JP3407054B2 - Copper alloy with excellent heat resistance, strength and conductivity - Google Patents
Copper alloy with excellent heat resistance, strength and conductivityInfo
- Publication number
- JP3407054B2 JP3407054B2 JP09083293A JP9083293A JP3407054B2 JP 3407054 B2 JP3407054 B2 JP 3407054B2 JP 09083293 A JP09083293 A JP 09083293A JP 9083293 A JP9083293 A JP 9083293A JP 3407054 B2 JP3407054 B2 JP 3407054B2
- Authority
- JP
- Japan
- Prior art keywords
- strength
- copper alloy
- conductivity
- heat resistance
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Conductive Materials (AREA)
Description
【発明の詳細な説明】
【0001】
【産業上の利用分野】この発明は、超強磁場発生装置の
導電材料に用いられる耐熱性、強度および導電性に優れ
た銅合金に関するものである。
【0002】
【従来の技術】従来、超強磁場を発生せしめるマグネッ
トに用いられる導電材料は強磁場により発生する強い電
磁力に抗しうる強度および大電流を流してもジュール熱
発生の少ない高導電特性を有する材料が要求されてい
る。
【0003】かかる材料として、近年、Ag:2〜60
質量%、残部:CuからなるAg含有銅合金が提案され
ている(例えば、日本金属学会誌 第55巻 第12号
(1991) P1382〜1391参照)。
【0004】
【発明が解決しようとする課題】しかし、前記従来のA
g含有銅合金は、80T以上の強磁場発生時に生じる応
力に対して十分に耐えうる強度を有するものではなく、
なお一層優れた耐熱性、強度および導電性を有する銅合
金が求められていた。
【0005】
【課題を解決するための手段】そこで、本発明者らは、
従来よりも耐熱性に優れ、さらに高強度でかつ高導電性
を有する銅合金を得るべく研究を行った結果、Ag:
8.0〜20.0質量%、Cr:0.1〜1.0質量%
を含有し、残りがCuおよび不可避不純物からなる組成
を有する銅合金鋳塊を冷間加工と時効を繰り返すことに
より得られた初晶および共晶の2相が繊維状に配向した
素地中にCrの微細な析出物が分散している組織を有す
る銅合金は、前記従来のAg含有銅合金に比べて強度お
よび硬さが大幅に向上するだけでなく、さらにその半軟
化温度(加工材を1時間焼鈍した時の強度が焼鈍しない
加工材の強度の1/2になる焼鈍温度)が高くなり耐熱
性が向上するという知見を得たのである。
【0006】この発明は、かかる知見にもとづいてなさ
れたものであって、Ag:8.0〜20.0質量%、C
r:0.1〜1.0質量%を含有し、残りがCuおよび
不可避不純物からなる組成、並びに初晶および共晶が繊
維状に配向した素地中にCrの微細な析出物が分散して
いる組織を有する耐熱性、強度および導電性に優れた銅
合金、に特徴を有するものである。
【0007】この発明の銅合金を製造するには、まず、
電気銅を不活性ガス中で溶解し、得られた溶湯にAgお
よびCrを添加して成分組成調整し、鋳造して鋳塊を製
造する。この鋳塊を600〜700℃で熱間鍛造もしく
は熱間圧延を施した後、溶体化処理し、さらに冷間加工
と時効処理を繰り返して施すことにより製造される。こ
のようにして得られたこの発明の銅合金は、Cu初晶お
よびCuとAg固溶体の共晶が繊維状に配向して強化さ
れた素地中にCrの微細な析出物が分散した組織を有し
ている。
【0008】つぎに、この発明の銅合金の成分組成を上
記のごとく限定した理由について説明する。
【0009】(a) Ag
Agは、Cuに固溶あるいはCuとの共晶組織として晶
出され、合金の強度および硬さを向上させる作用がある
が、8.0質量%未満では素地がAg固溶体単相となっ
て特に繊維強化できないので好ましくなく、一方、2
0.0質量%を越えて含有しても、高温下での強度の著
しい向上は見られないので経済的にも好ましくない。し
たがって、Agの含有量は、8.0〜20.0質量%に
定めた。
【0010】(b) Cr
Crは、Agとともに素地に固溶し、その後の時効処理
によるCrの微細な析出により合金の強度および硬さを
改善する作用があり、さらに高温での強度を改善する作
用があるが、0.1質量%未満ではその効果がなく、一
方、1.0質量%を越えて含有すると、鋳造時に粗大な
Cr晶出物を生じやすく、強度の向上も期待できなく、
さらに導電率が低下するようになるので好ましくない。
したがって、Crの含有量は、0.1〜1.0質量%に
定めた。
【0011】
【実施例】つぎに、この発明の銅合金を実施例により具
体的に説明する。
【0012】Ar雰囲気中で溶解、鋳造し、表1に示さ
れる成分組成のCu合金鋳塊を製造し、このCu合金鋳
塊を圧下率:50%の冷間圧延を施し、さらに温度:4
00℃、1時間保持の中間時効処理を施し、この中間時
効処理施した本発明銅合金1〜6および比較銅合金1〜
3の組織をSEMで観察したところ、Cu初晶およびC
uとAgの共晶からなる2相の繊維状に配向した素地中
にCrの微細な析出が分散しているのが見られた。
【0013】上記中間時効処理を施した本発明銅合金1
〜6、比較銅合金1〜3および従来銅合金をさらに圧下
率:95%の最終冷間圧延を施すことにより本発明銅合
金1〜6、比較銅合金1〜3および従来銅合金を製造し
た。上記比較銅合金1〜3は、成分含有量がこの発明の
範囲から外れたものである(表1において、この発明の
範囲から外れた値に*印しを付して示した)。
【0014】これら本発明銅合金1〜6、比較銅合金1
〜3および従来銅合金のビッカース硬さ、導電率および
引張り強さを測定し、さらに加工材を1時間焼鈍した時
の強度が焼鈍しない加工材の強度の1/2になる焼鈍温
度を半軟化温度として求め、これらの測定結果も表1に
示した。
【0015】
【表1】【0016】表1に示される結果から、中間時効処理し
たのち最終冷間圧延した本発明銅合金1〜6は、いずれ
も中間時効処理したのち最終冷間圧延した従来銅合金に
比べて、導電率はほぼ同等であるが、ビッカース硬さお
よび引張り強さが格段に優れており、さらに半軟化温度
が大幅に向上していることから耐熱性にも優れているこ
とがわかる。また比較銅合金1〜3に見られるように、
成分組成がこの発明の範囲から外れると、ビッカース硬
さ、引張り強さ、導電率および半軟化温度のうち少なく
ともいずれかの性質が従来銅合金とほぼ同等または従来
銅合金よりも劣ったものとなることもわかる。
【0017】
【発明の効果】上述のように、冷間圧延と時効処理を繰
り返し、最終的に冷間圧延することにより得られた線材
または板材を用いて、従来よりも優れた特性を有する超
強磁場発生装置の導電コイルを製造することができ、工
業上優れた効果をもたらすものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy excellent in heat resistance, strength and conductivity used as a conductive material of an ultra-high magnetic field generator. 2. Description of the Related Art Conventionally, a conductive material used for a magnet that generates an ultra-high magnetic field has a strength that can withstand a strong electromagnetic force generated by the strong magnetic field and a high conductive material that generates little Joule heat even when a large current flows. Materials having properties are required. As such a material, recently, Ag: 2 to 60
There has been proposed an Ag-containing copper alloy composed of mass% and the balance: Cu (see, for example, Journal of the Japan Institute of Metals, Vol. 55, No. 12, (1991) P1382-1391). [0004] However, the conventional A
The g-containing copper alloy does not have sufficient strength to withstand the stress generated when a strong magnetic field of 80 T or more is generated,
There has been a demand for copper alloys having even better heat resistance, strength and conductivity. [0005] Therefore, the present inventors have proposed:
As a result of conducting research to obtain a copper alloy having higher heat resistance, higher strength and higher conductivity than before, Ag:
8.0 to 20.0% by mass, Cr: 0.1 to 1.0% by mass
Is contained in a matrix in which two phases of primary crystals and eutectic crystals obtained by repeating cold working and aging of a copper alloy ingot having a composition consisting of Cu and unavoidable impurities are in a fibrous state. A copper alloy having a structure in which fine precipitates are dispersed not only significantly improves the strength and hardness as compared with the conventional Ag-containing copper alloy, but also has a semi-softening temperature (1 It has been found that the strength at the time of annealing for one hour increases the annealing temperature at which the strength of the work material that does not anneal becomes 1 / of that of the non-annealed material, thereby improving the heat resistance. [0006] The present invention has been made based on such knowledge, and it is found that Ag: 8.0 to 20.0 mass%,
r: a composition containing 0.1 to 1.0 mass%, the balance being Cu and unavoidable impurities, and fine precipitates of Cr dispersed in a base material in which primary crystals and eutectics are oriented in a fibrous form. It is characterized by a copper alloy having an excellent heat resistance, strength and conductivity. To produce the copper alloy of the present invention, first,
Electrolytic copper is dissolved in an inert gas, Ag and Cr are added to the obtained molten metal, the composition of the components is adjusted, and casting is performed to produce an ingot. The ingot is manufactured by subjecting it to hot forging or hot rolling at 600 to 700 ° C., then performing solution treatment, and then repeatedly performing cold working and aging treatment. The thus obtained copper alloy of the present invention has a structure in which fine precipitates of Cr are dispersed in a matrix in which the primary crystal of Cu and the eutectic of Cu and Ag solid solution are oriented in a fibrous form and reinforced. are doing. Next, the reason why the component composition of the copper alloy of the present invention is limited as described above will be described. (A) Ag Ag is dissolved in Cu or crystallized as a eutectic structure with Cu, and has the effect of improving the strength and hardness of the alloy. It is not preferable because it becomes a solid solution single phase and cannot be fiber reinforced especially.
Even if the content exceeds 0.0% by mass, no remarkable improvement in strength at high temperatures is observed, which is not economically preferable. Therefore, the content of Ag was set to 8.0 to 20.0% by mass. (B) Cr Cr forms a solid solution with Ag together with Ag, and has an effect of improving the strength and hardness of the alloy by fine precipitation of Cr by aging treatment, and further improves the strength at high temperatures. There is an effect, but if the content is less than 0.1% by mass, the effect is not obtained. On the other hand, if the content exceeds 1.0% by mass, coarse Cr crystals are easily generated at the time of casting, and improvement in strength cannot be expected.
Further, the conductivity is further reduced, which is not preferable.
Therefore, the content of Cr is set to 0.1 to 1.0% by mass. Next, the copper alloy of the present invention will be described in detail with reference to examples. Melting and casting in an Ar atmosphere to produce a Cu alloy ingot having the component composition shown in Table 1, cold-rolling the Cu alloy ingot with a reduction ratio of 50%, and further temperature: 4
Intermediate aging treatment of holding at 00 ° C. for 1 hour is performed, and the copper alloys 1 to 6 of the present invention and the comparative copper alloys 1
When the structure of No. 3 was observed by SEM, Cu primary crystal and C
It was observed that fine precipitates of Cr were dispersed in a two-phase fibrous base material composed of a eutectic of u and Ag. The copper alloy 1 of the present invention subjected to the above-mentioned intermediate aging treatment
-6, comparative copper alloys 1-3 and conventional copper alloys were further subjected to final cold rolling at a reduction of 95% to produce copper alloys 1-6 of the present invention, comparative copper alloys 1-3 and conventional copper alloys. . The comparative copper alloys 1 to 3 have component contents out of the range of the present invention (in Table 1, the values out of the range of the present invention are indicated by *). These copper alloys 1 to 6 of the present invention and comparative copper alloy 1
Measure the Vickers hardness, electrical conductivity and tensile strength of conventional and copper alloys and semi-soften the annealing temperature where the strength of the processed material after annealing for 1 hour becomes half the strength of the non-annealed processed material The temperature was determined, and the measurement results are also shown in Table 1. [Table 1] From the results shown in Table 1, the copper alloys 1 to 6 of the present invention which were subjected to the intermediate aging treatment and then finally cold-rolled were all more conductive than the conventional copper alloys which were subjected to the intermediate aging treatment and finally cold-rolled. Although the ratios are almost the same, it can be seen that the Vickers hardness and the tensile strength are remarkably excellent, and the semi-softening temperature is significantly improved, so that the heat resistance is also excellent. Also, as seen in comparative copper alloys 1-3,
When the component composition deviates from the scope of the present invention, Vickers hardness, tensile strength, conductivity and / or the property of semi-softening temperature become at least one of properties substantially equal to or inferior to conventional copper alloys. I understand that. As described above, cold rolling and aging treatment are repeated, and finally, a wire or a sheet obtained by cold rolling is used to obtain a super rod having excellent characteristics compared to the conventional one. It is possible to manufacture a conductive coil of a strong magnetic field generator and bring about an industrially superior effect.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 和田 仁 茨城県つくば市千現1−2−1 科学技 術庁 金属材料技術研究所 筑波支所内 (56)参考文献 特開 平4−120227(JP,A) 特開 平3−294457(JP,A) 特開 昭50−39216(JP,A) 特開 昭51−16219(JP,A) 坂井 義和,井上 廉,浅野 稔久, 前田 弘,高強度・高導電性Cu−Ag 合金の開発,日本金属学会誌,日本,社 団法人日本金属学会,1991年12月20日, 第55巻,第12号,p.1382−1391 (58)調査した分野(Int.Cl.7,DB名) C22C 9/00 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Jin Wada 1-2-1 Sengen, Tsukuba City, Ibaraki Pref., National Institute of Metals and Materials, Tsukuba Branch (56) References JP-A-4-120227 (JP, A) JP-A-3-294457 (JP, A) JP-A-50-39216 (JP, A) JP-A-51-16219 (JP, A) Yoshikazu Sakai, Ren Inoue, Toshihisa Asano, Hiroshi Maeda, Development of Highly Conductive Cu-Ag Alloy, Journal of the Japan Institute of Metals, Japan, The Institute of Metals, Japan, December 20, 1991, Vol. 55, No. 12, p. 1382-1391 (58) Field surveyed (Int.Cl. 7 , DB name) C22C 9/00
Claims (1)
0.1〜1.0質量%を含有し、残りがCuおよび不可
避不純物からなる組成、並びに初晶および共晶が繊維状
に配向した素地中にCrの微細な析出物が分散している
組織を有することを特徴とする耐熱性、強度および導電
性に優れた銅合金。(57) [Claims 1] Ag: 8.0 to 20.0% by mass, Cr:
A composition containing 0.1 to 1.0% by mass, the balance being Cu and unavoidable impurities, and a structure in which fine precipitates of Cr are dispersed in a matrix in which primary crystals and eutectic crystals are oriented in a fibrous form. A copper alloy excellent in heat resistance, strength and conductivity , characterized by having:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP09083293A JP3407054B2 (en) | 1993-03-25 | 1993-03-25 | Copper alloy with excellent heat resistance, strength and conductivity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP09083293A JP3407054B2 (en) | 1993-03-25 | 1993-03-25 | Copper alloy with excellent heat resistance, strength and conductivity |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06279894A JPH06279894A (en) | 1994-10-04 |
JP3407054B2 true JP3407054B2 (en) | 2003-05-19 |
Family
ID=14009566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP09083293A Expired - Lifetime JP3407054B2 (en) | 1993-03-25 | 1993-03-25 | Copper alloy with excellent heat resistance, strength and conductivity |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3407054B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001288517A (en) | 2000-04-05 | 2001-10-19 | Ishikawajima Harima Heavy Ind Co Ltd | Cu-BASED ALLOY, CASTING HAVING HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY USING THE SAME AND METHOD FOR PRODUCING CASTING |
JP3861712B2 (en) * | 2002-02-21 | 2006-12-20 | 石川島播磨重工業株式会社 | Cu-based alloy and method for producing high-strength and high-thermal conductivity forging using the same |
JP4859238B2 (en) * | 2007-03-30 | 2012-01-25 | Jx日鉱日石金属株式会社 | High strength high conductivity heat resistant copper alloy foil |
JP5048046B2 (en) * | 2009-12-14 | 2012-10-17 | Jx日鉱日石金属株式会社 | Copper alloy for electronic equipment |
CN106676314B (en) * | 2016-12-28 | 2018-06-15 | 北京有色金属研究总院 | A kind of preparation method of high-strength high-conductivity Cu-Ag alloys |
CN115464406B (en) * | 2022-08-30 | 2023-08-04 | 南京理工大学 | High-strength high-conductivity CuCr copper intermediate alloy and preparation method thereof |
-
1993
- 1993-03-25 JP JP09083293A patent/JP3407054B2/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
坂井 義和,井上 廉,浅野 稔久,前田 弘,高強度・高導電性Cu−Ag合金の開発,日本金属学会誌,日本,社団法人日本金属学会,1991年12月20日,第55巻,第12号,p.1382−1391 |
Also Published As
Publication number | Publication date |
---|---|
JPH06279894A (en) | 1994-10-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2726939B2 (en) | Highly conductive copper alloy with excellent workability and heat resistance | |
US4073667A (en) | Processing for improved stress relaxation resistance in copper alloys exhibiting spinodal decomposition | |
JPH06299280A (en) | Molybdenum - rhenium alloy | |
JPS62112748A (en) | Aluminum forging alloy | |
WO2012132765A1 (en) | Cu-si-co-base copper alloy for electronic materials and method for producing same | |
US5882442A (en) | Iron modified phosphor-bronze | |
JP3407054B2 (en) | Copper alloy with excellent heat resistance, strength and conductivity | |
US3268328A (en) | Metallurgy | |
US3156560A (en) | Ductile niobium and tantalum alloys | |
JPS6141739A (en) | Copper-nickel-tin-cobalt spinnel alloy | |
CA1093437A (en) | Processing for improved stress relaxation resistance in copper alloys exhibiting spinodal decompositon | |
JP2714555B2 (en) | High strength and high conductivity copper alloy sheet material | |
US4148671A (en) | High ductility, high strength aluminum conductor | |
US4213799A (en) | Improving the electrical conductivity of aluminum alloys through the addition of mischmetal | |
US2666698A (en) | Alloys of titanium containing aluminum and iron | |
US2883284A (en) | Molybdenum base alloys | |
JP3626507B2 (en) | High strength and high ductility TiAl intermetallic compound | |
US3330653A (en) | Copper-zirconium-vanadium alloys | |
JP3325641B2 (en) | Method for producing high-strength high-conductivity copper alloy | |
US3107998A (en) | Copper-zirconium-arsenic alloys | |
JP2918961B2 (en) | High-strength copper alloy with high workability | |
CN115874080B (en) | Copper-based alloy material and preparation method and application thereof | |
JPH06279893A (en) | Copper alloy excellent in strength and electrical conductivity | |
US2246886A (en) | Manganese-base alloy and method of making and using the same | |
JPH0832935B2 (en) | High strength and high toughness Cu alloy with little characteristic anisotropy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20030128 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080314 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090314 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100314 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100314 Year of fee payment: 7 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100314 Year of fee payment: 7 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110314 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110314 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120314 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130314 Year of fee payment: 10 |