JP3508990B2 - Optical element mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [0001] [0001] 1. Field of the Invention [0002] The present invention relates to hybrid optical integration
Regarding the structure of the optical element mounting part for mounting the optical element on the substrate,
The temperature of the optical device mounted on the integrated optical
Control by the heat generated by the heater formed on the plate
It is like that. [0002] 2. Description of the Related Art An optical device on a hybrid optical integrated substrate is realized.
FIGS. 13 to 16 show a conventional optical element mounting structure.
It will be described based on the following. FIG. 13 shows an optical device using a thin solder film.
FIG. 14 is a perspective view showing the mounting portion structure.
The view from the arrow V is shown. As shown in FIG. 1, a substrate 1 made of silicon is used.
A cladding layer 2 made of quartz glass and embedded therein
An optical waveguide comprising a core layer 3 is formed, and a substrate 1
A terrace structure 4 is formed, and an element including an upper portion of the terrace structure 4 is formed.
The clad layer on the child mounting part and electrical wiring part has been removed.
You. Further, the electrode 5 and the half are covered so as to cover the upper surface of the terrace structure 4.
The field film 6 is formed in this order, and the electrode 5
It is electrically connected outside. For semiconductor optical devices, see the device table
Terrace so as to be in contact with electrode 8 and solder film 6 formed on the surface
It is fixed on the structure 4. At this time, the active layer of the semiconductor element
9 so that the height of the core layer 3 coincides with that of the terrace structure 4.
Height is machined. FIG. 15 shows an optical device mounting using solder bumps.
FIG. 16 is a perspective view showing a partial structure, and FIG.
A line arrow is shown. The members shown in FIGS.
The same members as those described above are denoted by the same reference numerals. As shown in FIG. 1, a substrate 1 made of silicon
A cladding layer 2 made of quartz glass and embedded therein
An optical waveguide comprising a core layer 3 is formed, and a substrate 1
A terrace structure 4 is formed, and at least two terrace structures 4 are formed.
The recess 11 is formed so as to be divided into two regions. Ma
In addition, the element mounting part including the upper part of the terrace structure 4 and the electric wiring part
Of the terrace structure 4 is higher than the upper surface of the terrace structure 4.
Has been removed to be lower. Further, the recess 11
An electrode 5 is formed on the surface of the lad,
5 is provided with an opening so that a part of the glass 5 is exposed.
A film 12 is formed. Covers the opening of the glass thin film 12
The electrodes 13 are formed so that the solder bumps
The electrode 5 is electrically connected to the outside of the element mounting portion.
It is connected. The semiconductor optical device 7 is formed on the surface of the device.
So that the electrode 8 is in contact with the solder bump 14.
It is fixed on the structure 4. At this time, the active layer 9 of the semiconductor element
So that the height of the core layer 3 matches the height of the terrace structure 4.
Height is machined. In the structure of the optical element mounting structure described above,
The position of the semiconductor element in the plane direction is optically
After positioning in the bonding direction, mount the semiconductor element
To the part. Thereby, the active layer 9 of the semiconductor element,
While optically coupling the core layer 3 of the glass waveguide,
Optical element mounting that enables electrical connection between the substrate 1
The function of the unit can be realized. [0008] However, FIG.
In the conventional optical element mounting portion structure shown in FIG.
If multiple optical elements are mounted on the board, the temperature of the optical
There is a problem that it is difficult to control
Was. The present invention has been made in view of the above situation.
Light that can control the temperature of each mounted optical element
It is an object to provide an element mounting structure. [0010] [Means for Solving the Problems]In the present invention,Optical waveguide
The optical element mounting part and the electrical wiring part are provided on the same substrate.
Optical element mounting board, and the optical element mounting portion is
The first insulator, the heater, and the second insulator are stacked in this order.
Electrodes and solder film in this order to cover the top of the heater.
When the solder film and the optical element are electrically connected,
The electrodes and heater are electrically wired outside the optical element mounting part
It is characterized by having been done. [0011],lightWaveguide section, optical element mounting section and electrical distribution
The line part is an optical element mounting substrate provided on the same substrate.
Therefore, the substrate of the optical element mounting part has a convex
A terrace and a recess that divides the terrace into two regions are formed
In the recess, the first insulator, the heater,
A second insulator is laminated and covers the terrace and the upper surface of the concave portion
The electrodes and the solder film are laminated in this order,
The electrodes and the heater are connected
It is electrically wired outside the child mounting part.
You. [0012]UpClaims to achieve the stated purpose1Pertain to
The configuration of the present invention includes:Optical waveguide, optical element mounting part, and electrical wiring part
Is an optical element mounting substrate provided on the same substrate,
On the substrate of the optical element mounting part, a tape with a flat top is formed.
A concave portion that divides the lath portion and the terrace portion into two regions is formed.
The surface of the terrace is in contact with a part of the optical element.
The optical element is mounted on the
First insulator, heater, second insulator, electrode
Are stacked, while one of the electrodes is recessed on the electrode.
The third insulator with the opening formed so that the portion appears
Layer, including an opening in the third insulator, and from the opening
A second electrode is formed so as to cover a large area,
A solder film is formed so as to cover the second electrode, and the solder film is
So that the active layer of the optical device is placed on top of the device.
Pneumatically connected, electrodes and heater mounted optical element
Is electrically wired outside the unitIt is characterized by the following. [0013] BEST MODE FOR CARRYING OUT THE INVENTIONExample of this embodimentOptical element mounting part by
In the structure, an insulator made of, for example, glass formed on a substrate
A heater is formed on the surface of the edge layer, and the heater
It has a structure in which a solder film is formed on the top with an insulating layer and electrodes
are doing. [0014]Example of this embodimentDue to the optical element mounting structure
If you fix the optical element on the solder film, heat the heater
Then, heat is transmitted to the solder film through the insulating layer,
The temperature can be raised. Some of the semiconductor optical devices are
Also contacts the solder film formed on the insulating layer away from the heater
The heat from the heater and the
The generated heat is radiated to the board from the solder away from the heater
Is done. Therefore, depending on the intensity of the current flowing through the heater,
The temperature of the part directly above the heater of the element
Is possible. Also, when mounting multiple elements,
Mounts thermal resistance from the board to the package that fixes it
By making the thermal resistance between the parts sufficiently smaller than the
Temperature of each element while suppressing heat
Can be controlled separately. [0016]In addition, this embodiment exampleOptical element mounting structure
In order to determine the position of the optical element in the height direction,
Part of the terrace structure processed into, for example, glass
A recess filled with the insulator layer is formed, and the surface of the insulator layer is formed.
A heater is formed, and an insulating layer is formed on the heater.
It has a structure in which a solder film is formed via electrodes. [0017]Example of this embodimentDue to the optical element mounting structure
If you fix the optical element on the solder film, heat the heater
Then, heat is transmitted to the inert film through the insulating layer, and the optical element
The temperature can be raised. Some semiconductor optical devices are
Since it also contacts the solder film formed on the glass, the heater
Heat from the device and heat generated in the device
Heat is radiated from the upper solder to the board. Therefore, the intensity of the current flowing through the heater depends on the intensity of the current.
The temperature of the part directly above the heater of the element
Is possible. At this time, compared to the first aspect, the device
Because the thermal resistance at the part where the
It is possible to quickly lower the temperature. Also, billing
A plurality of elements are mounted on the same substrate as in the invention of Item 1.
Even if the temperature of each element is controlled individually
Can be. [0019]BookIn the optical element mounting structure according to the invention, the solder
Heat the heater after fixing the optical element on the bump
Heat is transmitted to the solder bumps through the insulating layer,
You can increase the degree. Similar to the second aspect of the present invention,
Since some of the optical waveguide elements also touch the terrace,
The heat applied from the heater and the heat generated in the device
Heat is radiated from the contact surface between the semiconductor optical device and the semiconductor device. Therefore, depending on the intensity of the current flowing through the heater,
The temperature of the part directly above the heater of the element
Is possible. At this time, compared to the first aspect, the device
The lower the thermal resistance between the and the terrace, the lower the temperature faster
It is possible to lower. Further, the same as in the first aspect of the present invention.
Similarly, when multiple devices are mounted on the same substrate,
The temperature of each element can be controlled individually. (Embodiment 1) First Embodiment of Optical Device Mounting Structure of the Present InventionExample1 and 2
It will be described based on. FIG. 1 shows a first embodiment of the present invention.
FIG. 2 shows a perspective view of the optical element mounting structure, and FIG.
The view from the arrow I is shown. In addition, as shown in FIGS.
The same members as the members are denoted by the same reference numerals. As shown in FIG.
As a first insulator made of glass on a substrate 1
An optical waveguide consisting of the cladding layer 2 and the core layer 3 is formed,
The glass layer in the area of the mounting portion has the core exposed at the end face, and
The height of the core layer 3 matches the height of the active layer 9 of the mounted optical element.
Has been removed. Further, the cladding layer 2 of the mounting portion
On top, for example, a heater 15 made of a thin film metal is formed.
The heater 15 is made of, for example, glass.
An insulating layer 16 as a second insulator is formed. For example, to cover the upper surface of the heater 15,
For example, an electrode 5 made of gold and a solder film made of eutectic of gold and tin
6 are stacked in this order, and the electrode 5 is arranged outside the mounting portion.
Is lined. For example, half a laser diode
In the conductive optical element 7, the electrode layer 8 comes into contact with the solder and emits light.
The active layer 9, which is a portion, is disposed above the heater 15.
Then, the emitted light is optically coupled to the core layer 3.
The semiconductor optical element 7 is mounted on a mounting section. The structure of the optical element mounting portion of the first embodiment having the above configuration.
According to the above, by passing a current through the heater 15,
It is possible to raise the temperature of the solder film 6 of the electrode 5 through the layer 16.
Can be. As a result, the semiconductor mounted on the solder film 6
The function of changing the temperature of the active layer 9 of the body light element 7
realizable. At this time, the lower surface of the heater 15 has a thermal resistance.
Since there is a cladding layer 2 made of glass having a large
The heat generated by the heater 15 is effective without escaping to the substrate 1.
The temperature of the optical element can be raised efficiently. Also this
The effect of increasing the temperature is limited to a region near the heater 15.
Therefore, when a plurality of optical element mounting structures exist on the substrate 1,
Also, the temperature of the active layer 9 of each semiconductor optical device 7 is independent.
It also has the effect of changing (Embodiment 2) Second Embodiment of Optical Device Mounting Structure of the Present InventionExample3 and 4
It will be described based on. FIG. 3 shows a second embodiment of the present invention.
FIG. 4 is a perspective view of the optical element mounting structure, and FIG.
The view from the arrow V is shown. 1 and 2 and FIGS.
The same members as those shown in FIG.
You. As shown in FIG.
As a first insulator made of glass on a substrate 1
A glass layer 19 is formed. Furthermore, optical fiber 1
7 and the active layer 9 of the mounted semiconductor optical device 7 are optically coupled.
V-shaped grooves 18 are formed on the substrate 1 so that
The optical fiber 17 for guiding light to the V-shaped groove 18 is
Fixed. On the glass layer 19, for example, a thin film
A heater 15 made of metal is formed.
Part 15 is wired in a region outside the element mounting portion.
An insulating layer 16 as a second insulator is provided on the heater 15.
Is formed. For example, to cover the upper surface of the heater 15,
For example, an electrode 5 made of gold and a solder film made of eutectic of gold and tin
6 are stacked in this order, and the electrode 5 is arranged outside the mounting portion.
Is lined. For example, half a laser diode
In the conductive optical element 7, the electrode layer 8 comes into contact with the solder and emits light.
The active layer 9, which is a portion, is disposed above the heater 15.
Then, the emitted light is coupled to the optical fiber 17.
The semiconductor optical element 7 is mounted on a mounting section. The optical element mounting part structure of the second embodiment having the above configuration.
According to the above, by passing a current through the heater 15,
It is possible to raise the temperature of the solder film 6 of the electrode 5 through the layer 16.
Can be. As a result, the semiconductor mounted on the solder film 6
The function of changing the temperature of the active layer 9 of the body light element 7
realizable. At this time, the lower surface of the heater 15 has a thermal resistance.
Since there is a glass layer 19 made of glass having a large
The heat generated by the heater 15 is effective without escaping to the substrate 1.
The temperature of the optical element can be raised efficiently. Also this
The temperature rise effect is such that the back surface of the substrate 1 has a constant temperature.
Is limited to the area near the heater 15
Therefore, a plurality of optical element mounting structures exist on the substrate 1.
However, the temperature of the active layer 9 of each semiconductor optical
There is also the effect of changing it upright. (Embodiment 3) Third Embodiment of Optical Device Mounting Structure of the Present InventionExample5 and 6
It will be described based on. FIG. 5 shows a third embodiment of the present invention.
FIG. 6 shows a perspective view of the optical element mounting structure, and FIG.
The view from the arrow I is shown. 1 to 4 and FIG.
The same members as those shown in FIG.
is there. As shown in FIG.
On the substrate 1 as a terrace with a flat top
Terrace structure 4 is formed, and the terrace structure 4 is divided into two regions.
A concave portion 11 is provided. Furthermore, from glass
From the clad layer 2 and the core layer 3 as the first insulator
Is formed, and the upper surface of the terrace structure 4 is
The upper part of the cladding layer 2 has been removed so as to appear. K
On the lad layer 2, for example, a heater made of a thin film metal
15 is formed, and a part of the heater 15 has a terrace structure 4.
Are wired in the area outside On the heater 15, for example, glass
An insulating layer 16 is formed as a second insulator made of
So as to cover the upper surface of the heater 15 and the upper surface of the terrace structure 4.
For example, the electrode 5 made of gold and the half made of eutectic of gold and tin are used.
The film 6 is laminated in this order, and the electrode 5 is located outside the mounting portion.
It is wired to. For example, from a laser diode
The semiconductor optical device 7 has the electrode layer 8 in contact with the solder, and
An active layer 9 serving as a light emitting unit is disposed above the heater 15.
You. Here, the height of the surface of the terrace structure 4 is
The height of the active layer 9 and the core layer 3 of the semiconductor optical device 7 to be mounted is
Since they are formed so as to coincide with each other,
Features that optical coupling between optical element and core layer is easy
There is. The structure of the optical element mounting portion of the third embodiment having the above configuration.
According to the above, by passing a current through the heater 15,
The temperature of the electrode 5 and the solder film 6 on the recess 11 through the layer 16 is
Can be raised. As a result, the board is mounted on the solder film 6.
Changing the temperature of the active layer 9 of the mounted semiconductor optical device 7
Function can be realized. At this time, the lower surface of the heater 15
Has a clad layer 2 made of glass having a large thermal resistance
Therefore, the heat generated by the heater 15 is released to the substrate 1.
The temperature of the optical element can be raised efficiently without the need.
The effect of the temperature rise is that the rear surface of the substrate 1 has a constant temperature.
If it is cooled so that
Since it is limited to the area, a plurality of optical element mounting structures
The active layer 9 of each semiconductor optical device 7 is
There is also an effect of independently changing the temperature. In addition, terrace construction
Since part of the optical element is in contact with the surface of structure 4,
The speed of the element can be reduced quickly compared to 1 and 2.
You. (Embodiment 4) Fourth embodiment of the optical element mounting structure of the present inventionExample7 and 8
It will be described based on. FIG. 7 shows a fourth embodiment of the present invention.
8 is a perspective view of the optical element mounting structure, and FIG.
-VIII line is shown. 1 to 6 and FIG.
The same members as those shown in FIGS.
I have. As shown in FIG.
On the substrate 1 as a terrace with a flat top
Terrace structure 4 is formed, and the terrace structure 4 is divided into two regions.
A concave portion 11 is provided. Also, optical fiber
-17 and the active layer 9 of the mounted semiconductor optical device 7 are optically
A V-shaped groove 18 processed to be connected is formed on the substrate 1.
And an optical fiber 1 for guiding light to the V-shaped groove 18.
7 is fixed. Also, the V-shaped groove 18 is exposed and
Of glass so that the upper surface of the metal structure 4 appears on the surface.
A glass layer 19 as an insulator is formed. Further, on the glass layer 19 of the concave portion 11,
For example, a heater 15 made of a thin-film metal is formed,
A part of the heater 15 is wired in an area outside the terrace structure 4.
ing. Above the heater 15, an insulator as a second insulator
An edge layer 16 is formed, and an upper surface of the heater 15 and a terrace structure are formed.
The electrode 5 made of, for example, gold and
A solder film 6 made of a eutectic of gold and tin is laminated in this order.
The electrode 5 is wired outside the mounting section. For example,
The semiconductor optical element 7 composed of a laser diode has an electrode layer 8
Is in contact with the solder, and the active layer 9 as a light emitting portion is a heater.
-15. The emitted light is
The semiconductor optical element 7 is mounted on the mounting portion so as to be coupled to the fiber 17.
Mounted on The structure of the optical element mounting portion of the fourth embodiment having the above configuration.
According to the third embodiment, the same effect as that of the third embodiment is realized, and
Instead of the optical waveguide formed on the plate 1, V
Optical fiber 17 and semi-conductor fixed using groove 18
The operation and effect of optically coupling the body light element 7 are provided.
You. (Embodiment 5) Fifth Embodiment of Optical Device Mounting Structure of the Present InventionExample9 and 1
Description will be made based on 0. FIG. 9 shows a fifth embodiment of the present invention.
FIG. 10 shows a perspective view of such an optical element mounting portion structure.
X-X line view is shown. 1 to 8 and FIG.
The same members as those shown in FIGS.
It is. As shown in FIG.
On the substrate 1 as a terrace with a flat top
Terrace structure 4 is formed, and the terrace structure 4 is divided into two regions.
A concave portion 11 is provided. Furthermore, from glass
From the clad layer 2 and the core layer 3 as the first insulator
Is formed, and the upper surface of the terrace structure 4 is
The upper part of the cladding layer 2 has been removed so as to appear. Depression
On the cladding layer 2 of the part 11, for example,
Heater 15 is formed, and a part of the heater 15 is
The wiring is provided in a region outside the lath structure 4. On the heater 15 as a second insulator
The insulating layer 16 is formed to cover the upper surface of the heater 15.
Thus, for example, the electrode 5 made of gold is formed, and the electrode 5 is
It is wired outside the terrace structure 4. On the surface of the electrode 5
Is, for example, an insulating film made of glass as a third insulator
12 are laminated, and the insulating film 12
Are formed so as to be partially exposed. Further, the electrode 5
To completely cover the exposed area of, for example, Ti, Pt, Au
Are deposited in this order to form a second electrode 13.
You. On the surface of the second electrode 13, for example, a eutectic of gold and tin
A solder bump 14 is formed as a solder film made of solder.
ing. On the other hand, for example, a laser diode
The electrode layer 8 formed on the surface of the semiconductor optical device 7
The active layer 9 that is in contact with the pump 14 and is
The semiconductor optical device 7 is arranged above the
It is installed. Here, the height of the surface of the terrace structure 4
Corresponds to the active layer 9 of the semiconductor optical element 7 mounted thereon.
A is formed so that the height of the
The optical coupling between the optical element and the core layer is shorter than in Examples 1 and 2.
There is a feature of pan. The structure of the optical element mounting portion of the fifth embodiment having the above configuration.
According to the above, by passing a current through the heater 15,
The electrode 5 and the second electrode 13 on the recess 11 through the layer 16;
In addition, the temperature of the solder bump 14 can be increased.
As a result, the semiconductor optical element mounted on the solder bump 14
The function of changing the temperature of the active layer 9 of the element 7 is realized.
Wear. At this time, the lower surface of the heater 15 has a large thermal resistance.
Since there is a cladding layer 2 made of glass, the heater
Efficiently without escaping the heat generated in step 15 to the substrate 1
The temperature of the optical element can be increased. Also, on this temperature
The ascending effect is to cool the surface of the substrate 1 to a constant temperature.
Is limited to the area near the heater 15.
Therefore, even if a plurality of optical element mounting structures exist on the substrate 1,
The temperature of the active layer 9 of each semiconductor optical device 7 is changed independently.
There is also an effect to make it. In addition, the surface of the terrace structure 4
Since some of the elements are in contact with each other,
Can be quickly reduced. (Embodiment 6) Sixth embodiment of the optical element mounting structure of the present inventionExampleFIG. 11, FIG.
12 will be described. FIG. 11 shows a sixth embodiment of the present invention.
FIG. 12 shows a perspective view of an optical element mounting structure according to an example.
The XII-XII line in FIG. 1 to 1
0 and the same members as those shown in FIGS.
One symbol is attached. As shown in FIG.
On the substrate 1 as a terrace with a flat top
Terrace structure 4 is formed, and the terrace structure 4 is divided into two regions.
A concave portion 11 is provided. Also, optical fiber
The active layer 9 of the semiconductor optical device 7 after mounting the
A V-shaped groove 18 processed to be connected is formed on the substrate 1.
And an optical fiber 1 for guiding light to the V-shaped groove 18.
7 is fixed. Also, the V-shaped groove 18 is exposed and
Of glass so that the upper surface of the metal structure 4 appears on the surface.
A glass layer 19 as an insulator is formed. Further, on the glass layer 19 of the concave portion 11,
For example, a heater 15 made of a thin-film metal is formed,
A part of the heater 15 is wired in an area outside the terrace structure 4.
ing. Above the heater 15, an insulator as a second insulator
An edge layer 16 is formed so as to cover the upper surface of the heater 15.
Then, an electrode 5 made of, for example, gold is formed, and the electrode 5 is
The wiring is provided in a region outside the lath structure 4. The surface of the electrode 5 is made of, for example, glass.
An insulating film 12 as a third insulator is laminated, and the insulating film 1
2 is formed so that a part of the electrode 5 is exposed in the recess 11.
It is made. Further, the exposed area of the electrode 5 is completely covered.
As described above, for example, the first layer of Ti, Pt, Au
Two electrodes 13 are formed. Surface of second electrode 13
For example, as a solder film made of eutectic solder of gold and tin
Are formed. On the other hand, for example, a laser diode
The electrode layer 8 formed on the surface of the semiconductor optical device 7
The active layer 9 that is in contact with the pump 14 and is
The semiconductor optical element 7 is arranged above the
It is installed. Here, the height of the surface of the terrace structure 4
Corresponds to the active layer 9 of the semiconductor optical element 7 mounted thereon.
A is formed so that the height of the
The optical coupling between the optical element and the core layer is shorter than in Examples 1 and 2.
There is a feature of pan. The structure of the optical element mounting portion of the sixth embodiment having the above configuration.
According to the present embodiment, the same effect as that of the fifth embodiment is realized, and
Instead of the optical waveguide formed on the plate 1, V
Optical fiber 17 and semi-conductor fixed using groove 18
The operation and effect of optically coupling the body light element 7 are provided.
You. [0048]Of the above embodimentThe optical element mounting structure is
Forming a first insulator on the plate, on which a heater,
A structure in which a second insulator, an electrode, and a solder film are laminated in this order
Having an optical waveguide formed on a substrate or a substrate.
The optical fiber fixed to the V-groove for guide and mounted on the substrate
Of the insulating layer so that the output light of the semiconductor optical device
Since the height is processed, the active layer is located just above the heater
Flip chip bonding of semiconductor optical devices
If a current is passed through the heater, the active layer of the optical element
It is possible to control the temperature. As a result, the same substrate
Even if multiple optical elements are mounted on the back,
Is cooled down to a constant temperature,
The temperature can be individually controlled for each optical element. [0049]Also, in the above-described embodimentOptical element mounting structure
Is provided on the substrate with a terrace with a flat top
Optical waveguides formed on the substrate or guides on the substrate.
Optical fiber fixed to the V-groove and the half mounted on the substrate
The height of the terrace so that the output light from the conductive optical element is coupled
Is set, and the terrace is divided into at least two areas.
Formed in the first insulator, the heater, the second
Since the insulator, electrode and solder film are laminated in the recess, the active layer
Solder the optical element so that the
If flip chip bonding is performed on the top,
Controls the temperature of the active layer of an optical element by heating
It becomes possible. As a result, multiple photoelements on the same substrate
Even when mounting a board, the back side of the board is kept at a constant temperature.
So that the temperature of each mounted optical element
Can be individually controlled. [0050]【The invention's effect】 The optical element mounting portion structure of the present invention,Optical waveguide
The optical element mounting part and the electrical wiring part are provided on the same substrate.
Optical element mounting board,
Is composed of two terraces, one with a convex top
And a concave portion is formed on the terrace
The surface of the part contacts the part of the optical element and
The optical element is mounted, and the concave portion is a first insulator in order from the substrate,
While the heater, the second insulator and the electrode are laminated, the electrode
Over the opening so that part of the electrode appears in the recess
The third insulator on which is formed is laminated, and the third insulator
Including the opening and covering an area wider than the opening
Then, a second electrode is formed, and further so as to cover the second electrode.
A solder film is formed, and the solder film is formed on the active layer of the optical device.
Is electrically connected to the optical element so that
The electrodes and heater are electrically wired outside the optical element mounting part
Has beenMake sure the active layer is facing the heater.
-Chip bonding of optical elements to terraces
Then, the optical element and the second electrode are connected via a solder film to form a heater.
If current is passed through the heater and heated, the temperature of the optical element active layer is controlled.
Can be controlled. As a result, multiple
Even when mounting optical elements of
Cooling so that each mounted optical element
Temperature can be individually controlled.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an optical element mounting structure according to a first embodiment of the present invention. FIG. 2 is a view taken along line II-II in FIG. FIG. 3 is a perspective view of an optical element mounting structure according to a second embodiment of the present invention. FIG. 4 is a view taken along line IV-IV in FIG. 3; FIG. 5 is a perspective view of an optical element mounting structure according to a third embodiment of the present invention. FIG. 6 is a view taken along the line VI-VI in FIG. 5; FIG. 7 is a perspective view of an optical element mounting structure according to a fourth embodiment of the present invention. FIG. 8 is a view taken along line VIII-VIII in FIG. 7; FIG. 9 is a perspective view of an optical element mounting portion structure according to a fifth embodiment of the present invention. FIG. 10 is a view taken along line XX in FIG. 9; FIG. 11 is a perspective view of an optical element mounting structure according to a sixth embodiment of the present invention. FIG. 12 is a view taken along line X11-X11 in FIG. 11; FIG. 13 is a perspective view illustrating an optical element mounting portion structure using a thin solder film. FIG. 14 is a view taken along line X1V-X1V in FIG. 13; FIG. 15 is a perspective view illustrating an optical element mounting structure using solder bumps. FIG. 16 is a view taken along line XVI-XVI in FIG. 15; [Description of Signs] 1 Substrate 2 Cladding layer 3 Core layer 4 Terrace structure 5 Electrode 6 Solder film 7 Semiconductor optical device 8 Electrode layer 9 Active layer 11 Depression 12 Insulating film 13 Second electrode 14 Solder bump 15 Heater 16 Insulating layer 17 Optical fiber 18 Groove 19 Glass layer

──────────────────────────────────────────────────続 き Continuation of the front page (72) Takashi Yamada, inventor, Nippon Telegraph and Telephone Corporation 3-9-1-2 Nishishinjuku, Shinjuku-ku, Tokyo (56) References JP-A-10-233548 (JP, A) JP-A-8-78657 (JP, A) JP-A-9-232671 (JP, A) JP-A-9-74250 (JP, A) JP-A-10-65269 (JP, A) JP-A-9-148681 (JP JP, A) JP-A-63-131104 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01S 5/00-5/50 H01L 33/00 H01L 31/02 G02B 6 / 42

Claims (1)

(57) [Claims] [Claim 1] An optical waveguide, an optical element mounting part, and an electric wiring part
Is an optical device mounting substrate provided on the same substrate, and a substrate having a flat upper surface is formed on the substrate of the optical device mounting portion.
A concave portion that divides the lath portion and the terrace portion into two regions is formed.
Is, the convex portion, the surface of the terrace portion is in contact with a portion of the optical device
The optical element is mounted thereon, and the concave portion is formed of the first insulator, the heater, and the second
While the insulator and the electrode are stacked,
And an opening formed so that a part of the electrode appears.
Of the third insulator, including the opening of the third insulator and being wider than the opening.
A second electrode is formed so as to cover the area, and a second electrode is formed.
A solder film is formed to cover the poles, and the solder film is
Electrical contact with the optical element so that the active layer of the optical element is arranged
And the electrodes and heater are outside the optical element mounting part.
An optical element mounting structure, which is electrically wired .