JP3401803B2 - Wafer transfer method, wafer holding carrier stage, wafer transfer device, and semiconductor - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer method, a wafer holding carrier stage , a wafer transfer apparatus , and
And semiconductors . The present invention can be preferably used particularly in a mode in which when transferring semiconductor wafers or the like, switching can be performed according to the processing, for example, according to the degree of contamination, and contamination can be prevented from reaching other wafers or the like. it can.

[0002]

2. Description of the Related Art For example, in a semiconductor device manufacturing process, when various treatments are applied to a semiconductor wafer, a plurality of wafers are generally supported by a wafer supporting tool called a wafer carrier, and the wafer is moved to move other wafers. It is being transferred to the processing section.

A conventional wafer transfer device is shown in FIG.
Conventionally, a plurality of wafers 1 to be transferred are usually housed in a wafer carrier, and the wafers 1 in the wafer carrier 2 are supported by a wafer chuck that is a support arm 4'and transferred to another wafer carrier. Carriers are being moved for further predetermined processing.

In FIG. 4, in the apparatus main body shown in FIGS. 4 (a) and 4 (b), the carrier 2A at the position shown by enclosing A in the figure is circled.
In order to transfer the inner wafer to the carrier 2B at the position indicated by B in the same circle, first, the wafer in the carrier 2A is taken out by the wafer chuck which is the support arm 4 ', and then the wafer is chucked by the chuck 4 While being held at ′, the wafer is horizontally moved to load the wafer into the designated position of the carrier 2B. As a method for holding the wafer chuck by the support arm 4 ', vacuum suction is generally used.

In the prior art, the chuck portion constituting the wafer support arm 4'generally has a horizontal type multi-joint driving function as shown in FIG. 5, and the robot arm portion 4a 'is provided on each axis. By rotating it to the opposite side, the expansion and contraction operation becomes possible, whereby the carrier 2
The wafer 1 can be taken out or stored from A and 2B. Furthermore, it is possible to drive this articulated robot itself in the horizontal direction.
The articulated robot can be moved and stopped even before the stage of the carriers 2A and 2B. Figure 4
The arrow in (a) shows the movement of the support arm 4 '.

Further, as shown in FIG. 6, both carrier stages 3 (stage parts are indicated by 30) at positions A and B respectively have an elevator function (see also the arrow in FIG. 4 (b)). ) At this time, the number of wafers in the wafer carriers 2A and 2B and the position of the wafers are confirmed by the sensor by the ascending / descending operation.

The wafer transfer command is issued by designating the position of the wafer to be transferred (carrier 2A) and the transfer destination position (carrier 2B). However, since the position of each wafer 1 in the carriers 2A and 2B has been confirmed by the carrier elevator function, if an incorrect transfer command is issued (for example, the wafer is not moved to the carrier at the transfer source). When a loading command is issued, etc.), it has a function to output an error message. Alternatively, after confirming the wafer position in each carrier, a function of introducing information of the transfer source and transfer destination carriers from the device to the operator (for example, LCD (liquid crystal)).
It may have a display surface).

[0008]

In the conventional wafer transfer device as described above, there are only one type of wafer chuck and one type of carrier stage. Therefore, if the back surface of the transferred wafer or the carrier wall portion is contaminated with some sort, it naturally contaminates the wafer chuck portion and the carrier stage portion, respectively.

Once the wafer chuck portion and the carrier stage portion are contaminated, the next wafer rear surface is passed through the chuck portion and the carrier wall is passed through the stage portion during the next wafer transfer operation. It will contaminate the department.

Typical pollutants referred to here are, for example, organic substances derived from metal components, dust, resist and the like.

When the back surface of the wafer and the carrier wall are contaminated by such contaminants, for example, as shown in FIG.
During the treatment (wet cleaning) with the chemical 71, the whole chemical is contaminated, which causes contamination of the mirror surface of the wafer 1 (that is, contaminants on the back surface of the wafer and the carrier wall 2 ′ are treated by the treatment tank 72).
During the chemical treatment of the inside, the surface of the wafer is contaminated by using the chemical as a medium. (See FIG. 7). The pollutant is shown schematically at 73.

In the semiconductor manufacturing process, there are many processes that require processing and processing under extremely clean conditions, and if the above-mentioned contamination occurs, the yield, performance and reliability of the semiconductor will be greatly affected. To do.

Further, there are a great number of manufacturing processes until the semiconductor is completed, and the clean level in these processes varies depending on the processing content.
That is, many processing steps (processing apparatuses) having different contamination levels and clean levels are mixed.

From the above, in order to prevent contamination (cross contamination) by the wafer transfer device, the transfer device is provided for each device having a different contamination level (clean level). As a result, since the same transfer device does not work on wafers or carriers having different contamination (clean) levels, the risk of cross-contamination of contaminants can be eliminated.

However, in this case, an extremely large number of wafer transfer devices are required, which is disadvantageous in the following points. (1) The cost required for the wafer transfer device is large. (2) The space required for the wafer transfer device becomes very large (the occupied area in the clean room increases).

[0016]

SUMMARY OF THE INVENTION The present invention solves the above problems and solves the conventional problem of cross contamination with a simple structure. For example, a single device can be used to easily carry out wafers or carriers having a plurality of contamination levels. It is also possible to reduce the number of wafer transfer devices required for each process, which was conventionally required for each process, and it is possible to reduce costs and occupy an area in a clean room. and it seeks to provide state, and are intended to provide a wafer transfer method to achieve this object, a wafer carrier holding the carrier stage, and the wafer transfer device, or
To provide semiconductors obtained by such technology
Monodea Ru.

[0017]

According to the invention of claim 1 of the present application, in a wafer transfer method for transferring a wafer to be processed by using a wafer carrier that supports the wafer, the wafer is transferred in a vertical direction about a horizontal axis. A rotary body that can be rotationally driven, and a side surface of the rotary body has a plurality of planes.
Can be the stage part that holds the wafer carrier
Using the rotating body as a wafer carrier,
The wafer carrier moves the plurality of flat wafers by the rotary drive.
One of the surfaces should be exposed on the wafer transfer surface.
Accordingly, with use of the structure and the carrier stage used for holding the wafer carrier as the plane located on the upper surface by the rotation driving stearyl <br/> over di unit, the stage of the carrier stage, the process of the wafer processing Accordingly, the wafer transfer method is characterized in that the wafer carrier is configured to be switchable and hold a wafer carrier on a desired stage portion for a specific processing step. is there.

According to a second aspect of the present invention, the wafer is
1 carrier and 1 carrier stage to hold it
Pairs are provided, one set for the transfer source and the other set for the transfer destination
The wafer transfer according to claim 1, characterized in that
A mounting method , which achieves the above object.

According to the invention of claim 3 of the present application, in a wafer transfer method for transferring a wafer to be processed by using a wafer carrier for supporting a wafer, a plane which can be rotationally driven in a horizontal direction about a vertical axis. A carrier stage having a plurality of stage portions for holding the wafer carrier integrally therewith and configured to hold the wafer carrier on a desired stage portion by integrally rotating the carrier is used. Is configured so as to be switchable according to the wafer processing step and hold the wafer carrier on a desired stage portion for a specific processing step , and the wafer carrier and
One pair of carrier stages are provided to hold this.
Is used for the transfer source , and the other set is used for the transfer destination. The wafer transfer method achieves the above object.

[0020] This application of the invention of claim 4 is a carrier stage for holding a wafer carrier that supports the wafer, without the center and the vertical rotary drive capable rotation of the horizontal shaft, the rotating member Has a plurality of flat sides,
The plurality of planes is a stage unit for holding a wafer carrier
It is possible that
One of the surfaces should be exposed on the wafer transfer surface.
Accordingly, the rotation driving by a plane positioned at the upper surface a wafer carrier holding carrier stage, characterized in that the arrangement used for the wafer carrier holding a stearyl <br/> over di unit, thereby the object Is achieved.

[0021] The invention of claim 5 of the present application, along with the wafer transferring the support arm mechanism, and the wafer carrier that supports the wafer in the wafer transfer method using a carrier stage for holding the wafer carrier, the Wafer carrier contains the wafer inside
And the carrier stage is
The wafer carrier is held by holding the wafer carrier.
A) The wafer stored in the
In order to hold the carrier, and according to the process of wafer processing, the wafer support portion of the support arm mechanism is selected, and the carrier stage is provided with a plurality of stage portions for holding the wafer carrier, The stage can be switched according to the wafer processing process,
For a specific processing step, the wafer carrier is held on a desired stage portion, and the selection of the wafer support portion of the support arm mechanism and the switching of the stage portion are interlocked with each other. The transfer method achieves the above object.

The invention according to claim 6 of the present application is a wafer transfer apparatus which transfers a wafer by a support arm mechanism and includes a wafer carrier for supporting the wafer and a carrier stage for holding the wafer carrier. The wafer carrier stores the wafer inside
And the carrier stage is
The wafer carrier is held by holding the wafer carrier.
A) The wafer stored in the
In order to hold the carrier, and according to the process of wafer processing, the wafer support portion of the support arm mechanism is selected, and the carrier stage is provided with a plurality of stage portions for holding the wafer carrier, The stage can be switched according to the wafer processing process,
Regarding a specific processing step, the wafer carrier can be held on a desired stage part, and the selection of the wafer support part of the support arm mechanism and the switching of the stage part are interlocked with each other. A wafer transfer device that achieves the above object by this configuration.

The invention of claim 7 of the present application is a wafer transfer method, wherein a wafer is transferred by a support arm mechanism, and a wafer carrier for supporting the wafer and a carrier stage for holding the wafer carrier are used. The wafer support part of the support arm mechanism is selected according to the process step, and the carrier stage is provided with a plurality of stage parts for holding the wafer carrier, and the stage part is switched according to the wafer process step. Enable, hold the wafer carrier to a desired stage portion for a specific processing step, and select the wafer support portion of the support arm mechanism, and the switching of the stage portion, together with the configuration , The wafer
1 carrier and 1 carrier stage to hold it
Pairs are provided, one set for the transfer source and the other set for the transfer destination
A wafer transfer method characterized by using
This achieves the above object.

The invention of claim 8 of the present application is a wafer transfer apparatus which transfers a wafer by a support arm mechanism and includes a wafer carrier for supporting the wafer and a carrier stage for holding the wafer carrier, According to the process of wafer processing, the wafer supporting part of the support arm mechanism is selected, and the carrier stage is provided with a plurality of stage parts for holding the wafer carrier. It is configured to be switchable so that the wafer carrier can be held on a desired stage part for a specific process step, and the selection of the wafer support part of the support arm mechanism and the switching of the stage part are interlocked. And
The wafer carrier and a carrier stage for holding the wafer carrier.
One pair for each transfer source, one set for transfer source, the other set
A wafer transfer device for use as a transfer destination , which achieves the above object.

According to the invention of claim 9 of the present application, in a semiconductor manufactured by performing a plurality of processing steps having different contamination levels and performing transfer using a transfer device between the processing steps, the contamination level is increased. Along with being manufactured by performing a predetermined transfer according to, the transfer is a wafer transfer method using a wafer carrier supporting a semiconductor wafer,
A rotary body that can be driven to rotate in a vertical direction about a horizontal axis is formed, and a side surface of the rotary body has a plurality of flat surfaces.
The flat surface can be the stage part that holds the wafer carrier.
Use the rotating body as a wafer carrier
The wafer carrier is rotated by the rotary drive to
One of a number of planes is exposed on the wafer transfer surface.
By doing so, the flat surface located on the upper surface by the rotational drive
There together using the carrier stage where the structure used for the wafer carrier holding the stage unit, the stage of the carrier stage, in accordance with the process of the wafer processing, and enables switching, desired for a particular process steps A semiconductor, which is characterized in that it is carried out by a wafer transfer method configured to hold a wafer carrier on a stage part, and thereby achieves the above object.

The invention according to claim 10 of the present application is the above-mentioned way.
Ha carrier and the carrier stage that holds it
One pair is provided, one set for the transfer source and the other set for the transfer destination
The semiconductor according to claim 9, wherein the semiconductor is used for achieving the above object.

According to the invention of claim 11 of the present application, in a semiconductor manufactured by performing a plurality of processing steps having different contamination levels and performing transfer using a transfer device between the processing steps, the contamination level is increased. It is manufactured by performing a predetermined transfer according to the above, and the transfer is a wafer transfer method using a wafer carrier that supports a semiconductor wafer, and can be driven to rotate in a horizontal direction about a vertical axis. On a flat surface, a carrier stage having a plurality of stage portions for holding the wafer carrier is integrally used, and a carrier stage configured to hold the wafer carrier on a desired stage portion by integrally rotating the carrier is used. The stage section can be switched according to the wafer processing step, and the wafer key can be switched to a desired stage section for a specific processing step. A structure for holding the rear and,
The wafer carrier and a carrier stage for holding the wafer carrier.
One pair for each transfer source, one set for transfer source, the other set
A semiconductor characterized by being carried out by a wafer transfer method characterized by being used as a transfer destination ,
This achieves the above object.

The invention according to each claim of the present application achieves the object of the present invention by adopting the above-mentioned configuration.

The invention of claim 13 of the present application is the contamination level
Is processed by a plurality of different processing steps,
Between semiconductors manufactured by transfer using a transfer device
Manufactured by carrying out predetermined transfer according to the contamination level
A semiconductor characterized in that
It achieves the stated purpose. In the present invention, the wafer refers to all objects to be processed, such as semiconductor substrate wafers, which require different processing and need to be transferred.

[0030]

According to the invention of the present application, since a stage having a plurality of stages is used, the stages can be selected and switched according to the cause of contamination. For example, a clean wafer carrier is always a clean stage. It can be placed on top and always put organically contaminated on the holding stage for the organically contaminated wafer carrier, thus preventing the propagation of contamination.

Similarly, a plurality of arm mechanisms for supporting a wafer and transferring it to a wafer chuck or the like are similarly provided depending on the processing (depending on the cause of contamination, etc.) and are dedicated to each stage. Prevents cross contamination.

Furthermore, when the arm mechanism and the carrier stage are selected and switched, they can be interlocked. For example, when a support arm that supports a wafer with metal contamination is driven, then a wafer stage with metal contamination can be automatically selected and switched to use that stage section. .

[0033]

Embodiments of the present invention will be described below with reference to the drawings. However, it should be understood that the present invention is not limited to the illustrated embodiments.

Embodiment 1 A wafer transfer device according to an embodiment of the present invention is shown in FIGS. 1 is a top view of the entire apparatus, FIG. 2 is a front view thereof, and FIG. 3 is a perspective view thereof.

In this embodiment, as shown in FIGS. 1 to 3, when the wafer 1 to be processed is transferred by using the wafer carrier 2 which supports the wafer 1, the wafer carrier 2
The carrier stages 3a and 3b holding a and 2b are used, and the carrier stages 3a and 3b are stage parts 31a to 35a and 31 which hold the wafer carriers 2a and 2b.
b to 35b are provided, and the stage portion of the carrier stage is switchable according to the wafer processing step,
The wafer carrier is held on a desired stage for a specific processing step.

The switching can be performed, for example, by a chuck and carrier stage selection button indicated by reference numeral 5 in FIG. In this example, the carrier stage selection and the chuck as the support arm mechanism can be selected in conjunction with each other.

Further, the carrier stage 3 of this embodiment is
Stage part 31a for holding the wafer carriers 2a, 2b
.About.35a, 31b to 35b are integrally formed and driven integrally.

In this embodiment, the stage portion can be switched according to the wafer processing step, and the wafer carrier can be held on a desired stage portion for a specific processing step.

The wafer transfer apparatus according to the present embodiment has a plurality of wafer chucks forming a support arm mechanism 4 for taking out and supporting a wafer and a plurality of carrier stage sections 3 in one apparatus.

Further, it has a function of selecting these plural portions according to the application (contamination level of the wafer or carrier).

In FIG. 1, the wafer chuck portion 4 is
In the figure, the structure is such that four chucks are owned, and the chuck is selected by rotation according to the application.
Any number of chucks may be used as long as another chuck does not contact the same wafer during wafer transfer.

The wafer chuck can be selected by the switch 5 (A to F in the drawing) in the apparatus.

As an example of selection, clean, metal contamination I
(For example, with Al), metal contamination II (for example, with WSi, organic contamination (for example, with resist))
It is desirable to divide into process contamination levels.

Further, the carrier stage portion can be rotationally driven in a vertical direction as shown by an arrow A1 in FIGS. 1 to 3, particularly FIGS. 1 and 3, and this can also be driven by rotation depending on the application. You can select the required career stage. The carrier stages 3a and 3b shown in FIG.
Although shown asymmetrically for convenience of illustration, each stage is a point-symmetrical rotating body capable of supporting a wafer carrier during rotation. When the above-mentioned four types of levels are set as the selection type, it is sufficient that the rotating body has a rectangular shape or more. The selection in this case is also performed by the switch 5 in the apparatus, and is interlocked with the above-mentioned wafer chuck section. That is, for example, if a resist-attached pattern is applied, both the chuck and the stage for use with resist are selected.

As a method of using the apparatus, first, the selection button constituting the switch 5 is pushed to select the carrier stage, and then the carrier of the transfer source and the carrier of the transfer destination are placed on each stage. When the start button of the switch 5 is pressed, the wafer position in the carrier is confirmed (the wafer position is confirmed by moving the carrier stage or the sensor up and down), and then the transfer operation is performed.

Next, details of the apparatus configuration of this embodiment will be described. FIG. 8 and subsequent figures show the details of the configuration example of each drive unit in the wafer transfer apparatus of this embodiment.

As a chucking method for the chuck portion forming the wafer support arm mechanism 4, a vacuum suction method, a mechanical (mechanical) holding method, or both configurations can be adopted.

FIGS. 8A to 8D show a structure in which the vacuum chuck portions 41a to 44a are provided on the wafer supporting portions 41 to 44, and the wafer is shown in FIGS. 8B and 8C. Thus, it is supported by vacuum chucking. Depending on the application, the necessary chuck part is selected by rotation, and the wafer is transferred. As shown in FIG. 8D, a plurality of vacuum holes 41a may be formed in one support portion 4a.

FIGS. 9A to 9C show a device in which the outer edge of the wafer is mechanically gripped to fix the wafer. Reference numerals 41b to 44d denote fixing portions for holding the wafer. 10A to 10C show an example in which mechanical support and vacuum chuck support are used in combination.

11 to 13 show examples of the structure of the carrier stage 3. As a stage selection method, each structure of a vertical rotation type (FIG. 11), a horizontal rotation type (FIG. 12), and a plurality of arrangement types on the same plane (FIG. 13) can be adopted, and respective configurations are illustrated.

In the example of FIG. 11, a plurality of carrier stages 31 ...
33, and if necessary, the stage is selectively used by vertical rotation (rotation in the direction of the arrow in the figure). A belt may be used so that the stage can be selected.

In the example of FIG. 12, a plurality of carrier stages 31 ...
37, and if necessary, the stage is selected by horizontal rotation (rotation of arrow in the figure).

In the example of FIG. 13, a plurality of wafer stages 31 to 33 for different purposes are integrated on a wafer transfer device .
This is an example of the case, and it is installed so that it can be driven integrally.
It is also possible to select and use.

By properly adopting the above configuration, it becomes possible to provide a plurality of wafer chucks and carrier stages in the same apparatus.

With the above apparatus of this embodiment, it is possible to transfer a plurality of wafers or carriers having different contamination (clean) levels with each other, so that it is possible to reliably prevent cross-contamination of contaminants. Can be achieved. Moreover, the required number of wafer transfer devices can be reduced, which can reduce the required cost for wafer transfer, and can also reduce the area occupied by the device (space saving).

[0056]

According to the present invention, the problem of cross-contamination can be solved with a simple structure, and it is possible to simply
It is also possible to process wafers and carriers of multiple contamination levels with one device, and it is possible to reduce the required number of wafer transfer devices, which conventionally required one for each process, resulting in cost savings and The occupied area in the clean room can also be reduced.

[Brief description of drawings]

FIG. 1 is a top view of a wafer transfer device according to a first embodiment.

FIG. 2 is a front view of the wafer transfer device according to the first embodiment.

FIG. 3 is a perspective view of the wafer transfer device according to the first embodiment.

FIG. 4 is a view showing a conventional wafer transfer device.

FIG. 5 is a view showing a conventional support arm (wafer chuck).

FIG. 6 is a diagram showing a conventional carrier elevator.

FIG. 7 is a diagram showing a problem of the conventional technique.

FIG. 8 is a diagram showing a configuration example of a support arm mechanism (chuck portion).

FIG. 9 is a diagram showing a configuration example of a support arm mechanism (chuck portion).

FIG. 10 is a diagram showing a configuration example of a support arm mechanism (chuck portion).

FIG. 11 is a diagram showing a configuration example of a carrier stage.

FIG. 12 is a diagram showing a configuration example of a carrier stage.

FIG. 13 is a diagram showing a configuration example of a carrier stage.

[Explanation of symbols]

1 wafer 2 Wafer carrier 3,3a, 3b Carrier stage 31a-35a, 31b-35b Stage part 4 Support arm mechanism (chuck part) 41-44 Wafer support

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) B65G 49/07 H01L 21/68

Claims (11)

(57) [Claims] 1. A wafer transfer method in which a wafer to be processed is transferred using a wafer carrier that supports a wafer, wherein a rotary body that can be rotationally driven in a vertical direction about a horizontal axis is formed, The side surface has a plurality of planes,
The flat surface can be the stage part that holds the wafer carrier.
Use the rotating body as a wafer carrier
The wafer carrier has the plurality of wafers driven by the rotary drive.
One of the planes should be exposed on the wafer transfer surface.
And, the plane located on the upper surface by the rotary drive and the stage portion
Then, the carrier stage configured to be used for holding the wafer carrier is used, and the stage part of the carrier stage can be switched according to the process of wafer processing, and a desired stage part can be provided for a specific process. A wafer transfer method, characterized in that the wafer carrier is held by the wafer carrier. 2. The wafer carrier and holding the same
One pair of carrier stages is provided, one set is the transfer source
And the other set is used as a transfer destination.
The wafer transfer method according to claim 1. 3. A wafer transfer method in which a wafer to be processed is transferred using a wafer carrier that supports a wafer, and the wafer carrier is held on a plane that can be rotationally driven in a horizontal direction about a vertical axis. A carrier stage that has a plurality of stage parts integrally and is configured to hold a wafer carrier on a desired stage part by integrally rotationally driving the stage part is used. The wafer carrier is held on a desired stage for a specific processing step , and the wafer carrier and the carrier stage holding the wafer carrier are held.
One pair for each transfer source, one set for transfer source, the other set
A wafer transfer method characterized by being used as a transfer destination . 4. A carrier stage for holding a wafer carrier for supporting a wafer, comprising a rotating body capable of being rotationally driven in a vertical direction about a horizontal axis, and a side surface of the rotating body has a plurality of flat surfaces. And the plurality of
The flat surface can be the stage part that holds the wafer carrier.
It is assumed that one of the plurality of planes is rotated by the rotation drive.
By adopting a configuration that appears on the transfer surface, the plane located on the upper surface due to the rotation drive becomes the stage section .
A carrier stage for holding a wafer carrier, which is configured to be used for holding a wafer carrier. 5. A wafer transfer method, wherein a wafer is transferred by a support arm mechanism, and a wafer carrier that supports the wafer and a carrier stage that holds the wafer carrier are used. Store it
The carrier stage supports the way.
By holding the carrier, inside the wafer carrier
The wafer stored in the
Carrier carrier, and the wafer support part of the support arm mechanism is selected according to the wafer processing step.The carrier stage is provided with a plurality of stage parts for holding the wafer carrier. Depending on the process step, the stage part can be switched, the wafer carrier is held on a desired stage part for a specific process step, and the wafer support part of the support arm mechanism is selected.
The wafer transfer method is characterized in that the switching of the stage section is interlocked. 6. A wafer transfer apparatus, comprising: a wafer carrier that transfers a wafer by a support arm mechanism; a wafer carrier that supports the wafer; and a carrier stage that holds the wafer carrier. Store in
The carrier stage supports the way.
By holding the carrier, inside the wafer carrier
The wafer stored in the
Carrier carrier, and the wafer support part of the support arm mechanism is selected according to the wafer processing step.The carrier stage is provided with a plurality of stage parts for holding the wafer carrier. Depending on the process step, the stage part can be switched, and the wafer carrier can be held on a desired stage part for a specific process step, and selection of the wafer support part of the support arm mechanism,
A wafer transfer device characterized in that it is configured to interlock with the switching of the stage section. 7. A wafer transfer method in which a wafer is transferred by a support arm mechanism, and a wafer carrier that supports the wafer and a carrier stage that holds the wafer carrier are used. The wafer support part of the arm mechanism is selected, and the carrier stage is provided with a plurality of stage parts for holding the wafer carrier. For the process, hold the wafer carrier on the desired stage part, and select the wafer support part of the support arm mechanism,
Tomo and The switching of the stage, a structure in which to work
In addition, the wafer carrier and carrier stage for holding the wafer carrier.
One pair for each transfer source, one set for transfer source, the other set
A wafer transfer method characterized by being used as a transfer destination . 8. A wafer transfer device which transfers a wafer by a support arm mechanism and which includes a wafer carrier for supporting the wafer and a carrier stage for holding the wafer carrier, in accordance with a wafer processing step. The wafer support part of the support arm mechanism is selected, and the carrier stage is provided with a plurality of stage parts that hold the wafer carrier, and the stage parts can be switched according to the wafer processing process to enable specific processing. For the step of, the wafer carrier can be held on a desired stage part, and the selection of the wafer support part of the support arm mechanism,
Tomo and The switching of the stage, a structure in which to work
In addition, the wafer carrier and carrier stage for holding the wafer carrier.
One pair for each transfer source, one set for transfer source, the other set
A wafer transfer device that is used as a transfer destination . 9. A semiconductor which is processed by a plurality of processing steps having different contamination levels, and which is manufactured by performing transfer using a transfer device between the processing steps, is subjected to predetermined transfer according to the contamination level. while being manufactured Te, the placing is a wafer transfer method using a wafer carrier that supports a semiconductor wafer, without the center and the vertical rotary drive capable rotation of the horizontal shaft, the rotating The side surface of the body has a plurality of planes,
The flat surface can be the stage part that holds the wafer carrier.
Use the rotating body as a wafer carrier
The wafer carrier has the plurality of wafers driven by the rotary drive.
One of the planes should be exposed on the wafer transfer surface.
As a result, the plane located on the upper surface by the rotational drive becomes the stage section .
Then, the carrier stage configured to be used for holding the wafer carrier is used, and the stage part of the carrier stage can be switched according to the process of wafer processing, and a desired stage part can be provided for a specific process. A semiconductor, which is performed by a wafer transfer method configured to hold a wafer carrier. 10. The wafer carrier and holding the same
There is one pair of carrier stages each, one set is the transfer source
And the other set is used as a transfer destination.
The semiconductor according to claim 9. 11. A semiconductor manufactured by a plurality of processing steps having different contamination levels and transferred by using a transfer device between the processing steps is subjected to predetermined transfer according to the contamination level. The transfer is a wafer transfer method using a wafer carrier that supports semiconductor wafers, and the wafer carrier is placed on a plane that can be rotationally driven in the horizontal direction about a vertical axis. A carrier stage is used which has a plurality of holding stage parts integrally and is configured to hold a wafer carrier on a desired stage part by integrally rotating and driving the stage part. The wafer carrier is held on a desired stage for a specific processing step. And the wafer carrier and a carrier stage for holding the wafer carrier.
One pair for each transfer source, one set for transfer source, the other set
A semiconductor characterized by being carried out by a wafer transfer method characterized by being used as a transfer destination .