JP3317855B2

JP3317855B2 - Cleaning equipment

Info

Publication number: JP3317855B2
Application number: JP23190096A
Authority: JP
Inventors: 昭米水; 裕幸工藤; 正巳飽本
Original assignee: Tokyo Electron Ltd
Current assignee: Tokyo Electron Ltd
Priority date: 1996-09-02
Filing date: 1996-09-02
Publication date: 2002-08-26
Anticipated expiration: 2016-09-02
Also published as: JPH1074725A

Description

DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、例えば半導体ウエ
ハを洗浄するウエハ洗浄装置等の洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus such as a wafer cleaning apparatus for cleaning a semiconductor wafer.

【０００２】[0002]

【従来の技術】半導体製造プロセスにおいては、半導体
ウエハ（以下、単にウエハと呼ぶ。）の洗浄、例えば微
粒子除去や金属汚染除去、酸化膜除去等を行うことが要
求される。微粒子除去の洗浄プロセスにおいては、ＮＨ
₄／Ｈ₂Ｏ₂／Ｈ₂Ｏ混合液（以下、ＡＰＭと称す
る。）を使用した液相洗浄が一般的であり、金属汚染除
去の洗浄プロセスにおいては、ＨＣｌ／Ｈ₂Ｏ₂／Ｈ₂
Ｏ混合液（以下、ＨＰＭと称する。）を使用した液相洗
浄が一般的であり、また酸化膜除去の洗浄プロセスにお
いては、ＨＦ／Ｈ₂Ｏ混合液（以下、ＤＨＭと称す
る。）を使用した液相洗浄が一般的である。2. Description of the Related Art In a semiconductor manufacturing process, it is required to clean a semiconductor wafer (hereinafter simply referred to as a wafer), for example, to remove fine particles, remove metal contamination, remove an oxide film, and the like. In the cleaning process for removing fine particles, NH
Liquid phase cleaning using a ₄ / H ₂ O ₂ / H ₂ O mixture (hereinafter referred to as APM) is common. In a cleaning process for removing metal contamination, HCl / H ₂ O ₂ / H _{2 is used.}
Liquid phase cleaning using an O mixed solution (hereinafter referred to as HPM) is common, and in a cleaning process for removing an oxide film, an HF / H ₂ O mixed solution (hereinafter referred to as DHM) is used. Liquid phase washing is common.

【０００３】近年、ウエハの大口径化に伴い、各処理プ
ロセスの枚葉処理化が進む中で、このような洗浄プロセ
スにおいても枚葉処理化が進められている。枚葉処理化
したウエハ洗浄装置として、例えばＡＰＭ洗浄を行うＡ
ＰＭユニットとＨＰＭ洗浄を行うＨＰＭユニットとＤＨ
Ｍ洗浄を行うＤＨＭユニットとをウエハを搬送するウエ
ハ搬送路に沿って配置し、これらユニット間でウエハの
受け渡しを行うウエハ搬送体を上記のウエハ搬送路上を
移動可能に配置して構成した装置がある。In recent years, with the increase in the diameter of wafers, single-wafer processing in each processing process has been progressing. In such a cleaning process, single-wafer processing has been promoted. As a single wafer processing wafer cleaning apparatus, for example, A for performing APM cleaning
PM unit and HPM unit and DH for HPM cleaning
A DHM unit for performing M cleaning is arranged along a wafer transfer path for transferring a wafer, and a wafer transfer body for transferring a wafer between these units is arranged so as to be movable on the wafer transfer path. is there.

【０００４】このようなウエハ洗浄装置では、ユニット
内に１枚のウエハを搬入し、ＡＰＭ、ＨＰＭ、ＤＨＭ等
の洗浄液を使ってウエハを洗浄した後に濯ぎ液、例えば
純水（ＤＩＷ：deionized water ）を使って洗浄するこ
とが行われる。かかる使用後の洗浄液や濯ぎ液等につい
ては、廃棄するのが一般的である。In such a wafer cleaning apparatus, one wafer is carried into the unit, and the wafer is cleaned using a cleaning liquid such as APM, HPM, DHM, etc., and then rinsed, for example, DIW (deionized water). Washing is performed using. It is common to discard such washing liquids and rinsing liquids after use.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、このよ
うな洗浄液及び濯ぎ液のうち、特に洗浄液は非常に高価
であり、しかも上記の如く枚葉処理化した場合にはこう
した洗浄液を大量に消費することとなるため、ランニン
グコストが非常に高価になるという問題がある。また、
このような枚葉式の洗浄装置では、上記洗浄液を貯蔵す
るための洗浄液槽が大型化し、スペースコストが増大す
るという問題もある。However, among such cleaning liquids and rinsing liquids, particularly, the cleaning liquid is very expensive, and in the case of single-wafer processing as described above, a large amount of such a cleaning liquid is consumed. Therefore, there is a problem that the running cost becomes very expensive. Also,
In such a single-wafer cleaning apparatus, there is also a problem that a cleaning liquid tank for storing the above-mentioned cleaning liquid becomes large and space cost increases.

【０００６】本発明は、かかる課題に対処したもので、
洗浄に使用する洗浄液の消費量を減らし、ランニングコ
スト及びスペースコストを低減することができる洗浄装
置を提供することを目的としている。[0006] The present invention addresses such a problem.
An object of the present invention is to provide a cleaning apparatus capable of reducing the consumption of a cleaning liquid used for cleaning and reducing running costs and space costs.

【０００７】また、本発明は、洗浄液の回収及び再利用
を簡単な構成で行うことができる洗浄装置を提供するこ
とを目的としている。Another object of the present invention is to provide a cleaning apparatus capable of recovering and reusing a cleaning liquid with a simple configuration.

【０００８】本発明のさらなる目的は、洗浄時間を短縮
してスループットを向上することができる洗浄装置を提
供することにある。A further object of the present invention is to provide a cleaning apparatus capable of shortening the cleaning time and improving the throughput.

【０００９】本発明のさらなる目的は、被処理基板に対
して洗浄液による悪影響を与えることのない洗浄装置を
提供することにある。Another object of the present invention is to provide a cleaning apparatus which does not adversely affect a substrate to be processed by a cleaning liquid.

【００１０】本発明のさらなる目的は、洗浄液の回収及
び再利用をより効率よく行うことができる洗浄装置を提
供することにある。A further object of the present invention is to provide a cleaning apparatus capable of recovering and reusing a cleaning solution more efficiently.

【００１１】また、本発明の別の目的は、洗浄処理をよ
り良好に行うことができる洗浄装置を提供することにあ
る。具体的には、例えば被処理基板に対して洗浄液によ
る悪影響を与えたり、ウォーターマーク等が付着するこ
とがない洗浄装置を提供することにある。Another object of the present invention is to provide a cleaning apparatus capable of performing a cleaning process more favorably. Specifically, it is an object of the present invention to provide a cleaning apparatus that does not adversely affect a substrate to be processed by a cleaning liquid or adheres a watermark or the like.

【００１２】本発明のさらなる目的は、洗浄に使用する
洗浄液の消費量をさらに減らすことができる洗浄装置を
提供することにあり、さらにかかる洗浄液消費量の減少
をより簡単な構造でさらには装置の大型化を招来させる
ことなく実現できる洗浄装置を提供することにある。It is a further object of the present invention to provide a cleaning apparatus capable of further reducing the consumption of the cleaning liquid used for cleaning, and to further reduce the consumption of the cleaning liquid with a simpler structure and further reducing the consumption of the cleaning liquid. An object of the present invention is to provide a cleaning device that can be realized without increasing the size.

【００１３】[0013]

【課題を解決するための手段】上記課題を解決するた
め、請求項１記載の本発明に係る洗浄装置は、被処理基
板を洗浄液及び濯ぎ液を使って洗浄する洗浄手段と、前
記洗浄手段で使った洗浄液を洗浄液槽へ回収し、洗浄液
循環用のポンプと洗浄液ろ過用のフィルタを介して前記
洗浄手段に供給して再使用可能、かつ、前記洗浄液槽内
の洗浄液を、前記洗浄手段に供給することなく前記洗浄
液循環用のポンプと前記洗浄液ろ過用のフィルタを介し
て再び当該洗浄液槽内へ循環することにより前記洗浄液
槽内の洗浄液の混合が可能とされた循環系と、前記洗浄
液槽に接続されたＮＨ ₄ ＯＨを補充するためのタンク及
びＨ ₂ Ｏ ₂ を補充するためのタンクと、前記洗浄液槽に
接続された純水供給口と、前記ＮＨ ₄ ＯＨを補充するた
めのタンク及びＨ ₂ Ｏ ₂ を補充するためのタンクから前
記洗浄液槽への洗浄液の補充を行う手段と、前記洗浄液
槽内の洗浄液量を検出し、前記洗浄液の補充を行う手段
による洗浄液の補充制御に使われるセンサと、前記洗浄
手段で使った濯ぎ液を排出する排出系とを具備する。According to a first aspect of the present invention, there is provided a cleaning apparatus for cleaning a substrate to be processed using a cleaning liquid and a rinsing liquid. The used cleaning liquid is collected in the cleaning liquid tank, supplied to the cleaning means via a pump for circulating the cleaning liquid and a filter for filtering the cleaning liquid, and can be reused, and the cleaning liquid in the cleaning liquid tank is supplied to the cleaning means. the cleaning solution by re-circulating to the cleaning liquid tank through without pump and filter for the cleaning liquid filtered for the washing liquid circulation to
A circulation system for mixing is possible of the cleaning liquid in the tank, the washing
A tank and a tank for replenishing NH ₄ OH connected to the liquid tank
And a tank for replenishing H ₂ O ₂ and the cleaning solution tank.
The connected pure water supply port and the NH ₄ OH were replenished.
Means for performing a replenishment of the cleaning liquid to the front <br/> Symbol cleaning solution tank from the tank to replenish the fit of the tank and H ₂ O _2, to detect the cleaning liquid of the cleaning liquid <br/> tank, A sensor used for controlling the replenishment of the cleaning liquid by the means for replenishing the cleaning liquid; and a discharge system for discharging the rinse liquid used in the cleaning means.

【００１４】本発明では、洗浄処理で使った洗浄液を循
環させて再使用するように構成しているので、洗浄に使
用する洗浄液の消費量を減らし、ランニングコスト及び
スペースコストを低減することができる。In the present invention, since the cleaning liquid used in the cleaning process is circulated and reused, the consumption of the cleaning liquid used for cleaning can be reduced, and the running cost and space cost can be reduced. .

【００１５】請求項２記載の本発明に係る洗浄装置は、
被処理基板の出し入れが可能な開口部を有し、内カップ
の開口部の高さが外カップの開口部の高さよりも低い内
外２重のカップ構造の収容部と、前記収容部内で被処理
基板を保持して回転し、かつ前記内外カップ間を移送す
る回転移送部と、前記内外カップ内でそれぞれ前記回転
移送部により回転される被処理基板に対し、それぞれ洗
浄液及び濯ぎ液のうち一方を噴出する噴出部と、前記内
外カップのうち一方で回収された洗浄液を洗浄液槽へ回
収し、洗浄液循環用のポンプと洗浄液ろ過用のフィルタ
を介して前記噴出部に供給して再使用可能、かつ、前記
洗浄液槽内の洗浄液を、前記噴出部に供給することなく
前記洗浄液循環用のポンプと前記洗浄液ろ過用のフィル
タを介して再び当該洗浄液槽内へ循環することにより前
記洗浄液槽内の洗浄液の混合が可能とされた循環系と、
前記洗浄液槽に接続されたＮＨ ₄ ＯＨを補充するための
タンク及びＨ ₂ Ｏ ₂ を補充するためのタンクと、前記洗
浄液槽に接続された純水供給口と、前記ＮＨ ₄ ＯＨを補
充するためのタンク及びＨ ₂ Ｏ ₂ を補充するためのタン
クから前記洗浄液槽への洗浄液の補充を行う手段と、前
記洗浄液槽内の洗浄液量を検出し、前記洗浄液の補充を
行う手段による洗浄液の補充制御に使われるセンサと、
前記内外カップのうち他方で回収された濯ぎ液を排出す
る排出系とを具備する。The cleaning device according to the present invention according to claim 2 is
A housing having an inner / outer double cup structure having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is lower than the height of the opening of the outer cup; A rotary transfer unit that rotates while holding the substrate, and transfers between the inner and outer cups, and for the substrates to be processed that are rotated by the rotary transfer unit in the inner and outer cups, respectively, one of a cleaning liquid and a rinsing liquid. A jetting part to be spouted, and the cleaning liquid collected on one of the inner and outer cups is collected in a cleaning liquid tank, supplied to the jetting part via a cleaning liquid circulation pump and a cleaning liquid filtration filter, and can be reused, and before by circulating washing liquid in the washing liquid tank, to the said pump for the washing liquid circulation without supplying the ejection portion through the filter for the cleaning liquid filtered again the washing liquid tank
A circulation system capable of mixing the cleaning liquid in the cleaning liquid tank ,
For replenishing NH ₄ OH connected to the cleaning solution tank
A tank and a tank for replenishing H ₂ O ₂ ,
The pure water supply port connected to the purification tank and the NH ₄ OH
Tank for filling and tank for replenishing H ₂ O ₂
Means for performing a replenishment of the cleaning liquid from click to the washing liquid tank, a sensor used for replenishing operation of the cleaning liquid by means for detecting the washing liquid amount of the cleaning liquid in the tank, performs replenishment of the cleaning solution,
A discharge system for discharging the rinse liquid collected by the other of the inner and outer cups.

【００１６】本発明では、内カップに移送された被処理
基板に対して噴出された液は内カップで回収され、外カ
ップすなわち外カップと内カップの開口部間に移送され
た被処理基板に対して噴出された液は遠心力により開口
部間に飛翔して外カップで回収され、内外カップのうち
一方で回収された洗浄液を循環させて再使用するように
構成しているので、洗浄液の回収及び再利用を簡単な構
成で行うことができる。請求項３記載の本発明に係る洗
浄装置は、被処理基板の出し入れが可能な開口部を有
し、内カップの開口部の高さが外カップの開口部の高さ
よりも低い内外２重のカップ構造の収容部と、前記収容
部内で被処理基板を保持して回転し、かつ前記内外カッ
プ間を移送する回転移送部と、前記内外カップ内でそれ
ぞれ前記回転移送部により回転される被処理基板の表裏
両面に対し、それぞれ洗浄液及び濯ぎ液のうち一方を噴
出する噴出部と、前記内外カップのうち一方で回収され
た洗浄液を洗浄液槽へ回収し、洗浄液循環用のポンプと
洗浄液ろ過用のフィルタを介して前記噴出部に供給して
再使用可能、かつ、前記洗浄液槽内の洗浄液を、前記噴
出部に供給することなく前記洗浄液循環用のポンプと前
記洗浄液ろ過用のフィルタを介して再び当該洗浄液槽内
へ循環することにより前記洗浄液槽内の洗浄液の混合が
可能とされた循環系と、前記洗浄液槽に接続されたＮＨ
₄ ＯＨを補充するためのタンク及びＨ ₂ Ｏ ₂ を補充する
ためのタンクと、前記洗浄液槽に接続された純水供給口
と、前記ＮＨ ₄ ＯＨを補充するためのタンク及びＨ ₂ Ｏ
₂ を補充するためのタンクから前記洗浄液槽への洗浄液
の補充を行う手段と、前記洗浄液槽内の洗浄液量を検出
し、前記洗浄液の補充を行う手段による洗浄液の補充制
御に使われるセンサと、前記内外カップのうち他方で回
収された濯ぎ液を排出する排出系とを具備する。In the present invention, the liquid ejected to the substrate to be transferred transferred to the inner cup is collected by the inner cup and is transferred to the outer cup, that is, the substrate transferred between the openings of the outer cup and the inner cup. On the other hand, the ejected liquid flies between the openings by centrifugal force and is collected by the outer cup, and the cleaning liquid collected on one of the inner and outer cups is circulated and reused. Collection and reuse can be performed with a simple configuration. According to a third aspect of the present invention, there is provided the cleaning apparatus having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is lower than the height of the opening of the outer cup. An accommodating section having a cup structure, a rotating transfer section that holds and rotates the substrate to be processed in the accommodating section, and transfers between the inner and outer cups; A spouting part for spouting one of the cleaning liquid and the rinsing liquid on both the front and back surfaces of the substrate, and the cleaning liquid collected on one of the inner and outer cups is collected in a cleaning liquid tank, and a pump for cleaning liquid circulation and a cleaning liquid The cleaning liquid in the cleaning liquid tank can be reused by being supplied to the ejection part via a filter, and the cleaning liquid in the cleaning liquid tank is supplied again through the cleaning liquid circulation pump and the cleaning liquid filtration filter without supplying the cleaning liquid to the ejection part. The A circulation system for mixing of the cleaning liquid in the cleaning liquid tank is capable <br/> by circulating the purification liquid tank, NH connected to the cleaning solution tank
Refilling tank and H ₂ O ₂ for replenishing ₄ OH
Tank and a pure water supply port connected to the washing liquid tank
And a tank for replenishing the NH ₄ OH and H ₂ O
Means for performing a replenishment of the cleaning liquid from the tank for replenishing to the washing liquid tank ₂ to detect the cleaning liquid of the cleaning liquid in the tank, the sensor used for replenishing operation of the cleaning liquid by means for performing replenishment of the cleaning solution And a discharge system for discharging the rinsing liquid collected by the other of the inner and outer cups.

【００１７】本発明では、特に被処理基板の表裏両面に
対して洗浄液及び濯ぎ液を噴出させて洗浄を行うように
構成しているので、洗浄時間を短縮してスループットを
向上することができる。In the present invention, since the cleaning liquid and the rinsing liquid are jetted onto both the front and back surfaces of the substrate to be cleaned, the cleaning time can be shortened and the throughput can be improved.

【００１８】請求項４記載の本発明に係る洗浄装置は、
被処理基板の出し入れが可能な開口部を有し、内カップ
の開口部の高さが外カップの開口部の高さよりも低い内
外２重のカップ構造の収容部と、前記収容部内で被処理
基板を保持して回転し、かつ前記内外カップ間を移送す
る回転移送部と、前記内カップ内で前記回転移送部によ
り回転される被処理基板の表裏両面に対して洗浄液を噴
出し、前記外カップ内で前記回転移送部により回転され
る被処理基板の表裏両面に対して濯ぎ液を噴出する噴出
部と、前記内カップで回収された洗浄液を洗浄液槽へ回
収し、洗浄液循環用のポンプと洗浄液ろ過用のフィルタ
を介して前記噴出部に供給して再使用可能、かつ、前記
洗浄液槽内の洗浄液を、前記噴出部に供給することなく
前記洗浄液循環用のポンプと前記洗浄液ろ過用のフィル
タを介して再び当該洗浄槽内へ循環することにより前記
洗浄液槽内の洗浄液の混合が可能とされた循環系と、前
記洗浄液槽に接続されたＮＨ ₄ ＯＨを補充するためのタ
ンク及びＨ ₂ Ｏ ₂ を補充するためのタンクと、前記洗浄
液槽に接続された純水供給口と、前記ＮＨ ₄ ＯＨを補充
するためのタンク及びＨ ₂ Ｏ ₂ を補充するためのタンク
から前記洗浄液槽への洗浄液の補充を行う手段と、前記
洗浄液槽内の洗浄液量を検出し、前記洗浄液の補充を行
う手段による洗浄液の補充制御に使われるセンサと、前
記外カップで回収された濯ぎ液を排出する排出系とを具
備する。The cleaning device according to the present invention according to claim 4 is
A housing having an inner / outer double cup structure having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is lower than the height of the opening of the outer cup; A rotary transfer unit that rotates while holding the substrate, and transfers between the inner and outer cups, and jets a cleaning liquid onto both front and back surfaces of the substrate to be processed that is rotated by the rotary transfer unit in the inner cup; A spouting unit for spouting a rinsing liquid onto both front and back surfaces of the substrate to be processed rotated by the rotary transfer unit in the cup; The cleaning liquid circulation pump and the cleaning liquid filtration filter can be supplied to the ejection section via a cleaning liquid filtration filter and reused, and the cleaning liquid in the cleaning liquid tank is not supplied to the ejection section. Again through Wherein by circulating the cleaning tank
A circulation system for mixing is possible of the cleaning liquid in the cleaning liquid tank, before
A tank for replenishing NH ₄ OH connected to the cleaning liquid tank .
Tank for replenishing ink and H ₂ O ₂ , and said cleaning
Replenish the pure water supply port connected to the liquid tank and the NH ₄ OH
Tank and tank for replenishing H ₂ O ₂
A sensor wherein the means for performing the replenishment of the cleaning liquid to the cleaning liquid tank, to detect the cleaning liquid of the <br/> cleaning liquid tank, used to supplement the control of the cleaning liquid by means for performing replenishment of the cleaning solution from the A discharge system for discharging the rinse liquid collected by the outer cup.

【００１９】本発明では、特に内カップ内で洗浄液を噴
出し、外カップ内で濯ぎ液を噴出するように構成したの
で、洗浄液に伴う雰囲気が濯ぎ液によって洗浄された被
処理基板に及ぶようなことはなくなり、被処理基板に対
して洗浄液による悪影響を与えることがなくなる。In the present invention, since the cleaning liquid is spouted in the inner cup and the rinsing liquid is spouted in the outer cup, the atmosphere accompanying the cleaning liquid extends to the substrate to be processed cleaned by the rinsing liquid. The cleaning liquid does not adversely affect the substrate to be processed.

【００２０】請求項５記載の本発明に係る洗浄装置は、
被処理基板の出し入れが可能な開口部を有し、内カップ
の開口部の高さが外カップの開口部の高さよりも低い内
外２重のカップ構造の収容部と、前記収容部内で被処理
基板を保持して回転し、かつ前記内外カップ間を移送す
る回転移送部と、前記外カップ内で前記回転移送部によ
り回転される被処理基板の表裏両面に対して洗浄液を噴
出し、前記内カップ内で前記回転移送部により回転され
る被処理基板の表裏両面に対して濯ぎ液を噴出する噴出
部と、前記外カップで回収された洗浄液を洗浄液槽へ回
収し、洗浄液循環用のポンプと洗浄液ろ過用のフィルタ
を介して前記噴出部に供給して再使用可能、かつ、前記
洗浄液槽内の洗浄液を、前記噴出部に供給することなく
前記洗浄液循環用のポンプと前記洗浄液ろ過用のフィル
タを介して再び当該洗浄槽内へ循環することにより前記
洗浄液槽内の洗浄液の混合が可能とされた循環系と、前
記洗浄液槽に接続されたＮＨ4 ＯＨを補充するためのタ
ンク及びＨ2 Ｏ2 を補充するためのタンクと、前記洗浄
液槽に接続された純水供給口と、前記ＮＨ4 ＯＨを補充
するタンク及びＨ2 Ｏ2 を補充するタンクから前記洗浄
液槽への洗浄液の補充を行う手段と、前記洗浄液槽内の
洗浄液量を検出し、前記洗浄液の補充を行う手段による
洗浄液の補充制御に使われるセンサと、前記内カップで
回収された濯ぎ液を排出する排出系とを具備する。The cleaning device according to the present invention described in claim 5 is:
A housing having an inner / outer double cup structure having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is lower than the height of the opening of the outer cup; A rotary transfer unit that holds and rotates the substrate, and transfers between the inner and outer cups; and a cleaning liquid that is ejected to both front and back surfaces of the substrate to be processed that is rotated by the rotary transfer unit in the outer cup. A spouting section for spouting a rinsing liquid onto both front and back surfaces of the substrate to be processed rotated by the rotary transfer section in the cup, and a cleaning liquid tank for collecting the cleaning liquid collected in the outer cup into a cleaning liquid tank, and a pump for circulating the cleaning liquid. The cleaning liquid circulation pump and the cleaning liquid filtration filter can be supplied to the ejection section via a cleaning liquid filtration filter and reused, and the cleaning liquid in the cleaning liquid tank is not supplied to the ejection section. Again through Wherein by circulating the cleaning tank
A circulation system for mixing is possible of the cleaning liquid in the cleaning liquid tank, before
A tank for replenishing NH4 OH connected to the cleaning liquid tank.
Tank for replenishing ink and H2 O2;
Replenish the pure water supply port connected to the liquid tank and the NH4 OH
From the tank to be replenished and the tank to replenish H2 O2
Means for performing a replenishment of the cleaning liquid into the liquid tank, to detect the cleaning liquid of the cleaning liquid in the tank, a sensor used for replenishing operation of the cleaning liquid by means for performing replenishment of the cleaning solution, the recovered rinsing in said cup A discharge system for discharging the liquid.

【００２１】本発明では、特に内カップ内で濯ぎ液を噴
出し、外カップ内で洗浄液を噴出するように構成したの
で、洗浄液をより効率よく回収することができる。In the present invention, since the rinsing liquid is spouted particularly in the inner cup and the cleaning liquid is spouted in the outer cup, the cleaning liquid can be recovered more efficiently.

【００２２】請求項６記載の本発明に係る洗浄装置は、
被処理基板に対して同一の噴出ノズルを使って洗浄液及
び濯ぎ液を交互に噴出する噴出部と、前記噴出部が被処
理基板に対して洗浄液を噴出する前に予め所定期間前記
噴出ノズルより洗浄液を排出させ、前記噴出部が被処理
基板に対して濯ぎ液を噴出する前に予め所定期間前記噴
出ノズルより濯ぎ液を排出させる手段とを具備する。The cleaning device according to the present invention described in claim 6 is:
And ejection part for ejecting a cleaning liquid and rinsing liquid are alternately using the same spray nozzle relative to the substrate to be processed, from the previously predetermined time period the ejection nozzle before the ejection portion for ejecting a cleaning liquid onto the substrate to be processed the washing liquid is discharged, the ejection part is treated
Before spraying the rinsing liquid onto the substrate,
Exits and means for Ru was drained rinsing liquid from the nozzle.

【００２３】本発明では、噴出部が被処理基板に対して
洗浄液及び濯ぎ液を噴出する前に予め所定期間噴出ノズ
ルより洗浄液及び濯ぎ液を排出させるように構成してい
るので、被処理基板に対して洗浄液を噴出しようとする
場合に噴出ノズルに残っていた濯ぎ液が被処理基板に対
して噴出されることがなくなり、また被処理基板に対し
て濯ぎ液を噴出しようとする場合に噴出ノズルに残って
いた洗浄液が被処理基板に対して噴出されることがなく
なる。従って、被処理基板に対して洗浄液による悪影響
を与えたり、ウォーターマーク等が付着することがなく
なり、洗浄処理をより良好に行うことができるようにな
る。In the present invention, the cleaning liquid and the rinsing liquid are discharged from the jet nozzle for a predetermined period before the jetting section jets the cleaning liquid and the rinsing liquid to the substrate to be processed. On the other hand, when the cleaning liquid is to be ejected, the rinsing liquid remaining at the ejection nozzle is not ejected to the substrate to be processed, and when the rinsing liquid is ejected to the substrate to be treated, the ejection nozzle is not ejected. The cleaning liquid remaining on the substrate to be processed is not spouted. Accordingly, the cleaning liquid does not adversely affect the substrate to be processed or adheres a watermark or the like, and the cleaning process can be performed more favorably.

【００２４】請求項７記載の本発明に係る洗浄装置は、
被処理基板に対して同一の噴出ノズルを使って洗浄液及
び濯ぎ液を交互に噴出する噴出部と、前記噴出部が被処
理基板に対して洗浄液を噴出する前に予め所定期間前記
噴出ノズルより洗浄液を排出させ、前記噴出部が被処理
基板に対して濯ぎ液を噴出する前に予め所定期間前記噴
出ノズルより濯ぎ液を排出させる手段と、前記噴出ノズ
ルより排出された洗浄液及び濯ぎ液のうち洗浄液につい
ては回収して循環させて前記噴出部で再使用させる循環
系とを具備する。According to a seventh aspect of the present invention, there is provided a cleaning apparatus comprising:
And ejection part for ejecting a cleaning liquid and rinsing liquid are alternately using the same spray nozzle relative to the substrate to be processed, from the previously predetermined time period the ejection nozzle before the ejection portion for ejecting a cleaning liquid onto the substrate to be processed the washing liquid is discharged, the ejection part is treated
Before spraying the rinsing liquid onto the substrate,
Means for Ru was drained rinsing liquid from the nozzle exit, the cleaning liquid of the cleaning liquid and the rinsing liquid discharged from the ejection nozzle is provided with a circulation system for re-use in the jet section is circulated and recovered.

【００２５】本発明では、特に噴出ノズルより排出され
た洗浄液及び濯ぎ液のうち洗浄液については回収して循
環させるように構成したので、洗浄液の消費量をさらに
減らすことができる。According to the present invention, since the cleaning liquid is recovered and circulated among the cleaning liquid and the rinsing liquid discharged from the ejection nozzle, the consumption of the cleaning liquid can be further reduced.

【００２６】請求項８記載の本発明に係る洗浄装置は、
被処理基板に対して同一の噴出ノズルを使って洗浄液及
び濯ぎ液を交互に噴出する噴出部と、前記噴出ノズルよ
り噴出された洗浄液を回収する洗浄液回収部と、前記噴
出ノズルより噴出された濯ぎ液を回収する濯ぎ液回収部
と、前記噴出部が被処理基板に対して洗浄液を噴出する
前に予め所定期間前記噴出ノズルより前記洗浄液回収部
に洗浄液を排出させ、前記噴出部が被処理基板に対して
濯ぎ液を噴出する前に予め所定期間前記噴出ノズルより
前記洗浄液回収部に洗浄液を排出させる手段と、前記洗
浄液回収部により回収された洗浄液を循環させて前記噴
出部で再使用させる循環系とを具備する。本発明で
は、特に噴出ノズルより噴出された洗浄液を回収する洗
浄液回収部と噴出ノズルより噴出された濯ぎ液を回収す
る濯ぎ液回収部とを区別して構成したので、洗浄液の回
収を容易に行うことができる。The cleaning device according to the present invention described in claim 8 is
An ejection section for alternately ejecting a cleaning liquid and a rinsing liquid using the same ejection nozzle on the substrate to be processed, a cleaning liquid recovery section for collecting the cleaning liquid ejected from the ejection nozzle, and a rinse ejected from the ejection nozzle A rinsing liquid collecting unit for collecting a liquid, and a cleaning liquid is discharged from the jet nozzle to the cleaning liquid collecting unit in advance for a predetermined period before the jetting unit jets the cleaning liquid to the substrate to be processed. Means for discharging the washing liquid from the ejection nozzle to the washing liquid collecting section for a predetermined period before ejecting the rinsing liquid to the washing liquid; and circulating the washing liquid collected by the washing liquid collecting section to reuse the washing liquid in the ejecting section. System. In the present invention, in particular, the cleaning liquid collecting section for collecting the cleaning liquid ejected from the ejection nozzle and the rinsing liquid collecting section for collecting the rinsing liquid ejected from the ejection nozzle are separately configured, so that the washing liquid can be easily collected. Can be.

【００２７】請求項９記載の本発明に係る洗浄装置は、
被処理基板に対して同一の噴出ノズルを使って洗浄液及
び濯ぎ液を交互に噴出する噴出部と、前記噴出部に隣接
して設けられ、前記噴出ノズルより噴出された洗浄液を
回収する洗浄液回収部と、前記噴出部に隣接して設けら
れ、前記噴出ノズルより噴出された濯ぎ液を回収する濯
ぎ液回収部と、前記噴出ノズルを前記噴出部と前記洗浄
液回収部と前記濯ぎ液回収部との間を移動させるノズル
移動手段と、前記噴出部が被処理基板に対して洗浄液を
噴出する前に前記ノズル移動手段により前記噴出ノズル
を前記洗浄液回収部へ移動させて予め所定期間噴出ノズ
ルより洗浄液回収部に洗浄液を排出させ、前記噴出部が
被処理基板に対して濯ぎ液を噴出する前に前記ノズル移
動手段により前記噴出ノズルを前記濯ぎ液回収部へ移動
させて予め所定期間噴出ノズルより洗浄液回収部に洗浄
液を排出させる手段と、前記洗浄液回収部により回収さ
れた洗浄液を循環させて前記噴出部で再使用させる循環
系とを具備する。According to a ninth aspect of the present invention, there is provided a cleaning apparatus comprising:
An ejection section for alternately ejecting a cleaning liquid and a rinsing liquid using the same ejection nozzle on the substrate to be processed; and a cleaning liquid collection section provided adjacent to the ejection section and for collecting the cleaning liquid ejected from the ejection nozzle. A rinsing liquid recovery unit provided adjacent to the ejection unit and collecting the rinsing liquid ejected from the ejection nozzle; and a rinsing liquid collection unit for connecting the ejection nozzle to the ejection unit, the cleaning liquid collection unit, and the rinsing liquid collection unit. A nozzle moving means for moving between the nozzles; and a cleaning liquid recovery means for moving the jet nozzle to the cleaning liquid collecting part by the nozzle moving means before the jetting part jets the cleaning liquid to the substrate to be processed for a predetermined period of time. The cleaning liquid is discharged to the section, and before the jetting section jets the rinsing liquid to the substrate to be processed, the jet nozzle is moved to the rinsing liquid collecting section by the nozzle moving means, and a predetermined period is set. Comprising means for discharging the cleaning liquid to the cleaning liquid recovery section than jet nozzle, and a circulation system for re-use in the ejection part by circulating the recovered cleaning liquid by the cleaning liquid recovery section.

【００２８】本発明では、特に洗浄液回収部及び濯ぎ液
回収部を噴出部に隣接して設け、洗浄液の排出が必要な
場合には噴出ノズルを洗浄液回収部及び濯ぎ液回収部に
移送するように構成したので、洗浄液消費量の減少をよ
り簡単な構造でさらには装置の大型化を招来させること
なく実現できる。In the present invention, the cleaning liquid recovery section and the rinsing liquid recovery section are particularly provided adjacent to the ejection section, and when the cleaning liquid needs to be discharged, the ejection nozzle is transferred to the cleaning liquid recovery section and the rinsing liquid recovery section. With this configuration, it is possible to reduce the consumption of the cleaning liquid with a simpler structure and without increasing the size of the apparatus.

【００２９】請求項１０記載の本発明に係る洗浄装置
は、被処理基板に対して同一の噴出ノズルを使って洗浄
液及び濯ぎ液を交互に噴出する噴出部と、前記噴出部に
隣接して設けられ、前記噴出ノズルより噴出された洗浄
液及び濯ぎ液のうち一方を回収する内カップと他方を回
収する外カップとを有する内外２重のカップ構造の回収
部と、前記噴出ノズルを前記噴出部と前記回収部との間
を移動させるノズル移動手段と、前記噴出部が被処理基
板に対して洗浄液を噴出する前に前記ノズル移動手段に
より前記噴出ノズルを前記一方のカップへ移動させて予
め所定期間噴出ノズルより洗浄液を排出させ、前記噴出
部が被処理基板に対して濯ぎ液を噴出する前に前記ノズ
ル移動手段により前記噴出ノズルを前記他方のカップへ
移動させて予め所定期間噴出ノズルより洗浄液を排出さ
せる手段と、前記回収部により回収された洗浄液のうち
洗浄液については循環させて前記噴出部で再使用させる
循環系とを具備する。According to a tenth aspect of the present invention, there is provided a cleaning apparatus comprising: an ejection section for alternately ejecting a cleaning liquid and a rinsing liquid to a substrate to be processed by using the same ejection nozzle; and a cleaning apparatus provided adjacent to the ejection section. A collection section having an inner and outer double cup structure having an inner cup for collecting one of the cleaning liquid and the rinsing liquid ejected from the ejection nozzle, and an outer cup for collecting the other, and the ejection nozzle having the ejection section. A nozzle moving means for moving between the collecting section and the ejecting section, the ejecting nozzle being moved to the one of the cups by the nozzle moving means before the ejecting section ejects the cleaning liquid to the substrate to be processed, for a predetermined period of time. The cleaning liquid is discharged from the ejection nozzle, and the ejection nozzle is moved to the other cup by the nozzle moving means before the ejection section ejects the rinsing liquid to the substrate to be processed. Means for discharging the cleaning liquid from between the ejection nozzle, the cleaning liquid of the cleaning liquid recovered by the recovery unit is provided with a circulation system for re-use in the ejection part is circulated.

【００３０】本発明では、特に回収部を噴出ノズルより
噴出された洗浄液及び濯ぎ液のうち一方を回収する内カ
ップと他方を回収する外カップとを有する内外２重のカ
ップ構造としたので、装置のさらなる小型化を図ること
ができる。請求項１１記載の本発明に係る洗浄装置は、
請求項１〜５いずれか一項記載の洗浄装置において、前
記洗浄手段に設けられた噴出ノズルから被処理基板に対
して洗浄液を噴出する前に、予め所定期間前記噴出ノズ
ルから洗浄液を噴出させるための洗浄液回収部が設けら
れ、当該洗浄液回収部で回収された洗浄液は前記洗浄液
槽へ回収されるよう構成されたことを特徴とする。In the present invention, in particular, since the collecting section has an inner / outer double cup structure having an inner cup for collecting one of the washing liquid and the rinsing liquid ejected from the ejection nozzle and an outer cup for collecting the other, Can be further reduced in size. The cleaning device according to the present invention described in claim 11 is
Jetting apparatus for cleaning 請 Motomeko 1-5 have shifted or one claim, before jetting a cleaning liquid against the target substrate from the spray nozzles provided in the cleaning unit, the cleaning liquid from the previously predetermined time period the jet nozzle A cleaning liquid collecting section for causing the cleaning liquid to be collected in the cleaning liquid tank.

【００３１】[0031]

【発明の実施の形態】以下、本発明の実施形態を図に基
づいて説明すれば、図１〜図３は、各々本発明の実施形
態が採用された半導体ウエハ（以下、「ウエハ」とい
う）のウエハ洗浄装置１の全体構成の図であって、図１
は平面、図２は正面、図３は背面を夫々示している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIGS. 1 to 3 show a semiconductor wafer (hereinafter, referred to as a "wafer") to which an embodiment of the present invention is applied. 1 is a diagram of the overall configuration of a wafer cleaning apparatus 1 of FIG.
2 shows a plane, FIG. 2 shows a front, and FIG. 3 shows a back.

【００３２】このウエハ洗浄装置１は、被処理基板とし
てウエハＷをウエハカセットＣＲで複数枚、例えば２５
枚単位で外部からシステムに搬入したり、あるいはシス
テムから搬出したり、ウエハカセットＣＲに対してウエ
ハＷを搬入・搬出したりするためのカセットステーショ
ン１０と、１枚ずつウエハＷに所定の洗浄処理を施す枚
葉式の各種洗浄処理ユニットを所定位置に配置してなる
洗浄処理ステーション１１とを一体に接続した構成を有
している。In the wafer cleaning apparatus 1, a plurality of wafers W, for example, 25
A cassette station 10 for loading and unloading wafers W from outside into and out of the system in units of wafers, and loading and unloading wafers W into and out of the wafer cassette CR. And a cleaning processing station 11 in which various single-wafer-type cleaning processing units are arranged at predetermined positions.

【００３３】カセットステーション１０では、図１に示
すように、カセット載置台２０上の位置決め突起２０ａ
の位置に、複数個例えば４個までのウエハカセットＣＲ
が、夫々のウエハ出入口を処理ステーション１１側に向
けてＸ方向（図１中の上下方向）一列に載置され、この
カセット配列方向（Ｘ方向）およびウエハカセッ卜ＣＲ
内に収納されたウエハのウエハ配列方向（Ｚ方向；垂直
方向）に移動可能なウエハ搬送体２１が各ウエハカセッ
トＣＲに選択的にアクセスするようになっている。さら
にこのウエハ搬送体２１は、θ方向に回転自在に構成さ
れており、後述するように洗浄処理ステーション１１側
のウエハ搬送体２２にも相互にアクセスできるようにな
っている。In the cassette station 10, as shown in FIG.
In the position, a plurality of, for example, up to four wafer cassettes CR
Are placed in a row in the X direction (vertical direction in FIG. 1) with their respective wafer entrances facing the processing station 11, and the cassette arrangement direction (X direction) and the wafer cassette CR are arranged.
A wafer carrier 21 that can move in the wafer arrangement direction (Z direction; vertical direction) of the wafers stored therein selectively accesses each wafer cassette CR. Further, the wafer carrier 21 is configured to be rotatable in the θ direction, so that the wafer carrier 22 on the cleaning processing station 11 side can be mutually accessed as described later.

【００３４】洗浄処理ステーション１１には、図１に示
すように、ウエハ搬送体２２が設けられている。ウエハ
搬送体２２は、ウエハ搬送路（Ｙ方向）に沿って移動可
能とされている。ウエハ搬送体２２の搬送路の両側に
は、洗浄処理ユニットが配置されている。処理ステーシ
ョン１１のウエハ搬送体２２は、θ方向にも回転自在に
構成されており、上述したカセットステーション１０側
のウエハ搬送体２１の他に、各洗浄処理ユニットにもア
クセスできるようになっている。The cleaning station 11 is provided with a wafer carrier 22 as shown in FIG. The wafer transfer body 22 is movable along a wafer transfer path (Y direction). Cleaning processing units are arranged on both sides of the transfer path of the wafer transfer body 22. The wafer transfer body 22 of the processing station 11 is configured to be rotatable also in the θ direction, and can access not only the above-described wafer transfer body 21 of the cassette station 10 but also each cleaning processing unit. .

【００３５】ウエハ搬送体２２の搬送路の両側には、図
１に示したように例えば４つの洗浄処理ユニットが配置
されている。装置の前面側には、単に濯ぎ液、例えば純
水（ＤＩＷ：deionized water ）により洗浄を行うＤＩ
Ｗ洗浄ユニット及び洗浄液、例えばＡＰＭを使用した洗
浄を行うＡＰＭ洗浄ユニットが配置され、装置の背面側
には、ＤＨＭを使用したＤＨＭ洗浄ユニット及びＨＰＭ
を使用した洗浄を行うＨＰＭ洗浄ユニットが配置されて
いる。なお、残りの位置には、これらのユニットあるい
は他のユニットを配置することが可能である。On both sides of the transfer path of the wafer transfer body 22, for example, four cleaning processing units are arranged as shown in FIG. On the front side of the apparatus, DI which is simply washed with a rinsing liquid, for example, DIW (deionized water) is used.
A W cleaning unit and an APM cleaning unit for performing cleaning using a cleaning liquid, for example, APM, are arranged. On the back side of the apparatus, a DHM cleaning unit using DHM and an HPM cleaning unit are provided.
An HPM cleaning unit for performing the cleaning using is provided. These units or other units can be arranged at the remaining positions.

【００３６】図４にこれら洗浄処理ユニットの構成を示
す。なお、ＡＰＭ洗浄ユニット、ＤＨＭ洗浄ユニット及
びＨＰＭ洗浄ユニットは基本的には同図に示すように同
一構成である。FIG. 4 shows the construction of these cleaning units. The APM cleaning unit, the DHM cleaning unit, and the HPM cleaning unit have basically the same configuration as shown in FIG.

【００３７】同図に示すように、密閉型の処理室３０内
のほぼ中央の下方には、ウエハＷの周縁部を支持して回
転させるチャック機構３１が設けられている。このチャ
ック機構３１は後述する第１のカップ３８と共に駆動シ
リンダ３２により所定の範囲で上昇・下降が行われるよ
うになっている。また、このチャック機構３１により支
持されたウエハＷの下方及び上方には、ウエハＷに対し
て洗浄液やＤＩＷを噴出する噴出ノズル３３、３４が配
置されている。噴出ノズル３３、３４には、後述するよ
うに洗浄液やＤＩＷが供給されるようになっている。As shown in the figure, a chuck mechanism 31 for supporting and rotating the peripheral portion of the wafer W is provided substantially below the center of the closed processing chamber 30. The chuck mechanism 31 is raised and lowered in a predetermined range by a driving cylinder 32 together with a first cup 38 described later. In addition, below and above the wafer W supported by the chuck mechanism 31, ejection nozzles 33 and 34 for ejecting a cleaning liquid or DIW to the wafer W are arranged. A cleaning liquid and DIW are supplied to the ejection nozzles 33 and 34 as described later.

【００３８】上記ウエハＷの下方に設けられた噴出ノズ
ル３３は、駆動シリンダ３５により所定の範囲内で上昇
・下降が行われるようになっている。また、上記ウエハ
Ｗの上方に設けられた噴出ノズル３４は、図５に示すよ
うに、駆動シリンダ３６により所定の範囲内で上昇・下
降が行われるようになっており、さらに水平方向（θ′
方向）に回転可能にされており、これにより噴出ノズル
３４は、ウエハＷの外周より外れた位置まで回動される
ようになっている。ウエハＷの外周より外れた所定の位
置、すなわち後述する第１及び第２のカップ３８、４１
に隣接する位置には、噴出ノズル３４から噴出した溶液
を回収するための回収部としてのダミーディスペンサ３
７が設けられている。The ejection nozzle 33 provided below the wafer W is raised and lowered by a driving cylinder 35 within a predetermined range. Further, as shown in FIG. 5, the ejection nozzle 34 provided above the wafer W is raised and lowered within a predetermined range by a driving cylinder 36, and is further moved in a horizontal direction (θ ′).
Direction), whereby the ejection nozzle 34 is rotated to a position outside the outer periphery of the wafer W. A predetermined position off the outer periphery of the wafer W, that is, first and second cups 38 and 41 described later.
The dummy dispenser 3 as a collecting unit for collecting the solution jetted from the jet nozzle 34 is located at a position adjacent to the dummy dispenser 3.
7 are provided.

【００３９】ダミーディスペンサ３７は、図６に示すよ
うに、噴出ノズル３４より噴出された洗浄液を回収する
内カップ３７ａと噴出ノズル３４より噴出されたＤＩＷ
を回収する外カップ３７ｂとを有する内外２重のカップ
構造とされている。As shown in FIG. 6, the dummy dispenser 37 has an inner cup 37a for collecting the cleaning liquid ejected from the ejection nozzle 34 and DIW ejected from the ejection nozzle 34.
And an outer cup 37b for collecting the inner and outer cups.

【００４０】また、図５に示すように、ダミーディスペ
ンサ３７及び駆動シリンダ３６の配置側とは反対側に
は、Ｎ2 パージやＩＰＡ等を噴出する噴出ノズル５１と
この噴出ノズル５１を水平方向（θ″方向）に回転及び
所定の範囲内で上昇・下降させる駆動シリンダ５２が配
置されている。この噴出ノズル５１から噴出される気体
によってウエハＷ上の洗浄液やＤＩＷが振り切り乾燥さ
れるようになっている。上記チャック機構３１や噴出ノ
ズル３３等は、小径の第１のカップ３８内に収納されて
いる。第１のカップ３８は、上方に向けてウエハＷの直
径よりやや大きめの直径の開口部を有し、この開口部を
介して上方よりウエハＷがカップ内に収容されるように
なっている。また、この第１のカップ３８の下面には、
このカップで回収された液をカップ外に排出するための
第１の排出口３９が設けられている。さらに、第１のカ
ップ３８の下面には、処理室３０内であって特に第１の
カップ３８内の排気を行うための排気口４０が設けられ
ている。排気口４０は、例えば図示を省略した排気ポン
プに接続されている。As shown in FIG. 5, on the side opposite to the side on which the dummy dispenser 37 and the drive cylinder 36 are disposed, an ejection nozzle 51 for ejecting N2 purge or IPA and the ejection nozzle 51 are arranged in the horizontal direction (θ A driving cylinder 52 is arranged to rotate in the “方向” direction and move up and down within a predetermined range.The cleaning liquid and DIW on the wafer W are shaken off and dried by the gas ejected from the ejection nozzle 51. The chuck mechanism 31, the ejection nozzle 33, and the like are housed in a small-diameter first cup 38. The first cup 38 has an opening having a diameter slightly larger than the diameter of the wafer W upward. The wafer W is accommodated in the cup from above through the opening.
A first outlet 39 is provided for discharging the liquid collected by the cup to the outside of the cup. Further, on the lower surface of the first cup 38, an exhaust port 40 for exhausting the inside of the processing chamber 30 and particularly the inside of the first cup 38 is provided. The exhaust port 40 is connected to, for example, an exhaust pump (not shown).

【００４１】第１のカップ３８は、この第１のカップ３
８より大径の第２のカップ４１内に収容されている。第
２のカップ４１は、上方に向けて第１のカップ３８より
大きな径の開口部を有しており、この開口部を介して第
２のカップ内さらには第１のカップ内にウエハＷを収容
する。また、第２のカップ４１の開口部の高さは、第１
のカップ３８の高さより高い位置にあり、この高低差を
利用した間隙を介してウエハＷより飛散された液を第２
のカップ４１内に回収するようになっている。また、こ
の第２のカップ４１の下面には、このカップで回収され
た液をカップ外に排出するための第２の排出口４２が設
けられている。さらに、第２のカップ４１の下面には、
処理室３０内であって特に第２のカップ４１内の排気を
行うための排気口４４が設けられている。排気口４４
は、例えば図示を省略した排気ポンプに接続されてい
る。このように各カップ３８、４１ごとに排出口及び排
気口を設けることで、洗浄液とＤＩＷの２液分離及び２
気体分離が実現される。The first cup 38 is the first cup 3
8 is accommodated in a second cup 41 having a larger diameter. The second cup 41 has an opening having a larger diameter than the first cup 38 toward the upper side, and the wafer W is placed in the second cup and further in the first cup through this opening. To accommodate. The height of the opening of the second cup 41 is the first height.
The liquid scattered from the wafer W through the gap utilizing the height difference is located at a position higher than the height of the cup 38 of the second position.
Is collected in the cup 41. Further, on the lower surface of the second cup 41, a second discharge port 42 for discharging the liquid collected by the cup to the outside of the cup is provided. Further, on the lower surface of the second cup 41,
An exhaust port 44 for exhausting the inside of the processing chamber 30 and particularly the inside of the second cup 41 is provided. Exhaust port 44
Is connected to, for example, an exhaust pump not shown. By providing a discharge port and an exhaust port for each of the cups 38 and 41 in this manner, two-liquid separation of the cleaning liquid and DIW
Gas separation is achieved.

【００４２】処理室３０のウエハ搬送路側の正面には、
ウエハＷの受け渡しを行うための窓部４３が設けられて
いる。窓部４３は、図示省略した駆動シリンダによって
例えば上下に開閉可能とされている。そして、ウエハ搬
送路上に移動可能に配置されたウエハ搬送体２２が上記
窓部４３を介して処理室３０との間で洗浄を行うウエハ
Ｗの受け渡しを行っている。In front of the processing chamber 30 on the side of the wafer transfer path,
A window 43 for transferring the wafer W is provided. The window 43 can be opened and closed, for example, vertically by a drive cylinder (not shown). The wafer carrier 22 movably arranged on the wafer carrier path transfers the wafer W to be cleaned with the processing chamber 30 through the window 43.

【００４３】そして、チャック機構３１が、第２のカッ
プ４１の開口部より上の第１の位置において窓部４３
を介してウエハ搬送体２２からウエハＷを受け取り、受
け取ったウエハＷを第１のカップ３８の開口部下の位置
に移送して例えば洗浄液による洗浄が行われ、次いで
第１のカップの３８と第２のカップ４１の開口部間の間
隙位置に移送して例えばＤＩＷによる洗浄が行われ
る。従って、第１のカップ３８では洗浄液の回収が行わ
れ、第２のカップ４１ではＤＩＷの回収が行われること
になる。Then, the chuck mechanism 31 moves the window 43 at the first position above the opening of the second cup 41.
The wafer W is transferred from the wafer carrier 22 to the position below the opening of the first cup 38, and is washed with, for example, a cleaning liquid. Is transferred to a gap position between the openings of the cup 41 to be cleaned by, for example, DIW. Therefore, the cleaning liquid is collected in the first cup 38, and the DIW is collected in the second cup 41.

【００４４】図７に第１及び第２のカップ３８、４１並
びにダミーディスペンサ３７で回収された洗浄液及びＤ
ＩＷの循環系及び排出系の構成を示す。FIG. 7 shows the cleaning liquid and D collected by the first and second cups 38 and 41 and the dummy dispenser 37.
1 shows a configuration of a circulation system and a discharge system of an IW.

【００４５】図７に示すように、第１のカップ３８で回
収された洗浄液及びダミーディスペンサ３７の内カップ
３７ａで回収された洗浄液は、洗浄液槽６１へ回収され
るようになっている。この洗浄液槽６１は、例えば３０
ｌ程度の洗浄液を貯蔵することが可能である。As shown in FIG. 7, the cleaning liquid collected by the first cup 38 and the cleaning liquid collected by the inner cup 37 a of the dummy dispenser 37 are collected in a cleaning liquid tank 61. This cleaning liquid tank 61 is, for example, 30
It is possible to store about 1 washing solution.

【００４６】洗浄液槽６１の下部には、貯蔵する洗浄液
を加熱するヒータ６２が配置されている。ヒータ６２
は、例えば洗浄液がＡＰＭの場合には洗浄液を例えば４
０℃程度に、例えば洗浄液がＨＰＭの場合には洗浄液を
例えば８０℃程度に加熱する。洗浄液がＤＨＦの場合に
は通常洗浄液の加熱は行わない。従って、このような場
合には、ヒータ６２を配置しないように構成してもよ
い。なお、洗浄液槽６１における洗浄液の導入口はヒー
ター６２よりも下部に、洗浄液の取り出し口はヒーター
６２よりも上部に設けた方がより好ましい。これによ
り、洗浄液槽６１内の洗浄液の温度の均一化を図ること
ができる。洗浄液槽６１の側部には、貯蔵する洗浄液の
水面を検出して洗浄液量を検出するリミットセンサ群６
３が配置されている。このリミットセンサ群６３は、例
えば最低レベルの水面の高さと最高レベルの水面の高さ
を検出するように構成し、洗浄液の補充制御に使われ
る。センサの数を増やしてより細かな検出を行うように
しても勿論よい。A heater 62 for heating the cleaning liquid to be stored is disposed below the cleaning liquid tank 61. Heater 62
For example, when the cleaning liquid is APM, the cleaning liquid is
The cleaning liquid is heated to about 0 ° C., for example, when the cleaning liquid is HPM, to about 80 ° C., for example. When the cleaning liquid is DHF, the cleaning liquid is not usually heated. Therefore, in such a case, the heater 62 may not be disposed. It is more preferable that the inlet for the cleaning liquid in the cleaning liquid tank 61 is provided below the heater 62, and the outlet for the cleaning liquid is provided above the heater 62. Thereby, the temperature of the cleaning liquid in the cleaning liquid tank 61 can be made uniform. A limit sensor group 6 for detecting the water level of the stored cleaning liquid and detecting the amount of the cleaning liquid is provided on the side of the cleaning liquid tank 61.
3 are arranged. The limit sensor group 63 is configured to detect, for example, the lowest level water level and the highest level water level, and is used for controlling the replenishment of the cleaning liquid. Needless to say, more detailed detection may be performed by increasing the number of sensors.

【００４７】洗浄液槽６１の上部には、洗浄液槽６１に
対して洗浄液、例えばＡＰＭであればＮＨ₄ ＯＨ及びＨ
₂Ｏ₂を補充するためのタンク６４、６５が接続され、
さらにＤＩＷ供給口６６が接続されている。このような
補充を洗浄液槽６１の上部から行うようにすることで、
洗浄液の撹拌を効果的に行うことができる。洗浄液の補
充は、例えば所定時間毎に行うようにしてもよく、また
洗浄したウエハＷの枚数が所定枚数になる毎に行うよう
にしてもよく、さらにこれらの組み合わせによって行う
ようにしてもよい。At the top of the cleaning liquid tank 61, a cleaning liquid for the cleaning liquid tank 61, for example, NH ₄ OH and H
Tanks 64 and 65 for replenishing ₂ O ₂ are connected,
Further, a DIW supply port 66 is connected. By performing such replenishment from the upper part of the cleaning liquid tank 61,
The washing liquid can be effectively stirred. The replenishment of the cleaning liquid may be performed, for example, every predetermined time, may be performed every time the number of cleaned wafers W reaches a predetermined number, or may be performed in combination.

【００４８】洗浄液槽６１に貯蔵された洗浄液は、洗浄
液循環用のポンプ６７及び洗浄液ろ過用のフィルタ６８
を介して噴出ノズル３３、３４に供給されるようになっ
ている。これにより、噴出ノズル３３、３４で使った洗
浄液を循環させて当該噴出ノズル３３、３４で再使用さ
せる循環系が構成されている。また、洗浄液槽６１に貯
蔵された洗浄液は、洗浄液循環用のポンプ６７及び洗浄
液ろ過用のフィルタ６８を介して再び洗浄液槽６１に循
環するようになっている。これにより、洗浄液槽６１内
の洗浄液の混合と温調が行われるようになっている。The cleaning liquid stored in the cleaning liquid tank 61 is supplied to a cleaning liquid circulation pump 67 and a cleaning liquid filtration filter 68.
Through the nozzles 33 and 34. Thus, a circulating system in which the cleaning liquid used in the ejection nozzles 33 and 34 is circulated and reused in the ejection nozzles 33 and 34 is configured. The cleaning liquid stored in the cleaning liquid tank 61 is circulated again to the cleaning liquid tank 61 via a cleaning liquid circulation pump 67 and a cleaning liquid filtration filter 68. Thus, mixing and temperature control of the cleaning liquid in the cleaning liquid tank 61 are performed.

【００４９】また、洗浄液ろ過用のフィルタ６８と噴出
ノズル３４及びフィルタ６８と噴出ノズル３３との間に
は、それぞれ切換部６９、７０が介挿されている。切換
部６９は、洗浄液槽６１からの洗浄液、ＤＩＷ供給口７
１からのＤＩＷのうちいずれか一方を噴出ノズル３４に
供給する。切換部７０は、洗浄液槽６１からの洗浄液、
ＤＩＷ供給口７２からのＤＩＷのうちいずれか一方を噴
出ノズル３３に供給する。切換部６９、７０の切換制御
は、例えば図示を省略した制御部によって後述するタイ
ミングで行われる。Further, switching portions 69 and 70 are interposed between the filter 68 for cleaning liquid filtration and the ejection nozzle 34 and between the filter 68 and the ejection nozzle 33, respectively. The switching unit 69 is used to supply the cleaning liquid from the cleaning liquid tank 61 and the DIW supply port 7.
Any one of DIW from No. 1 is supplied to the ejection nozzle 34. The switching unit 70 includes a cleaning liquid from the cleaning liquid tank 61,
One of the DIWs from the DIW supply port 72 is supplied to the ejection nozzle 33. The switching control of the switching units 69 and 70 is performed at a later-described timing by, for example, a control unit (not shown).

【００５０】噴出ノズル３３、３４からウエハＷに対し
て噴出されたＤＩＷは、第２のカップ４１により回収さ
れて、排出口４２から排出される。また。噴出ノズル３
４からダミーディスペンサ３７に対して噴出されたＤＩ
Ｗは、外カップ３７ｂにより回収されて排出される。The DIW ejected from the ejection nozzles 33 and 34 to the wafer W is collected by the second cup 41 and discharged from the outlet 42. Also. Jet nozzle 3
DI jetted from 4 to the dummy dispenser 37
W is collected and discharged by the outer cup 37b.

【００５１】ところで、このように同一の噴出ノズルか
ら洗浄液とＤＩＷの２種類の液体をと交互に噴出するよ
うに構成すると、例えば噴出ノズルからウエハＷに対し
て洗浄液を噴出しようとする場合に、図８に示すように
噴出ノズル３４と切換部６９との間７３に残っていた濯
ぎ液が最初にウエハＷに対して噴出され、また噴出ノズ
ルからウエハＷに対して濯ぎ液を噴出しようとする場合
に、噴出ノズル３４と切換部６９との間７３に残ってい
た洗浄液が最初にウエハＷに対して噴出される。このた
め、ウエハＷに対して洗浄液による悪影響を与えたり、
ウォーターマーク等が付着したりする、といった不具合
が発生する。When the cleaning liquid and the DIW are alternately ejected from the same ejection nozzle as described above, for example, when the cleaning liquid is ejected to the wafer W from the ejection nozzle, As shown in FIG. 8, the rinsing liquid remaining in the space 73 between the ejection nozzle 34 and the switching section 69 is first ejected to the wafer W, and the ejection nozzle attempts to eject the rinsing liquid to the wafer W. In this case, the cleaning liquid remaining in the space 73 between the ejection nozzle 34 and the switching unit 69 is ejected to the wafer W first. For this reason, the cleaning liquid may adversely affect the wafer W,
Problems such as attachment of a watermark or the like occur.

【００５２】そこで、本実施形態に係る洗浄装置１で
は、噴出部ノズル３４がウエハＷに対して洗浄液を噴出
する前に予め噴出ノズル３４をダミーディスペンサ３７
の内カップ３７ａ上（図６の位置）に移動させて所定
期間噴出ノズル３４より噴出ノズル３４と切換部６９と
の間７３に残っていたＤＩＷを排出させ、噴出部ノズル
３４がウエハＷに対してＤＩＷを噴出する前に予め噴出
ノズル３４をダミーディスペンサ３７の外カップ３７ｂ
上（図６の位置）に移動させて所定期間噴出ノズル３
４より噴出ノズル３４と切換部６９との間７３に残って
いた洗浄液を排出させている。Therefore, in the cleaning apparatus 1 according to the present embodiment, before the ejection nozzle 34 ejects the cleaning liquid to the wafer W, the ejection nozzle 34 is previously set to the dummy dispenser 37.
The DIW remaining in the space 73 between the ejection nozzle 34 and the switching unit 69 is discharged from the ejection nozzle 34 for a predetermined period, and the ejection nozzle 34 Before ejecting the DIW, the ejection nozzle 34 is previously connected to the outer cup 37b of the dummy dispenser 37.
The nozzle 3 is moved upward (the position in FIG.
4, the cleaning liquid remaining in the space 73 between the ejection nozzle 34 and the switching section 69 is discharged.

【００５３】これにより、ウエハＷに対して洗浄液を噴
出しようとする場合に噴出ノズル３４に残っていたＤＩ
ＷがウエハＷに対して噴出されることがなくなり、また
ウエハＷに対してＤＩＷを噴出しようとする場合に噴出
ノズル３４に残っていた洗浄液がウエハＷに対して噴出
されることがなくなり、洗浄処理をより良好に行うこと
ができるようになる。Thus, when the cleaning liquid is to be jetted to the wafer W, the DI remaining at the jet nozzle 34
W is no longer ejected to the wafer W, and when the DIW is to be ejected to the wafer W, the cleaning liquid remaining in the ejection nozzle 34 is not ejected to the wafer W. Processing can be performed better.

【００５４】以上のように本実施形態のウエハ洗浄装置
１では、噴出ノズル３３、３４からウエハＷに噴出され
た洗浄液、さらには噴出ノズル３３からダミーディスペ
ンサ３７に噴出された洗浄液を回収して循環し再利用す
るように構成しているので、洗浄に使用する洗浄液の消
費量を減らことができる。この結果、ランニングコスト
の低減を図ることができる。また、洗浄液槽６１の小型
化が可能となり、スペースコストを低減を図ることがで
きるようになる。As described above, in the wafer cleaning apparatus 1 of the present embodiment, the cleaning liquid jetted from the jet nozzles 33 and 34 to the wafer W and the cleaning liquid jetted from the jet nozzle 33 to the dummy dispenser 37 are collected and circulated. Since it is configured to be reused, the consumption of the cleaning liquid used for cleaning can be reduced. As a result, the running cost can be reduced. Further, the size of the cleaning liquid tank 61 can be reduced, and the space cost can be reduced.

【００５５】また、このウエハ洗浄装置１では、洗浄部
を第１及び第２のカップ３８、４１からなる内外２重の
カップ構造とし、さらにダミーディスペンサ３７につい
ても、内外２重のカップ３７ａ、３７ｂの構造としたの
で、洗浄液のみの回収及び再利用を簡単な構成で行うこ
とができる。さらに、このウエハ洗浄装置１では、２
つの噴出ノズル３３、３４を使いウエハＷの表裏両面よ
り洗浄を行うように構成したので、洗浄処理のスループ
ットを向上させることができる。また、噴出ノズル３
３、３４は、１つの噴出ノズルで２種類の液、つまり洗
浄液とＤＩＷを噴出するように構成したので、装置を小
型化を図ることができる。Further, in this wafer cleaning apparatus 1, the cleaning section has a double inner / outer cup structure composed of the first and second cups 38 and 41, and the dummy dispenser 37 also has double inner and outer cups 37a and 37b. With this structure, only the cleaning liquid can be collected and reused with a simple configuration. Further, in this wafer cleaning apparatus 1, 2
Since the cleaning is performed from both the front and back surfaces of the wafer W using the two ejection nozzles 33 and 34, the throughput of the cleaning process can be improved. In addition, jet nozzle 3
Each of the nozzles 3 and 34 is configured to eject two kinds of liquids, that is, a cleaning liquid and DIW, with one ejection nozzle, so that the apparatus can be downsized.

【００５６】また、ウエハＷを第１のカップ３８で洗浄
液による洗浄を行い、第２のカップ４１でＤＩＷによる
洗浄を行うように、つまり下部で洗浄液による洗浄を行
い、上部でＤＩＷによる洗浄を行うように構成している
ので、洗浄液に伴う雰囲気がＤＩＷによって洗浄された
ウエハＷに及ぶようなことはなくなり、ウエハＷに対し
て洗浄液による悪影響を与えることがなくなる。なお、
逆の構成、すなわちウエハＷを第１のカップ３８でＤＩ
Ｗによる洗浄を行い、第２のカップ４１で洗浄液による
洗浄を行うように、つまり下部でＤＩＷによる洗浄を行
い、上部で洗浄液による洗浄を行うように構成すること
も可能であり、これにより洗浄液をより効率よく回収す
ることができるようになる。Further, the wafer W is cleaned with the cleaning liquid in the first cup 38 and the cleaning with DIW is performed in the second cup 41, that is, the cleaning with the cleaning liquid is performed in the lower part, and the cleaning with DIW is performed in the upper part. With such a configuration, the atmosphere accompanying the cleaning liquid does not reach the wafer W cleaned by the DIW, and the cleaning liquid does not adversely affect the wafer W. In addition,
The reverse configuration, that is, the wafer W is
It is also possible to perform a cleaning with W and a cleaning liquid with the second cup 41, that is, to perform a cleaning with DIW in the lower part and a cleaning with the cleaning liquid in the upper part. It becomes possible to collect more efficiently.

【００５７】なお、本発明は、上述した実施形態に限定
されることはなく、その技術思想の範囲内で種々の変形
が可能である。The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the technical concept.

【００５８】例えば、上述した実施形態では、本発明を
ＡＰＭ洗浄ユニットやＤＨＭ洗浄ユニット、ＨＰＭ洗浄
ユニットに適用した例を説明したが、他の洗浄ユニット
についても本発明を適用できる。For example, in the above-described embodiment, an example in which the present invention is applied to the APM cleaning unit, the DHM cleaning unit, and the HPM cleaning unit has been described. However, the present invention can be applied to other cleaning units.

【００５９】また、ユニットの構成も上下方向（Ｚ方
向）に多段となるように構成してもよい。The units may be arranged in multiple stages in the vertical direction (Z direction).

【００６０】さらに、被処理基板も半導体ウエハに限る
ものでなく、ＬＣＤ基板、ガラス基板、ＣＤ基板、フォ
トマスク、プリント基板、セラミック基板等でも可能で
ある。The substrate to be processed is not limited to a semiconductor wafer, but may be an LCD substrate, a glass substrate, a CD substrate, a photomask, a printed substrate, a ceramic substrate, or the like.

【００６１】[0061]

【発明の効果】以上詳述したように、本発明によれば、
被処理基板を洗浄液及び濯ぎ液を使って洗浄する洗浄手
段と、前記洗浄手段で使った洗浄液を循環させて当該洗
浄手段で再使用させる循環系と、前記洗浄手段で使った
濯ぎ液を排出する排出系とを具備したので、洗浄に使用
する洗浄液の消費量を減らし、ランニングコスト及びス
ペースコストを低減することができる。As described in detail above, according to the present invention,
Cleaning means for cleaning a substrate to be processed using a cleaning liquid and a rinsing liquid, a circulation system for circulating the cleaning liquid used in the cleaning means and reusing it in the cleaning means, and discharging the rinsing liquid used in the cleaning means Since the discharge system is provided, the consumption of the cleaning liquid used for cleaning can be reduced, and the running cost and the space cost can be reduced.

【００６２】本発明によれば、被処理基板の出し入れが
可能な開口部を有し、内カップの開口部の高さが外カッ
プの開口部の高さよりも低い内外２重のカップ構造の収
容部と、前記収容部内で被処理基板を保持して回転し、
かつ前記内外カップ間を移送する回転移送部と、前記内
外カップ内でそれぞれ前記回転移送部により回転される
被処理基板に対し、それぞれ洗浄液及び濯ぎ液のうち一
方を噴出する噴出部と、前記内外カップのうち一方で回
収された洗浄液を循環させて前記噴出部で再使用させる
循環系と、前記内外カップのうち他方で回収された濯ぎ
液を排出する排出系とを具備したので、特に洗浄液の回
収及び再利用を簡単な構成で行うことができる。According to the present invention, an inner / outer double cup structure having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is smaller than the height of the opening of the outer cup. Part, holding and rotating the substrate to be processed in the accommodation part,
A rotary transfer unit configured to transfer between the inner and outer cups; an ejection unit configured to eject one of a cleaning liquid and a rinsing liquid to the substrate to be processed rotated by the rotary transfer unit in the inner and outer cups; Since a circulating system for circulating the cleaning liquid collected on one of the cups and reusing it at the jetting portion and a discharge system for discharging the rinsing liquid collected on the other of the inner and outer cups were provided, particularly the cleaning liquid was used. Collection and reuse can be performed with a simple configuration.

【００６３】本発明では、被処理基板の出し入れが可能
な開口部を有し、内カップの開口部の高さが外カップの
開口部の高さよりも低い内外２重のカップ構造の収容部
と、前記収容部内で被処理基板を保持して回転し、かつ
前記内外カップ間を移送する回転移送部と、前記内外カ
ップ内でそれぞれ前記回転移送部により回転される被処
理基板の表裏両面に対し、それぞれ洗浄液及び濯ぎ液の
うち一方を噴出する噴出部と、前記内外カップのうち一
方で回収された洗浄液を循環させて前記噴出部で再使用
させる循環系と、前記内外カップのうち他方で回収され
た濯ぎ液を排出する排出系とを具備したので、特に洗浄
時間を短縮してスループットを向上することができる。According to the present invention, there is provided an inner / outer double cup structure accommodating portion having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is lower than the height of the opening of the outer cup. A rotating transfer unit that holds and rotates the substrate to be processed in the storage unit, and transfers between the inner and outer cups; and a front and back surface of the substrate to be processed that is rotated by the rotary transfer unit in the inner and outer cups. A jetting unit for jetting one of the cleaning liquid and the rinsing liquid, a circulation system for circulating the cleaning liquid collected on one of the inner and outer cups and reusing the jetting unit, and a collecting unit for the other of the inner and outer cups Since the apparatus is provided with a discharge system for discharging the rinse solution, the cleaning time can be particularly shortened and the throughput can be improved.

【００６４】本発明では、被処理基板の出し入れが可能
な開口部を有し、内カップの開口部の高さが外カップの
開口部の高さよりも低い内外２重のカップ構造の収容部
と、前記収容部内で被処理基板を保持して回転し、かつ
前記内外カップ間を移送する回転移送部と、前記内カッ
プ内で前記回転移送部により回転される被処理基板の表
裏両面に対して洗浄液を噴出し、前記外カップ内で前記
回転移送部により回転される被処理基板の表裏両面に対
して濯ぎ液を噴出する噴出部と、前記内カップで回収さ
れた洗浄液を循環させて前記噴出部で再使用させる循環
系と、前記外カップで回収された濯ぎ液を排出する排出
系とを具備したので、洗浄液に伴う雰囲気が濯ぎ液によ
って洗浄された被処理基板に及ぶようなことはなくな
り、被処理基板に対して洗浄液による悪影響を与えるこ
とがなくなる。According to the present invention, there is provided an inner / outer double cup structure accommodating portion having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is lower than the height of the opening of the outer cup. A rotating transfer unit that holds and rotates the substrate to be processed in the storage unit, and transfers between the inner and outer cups; and a front and back surface of the substrate to be processed rotated by the rotary transfer unit in the inner cup. A jetting section for jetting a cleaning liquid and jetting a rinsing liquid onto both front and back surfaces of the substrate to be processed rotated by the rotary transfer section in the outer cup; and circulating the cleaning liquid collected in the inner cup to jet the cleaning liquid. Since the circulating system for reuse in the section and the discharge system for discharging the rinsing liquid collected by the outer cup are provided, the atmosphere accompanying the cleaning liquid does not reach the substrate to be processed cleaned by the rinsing liquid. For the substrate to be processed It is adversely affected by the cleaning solution Te is eliminated.

【００６５】本発明によれば、被処理基板の出し入れが
可能な開口部を有し、内カップの開口部の高さが外カッ
プの開口部の高さよりも低い内外２重のカップ構造の収
容部と、前記収容部内で被処理基板を保持して回転し、
かつ前記内外カップ間を移送する回転移送部と、前記外
カップ内で前記回転移送部により回転される被処理基板
の表裏両面に対して洗浄液を噴出し、前記内カップ内で
前記回転移送部により回転される被処理基板の表裏両面
に対して濯ぎ液を噴出する噴出部と、前記外カップで回
収された洗浄液を循環させて前記噴出部で再使用させる
循環系と、前記内カップで回収された濯ぎ液を排出する
排出系とを具備したので、特に洗浄液をより効率よく回
収することができる。According to the present invention, there is provided an inner / outer double cup structure having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is lower than the height of the opening of the outer cup. Part, holding and rotating the substrate to be processed in the accommodation part,
And a rotary transfer unit for transferring between the inner and outer cups, and a cleaning liquid is spouted on both front and back surfaces of the substrate to be processed rotated by the rotary transfer unit in the outer cup, and the rotary transfer unit in the inner cup. A spouting section for spouting a rinsing liquid onto both the front and back surfaces of the substrate to be rotated, a circulating system for circulating the cleaning liquid collected in the outer cup and reusing it in the spouting section, and a circulating system collected in the inner cup. Since a discharge system for discharging the rinse solution is provided, the cleaning liquid can be particularly efficiently recovered.

【００６６】また、本発明によれば、被処理基板に対し
て同一の噴出ノズルを使って洗浄液及び濯ぎ液を交互に
噴出する噴出部と、前記噴出部が被処理基板に対して洗
浄液及び濯ぎ液を噴出する前に予め所定期間前記噴出ノ
ズルより洗浄液及び濯ぎ液を排出させる手段とを具備し
たので、被処理基板に対して洗浄液による悪影響を与え
たり、ウォーターマーク等が付着することがなくなり、
洗浄処理をより良好に行うことができるようになる。Also, according to the present invention, an ejection section for alternately ejecting the cleaning liquid and the rinsing liquid to the substrate to be processed by using the same ejection nozzle, and the ejection section provides the cleaning liquid and the rinsing liquid to the substrate to be processed. Means for discharging the cleaning liquid and the rinsing liquid from the jet nozzle for a predetermined period before the liquid is jetted, so that the cleaning liquid does not adversely affect the substrate to be processed or a watermark or the like does not adhere,
The cleaning process can be performed more favorably.

【００６７】本発明では、被処理基板に対して同一の噴
出ノズルを使って洗浄液及び濯ぎ液を交互に噴出する噴
出部と、前記噴出部が被処理基板に対して洗浄液及び濯
ぎ液を噴出する前に予め所定期間前記噴出ノズルより洗
浄液及び濯ぎ液を排出させる手段と、前記噴出ノズルよ
り排出された洗浄液及び濯ぎ液のうち洗浄液については
回収して循環させて前記噴出部で再使用させる循環系と
を具備したので、特に洗浄液の消費量をさらに減らすこ
とができる。According to the present invention, the jetting section for jetting the cleaning liquid and the rinsing liquid alternately to the substrate to be processed by using the same jet nozzle, and the jetting section jets the cleaning liquid and the rinsing liquid to the substrate to be processed. Means for discharging the cleaning liquid and the rinsing liquid from the ejection nozzle in advance for a predetermined period; and a circulation system for collecting and circulating the cleaning liquid among the cleaning liquid and the rinsing liquid discharged from the ejection nozzle and reusing the cleaning liquid in the ejection part. , The consumption of the cleaning liquid can be further reduced.

【００６８】本発明では、被処理基板に対して同一の噴
出ノズルを使って洗浄液及び濯ぎ液を交互に噴出する噴
出部と、前記噴出ノズルより噴出された洗浄液を回収す
る洗浄液回収部と、前記噴出ノズルより噴出された濯ぎ
液を回収する濯ぎ液回収部と、前記噴出部が被処理基板
に対して洗浄液を噴出する前に予め所定期間前記噴出ノ
ズルより前記洗浄液回収部に洗浄液を排出させ、前記噴
出部が被処理基板に対して濯ぎ液を噴出する前に予め所
定期間前記噴出ノズルより前記洗浄液回収部に洗浄液を
排出させる手段と、前記洗浄液回収部により回収された
洗浄液を循環させて前記噴出部で再使用させる循環系と
を具備したので、特に洗浄液の回収を容易に行うことが
できる。According to the present invention, an ejection section for alternately ejecting a cleaning liquid and a rinsing liquid to the substrate to be processed by using the same ejection nozzle, a cleaning liquid recovery section for collecting the cleaning liquid ejected from the ejection nozzle, A rinsing liquid collecting unit for collecting a rinsing liquid ejected from the ejection nozzle, and discharging the cleaning liquid from the ejection nozzle to the cleaning liquid collection unit for a predetermined period before the ejection unit ejects the cleaning liquid onto the substrate to be processed; Means for discharging the washing liquid from the ejection nozzle to the washing liquid collecting section in advance for a predetermined period before the ejecting section ejects the rinsing liquid to the substrate to be processed, and circulating the washing liquid collected by the washing liquid collecting section. Since a circulation system for reuse at the jetting portion is provided, it is possible to particularly easily recover the cleaning liquid.

【００６９】本発明では、被処理基板に対して同一の噴
出ノズルを使って洗浄液及び濯ぎ液を交互に噴出する噴
出部と、前記噴出部に隣接して設けられ、前記噴出ノズ
ルより噴出された洗浄液を回収する洗浄液回収部と、前
記噴出部に隣接して設けられ、前記噴出ノズルより噴出
された濯ぎ液を回収する濯ぎ液回収部と、前記噴出ノズ
ルを前記噴出部と前記洗浄液回収部と前記濯ぎ液回収部
との間を移動させるノズル移動手段と、前記噴出部が被
処理基板に対して洗浄液を噴出する前に前記ノズル移動
手段により前記噴出ノズルを前記洗浄液回収部へ移動さ
せて予め所定期間噴出ノズルより洗浄液回収部に洗浄液
を排出させ、前記噴出部が被処理基板に対して濯ぎ液を
噴出する前に前記ノズル移動手段により前記噴出ノズル
を前記濯ぎ液回収部へ移動させて予め所定期間噴出ノズ
ルより洗浄液回収部に洗浄液を排出させる手段と、前記
洗浄液回収部により回収された洗浄液を循環させて前記
噴出部で再使用させる循環系とを具備したので、特に洗
浄液消費量の減少をより簡単な構造でさらには装置の大
型化を招来させることなく実現できる。According to the present invention, the jetting portion for jetting the cleaning liquid and the rinsing liquid alternately using the same jetting nozzle to the substrate to be processed is provided, and the jetting portion is provided adjacent to the jetting portion and jetted from the jetting nozzle. A cleaning liquid collecting unit that collects a cleaning liquid, a rinsing liquid collecting unit that is provided adjacent to the ejection unit, and collects a rinsing liquid ejected from the ejection nozzle, and the ejection nozzle includes the ejection unit and the cleaning liquid collection unit. A nozzle moving unit that moves between the rinsing liquid collecting unit and the jetting nozzle is moved to the cleaning liquid collecting unit by the nozzle moving unit before the jetting unit jets the cleaning liquid to the substrate to be processed; The cleaning liquid is discharged from the jet nozzle to the cleaning liquid collecting section for a predetermined period, and the jet moving nozzle collects the rinse liquid by the nozzle moving means before the jet section jets the rinsing liquid to the substrate to be processed. And a circulating system for circulating the cleaning liquid collected by the cleaning liquid recovery unit and reusing the cleaning liquid by the jetting unit. It is possible to reduce the consumption of the cleaning liquid with a simpler structure and without increasing the size of the apparatus.

【００７０】本発明では、被処理基板に対して同一の噴
出ノズルを使って洗浄液及び濯ぎ液を交互に噴出する噴
出部と、前記噴出部に隣接して設けられ、前記噴出ノズ
ルより噴出された洗浄液及び濯ぎ液のうち一方を回収す
る内カップと他方を回収する外カップとを有する内外２
重のカップ構造の回収部と、前記噴出ノズルを前記噴出
部と前記回収部との間を移動させるノズル移動手段と、
前記噴出部が被処理基板に対して洗浄液を噴出する前に
前記ノズル移動手段により前記噴出ノズルを前記一方の
カップへ移動させて予め所定期間噴出ノズルより洗浄液
を排出させ、前記噴出部が被処理基板に対して濯ぎ液を
噴出する前に前記ノズル移動手段により前記噴出ノズル
を前記他方のカップへ移動させて予め所定期間噴出ノズ
ルより洗浄液を排出させる手段と、前記回収部により回
収された洗浄液のうち洗浄液については循環させて前記
噴出部で再使用させる循環系とを具備したので、特に装
置のさらなる小型化を図ることができる。According to the present invention, the jetting portion for alternately jetting the cleaning liquid and the rinsing liquid to the substrate to be processed by using the same jetting nozzle, and the jetting portion is provided adjacent to the jetting portion and jetted from the jetting nozzle. Inner / outer 2 having an inner cup for collecting one of the washing liquid and the rinsing liquid and an outer cup for collecting the other
A collecting section having a heavy cup structure, and a nozzle moving means for moving the ejection nozzle between the ejection section and the collection section,
Before the ejection unit ejects the cleaning liquid to the substrate to be processed, the ejection nozzle is moved to the one cup by the nozzle moving means to discharge the cleaning liquid from the ejection nozzle in advance for a predetermined period, and the ejection unit Means for moving the ejection nozzle to the other cup by the nozzle moving means before ejecting the rinsing liquid to the substrate to discharge the washing liquid from the ejection nozzle for a predetermined period in advance; Since a circulation system for circulating the cleaning liquid and reusing the cleaning liquid at the jetting section is provided, the size of the apparatus can be further reduced.

[Brief description of the drawings]

【図１】本発明の実施形態が採用された半導体ウエハの
洗浄装置の全体構成の平面図である。FIG. 1 is a plan view of the overall configuration of a semiconductor wafer cleaning apparatus employing an embodiment of the present invention.

【図２】図１に示した洗浄装置の正面図である。FIG. 2 is a front view of the cleaning device shown in FIG.

【図３】図１に示した洗浄装置の背面図である。FIG. 3 is a rear view of the cleaning device shown in FIG. 1;

【図４】図１に示した洗浄処理ユニットの縦断面図であ
る。FIG. 4 is a longitudinal sectional view of the cleaning unit shown in FIG. 1;

【図５】図１に示した洗浄処理ユニットの平面図であ
る。FIG. 5 is a plan view of the cleaning unit shown in FIG. 1;

【図６】図４に示した洗浄処理ユニットのダミーディス
ペンサの断面図である。6 is a sectional view of a dummy dispenser of the cleaning processing unit shown in FIG.

【図７】図１に示した洗浄装置の洗浄液及びＤＩＷの循
環系及び排出系の構成を示す図である。FIG. 7 is a diagram showing a configuration of a circulation system and a discharge system of a cleaning liquid and DIW of the cleaning apparatus shown in FIG.

【図８】図７に示した噴出ノズルと切換部との間の拡大
図である。FIG. 8 is an enlarged view between the ejection nozzle and the switching unit shown in FIG. 7;

[Explanation of symbols]

１洗浄装置２２ウエハ搬送体３０処理室３１チャック機構３３、３４ノズル３７ダミーディスペンサ３７ａ内カップ３７ｂ外カップ３８第１のカップ４０、４４排気口４１第２のカップ４３窓部Ｗウエハ DESCRIPTION OF SYMBOLS 1 Cleaning apparatus 22 Wafer carrying body 30 Processing chamber 31 Chuck mechanism 33, 34 Nozzle 37 Dummy dispenser 37a Inner cup 37b Outer cup 38 First cup 40, 44 Exhaust port 41 Second cup 43 Window W wafer

───────────────────────────────────────────────────── フロントページの続き (72)発明者飽本正巳熊本県菊池郡菊陽町津久礼2655番地東京エレクトロン九州株式会社熊本事業所内 (56)参考文献特開平８−78378（ＪＰ，Ａ) 特開平６−277638（ＪＰ，Ａ) 特開平８−108125（ＪＰ，Ａ) 特開平８−168614（ＪＰ，Ａ) 特開平５−21415（ＪＰ，Ａ) 特開平10−12523（ＪＰ，Ａ) 特開平10−41269（ＪＰ，Ａ) 特開平９−38595（ＪＰ，Ａ) 特開平10−41264（ＪＰ，Ａ) 特開平10−64869（ＪＰ，Ａ) 特開平７−245466（ＪＰ，Ａ) 特開平４−287922（ＪＰ，Ａ) 実開昭63−111960（ＪＰ，Ｕ) 実開平１−110887（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.⁷，ＤＢ名) H01L 21/304 ──────────────────────────────────────────────────続き Continuation of the front page (72) Inventor Masami Atsumoto 2655 Tsukure, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Co., Ltd. Kumamoto Office (56) References JP-A-8-78378 (JP, A JP-A-6-277638 (JP, A) JP-A-8-108125 (JP, A) JP-A-8-168614 (JP, A) JP-A-5-21415 (JP, A) JP-A-10-108 JP-A-10-41269 (JP, A) JP-A-9-38595 (JP, A) JP-A-10-41264 (JP, A) JP-A-10-64869 (JP, A) JP-A-7-245466 (JP, A) JP-A-4-287922 (JP, A) JP-A 63-111960 (JP, U) JP-A 1-110887 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/304

Claims

(57) [Claims]

A cleaning means for cleaning a substrate to be processed using a cleaning liquid and a rinsing liquid; a cleaning liquid used in the cleaning means being collected into a cleaning liquid tank; and a cleaning liquid circulation pump and a cleaning liquid filtration filter. said cleaning means supplied to it reusable, and washing solution, again the washing liquid tank through the pump and filter for the cleaning liquid filtered for the washing liquid circulation without supplying the cleaning means of the cleaning liquid tank Washing by circulating into the
A circulating system in which the cleaning liquid in the liquid tank can be mixed , and a NH ₄ OH for replenishing the NH ₄ OH connected to the cleaning liquid tank .
A tank for replenishing the tank and H ₂ O _2, and pure water supply port connected to the cleaning solution tank, the tank and H ₂ O ₂ for refilling the NH ₄ OH
Means from the tank to replenish performing replenishment of the cleaning liquid to the cleaning liquid tank, a sensor used for replenishing operation of the cleaning liquid by means for detecting the washing liquid amount of the cleaning liquid in the tank, performs replenishment of the cleaning solution, A discharge system for discharging the rinse liquid used in the cleaning means.

2. An accommodating portion having an inner / outer double cup structure, having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is lower than the height of the opening of the outer cup. A rotating transfer unit that holds and rotates the substrate to be processed in the storage unit and transfers between the inner and outer cups; and a cleaning liquid and a rinse for the substrate that is rotated by the rotary transfer unit in the inner and outer cups. A spouting section for spouting one of the liquids, and a cleaning liquid collected on one of the inner and outer cups is collected in a cleaning liquid tank, and supplied to the spouting section via a cleaning liquid circulation pump and a cleaning liquid filtration filter. reusable, and the cleaning liquid of the cleaning liquid tank, to circulate into the pump for the cleaning fluid circulation without supplying the ejection part and the cleaning liquid for filtration through the filter again the washing liquid tank
And a circulating system in which the cleaning liquid in the cleaning liquid tank can be mixed , and a NH ₄ OH connected to the cleaning liquid tank .
A tank for replenishing the tank and H ₂ O _2, and pure water supply port connected to the cleaning solution tank, the tank and H ₂ O ₂ for refilling the NH ₄ OH
Means from the tank to replenish performing replenishment of the cleaning liquid to the cleaning liquid tank, a sensor used for replenishing operation of the cleaning liquid by means for detecting the washing liquid amount of the cleaning liquid in the tank, performs replenishment of the cleaning solution, A discharge system for discharging the rinse liquid collected by the other of the inner and outer cups.

3. An accommodating portion having an inner / outer double cup structure having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is lower than the height of the opening of the outer cup. A rotating transfer unit that holds and rotates the substrate to be processed in the storage unit, and transfers between the inner and outer cups, and for both the front and back surfaces of the substrate to be processed that are rotated by the rotary transfer unit in the inner and outer cups, respectively. An ejection part for ejecting one of a cleaning liquid and a rinsing liquid, and a washing liquid collected on one of the inner and outer cups is collected in a washing liquid tank, and the ejection liquid is supplied to the ejection part via a washing liquid circulation pump and a washing liquid filtration filter. supplied to reusable, and the washing liquid of the washing liquid tank, again circulated to the washing liquid tank through the pump and filter for the cleaning liquid filtered for the washing liquid circulation without supplying to the ejection part thing
And a circulating system in which the cleaning liquid in the cleaning liquid tank can be mixed , and a NH ₄ OH connected to the cleaning liquid tank .
A tank for replenishing the tank and H ₂ O _2, and pure water supply port connected to the cleaning solution tank, the tank and H ₂ O ₂ for refilling the NH ₄ OH
Means from the tank to replenish performing replenishment of the cleaning liquid to the cleaning liquid tank, a sensor used for replenishing operation of the cleaning liquid by means for detecting the washing liquid amount of the cleaning liquid in the tank, performs replenishment of the cleaning solution, A discharge system for discharging the rinse liquid collected by the other of the inner and outer cups.

4. An accommodating portion having an inner / outer double cup structure having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is lower than the height of the opening of the outer cup. A rotary transfer unit that holds and rotates the substrate to be processed in the storage unit, and transfers between the inner and outer cups; and a cleaning liquid for both the front and back surfaces of the substrate to be processed that is rotated by the rotary transfer unit in the inner cup. A spouting section for spouting a rinsing liquid onto both front and back surfaces of the substrate to be processed which is rotated by the rotary transfer section in the outer cup, and a cleaning liquid collected by the inner cup is collected into a cleaning liquid tank,
The cleaning liquid circulation pump and the cleaning liquid circulation filter are supplied to the ejection section via a cleaning liquid filtration filter, and the cleaning liquid in the cleaning liquid tank is supplied to the ejection section without being supplied to the ejection section. The cleaning liquid is circulated again through the cleaning tank through the cleaning liquid filtration filter so that the cleaning liquid
A circulating system capable of mixing the cleaning liquid in the tank, and a replenishing system for replenishing NH ₄ OH connected to the cleaning liquid tank .
A tank for replenishing the tank and H ₂ O _2, and pure water supply port connected to the cleaning solution tank, the tank and H ₂ O ₂ for refilling the NH ₄ OH
Means from the tank to replenish performing replenishment of the cleaning liquid to the cleaning liquid tank, a sensor used for replenishing operation of the cleaning liquid by means for detecting the washing liquid amount of the cleaning liquid in the tank, performs replenishment of the cleaning solution, A discharge system for discharging the rinsing liquid collected by the outer cup.

5. An accommodating portion having an inner / outer double cup structure having an opening through which a substrate to be processed can be taken in and out, wherein the height of the opening of the inner cup is smaller than the height of the opening of the outer cup. A rotation transfer unit that holds and rotates the substrate to be processed in the storage unit, and transfers between the inner and outer cups; and a cleaning liquid for both the front and back surfaces of the substrate to be processed that is rotated by the rotation transfer unit in the outer cup. A jetting portion for jetting a rinsing liquid onto both front and back surfaces of the substrate to be processed which is rotated by the rotary transfer portion in the inner cup, and a cleaning liquid collected in the outer cup is collected in a cleaning liquid tank,
The cleaning liquid circulation pump and the cleaning liquid circulation filter are supplied to the ejection section via a cleaning liquid filtration filter, and the cleaning liquid in the cleaning liquid tank is supplied to the ejection section without being supplied to the ejection section. The cleaning liquid is circulated again through the cleaning tank through the cleaning liquid filtration filter so that the cleaning liquid
A circulation system capable of mixing the cleaning liquid in the tank, and a replenishing system for replenishing NH4 OH connected to the cleaning liquid tank.
A tank and a tank for replenishing H2 O2, a pure water supply port connected to the cleaning liquid tank, a tank for replenishing the NH4 OH, and replenishing H2 O2;
A sensor means for performing a replenishment of the cleaning liquid into the cleaning tank from the tank, to detect the cleaning liquid of the cleaning liquid in the tank, is used to supplement the control of the cleaning liquid by means for performing replenishment of the cleaning liquid that, said cup And a discharge system for discharging the rinse liquid collected in the step (a).

6. An ejection section for alternately ejecting a cleaning liquid and a rinsing liquid using the same ejection nozzle to a substrate to be processed, and a predetermined period before the ejection section ejects the cleaning liquid to the substrate to be processed. Means for discharging the cleaning liquid from the jet nozzle and discharging the rinsing liquid from the jet nozzle for a predetermined period before the jetting section jets the rinsing liquid onto the substrate to be processed. .

7. An ejection section for alternately ejecting a cleaning liquid and a rinsing liquid to the substrate to be processed using the same ejection nozzle, and a predetermined period before the ejection section ejects the cleaning liquid to the substrate to be processed. Means for discharging the cleaning liquid from the ejection nozzle, a means for discharging the rinsing liquid from the ejection nozzle for a predetermined period before the ejection section ejects the rinsing liquid onto the substrate to be processed, and a cleaning liquid discharged from the ejection nozzle. A cleaning system comprising: a circulating system that collects and circulates a cleaning liquid among the rinsing liquids and reuses the cleaning liquid in the ejection unit.

8. An ejection section for alternately ejecting a cleaning liquid and a rinsing liquid to the substrate to be processed using the same ejection nozzle, a cleaning liquid recovery section for collecting the cleaning liquid ejected from the ejection nozzle, and the ejection nozzle. A rinsing liquid collecting unit for collecting the rinsing liquid ejected from the rinsing liquid; and Means for discharging the rinsing liquid from the jet nozzle to the rinsing liquid collecting unit for a predetermined period before the unit jets the rinsing liquid to the substrate to be processed; and circulating the cleaning liquid collected by the cleaning liquid collecting unit. A circulating system for reuse in the ejection section.

9. An ejection section for alternately ejecting a cleaning liquid and a rinsing liquid to a substrate to be processed using the same ejection nozzle, and a cleaning liquid provided adjacent to the ejection section and ejected from the ejection nozzle. A cleaning liquid recovery unit to be recovered; a rinsing liquid recovery unit provided adjacent to the jetting unit for collecting a rinsing liquid jetted from the jetting nozzle; and a jetting unit for jetting the jetting nozzle, the cleaning liquid collecting unit, and the rinsing. A nozzle moving unit for moving between the liquid collecting unit and the jetting unit, before the jetting unit jets the cleaning liquid to the substrate to be processed, moving the jet nozzle to the cleaning liquid collecting unit by the nozzle moving unit for a predetermined period; The cleaning liquid is discharged from the ejection nozzle to the cleaning liquid collection unit, and the ejection nozzle is moved to the rinsing liquid collection unit by the nozzle moving unit before the ejection unit ejects the rinsing liquid to the substrate to be processed. Means for discharging the rinsing liquid from the ejection nozzle to the rinsing liquid recovery section for a predetermined period in advance, and a circulation system for circulating the cleaning liquid collected by the cleaning liquid collection section and reusing the cleaning liquid in the ejection section. And cleaning equipment.

10. An ejection section for alternately ejecting a cleaning liquid and a rinsing liquid to a substrate to be processed by using the same ejection nozzle; and a cleaning liquid provided adjacent to the ejection section and ejected from the ejection nozzle. A collection unit having an inner and outer double cup structure having an inner cup for collecting one of the rinsing liquids and an outer cup for collecting the other, and a nozzle movement for moving the ejection nozzle between the ejection unit and the collection unit Means for moving the ejection nozzle to the one cup by the nozzle moving means before the ejection section ejects the cleaning liquid to the substrate to be processed, and discharging the cleaning liquid from the ejection nozzle for a predetermined period in advance; Moving the ejection nozzle to the other cup by the nozzle moving means before ejecting the rinsing liquid to the substrate to be processed, and discharging the rinsing liquid from the ejection nozzle for a predetermined period in advance. A cleaning apparatus comprising: means; and a circulating system for circulating the cleaning liquid out of the cleaning liquid and the rinsing liquid collected by the cleaning liquid recovery section and reusing the cleaning liquid in the ejection section.

11. A cleaning apparatus according one wherein one of claims 1 to 5 have shifted, before jetting a cleaning liquid against the target substrate from the spray nozzles provided in the cleaning unit, previously prescribed period the jet nozzle A cleaning liquid collecting unit for ejecting the cleaning liquid from the cleaning liquid collecting unit, and the cleaning liquid collected by the cleaning liquid collecting unit is collected in the cleaning liquid tank.