JP3465482B2 - Circuit board - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various electronic devices, and particularly to a circuit board used for a power circuit such as a power supply circuit.

[0002]

2. Description of the Related Art Two metal substrates each having a required wiring circuit (circuit pattern) formed by punching a metal plate are prepared, and an insulating support (insulating substrate) is interposed between the metal substrates. As a circuit board, for example, Jikken 7-20937
Japanese Patent Publication has been proposed.

FIG. 9 is an exploded perspective view of an essential part of the constructional concept, and FIG. 10 is a sectional perspective view of an essential part of the through hole portion of FIG.
9 and 10, reference numerals 5A and 5B are metal plates,
6 is an insulating support (insulating substrate), 7 is an electronic component, 8 is a plated layer, and 9 is solder.

The conventional circuit board has two surfaces of the insulating substrate 6,
The metal plate 5A and the metal plate 5B punched out into a required circuit pattern are embedded and integrated so that the surfaces thereof are substantially the same as the surface of the insulating substrate 6.

In order to electrically connect the wiring circuits arranged on both surfaces of the insulating substrate 6 to each other, a through hole 10 is opened in a portion where the wiring circuit is conducted, a plating layer 8 is provided on the inner surface, and solder 9 is filled.

The above conventional circuit board can be manufactured by the following method. First, the two metal plates 5A and 5B punched out into a required wiring circuit are aligned with the portions forming the through holes, and then the insulating support 6 is formed.
Insulating resin that is a metal plate 5A and a metal plate 5B on both sides
A circuit board can be manufactured by pouring it into a space and integrally molding it.

In addition, a metal plate 5A and a metal plate 5B in which a wiring circuit is punched are laminated on both surfaces of a prepreg sheet which constitutes the insulating support 6. This is heated and pressed by a hot press to soften the prepreg sheet. In the process of further curing, the metal plate 5A and the metal plate 5 are placed in the prepreg sheet.
A circuit board is completed by embedding B up to near the surface.

After that, in order to make the wiring circuits on both sides electrically conductive, a hole 10 is made at a portion where conduction is established, and the plating layer 8 is formed on the inner surface.
And the solder 9 is filled.

[0009]

However, in the above-mentioned conventional circuit board, it is necessary to accurately align the wiring circuits on both sides in order to bring the wiring circuits on both sides into conduction. Then, after integrating with the insulating substrate, the steps of forming holes, plating, and filling solder are required, resulting in an increase in cost.

It is an object of the present invention to obtain a low-cost circuit board by eliminating the steps of hole formation, plating, and solder filling after lamination with a simple structure and process.

[0011]

In order to solve the above-mentioned problems, a circuit board of the present invention comprises: (1) a circuit board having a required wiring circuit and holes provided by punching a metal plate; and punching the metal plate. An insulating substrate (arbitrary insulator member) is interposed between a required wiring circuit and a circuit board provided with a cylindrical protrusion, and the hole and the protrusion are fitted and integrated. those with the circuit board, wherein
Is .

(2) A metal plate is punched out to interpose an insulating substrate between a required wiring circuit and two circuit boards provided with a cylindrical protruding portion, and the protruding portions are fitted to each other to be integrated. is obtained by the circuit board, characterized in that it phased.

(3) Between a metal plate punched out of a metal plate to provide a required wiring circuit and a cylindrical protrusion, and a circuit board punched out of the metal plate to provide a required wiring circuit and a protrusion. that the insulating substrate is interposed, and the circuit board, characterized in that integrated in fitting the said projections and the tubular projecting portion
Is .

(4) A metal plate punched out to provide a required wiring circuit and a circular hole or a cylindrical protruding portion, and a metal plate punched out to obtain a required wiring circuit and its cross-sectional shape is approximately V-shaped. A metal plate provided with a protrusion having a bulge portion and an insulating substrate interposed between the metal plates, and the bulge portion has a taper shape in which the width dimension of the root is larger than the width dimension of the tip. the the outer dimension of the projection at the base portion of the bulge portion greater than the inner diameter of the hole is obtained by the circuit board, characterized in that integrated in fitting the said projection and said hole .

According to the present invention, it is possible to obtain a low-cost circuit board by omitting the steps of drilling holes, plating, and filling solder after lamination with a simple structure and steps.

According to the present invention , between a circuit board having a required wiring circuit and a hole formed by punching a metal plate, and a circuit board having a required wiring circuit and a cylindrical protrusion formed by punching a metal plate. A circuit board characterized by interposing an insulating substrate on and integrating the hole and the protrusion by fitting.
The hole forming step, the plating step, and the soldering step after the lamination are not required, and the man-hour and cost can be reduced.

Further, according to the present invention, the surface of at least one of the metal plates is embedded in the insulating substrate so as to be substantially flush with the surface of the insulating substrate. Improves and enables smooth electronic component mounting.

According to the present invention , a metal plate is punched out, an insulating substrate is interposed between a required wiring circuit and two circuit boards provided with a cylindrical protrusion, and the protrusions are fitted to each other. Since the circuit board is characterized by being integrated, a hole forming step, a plating step, and a soldering step are unnecessary, and the number of steps and cost can be reduced.

[0019]

According to the present invention , an insulating substrate is provided between a metal plate punched out of a metal plate to provide a required wiring circuit and holes and a circuit board punched out of the metal plate to provide a required wiring circuit and a protrusion. A circuit board characterized in that the hole and the projection are fitted and integrated with each other by interposing,
The plating process and the soldering process are unnecessary, and the man-hour and cost can be reduced.

[0021]

According to the present invention, a metal plate is punched out to provide a required wiring circuit and a cylindrical protrusion, and a metal plate is punched out to provide a required wiring circuit and a circuit board provided with a protrusion. An insulating substrate is interposed, and the circuit board is characterized in that the cylindrical protrusion and the protrusion are fitted and integrated with each other, and a hole forming step, a plating step, and a soldering step are unnecessary, Man-hours and cost can be reduced.

[0023]

The present invention has a substantially U-shape and further has a protrusion having a hook portion at its tip end, so that the number of steps and cost can be reduced.

According to the present invention , an insulating substrate is provided between a metal plate punched out of a metal plate to provide a required wiring circuit and holes and a circuit board punched out of the metal plate to provide a required wiring circuit and a protrusion. The circuit board is characterized in that it is inserted and integrated so that the hole and the end face provided on the protrusion and the bulge portion are fitted so that they are in contact with each other at three points. The soldering process becomes unnecessary, and the man-hour and cost can be reduced.

[0026]

According to the present invention , a metal plate is punched out to provide a required wiring circuit and a cylindrical protruding portion, and a metal plate is punched out to provide a wiring circuit and a projection provided with a circuit board. A circuit board is characterized in that an insulating substrate is interposed between the holes and the end face provided on the protrusion and the bulging portion are fitted and integrated so that they contact each other at three points. Since the plating process and the soldering process are unnecessary, the man-hour and cost can be reduced.

[0028]

The circuit board according to the embodiment of the present invention will be described below with reference to FIGS.

(Embodiment 1) FIG. 1 is an exploded perspective view of the concept of a circuit board according to Embodiment 1 of the present invention, and FIG.
FIG. 3 is a cross-sectional perspective view of a main part of the conducting part in FIG.

In FIGS. 1 and 2, reference numerals 1A and 1B are metal plates, 2 is an insulating support (insulating substrate), 3A and 3B are through holes, and 4A and 4B are standing around the through holes 3A and 3B. The reference numeral 7 denotes a circuit board, 7 denotes various electronic components to be mounted on the circuit board, and 100 denotes a circuit board.

The metal plates 1A, 1B are formed by patterning by etching or punching a wiring circuit (circuit pattern) as desired by means such as pressing.

In addition, the metal plates 1A and 1B are connected to the insulating substrate 2.
When arranged on both sides of the through holes 3A and 3B and cylindrical protrusions 4A and 4B (for example, cylindrical upright portions) around the through holes in the pressing process in order to establish conduction between the wiring circuits. It is drawn. Then, the other protrusion 4B is fitted (fitted by press-fitting) into the hole 3A of the protrusion 4A.

The surfaces of the metal plates 1A and 1B are embedded in the insulating substrate 2 so that they have substantially the same surface as the surface of the insulating substrate 2.

Specifically, the hole 3A of the metal plate 1A punched into a required wiring circuit shape and having the protruding portion drawn is formed,
The circuit board 10 is formed by press-fitting and joining the holes 3B of the metal plate 1B to each other, and then pouring the insulating resin forming the insulating substrate 2 between the metal plate 1A and the metal plate 1B to integrally form the resin.
0 can be produced. That is, any resin member such as epoxy, ABS, PS, PP is reinforced by means such as insert molding or casting.

As another method of manufacturing the circuit board 100, the metal plates 1A and 1B are laminated so that the prepreg sheets forming the insulating substrate 2 are sandwiched between the metal plates. This laminated body is heated and pressed by a hot press to soften the prepreg sheet. Further, in the process of curing the prepreg sheet, the metal plate 1A is placed in the prepreg base material.
And the metal plate 1B are buried up to the vicinity of the surface to form the circuit board 10.
0 can be formed.

The cylindrical standing portion (protruding portion 4A) provided on the metal plate 1A may be omitted and only the hole 3A may be formed.
The metal plates 1A and 1B can be fitted to each other as in the case of FIG.

With the above structure, the circuit board 100 does not require a hole forming step, a plating step, and a soldering step after stacking, so that the number of steps and cost can be reduced. Further, the strength of integration between the insulating substrate and the metal plate is improved, which enables smooth electronic component mounting.

(Embodiment 2) FIG. 3 is an exploded perspective view of the concept of a circuit board according to Embodiment 2 of the present invention, and FIG.
FIG. 3 is a cross-sectional perspective view of a main part of the conducting part in FIG.

The circuit board 200 in this case is basically the same as that of the first embodiment. The configuration different from the first embodiment is that a cut-and-raised (protrusion) 34 is provided on one metal plate instead of the protruding portion 4B in FIG.

In FIGS. 3 and 4, reference numeral 31B is a metal plate,
34 is a cut-and-raised part (protrusion), and 200 is a circuit board.
Other symbols and configurations are the same as those in the first embodiment.

The cut-and-raised (protrusion) 34 is formed in a substantially triangular shape having a tapered portion at the tip thereof.
It is press-fitted and fitted into the hole 3A of A. Circuit board 200
The manufacturing process of 1 may be performed in the same manner as in Embodiment 1. The effect is the same.

FIG. 5 shows a perspective sectional view of the main part of another circuit board 300 according to the second embodiment. In this case, a protrusion 54 different from that shown in FIG. 4 is provided on the metal plate 51B.

That is, the projection 54 has a slit 55 in the center, is substantially U-shaped, and is characterized in that it has a hook at the tip.

With this structure, when the protrusion 54 is mounted in the hole 3A of the metal plate 1A, the hook 56 is elastically deformed and bent,
In addition, after mounting, it elastically returns to function as a detent.

The cylindrical standing portion (protruding portion 4A) provided on the metal plate 1A is omitted, and the metal plates 1A and 51B are fitted to each other as shown in FIGS. Is possible as well.

(Embodiment 3) FIG. 6 is a perspective view of an essential portion of a metal plate according to Embodiment 3 of the present invention, and FIG. 7 is a perspective sectional view of an essential portion of a metal plate according to Embodiment 3 of the present invention. Figure 7
FIG. 4 is a sectional view of an essential part taken along section line S-S of FIG.

The circuit board in this case is basically the same as that of the second embodiment. The configuration different from the second embodiment is that a protrusion 64 is provided on one metal plate instead of the protrusion 34 in FIG.

6 to 8, reference numeral 61B is a metal plate,
Reference numeral 64 is a protrusion, 65 is a bulge, 66 is a ridge, 67 is a recess, 68 is an end face, and 400 is a circuit board.

The protrusion 64 is provided with a bulge portion 65 in the shape of a mountain at the center of the main surface of the bent portion. When the bulging portion 65 is press-fitted (attached) into the hole 3A of the metal plate 1A, the hole 3A
The contact is made at three points on the inner wall of the.

More specifically, as shown in FIG. 8, when the portion located inside the hole 3A is cut in the horizontal direction, the cross-sectional shape is approximately V-shaped.

Further, as shown in FIG. 6, both end faces 68.68 of the insertion portion are at least in the region in contact with the inner wall of the hole.
The width between them is small, and the width at the base is large.

Further, in the region of pressure contact with the inner wall of the hole 3A, the outer dimension of the insertion portion is made larger than the inner diameter dimension of the hole by a predetermined amount.

When the protrusion 64 configured as described above is press-fitted (installed) into the hole 3A, the plate thickness (thickness) of the bulging portion 65 is obtained even though the outer shape of the insertion portion is larger than the inner diameter of the hole 3A. Is thin and has low rigidity, the recess 67 is easily elastically deformed and contracted. As a result, the end surface 68 and the ridge line portion 66 are fitted in close contact with the inner wall of the hole 3A.

Incidentally, the tubular standing portion (protruding portion 4A) provided on the metal plate 1A is omitted, and the metal plates 1A and 1B are fitted to each other as in the case of FIG. It is possible.

In the above-mentioned three embodiments, after the holes or the cylindrical standing portions and the protruding portions or the projections are fitted (press-fitted) to each other, an adhesive material such as epoxy resin or solder is attached to the fitted portions. It goes without saying that the above may be applied and cured. In addition, in addition to the press-fitting, the gap fitting may be used, and the metal plates may be electrically connected to each other by joining by a soldering process.

With the above structure, the circuit board 400 does not require a hole forming step, a plating step, and a soldering step after stacking, so that the number of steps and cost can be reduced. Further, the strength of integration between the insulating substrate and the metal plate is improved, which enables smooth electronic component mounting.

[0058]

As described above, according to the present invention, the steps of drilling, plating, and soldering after stacking are unnecessary, and the number of steps and cost can be reduced. Further, the strength of integration between the insulating substrate and the metal plate is improved, which enables smooth electronic component mounting.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a concept of a circuit board according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional perspective view of an essential part of a conducting part in FIG.

FIG. 3 is an exploded perspective view of a concept of a circuit board according to a second embodiment of the present invention.

FIG. 4 is a cross-sectional perspective view of an essential part of a conducting part in FIG.

FIG. 5 is a cross-sectional perspective view of essential parts of another circuit board according to the second embodiment.

FIG. 6 is a perspective view of a main part of a metal plate according to a third embodiment of the present invention.

FIG. 7 is a perspective sectional view of a main part of a metal plate according to a third embodiment of the present invention.

FIG. 8 is a cross-sectional view of an essential part taken along the line S-S in FIG. 7.

FIG. 9 is an exploded perspective view of a concept of a conventional circuit board.

10 is a cross-sectional perspective view of a main part of a conducting part in FIG.

[Explanation of symbols]

1A, 1B, 31B, 51B, 61B Metal plate 2 Insulating support (insulating substrate) 3A, 3B holes 4A, 4B Projection 4, 34, 54, 64 Cut and raised (protrusion) 7 electronic components 55 slits 56 Hook 65 bulge 67 recess 68 Edge 100, 200, 300, 400 Circuit board

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References SHO 58-72867 (JP, U) ACT 62-166669 (JP, U) ACT HEI 2-99571 (JP, U) ACT 53- 123454 (JP, U) JPB 46-2875 (JP, B1) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 1/11 H05K 1/18 H05K 3/20 H05K 3/22 H05K 3/40 H02G 3/16 H05K 7/06

Claims (3)

(57) [Claims] 1. A required wiring circuit and a circle are formed by punching out a metal plate.
A metal plate provided with a hole having a shape, a metal plate provided with a required wiring circuit and a protrusion formed with a bulged portion having a substantially V-shaped cross section , Insulating group interposed between metal plates
A plate is provided, and the bulging portion has a width dimension at the base rather than a width dimension at the tip.
Has a larger taper shape and
The outer dimension of the protrusion at the root is the inner diameter of the hole.
A circuit board characterized in that it is made larger than the conventional method and the hole and the projection are fitted and integrated. 2. A metal plate punched required wiring circuit and circular <br/> cylindrical metal plate provided with a protrusion, the required wiring circuit and cross-sectional shape is substantially V-shaped by punching a metal plate Forming a bulge
Intervening between the metal plate provided with the protrusion and the both metal plates
An insulating substrate is provided, and the bulging portion is located at the base of the width dimension of the tip.
The width of the taper is larger and the expansion
The external dimensions of the protrusion at the base of the protrusion
A circuit board, characterized in that it is made larger than the inner diameter of the portion, and the protrusion and the protrusion are fitted and integrated. Wherein at least one of the surfaces of the metal plate, the circuit board according to claim 1 or 2, characterized in that embedded in the insulating substrate so that the surface and substantially the same plane of the insulating substrate.