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JP3425524B2 - Pressure-sensitive adhesive composition for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape using the same - Google Patents

Pressure-sensitive adhesive composition for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape using the same

Info

Publication number
JP3425524B2
JP3425524B2 JP06150298A JP6150298A JP3425524B2 JP 3425524 B2 JP3425524 B2 JP 3425524B2 JP 06150298 A JP06150298 A JP 06150298A JP 6150298 A JP6150298 A JP 6150298A JP 3425524 B2 JP3425524 B2 JP 3425524B2
Authority
JP
Japan
Prior art keywords
pressure
sensitive adhesive
component
adhesive composition
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP06150298A
Other languages
Japanese (ja)
Other versions
JPH11256122A (en
Inventor
進 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP06150298A priority Critical patent/JP3425524B2/en
Publication of JPH11256122A publication Critical patent/JPH11256122A/en
Application granted granted Critical
Publication of JP3425524B2 publication Critical patent/JP3425524B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/383Natural or synthetic rubber
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/302Applications of adhesives in processes or use of adhesives in the form of films or foils for bundling cables
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00Presence of halogenated polymer
    • C09J2427/006Presence of halogenated polymer in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は粘着テープ用粘着組
成物及びそれを用いた粘着テープに関するものである。
TECHNICAL FIELD The present invention relates to an adhesive composition for an adhesive tape and an adhesive tape using the same.

【0002】[0002]

【従来の技術】自動車用電線の集束や保護を目的とし
て、粘着テープが使われている。テープの粘着剤として
は、安全衛生などの優れている等で水系粘着剤が使わ
れ、ベースとして(天然ゴムラテックス/スチレンブタ
ジエンラテックス/アクリレート系樹脂エマルジョン)
混合系、タッキファイヤとして、テルペンフェノール樹
脂エマルジョン、軟化剤として低分子量ポリイソプレン
ラテックスより構成されている。テーピング施工後のワ
イヤーハーネスにおいて運転時や自動車への組み付け時
の振動、応力等によりテープ末端部がはがれ易い為、粘
着力の強いテープが好んで使われる。粘着力を高める
為、高軟化点のタッキファイヤが使われるが、低軟化点
のものに比べテープ製造時、熱乾燥工程に於いて、タッ
キファイヤ粒子が溶融し難くゴム中に溶け込むまでには
至らない。従って、乾燥直後に於いて、タック性に欠
け、巻き取り工程でテープ糊面が巻き心に貼り付かず粘
着テープを生産できないという問題がある。また、水系
粘着剤に対して低軟化点タッキファイヤの使用や軟化剤
の添加量の増加により、乾燥直後のタック性は改善され
るが、粘着力の低下を生ずると共に凝集力低下による粘
着組成物の被着物への転着の発生等の不具合を伴う。
2. Description of the Related Art Adhesive tapes are used for the purpose of bundling and protecting automobile electric wires. Water-based adhesives are used as the adhesives for tapes because of their excellent safety and health, and as a base (natural rubber latex / styrene butadiene latex / acrylate resin emulsion)
It is composed of a mixed system, a terpene phenol resin emulsion as a tackifier, and a low molecular weight polyisoprene latex as a softening agent. In the wire harness after taping, the tape end portion is easily peeled off due to vibration, stress, etc. during operation or assembly into a car, so tape with strong adhesiveness is preferred. A tackifier with a high softening point is used to increase the adhesive strength, but it is difficult for the tackifier particles to melt in the rubber during the tape drying process and the heat drying process compared to those with a low softening point, and it does not even melt into the rubber. Absent. Therefore, there is a problem that tackiness is lacking immediately after drying and the adhesive tape surface cannot be adhered to the winding core during the winding process to produce an adhesive tape. In addition, the tackiness immediately after drying is improved by using a low softening point tackifier or the addition amount of the softening agent with respect to the water-based pressure-sensitive adhesive, but the pressure-sensitive adhesive composition causes a decrease in the adhesive strength and a decrease in the cohesive strength. It is accompanied by problems such as transfer to the adherend.

【0003】[0003]

【発明が解決しようとする課題】本発明は、粘着テープ
製造時に於けるテープ糊面の巻き芯への貼り付き性に優
れ、且つ粘着力、タック性、凝集力のバランスも良好な
粘着テープ用粘着組成物及びそれを用いた粘着テープを
提供することを課題とする。
DISCLOSURE OF THE INVENTION The present invention is for an adhesive tape which is excellent in the sticking property of the tape adhesive surface to the winding core during the production of the adhesive tape and has a good balance of the adhesive force, tackiness and cohesive force. An object is to provide an adhesive composition and an adhesive tape using the same.

【0004】[0004]

【課題を解決するための手段】本発明は、天然ゴムラテ
ックス及びスチレンブタジエンゴムラテックスを含む混
合ラテックスをA成分、軟化点が100〜135℃であ
るテルペンフェノール樹脂エマルジョンをB成分及びブ
チルアクリレート樹脂と軟化点が60〜80℃であるテ
ルペンフェノール樹脂であるC成分との混合エマルジョ
ンをD成分として含むことを特徴とする粘着テープ用粘
着組成物に関するものである。また、本発明は、塩化ビ
ニル樹脂からなるテープ基材上に前記粘着テープ用粘着
組成物を塗布し、乾燥してなることを特徴とする粘着テ
ープに関するものである。
According to the present invention, a mixed latex containing natural rubber latex and styrene-butadiene rubber latex is used as component A, and a terpene phenol resin emulsion having a softening point of 100 to 135 ° C. is used as component B and butyl acrylate resin. The present invention relates to a pressure-sensitive adhesive composition for a pressure-sensitive adhesive tape, which comprises as a D component a mixed emulsion with a C component which is a terpene phenol resin having a softening point of 60 to 80 ° C. The present invention also relates to a pressure-sensitive adhesive tape, which is obtained by applying the pressure-sensitive adhesive composition for a pressure-sensitive adhesive tape on a tape substrate made of vinyl chloride resin and drying the composition.

【0005】以下、本明細書において、本発明に用いら
れる「軟化点が100〜135℃であるテルペンフェノ
ール樹脂」を「高軟化点テルペンフェノール樹脂」と、
「軟化点が60〜80℃であるテルペンフェノール樹
脂」を「低軟化点テルペンフェノール樹脂」とも言う。
また、天然ゴムをNR、スチレンブタジエンゴムをSB
R、ブチルアクリレートをBAとも各々記す。
Hereinafter, in the present specification, a "terpene phenol resin having a softening point of 100 to 135 ° C." used in the present invention is referred to as a "high softening point terpene phenol resin",
The “terpene phenol resin having a softening point of 60 to 80 ° C.” is also referred to as a “low softening point terpene phenol resin”.
Also, natural rubber is NR and styrene butadiene rubber is SB.
R and butyl acrylate are also referred to as BA.

【0006】本発明は、A成分、B成分及びD成分を少
なくとも含有することを特徴とする粘着組成物に関する
ものであり、特にD成分を用いたことを特徴とし、これ
により上記課題を解決したものである。即ち、B成分の
高軟化点テルペンフェノール樹脂により経時による粘着
力及び凝集力を確保すると共にD成分に含まれるC成分
すなわち低軟化点テルペンフェノール樹脂により乾燥直
後のテープの巻き芯への貼り付き性を確保するものであ
る。
The present invention relates to a pressure-sensitive adhesive composition characterized by containing at least A component, B component and D component, and in particular characterized by using D component, by which the above problems are solved. It is a thing. That is, the high softening point terpene phenolic resin as the B component secures the adhesive force and cohesive force over time, and the C component contained in the D component, that is, the low softening point terpene phenolic resin, makes the tape sticky to the core immediately after drying. To secure.

【0007】本発明のD成分は、BA樹脂とC成分とが
均一に相溶した状態のエマルジョンであれば、特にその
製造方法は制限されるべきものではないが、好ましく
は、BAモノマーに低軟化点テルペンフェノール樹脂を
混合し、重合した後、乳化することにより製造されたも
のが挙げられる。尚、本発明の粘着組成物は、予めD成
分としてBA樹脂とC成分とを混合したエマルジョンを
用いることが好ましいが、A成分との混合分散過程にお
いてD成分と同様な分散状態が得られるのであれば、B
A樹脂とC成分は別個に用いることができる。
The component D of the present invention is not particularly limited in its production method as long as it is an emulsion in which the BA resin and the component C are uniformly compatible with each other. Examples include those produced by mixing a softening point terpene phenol resin, polymerizing, and then emulsifying. The adhesive composition of the present invention preferably uses an emulsion in which a BA resin and a C component are previously mixed as the D component, but a dispersion state similar to that of the D component is obtained in the mixing and dispersion process with the A component. If there is, B
The A resin and the C component can be used separately.

【0008】ところで、一般にテープ基材に粘着組成物
を塗布後、乾燥した時に粘着組成物は水の蒸発、各
ポリマー粒子の融着、各ポリマー相互の拡散へ至る過
程を踏むが、本発明のD成分は、上記のようなエマルジ
ョンであるから、このにおいて特にC成分がA成分、
B成分及びBA樹脂等の他のポリマーと混在した状態と
なり乾燥直後でも良好な粘着性が得られるものと考えら
れる。
By the way, generally, when the pressure-sensitive adhesive composition is applied to a tape substrate and then dried, the pressure-sensitive adhesive composition goes through the steps of water evaporation, fusion of each polymer particle, and diffusion of each polymer. Since the component D is an emulsion as described above, the component C is particularly the component A,
It is considered that the B component and the BA resin are mixed with other polymers, and good adhesiveness can be obtained even immediately after drying.

【0009】本発明の粘着組成物は、上記成分に更に任
意の添加剤、例えば、軟化剤、酸化防止剤、充填剤、耐
水化剤等を含むことができ、中でも軟化剤、酸化防止剤
を含むことが好ましい。また、好ましい軟化剤としては
ポリイソプレンラテックスが挙げられる。このポリイソ
プレンは、低分子量のものが好ましく、例えば、30,
000〜50,000の範囲が挙げられる。
The pressure-sensitive adhesive composition of the present invention may further contain optional additives such as a softening agent, an antioxidant, a filler and a water resistant agent in addition to the above components. It is preferable to include. Moreover, polyisoprene latex is mentioned as a preferable softening agent. This polyisoprene preferably has a low molecular weight, for example, 30,
The range of 000-50,000 is mentioned.

【0010】本発明の粘着組成物は、そのWET重量比
率は、目的により種々変更し得るが、A成分:B成分:
D成分:軟化剤=100:60:20〜40:5である
ことが好ましい。ここでD成分がA成分に対して20重
量%未満であると乾燥直後のタック性が低下し、40重
量%を越えると凝集力が低下し高温経時での被着物への
粘着組成物の転着が生じ易くなる。また、D成分におい
て、BA樹脂とC成分との混合エマルジョンのWET重
量比率は、BA樹脂:C成分=100:100であるこ
とが好ましい。更に、A成分において、NRラテックス
とSBRラテックスのWET重量比率は、NR:SBR
=100:100であることが好ましい。
The WET weight ratio of the pressure-sensitive adhesive composition of the present invention can be variously changed according to the purpose, but the A component: B component:
D component: softening agent = 100: 60: 20 to 40: 5 is preferable. When the content of the component D is less than 20% by weight relative to the amount of the component A, the tackiness immediately after drying is reduced, and when it exceeds 40% by weight, the cohesive force is reduced and the adhesive composition is transferred to an adherend at high temperature. Wearing is easy to occur. Further, in the D component, the WET weight ratio of the mixed emulsion of the BA resin and the C component is preferably BA resin: C component = 100: 100. Further, in the component A, the WET weight ratio of NR latex and SBR latex is NR: SBR.
= 100: 100 is preferable.

【0011】本発明の粘着組成物に用いられる組成成分
は、公知のものであり、粘着テープの用途に応じて種々
の物性の接着特性が得られるように適宜、その分子量あ
るいは軟化点、ラテックスまたはエマルジョンにおける
分子分散状態(固形分比率、乳化剤その他の添加剤の種
類、添加量の選択により調整)を選定することができ
る。また、上記各々の成分は市販のものを使用すること
もできる。
The composition components used in the pressure-sensitive adhesive composition of the present invention are known, and their molecular weight or softening point, latex or latex are appropriately selected so that adhesive properties with various physical properties can be obtained depending on the application of the pressure-sensitive adhesive tape. The molecular dispersion state in the emulsion (solid content ratio, type of emulsifier and other additives, adjusted by selection of addition amount) can be selected. In addition, each of the above components may be a commercially available product.

【0012】尚、本発明に用いられるB成分やC成分の
テルペンフェノール樹脂とは、テルペンと種々のフェノ
ールをフリーデルクラフト型触媒で反応させたり、ある
いは、これをさらにホルマリンで縮合する方法で得られ
るものを言う。また、B成分やC成分の軟化点は、環球
法(Ball&Ring法)により測定され、樹脂の熱
変形温度を言う。
The terpene phenol resin as the component B or C used in the present invention can be obtained by reacting terpene and various phenols with a Friedel-Crafts type catalyst, or by condensing this with formalin. Say what can be done. The softening points of the B component and the C component are measured by the ring and ball method (Ball & Ring method) and refer to the heat distortion temperature of the resin.

【0013】粘着テープは、上記本発明の粘着組成物を
テープ基材上に常法により塗布、乾燥し、巻き芯に巻き
取ることにより製造することができる。ここで、乾燥条
件として、好ましくは、100〜120℃の空気を5〜
3分間当てる処理が挙げられる。特に、本発明の粘着組
成物は、テープ基材として、塩化ビニル樹脂を選択した
場合に良好な特性を発揮する。これは、本発明の粘着組
成物と塩化ビニル樹脂との界面における接着特性が良好
であるからである。また、本発明の粘着テープは、巻き
芯材料の選択の幅が従来に比べて広がる等の利点があ
る。本発明において好適に用いられる巻き芯材料として
は、紙、ポリエチレン等が挙げられる。
A pressure-sensitive adhesive tape can be produced by coating the pressure-sensitive adhesive composition of the present invention on a tape substrate by a conventional method, drying and winding it on a winding core. Here, as the drying condition, preferably, air of 100 to 120 ° C. is 5 to
A treatment of applying for 3 minutes can be mentioned. In particular, the pressure-sensitive adhesive composition of the present invention exhibits good characteristics when a vinyl chloride resin is selected as the tape base material. This is because the adhesive property at the interface between the pressure-sensitive adhesive composition of the present invention and the vinyl chloride resin is good. Further, the pressure-sensitive adhesive tape of the present invention has an advantage that the range of selection of the core material is wider than that of the conventional one. Examples of the core material that is preferably used in the present invention include paper and polyethylene.

【0014】本発明の粘着テープに使用される塩化ビニ
ル樹脂は、ポリ塩化ビニル(PVC)の他、他の共重合
可能なモノマーとの共重合体を含むものであり、ポリ塩
化ビニルの一部をそれら共重合体とすることができる。
該共重合体を構成するモノマーとしては、エチレン、酢
酸ビニル、アクリル酸、アクリル酸エステル等から選ば
れる少なくとも1種が挙げられる。PVCとしては、好
ましくは、平均重合度p=800〜1300のものが挙
げられる。該塩化ビニル樹脂は、通常、可塑剤、安定
剤、充填剤、酸化防止剤、紫外線吸収剤、難燃剤、顔料
等を含み得る。また、本発明の粘着組成物は、テープ以
外にもラベル、シート等にも適用できることは明らかで
ある。
The vinyl chloride resin used in the pressure-sensitive adhesive tape of the present invention contains not only polyvinyl chloride (PVC) but also a copolymer with other copolymerizable monomers, and is a part of polyvinyl chloride. Can be those copolymers.
The monomer constituting the copolymer includes at least one selected from ethylene, vinyl acetate, acrylic acid, acrylic acid ester and the like. The PVC preferably has an average degree of polymerization p = 800 to 1300. The vinyl chloride resin can usually contain a plasticizer, a stabilizer, a filler, an antioxidant, an ultraviolet absorber, a flame retardant, a pigment and the like. Further, it is obvious that the pressure-sensitive adhesive composition of the present invention can be applied to labels, sheets and the like as well as tapes.

【0015】[0015]

【実施例】以下、本発明の具体的実施例を説明するが、
本発明はこれに限定されるべきものではない。 実施例1〜2、比較例1〜3 表1に記載の組成成分〔数値は、WET重量部(ただ
し、酸化防止剤は固形重量部)〕を同一条件で混合、分
散して粘着テープ用粘着組成物を調製し、塩化ビニル樹
脂に塗布、乾燥し、粘着層の厚さが20μmである各々
の粘着テープを作成した。
EXAMPLES Hereinafter, specific examples of the present invention will be described.
The present invention should not be limited to this. Examples 1 and 2 and Comparative Examples 1 to 3 Composition components described in Table 1 (numerical values are WET parts by weight (however, the antioxidant is solid parts by weight)) are mixed and dispersed under the same conditions to obtain an adhesive tape. The composition was prepared, applied to a vinyl chloride resin, and dried to prepare each adhesive tape having an adhesive layer thickness of 20 μm.

【0016】それらの特性を評価した。粘着組成物の組
成の詳細及び評価法は以下の通りである。 粘着組成物の組成 NRラテックス;スタンダード(ガスリー(株)製)固
形分60重量% SBRラテックス;T091A(日本合成ゴム(株)
製)固形分50重量% BA樹脂エマルジョン;AE200(日本合成ゴム
(株)製)固形分50重量% B成分(高軟化点テルペンフェノール樹脂エマルジョ
ン);ナノレットG1250(ヤスハラケミカル(株)
製)固形分50重量%、軟化点125℃ C成分(低軟化点テルペンフェノール樹脂);ナノレッ
トT800(ヤスハラケミカル(株)製)固形分50重
量%、軟化点70〜80℃ D成分(BA樹脂と低軟化点テルペンフェノール樹脂と
の混合エマルジョン);セルベストガンマ2000(ヘ
キスト合成(株)製)固形分50重量%、BA樹脂/低
軟化点テルペンフェノール樹脂(軟化点70〜80℃)
≒1/1(重量比) 軟化剤;LIR(クラレ(株)製)固形分60重量% 酸化防止剤;チヌビンB75(チバスペシャルテイケミ
カルズ(株)製)
Their properties were evaluated. The details of the composition of the adhesive composition and the evaluation method are as follows. Composition of adhesive composition NR latex; Standard (manufactured by Guthrie Co., Ltd.) Solid content 60 wt% SBR latex; T091A (Nippon Synthetic Rubber Co., Ltd.)
50% by weight solids BA resin emulsion; AE200 (manufactured by Japan Synthetic Rubber Co., Ltd.) 50% by weight solids B component (high softening point terpene phenol resin emulsion); Nanolet G1250 (Yasuhara Chemical Co., Ltd.)
50% by weight solids, 125 ° C. softening point C component (low-softening point terpene phenol resin); Nanolet T800 (Yasuhara Chemical Co., Ltd.) 50% by weight solids, softening point 70-80 ° C. D component (with BA resin) Mixed emulsion with low softening point terpene phenol resin); Celbest Gamma 2000 (Hoechst Synthetic Co., Ltd.) solid content 50% by weight, BA resin / low softening point terpene phenol resin (softening point 70 to 80 ° C.)
≈ 1/1 (weight ratio) Softener; LIR (Kuraray Co., Ltd.) Solid content 60 wt% Antioxidant; Tinuvin B75 (Ciba Specialty Chemicals Co., Ltd.)

【0017】評価法 指触タック:粘着組成物を塗布、乾燥し、その直後の糊
面を触感による官能テストを行った(◎:優、○:良、
×:劣)。 粘着力:粘着組成物を塗布、乾燥し、70℃、1時間保
持した後、テープをJIS C2107に準拠し、測定
した。 凝集力:粘着組成物を塗布、乾燥し、70℃、1時間保
持した後、テープをJIS C2107に準拠し、測定
した。ただし、糊面どうしの貼付面積19×10mm2
荷重1Kg、23℃での落下までの時間を測定した。
Evaluation method Finger touch: The adhesive composition was applied and dried, and the paste surface immediately after that was subjected to a sensory test by touch (◎: excellent, ○: good,
X: inferior). Adhesive strength: The adhesive composition was applied, dried, and held at 70 ° C. for 1 hour, and then the tape was measured according to JIS C2107. Cohesion: The pressure-sensitive adhesive composition was applied, dried, and held at 70 ° C. for 1 hour, and then the tape was measured according to JIS C2107. However, the pasting area between glue surfaces is 19 × 10mm 2
The time until falling at 23 ° C. under a load of 1 kg was measured.

【0018】[0018]

【表1】 [Table 1]

【0019】表1から本発明の粘着組成物を用いた実施
例1及び2は、乾燥直後の指触タックと高温経時後の粘
着力及び凝集力の両者に優れた性能を示すことが分か
る。一方、比較例1〜3は本発明のD成分を用いてない
例を示すものである。比較例1は指触タックに劣り、比
較例3は軟化剤を増加すると指触タックは改善された
が、経時後の粘着力が低下すると共に試験板への粘着組
成物の転着傾向が見られた。比較例2はD成分中のC成
分としても使用され得る低軟化点テルペンフェノール樹
脂(ただし、実施例で使用のD成分中のC成分とは製造
元が異なるので全く同一とは断言できない)とBA樹脂
を別個に他の成分と混合分散させたため、実施例と同じ
分散条件ではC成分の分散性が劣り、実施例より粘着力
及び凝集力に劣ることが分かる。
It can be seen from Table 1 that Examples 1 and 2 using the pressure-sensitive adhesive composition of the present invention show excellent performances in both finger tack immediately after drying and pressure-sensitive adhesive strength and cohesive strength after aging at high temperature. On the other hand, Comparative Examples 1 to 3 show examples in which the D component of the present invention is not used. Comparative Example 1 was inferior in finger touch tack, and Comparative Example 3 was improved in finger touch tack when the amount of the softening agent was increased, but the adhesive strength after time decreased and the tendency of the adhesive composition to transfer to the test plate was observed. Was given. Comparative Example 2 is a low-softening-point terpene phenol resin that can also be used as the C component in the D component (however, the manufacturer is different from the C component in the D component used in the examples, so it cannot be absolutely said that they are the same) and BA. Since the resin was separately mixed and dispersed with the other components, it can be seen that the dispersibility of the component C is poor under the same dispersion conditions as in the example, and the adhesive force and cohesive force are inferior to those in the example.

【0020】[0020]

【発明の効果】本発明の粘着組成物は、乾燥直後のタッ
ク性に優れ、テープ製造時の巻き芯への貼り付き性が良
好である。また、本発明の粘着組成物を用いた粘着テー
プは、粘着力、凝集力のバランスにも優れる。
EFFECTS OF THE INVENTION The pressure-sensitive adhesive composition of the present invention has excellent tackiness immediately after drying and good sticking property to the core during tape production. In addition, the pressure-sensitive adhesive tape using the pressure-sensitive adhesive composition of the present invention has an excellent balance of adhesive force and cohesive force.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) C09J 107/02 C09J 7/02 - 7/04 C09J 109/08 C09J 133/08 C09J 161/14 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) C09J 107/02 C09J 7 /02-7/04 C09J 109/08 C09J 133/08 C09J 161/14

Claims (6)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 天然ゴムラテックス及びスチレンブタジ
エンゴムラテックスを含む混合ラテックスをA成分、軟
化点が100〜135℃であるテルペンフェノール樹脂
エマルジョンをB成分及びブチルアクリレート樹脂と軟
化点が60〜80℃であるテルペンフェノール樹脂であ
るC成分との混合エマルジョンをD成分として含むこと
を特徴とする粘着テープ用粘着組成物。
1. A mixed latex containing a natural rubber latex and a styrene-butadiene rubber latex as a component A, and a terpene phenol resin emulsion having a softening point of 100 to 135 ° C. with a B component and a butyl acrylate resin at a softening point of 60 to 80 ° C. A pressure-sensitive adhesive composition for a pressure-sensitive adhesive tape, comprising a mixed emulsion with a component C which is a terpene phenol resin as a component D.
【請求項2】 前記D成分は、ブチルアクリレートモノ
マーに低軟化点テルペンフェノール樹脂を混合し、重合
した後、乳化することにより製造されたものであること
を特徴とする請求項1記載の粘着テープ用粘着組成物。
2. The adhesive tape according to claim 1, wherein the component D is produced by mixing a butyl acrylate monomer with a low softening point terpene phenol resin, polymerizing the mixture, and then emulsifying the mixture. Adhesive composition.
【請求項3】 更に軟化剤としてポリイソプレンラテッ
クスを含むことを特徴とする請求項1または2記載の粘
着テープ用粘着組成物。
3. The pressure-sensitive adhesive composition for pressure-sensitive adhesive tapes according to claim 1, further comprising polyisoprene latex as a softening agent.
【請求項4】 WET重量比率が、A成分:B成分:D
成分:軟化剤=100:60:20〜40:5であるこ
とを特徴とする1〜3のいずれか1項に記載の粘着テー
プ用粘着組成物。
4. The weight ratio of WET is A component: B component: D.
Ingredient: Softening agent = 100: 60: 20 to 40: 5, The pressure-sensitive adhesive composition for pressure-sensitive adhesive tapes according to any one of 1 to 3, characterized in that:
【請求項5】 前記D成分において、WET重量比率
は、ブチルアクリレート樹脂:C成分=100:100
であることを特徴とする請求項1〜4のいずれか1項に
記載の粘着テープ用粘着組成物。
5. In the D component, the WET weight ratio is butyl acrylate resin: C component = 100: 100.
The pressure-sensitive adhesive composition for pressure-sensitive adhesive tapes according to any one of claims 1 to 4, wherein
【請求項6】 塩化ビニル樹脂からなるテープ基材上に
請求項1〜5のいずれか1項に記載の粘着テープ用粘着
組成物を塗布し、乾燥してなることを特徴とする粘着テ
ープ。
6. A pressure-sensitive adhesive tape, which is obtained by applying the pressure-sensitive adhesive composition for pressure-sensitive adhesive tape according to any one of claims 1 to 5 onto a tape base material made of vinyl chloride resin and drying the composition.
JP06150298A 1998-03-12 1998-03-12 Pressure-sensitive adhesive composition for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape using the same Expired - Fee Related JP3425524B2 (en)

Priority Applications (1)

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JP06150298A JP3425524B2 (en) 1998-03-12 1998-03-12 Pressure-sensitive adhesive composition for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06150298A JP3425524B2 (en) 1998-03-12 1998-03-12 Pressure-sensitive adhesive composition for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape using the same

Publications (2)

Publication Number Publication Date
JPH11256122A JPH11256122A (en) 1999-09-21
JP3425524B2 true JP3425524B2 (en) 2003-07-14

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ID=13172943

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Country Link
JP (1) JP3425524B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4163350B2 (en) * 1999-11-09 2008-10-08 矢崎総業株式会社 Adhesive composition for color vinyl chloride adhesive tape and color vinyl chloride adhesive tape coated therewith
DE10036707A1 (en) * 2000-07-27 2002-04-18 Tesa Ag Adhesive tape, in particular for packaging purposes
JP4493289B2 (en) * 2003-06-16 2010-06-30 日東電工株式会社 Pressure-sensitive adhesive tape or sheets for fixing wiring
JP4624090B2 (en) 2004-12-10 2011-02-02 矢崎総業株式会社 Halogen-free adhesive tape
JP4676945B2 (en) * 2006-01-13 2011-04-27 日東電工株式会社 Aqueous adhesive composition, adhesive tape and wire harness
JP5288812B2 (en) * 2008-01-21 2013-09-11 日東電工株式会社 Water-dispersed pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
DE102008062368A1 (en) * 2008-12-17 2010-06-24 Tesa Se Pressure-sensitive adhesives based on natural rubber and polyacrylates
JP5964073B2 (en) * 2011-05-26 2016-08-03 日東電工株式会社 Water-dispersed pressure-sensitive adhesive composition, pressure-sensitive adhesive, and pressure-sensitive adhesive sheet
JP6781100B2 (en) * 2017-04-17 2020-11-04 矢崎総業株式会社 Adhesive compositions, adhesive resin tapes and wire harnesses
CN113061399A (en) * 2021-03-31 2021-07-02 万洲胶粘制品(江苏)有限公司 PVC baking varnish adhesive tape for metal baking varnish vehicle and preparation method thereof

Also Published As

Publication number Publication date
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