JP3514094B2 - Apparatus and method for inspecting appearance of mounting board - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board appearance inspection apparatus and an appearance inspection method for performing an appearance inspection of a mounting board on which electronic components are mounted.

[0002]

2. Description of the Related Art A mounting board on which an electronic component such as a chip is mounted is subjected to an appearance inspection in an appearance inspection line to determine the positional deviation of the electronic component and the quality of soldering.
In the visual inspection of the mounting board, a modularized inspection machine is connected for each determination unit for different inspection items, and the same mounting board is sequentially inspected by the plurality of inspection machines. By modularizing each judgment means in this way, it is possible to improve the inspection quality and efficiency by using an appropriate judgment means specialized for the function required for each inspection target item, and to inspect multiple inspection machines. By allocating the items, there is an advantage that the takt time of the appearance inspection process can be shortened.

[0003]

In the above inspection, the inspection result is output from each inspection machine by the output means, and the operator confirms and repairs the defective portion according to these output results. However, each inspection machine outputs the inspection result for each inspection machine only for the inspection item performed by each inspection machine. That is, even if the defective portion is on the same mounting board, the defective portion that is inspected and detected by a different inspection machine is to be output as a separate inspection result. For this reason, because multiple inspection results exist on the same mounting board, the defective parts of the mounting board are checked and repaired while checking the inspection results output by each inspection machine. There was a problem that it required.

Therefore, it is an object of the present invention to provide an appearance inspection apparatus and appearance inspection method for a mounting board that can easily confirm the inspection result for one mounting board even when inspected by a plurality of inspection machines.

[0005]

According to a first aspect of the present invention, there is provided a mounting board appearance inspection apparatus, comprising: first determination means mainly for determining whether or not there is an electronic component soldered to the mounting board and a positional deviation. A second determination unit that mainly determines a shape defect of a soldering unit that joins an electronic component to a mounting board; and a determination result storage unit that stores the determination results of the first determination unit and the second determination unit. An inspection result processing unit that synthesizes the determination result stored in the determination result storage unit as a single final inspection result for the same mounting board, and an output unit that outputs the final inspection result are provided.

According to a second aspect of the present invention, there is provided a method for inspecting the appearance of a mounting board, wherein the first judging means mainly judges the presence or absence of an electronic component soldered to the mounting board and the positional deviation, and the electronic part is joined to the board. A method for inspecting the appearance of a mounting board, wherein the mounting board is inspected by a plurality of judging means including a second judging means whose main judgment target is a defect of a soldering part, The determination results of a plurality of determination units including the first determination unit and the second determination unit are stored in the determination result storage unit, and the stored determination results are stored by the inspection result processing unit into a single The final inspection result is combined, and the final inspection result is output by the output means.

According to the present invention, the determination results of the plurality of determining means of the appearance inspection apparatus are stored in the determination result storage section, and the stored determination results are combined as a single final inspection result for the same mounting board. It is possible to surely and easily confirm the defective portion on one mounting board even if the inspection is performed by a plurality of inspection machines.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an electronic component mounting state inspection device according to an embodiment of the present invention, FIG. 2 is a block diagram showing a configuration of a control system of the electronic component mounting state inspection device, and FIG. FIG. 4 is a block diagram showing a configuration of a first determination unit of the mounting state inspection device, FIG. 4 is a block diagram showing a configuration of a second determination unit of the mounting state inspection device of the electronic component, and FIG. 5 is a mounting state of the electronic component. FIG. 7 is a block diagram showing a configuration of a third determination unit of the inspection device, FIG. 6 is a data table showing defective items and ranking of the mounting state inspection device of the electronic component, and FIG.
Is a table showing an image pattern of a soldering state inspection of the electronic component mounting state inspection device, and FIG. 8 is a flow chart showing a processing flow of an inspection result processing unit of the electronic component mounting state inspection device.

First, the structure of an electronic component mounting state inspection apparatus will be described with reference to FIG. In FIG. 1, an electronic component mounting state inspection apparatus 1 is composed of two modules, a first inspection machine 2A and a second inspection machine 2B. A movable table 6A is arranged on a base 5A of the first inspection machine 2A, and a substrate holding portion 7A is placed on the movable table 6A. The board holding portion 7A holds the mounting board 3 on which a large number of electronic components 4 are mounted. The mounting substrate 3 is horizontally moved and positioned by driving the movable table 6A.

Conveyor units 8A and 9A are arranged on both sides of the substrate holder 7A. Conveyor unit 8A
Carries the mounting board 3 into the board holding section 7A, and the conveyor unit 9A carries out the mounted board 3 after the inspection from the board holding section 7A. The first imaging unit 10 is provided above the substrate holding unit 7A.
Is provided. The first imaging unit 10 includes a color camera 11, a lens barrel 12, and a dome-shaped illumination unit 13. The first imaging unit 10 captures a color image of the mounting board 3. With this color image, the presence or absence of the electronic component 4 and the positional deviation are detected by utilizing the difference in color between the substrate surface and the electronic component 4.

A second inspection machine 2B is arranged adjacent to the first inspection machine 2A. The second inspection machine 2B includes a base 5B, a movable table 6B, a substrate holding portion 7B, and conveyor units 8B and 9B, like the first inspection machine 2A. The second imaging unit 20 is arranged above the substrate holding unit 6B. The second image capturing section 20 includes a monochrome camera 21, and the monochrome camera 21 captures an image of the mounting board 3 illuminated by a multi-stage illumination section 23 configured by arranging a large number of LEDs via a lens barrel 22. . The monochrome image thus obtained is used for the inspection of the soldered portion of the electronic component 4.

The second image pickup section 20 has four PSDs.
24 are arranged in north, south, east, and west with the mounting substrate 3 as the center with the light-receiving surface facing obliquely downward. A laser light source 25 and a scanner 26 are provided on the side surface of the lens barrel 22. The laser light emitted by the laser light source 25 is used by the half mirror 2
It is irradiated downward by 7 and reflected on the mounting substrate 3. By receiving the reflected light by the four PSDs 24, the height of the irradiation point of the laser light on the mounting substrate 3 can be obtained, and a defect such as floating of the electronic component 4 is detected based on the height measurement value. To do. By driving the scanner 26, the irradiation point of the laser beam can be moved to a desired position on the mounting board 3, and thus the floating of each electronic component 4 can be detected.

Next, the configuration of the control system of the mounting state inspection device for the electronic component 4 will be described with reference to FIG. In FIG. 2, a broken line frame 2A indicates a range included in the first inspection machine 2A, and a line frame 2B indicates a range included in the second inspection machine 2B. The first determination unit 31 utilizes the color difference between the substrate surface and the electronic component 4 based on the imaged data of the color camera 11 so that the electronic component 4 is out of stock, the component is different, the polarity (direction) is different, the position is displaced, and the like. Detect defects. First determination unit 31
The color camera 11 constitutes a first judging means.

The second determination section 32 inspects the soldering section of the electronic component 4 based on the image data of the monochrome camera 21,
That is, excessive solder, excessive solder, no solder, defects in the soldered portion such as a bridge are detected. The second determination unit 32 and the monochrome camera 21 form a second determination unit. In addition, the third determination unit 33 obtains the height of the inspection target point based on the output of the laser reflected light received by the four PSDs 24, and based on the height measurement result, the electronic component 4 such as the floating of the electronic component 4 is detected. Detect defects in height. The third determination unit 33 and the PSD 24 form a third determination unit. The control unit 34 is a CPU, and controls the entire operation of the mounting state inspection device 1 for the electronic component 4.

The first storage unit 41 is a determination result storage unit, and stores the determination results output by the first determination unit 31, the second determination unit 32, and the third determination unit 33. The second storage unit 42 stores ranking data for each item set in advance according to the importance of the inspection item, the usefulness of the display, and the like. Here, the ranking data set according to the type of defect and the severity of the defect will be described with reference to FIG. As shown in the defect item table of FIG. 6, the types shown in the left column of the defect data table are set as items that are determined to be defective by the visual inspection, and a defect code is assigned to each defect type. Has been done. In the failure result information output from each determination unit, the type of failure is specified by this failure code.

As shown in the right column of the table of FIG. 6, each defect type is ranked in six stages from A to F. This ranking is based on the importance of defect content and the usefulness of defect display, that is, when multiple defect results are displayed.
It is determined from the viewpoint of which defective display has a substantial meaning. For example, in the example in which the defective result of the defective product and the defective result of the solder shape which are output when the electronic component 4 is not present at the position where the electronic component 4 should exist, are present at the same time with respect to the same electronic component 4, the electronic component 4 is not present in the solder. Displaying a defective shape is meaningless and is not useful.

In order to avoid outputting such a meaningless inspection result that is not useful, when there are a plurality of pieces of defect result information for the same electronic component 4, the defect is meaningless. The result information is selected by the inspection result processing unit 44 with reference to the ranking data.

The inspection data stored in the first storage unit 41 is subjected to processing such as selection and deletion by the inspection result processing unit 44 on the basis of the ranking data in the second storage unit 42. , The same mounting board is combined as a single final inspection result, and the final inspection result is stored in the third storage unit 43. This eliminates the need to refer to a plurality of inspection results for the same practical substrate 3 when repairing a defective portion.

The input means 45 is a keyboard or the like, and inputs the ranked data set in the second storage section 42 and other operation inputs. The display unit 46 is a monitor,
The final inspection result is displayed. The printer 47 prints out the final inspection result and the like. That is, the display unit 46 and the printer 47 are output means for outputting the final inspection result.

Next, the first judging section 31 will be described with reference to FIG. In the first determination unit 31, the color camera 1
The image data of the inspection target imaged by 1 is stored in the image storage unit 31a, and the image data is processed by each inspection processing unit described below, and the defect result information including the determination result is output.

The out-of-stock inspection processing section 31b inspects whether or not the electronic component 4 is present at the inspection position. The component size inspection processing unit 31c detects the size of the electronic component 4 and inspects whether the electronic component 4 is the correct electronic component 4. The front / back inversion inspection processing unit 31d inspects whether the detected front / back of the electronic component 4 is properly mounted. The polarity inspection processing unit 31e inspects whether the polarity of the electronic component 4, that is, the mounting direction is correct. The misalignment inspection processing section 31f inspects whether or not the electronic component 4 is displaced beyond an allowable value.

The defect result information output from the first judging section 31 will be described. As shown in FIG. 3, the failure result information includes a board code, a component code, a failure code,
It consists of a pin number and a judgment type code. The board code is information that identifies the mounting board 3 to be inspected, the component code is information that identifies the electronic component 4 on the mounting board, the failure code is information that indicates the determined failure type, and the pin number is the electronic component with lead 4 Is output only in the case of
It is information indicating which of the leads has a defect.
The determination type code indicates which determination unit has determined and output the defect result information. The defect result information is output to the second determination unit 32 and the third determination unit 33 with the same configuration.

Next, referring to FIGS. 4 and 7, the second judging section 3
2 will be described. In FIG. 4, the monochrome camera 2
The image pickup data picked up by No. 1 is stored in the image storage unit 32a, and then the shape of the solder fillet of the soldering portion is inspected by the solder portion inspection processing unit 32b. Here, Fig. 7
As shown in FIG. 4, the images of the solder fillets in the solder inspection windows 48, 48 ′ set in the obtained image of the electronic component 4 are compared with reference patterns indicating normal and defective states of the solder fillets. By doing so, it is determined whether it is normal, or there is excess solder, insufficient solder, or no solder. As shown in FIG. 7, these reference patterns are set according to the types of chip parts and leaded parts. In addition, in the case of a leaded component, the bridge inspection processing unit 32c inspects the presence or absence of a solder bridge that flows at the time of melting and connects to the solder of the adjacent lead to short-circuit the leads.

Next, the third judging section 33 will be described with reference to FIG. In the third determination unit 33, the outputs of the four PSDs 24 obtained by irradiating the measurement target point of the electronic component 4 with the laser light are stored in the height information storage unit 33a, and then the height information is stored in the height information storage unit 33a. Based on the floating inspection processing unit 33b, it is inspected whether or not the measurement target point of the electronic component 4 is floating.

Next, the processing performed by the inspection result processing unit 44 will be described with reference to the flow of FIG. First, the defect result information regarding the mounting board 3 for which the inspection is completed is read from the first storage unit 41 (ST1). Here, it is determined whether there is defect result information (ST2), the process is terminated if there is no defect result information, and if there is defect result information, then there is a plurality of defect result information for one electronic component 4. It is determined whether or not (ST3). When there are a plurality of pieces of defect result information, the defect result information is sorted out by referring to the ranked data set according to the above-mentioned defect severity (S).
T4). Next, the failure result information selected in this manner, or the failure result information when only one electronic component 4 exists in ST3, is used as a single final inspection result for each mounting board. The combination processing is performed (ST5) and the result is stored in the third storage unit 43 (ST6). A series of these processes is executed every time all the inspections of one mounting board 3 are completed.

The mounting state inspection apparatus for the electronic component 4 is constructed as described above, and the mounting state inspection for the electronic component 4 using this inspection apparatus will be described below. First, in FIG. 1, the mounting substrate 3 is carried into the substrate holding portion 7A by the conveyor unit 8A of the first inspection machine 2A. Next, the movable table 5A is driven to position the mounting substrate 3 with respect to the first imaging unit 10.

Thereafter, the inspection items such as the presence or absence of the electronic component 4 to be inspected and the positional deviation are inspected and determined by the first determining means. The defect result information that is inspected and determined to be defective is stored in the first storage unit 41. Then, when the inspection of all electronic components 4 to be inspected on the same mounting board 3 is completed, the mounting board 3 is carried out from the board holding portion 7A and transferred to the second inspection machine 2B by the conveyor unit 9A. Next, the mounting board 3 carried into the board holding portion 7B is inspected by the second judging means for the inspection items relating to the soldering portion, and the third judging means is inspected for the floating of the electronic component 4. After that, the mounting board 3 for which the inspection is completed is carried out by the conveyor unit 9B. The defect result information determined to be defective in these inspections is similarly stored in the first storage unit 41.

The defect result information stored in the first storage unit 41 is selected by the inspection result processing unit 44 according to the ranking of importance and the like, and includes only the selected defect item, and further the same mounting board 3 For the third storage unit 4, the defect result information synthesized as a single final inspection result for
3 is stored. These final inspection results are displayed on the display unit 46 or printed out by the printer 47 as needed.

The content of the final inspection result output in this way is only useful defect result information after meaningless defect result information is deleted, and it is easy to see that excess data has been erased. There is. Further, since the single inspection result is arranged for each mounting board, it is possible to surely and easily carry out confirmation of a defective portion of the same mounting board without redundant labor.

As described above, the appearance inspection apparatus is configured by connecting a plurality of inspection machines each having a judgment means whose function is specialized according to the inspection object, and the judgment result output from each judgment means is temporarily determined. The following effects can be obtained by adding the function of randomly storing and then collectively processing and organizing the judgment results.

First, in the case where inspections are sequentially carried out by a plurality of judging means, the judgment result is finally selected according to the judgment criteria of the significance of the defective contents and the usefulness of the displayed contents, so that the operator is meaningless. It is possible to obtain inspection results in which information is deleted and arranged, and repair efficiency can be improved. In addition, regardless of the order in which the mounting boards are inspected by each judging means, the finalized inspection results having the same contents are always output, so that the degree of freedom in setting the order of mounting the mounting boards on a plurality of inspection machines is increased. Therefore, the process control becomes easy. Further, since the same mounting board is combined and output as a single final inspection result by the inspection result processing unit, duplicate labor is not required when confirming a defective portion of one mounting board.

[0032]

According to the present invention, the determination results of a plurality of determining means of the appearance inspection apparatus are stored in the determination result storage section, and the stored determination results are used as a single final inspection result for the same mounting board. Since it is composed and output,
Even when the mounting board is inspected by a plurality of inspection machines having different determining means, it is possible to easily confirm the defective portion while looking at the inspection results arranged for each mounting board.

[Brief description of drawings]

FIG. 1 is a front view of an electronic component mounting state inspection device according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a configuration of a control system of the electronic component mounting state inspection device according to the embodiment of the present invention.

FIG. 3 is a block diagram showing a configuration of a first determination unit of the electronic component mounting state inspection device according to the embodiment of the present invention.

FIG. 4 is a block diagram showing a configuration of a second determination unit of the electronic component mounting state inspection device according to the embodiment of the present invention.

FIG. 5 is a block diagram showing the configuration of a third determination unit of the electronic component mounting state inspection device according to the embodiment of the present invention.

FIG. 6 is a diagram showing defective items and ranking of the electronic component mounting state inspection device according to the embodiment of the present invention.

FIG. 7 is a diagram showing an image pattern of a soldering state inspection of an electronic component mounting state inspection device according to an embodiment of the present invention.

FIG. 8 is a flowchart showing a processing flow of an inspection result processing unit of the electronic component mounting state inspection device according to the embodiment of the present invention.

[Explanation of symbols]

1 Visual inspection device 2A First inspection machine 2B Second inspection machine 3 mounting board 4 electronic components 6A, 6B movable table 7A, 7B substrate holder 10 First imaging unit 11 color camera 20 Second imaging unit 21 monochrome camera 24 PSD 31 First determination unit 32 Second determination unit 33 Third determination unit 34 Control unit 41 First Storage 42 Second storage unit

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masahiro Kihara 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Keiji Yano 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (56) References JP-A-9-260898 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G01B 11/00-11/30 H05K 13/04

Claims (2)

(57) [Claims] 1. A first determining means mainly for determining whether or not an electronic component is soldered to a mounting board and a positional deviation, and a shape defect of a soldering part for joining the electronic component to the mounting board. A second determination unit to be determined, a determination result storage unit that stores the determination results of the first determination unit and the second determination unit, and the determination results stored in the determination result storage unit are the same mounting board. The mounting board appearance inspection device, comprising: an inspection result processing unit that performs a combination process as a single final inspection result for the above; and an output unit that outputs the final inspection result. 2. A first determination means mainly for determining whether or not an electronic component is soldered to a mounting board and a positional deviation, and a main determination target for a defect of a soldering part for joining the electronic component to the board. A mounting board appearance inspection method for inspecting a mounting board by a plurality of judging means including a second judging means for judging whether each judgment object is good or bad, the first judging means and the second judging means. The determination results of the plurality of determination means including the means are stored in the determination result storage unit, and the stored determination results are combined into a single final inspection result for the same mounting board by the inspection result processing unit, and this final inspection is performed. An appearance inspection method for a mounting board, wherein the result is output by an output means.