing 3 having a flat rectangular box shape and having a space inside, and charging a heat storage material 5 such as a latent heat storage material in the space inside the housing 3. Has been. The housing 3 and the rising wall 4 of the heat storage board 1 are integrally formed of a synthetic resin such as polypropylene. The heater block is mounted on the lower surface side of the housing 3 of the heat storage board 1 so that the heater block can be heated by midnight power or the like to store heat in the heat storage material 5 of the heat storage board 1.
[0011]
A plurality of overlapping portions 6 in which the upper surface plate portion 3 a and the lower surface plate portion 3 b of the housing 3 are overlapped and joined are formed at appropriate positions on the housing 3 of the heat storage board 1. In other words, the bottom plate-shaped inverted truncated cone cylindrical concave curved portion 7 is provided on the upper surface plate portion 3 a, and the bottom-shaped truncated cone cylindrical convex curved portion 8 is provided on the lower surface plate portion 3 b. The bottom portion and the bottom portion of the convex curved portion 8 are fused to each other. Thus, by providing the concave curved portion 7 and the convex curved portion 8 and providing the overlapped portion 6 in which the bottom portions are fused together, the reinforcing rib 6 functions. A hole 12 is provided in the overlapping portion 6 so as to penetrate the overlapping portion 6, and a recess 9 that penetrates vertically is formed by the space in the concave curved portion 7, the space in the convex curved portion 8, and the hole 12. The surface exposed to the recess 9 is a heat radiating surface. In the case of this example, the recess 9 is provided so as to penetrate vertically, but the recess 9 may be provided only in the space of the concave curved portion 7.
[0012]
On the upper end of the rising wall 4 of the heat storage board 1, a floor board 2 such as a plywood is arranged so as to cover the entire upper surface of the heat storage board 1, and the heat storage board 1 and the floor board 2 are integrated. . A heat dissipation control plate 10 that covers the housing 3 is disposed on the upper surface of the housing 3 of the heat storage board 1, and the heat dissipation control plate 10 is formed of a relatively heat-insulating material. It is made of synthetic resin. The heat dissipation control plate 10 is provided with a through hole 11 so as to correspond to the recess 9 of the housing 3. The heat radiation control plate 10 has a thickness of 2 mm, for example, and the diameter of the through hole 11 is 14 mmφ. The heat radiation control plate 10 can be slid to match the through hole 11 and the recess 9 or not from the through hole 11 and the recess 9. When the through hole 11 and the recess 9 are not matched, the heat radiation area S1 of the housing 3 exposed to the through hole 11 is reduced as shown in FIG. When the through hole 11 and the recess 9 are matched, the heat radiation area S2 of the housing 3 exposed to the through hole 11 is increased as shown in FIG. As a result, when the heat storage amount of the heat storage material 5 is large, the heat dissipation control plate 10 is moved so that the through hole 11 and the recess 9 do not coincide with each other, and the heat dissipation control state is set. The heat radiation control plate 10 can be moved so that the heat radiation acceleration plate 11 and the recess 9 coincide with each other to be in a heat radiation promotion state.
[0013]
In the case of this example, the operating plate 13 made of a shape memory alloy is used as a moving means for moving the heat dissipation control plate 10 so as to be in a heat dissipation suppressed state or a heat dissipation accelerated state. The heat radiation control plate 10 moves by shape deformation. The shape memory alloy actuating plate 13 is formed by a horizontal piece 13a and a vertical piece 13b in a substantially inverted L-shape, and the horizontal piece 13a is fixed to the floor plate 2 by a fixing tool 14, The lower end is coupled to one end of the heat dissipation control plate 10. The transformation point of this shape memory alloy is, for example, 40 to 45 ° C., and the vertical piece 13b is deformed with the temperature of this transformation point as a boundary. A spring 15 made of a tension spring is disposed at the end of the heat radiation control plate 10 opposite to the side where the operating plate 13 is mounted, and one end of the spring 15 is connected to the heat radiation control plate 10. The end is fixed to the heat storage board 1. As a result, the heat dissipation control plate 10 is always pulled in a direction opposite to the direction where the operation plate 13 is located with a predetermined spring force.
[0014]
Thus, when the heat storage material 5 is sufficiently stored, the temperature of the working plate 13 of the shape memory alloy rises, exceeds the temperature of the transformation point of the shape memory alloy, and the working plate 13 is deformed into the memory shape of the shape memory alloy. Then, the heat radiation control plate 10 is pulled against the force of the spring 15 as shown in FIG. As a result, the heat radiation control plate 10 moves so that the through hole 11 and the recess 9 do not match, and the heat radiation area of the housing 3 exposed to the through hole 11 is reduced, and the heat radiation is suppressed. When the heat storage amount of the heat storage material 5 decreases and the temperature of the operation plate 13 decreases and becomes lower than the temperature of the transformation point, the heat radiation control plate 10 is returned by the force of the spring 15 as shown in FIG. As a result, the heat radiation control plate 10 moves so that the through hole 11 and the recess 9 match, and the heat radiation area of the housing 3 exposed to the through hole 11 is increased, and the heat radiation is promoted. When the heat dissipation control plate 10 is moved by the shape memory alloy operating plate 13 as described above, the heat dissipation control plate 10 is automatically moved according to the heat storage amount of the heat storage material 5 to be in a heat dissipation suppression state or a heat dissipation promotion state. it can.
[0015]
In the case of this example, the shape memory alloy working plate 13 operates according to the temperature of the heat storage material 5, but a small heater is attached in the vicinity of the shape memory alloy working plate 13 to electrically control the heater. The actuating plate 13 may be actuated. Further, a solenoid may be connected to the heat dissipation control plate 10 instead of the shape memory alloy operating plate 13, and the heat dissipation control plate 10 may be moved by a predetermined stroke by operating the solenoid by electrical control. If the heat control plate 10 is moved under electrical control as described above, it is possible to switch between suppression of heat dissipation and promotion of heat dissipation.
[0016]
【The invention's effect】
According to the first aspect of the present invention, the heat storage board is formed by filling the housing with a heat storage material, and the housing is formed with a plurality of recesses that open at least the upper surface. A heat dissipation control plate covering the upper surface is slidably mounted on the upper surface of the heat storage board, and through holes are provided in the heat dissipation control plate so as to correspond to the respective recesses, and the heat dissipation control plate is slid. Since the heat dissipation control is switched to the heat dissipation promotion state in which the recess and the through hole are matched and the heat dissipation suppression state in which the recess and the through hole do not match, when the heat storage amount of the heat storage material is large, By not matching with the through hole, the heat radiation area of the housing exposed to the through hole can be reduced to reduce heat dissipation, and when the heat storage amount of the heat storage material decreases, the recess and the through hole are matched to make the through hole The heat dissipation area of the housing exposed to the When the amount of heat stored in the heat storage material is large, heat dissipation can be suppressed, and when the amount of heat stored in the heat storage material is small, heat dissipation can be promoted, temperature differences due to time zones cannot be made, and daily temperature differences can be reduced. is there.
[0017]
The invention of claim 2 of the present invention is that in claim 1, the heat dissipation control plate is slid by the shape change of the shape memory alloy, so that the heat storage control plate is driven by the temperature change of the heat storage material to store the heat. When the amount is large, the heat radiation can be suppressed, and when the amount of heat storage is small, the heat radiation can be accelerated.This allows the heat radiation control plate to operate properly according to the temperature change of the heat storage material and It operates automatically.
[0018]
In the invention of claim 3 of the present invention, in claim 1 or claim 2, the recess is provided so as to penetrate vertically between the upper surface and the lower surface of the housing of the heat storage board. When the heat is extracted in the heat dissipation accelerated state, the heat can be extracted uniformly over the thickness direction of the housing.
[0019]
According to a fourth aspect of the present invention, in any one of the first to third aspects, the housing of the heat storage board is composed of an upper surface plate portion and a lower surface plate portion, and is a concave curved portion provided on the upper surface plate portion. Since the bottom surface of the convex portion and the bottom surface of the convex portion provided on the lower surface plate portion are polymerized and joined together, a reinforcing portion of the reinforcing rib is provided by providing a superposed portion having a concave portion and a convex portion and the bottom portions being fused together. Since the concave part that penetrates up and down is formed by forming a hole in the overlap part, the concave part that penetrates up and down for heat dissipation using the part for reinforcement Can be easily formed.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view of an example of an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing an enlarged main part of the above.
FIGS. 3A and 3B are explanatory views for explaining a heat radiation area. FIGS.
FIG. 4 is a schematic cross-sectional view operated in the heat dissipation suppression state.
FIG. 5 is a schematic cross-sectional view operated in the heat dissipation promotion state.
FIG. 6 is a schematic cross-sectional view of a conventional example.
FIG. 7 is an enlarged cross-sectional view of a main part of a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Thermal storage board 2 Floor surface board 3 Housing | casing 3a Upper surface board part 3b Lower surface board part 5 Thermal storage material 6 Superposition | polymerization part 7 Concavity part 8 Convex part 9 Concave part 10 Radiation control board 11 Through-hole

Claims (4)

In a heat storage floor heating device in which a heat storage board is laminated on a heater block and a floor plate is pasted on the heat storage board, the heat storage board is formed by filling a heat storage material in the housing, and at least the upper surface of the housing is formed. A plurality of recesses to be opened are formed, and a heat dissipation control plate covering the upper surface of the heat storage board is slidably mounted on the upper surface of the heat storage board between the heat storage board and the floor plate, and the heat dissipation control plate corresponds to each of the above recesses. A through hole is provided so that the heat radiation control plate is slid to switch between a heat radiation promotion state in which the recess and the through hole are matched and a heat radiation suppression state in which the recess and the through hole do not match. A regenerative floor heating apparatus characterized by the above. The regenerative floor heating device according to claim 1, wherein the heat dissipation control plate is slid by a shape change of the shape memory alloy. The heat storage floor heating device according to claim 1 or 2, wherein the recess is provided so as to penetrate vertically between the upper surface and the lower surface of the housing of the heat storage board. The housing of the heat storage board is composed of an upper surface plate portion and a lower surface plate portion, and the bottom surface of the concave curved portion provided on the upper surface plate portion and the bottom surface of the convex curved portion provided on the lower surface plate portion are polymerized and combined. The regenerative floor heating device according to any one of claims 1 to 3, wherein a recess penetrating vertically is formed by forming a hole in the overlapping portion.

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