JP3651633B2 - Cooling device with fan for electrical equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling device with a fan for an electric device that radiates and cools an electric device such as a semiconductor contactor through a cooling body that is forcibly cooled by a motor fan.
[0002]
[Prior art]
6 to 8 show a conventional configuration of the cooling device for a semiconductor contactor, FIG. 6 is a side view, FIG. 7 is a plan view, and FIG. 8 is a left front view of FIG. In these drawings, reference numeral 1 denotes a three-phase semiconductor contactor whose main circuit opening / closing portion is composed of a semiconductor element such as a thyristor. Main terminals 2 are arranged in the front and rear, and a terminal for an operation circuit and an auxiliary contact on one side of the upper surface. 3 are arranged. Since the semiconductor element generates heat in the semiconductor contactor 1, the semiconductor contactor 1 is fastened to the upper surface of the cooling body 4 with screws 5 at the four corners via a heat conductive compound (not shown) and is cooled by heat conduction to the cooling body 4. The cooling body 4 manufactured by extrusion molding or die-casting from an aluminum material is a rectangular parallelepiped with a square cross section, as shown in FIG. 8, along the axial direction (the left-right direction in FIG. 6, the direction perpendicular to the paper surface in FIG. 8). Thus, the cavity 4a is formed so as to penetrate therethrough, and heat is radiated by the cooling fins 4b formed therebetween.
[0003]
A motor fan 6 is attached to the end face of one end side (right end in FIG. 6) of the cooling body 4 by screws 7 at four corners. Here, on the upper surface of the cooling body 4, the semiconductor contactor 1 is arranged to be shifted to one side (the lower side in FIG. 7, the right side in FIG. 8), and the input of the motor fan 6 is placed in the opposite space. Terminal block 8 is fixed by two screws 9 at both ends. A thermostat 10 as a temperature sensor is attached to the upper surface of the cooling body 4, and an output terminal block 11 is also fixed side by side with two screws 12 at both ends. The thermostat 10 is for detecting when the motor fan 6 stops due to disconnection or the like and the temperature of the cooling body 4 rises excessively. An L-shaped mounting bracket 13 for fixing the cooling body 4 to a control panel or the like is fixed to the cooling body 4 at two locations on the left and right sides with screws 14, and mounting screws (not shown) are inserted into the mounting bracket 13. A U-shaped groove 15 (FIG. 7) is formed by notching.
[0004]
In the above configuration, the heat generated by the semiconductor contactor 1 is transmitted to the cooling body 4 by heat conduction and radiated from the surface. In the meantime, the cooling body 4 is forcibly cooled by the cold air flowing through the cavity 4a by pushing air from the motor fan 6, and heat dissipation is promoted. The temperature of the cooling body 4 is monitored by the thermostat 10 in the vicinity of the semiconductor contactor 1, and when a predetermined temperature is exceeded by stopping the motor fan 6 or the like, a signal is output from the thermostat 10, such as opening of the semiconductor contactor 1. Action is taken.
[0005]
[Problems to be solved by the invention]
The conventional cooling device described above has the following problems.
(1) Since the mounting space for the motor fan input terminal block, temperature sensor, and output terminal block is secured on the top surface of the cooling body, the width of the cooling body is larger than that of semiconductor contactors (electrical equipment). Become. On the other hand, the frame of the motor fan is generally formed in a square shape. In order to attach the motor fan to the end surface of the cooling body, the outer frame shape of the cross section of the cooling body is also square. As a result, the cooling body was enlarged in size with a square cross section having one side larger than necessary. In addition, when the said installation space is provided before and behind a semiconductor contactor (right and left of FIG. 7), the length of a cooling body becomes large, and in any case, the installation area of a cooling body becomes large.
(2) The motor fan must be of a size that fits the cross-sectional dimensions of the cooling body. For the above reason, the motor fan becomes large because the cross-section of the cooling body is large, resulting in too much room for fan performance. There was waste.
(3) The cavity of the cooling body must be closed so that the cooling air does not escape. Conventionally, the cooling body is surrounded by a square outer frame. For this reason, it is difficult to form a cooling fin having a complicated shape with high cooling efficiency because the cooling body has poor molding workability. (4) Although the L-shaped mounting bracket for mounting the cooling body is fixed to the cooling body with screws, it takes a lot of man-hours to tighten a plurality of mounting brackets with screws.
An object of the present invention is to deal with the above problems and to provide a small and inexpensive cooling device at low cost.
[0006]
[Means for Solving the Problems]
The present invention provides a substrate on which a fan mounting portion is raised, and a motor fan is mounted on the fan mounting portion, and a cooling body is fixed on the substrate with one end face thereof facing the motor fan. is there. By attaching the motor fan to the fan mounting part of the board without attaching it to the end face of the cooling body, it is not always necessary to make the cross section of the cooling body square, but the motor fan is also restricted by the size of the cross section of the cooling body. However, it is possible to freely select an appropriate capacity. In that case, it is preferable to provide a gap between the motor fan and the end face of the cooling body opposite to the motor fan, thereby attracting outside air into the cavity of the cooling body through this gap and the amount of air flowing through the cooling body. And the cooling performance can be improved.
[0007]
Wherein the substrate forms up the terminal block mounting part, you will install the input terminal block of the motor fan to the terminal block mounting portion. Further, the attachment of the temperature sensor for monitoring the temperature of the pre-Symbol cooling body on the side surface of the cooling body, it will install the output terminal block of the temperature sensor to the terminal block mounting portion. As a result, it is not necessary to secure a space for attaching a terminal block and a temperature sensor on the upper surface of the cooling body to which the electric equipment is attached, so that the plane dimension of the cooling body can be accommodated in the same size as the electric equipment. Become.
[0008]
Wherein the cooling body in the above-described structure for fixing on the substrate, a cooling body with a shape that the bottom surface is open, can be closed the open surface in the substrate. The cooling body with the open bottom has good workability and can easily form cooling fins having a large heat dissipation area and a complicated shape.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, based on FIGS. 1-5, embodiment of this invention in the cooling device of a semiconductor contactor is described. Here, FIG. 1 is a side view of a cooling device with a semiconductor contactor attached, FIG. 2 is a plan view thereof, FIG. 3 is a left front view of FIG. 1, FIG. 4 is a right front view, and FIG. FIG. In addition, the same code | symbol is used for the part corresponding to a prior art example, and the overlapping description is abbreviate | omitted about substantially the same part. 1 to 4, the cooling body 4 made of an aluminum material is formed in a rectangular parallelepiped having a width substantially the same as that of the semiconductor contactor 1 and having a height slightly smaller than the width, as shown in FIG. 4. Thus, the cooling fin 4b is formed between the upper and lower two-stage cavities 4a penetrating in the axial direction. The bottom surface of the cooling body 4 is open except for a part of the left and right ends, and the vertical fins 4b facing the open surface are comb-like.
[0010]
The semiconductor contactor 1 is fastened to the upper surface of the cooling body 4 with screws 5 at four corners through a heat conductive compound (not shown) so as to be aligned with the left and right centers. And the cooling body 4 with which the semiconductor contactor 1 was attached is being fixed on the board | substrate 16 with the four screws 17 (FIG. 4). Here, the board | substrate 16 consists of a steel plate, and is comprised by the shape shown in FIG. 5 by press work. That is, in FIG. 5, the board 16 has one end of the main body 16 a that is slightly larger than that to which the cooling body 4 is attached, and a fan attachment portion 16 b to which the motor fan 6 is attached as described later. The terminal block attaching portion 16c is vertically formed by bending from the main body portion 16a.
[0011]
The board body 16a is provided with four mounting holes 18 through which the mounting screws 17 (FIG. 4) of the cooling body 4 are passed, and U-shaped holes through which screws (not shown) for fixing the board 16 to the control panel or the like are passed to the left and right edges. Two grooves 19 are provided. On the other hand, a window hole 20 into which the motor fan 6 is fitted is formed in the fan mounting portion 16b, and mounting holes 21 are provided at four corners. Further, the terminal block mounting portion 16c has an upper end cut and bent into the illustrated shape to form a horizontal mounting surface, and screw holes 22 are provided at both ends thereof.
[0012]
As shown in FIGS. 1 to 3, the motor fan 6 is applied to the fan mounting portion 16 b of the substrate 16 from the inside facing the window hole 20, and is screwed into a bolt 23 that passes through the mounting hole 21. It is tightened by a nut 24 (FIG. 1). The cooling body 4 is mounted on the board body 16a so that one end face thereof faces the motor fan 6 with a gap S (FIG. 1), and is fixed by an attachment screw 17 screwed from the bottom surface through the attachment hole 18. Has been. The screw holes to be mated with the mounting screws 17 are provided in the bottom plate 4c (FIG. 4) provided partially at the left and right ends of the bottom of the cooling body 4. When the cooling body 4 is attached to the substrate 4, the bottom open surface is closed by the substrate 4 as shown in FIG. 4.
[0013]
The upper surface of the terminal base attachment portion 16 c is fixed by the terminal block 25 having a four-pole terminal is screwed into both ends of the screw 26 threaded hole 22 (FIG. 5). The terminal block 25 is shared by the motor fan 6 and the thermostat 10, the input lead wire 6a of the motor fan 6 is connected to the left two-pole terminal in FIG. 2, and the output lead of the thermostat 10 is connected to the right two-pole terminal. The line 10a is connected. Here, the thermostat 10 is fastened to the side surface of the cooling body 4 on the same side as the terminal block 25 by a screw (not shown) adjacent to the upper surface of the cooling body 4. A name plate 27 (FIG. 1) is affixed to the outer surface of the terminal block mounting portion 16c.
[0014]
In the embodiment described above, the motor fan 6 pushes and blows air through the cavity 4a of the cooling body 4 and promotes heat dissipation of the cooling body 4 as in the conventional configuration, but the motor fan 6 is not directly on the end face of the cooling body 4. Rather, it is attached to the fan attachment portion 16b of the substrate 16 so as to face this end face. Therefore, the cross-sectional shape of the cooling body 4 does not need to be a square having the same shape as the motor fan 6, and can be determined to an arbitrary shape from the relationship with other design conditions. On the other hand, the frame size of the motor fan 6 can be freely determined from the viewpoint of the optimum capacity without being restricted by the cross-sectional size of the cooling body 4. Further, a gap S is provided between the motor fan 6 and the air inlet end surface of the cooling body 4. Therefore, as the motor fan 6 blows, ambient air is attracted through the gap S and added to the wind from the motor fan 6. Thereby, the air volume which flows through the cooling body 4 increases, and a cooling effect | action is heightened so much.
[0015]
Further, in the above embodiment, the motor fan 6 and the input / output terminal block 25 of the thermostat 10 are mounted on the terminal block mounting portion 16 c of the substrate 16, and the thermostat 10 is mounted on the side surface of the cooling body 4. Therefore, a mounting space for the terminal block and the temperature sensor is not required on the upper surface of the cooling body 4, the planar size of the cooling body 4 is accommodated to the same extent as that of the semiconductor contactor 1, and the sectional shape of the cooling body 4 for the reason described above. In combination with the fact that it is not necessary to form a square, the cooling body 4 can be miniaturized within a range that satisfies the cooling performance.
[0016]
Furthermore, since the bottom surface of the cooling body 4 can be closed by the substrate 16, a structure in which the bottom surface of the cooling body 4 is opened can be achieved. Therefore, the cooling body 4 can be easily formed, and accordingly, the cooling fins 4a can be formed into a complicated shape with a large surface area to increase the cooling efficiency, and the cooling body 4 can be further miniaturized. In the embodiment shown in FIG. 5, the terminal block mounting portion 16c is formed by bending from the substrate body 16a for the convenience of manufacturing, and an opening is formed in the substrate body 16a . Although this degree of opening is not a problem in practice, the terminal block mounting portion is formed on the side edge of the substrate 16 in the same manner as the fan mounting portion 16b, for example, so that the opening does not occur when it is desired that the wind leak from this portion. It can be bent from the part, or can be fixed separately by welding or the like. Furthermore, since the mounting groove 19 is provided in the substrate 16, it is not necessary to separately provide a mounting bracket for fixing the cooling body 4 to the control panel or the like by screwing.
[0017]
【The invention's effect】
According to the present invention, the following effects can be obtained.
(1) By providing a substrate on which a fan mounting portion is raised, mounting a motor fan on the fan mounting portion, and fixing the cooling body on the substrate with one end face thereof facing the motor fan, The cross-sectional shape of the cooling body and the frame size of the motor fan are not mutually restricted, and an appropriate cooling body cross-sectional shape and fan capacity can be selected from the viewpoint of cooling performance.
(2) By providing a gap between the motor fan and the end face of the cooling body facing the motor fan, the amount of air blown from the motor fan is increased, and the cooling performance can be improved or the motor fan can be reduced in size.
(3) A terminal block mounting part is raised and formed on the board, a motor fan input terminal block is mounted on this terminal block mounting part, and a temperature sensor for monitoring the temperature of the cooling body is mounted on the side surface of the cooling body. By attaching the output terminal block of the temperature sensor to the terminal block mounting portion, the plane size of the cooling body can be kept substantially the same as that of an electric device, and the cooling body can be downsized or the mounting area on the panel surface can be reduced. Can be planned.
(4) By making the cooling body into a shape with an open bottom surface and closing the open surface with a substrate, it is possible to improve the molding workability of the cooling body and to easily form a radiation fin having a large heat radiation area.
(5) By providing a mounting groove for fixing the cooling body to the board surface or the like on the substrate, a separate mounting bracket can be dispensed with.
[Brief description of the drawings]
FIG. 1 is a side view of a cooling device showing an embodiment of the present invention.
2 is a plan view of FIG. 1. FIG.
3 is a left front view of FIG. 1. FIG.
4 is a right side view of FIG. 1. FIG.
FIG. 5 is a perspective view of a substrate.
FIG. 6 is a side view of a cooling device showing a conventional example.
7 is a plan view of FIG. 6. FIG.
FIG. 8 is a left front view of FIG. 6;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Semiconductor contactor 4 Cooling body 4a Cavity 6 Motor fan 10 Thermostat 16 Board | substrate 16b Fan attachment part 16c Terminal block attachment part 25 Terminal block

Claims (3)

In a cooling device with a fan of an electric device that has a rectangular cross-section cooling body in which cooling air is blown in the axial direction through a cavity by a motor fan, and cools the electric device installed on the upper surface of the cooling body by heat conduction,
A substrate with a fan mounting portion raised is provided, the motor fan is mounted on the fan mounting portion, the cooling body is fixed on the substrate with one end face thereof facing the motor fan, and the substrate is mounted on the substrate. terminal block mounting portion with increased formation up the fan with the cooling device of the electric device, wherein the ever attach the input terminal block of the motor fan to the terminal block mounting portion. Is attached a temperature sensor for monitoring the temperature of the cooling body on the side surface of the cooling body, the output terminal block of the temperature sensor of the electrical device according to claim 1, characterized in that attached to the terminal block mounting portion Cooling device with fan. Before Symbol the cooling body a shape bottom is open, the fan with the cooling device for an electric apparatus according to claim 1 or claim 2, wherein the occluded the open surface in the substrate.

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