JP3583058B2 - Processing liquid supply device - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor processing apparatus, and more particularly, to a processing liquid supply apparatus for supplying a processing liquid such as a resist liquid onto a substrate to be processed such as a semiconductor wafer.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in a processing liquid supply device that supplies a processing seat to a substrate to be processed, a supply pipe is used to connect a container containing the processing liquid and a nozzle disposed near the substrate to be processed with a supply pipe. The processing liquid contained in the container is sent to the nozzle by a pump disposed in the nozzle.
[0003]
FIG. 14 is a schematic diagram of a processing liquid supply system used in a conventional coating apparatus.
[0004]
As shown in FIG. 14, in the processing liquid supply system 214, a processing liquid tank 201, a liquid end sensor 203, a supply pump 204, a filter 205, a discharge pump 206, and a nozzle 202 are arranged in this order. These adjacent elements are connected by a supply pipe 207. A vent pipe 208 connected to a waste liquid tank (not shown) is attached to the filter 205.
[0005]
Further, a purge pipe 209 is attached downstream of the discharge pump 206 in the processing liquid moving direction. The purge pipe 209 is connected to a T-shaped branch pipe 213 attached to a supply pipe 207b between the processing liquid tank 201 and the liquid end sensor 203, and the processing liquid passing through the purge pipe 209 is supplied to the supply pipe 207b. They are joined.
[0006]
By the way, in the processing liquid supply system 214 having a structure in which the container 207 and the nozzle 202 are connected by a long supply pipe 207 as shown in FIG. 14, bubbles may be formed in the supply pipe 207. If left as it is, the amount of the processing liquid discharged from the nozzle 202 to the substrate to be processed such as the wafer W may fluctuate, and the quality of the wafer W may be reduced. Therefore, the processing liquid supply system 214 as shown in FIG. 14 includes a bubble removing mechanism.
[0007]
That is, when air enters the supply pipe 207, such as when a new processing liquid is introduced into the processing liquid tank 201 or when a new processing liquid is supplied by replacing the filter module in the filter 205, When the supply of liquid is started, the supply pump 204 is operated with the vent valve 211 of the vent pipe 208 opened, and the processing liquid pumped from the processing liquid tank 201 is sent to the filter 205. First, a processing liquid containing a large amount of bubbles is sent into the filter 205, and the amount of the bubbles gradually decreases, and a processing liquid containing no bubbles is eventually supplied. For this reason, the processing liquid containing bubbles has been disposed of in a waste liquid tank (not shown) via the vent pipe 208.
[0008]
However, when the supply pump 204 is operated with the vent valve 211 opened, all the processing liquid is discarded, and there is a problem that the processing liquid is wasted much.
[0009]
Also, bubbles may be generated in the supply pipe 207 during the normal operation of discharging the processing liquid from the nozzle 202 to the wafer W. In this case, the purge valve 212 of the purge pipe 209 connected to the discharge side of the discharge pump 206 Is opened, and the processing solution containing bubbles is sent to the purge pipe 209 side.
[0010]
However, the purge pipe 209 is connected to a T-shaped branch pipe 213 provided in the supply pipe 207b between the processing liquid tank 201 and the liquid end sensor 203, and the processing liquid containing bubbles is again supplied to the supply pipe 207. There is a problem that the supply of an accurate amount of processing liquid is prevented by circulating through the inside.
[0011]
[Problems to be solved by the invention]
The present invention has been made to solve the above problems.
[0012]
That is, an object of the present invention is to provide a processing liquid supply device capable of eliminating waste of a processing liquid.
[0013]
Another object of the present invention is to provide a processing liquid supply device capable of effectively removing bubbles.
[0014]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a processing liquid supply apparatus of the present invention includes a discharge unit that discharges a processing liquid onto a substrate to be processed, a processing liquid supply source that stores the processing liquid, the discharge unit, and the processing liquid supply. A supply pipe connecting the source, a pump disposed in the supply pipe, means for controlling the operation of the pump, and a branch pipe disposed in a pipe between the processing liquid supply source and the pump. A bypass pipe connecting the branch pipe and the pump; A waste liquid pipe branched from the bypass pipe, Disposed on the bypass pipe, and the branch pipe or Said It has a three-way valve for communicating with the waste liquid pipe, and means for switching the three-way valve.
[0015]
In the above-described processing liquid supply device, the discharging unit refers to, for example, a nozzle that discharges the processing liquid onto the wafer W. The processing liquid supply source is, for example, a processing liquid tank that stores a processing liquid. The supply pipe refers to a pipe for supplying a processing liquid from the processing liquid supply source to the discharge unit, and a liquid end sensor disposed in the middle, a supply pump, a filter, a discharge pump, and the like. Refers to the piping to connect. The pump refers to, for example, one or both of a supply pump and a discharge pump. The means for controlling the operation of the pump refers to, for example, a control device for controlling the operation of the supply pump and the discharge pump. The branch pipe refers to, for example, a T-shaped branch pipe connecting a supply pipe and a purge pipe, and a cross branch pipe connecting a supply pipe to a purge pipe and a vent pipe. The bypass pipe refers to a pipe other than the supply pipe, for example, one or both of a purge pipe and a vent pipe.
[0016]
The three-way valve is, for example, a valve that has one input side and two output sides and can switch between one of the two output sides and one input side. The means for switching the three-way valve means, for example, means for switching the three-way valve by a mechanical or electrical method, such as a solenoid.
[0017]
In the processing liquid supply apparatus of the present invention, the vent pipe and the supply pipe are connected to each other through a T-shaped branch pipe or a cross branch pipe, and a three-way valve is attached in the middle of the vent pipe, and a waste liquid tank or a supply pipe is connected to the vent pipe. May be switched.
[0018]
In the processing liquid supply apparatus of the present invention, the purge pipe and the supply pipe are connected through a T-shaped branch pipe or a cross branch pipe, and a three-way valve is attached in the middle of the purge pipe to supply a waste liquid tank or supply liquid to the purge pipe. The communication with the pipe may be switched.
[0019]
Further, as described above, the vent pipe, the purge pipe, and the supply pipe are connected to each other through the cross branch pipe, and a three-way valve is attached to each of the vent pipe and the purge pipe. The treatment liquid may be disposed of in a waste liquid tank.
[0020]
Further, a means for controlling the three-way valve may be further provided, and the three-way valve may be operated periodically to discard the processing liquid containing bubbles from the vent pipe or the purge pipe.
[0021]
Further, a sensor for detecting the presence or absence of bubbles is attached in the middle of the supply pipe, and when bubbles are generated in the processing liquid supply system, the three-way valve is operated to remove the processing liquid containing bubbles from the vent pipe or the purge pipe. You may make it discard.
[0022]
In this treatment liquid supply device, while a vent pipe or a purge pipe communicates with the supply pipe, a three-way valve is provided in the vent pipe or the purge pipe, so that the bubbles in the pipe are reduced by appropriately switching the three-way valve. Only the processing solution containing the waste can be discarded. Therefore, useless disposal of the processing liquid can be almost eliminated. Further, since the processing liquid containing bubbles does not recirculate, the discharge amount of the processing liquid can be accurately controlled.
[0023]
Further, another processing liquid supply apparatus of the present invention includes a discharge unit that discharges the processing liquid to the substrate to be processed, a processing liquid supply source that stores the processing liquid, and connects the discharge unit and the processing liquid supply source. A supply pipe, a pump for supplying a processing liquid from the processing liquid supply source to a discharge unit, a filter inserted in a supply pipe between the pump and the discharge unit, the filter, and a supply upstream of the pump. A bypass pipe connecting the pipe, a waste liquid pipe branched from the bypass pipe, and a switching valve for switching a processing liquid in the bypass pipe between the pump upstream side and the waste liquid pipe.
[0024]
In the above processing liquid supply device, the bypass pipe may connect the pump and the supply pipe. Further, two bypass pipes may be used, and the filter and the supply pipe may be connected by one bypass pipe, and the pump and the supply pipe may be connected by another bypass pipe.
[0025]
Further, the switching valve may be driven at a predetermined timing.
[0026]
In the treatment liquid supply device, a bypass pipe connecting the supply pipe to the filter or the pump is provided in addition to the supply pipe, and a waste liquid pipe is provided to the bypass pipe via a switching valve. By switching the switching valve at an appropriate timing, bubbles in the pipe can be efficiently removed.
[0027]
Still another processing liquid supply device of the present invention includes a discharge unit that discharges a processing liquid to a substrate to be processed, a processing liquid supply source that stores the processing liquid, and a supply that connects the discharge unit and the processing liquid supply source. Piping, a pump disposed in the supply pipe, means for controlling the operation of the pump, a branch pipe disposed in a supply pipe between the processing liquid supply source and the pump, and the pump A bypass pipe connected to the branch pipe, a return pipe branched from the bypass pipe and connected to the processing liquid supply source, and disposed on the bypass pipe, and the bypass pipe or the return pipe is provided to the pump. A first three-way valve for communicating with a pipe, and means for switching the first three-way valve; A waste liquid pipe that is disposed between the first three-way valve and the branch pipe and branches from the bypass pipe; The bypass pipe or the first three-way valve is disposed between the first three-way valve and the branch pipe. Said A second three-way valve for communicating with the waste liquid pipe, and a means for switching the second three-way valve are provided.
[0028]
Still another processing liquid supply device of the present invention includes a discharge unit that discharges a processing liquid to a substrate to be processed, a processing liquid supply source that stores the processing liquid, and a supply that connects the discharging unit and the processing liquid supply source. A pipe, a discharge pump disposed on the supply pipe, a supply pump disposed on a supply pipe between the discharge pump and the processing liquid supply source, and controlling operations of the discharge pump and the supply pump. Means, a filter disposed on a supply pipe between the discharge pump and the supply pump, a branch pipe disposed on a supply pipe between the supply pump and the processing liquid supply source, and the filter A vent pipe connecting between the discharge pipe and the branch pipe; a purge pipe connecting between the discharge pipe and the branch pipe; and a branch pipe extending from the vent pipe and the purge pipe to the processing liquid supply source. A return pipe to tie, A vent-side three-way valve, which is disposed in a vent pipe, and communicates the branch pipe or the return pipe with the filter, means for switching the vent-side three-way valve, and is disposed in the purge pipe; A purge-side three-way valve that communicates between the discharge pipe and the branch pipe or the return pipe, and a unit that switches the purge-side three-way valve; A first waste liquid pipe disposed between the vent-side three-way valve and the branch pipe, and branched from the vent pipe; The vent pipe is disposed in the vent pipe, and communicates the vent side three-way valve with the branch pipe, or the vent side three-way valve and the First The waste liquid pipe is communicated with, or the branch pipe and the First A vent-side switching valve for communicating with a waste liquid pipe, and means for switching the vent-side switching valve; A second waste pipe disposed between the purge-side three-way valve and the branch pipe, and branched from the purge pipe; The purge pipe is arranged to communicate the purge side three-way valve and the branch pipe, or the purge side three-way valve and the Second The waste liquid pipe is communicated with, or the branch pipe and the Second A purge side switching valve for communicating with a waste liquid pipe; Switching There is provided a means for switching a valve, and a processing liquid removing means disposed in the branch pipe for removing a processing liquid in the branch pipe, the supply pipe, the vent pipe, and the purge pipe.
[0029]
The processing liquid supply device may further include a unit that is disposed between the filter and the vent-side three-way valve and that detects bubbles on the vent side.
[0030]
Further, the processing liquid supply device may further include a unit disposed between the discharge pump and the purge-side three-way valve to detect bubbles on the purge side.
[0031]
Further, the processing liquid supply device is configured to detect the presence of the bubbles present in the vent pipe and the purge pipe by the vent-side foam detecting means and the purge-side foam detecting means, and perform the vent-side three-way operation at a predetermined timing. Control means for switching the valve, the purge-side three-way valve, the vent-side switching valve, and the purge-side switching valve may be further provided.
[0032]
Further, the processing liquid supply device may further include a vent-side vibrator disposed between the filter and the vent-side bubble detecting means.
[0033]
Further, the processing liquid supply device may further include a purge-side vibrator disposed between the discharge pump and the purge-side bubble detecting means.
[0034]
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0035]
FIG. 1 is a plan view showing an entire system 1 for coating and developing a semiconductor wafer (hereinafter, referred to as “wafer”) W provided with a resist coating unit (COT) according to an embodiment of the present invention.
[0036]
In the coating and developing processing system 1, a plurality of wafers W as objects to be processed are loaded into and unloaded from the system in units of, for example, 25 wafers CR, or loaded and unloaded into and out of the wafer cassette CR. And a processing station 11 in which various single-wafer processing units for performing predetermined processing on wafers W one by one in a coating and developing process are arranged at predetermined positions in multiple stages. And an interface unit 12 for transferring a wafer W to and from an exposure apparatus (not shown) provided adjacent to the apparatus.
[0037]
In the cassette station 10, a plurality of wafer cassettes CR, for example, up to four wafer cassettes CR are arranged at the positions of the positioning projections 20a on the cassette mounting table 20 in the X direction with their respective wafer entrances facing the processing station 11 (see FIG. 1). Each wafer carrier 21 is placed in a line (up and down direction) and is movable in the cassette arrangement direction (X direction) and the wafer arrangement direction (Z direction; vertical direction) of the wafers W stored in the wafer cassette CR. The cassette CR is selectively accessed.
[0038]
The wafer transfer body 21 is rotatable in the θ direction, and a third processing unit group G on the processing station 11 side as described later. ₃ Can also access the alignment unit (ALIM) and extension unit (EXT) arranged in the multi-stage unit section.
[0039]
The processing station 11 is provided with a vertical transfer type main arm 22 having a wafer transfer device, around which all the processing units are arranged in one or more sets in multiple stages.
[0040]
FIG. 2 is a front view of the coating and developing processing system 1.
[0041]
First processing unit group G ₁ Here, two spinner-type processing units, for example, a resist coating unit (COT) and a developing unit (DEV), which perform predetermined processing by placing a wafer W on a spin chuck in the cup CP, are stacked in two stages in order from the bottom. I have. Second processing unit group G ₂ In this example, two spinner type processing units, for example, a resist coating unit (COT) and a developing unit (DEV) are stacked in two stages from the bottom. These resist coating units (COT) are preferably arranged in the lower stage in this manner because drainage of the resist solution is troublesome both mechanically and in terms of maintenance. However, it is of course possible to appropriately arrange the upper stage as needed.
[0042]
FIG. 3 is a rear view of the coating and developing system 1.
[0043]
In the main arm 22, a wafer transfer device 46 is provided inside the cylindrical support 49 so as to be able to move up and down in the vertical direction (Z direction). The cylindrical support 49 is connected to a rotating shaft of a motor (not shown), and is rotated integrally with the wafer transfer device 46 about the rotating shaft by the rotation driving force of the motor, whereby the wafer transfer is performed. The device 46 is rotatable in the θ direction. Note that the cylindrical support 49 may be configured to be connected to another rotating shaft (not shown) rotated by the motor.
[0044]
The wafer transfer device 46 is provided with a plurality of holding members 48 that are movable in the front-rear direction of the transfer base 47. These holding members 48 enable the transfer of the wafer W between the processing units. ing.
[0045]
Further, as shown in FIG. 1, in the coating and developing processing system 1, five processing unit groups G ₁ , G ₂ , G ₃ , G ₄ , G ₅ Can be arranged, and the first and second processing unit groups G ₁ , G ₂ Is disposed on the front side (front side in FIG. 1) of the system, and the third processing unit group G ₃ Is disposed adjacent to the cassette station 10, and the fourth processing unit group G ₄ Are arranged adjacent to the interface unit 12, and the fifth processing unit group G ₅ Can be arranged on the back side.
[0046]
As shown in FIG. 3, the third processing unit group G ₃ Then, an oven-type processing unit that places a wafer W on a holding table (not shown) and performs a predetermined process, for example, a cooling unit (COL) that performs a cooling process, and a so-called hydrophobic process that enhances the fixability of the resist are performed. Adhesion unit (AD), alignment unit (ALIM) for positioning, extension unit (EXT), pre-baking unit (PREBAKE) for heating before exposure, and post for heating after exposure The baking units (POBAKE) are stacked, for example, in eight stages from the bottom. Fourth processing unit group G ₄ However, oven-type processing units such as a cooling unit (COL), an extension / cooling unit (EXTCOL), an extension unit (EXT), a cooling unit (COL), a pre-baking unit (PREBAKE), and a post-baking unit (POBAKE) ) Are stacked in order from the bottom, for example, in eight stages.
[0047]
Thus, the cooling unit (COL) and the extension cooling unit (EXTCOL) having a low processing temperature are arranged in the lower stage, and the baking unit (PREBAKE), the post-baking unit (POBAKE) and the adhesion unit (AD) having a high processing temperature are arranged. By arranging the upper stage, thermal mutual interference between units can be reduced. Of course, a random multi-stage arrangement may be used.
[0048]
As shown in FIG. 1, the interface unit 12 has the same dimensions in the depth direction (X direction) as the processing station 11, but has a smaller size in the width direction (Y direction). A portable pickup cassette CR and a stationary buffer cassette BR are arranged in two stages at the front of the interface unit 12, while a peripheral exposure device 23 is arranged at the rear, and a central exposure unit is further arranged at the center. Is provided with a wafer carrier 24. The wafer carrier 24 moves in the X and Z directions to access both cassettes CR and BR and the peripheral exposure device 23.
[0049]
The wafer transfer body 24 is also rotatable in the θ direction, and the fourth processing unit group G on the processing station 11 side. ₄ The extension unit (EXT) disposed in the multi-stage unit and a wafer transfer table (not shown) on the adjacent exposure apparatus side can be accessed.
[0050]
Further, in the coating and developing processing system 1, the fifth processing unit group G indicated by a broken line in FIG. ₅ Can be arranged, but this fifth processing unit group G ₅ Is movable in the Y direction along the guide rail 25. Therefore, the fifth processing unit group G ₅ Even when the multi-stage unit is provided as shown in the drawing, a space is secured by moving along the guide rail 25, so that maintenance work can be easily performed from behind the main arm 22.
[0051]
Next, a resist coating unit (COT) according to the present embodiment will be described.
[0052]
FIG. 4 is a schematic sectional view of the resist coating unit (COT) according to the present embodiment.
[0053]
An annular cup C # is provided at the center of the resist coating unit (COT), and a spin chuck 51 is provided inside the cup C #. The spin chuck 51 is rotationally driven by a drive motor 52 in a state where the wafer W is fixedly held by vacuum suction.
[0054]
The drive motor 52 is disposed so as to be able to move up and down in an opening 50 a provided in the unit bottom plate 50, and is made up of a lift drive unit 54 and a lift guide unit 55 made of, for example, an air cylinder via a cap-shaped flange member 53 made of aluminum. Are combined.
[0055]
A resist nozzle 60 for discharging a resist liquid as a coating liquid onto the surface of the wafer W is detachably attached to a distal end of a resist nozzle scan arm 61 via a nozzle holder 62. The resist nozzle scan arm 61 is attached to the upper end of a vertical support member 64 that can move horizontally on a guide rail 63 laid in one direction (Y direction) on the unit bottom plate 50, and is not shown in the Y direction. The drive mechanism moves in the Y direction integrally with the vertical support member 64.
[0056]
FIG. 5 is a schematic plan view of the resist coating unit (COT) according to the present embodiment.
[0057]
The resist nozzle scan arm 61 can also be moved in the Χ direction perpendicular to the Y direction to selectively attach the resist nozzle 60 in the resist nozzle standby section 65, and can be moved in the Χ direction by a Χ direction driving mechanism (not shown). .
[0058]
Further, in the resist nozzle standby section 65, the discharge port of the resist nozzle 60 is inserted into the port 65a of the solvent atmosphere chamber and exposed to the solvent atmosphere so that the resist liquid at the tip of the resist nozzle 60 does not solidify or deteriorate. Has become. Also, a plurality of resist nozzles 60, 60,... Are provided, and the resist nozzles 60 can be selectively used depending on the type and viscosity of the resist liquid.
[0059]
Further, on the guide rail 63, not only a vertical support member 64 that supports the resist nozzle scan arm 61 but also a vertical support member 71 that supports the rinse nozzle scan arm 70 and is movable in the Y direction is provided.
[0060]
The rinse nozzle scan arm 70 is moved by the Y-direction drive mechanism (not shown) between the rinse nozzle standby position (the position indicated by the solid line) set to the side of the cup CP and the peripheral portion of the semiconductor wafer W installed on the spin chuck 51. The translation or linear movement is performed between the rinse liquid discharge position (the position indicated by the dotted line) set immediately above.
[0061]
As shown in FIG. 4, the resist nozzle 60 is connected via a resist supply pipe 66 to a resist liquid supply mechanism disposed in a lower chamber of a resist coating unit (COT).
[0062]
Next, a resist supply system of the resist coating unit (COT) according to the present embodiment will be described.
[0063]
FIG. 6 is a schematic diagram of a resist supply system of the resist coating unit (COT) according to the present embodiment. In the figure, a solid line indicates piping, and a dotted line indicates electric wiring.
[0064]
As shown in FIG. 6, in the resist supply system 100, the resist tank 101 as a container, the liquid end sensor 103, the supply pump 104, the filter 105, the discharge pump 106, and the resist nozzle 60 are in the moving direction of the resist liquid. The components are arranged in this order, and the adjacent elements are connected by a supply pipe 107. A vent pipe 108 connected to a waste liquid tank (not shown) is attached to the filter 105.
[0065]
The discharge side of the supply pump 104 and the suction side of the discharge pump 106 are connected via a filter 105, and the resist solution discharged from the supply pump 104 once passes through the filter 105 and then enters the discharge pump 106. It is being sent.
[0066]
Inside the filter 105, a filter module (not shown) for filtering the resist solution is provided between a connection portion with the supply pipe 107d and a connection portion with the supply pipe 107e, and is sent from the supply pump 104. The resist solution is sent to the discharge pump 106 after being filtered through the filter module.
[0067]
A purge pipe 109 is attached downstream of the discharge pump 106 in the processing liquid moving direction. The purge pipe 109 is connected to a cross branch pipe 110 attached to a supply pipe 107b between the container 101 and the liquid end sensor 103, so that the resist solution passing through the purge pipe 109 is joined to the supply pipe 107b. It has become.
[0068]
Further, one end of the above-mentioned vent pipe 108 is also connected to the cross branch pipe 110 so that the resist solution having passed through the vent pipe 108 is joined to the supply pipe 107b.
[0069]
A first three-way valve, that is, a vent-side three-way valve 113 is provided in the middle of the vent pipe 108.
[0070]
The input side of the first three-way valve 113 is connected to the filter 105, and one of the two output sides of the first three-way valve 113 is connected to the vent pipe 108b connected to the cross pipe 110 connected to the supply pipe 117b. . Another output side of the first three-way valve 113 is connected to a waste liquid pipe 116 connected to a waste liquid tank (not shown). Therefore, by switching the first three-way valve 113, communication between the vent pipe 108a and the vent pipe 108b or communication between the vent pipe 108a and the waste liquid pipe 116 can be made. A vent valve 111 is provided in the middle of a vent pipe 108a connecting the filter 105 and the first three-way valve 113, and opens and closes the vent pipe 108.
[0071]
Similarly, a second three-way valve, that is, a purge-side three-way valve 114 is provided in the middle of the purge pipe 109.
[0072]
The input side of the second three-way valve 114 is connected to the discharge side of the discharge pump 106, and one of the two output sides of the second three-way valve 114 is connected to a purge pipe 109b connected to a cross pipe 110 connected to a supply pipe 117b. It is connected. The other output side of the second three-way valve 114 is connected to a waste liquid pipe 115 connected to a waste liquid tank (not shown).
[0073]
Therefore, by switching the second three-way valve 114, communication between the purge pipe 109a and the purge pipe 109b or communication between the purge pipe 109a and the waste liquid pipe 115 can be performed. A purge valve 112 is provided in the middle of a purge pipe 109a connecting the discharge pump 106 and the second three-way valve 114, and opens and closes the purge pipe 109.
[0074]
As shown in FIG. 6, the supply pump 104, the discharge pump 106, the vent valve 111, the first three-way valve 113, the purge valve 112, and the second three-way valve 114 are all electrically connected to the control unit 120, The control unit 120 controls the entire system.
[0075]
Next, an operation in the case where the resist supply device according to the present embodiment is operated to remove bubbles from inside the piping will be described.
[0076]
FIG. 7 shows the procedure of the bubble removal operation when the resist supply device is temporarily stopped and then restarted, such as when a new resist solution is installed in the resist supply device or when the filter module in the filter 105 is replaced. FIG.
[0077]
First, necessary preparations, such as filling the resist tank 101 with a new resist solution or replacing a filter module, are prepared, and then the resist supply device is started (step 1).
[0078]
At the same time as the activation of the resist supply device, the first three-way valve 113 is switched to allow communication between the vent pipe 108a and the waste liquid pipe 116 (step 2).
[0079]
Next, the vent valve 111 is opened, and the inside of the vent pipe 108a is brought into a state in which the resist solution can flow (step 3).
[0080]
The supply pump 104 is operated in this state (step 4).
[0081]
The resist liquid in the resist liquid tank 101 is pumped by the operation of the supply pump 104, and flows into the filter 105 via the supply pipes 107a to 107d (step 5).
[0082]
At this time, since the discharge pump 106 is not operating, the resist liquid flowing into the filter 105 flows into the vent pipe 108a. With the inflow of the resist solution, the air in the supply pipe 107, the filter 105, and the vent pipe 108a is pushed out, so that the air flows first in the waste liquid pipe 116, and eventually the resist liquid containing a large amount of bubbles flows, and the amount of bubbles Is reduced in order, and finally the resist solution containing no bubbles flows out. This state is monitored with the naked eye or using a foam sensor (not shown) for monitoring the presence or absence of bubbles in the piping (step 6).
[0083]
Then, when the resist solution containing bubbles no longer flows to the waste liquid piping 116 side, the first three-way valve 113 is switched to communicate between the vent piping 108a and the vent piping 108b (step 7).
[0084]
By switching the first three-way valve 113, the resist solution flows from the vent pipe 108a to the vent pipe 108b. The resist liquid flows into the supply pipe 107 b again through the cross branch pipe 110, merges with the resist liquid pumped up from the resist liquid tank 101, and flows toward the filter 105. At first, since air remains in the vent pipe 108b, bubbles are easily formed. Therefore, for a while, circulating from the supply pipe 107 via the filter 105 and the vent pipe 108 to return to the inside of the supply pipe 107 while continuing to monitor the bubbles in the pipe, and if bubbles are seen, The first three-way valve 116 is switched to remove bubbles from the piping. When no more bubbles are seen, the vent valve 111 is closed to end the bubble removal operation (step 8).
[0085]
Next, a bubble removal operation in the case where the formation of bubbles in the piping is confirmed during the normal operation of discharging the resist liquid onto the wafer W will be described.
[0086]
FIG. 8 is a flowchart showing a procedure in a case where the bubble removing operation in the pipe is performed during the normal operation of the resist liquid supply device.
[0087]
If bubbles are found in the piping during normal operation, the purge valve 112 is first opened to prevent the resist solution from flowing to the resist nozzle 60 (steps 11 and 12). With this operation, the resist liquid flows from the discharge pump 106 to the purge pipe 109a side. At the same time as the operation of opening the purge valve 112, the second three-way valve 114 is switched to make communication between the purge pipe 109a and the waste liquid pipe 115 (Step 13).
[0088]
In this state, the discharge pump 106 is operated to discharge the resist solution containing bubbles from the purge pipe 109a to the waste liquid pipe 115 (Step 14).
[0089]
The state of the resist solution flowing out to the waste liquid pipe 115 side is monitored by the naked eye or by a bubble sensor (not shown), and a timing at which the resist solution containing bubbles is switched to a resist solution containing no bubbles (step 16).
[0090]
When the resist solution containing no bubbles comes out, the second three-way valve 114 is switched again to communicate between the purge pipe 109a and the purge pipe 109b (step 17).
[0091]
When the bubble removal operation in the pipe is completed, the purge valve 112 is closed (step 18), and the resist liquid flows from the discharge pump 106 to the resist nozzle 60 side.
[0092]
As described in detail above, in the resist liquid supply apparatus of the present embodiment, the first three-way valve 113 is provided in the vent pipe 108, and the waste liquid pipe 116 or the supply pipe 107 is connected to the vent pipe via the first three-way valve 113. Since it is selectively connected to the pipe 108, only the resist liquid containing bubbles in the supply pipe 107 can be discarded by appropriately switching the first three-way valve 113. Therefore, the wasteful disposal of the resist solution can be almost eliminated.
[0093]
In the resist liquid supply apparatus of the present embodiment, a second three-way valve 114 is provided in the purge pipe 109, and the waste liquid pipe 115 or the supply pipe 107 is selectively connected to the purge pipe 109 via the second three-way valve 114. The bubble can be removed from the purge pipe 109 by appropriately switching the second three-way valve 114. Therefore, it is possible to prevent the resist liquid containing bubbles from being recirculated, so that the discharge amount of the resist liquid can be accurately controlled.
[0094]
The present invention is not limited to the contents described in the above embodiment.
[0095]
That is, in the above embodiment, both the vent pipe and the purge pipe are communicated with the supply pipe, and the three-way valve is disposed in both the vent pipe and the purge pipe, and the vent pipe and the purge pipe generate gas in the pipe from either the vent pipe or the purge pipe. Although the bubble removing operation can be performed on the foam, the bubble removing operation may be performed by disposing a three-way valve only in one of the vent pipe and the purge pipe and switching the three-way valve.
[0096]
Furthermore, in the above-described embodiment, the configuration in which confirmation is made with the naked eye whether or not the resist solution containing bubbles remains in the piping, but whether or not bubbles are contained in the resist solution passing through the piping is determined. Monitoring may be performed using a foam sensor to be detected, and the three-way valve may be switched based on the detection result of the foam sensor.
[0097]
In this case, a foam sensor is provided in the vent pipe, and when the presence of bubbles in the vent pipe is detected by the foam sensor, the vent-side three-way valve is switched to discard the resist solution containing bubbles to the waste liquid pipe side. When the bubbles are no longer detected, the vent-side three-way valve is switched to control to join the supply pipe to remove the bubbles in the vent pipe.
[0098]
On the other hand, when removing bubbles from the purge pipe side, a bubble sensor is provided in the middle of the purge pipe, and when the presence of bubbles in the purge pipe is detected by the bubble sensor, the purge side three-way valve is switched to switch the bubble. Is switched to a waste liquid pipe side, and when bubbles are no longer detected, the purge side three-way valve is switched to control to join the supply pipe to remove bubbles in the purge pipe.
[0099]
Also, a bubble sensor is provided in the middle of the supply pipe, and when the generation of bubbles is detected in the supply pipe, the purge valve is closed and the resist solution containing bubbles is moved to the purge pipe side. As described above, the purge-side three-way valve may be appropriately switched based on the detection result of the bubble sensor in the purge pipe to discard the resist solution containing bubbles into the waste liquid pipe.
[0100]
Furthermore, as a method for removing the resist solution containing bubbles in the piping, when a new resist solution is installed, the amount of the resist solution supplied immediately after the start of the supply of the resist likely to contain bubbles is determined in advance by an experiment or the like. After installation, a predetermined amount of resist solution is set to be discarded after installation, and a predetermined amount of resist solution discharged first is programmed in advance in the control device so that these are unconditionally drained. It is also possible to do this.
[0101]
In the above embodiment, the resist coating apparatus for the wafer W has been described as an example. However, it can be said that the present invention can be similarly applied to other apparatuses, for example, a resist coating apparatus or a processing apparatus for a glass substrate for a liquid crystal device. Not even.
[0102]
(Second embodiment)
Next, a second embodiment of the present invention will be described below. Note that, in the present embodiment, the description of the same parts as those in the first embodiment will be omitted. FIG. 9 is a diagram schematically illustrating a configuration of a processing liquid supply device according to the present embodiment. As shown in FIG. 9, in this processing liquid supply device, a resist container 130, a pump 140, a filter 150, and a discharge nozzle 160 are arranged in this order. These are connected by a supply pipe 170, and the resist solution in the resist container 130 is sent to a discharge nozzle 160 via a pump 140 and a filter 150, and is discharged from the discharge nozzle 160 to the wafer W. Further, in this processing liquid supply apparatus, the filter 150 and the supply pipe upstream of the pump 140 in the resist movement direction are connected by a bypass pipe 180, and a waste liquid pipe 190 branches in the middle of the bypass pipe. . A three-way valve 200 is provided at a junction between the waste liquid pipe 190 and the bypass pipe 180.
[0103]
The pump 140 and the three-way valve 200 are electrically connected to a control unit 210, and the control unit 210 controls the pump 140 and the three-way valve 200 as a whole.
[0104]
When operating this processing liquid supply device, the pump 140 and the three-way valve 200 are operated at an appropriate timing to remove bubbles from inside the pipe 170.
[0105]
For example, when the apparatus is started, or when air enters the pipe 170 by exchanging the resist solution in the resist container 130, the three-way valve 200 is first switched to the waste liquid pipe 190 side, and the pump 140 is operated to operate the resist. Start feeding. The resist container flows from the pipe 130 to the pipe, the pump 140 and the filter 150, but initially, most of the bubbles are. While there are many bubbles, the resist flows from the three-way valve 200 to the waste liquid pipe 190 side and is discarded. When the bubbles disappear after a while, the three-way valve 200 is switched so that the resist flows from the filter 150 into the pipe on the upstream side of the pump 140.
[0106]
By appropriately switching the three-way valve 200 in this manner, bubbles accumulated in the filter 150 can be efficiently removed.
[0107]
As a modification of the present embodiment, as shown in FIG. 10, a filter 150 is provided between the pump 140 and the resist container 130, and a bypass is provided between the pump 140 and the supply pipe on the upstream side of the filter 150. The waste liquid pipe 190 may be connected to the bypass pipe 180 via a three-way valve 200.
[0108]
Further, as shown in FIG. 11, separate bypass pipes are connected to both the filter 150 and the pump 140 and connected to a supply pipe upstream of the filter 150 and the pump 140, and the waste liquid is connected to each bypass pipe via a three-way valve. It is good also as a structure which connects a pipe. With such a configuration, bubbles accumulated in each of the filter 150 and the pump 140 can be efficiently removed.
[0109]
(Third embodiment)
FIG. 12 is a schematic diagram showing a processing liquid supply device according to the third embodiment of the present invention. In the treatment liquid supply device 30, the same components as those in the first and second embodiments are denoted by the same reference numerals.
[0110]
A vent pipe 71 provided between the filter 105 and the branch pipe 110 and a purge pipe 72 provided between the discharge pump 106 and the branch pipe 110 are branched from each other. The downstream portion of the return pipe 27 is connected to the resist tank 101. The vent pipe 71 is provided with a vent-side three-way valve 35 for communicating between the filter 105 and the branch pipe 110 or the return pipe 27. A purge-side three-way valve 36 is provided for communicating with the branch pipe 110 or the return pipe 27. The vent-side three-way valve 35 is disposed above the filter 105, and the purge-side three-way valve 36 is disposed above the discharge pump 106, so that bubbles mixed in the filter 105 and the discharge pump 106 can flow efficiently to the return pipe 27 side. Can be. The return pipe 27 joins from the vent-side three-way valve 35 and the purge-side three-way valve 36 to form one pipe. However, two pipes may be used without being joined.
[0111]
Between the vent-side three-way valve 35 and the branch pipe 110, the vent-side three-way valve 35 and the branch pipe 110 communicate, or the vent-side three-way valve 35 and the waste liquid pipe 43 communicate, or the branch pipe 110 and the waste liquid A vent-side switching valve 41 that communicates with the pipe 43 is provided. Similarly, on the purge side, between the purge-side three-way valve 36 and the branch pipe 110, the purge-side three-way valve 36 and the branch pipe 110 are connected, or the purge-side three-way valve 36 and the waste liquid pipe 44 are connected, Alternatively, a purge-side switching valve 42 for communicating the branch pipe 110 with the waste liquid pipe 44 is provided. A vent-side sensor 33 is provided between the filter 105 and the vent-side three-way valve 35 as means for detecting the presence of bubbles passing from the supply pipe 107 to the vent pipe upstream portion 71a. A purge side sensor 34 is provided as means for detecting the presence of bubbles passing from the supply pipe 107 to the purge pipe upstream portion 72a.
[0112]
On the upstream side of the vent-side sensor 33 and on the upstream side of the purge-side sensor 34, in order to efficiently detect bubbles by the sensors 33 and 34, the pipes are slightly vibrated to collect many small bubbles. The vent-side vibrator 31, the purge-side vibrator 31, and the purge-side vibrator 32 are provided respectively.
[0113]
The supply pipe 107f is provided with a supply pipe valve 57 for stopping the supply of the resist toward the resist nozzle 60.
[0114]
Further, in the branch pipe 110, a nitrogen gas cylinder 56 is disposed via a valve 58 as processing liquid removing means for removing the processing liquid in the branch pipe 110, the supply pipe 107, the vent pipe 71, and the purge pipe 72. ing.
[0115]
Further, the three-way valves 35 and 36, the switching valves 41 and 42, the sensors 33 and 34, the vibrators 31 and 32, and the opening and closing of the drain valve 38 provided in the waste pipe of the liquid end sensor 103 and the supply pipe valve A control unit 45 that controls the opening and closing of the unit 57 is provided.
[0116]
Next, a method for removing bubbles in the pipe 107 when the operating processing liquid supply device 30 is temporarily stopped and then restarted (during normal operation) will be described with reference to the flowchart shown in FIG.
[0117]
First, when the processing liquid supply device 30 is operating, the vent-side switching valve 41 is always in a state in which the vent-side three-way valve 35 and the branch pipe 110 communicate with each other according to a command from the control unit 45. Since the length of the pipe from the vent side three-way valve 35 to the vent side sensor 33 and the amount of the processing liquid flowing through the vent pipe 71 per unit time are set values, the bubbles detected by the vent side sensor 33 The time T1 required to reach the valve 35 is set in advance. Note that the vent-side vibrator 31 is slightly vibrated in order to collect as many bubbles as possible in the pipe.
[0118]
When the first bubble of a certain amount of foam is detected by the vent-side sensor 33 (S2), the supply pipe valve 57 is closed according to a command from the control unit 45, and after the predetermined time T1, the vent-side three-way valve is closed. 35 is connected to the return pipe 27 side (S3). Then, the control unit 45 stores a time ΔT from when the vent-side sensor 33 starts detecting the first foam to when the last foam of a large number of foams is detected to some extent. Then, after detecting the last bubble (S4), a predetermined time, for example, a time T2 is set in advance, and the supply pipe valve 57 is opened after the elapse of the time T2 (S5). Then, after a lapse of time ΔT + T2 since the vent-side three-way valve 35 is connected to the return pipe 27, the vent-side three-way valve 35 is connected to the branch pipe 110 (S6). As a result, the processing liquid containing bubbles is all returned to the resist tank 101 by the return pipe 27 without being discarded, while the processing liquid containing no bubbles is all passed from the vent pipe 71 to the branch pipe 110. To the supply pipe 107 again. As a result, useless disposal of the processing liquid can be prevented. Note that these series of operations are fully automatically controlled by the control unit 45.
[0119]
Since the above-described bubble removing method has the same operation on the vent pipe 71 side and the purge pipe 72 side, the description on the purge pipe 72 side is omitted.
[0120]
Next, a case where the inside of the pipe is cleaned with a thinner after the operating processing liquid supply device 30 is stopped (after the coating process on the wafer is terminated and the processing liquid supply device 30 is stopped). explain. Since the vent pipe 71 side and the purge pipe 72 side have the same action, only the vent pipe 71 side will be described.
[0121]
First, the connection between the resist tank 101 and the supply pipe 107 is disconnected, and the drain valve 38 of the liquid end sensor 103 is opened. Then, after the branch pipe 110 side and the waste liquid pipe 43 (44) are communicated with each other by the vent side switching valve 41 (purge side switching valve 42), the valve 58 of the nitrogen gas cylinder 56 is opened to supply the supply pipe 107a by the gas force. The processing liquid remaining in 107b, the branch pipe 110, and the vent pipe 71b (purge pipe 72b) is discarded from the waste liquid pipes 39 and 43 (44).
[0122]
Next, the drain valve 38 of the liquid end sensor 103 is closed, and the vent-side three-way valve 35 (purge-side three-way valve 36) and the waste liquid pipe 43 are communicated by the vent-side switching valve 41 (purge-side switching valve 42). Then, the vent-side three-way valve 35 (purge-side three-way valve 36) is switched to the branch pipe 110 side to operate the supply pump 104 and the discharge pump 106. At this time, the nitrogen gas remains jetted. Thereby, the processing liquid remaining in the supply pipe 107 and the vent pipe 71a (purge pipe 72a) is discarded from the waste liquid pipe 43 (44).
[0123]
Thereafter, a tank (not shown) containing the thinner is connected to the supply pipe 107, the liquid end sensor 103 and the drain valve 38 are closed, and the branch pipe 110 is opened by the vent-side switching valve 41 (purge-side switching valve 42). And the waste liquid pipe 43 (44), and the vent-side three-way valve 35 (purge-side three-way valve 36) is switched to the return pipe 27 side to operate each of the pumps 104 and 106 and the gas force of the nitrogen gas cylinder 56. Thus, the thinner is discarded from the waste liquid pipe 43 (44) and dried while flowing the thinner into the supply pipe 107, the branch pipe 110, and the vent pipe 71b (purge pipe 72b).
[0124]
Next, the vent-side switching valve 41 allows the vent-side three-way valve 35 to communicate with the waste liquid pipe 43, and connects the vent-side three-way valve 35 to the branch pipe 110 so that the supply pipe 107 and the vent pipe 71 a are connected. While flowing the thinner, the thinner is discarded from the waste liquid pipe 43 (44) and dried.
[0125]
Finally, the vent-side three-way valve 35 (purge-side three-way valve 36) is connected to the return pipe 27, and the thinner is returned to the thinner tank in the supply pipe 107 and the return pipe 27 and dried. These series of operations are fully automatically controlled by the control unit 45.
[0126]
As a result, all the pipes can be completely automatically washed with thinner and dried with nitrogen gas, so that the used processing liquid is completely removed. Therefore, when a new resist described later is installed, there is no possibility that the used processing liquid and the new processing liquid are confused.
[0127]
Next, a case where a new resist (processing liquid) is filled into the pipes of the processing liquid supply device 30 after thinning the inside of each pipe with thinner will be described. In this case, as in the case of thinner cleaning, the processing liquid supply device 30 is not operated (the coating process is not performed on the wafer). Since the vent pipe 71 side and the purge pipe 72 side have the same function, only the vent pipe 71 side will be described.
[0128]
First, a new resist tank is connected to the supply pipe 107, the drain valve 38 of the liquid end sensor 103 is closed, and the supply pipe valve 57 is opened, and the processing liquid is supplied to the supply pipe 107 by operating the pumps 104 and 106. inject. The processing liquid is filled into each of the vent pipe 71, the purge pipe 72, and the return pipe 27 by appropriately switching the vent-side three-way valve 35 (purge-side three-way valve 36) and the vent-side switching valve 41 (purge-side switching valve 42). I do.
[0129]
Since the amount of bubbles in each pipe after the new resist is filled is larger than the amount of bubbles in the normal operation described above, the bubbles are manually removed.
[0130]
To remove bubbles, the supply pipe valve 57 is closed while the pumps 104 and 106 are operated, and the vent-side three-way valve 35 (purge-side three-way valve) is operated by the vent-side switching valve 41 (purge-side switching valve 42). 36) and the branch pipe 110, and while circulating the processing liquid from the supply pipes 107b to 107e to the supply pipes 107b to 107e again via the vent pipe 71 (purge pipe 72) and the branch pipe 110, The presence of bubbles in the processing liquid is confirmed by the vent side sensor 33 (purge side sensor 34). At this time, the use of the vent side vibrator 31 (purge side vibrator 32) is optional. Then, when bubbles are detected, the vent-side switching valve 41 (purge-side switching valve 42) is switched to the waste liquid pipe 43 (44) to discard the processing liquid containing bubbles. Regarding the return pipe 27, even after the device 30 is operated, it is not necessary to remove the bubbles since the bubbles are mixed. That is, the return pipe 27 is a pipe for returning only the processing liquid containing bubbles to the resist tank 101 as described above.
[0131]
Thereafter, the supply pipe valve 57 is opened to start the processing liquid supply device 30, and the coating process on the wafer is started. Then, the bubble removing operation is performed in the same sequence as in the normal operation described above.
[0132]
In the third embodiment described above, the bubble removal may be performed by manual operation during the normal operation and when the inside of the pipe is cleaned with the thinner.
[0133]
According to the present invention, while a branch pipe is provided in a pipe between the container and the pump, a three-way valve is provided in a bypass pipe connecting the branch pipe and the pump, and a pipe is formed by switching the three-way valve. Since the inside is defoamed, the processing liquid is not wasted.
[0134]
Further, according to the present invention, a circulation path returning from the supply pipe to the supply pipe via the filter and the filter via the vent pipe is formed, and a vent-side three-way valve is provided in the vent pipe, and the vent-side three-way valve is provided. Since the operation for removing bubbles in the piping is performed by switching, the processing liquid containing no bubbles is not discarded, and the processing liquid can be prevented from being discarded unnecessarily.
[0135]
Furthermore, according to the present invention, a circulation path returning from the supply pipe to the supply pipe via the discharge pump and the discharge pump via the purge pipe is formed, and a purge-side three-way valve is provided in the purge pipe to form the purge-side three-way valve. Since the bubble removal operation in the pipe is performed by switching the valve, the processing liquid containing no bubbles is not discarded, and the processing liquid can be prevented from being discarded unnecessarily.
[0136]
Furthermore, according to the present invention, a circulation path is formed to return from the supply pipe to the supply pipe via the filter and the filter to the supply pipe again via the vent pipe. A circulation path returning from the pump and the discharge pump to the supply pipe again via the purge pipe is formed, a purge-side three-way valve is disposed in the purge pipe, and the above-described vent-side three-way valve and purge-side three-way valve are switched to form a pipe. Since the internal bubble removal operation is performed, the bubble removal operation can be performed from either the vent side or the purge side. Therefore, the bubble removing operation can be appropriately performed not only at the time of installing the processing liquid or replacing the filter, but also at the time of normal operation.
[0137]
Further, according to the present invention, during the normal operation, the processing liquid mixed with bubbles in the supply pipe is all returned to the processing liquid supply source by the return pipe without being discarded, while the processing liquid without bubbles is mixed. All the liquid is returned from the purge pipe to the supply pipe via the branch pipe. As a result, useless disposal of the processing liquid can be prevented.
[0138]
The embodiments described above are intended only to clarify the technical contents of the present invention, and the present invention is not limited to such specific examples and is not interpreted in a narrow sense. Various modifications are possible within a range based on the same technical idea as described above.
[0139]
【The invention's effect】
According to the present invention, while a branch pipe is provided in a pipe between the container and the pump, a three-way valve is provided in a bypass pipe connecting the branch pipe and the pump, and a pipe is formed by switching the three-way valve. Since the inside is defoamed, wasteful disposal of the processing liquid is prevented.
[Brief description of the drawings]
FIG. 1 is a plan view of a coating and developing system including a resist coating unit according to an embodiment of the present invention.
FIG. 2 is a front view of a coating and developing system including a resist coating unit according to an embodiment of the present invention.
FIG. 3 is a rear view of the coating and developing system including the resist coating unit according to the embodiment of the present invention.
FIG. 4 is a schematic sectional view of a resist coating unit according to the embodiment.
FIG. 5 is a schematic plan view of a resist coating unit according to the embodiment.
FIG. 6 is a schematic diagram of a resist supply system of the resist coating unit according to the present embodiment.
FIG. 7 is a flowchart of a bubble removal operation when the resist supply device according to the present embodiment is temporarily stopped and then restarted.
FIG. 8 is a flowchart of a bubble removal operation performed during a normal operation of the resist liquid supply device according to the present embodiment.
FIG. 9 is a diagram schematically showing a configuration of a resist liquid supply device according to a second embodiment of the present invention.
FIG. 10 is a schematic diagram of a resist liquid supply device according to a modification of the second embodiment of the present invention.
FIG. 11 is a schematic view of a resist liquid supply device according to a modification of the second embodiment of the present invention.
FIG. 12 is a schematic view showing a processing liquid supply device according to a third embodiment of the present invention.
FIG. 13 is a flowchart of a bubble removal operation when the resist supply device according to the third embodiment of the present invention is once stopped and then restarted.
FIG. 14 is a schematic diagram of a resist supply system of a conventional resist coating unit.
[Brief description of reference numerals]
W: wafer (substrate to be processed),
60 resist nozzle (discharge means),
101: Resist liquid tank (container),
107 ... supply pipe,
104 supply pump (pump),
106 ... discharge pump (pump),
120 ... control unit (control means),
110 ... cross branch pipe (branch pipe),
108 vent pipe (bypass pipe),
109 ... purge pipe (bypass pipe)
113... First three-way valve (three-way valve),
114... A second three-way valve (three-way valve),
105 Filter.

Claims (17)

Discharging means for discharging the processing liquid to the substrate to be processed,
A processing liquid supply source containing the processing liquid,
A supply pipe connecting the discharge unit and the processing liquid supply source,
A pump arranged in the supply pipe,
Means for controlling the operation of the pump;
A branch pipe disposed in a pipe between the processing liquid supply source and the pump,
A bypass pipe connecting the branch pipe and the pump,
A waste liquid pipe branched from the bypass pipe,
Disposed in the bypass pipe, and a three-way valve for communicating between the branch pipe and the waste liquid tube to the pump,
Means for switching the three-way valve;
A processing liquid supply device comprising: Discharging means for discharging the processing liquid to the substrate to be processed,
A processing liquid supply source containing the processing liquid,
A supply pipe connecting the discharge unit and the processing liquid supply source,
A discharge pump arranged in the supply pipe,
A supply pump disposed in a supply pipe between the discharge pump and the processing liquid supply source,
Means for controlling the operation of the discharge pump and the supply pump,
A filter disposed on a supply pipe between the discharge pump and the supply pump,
A branch pipe disposed in a supply pipe between the supply pump and the processing liquid supply source,
A vent pipe connecting the filter and the branch pipe,
A waste liquid pipe branched from the vent pipe,
Disposed in the vent pipe, a vent-side three-way valve for communicating between the branch pipe and the waste liquid tube to the filter,
Means for switching the vent-side three-way valve,
A processing liquid supply device comprising: Discharging means for discharging the processing liquid to the substrate to be processed,
A processing liquid supply source containing the processing liquid,
A supply pipe connecting the discharge unit and the processing liquid supply source,
A discharge pump arranged in the supply pipe,
A supply pump disposed in a supply pipe between the discharge pump and the processing liquid supply source,
Means for controlling the operation of the discharge pump and the supply pump,
A filter disposed on a supply pipe between the discharge pump and the supply pump,
A branch pipe disposed in a supply pipe between the supply pump and the processing liquid supply source,
A purge pipe connecting between the discharge pump and the branch pipe,
A waste liquid pipe branched from the purge pipe,
Disposed in the purge pipe, a purge-side three-way valve for communicating between the branch pipe and the waste liquid pipe to the discharge pump,
Means for switching the purge-side three-way valve;
A processing liquid supply device comprising: Discharging means for discharging the processing liquid to the substrate to be processed,
A processing liquid supply source containing the processing liquid,
A supply pipe connecting the discharge unit and the processing liquid supply source,
A discharge pump arranged in the supply pipe,
A supply pump disposed in a supply pipe between the discharge pump and the processing liquid supply source,
Means for controlling the operation of the discharge pump and the supply pump,
A filter disposed on a supply pipe between the discharge pump and the supply pump,
A branch pipe disposed in a supply pipe between the supply pump and the processing liquid supply source,
A vent pipe connecting the filter and the branch pipe,
A first waste pipe branched from the vent pipe;
A first three-way valve disposed on the vent pipe and communicating the filter with the branch pipe or the first waste liquid pipe;
Means for switching the first three-way valve;
A purge pipe connecting between the discharge pump and the branch pipe,
A second waste pipe branched from the purge pipe;
A second three-way valve disposed on the purge pipe and communicating the discharge pump with the branch pipe or the second waste pipe;
Means for switching the second three-way valve;
A processing liquid supply device comprising: Discharging means for discharging the processing liquid to the substrate to be processed,
A processing liquid supply source containing the processing liquid,
A supply pipe connecting the discharge unit and the processing liquid supply source,
A pump for supplying a processing liquid from the processing liquid supply source to a discharge unit,
A filter inserted into a supply pipe between the pump and the discharge means,
A bypass pipe connecting the filter and a supply pipe on an upstream side of the pump,
A waste liquid pipe branched from the bypass pipe,
A switching valve for switching the processing liquid in the bypass pipe to the pump upstream side and the waste liquid pipe,
A processing liquid supply device comprising: The processing liquid supply device according to claim 5, further comprising a control unit that controls operation timing of the pump and the switching valve. Discharging means for discharging the processing liquid to the substrate to be processed,
A processing liquid supply source containing the processing liquid,
A supply pipe connecting the discharge unit and the processing liquid supply source,
A pump for supplying a processing liquid from the processing liquid supply source to a discharge unit,
A filter inserted into a supply pipe between the processing liquid supply source and a pump,
A bypass pipe connecting the pump and a supply pipe on the upstream side of the filter,
A waste liquid pipe branched from the bypass pipe,
A switching valve for switching the processing liquid in the bypass pipe to the filter upstream side and the waste liquid pipe,
A processing liquid supply device comprising: The processing liquid supply device according to claim 7, further comprising a control unit that controls operation timings of the pump and the switching valve. Discharging means for discharging the processing liquid to the substrate to be processed,
A processing liquid supply source containing the processing liquid,
A supply pipe connecting the discharge unit and the processing liquid supply source,
A pump for supplying a processing liquid from the processing liquid supply source to a discharge unit,
A filter inserted into a supply pipe between the processing liquid supply source and a pump,
A first bypass pipe connecting the filter and a supply pipe on an upstream side of the pump,
A first waste pipe branched from the first bypass pipe,
A first switching valve that switches the processing liquid in the first bypass pipe to the pump upstream side and the first waste liquid pipe;
A second bypass pipe connecting the pump and a supply pipe upstream of the filter;
A second waste pipe branched from the second bypass pipe,
A second switching valve for switching the processing liquid in the second bypass pipe to the upstream side of the filter and the second waste liquid pipe;
A processing liquid supply device comprising: The processing liquid supply device according to claim 9, further comprising a control unit that controls operation timings of the pump, the first switching valve, and the second switching valve. Discharging means for discharging the processing liquid to the substrate to be processed,
A processing liquid supply source containing the processing liquid,
A supply pipe connecting the discharge unit and the processing liquid supply source,
A pump arranged in the supply pipe,
Means for controlling the operation of the pump;
A branch pipe disposed in a supply pipe between the processing liquid supply source and the pump,
A bypass pipe connecting the pump and the branch pipe;
A return pipe branching from the bypass pipe and connecting between the processing liquid supply source,
A first three-way valve disposed on the bypass pipe and communicating the pump with the bypass pipe or the return pipe;
Means for switching the first three-way valve;
A waste liquid pipe that is disposed between the first three-way valve and the branch pipe and branches from the bypass pipe;
A second three-way valve communicating between disposed, the bypass pipe or the waste liquid tube to the first three-way valve between the branch pipe and the first three-way valve,
Means for switching the second three-way valve;
A processing liquid supply device comprising: Discharging means for discharging the processing liquid to the substrate to be processed,
A processing liquid supply source containing the processing liquid,
A supply pipe connecting the discharge unit and the processing liquid supply source,
A discharge pump arranged in the supply pipe,
A supply pump disposed in a supply pipe between the discharge pump and the processing liquid supply source,
Means for controlling the operation of the discharge pump and the supply pump,
A filter disposed on a supply pipe between the discharge pump and the supply pump,
A branch pipe disposed in a supply pipe between the supply pump and the processing liquid supply source,
A vent pipe connecting the filter and the branch pipe,
A purge pipe connecting between the discharge pump and the branch pipe,
A return pipe branching from the vent pipe and the purge pipe and connecting between the processing liquid supply source,
A vent-side three-way valve disposed on the vent pipe and communicating the filter with the branch pipe or the return pipe;
Means for switching the vent-side three-way valve,
A purge-side three-way valve that is disposed on the purge pipe and communicates the discharge pump with the branch pipe or the return pipe;
Means for switching the purge-side three-way valve;
A first waste liquid pipe disposed between the vent-side three-way valve and the branch pipe, and branched from the vent pipe;
Disposed in the vent pipe, communicates the vent side three-way valve with the branch pipe, or communicates the vent side three-way valve with the first waste liquid pipe, or the branch pipe and the first waste liquid A vent-side switching valve for communicating with the pipe,
Means for switching the vent-side switching valve;
A second waste pipe disposed between the purge-side three-way valve and the branch pipe, and branched from the purge pipe;
The purge pipe is disposed to communicate the purge side three-way valve with the branch pipe, or the purge side three-way valve is communicated with the second waste pipe, or the branch pipe and the second waste liquid are connected to each other. A purge side switching valve for communicating with the pipe;
Means for switching the purge side switching valve,
A processing liquid removing unit disposed on the branch pipe, for removing a processing liquid in the branch pipe, the supply pipe, the vent pipe, and the purge pipe;
A processing liquid supply device comprising: The processing liquid supply apparatus according to claim 11, further comprising a unit disposed between the filter and the vent-side three-way valve and configured to detect a vent-side bubble. Liquid supply device. The processing liquid supply device according to claim 11, further comprising a unit disposed between the discharge pump and the purge-side three-way valve and configured to detect purge-side bubbles. Processing liquid supply device. The processing liquid supply device according to claim 14, wherein a predetermined timing is set based on detection of bubbles existing in the vent pipe and the purge pipe by the vent-side bubble detection unit and the purge-side bubble detection unit. And a control means for switching between the vent-side three-way valve, the purge-side three-way valve, the vent-side switching valve, and the purge-side switching valve. 15. The processing liquid supply device according to claim 14, further comprising a vent-side vibrator disposed between the filter and the vent-side bubble detecting means. 15. The processing liquid supply device according to claim 14, further comprising a purge-side vibrator disposed between the discharge pump and the purge-side bubble detection means.

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