JP3546506B2 - Electronic component and method of manufacturing the same - Google Patents

Description

[0001]
[Industrial applications]
The present invention relates to an electronic component incorporating a semiconductor element, a surface acoustic wave element, a crystal oscillator, or the like used for various electronic devices, and a method for manufacturing the same.
[0002]
[Prior art]
Hereinafter, conventional electronic components will be described.
[0003]
Packages incorporating semiconductor elements, surface acoustic wave elements, etc., were configured to take out the lead wires connected to those elements to the outside of the package while preventing electromagnetic effects on those elements and keeping airtight from the outside air. . As shown in FIGS. 7 and 8, a connection terminal 52 provided on an end surface of a first insulating plate 51 made of alumina or the like is provided between the first insulating plate 51 and a second insulating plate 53 made of alumina or the like. The first conductive pattern 54 provided, a conductive layer 55 provided in a recess formed in a vertical portion of the second insulating plate 53, and a second conductive pattern 56 provided on the upper surface of the second insulating plate 53 The case is formed by printing and forming a conductor on a green sheet-shaped alumina plate, and then bonding and firing two green sheet-shaped alumina plates. An element 57 such as a semiconductor element or a surface acoustic wave element is adhered and fixed on the case, and the electrode portion of the element 57 and the second conductive pattern 56 are connected with a lead wire 58 made of Au or Al. Is sealed with a metal layer 60 provided on the second insulating plate 53 by soldering or seam welding.
[0004]
In such a configuration, since the conductive connection between the element 57 and the external leads is performed using the wire bonding technique with the lead wire 58, the size of the electronic component is larger than the size of the element 57, It was difficult to reduce the size.
[0005]
In addition, if the step between the wire bond connection surface of the element 57 and the wire bond connection surface of the case becomes large, it becomes difficult to perform a good wire bond connection. Therefore, a part of the second insulating plate 53 is cut out. Although the step is eliminated by disposing the element 57 in such a case, creating such a case requires a complicated process, and the case is expensive.
[0006]
Furthermore, when the element 57 is a surface acoustic wave element, when the operating frequency is in a high frequency band around 1 GHz, the element 57 is changed depending on how to attach the lead wire 58 and how to arrange the ground electrode lead wire and the signal electrode lead wire. Frequency characteristics become affected. This is because, in the high frequency band, these leads act as inductors, and the inductance varies depending on how these leads are stretched.
[0007]
[Problems to be solved by the invention]
As described above, in the conventional configuration, it is difficult to reduce the size. In addition, when an element used in a high-frequency band is incorporated, a frequency variation in electrical characteristics occurs due to an inductance variation. However, there was a problem that it was complicated and the cost was high.
[0008]
The present invention solves the above-mentioned conventional problems, and can be miniaturized. When an element used in a high-frequency band is incorporated, frequency fluctuation of electric characteristics due to inductance fluctuation does not occur, thereby simplifying a manufacturing process and increasing cost. It is an object of the present invention to provide an electronic component and a manufacturing method thereof.
[0009]
[Means for Solving the Problems]
In order to achieve this object, an electronic component according to the present invention includes a bump-forming substrate having a protruding electrode provided through an electrode film formed in a through-hole of a glass insulating substrate, and an external circuit connected to the electrode film. and the surface electrode for connecting a device having a take-out electrode connected to the protruding electrode comprises a case and a lid in the glass to be bonded to the bump forming substrate, and joining the protruding electrodes and the extraction electrode, wherein in bump the case and the lid It is configured to be attached and sealed to the formation substrate.
[0010]
The manufacturing method therefor, a through hole in a position that matches the extraction electrodes of the elements of the glass insulating substrate provided by forming the insulating one side to the electrode film on the substrate including the through holes, then the insulation The surface on which the electrode film other than the through-hole of the non-conductive substrate is formed is covered with an insulator, plating is performed only on the through-hole to fill the through-hole, and the bump-formed substrate is provided with a protruding electrode having a shape protruding from the insulating substrate. It is a method of forming and taking out the electrode on this bump forming substrate, aligning it with the protruding electrode, aligning it, pressing and heating to make an alloy connection, and then sealing it with a glass inner case and lid. .
[0011]
[Action]
In this configuration and method, since the connection between the element and the external lead is performed without using a lead wire made of Au or Al, the size can be reduced, and there is no generation of inductance due to the lead wire, and the fluctuation of the frequency is reduced. Does not occur, and the structure of the substrate is simplified.
[0012]
【Example】
(Example 1)
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0013]
As shown in FIG. 1, a bump forming substrate 5 having a projecting electrode 4 provided through an electrode film 3 of a through hole 2 formed in an insulating substrate 1, and a surface joined to the electrode film 3 and connected to an external circuit. The configuration includes an electrode 6, an element 8 having an extraction electrode 7 that is joined to the bump electrode 4, and a middle case 9 and a lid 10 that are joined to the bump forming substrate 5. In this embodiment, a surface acoustic wave device having an interdigital transducer electrode 8a for exciting and receiving a surface acoustic wave is used as the device 8.
[0014]
Hereinafter, a method for manufacturing the electronic component having the above configuration will be described.
First, a method for manufacturing the bump forming substrate 5 will be described with reference to FIG.
[0015]
As shown in FIG. 2A, a through hole 2 is formed at a predetermined position on an insulating substrate 1 made of soda glass by sandblasting, and then, as shown in FIG. After the mask jig (1) 11 and the mask jig (2) 12 are set on the entire surface on one side and on the opposite surface where the electrode film 3 is not formed, the electrode film 3 is formed in the region including the through hole 2. . The electrode film 3 can be formed by vacuum evaporation or sputtering. In this embodiment, a Cr film (thickness: 30 nm) is formed as a lower layer and a Cu film (thickness: 2 μm) is formed as an upper layer by using sputtering. Then, as shown in FIG. 2 (c), a plating prevention cover 13 is attached so as to cover the electrode film 3 formed on one side surface of the insulating substrate 1, and is immersed in an Au plating solution to form an Au plating film. The electrode film 3 of the insulating substrate 1 is plated only on the through-hole 2 because only the through-hole 2 is exposed to the plating solution, and the through-hole 2 is filled with the Au plating film as the plating time elapses. Further, by continuing the plating, as shown in FIG. 2D, the protruding Au protruding electrode 4 is formed. Thereafter, when the cover 13 for preventing plating is removed, the bump-formed substrate 5 is obtained as shown in FIG.
[0016]
As shown in FIG. 3, after aligning the extraction electrode 7 of the element 8 with the projection electrode 4 of the bump forming substrate 5, the element 8 is pressurized and heated to perform alloy bonding between the extraction electrode 7 and the projection electrode 4. After that, the middle case 9 and the lid 10 are set and sealed and connected, and then the surface electrode 6 is formed by screen printing as an electrode for soldering to a printed circuit board of an external circuit, thereby completing an electronic component. .
[0017]
In the present embodiment, a surface acoustic wave element was used as the element 8 and the material of the extraction electrode 7 was Al, so that Au of the protruding electrode 4 was connected by Au-Al alloy bonding.
[0018]
Since the bump-forming substrate 5, the middle case 9 and the lid 10 were made of the same material, soda glass, the sealing joining was completed at 300 ° C. for 5 minutes using a direct joining technique between the soda glasses.
[0019]
As described above, according to the present embodiment, since the extraction electrode 7 of the element 8 is directly bonded to the bump electrode 4 of the bump forming substrate 5, the size can be reduced and the element 8 used in a high frequency band is incorporated. In such a case, the frequency of the electrical characteristics does not fluctuate due to the fluctuation of the inductance, so that the manufacturing process is simple and the manufacturing cost can be reduced.
[0020]
In the present embodiment, the element 8 is a surface acoustic wave element, but may be another element such as a semiconductor element. Although Au is used as a plating material for the protruding electrode 4, the present invention is not limited to Au. Various plating materials can be used by appropriately selecting the material of the extraction electrode 7 of the element 8. For example, when the surface of the extraction electrode 7 of the element 8 is made of solder, Au, Sn, or solder can be used as the protruding electrode 4. When the surface of the extraction electrode 7 is made of Au, the projection electrode 4 is made of Au, Sn, or the like. As long as Sn and solder are formed on at least the surface, it can be used. When the surface of the extraction electrode 7 is Sn, Au can be used as the protruding electrode 4.
[0021]
Further, in the present embodiment, a Cu / Cr two-layer laminated film is used as the electrode film 3, but any metal that can be plated may be used, and is not limited to the Cu / Cr two-layer laminated film.
[0022]
Further, in the alloy joining of the extraction electrode 7 and the protruding electrode 4, ultrasonic processing may be used in combination with pressurization and heating.
[0023]
Further, instead of the middle case 9 and the lid 10 in this embodiment, a cover (not shown) in which the middle case 9 and the lid 10 are integrated may be used.
[0024]
(Example 2)
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.
[0025]
As shown in FIG. 4, a package substrate 24 having through-holes 22 formed in an insulating substrate 21 made of an alumina plate and electrode films 23 provided on both sides around the through-holes 22 and a take-out for alloy bonding with the electrode films 23 The configuration includes an element 26 having an electrode 25 and a metal lid 27 joined to the package substrate 24. In this embodiment, a semiconductor element having the electrode 26a is used as the element 26.
[0026]
Hereinafter, a method for manufacturing the electronic component having the above configuration will be described. First, the package substrate 24 shown in FIG. 5 was created as follows. A through hole 22 is formed by sandblasting at a predetermined position on an insulating substrate 21 made of an alumina plate, and a metal mask is provided on both sides of the insulating substrate 21 in a region where the electrode film 23 is not formed, and then vacuum evaporation or sputtering is performed. As a result, an electrode film 23 was formed on both sides of the periphery including the through hole 22, and a package substrate 24 was formed. In this example, the electrode film 23 was formed by sputtering, and a Ti film (thickness: 50 nm) was formed as a lower layer, and an Au film (thickness: 7 μm) was formed as an upper layer. Next, as shown in FIG. 6, the element 26 is positioned on the package substrate 24 so that the extraction electrode 25 of the element 26 coincides with the through hole 22, and the element 26 is pressed and heated to remove the extraction electrode 25. Of Al and Au of the electrode film 23 are alloy-bonded. At this time, the size of the through hole 22 is configured to be smaller than the size of the extraction electrode 25, and the surrounding area is covered with the joining region between the extraction electrode 25 and the electrode film 23, thereby achieving sealing with the outside air. Is done. Thereafter, the metal lid 27 is aligned with the package substrate 24 and joined by soldering to complete the electronic component.
[0027]
As described above, according to the present embodiment, an electrode protruded by the step of the electrode film 23 is formed, and the through-hole 22 is formed by the junction between the electrode film 23 and the extraction electrode 25 surrounding the through-hole 22. With the sealed configuration, in addition to the effects of the first embodiment, plating is not required, so that the production of the package substrate 24 is simplified, and the manufacturing cost can be further reduced. In this embodiment, the element 26 is a semiconductor element, but may be another element such as a surface acoustic wave element. Further, although the Au / Ti laminated film is used as the electrode film 23 of the package substrate 24, it goes without saying that an optimum configuration can be selected in combination with the material of the extraction electrode 25. Further, instead of the metal lid 27, a cover obtained by integrating the middle case 9 and the lid 10 or the middle case 9 and the lid 10 according to the first embodiment may be used.
[0028]
【The invention's effect】
As is clear from the above description, the present invention provides a bump-forming substrate having a protruding electrode provided via an electrode film formed in a through-hole of a glass insulating substrate, a surface electrode, and an element having an extraction electrode. When provided with a case and cover in the glass, and joining the protruding electrodes and extraction electrodes, construction and sealing joint attaching a lid to the bump forming substrate, also in a position that matches the extraction electrode of the element of the insulating substrate , a through hole is provided, the one surface of an insulating substrate an electrode layer is formed, and then covering the insulating electrode film formed by surface other than the through hole of the substrate with an insulator comprising the through hole, only the through hole together fill the through-holes subjected to plating, the insulating substrate also create a bump forming substrate provided with a protruding electrode protruding shape than was aligned electrodes taken out to the bump forming substrate to match the protruding electrode , By heating the pressurized perform alloy connection, by a method of sealing a case and cover in a glass, can be miniaturized, when incorporating elements used in a high frequency band, the frequency of the electrical characteristics due to inductance variation It is possible to realize an excellent electronic component that does not change, has a simple manufacturing process, and does not increase the cost, and a manufacturing method thereof.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an electronic component according to a first embodiment of the present invention; FIG. 2 is a cross-sectional view illustrating a method of manufacturing a bump-formed substrate of the electronic component in a process order; FIG. FIG. 4 is a cross-sectional view of an electronic component according to a second embodiment of the present invention. FIG. 5 is a cross-sectional view of a package substrate of the electronic component. FIG. 6 is a cross-sectional view of a package substrate of the electronic component. FIG. 7 is an external perspective view showing the inside of a conventional electronic component with a part thereof removed, and FIG. 8 is an AA cross-sectional view of FIG.
DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Through hole 3 Electrode film 4 Projection electrode 5 Bump forming substrate 6 Surface electrode 7 Extraction electrode 8 Element 9 Middle case 10 Lid

Claims (3)

A bump-forming substrate that fills the through-hole via an electrode film formed in the through-hole formed in the glass insulating substrate and has a protruding electrode formed in a protruding state; A surface electrode connected to a circuit, an element provided at a position coincident with the bump electrode on the bump forming substrate, and having an extraction electrode joined to the bump electrode, a glass inner case and a lid, An electronic component in which an electrode and the extraction electrode are joined, and the middle case and the lid are attached to the bump forming substrate and sealed and joined by direct joining. A through-hole is provided at a position corresponding to the extraction electrode of the element on the glass-made insulating substrate, an electrode film is formed on one surface of the insulating substrate including the through-hole, and an electrode other than the through-hole of the insulating substrate is formed. Covering the surface on which the film is formed with an insulator, plating only the through-hole, filling the through-hole, and forming a bump-formed substrate provided with a protruding electrode having a shape protruding from the insulating substrate; After aligning the element so that the extraction electrode of the element matches the projection electrode on the bump-formed substrate, the extraction electrode and the projection electrode are combined with pressure and heating or further ultrasonic processing. A method for producing an electronic component, comprising: a step of performing an alloy connection; and a step of sealing with a glass middle case and a lid. 3. The method for manufacturing an electronic component according to claim 2, wherein the glass insulating substrate and the same glass inner case and lid are bonded directly to each other.

Images