JP3508033B2 - Epoxy resin composition - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a highly safe high boiling point
Epoxy resin composition that is soluble in terpene (terpene hydrocarbon oil), which is a mild solvent, and can give a coating film with excellent weather resistance, corrosion resistance, curability, and adhesion to various substrates. It is about things.

[0002]

BACKGROUND OF THE INVENTION Epoxy resins are excellent in adhesion to various substrates, heat resistance, chemical resistance, electrical properties, mechanical properties, etc.
Widely used as an adhesive, etc.

When used in these applications, a solvent type in which an epoxy resin is dissolved in various low boiling point solvents has been generally used. However, there is a risk of fire, harmfulness to human body,
Due to problems such as adverse effects on the global environment, the use of low boiling point solvents has come to be restricted, and there is a strong demand for reduction of the solvent or switching to a high boiling point and low stimulant solvent such as terpen.

However, an epoxy resin or a phenol novolac type epoxy resin produced from bisphenol A or bisphenol F and epichlorohydrin, which have been widely used in the past, have a high boiling point when used as a solvent type because of their poor solubility in terpenes. A mild terpene could not be used. Therefore, it has been strongly desired to find an epoxy resin that is soluble in terpenes and has excellent adhesion to various substrates, corrosion resistance, heat resistance, chemical resistance, electrical characteristics, mechanical characteristics, and the like.

Japanese Unexamined Patent Publication Nos. 4-45121 and 4-,
No. 117420 and Japanese Unexamined Patent Publication No. 5-222155, a terpene structure skeleton-containing polyvalent phenol compound obtained by adding a phenol to a cyclic terpene compound or condensation of the polyvalent phenol compound with an aldehyde An epoxy resin obtained by the reaction of a substance with epichlorohydrin has been proposed, and since the epoxy resin is excellent in electrical insulation, heat resistance, low water absorption, etc., it is particularly useful for laminates in electrical and electronic applications. It has been described as useful.

Epoxy resins derived from the above-mentioned terpene structure skeleton-containing polyphenol compounds have good solubility in terpenes, but have a drawback that the cured film has poor hardness, corrosion resistance, alkali resistance, curability and the like. However, they were not satisfactory for use in the paint field where these properties are required.

Further, Japanese Patent Laid-Open No. 4-359920 proposes a polyhydric phenol-modified epoxy resin obtained by reacting the above epoxy resin with a polyhydric phenol compound such as bisphenol A. However, the corrosion resistance, alkali resistance, curability, etc. were not satisfactory.

Further, a polyvalent phenol containing a terpene structure skeleton
It has also been proposed to use an epoxy compound as a curing agent for an epoxy resin. For example, JP-A-4-26642 and JP-A-4-55422 disclose a diglycidyl ether type epoxy resin of bisphenol. A curable epoxy resin composition suitable for semiconductor encapsulation containing a terpene structure skeleton-containing polyvalent phenol compound is described.

However, as described above, when the alkylidene bisphenol polyglycidyl ether type epoxy resin and the terpene structure skeleton-containing polyvalent phenol compound are simply mixed, the solubility of the epoxy resin in the terpene is hardly improved. In addition, the hardness, corrosion resistance, alkali resistance, curability, adhesion to the substrate, etc. of the cured film are insufficient, and it was not completely satisfactory for use in the paint field.

Therefore, the object of the present invention is not only excellent in solubility in terpenes that can be suitably used for paints, particularly heavy anticorrosion paints, white topcoat paints, etc., but also weather resistance, corrosion resistance, An object of the present invention is to provide an epoxy resin composition which is excellent in alkali resistance, curability and adhesion, and which can give a film having a high hardness as a cured film.

[0011]

Means for Solving the Problems As a result of intensive studies, the present inventors have found that a terpene structure skeleton obtained by adding phenols to a polyhydric phenol polyglycidyl ether type epoxy resin and a cyclic terpene compound. It was found that an epoxy resin composition containing a reaction product obtained by adding a contained phenol compound in a specific ratio can achieve the above object.

The present invention has been made on the basis of the above findings. (A) Polyglycidyl ethers of mononuclear polyhydric phenols and polynuclear polyhydric phenols having 4 or less carbon atoms in the bonds connecting each nucleus. At least one epoxy resin selected from the group consisting of glycidyl ether,
(B) A terpene structure skeleton-containing phenol compound obtained by adding a phenol or an alkylphenol compound to a cyclic terpene compound, and a terpene structure skeleton-containing phenol compound (B) for one epoxy group of the epoxy resin (A). ) Has a phenolic hydroxyl group of 0.05 to
It is intended to provide an epoxy resin composition having an epoxy equivalent of 200 to 2000, which contains a reaction product added at a ratio of 0.8.

The epoxy resin composition of the present invention will be described in detail below.

The epoxy resin of component (A) used in the present invention is a polyglycidyl ether of mononuclear polyhydric phenol and a polyglycidyl ether of polynuclear polyhydric phenol in which the number of carbon atoms of the bond connecting each nucleus is 4 or less. At least one kind of epoxy resin selected from the group consisting of, as the epoxy resin, for example, hydroquinone, resorcin, methylresorcin, pyrocatechol, mononuclear polyphenol compounds such as phloroglucinol; dihydroxynaphthalene, biphenol , Methylenebisphenol (bisphenol F), methylenebis (orthocresol), ethylidene bisphenol, isopropylidene bisphenol (bisphenol A), isopropylidene bis (orthocresol), tetrabromobisphenol A, 1,3 Bis (4-hydroxycumyl benzene), 1,4-bis (4-hydroxycumyl benzene), 1,1,3-tris (4-hydroxyphenyl)
Of polynuclear polyhydric phenol compounds such as butane, 1,1,2,2-tetra (4-hydroxyphenyl) ethane, thiobisphenol, sulfobisphenol, oxybisphenol; novolaks such as phenol novolac, orthocresol novolac and resorcin novolac; An example is polyglycidyl ether.

Among the above-mentioned epoxy resins, particularly when an alkylidene bisphenol polyglycidyl ether type epoxy resin represented by the general formula of the following [Chemical formula 2] (the same as the above-mentioned [Chemical formula 1] is used, corrosion resistance and weather resistance are obtained. It is preferable because it has excellent adhesion to the substrate.

[0016]

[Chemical 2]

In the above formula, the alkyl group represented by R ₁ and R ₂ is an alkyl group having 1 to 8 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, amyl, hexyl, heptyl and octyl. Can be given.

The (B) component terpene skeleton structure-containing phenol compound used in the present invention is obtained by adding an alkylphenol compound such as phenol or orthocresol to a cyclic terpene compound. 3] and the compounds represented by formulas (1) to (5).

[0019]

[Chemical 3]

The present invention comprises a reaction product obtained by adding the terpene structure skeleton-containing phenol compound of the component (B) to the epoxy resin of the component (A), both of which are the epoxy resin (A). To 1 epoxy group, the terpene structure-skeleton-containing phenol compound (B) has 0.05 to 0.8 phenolic hydroxyl groups, preferably 0.1 to 0.1 phenolic hydroxyl groups.
The ratio is 0.7, especially when a monophenol compound is used as the terpene structure skeleton-containing phenol compound (B), the ratio is preferably 0.1 to 0.5. By using the terpene structure skeleton-containing phenol compound (B) in such a ratio, the content of the above-mentioned added reaction product in the composition of the present invention is preferably 20% by weight or more, more preferably 30% by weight or more. It can be made to be more than the weight%. When the usage ratio of the terpene structure skeleton-containing phenol compound (B) is less than the above range (less than 0.05 hydroxyl groups to 1 epoxy group), the content of the reaction product is small, and thus the terpene is used. In addition, the solubility in water becomes insufficient, and when the amount exceeds the above range (more than 0.8 hydroxyl groups per 1 epoxy group), the epoxy equivalent becomes remarkably large and the curability becomes insufficient. Alkali resistance and corrosion resistance are insufficient.

As a method of adding the above component (B) to the above component (A) to obtain a reaction product, a usual method of adding a phenol compound to an epoxy resin can be adopted. For example, dimethylbenzylamine. In the presence of a basic catalyst such as the above, a method of heating both to 60 to 200 ° C. or the like can be used.

The epoxy resin composition of the present invention obtained as described above should have an epoxy equivalent of 200 to 2000, preferably 230 to 1500. If the epoxy equivalent is less than 200, the solubility in terpenes will be insufficient, and if it exceeds 2000, the curability will be insufficient and the alkali resistance, corrosion resistance, etc. will be insufficient.

The epoxy resin composition of the present invention is generally blended with a curing agent and used for applications such as paints and adhesives.

The above-mentioned curing agent can be used without particular limitation as long as it is a curing agent generally used for epoxy resins, and examples thereof include aromatic, aliphatic or heterocyclic polyamines. The compounds and polyepoxide addition modification products thereof, amidation modification products, Mannich modification products and the like can be used if necessary. Among these curing agents, a basic curing agent can cure an epoxy resin at room temperature or at a low temperature, and is suitable for use in the epoxy resin composition of the present invention.

Examples of the above polyamines include polyalkylene polymians such as diethylenetriamine, triethylenetetramine and tetraethylenepentamine,
1,2-diaminocyclohexane, 1,4-diamino-
Alicyclic polyamines such as 3,6-diethylcyclohexane and isophoronediamine, heterocyclic polyamines such as 1,4-bis (3-aminopropyl) piperazine, m-xylylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, etc. And aromatic polyamines. In addition, the polyepoxide addition modified product includes the above polyamines, glycidyl ethers such as phenylglycidyl ether, butylglycidyl ether, bisphenol A-diglycidyl ether, and bisphenol F-diglycidyl ether, or glycidyl esters of carboxylic acids. Produced by reacting various epoxy resins by a conventional method, the amidated modified product is produced by reacting the polyamines and carboxylic acids such as dimer acid by a conventional method,
The Mannich modified product is obtained by reacting the above polyamines with aldehydes such as formaldehyde and phenols having at least one aldehyde reaction site in the nucleus of phenol, cresol, xylenol, tert-butylphenol, resorcin, etc. by a conventional method. It is manufactured by

When the epoxy resin composition of the present invention is used as a coating material, a solvent is usually added, but the epoxy resin composition of the present invention is highly safe and has a high boiling point / low irritation. -Pen, i.e. turpentine oil, D-limonene,
It has the characteristic that it is soluble in pinene and can be used as a diluting solvent, but other common solvents,
For example, a commercially available high-boiling point hydrocarbon solvent can be used. The high boiling hydrocarbon solvent is an aliphatic, alicyclic,
It may be an aromatic high-boiling point hydrocarbon solvent or a mixture thereof, or may be a solvent having a single composition such as xylene or mesitylene. Furthermore, instead of a part or all of these high boiling hydrocarbon solvents, acetone,
Toluene, methyl ethyl ketone, ethyl acetate, propylene glycol monoethyl ether, N, N-dimethylformamide, N, N-dimethylacetamide, ethyl acetate and the like can be used, and these solvents are arbitrarily used as a mixed solvent of two or more kinds. It is also possible.

The epoxy resin composition of the present invention also contains
As required, reactive or non-reactive diluents (plasticizers) such as monoglycidyl ethers, dioctyl phthalate, dibutyl phthalate, benzyl alcohol and coal tar, glass fibers, carbon fibers, cellulose, silica sand, cement, Kaolin, clay, aluminum hydroxide, bentonite, silica, fine powder silica, titanium dioxide, carbon black, graphite, iron oxide and other fillers or pigments, thickeners, thixotropic agents, flame retardants, antifoaming agents, etc. The above additives may be contained, and further, tacky resins such as xylene resin and petroleum resin may be used in combination.

Using the epoxy resin composition of the present invention,
Examples of the method for preparing the coating include a method in which a desired additive such as a filler is added to the epoxy resin composition, glass beads are added, and the mixture is kneaded with a shaker for a predetermined time according to a conventional method. The obtained paint was mixed with a curing agent,
A coating film can be formed by applying a predetermined film thickness using a bar coater or the like and drying and curing.

[0029]

EXAMPLES Examples of the present invention will be shown below, but the present invention is not limited thereto. In each of the examples, the epoxy equivalent is defined as the molecular weight of the epoxy resin per epoxy group, and the OH equivalent is defined as the molecular weight of the terpene skeleton structure-containing phenol compound per phenolic hydroxyl group. It

Example 1 5 equipped with a thermometer, a stirrer, a cooling pipe, and a nitrogen inlet
In a 00cc four-neck round bottom flask, add ADEKA RESIN EP-4
901 (Asahi Denka Kogyo KK; Bisphenol F type epoxy resin, epoxy equivalent 175) 144.0 g (0.
82 eq), terpene phenol copolymer YP-90L
L (Yasuhara Chemical Co., Ltd., average molecular weight 266,
OH equivalent 300) 26.6 g (0.09 eq, 0.11 hydroxyl group per epoxy group) and 0.17 g of dimethylbenzylamine as a catalyst were charged, and the temperature in the system was raised to 120 ° C., then 2.5 The reaction was carried out for a period of time to obtain a phenol-modified epoxy resin containing a terpene structure skeleton in the form of a yellow liquid having an epoxy equivalent of 250 and a viscosity of 133 ps / 25 ° C.

Example 2 5 equipped with a thermometer, a stirrer, a cooling pipe, and a nitrogen inlet
In a 00cc four-neck round bottom flask, add ADEKA RESIN EP-4
100 (Asahi Denka Kogyo Co., Ltd .; bisphenol A type epoxy resin, epoxy equivalent 190) 190.0 g (1.
00eq), terpene phenol copolymer YP-90L
L60.0 g (0.20 eq, 0.20 hydroxyl groups per epoxy group) and 0.39 g of dimethylbenzylamine as a catalyst were charged, the temperature of the system was raised to 120 ° C., and the reaction was carried out for 3 hours to obtain an epoxy equivalent. 350, viscosity 46
A yellow liquid terpene structure skeleton-containing phenol-modified epoxy resin of 50 ps / 25 ° C. was obtained.

Example 3 5 equipped with a thermometer, a stirrer, a cooling pipe, and a nitrogen inlet
In a 00cc four-necked round bottom flask, 190.0 g (1.0
0 eq) Adeka Resin EP-4100, 115.0 g
(0.38 eq, 0.38 hydroxyl groups per epoxy group
Terpene-phenol copolymer YP-90LL and 0.39 g of dimethylbenzylamine as a catalyst are charged, the temperature of the system is raised to 120 ° C., and then the reaction is carried out for 3 hours to obtain a terpene structural skeleton of a yellow solid having an epoxy equivalent of 500. A phenol-containing modified epoxy resin containing was obtained.

Example 4 5 equipped with a thermometer, a stirrer, a cooling pipe, and a nitrogen inlet
In a 00cc four-necked round bottom flask, 75g (0.43e
q) ADEKA RESIN EP-4901, 40 g (0.21
eq) Adecaredin EP-4100, a terpene diphenol copolymer YP-90 containing a compound represented by the formula (1) and / or (2) shown in [Chemical Formula 3] as a main component.
(Yasuhara Chemical Co., Ltd., average molecular weight 324, O
H equivalent 162, melting point 85 ° C.) 75 g (0.46 eq, 0.72 hydroxyl groups per epoxy group) and 0.17 g of dimethylbenzylamine as a catalyst were charged.
After the temperature inside the system was raised to 0 ° C., the reaction was carried out for 4 hours to obtain a yellow solid terpene structure skeleton-containing phenol-modified epoxy resin having an epoxy equivalent of 1050.

Example 5 5 equipped with a thermometer, a stirrer, a cooling pipe, and a nitrogen inlet
In a 00cc four-necked round bottom flask, phenol novolac epoxy resin DEN431 (Dow Chemical Company
Made, average number of functional groups 2.2, epoxy equivalent = 175) 14
4 g (0.82 eq), terpene phenol copolymer Y
92 g of P-90LL (0.31 eq, 0.38 hydroxyl groups per epoxy group) and 0.36 g of dimethylbenzylamine as a catalyst were charged, the temperature of the system was raised to 120 ° C., and the reaction was continued for 3 hours to obtain an epoxy equivalent. 480 yellow solid terpene structure-containing phenol-modified epoxy resin was obtained.

Comparative Example 1 162 g of YP-90 was charged into a 1 liter reactor equipped with a thermometer, a stirrer and a condenser, and epichlorohydrin 74 was used.
0 g and 1.1 g of a tetraethylammonium chloride catalyst were added, and the mixture was heated to 117 ° C. and reacted under reflux for 2 hours. Then it is cooled to 60 ° C., fitted with a water separator, added with 42 g of NaOH, 40-100 mm
It was made to react at 50-70 degreeC under reduced pressure of Hg. The water generated during the reaction was removed by azeotropic distillation with epichlorohydrin, and the reaction end point was about 2 hours after the theoretical amount of water was distilled. The obtained epoxy resin epichlorohydrin solution was added with methyl isobutyl ketone (MIBK) 2500 cc.
Was added and washed with a large amount of water.
After removing aOH, the solution was neutralized with a 3% phosphoric acid aqueous solution. Then, epichlorohydrin and MIBK were distilled off with an evaporator to obtain 196 g of a terpene structure skeleton-containing epoxy resin having an epoxy equivalent of 233.

Comparative Example 2 The terpene structure skeleton-containing epoxy resin 66 of Comparative Example 1 was placed in a 1 liter reactor equipped with a thermometer, a stirrer and a cooling tube.
g (0.28 eq), bisphenol A 18 g (0.1
6 eq) and dimethylbenzylamine 0.
3 g was added and reacted at 150 ° C. for 3 hours to obtain an epoxy resin having a terpene structure skeleton and an epoxy equivalent of 700.

Comparative Example 3 175 g in a reactor equipped with a thermometer, a stirrer, and a cooling pipe.
(1.00 eq) of ADEKA RESIN EP-4901 and 74 g (0.65 eq) of bisphenol A were charged, and 1
The reaction was carried out at 50 ° C. for 2.5 hours to obtain an epoxy resin having an epoxy equivalent of 700.

Comparative Example 4 144.0 g (0.82 eq) of ADEKA RESIN EP-4
901 and terpene phenol copolymer YP-90LL2
6.6 g (0.09 eq) was blended at room temperature of 25 ° C. to obtain an epoxy resin composition containing a terpene structure skeleton-containing phenol.

Comparative Example 5 In a reactor equipped with a thermometer, a stirrer and a condenser, 75 g was added.
(0.43 eq) Adeka Resin EP-4901, 40
g (0.21 eq) of ADEKA RESIN EP-4100, 89 g (0.55 eq, 0.86 hydroxyl groups per epoxy group) of YP-90, and 0.18 g of dimethylbenzylamine as a catalyst were charged to a system up to 130 ° C. After the temperature was raised, the reaction was carried out for 7 hours to obtain a yellow solid terpene polyhydric phenol-modified epoxy resin having an epoxy equivalent of 2250.

100 g of each of the epoxy resin compositions obtained in Examples 1 to 5 and Comparative Examples 1 to 5 was replaced with 100 g of turpentine oil.
It was dissolved in and the solubility was observed. Solubility evaluation is the following 3
The results are shown in Table 1 below. ◯: Dissolved uniformly, no insoluble matter was observed. Δ: A small amount of insoluble matter is recognized. X: A large amount of insoluble matter is recognized.

[0041]

[Table 1]

Using the epoxy resin compositions obtained in the above Examples 1 to 5 and Comparative Examples 1 to 5, according to the following formulation,
Using glass beads, the mixture was kneaded with a shaker for 2 hours to prepare a white paint.

[0043] (Blend) Epoxy resin composition 20 parts by weight Titanium dioxide 20 Bentonite 1 Turpentine oil 14.1 Solvesso 100 3.5 (High boiling point hydrocarbon solvent manufactured by Exxon Chemical Co., Ltd.)

Adeka Hadna-EH340 (manufactured by Asahi Denka Kogyo Co., Ltd .; modified polyamidoamine, active hydrogen equivalent 81) was added to the obtained white coating composition as an epoxy group of epoxy compound / hardening agent active hydrogen = 1/1. A coating composition was prepared by blending so as to have an equivalent ratio.

Next, the obtained coating composition was applied onto a metal plate using a 070 bar coater so as to have a film thickness of 30 to 50 μm, and left standing at 25 ° C. for 7 days to dry and cure. The characteristics of the obtained coating film test piece were evaluated as follows, and the results are shown in [Table 2] below.

The method of evaluating each performance is as follows. Erichsen; using Erichsen tester, φ20mm,
It was conducted under the condition of 8 mm. Alkali resistance test; based on JIS K-5400. Corrosion resistance test: Based on JIS K-5400, the sandblasted plate coating film test piece was subjected to SST for 500 hours. The criteria are as follows. Flat part ○: No rust or blister △: 〃 Somewhat seen ×: 〃 Cross-cut part that is often seen ○: Rust, blister 0.5 mm or less ○ ~ △; 〃 0.5-1 mm △ ； 〃 1-1.5 mm △ to ×; 〃 1.5 to 2 mm ×; 〃 2 mm or more Weather resistance test: Mild steel plate coating film test piece according to JIS B-775
The gloss before and after exposure to a 2UV controller at 60 ° C. for 200 hours was measured with a gloss meter (specular reflectance 60 °), and the gloss retention rate was calculated. Low temperature curability: The presence or absence of tacking when left at 10 ° C. for 15 hours after application was evaluated by touch with a finger, and evaluated in two stages of ◯ and ×. Aluminum adhesion: A coating film test piece is prepared in the same manner except that an aluminum plate specified in JIS H-4000 is used, a cross-cut is put in the coating film, and a tape peeling test is performed to compare the peeling state of the coating film. did. ○: No peeling △: Partial peeling is seen ×: Whole surface is peeled off

[0047]

[Table 2]

As is clear from the above Examples and Comparative Examples, the phenol-modified epoxy resin composition containing a terpene structure skeleton, which is the epoxy resin composition of the present invention (Example 1)
(5) to (5) are excellent in terpene solubility and can form a coating film having good corrosion resistance, weather resistance and adhesion to a substrate.

On the other hand, the epoxy resin composition containing no terpene structural skeleton (Comparative Example 3) not only had poor solubility in terpenes but also poor adhesion to substrates,
Further, the epoxy resin composition (Comparative Example 4) obtained by simply blending the phenol having a terpene structure skeleton (Comparative Example 4) has not only poor solubility in terpenes but also poor results in all test items.

Even with the terpene structure skeleton-containing epoxy resin composition, an epoxy resin composition using an epoxy compound derived from a terpene structure skeleton-containing polyphenol having a large terpene structure skeleton content (Comparative Examples 1 and In 2), although the solubility in terpenes is excellent, the corrosion resistance and the low temperature curability are insufficient, and even in the epoxy resin composition modified with the terpene structure skeleton-containing phenol, the terpene structure skeleton-containing phenol When the amount used is large (epoxy equivalent is large) (Comparative Example 5), the solubility in terpenes is excellent, but only inferior results are obtained in all test items, and the amount of the terpene structure-skeleton-containing phenol used is large. Was limited to a relatively small amount, and the epoxy resin composition of the present invention (Examples 1 to 5) having a specific epoxy equivalent was used. It is clear that the effect is quite specific due to the.

[0051]

The epoxy resin composition of the present invention (Claim 1) is soluble in a highly safe terpene having a high boiling point and a low irritation, and is excellent in corrosion resistance, weather resistance and water resistance. A coating film having good adhesion to various substrates such as vinyl chloride, aluminum and zinc plates can be formed. Therefore, the epoxy resin composition of the present invention (Claim 1) is useful for various coatings, adhesives, encapsulating materials and the like. The epoxy resin composition of the present invention (claim 2) is particularly excellent in corrosion resistance, weather resistance and adhesion to a substrate.

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-5-222155 (JP, A) JP-A-5-301320 (JP, A) JP-A-7-188634 (JP, A) JP-A-5- 230175 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) C08G 59/00-59/72

Claims (2)

(57) [Claims] 1. At least one selected from the group consisting of (A) a polyglycidyl ether of a mononuclear polyhydric phenol and a polyglycidyl ether of a polynuclear polyhydric phenol having 4 or less carbon atoms in a bond connecting each nucleus. A terpene structure skeleton-containing phenol compound obtained by adding a phenol or an alkylphenol compound to a cyclic terpene compound (B) is added to the above epoxy resin, and the terpene structure skeleton is added to one epoxy group of the above epoxy resin (A). An epoxy resin composition having an epoxy equivalent of 200 to 2000, which contains a reaction product added at a ratio of the phenolic hydroxyl group of the contained phenol compound (B) to 0.05 to 0.8. 2. The epoxy resin (A) is an alkylidene bisphenol polyglycidyl ether type epoxy resin represented by the general formula of the following [Chemical formula 1].
The epoxy resin composition described. [Chemical 1]