JP3559182B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate processing apparatus provided with a processing liquid discharge nozzle for discharging a processing liquid and a substrate processing method.
[0002]
[Prior art]
2. Description of the Related Art A developing device is used to perform a developing process on a photosensitive film formed on a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, and a substrate for an optical disk.
[0003]
For example, a rotary developing device includes a rotation holding unit that holds a substrate horizontally and rotates it around a vertical axis, and a developer discharge nozzle that supplies a developer to the surface of the substrate. The developer discharge nozzle is attached to the tip of a nozzle arm rotatably provided in a horizontal plane, and can move between a position above the substrate and a standby position outside the substrate.
[0004]
During the development process, the developer is supplied to a photosensitive film such as a photoresist on the substrate after the developer discharge nozzle moves from the standby position to a position above the substrate. The supplied developer is spread over the entire surface of the substrate by the rotation of the substrate, and comes into contact with the photosensitive film. The development of the photosensitive film is performed by stopping the substrate for a certain period of time while the developing solution is held on the substrate by the surface tension (liquid level). When the supply of the developing solution is completed, the developing solution discharge nozzle moves to a standby position deviated from above the substrate by the rotation of the nozzle arm.
[0005]
[Problems to be solved by the invention]
In the above-described conventional rotary developing device, the photosensitive film on the substrate is subjected to a large impact when the developing solution at the start of the discharge is applied to the rotating substrate. Bubbles are generated in the developer by the impact, and minute bubbles remaining on the surface of the photosensitive film may cause development defects. In addition, the photosensitive film may be damaged by the impact of the developer at the start of ejection.
[0006]
Therefore, the inventor linearly moves the developing solution discharge nozzle from one end to the other end of the substrate while discharging the developing solution from the developing solution discharge nozzle having the slit-shaped discharge port, thereby supplying the developing solution. There has been proposed a developing method of supplying a developer with a uniform impact force on a substrate while suppressing the flow of the developer on the substrate in an initial stage.
[0007]
In this developing method, as shown in FIG. 10, the developer discharge nozzle 20 passes over the substrate 100 from one position outside the substrate 100 while discharging the developer from the slit-shaped discharge port 23, and The developer is supplied onto the substrate 100 by moving the substrate to a position on the other side of the above, and the liquid is stored.
[0008]
FIG. 11 is a plan view of the substrate supplied with the developing solution of FIG. The arrow in the figure indicates the scanning direction of the developer discharge nozzle 20. The region 21 is a region to which the developing solution is supplied, and the region 22 is a region to which the developing solution is not supplied.
[0009]
As described above, when the developer discharge nozzle 20 is scanned from one edge to the other edge of the substrate 100 while discharging the developer from the slit-like discharge port 23 onto the substrate 100, the developer is discharged onto the other edge of the substrate 100. It has been found that an area 22 where the developer is not supplied may occur.
[0010]
An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of uniformly supplying a processing liquid to the entire surface of a substrate.
[0011]
Means for Solving the Problems and Effects of the Invention
The present inventor conducted various experiments and studies in order to elucidate the cause of the occurrence of a region where the developing solution is not supplied on the substrate. As a result, the processing solution discharging that scans the substrate while discharging the processing liquid onto the substrate was performed. When the nozzle separates from the edge of the substrate, the processing liquid is pulled from the edge of the substrate by surface tension, and the pulled processing liquid is broken. It has been found that by being pulled back to the center of the substrate, a region free of the processing liquid is generated at the edge of the substrate. Based on the above findings, the inventor has devised the following invention.
[0012]
A substrate processing apparatus according to a first aspect of the present invention includes a substrate holding unit that holds a substrate, a processing liquid discharge nozzle that discharges a processing liquid, and one side edge of the substrate that is held stationary by the substrate holding unit. Moving means for moving the processing liquid discharge nozzle outside the other edge of the substrate by passing over the substrate; and a processing liquid discharge nozzle while the processing liquid discharge nozzle passes from the center of the substrate to the other edge of the substrate. Speed control means for deceleratingThe processing liquid discharge nozzle discharges the processing liquid linearly in a direction substantially perpendicular to the moving direction of the moving means with a width equal to or larger than the diameter of the substrate, and stops discharging the processing liquid after the processing liquid discharge nozzle passes over the substrate. DoThings.
[0013]
In the substrate processing apparatus according to the present invention, the processing liquid discharge nozzleA straight line in a direction approximately perpendicular to the direction of movement by the moving means with a width equal to or larger than the diameter of the substrateWhile discharging the processing liquid, the substrate passes from above the one edge of the substrate held stationary by the substrate holding means and moves to the outside of the other edge of the substrate. Thereby, the processing liquid is supplied onto the substrate. At this time, the processing liquid discharge nozzle decelerates from the center of the substrate while passing through the other edge of the substrate, and reaches the outside of the other edge of the substrate.
[0014]
As described above, since the processing liquid discharge nozzle decelerates while passing from the center of the substrate to the other edge of the substrate,,When the processing liquid discharge nozzle separates from the other edge of the substrate, the processing liquid pulled by the processing liquid discharge nozzle gently breaks. Therefore, the recoil due to the breakage of the processing liquid is reduced, and the phenomenon that the processing liquid near the edge of the substrate is returned to the center of the substrate does not occur. As a result, the processing liquid is uniformly supplied to the entire surface of the substrate.
[0015]
Further, since the recoil due to the breakage of the processing liquid is small, it is possible to prevent the vibration from being transmitted to the processing liquid on the substrate when the processing liquid pulled by the processing liquid discharge nozzle is broken. As a result, no unevenness occurs in the processing liquid on the substrate.
[0016]
A substrate processing apparatus according to a second aspect of the present invention includes a substrate holding unit that holds a substrate, a processing liquid discharge nozzle that discharges a processing liquid, and one side edge of the substrate held stationary in the substrate holding unit. A moving means for moving the processing liquid discharge nozzle outside the other edge of the substrate by passing over the substrate, and decelerating the processing liquid discharge nozzle to a predetermined speed from the center of the substrate to the other edge of the substrate Speed control means for passing the other edge of the substrate at a constant speed after the processing, and the discharge of the processing liquid is stopped after the processing liquid discharge nozzle has passed over the substrate.
[0017]
In the substrate processing apparatus according to the present invention, the processing liquid discharge nozzle passes over the substrate from outside one edge of the substrate held stationary by the substrate holding means while discharging the processing liquid, and the other side of the substrate. Move to the outside of the edge. Thereby, the processing liquid is supplied onto the substrate. At this time, the processing liquid discharge nozzle decelerates from the center of the substrate while passing through the other edge of the substrate, and reaches the outside of the other edge of the substrate.
[0018]
As described above, the processing liquid discharge nozzle decelerates while passing from the center of the substrate to the other edge of the substrate, and passes through the other edge of the substrate at a constant speed. When separated from the processing liquid, the processing liquid pulled by the processing liquid discharge nozzle gently breaks. Therefore, the recoil due to the breakage of the processing liquid is reduced, and the processing liquid near the edge of the substrate is pulled back to the center of the substrate. Phenomenon does not occur. As a result, the processing liquid is uniformly supplied to the entire surface of the substrate.
[0019]
Further, since the recoil due to the breakage of the processing liquid is small, it is possible to prevent the vibration from being transmitted to the processing liquid on the substrate when the processing liquid pulled by the processing liquid discharge nozzle is broken. As a result, no unevenness occurs in the processing liquid on the substrate.
[0020]
A substrate processing apparatus according to a third aspect of the present invention includes a substrate holding unit that holds a substrate, a processing liquid discharge nozzle that discharges a processing liquid, and one side edge of the substrate that is held stationary by the substrate holding unit. Moving means for moving the processing liquid discharge nozzle outside the other edge of the substrate by passing over the substrate; moving the processing liquid discharge nozzle from one edge of the substrate to the center at a constant speed; Speed control means for decelerating the processing liquid discharge nozzle while the nozzle passes from the center of the substrate to the other edge of the substrate.
[0021]
In the substrate processing apparatus according to the present invention, the processing liquid discharge nozzle passes over the substrate from outside one edge of the substrate held stationary by the substrate holding means while discharging the processing liquid, and the other side of the substrate. Move to the outside of the edge. Thereby, the processing liquid is supplied onto the substrate. At this time, the processing liquid discharge nozzle moves at a constant speed from one edge of the substrate to the center, decelerates while passing from the center of the substrate to the other edge of the substrate, and moves outward from the other edge of the substrate. To reach.
[0022]
In this manner, the processing liquid discharge nozzle moves at a constant speed from one edge of the substrate to the center and decelerates while passing from the center of the substrate to the other edge of the substrate. When the processing liquid is separated from the other edge, the processing liquid pulled by the processing liquid discharge nozzle gently breaks. Therefore, the recoil due to the breakage of the processing liquid is reduced, and the phenomenon that the processing liquid near the edge of the substrate is returned to the center of the substrate does not occur. As a result, the processing liquid is uniformly supplied to the entire surface of the substrate.
[0023]
Further, since the recoil due to the breakage of the processing liquid is small, it is possible to prevent the vibration from being transmitted to the processing liquid on the substrate when the processing liquid pulled by the processing liquid discharge nozzle is broken. As a result, no unevenness occurs in the processing liquid on the substrate.
[0024]
No.4The substrate processing apparatus according to the invention of theOr thirdIn the configuration of the substrate processing apparatus according to the first aspect of the invention, the speed control unit reduces the processing liquid discharge nozzle to a predetermined speed from the center of the substrate to the other edge of the substrate, and then controls the other side of the substrate at a constant speed. It passes through the edge.
[0025]
In this case, the processing liquid discharge nozzle decelerates to a predetermined speed before reaching the other edge of the substrate, and passes through the other edge of the substrate at a constant speed. Therefore, the processing liquid discharge nozzle can pass through the other edge of the substrate at a constant low speed.
[0026]
No.5The substrate processing apparatus according to the invention of theOr thirdIn the configuration of the substrate processing apparatus according to the invention, the speed control means decelerates the processing liquid discharge nozzle continuously or stepwise from the center of the substrate to the outside of the other edge of the substrate.
[0027]
In this case, the processing liquid discharge nozzle decelerates continuously or stepwise until reaching the outside of the other edge of the substrate. Therefore, the processing liquid discharge nozzle can pass through the other edge of the substrate while being decelerated.
[0028]
No.6The substrate processing apparatus according to the invention is, SecondAlternatively, in the configuration of the substrate processing apparatus according to the third invention, the processing liquid discharge nozzle has a width equal to or larger than the diameter of the substrate held by the substrate holding means.
[0029]
In this case, the processing liquid is uniformly supplied to the entire area on the substrate by scanning the processing liquid discharge nozzle once from one edge to the other edge of the substrate.
[0030]
No.7In the substrate processing method according to the invention, the processing liquid is discharged while moving the processing liquid discharge nozzle from outside of one edge of the substrate held in a stationary state to outside of the other edge of the substrate while passing over the substrate. From the nozzleLinear in a direction that is almost perpendicular to the moving direction with a width equal to or larger than the diameter of the substrateA substrate processing method for supplying a processing liquid onto a substrate, wherein the processing liquid discharge nozzle is decelerated while the processing liquid discharge nozzle passes from the center of the substrate to the other edge of the substrate.Stopping the discharge of the processing liquid by the processing liquid discharge nozzle after the processing liquid discharge nozzle has passed over the substrate.Things.
[0031]
In the substrate processing method according to the present invention, the processing liquid discharge nozzle includes:Linear in a direction that is almost perpendicular to the moving direction with a width equal to or larger than the diameter of the substrateWhile discharging the processing liquid, the substrate passes from above the one edge of the substrate held stationary by the substrate holding means and moves to the outside of the other edge of the substrate. Thereby, the processing liquid is supplied onto the substrate. At this time, the processing liquid discharge nozzle decelerates while passing from the center of the substrate to the other edge of the substrate, and then reaches the outside of the other edge of the substrate.
[0032]
As described above, since the processing liquid discharge nozzle decelerates while passing from the center of the substrate to the other edge of the substrate, when the processing liquid discharge nozzle separates from the other edge of the substrate, it is pulled by the processing liquid discharge nozzle. The processing solution that has been broken is gently broken. Therefore, the recoil due to the breakage of the processing liquid is reduced, and the phenomenon that the processing liquid near the edge of the substrate is drawn back to the center of the substrate does not occur. As a result, the processing liquid is uniformly supplied to the entire surface of the substrate.
[0033]
Further, since the recoil due to the breakage of the processing liquid is small, it is possible to prevent the vibration from being transmitted to the processing liquid on the substrate when the processing liquid pulled by the processing liquid discharge nozzle is broken. As a result, no unevenness occurs in the processing liquid on the substrate.
[0034]
A substrate processing method according to an eighth aspect of the present invention is a method of processing while moving a processing liquid discharge nozzle from outside of one edge of a substrate held in a stationary state to outside of the other edge of the substrate while passing over the substrate. A substrate processing method for supplying a processing liquid from a liquid discharge nozzle onto a substrate, wherein the processing liquid discharge nozzle is decelerated to a predetermined speed from the center of the substrate to the other edge of the substrate, and then at a constant speed. The processing liquid discharge nozzle stops passing the processing liquid after the processing liquid discharge nozzle passes over the substrate by passing the other end of the substrate.
[0035]
In the substrate processing method according to the present invention, the processing liquid discharge nozzle passes over the substrate from outside one edge of the substrate held stationary by the substrate holding means while discharging the processing liquid, and the other side of the substrate. Move to the outside of the edge. Thereby, the processing liquid is supplied onto the substrate. At this time, the processing liquid discharge nozzle decelerates while passing from the center of the substrate to the other edge of the substrate, and then reaches the outside of the other edge of the substrate.
[0036]
As described above, the processing liquid discharge nozzle decelerates while passing from the center of the substrate to the other edge of the substrate, and passes through the other edge of the substrate at a constant speed. When separated from the processing liquid, the processing liquid pulled by the processing liquid discharge nozzle gently breaks. Therefore, the recoil due to the breakage of the processing liquid is reduced, and the phenomenon that the processing liquid near the edge of the substrate is drawn back to the center of the substrate does not occur. As a result, the processing liquid is uniformly supplied to the entire surface of the substrate.
[0037]
Further, since the recoil due to the breakage of the processing liquid is small, it is possible to prevent the vibration from being transmitted to the processing liquid on the substrate when the processing liquid pulled by the processing liquid discharge nozzle is broken. As a result, no unevenness occurs in the processing liquid on the substrate.
[0038]
A substrate processing method according to a ninth aspect of the present invention is a method of processing a substrate held from a position outside one edge of a substrate held in a stationary state. A substrate processing method for supplying a processing liquid from a processing liquid discharge nozzle onto a substrate while moving the processing liquid discharge nozzle to the outside of the other edge of the substrate by passing the processing liquid discharge nozzle on the substrate. While moving at a constant speed from one edge to the center, the processing liquid discharge nozzle is decelerated while the processing liquid discharge nozzle passes from the center of the substrate to the other end of the substrate.
[0039]
In the substrate processing method according to the present invention, the processing liquid discharge nozzle passes over the substrate from outside one edge of the substrate held stationary by the substrate holding means while discharging the processing liquid, and the other side of the substrate. Move to the outside of the edge. Thereby, the processing liquid is supplied onto the substrate. At this time, the processing liquid discharge nozzle moves at a constant speed from one edge of the substrate to the center, decelerates while passing from the center of the substrate to the other edge of the substrate, and then moves outside the other edge of the substrate. To reach you.
[0040]
In this manner, the processing liquid discharge nozzle moves at a constant speed from one edge of the substrate to the center and decelerates while passing from the center of the substrate to the other edge of the substrate. When the processing liquid is separated from the other edge, the processing liquid pulled by the processing liquid discharge nozzle gently breaks. Therefore, the recoil due to the breakage of the processing liquid is reduced, and the phenomenon that the processing liquid near the edge of the substrate is drawn back to the center of the substrate does not occur. As a result, the processing liquid is uniformly supplied to the entire surface of the substrate.
[0041]
Further, since the recoil due to the breakage of the processing liquid is small, it is possible to prevent the vibration from being transmitted to the processing liquid on the substrate when the processing liquid pulled by the processing liquid discharge nozzle is broken. As a result, no unevenness occurs in the processing liquid on the substrate.
[0042]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a developing apparatus and a developing method will be described as examples of a substrate processing apparatus and a substrate processing method according to the present invention.
[0043]
FIG. 1 is a plan view of a developing device according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line XX of a main portion of the developing device of FIG. 1, and FIG. 3 is YY of a main portion of the developing device of FIG. It is a line sectional view.
[0044]
As shown in FIGS. 2 and 3, the developing device includes a substrate holding unit 1 that holds the substrate 100 by suction in a horizontal posture. The substrate holding unit 1 is fixed to a tip end of a rotating shaft 3 of a motor 2 and is configured to be rotatable around a vertical axis. Around the substrate holding portion 1, a circular inner cup 4 is provided so as to freely move up and down so as to surround the substrate 100. A square outer cup 5 is provided around the inner cup 4.
[0045]
As shown in FIG. 1, standby pots 6 and 7 are disposed on both sides of the outer cup 5, and a guide rail 8 is disposed on one side of the outer cup 5. The nozzle arm 9 is provided so as to be movable in the scanning direction A and the opposite direction along the guide rail 8 by the arm driving unit 10. On the other side of the outer cup 5, a pure water discharge nozzle 12 for discharging pure water is provided rotatably in the direction of arrow R.
[0046]
A developing solution discharge nozzle 11 having a slit-shaped discharge port 15 at a lower end portion is attached to the nozzle arm 9 perpendicularly to the guide rail 8. Thus, the developer discharge nozzle 11 can move in a straight line in the scanning direction A from the position of the standby pot 6 to the position of the standby pot 7 after passing over the substrate 100.
[0047]
As shown in FIG. 2, a developer is supplied to the developer discharge nozzle 11 by a developer supply system 13. The control unit 14 controls the rotation operation of the motor 2, the scanning of the developer discharge nozzle 11 by the arm drive unit 10, and the discharge of the developer from the developer discharge nozzle 11.
[0048]
As shown in FIG. 4, the slit-shaped discharge port 15 is arranged perpendicular to the scanning direction A of the developer discharge nozzle 11. The slit width t of the slit-shaped discharge port 15 is 0.05 to 1.0 mm, and is 0.2 mm in the present embodiment. Further, the discharge width L of the slit-shaped discharge port 15 is set to be equal to or larger than the diameter of the substrate 100 to be processed, and is set to 210 mm in the present embodiment for processing the substrate 100 having a diameter of 8 inches. .
[0049]
The developer discharge nozzle 11 is scanned in the scanning direction A so that the slit-shaped discharge port 15 is kept parallel to the surface of the substrate 100. The distance between the slit-shaped discharge port 15 and the surface of the substrate 100 is 0.2 to 5 mm, more preferably 0.5 to 2 mm, and is 1.5 mm in this embodiment.
[0050]
In this embodiment, the substrate holding unit 1 corresponds to a substrate holding unit, the developing solution discharge nozzle 11 corresponds to a processing liquid discharge nozzle, the arm driving unit 10 corresponds to a moving unit, and the control unit 14 corresponds to a speed control unit. Equivalent to.
[0051]
1 will be described with reference to FIGS. 5, 6, and 7. FIG. 5 is a front view illustrating the operation of the developing device of FIG. 1, FIG. 6 is a plan view illustrating the operation of the developing device of FIG. 1, and FIG. FIG. 3 is a diagram showing an example of No. 1. In FIG. 7, the horizontal axis represents time, and the vertical axis represents scanning speed.
[0052]
As shown in FIG. 5, the substrate 100 is held by the substrate holding unit 1 in a stationary state. During standby, the developer discharge nozzle 11 is waiting at a position P0 in the standby pot 6.
[0053]
During the development processing, the developer discharge nozzle 11 moves up in the scanning direction A after rising, and descends at the scanning start position P1 in the outer cup 5.
[0054]
Thereafter, as shown in FIGS. 6 and 7, the processing liquid ejection nozzle 11 starts scanning at a constant scanning speed V2 from the scanning start position P1. At this time, the developer is not yet discharged from the developer discharge nozzle 11.
[0055]
After the scan of the developer discharge nozzle 11 starts, before the slit-shaped discharge port 15 of the developer discharge nozzle 11 reaches the substrate 100, the developer is discharged by the developer discharge nozzle 11 at a predetermined flow rate at the discharge start position P2. Start discharging.
[0056]
Further, the developing solution discharge nozzle 11 moves in the scanning direction, and moves at the scanning speed V2 to the deceleration start position P21 at the center of the substrate 100 while discharging the developing solution onto the substrate 100 from the slit-shaped discharge port 15.
[0057]
The developer discharge nozzle 11 starts to decelerate from the deceleration start position P21, and reaches the scanning speed V1 at a position P22 before the substrate edge position P23. Thereafter, the developer discharge nozzle 11 moves at a constant scanning speed V1, and passes through the substrate edge position P23. Thus, the developer is supplied to the entire surface of the substrate 100.
[0058]
Further, the developing solution discharge nozzle 11 moves at the scanning speed V1, and ends the discharge of the developing solution from the slit-shaped discharge port 15 at the discharge end position P3 off the substrate 100.
[0059]
Then, when the developing solution discharge nozzle 11 reaches the scanning stop position P4 in the outer cup 5, the scanning of the developing solution discharge nozzle 11 is stopped.
[0060]
Thereafter, as shown in FIG. 5, the developer discharge nozzle 11 moves up to the position P5 of the standby pot 7 after rising at the scanning stop position P4 and descends into the standby pot 7.
[0061]
The state in which the developing solution is supplied onto the substrate 100 is maintained for a certain time (for example, 60 seconds), and the development proceeds. At this time, the substrate 2 may be rotated by the motor 2 to rotate the substrate 100.
[0062]
Thereafter, the substrate 100 is rotated at, for example, about 1000 rpm, pure water is supplied to the substrate 100 from the pure water discharge nozzle 12 for cleaning, the development is stopped, and a rinsing process is performed with the pure water.
[0063]
Finally, the supply of pure water by the pure water discharge nozzle 12 is stopped, the substrate 100 is rotated at, for example, 4000 rpm, the pure water is shaken off from the substrate 100, and the substrate 100 is dried. After that, the rotation of the substrate 100 is stopped, and the developing process ends.
[0064]
As described above, in the developing device of the present embodiment, the developer discharge nozzle 11 starts to decelerate from the deceleration start position P21 and passes through the substrate edge position P23 at the scanning speed V1, so that the developer discharge nozzle 11 When the developer is separated from the position P23, the developer pulled by the developer discharge nozzle 11 gently breaks. Thus, the developer on the substrate 100 is not pulled back to the center of the substrate 100 due to recoil and surface tension due to the breakage. Therefore, the developer is uniformly supplied to the entire surface of the substrate 100.
[0065]
Further, since the developing solution pulled by the developing solution discharge nozzle 11 is gently broken, transmission of vibration to the developing solution on the substrate 100 is suppressed. As a result, the developer on the substrate 100 does not become uneven.
[0066]
Further, in the developing device of the present embodiment, since the discharge of the developing solution is started before the developing solution discharge nozzle 11 reaches the stationary substrate 100, the developing solution at the time of starting the discharging may impact the substrate 100. Is avoided. Thereby, generation of bubbles in the developer is suppressed, and generation of development defects is prevented.
[0067]
Further, the developing solution in the vicinity of the slit-shaped discharge port 15 which comes into contact with air during the movement of the developing solution discharging nozzle 11 is discarded outside the substrate 100, and when the developing solution discharging nozzle 11 reaches the substrate 100, the developing solution discharging nozzle 11 From 11, a new developer is supplied onto the stationary substrate 100. This prevents generation of development defects due to the deteriorated developer and prevents particles generated by drying of the developer from adhering to the surface of the photosensitive film on the substrate 100.
[0068]
Further, the developing solution discharge nozzle 11 is horizontally and linearly moved in parallel with the slit-shaped discharge port 15 and the upper surface of the substrate 100 close to each other on the substrate 100 on which the developer discharge nozzle 11 is stationary. Since the developer continuously contacts the surface of the substrate 100, the developer is uniformly supplied to the entire surface of the substrate 100 without applying an impact to the surface of the substrate 100.
[0069]
Further, since the supply of the developing solution is continued until the developing solution discharge nozzle 11 passes over the substrate 100, an adverse effect on the developing solution in the liquid pool due to the impact at the time of stopping the discharge is prevented. As a result, development defects are suppressed, and the line width uniformity of the photosensitive film pattern after development is improved.
[0070]
Further, since the discharge of the developing solution is stopped after the developing solution discharging nozzle 11 has passed over the substrate 100, it is possible to prevent the photosensitive film on the substrate 100 from being shocked by the dripping of the developing solution when the discharging is stopped. You. Therefore, occurrence of development defects and deterioration of line width uniformity of the photosensitive film pattern are prevented.
[0071]
FIG. 8 is a diagram showing a second example of the scanning speed of the developing solution discharge nozzle in the developing device of FIG.
[0072]
The difference between the present example and the first example in FIG. 7 is the change in the scanning speed of the developer discharge nozzle 11 from the deceleration start position P21 to the scan stop position P4. Therefore, a description will be given from the deceleration start position P21 to the scanning stop position P4.
[0073]
As shown in FIG. 8, the developing solution discharge nozzle 11 starts to decelerate at a predetermined deceleration from the deceleration start position P21, and reaches the scanning speed V3 at a position P22 before the substrate edge position P23. Further, the developer discharge nozzle 11 decreases the deceleration from the position P22 and passes through the substrate edge position P23 at the scanning speed V1. Thus, the developer is supplied to the entire surface of the substrate 100.
[0074]
The developer discharge nozzle 11 moves to the discharge end position P3 off the substrate 100 while further lowering the scanning speed, and stops the discharge of the developer from the slit-shaped discharge port 15.
[0075]
Then, when the developing solution discharge nozzle 11 reaches the scanning stop position P4 in the outer cup 5, the scanning of the developing solution discharge nozzle 11 is stopped.
[0076]
As described above, in this example, the developer discharge nozzle 11 decreases the deceleration from the position P22 and passes through the substrate edge position P23 at the scanning speed V1, so that the developer discharge nozzle 11 is separated from the substrate edge position P23. At this time, the developing solution pulled by the developing solution discharge nozzle 11 is gradually broken. Thus, the developer on the substrate 100 is not pulled back to the center of the substrate 100 due to recoil and surface tension due to the breakage. Therefore, the developer is uniformly supplied to the entire surface of the substrate 100.
[0077]
Further, since the developing solution pulled by the developing solution discharge nozzle 11 is gently broken, transmission of vibration to the developing solution on the substrate 100 is suppressed. As a result, the developer on the substrate 100 does not become uneven.
[0078]
Further, the developing solution discharge nozzle 11 is controlled so that the deceleration is reduced from the position P22 and becomes the scanning speed V1 at the substrate edge position P23, so that a rapid change in speed is avoided. Therefore, the control of the scanning speed of the developer discharge nozzle 11 becomes easy.
[0079]
FIG. 9 is a diagram showing a third example of the scanning speed of the developer discharge nozzle in the developing device of FIG.
[0080]
This example differs from the first example in FIG. 7 and the second example in FIG. 8 in the change in the scanning speed of the developer discharge nozzle 11 from the deceleration start position 21 to the scan stop position P4. Therefore, a description will be given from the deceleration start position P21 to the scanning stop position P4.
[0081]
As shown in FIG. 9, the developing solution discharge nozzle 11 starts to decelerate from the deceleration start position P21, passes the position P22, the substrate edge position P23, and the discharge end position P3 while decreasing the deceleration, and returns to the scan stop position P4. Stop.
[0082]
The developer discharge nozzle 11 passes through the substrate edge position P23 at the scanning speed V1, and stops the discharge of the developer from the slit-shaped discharge port 15 at the discharge end position P3.
[0083]
As described above, in this example, since the developing solution discharge nozzle 11 that continuously decelerates passes through the substrate edge position P23 at the scanning speed V1, when the developer discharge nozzle 11 separates from the substrate edge position P23, The developing solution pulled by the developing solution discharge nozzle 11 is gradually broken. Thus, the developing solution on the substrate 100 is not pulled back to the central portion on the substrate 100 due to breakage and surface tension. Therefore, the developer is uniformly supplied to the entire surface of the substrate 100.
[0084]
Further, since the developing solution pulled by the developing solution discharge nozzle 11 is gently broken, transmission of vibration to the developing solution on the substrate 100 is suppressed. As a result, the developer on the substrate 100 does not become uneven.
[0085]
Further, since the developing solution discharge nozzle 11 is controlled so as to be decelerated by a continuous change in speed, a rapid change in speed is avoided. Therefore, the control of the scanning speed of the developer discharge nozzle 11 becomes easy.
[0086]
In the above-described embodiment, the case where the present invention is applied to the developing device and the developing method using the developing solution discharge nozzle having the slit-shaped discharge port has been described, but the present invention uses another developing solution discharging nozzle. The present invention can be applied to a developing device and a developing method.
[0087]
Further, in the above embodiment, the case where the present invention is applied to the developing device and the developing method has been described. However, the present invention is directed to a coating apparatus and a coating method including a coating liquid discharge nozzle for discharging a coating liquid such as a resist liquid. The present invention can be applied to other substrate processing apparatuses and substrate processing methods.
[Brief description of the drawings]
FIG. 1 is a plan view of a developing device according to an embodiment of the present invention.
FIG. 2 is a sectional view taken along line XX of a main part of the developing device of FIG.
FIG. 3 is a sectional view taken along line YY of a main part of the developing device of FIG. 1;
FIG. 4 is a view showing a slit-shaped discharge port of a developer discharge nozzle.
FIG. 5 is a front view illustrating the operation of the developing device of FIG. 1;
FIG. 6 is a plan view illustrating the operation of the developing device of FIG. 1;
FIG. 7 is a diagram illustrating a first example of a scanning speed of a developer discharge nozzle in the developing device of FIG. 1;
FIG. 8 is a diagram illustrating a second example of the scanning speed of the developer discharge nozzle in the developing device of FIG. 1;
FIG. 9 is a diagram illustrating a third example of the scanning speed of the developing solution discharge nozzle in the developing device of FIG. 1;
FIG. 10 is an explanatory diagram of the operation of the developing device.
FIG. 11 is a schematic diagram showing a state of a developing solution on a substrate by a developing device.
[Explanation of symbols]
1 Board holding part
10 Arm drive unit
11 Developer discharge nozzle
14 Control unit
15 Slit outlet

Claims (9)

Substrate holding means for holding a substrate,
A processing liquid discharge nozzle for discharging the processing liquid,
A moving means for moving the processing liquid discharge nozzle to the outside of the other edge of the substrate by passing over the substrate from outside one edge of the substrate held stationary by the substrate holding means,
Speed control means for decelerating the processing liquid discharge nozzle while the processing liquid discharge nozzle passes from the center of the substrate to the other edge of the substrate ,
The processing liquid discharge nozzle discharges the processing liquid linearly in a direction substantially perpendicular to the moving direction of the moving means with a width equal to or larger than the diameter of the substrate, and after the processing liquid discharge nozzle passes over the substrate, A substrate processing apparatus for stopping discharge . Substrate holding means for holding a substrate,
A processing liquid discharge nozzle for discharging the processing liquid,
A moving means for moving the processing liquid discharge nozzle outside the other edge of the substrate by passing over the substrate from outside one edge of the substrate held stationary by the substrate holding means,
After decelerating the processing liquid discharge nozzle to a predetermined speed from the center of the substrate to the other edge of the substrate, a speed control unit that passes the other edge of the substrate at a constant speed,
A substrate processing apparatus, wherein the discharge of the processing liquid is stopped after the processing liquid discharge nozzle passes over the substrate. Substrate holding means for holding a substrate,
A processing liquid discharge nozzle for discharging the processing liquid,
A moving means for moving the processing liquid discharge nozzle outside the other edge of the substrate by passing over the substrate from outside one edge of the substrate held stationary by the substrate holding means,
The processing liquid discharge nozzle is moved at a constant speed from one edge of the substrate to the center of the substrate, and the processing liquid discharge nozzle is decelerated while the processing liquid discharge nozzle passes from the center of the substrate to the other edge of the substrate. A substrate processing apparatus comprising: The speed control means, after decelerating the processing liquid discharge nozzle to a predetermined speed from the center of the substrate to the other edge of the substrate, and then passing the other edge of the substrate at a constant speed, the substrate processing apparatus according to claim 1 or 3, wherein to. Said speed control means, the substrate processing according to claim 1 or 3, wherein be continuously or stepwise decelerating the processing liquid discharge nozzle from the central portion of the substrate up to the outside of the other edge of the substrate apparatus. The substrate processing apparatus according to claim 2, wherein the processing liquid discharge nozzle has a width equal to or larger than a diameter of the substrate held by the substrate holding unit. While moving the processing liquid discharge nozzle from outside the one edge of the substrate held in a stationary state and passing the processing liquid discharge nozzle to the outside of the other edge of the substrate from the outside of the one edge of the substrate, the diameter of the substrate is equal to or larger than the diameter of the substrate. A substrate processing method for supplying a processing liquid on a substrate linearly in a direction substantially perpendicular to the moving direction at a width ,
Decelerating the processing liquid discharge nozzle while the processing liquid discharge nozzle passes from the center of the substrate to the other edge of the substrate ,
The substrate processing method according to claim Rukoto to stop the discharge of the processing solution by the processing liquid discharge nozzle after the treatment liquid ejection nozzle is passed through the upper substrate. The processing liquid is discharged from the processing liquid discharge nozzle onto the substrate while moving the processing liquid discharge nozzle from outside the one edge of the substrate held in a stationary state to the outside of the other edge of the substrate while passing over the substrate. A substrate processing method for supplying,
After decelerating the processing liquid discharge nozzle to a predetermined speed from the center of the substrate to the other edge of the substrate, pass the other edge of the substrate at a constant speed,
A substrate processing method, wherein the processing liquid discharge nozzle stops discharging the processing liquid after the processing liquid discharge nozzle passes over the substrate. The processing liquid ejecting nozzle is moved from the outside of the one edge of the substrate held in the stationary state to the outside of the other edge of the substrate while passing over the substrate, and is moved from the processing liquid ejecting nozzle to the substrate. A substrate processing method for supplying a processing liquid to
The processing liquid discharge nozzle is moved at a constant speed from one edge of the substrate to the center of the substrate, and the processing liquid discharge nozzle is decelerated while the processing liquid discharge nozzle passes from the center of the substrate to the other edge of the substrate. A substrate processing method characterized by:

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