JP3313054B2 - Die attach paste - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a die attach paste for semiconductor which has excellent adhesiveness, low stress property and solder crack resistance, and further can be cured in a very short time. SOLUTION: This die attach paste is obtained by including (A) a product by the reaction of a urethane diacrylate and/or urethane dimethacrylate with a phosphoric acid group-containing acrylate and/or a phosphoric acid group- containing methacrylate shown by formula I and an alicyclic epoxy group- containing alkoxysilane at 0-50 deg.C, (B) a monoacrylate shown by formula IIA or a monomethacrylate shown by formula IIB, (C) an initiator, and (D) silver powder, wherein R is H or CH3 (a) is 0 or 1, (b) and (c) are each 1 or 2, (b)+(c)=3, and R1 is a group containing alicylic and/or aromatic group(s) and having ten carbon atoms or more.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste for bonding a semiconductor, which is excellent in low stress property, adhesive property and quick curing property.

[0002]

2. Description of the Related Art In recent years, the production volume of semiconductor packages has been on an increasing trend, and accordingly, reduction of manufacturing costs has become an important issue. In the process of assembling a semiconductor package, there is a process of bonding a semiconductor and a lead frame with a die attach paste, and in this process, time reduction and low-temperature curing are important. The curing process is roughly classified into a batch oven method and a method of curing in an in-line (hot platen or the like). From the viewpoint of cost reduction, it is important to shorten the curing time in any method. When a so-called fast-curing paste used in-line is used, ordinary die mounting is performed at 150 to 200 ° C. for 30 to 60 seconds. However, in the future, development of a paste that can be cured at a lower temperature and for a shorter time is desired.

[0003] Furthermore, in the case of oven curing, there is also a demand for an improvement in productivity, so it is essential to shorten the curing time. In the case of oven curing, ordinary die mounting is performed at 150 to 200 ° C. for 60 to 120 minutes, but in the future, curing within 20 minutes will be required. In addition, it is currently in a transition period from oven curing to in-line curing, so it is not possible to completely narrow down to only in-line curing. Therefore, the development of a combined oven / in-line curing paste is also required.

[0004] On the other hand, the reliability of the package is particularly important for solder crack resistance, but the die attach paste requires particularly low stress and high adhesiveness. Epoxy resin, cyanate resin, bismaleimide resin, etc. are known as the base resin of the die attach paste. For example, it can be cured within 30 seconds by in-line curing and / or can be cured within 15 minutes by oven curing. No material has been found which has properties that are suitable for solder crack resistance. Further, even if the properties were satisfied, there was only a material which was unsuitable for use because the viscosity at room temperature increased too much.

[0005] As other resins, there are acrylate resins, but no practical resins have been found such as curing shrinkage problem and poor adhesion. Among them, urethane acrylate obtained by reacting hydroxyalkyl acryl, dialkylene glycol and diisocyanate is a resin system expected to reduce stress due to flexibility of the main chain skeleton. However, although this resin alone has excellent stress properties, it still has a problem in that the adhesive strength is poor. Therefore, as a method for solving this problem, a method using a phosphoric acid ester has been proposed in JP-A-7-292048 and the like. However, according to the study of the present inventors, in the semiconductor field, with respect to the bonding of a semiconductor chip to an organic substrate typified by a metal lead frame or a glass-epoxy resin, no adhesive strength can be obtained by only those components. The thing turned out. This is because it is necessary to raise the temperature to 200 ° C. or higher in the step of attaching a gold wire or the like to the semiconductor chip and the lead frame (hereinafter referred to as “wire bonding”). At high temperatures (200 ° C.
At 350 ° C.), the adhesion between the inorganic surface and the organic substance required further improvement.

[0006]

SUMMARY OF THE INVENTION The present invention has been studied to improve the disadvantages of the acrylate resin, and as a result, a specific acrylate resin, a polymerization initiator, a specific phosphoric acid compound as a coupling agent and By combining an alkoxysilane containing a cyclic epoxy group and silver powder, it was found that the adhesiveness between the semiconductor chip and a metal frame or an organic substrate was excellent. However, in the paste manufacturing process, the working life of the paste obtained by kneading all the components of the adhesive (the time during which the viscosity increases by 10%) is significantly deteriorated. Turned out to be a problem. Therefore, as a result of investigating the cause, specific urethane di (meth) acrylate, phosphates, and alicyclic alkoxysilane were kneaded in advance,
The mixture is allowed to stand at room temperature or in a heated state for a predetermined period of time, and the alicyclic epoxy group alkoxysilane and the (meth) acrylate having a phosphate group are sufficiently reacted under dilution conditions. It has been found that the working life of the paste is sufficiently prolonged. Furthermore, the obtained paste was found to be a die attach paste that maintains excellent adhesiveness, low stress, and solder crack resistance, and can be cured even in a very short time, and has completed the present invention. It is a thing.

[0007]

According to the present invention, there is provided a die attach paste comprising the following components (A), (B), (C) and (D). (A) Urethane diacrylate and / or urethane dimethacrylate, a phosphoric acid group-containing acrylate and / or a phosphoric acid group-containing methacrylate having the following structure (1), and an alicyclic epoxy group-containing alkoxysilane are reacted at 0 to 50 ° C. (B) Monoacrylate having the following structure (2a) or monomethacrylate having the following structure (2b), (C) a polymerization initiator, and (D) silver powder.

[0008]

Embedded image (Wherein, R: -H or -CH ₃ a: 0 or 1, b: 1 or 2, c: 1 or 2, b + c = 3)

[0009]

Embedded image (In the formula, R ₁ : a substituent containing an alicyclic and / or aromatic group and having 10 or more carbon atoms)

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Urethane acrylate used in the present invention is hydroxyalkyl acrylic acid,
It is synthesized by the reaction of polyalkylene glycol and diisocyanate.

Examples of hydroxyalkyl acrylic acid include 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate. Examples of the polyalkylene glycol include polyethylene glycol, polypropylene glycol, polybutylene glycol and the like. or,
Examples of diisocyanates include hexamethylene diisocyanate, isophorone diisocyanate, toluene diisocyanate and hydrogenated products thereof.

Further, since urethane diacrylate generally has a high viscosity, even if it is made into a paste as it is, the coating workability is poor and it is not suitable for practical use. Therefore, a mono (meth) acrylate containing one (meth) acryl group is added as a diluent. Further, the mono (meth) acrylate used in the present invention is represented by the formulas (2a) and (2b), and further has a substituent R ₁
Contains an alicyclic and / or aromatic group, and the total number of carbon atoms in the substituent R ₁ must be 10 or more. By satisfying this condition, not only the effect as a diluent but also the presence of a bulky substituent can suppress shrinkage during curing, thereby improving the bonding reliability of the interface. Alicyclic,
In the case of a substituent containing no aromatic group and having 10 or more carbon atoms, curing shrinkage can be reduced, but the adhesiveness is undesirably reduced due to the characteristics of the aliphatic hydrocarbon. Examples of mono (meth) acrylates

[0013]

Embedded image

And the like. The phosphate group-containing ester used in the present invention is not particularly limited as long as it is represented by the formula (1).
And PM-21 manufactured by the company.

The ratio of component (A) to component (B) is 8 by weight.
It is preferably 0/20 to 20/80. Component (A)
If the amount exceeds 80/20, the viscosity of the paste is too high and the coating workability deteriorates. On the other hand, if it is less than 20/80, the adhesive strength cannot be obtained.

Next, examples of the polymerization initiator include organic peroxides and azo compounds. The decomposition temperature of the organic peroxide in the rapid heating test (decomposition start temperature when 1 g of a sample is placed on an electric heating plate and heated at a rate of 4 ° C./min) is from 40 ° C. to 14 ° C.
Preferably it is 0 ° C. If the decomposition temperature is lower than 40 ° C., the storage stability at room temperature becomes poor, and if it exceeds 140 ° C., the curing time becomes extremely long.

Examples of the organic peroxide include cumylperoxyneodecanate, t-butylperoxyneodecanate, 1-cyclohexyl-1-methylethylperoxyneodecanate, 1,1,3,3 -Tetramethylbutyl peroxy neodecanoate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanate,
Bis (4-butylcyclohexyl) peroxydicarbonate, t-butylperoxyisopropyl monocarbonate, 1,1-bis (t-butylperoxy) -3,
3,5-trimethylcyclohexane, t-butylperoxybenzoate, t-butylperoxy 3,5,5-
Trimethylhexanate, t-butylperoxy-2-
Examples include ethylhexyl monocarbonate and t-hexylperoxy-2-ethylhexanate. Examples of the azo compound include 2,2′-azobisisobutyronitrile,
1,1′-azobis (1-acetoxy-1-phenylethane) and the like.

These organic peroxides and / or azo compounds can be used alone or in combination of two or more to control curability. Further, various polymerization inhibitors can be added in advance in order to improve the storage stability of the resin.

The addition amount of these organic peroxides and / or azo compounds may be from 0.1% by weight to 5% by weight based on the total weight of the component (A) + the component (B). If it is 0.1% or less, the curing speed is slow, and if it is 5% by weight or more, the adhesive strength is unfavorably reduced.

Next, examples of silver powder include spherical or flaky silver powder. The average particle size is 0.5 μm to 15 μm.
μm is preferred. If the average particle size is smaller than 0.5 μm, the product viscosity increases, and kneading with a roll or the like becomes impossible. If the average particle size is larger than 15 μm, nozzle clogging during paste application using a dispenser or the like, or an adhesive layer Is difficult to control, which is not preferable. As the addition amount,
It is preferably in the range of 60% to 85% by weight based on the total paste. When it is less than 60%, the volume resistivity increases, and when it exceeds 85%, the paste viscosity increases, which is not preferable in application workability.

The alkoxysilane containing an alicyclic epoxy group is, for example, KBM-3 manufactured by Shin-Etsu Chemical Co., Ltd.
03 and the like are known.

The total amount of the acrylate or methacrylate represented by the formula (1) and the alkoxysilane containing an alicyclic epoxy group is from 0.1% by weight to 5% by weight based on the total weight of the component (A) + the component (B). % By weight. 0.
If it is 1% or less, no effect is exerted on the adhesiveness, and if it is more than 5%, the viscosity is significantly increased.

Further, in the present invention, it is essential that each component of the component (A) is reacted at a temperature of 0 to 50 ° C. in advance. If the temperature is lower than 0 ° C, the reaction does not proceed sufficiently, which is not preferable. If the temperature is higher than 50 ° C, a side reaction occurs, which is not preferable. When the paste obtained by reacting in the range of 0 to 50 ° C. for 1 hour or more is used as the component (A) of the present invention, the obtained paste has excellent storage stability, low stress, excellent adhesion, and excellent fast curing property. Is preferred.

In the resin paste of the present invention, the above-mentioned additives such as a polymerization inhibitor, an antifoaming agent, a surfactant and a solvent can be used, if necessary. Hereinafter, the present invention will be described specifically with reference to Examples.

[0025]

EXAMPLE 1 Urethane diacrylate comprising hydroxyethyl acrylate, polybutylene glycol and isophorone diisocyanate (M-1600, manufactured by Toagosei Co., Ltd.)
50 parts by weight Phosphate group-containing methacrylate (Nippon Kayaku Co., Ltd., KAYA
MER, PM-21) 1 part by weight alicyclic epoxyalkoxysilane (Shin-Etsu Chemical Co., Ltd.)
KBM-303) 0.5 parts by weight

The above-mentioned raw materials are kneaded with three rolls to form a transparent uniform viscous solution, and then allowed to stand in a thermostat at 25 ° C. for 24 hours to react. The resulting solution (hereinafter referred to as varnish) 25
Phenoxydiethylene glycol monoacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., AMP-20G)
Y) 25 parts by weight of an organic peroxide initiator (Nippon Yushi Co., Ltd.
Park mill ND) 1.0 part by weight, silver powder (manufactured by Degussa, S
130 parts by weight of F-65) and 20 parts by weight of silver powder (manufactured by Tokurika Chemical Laboratory Co., Ltd., TCG-1) are mixed and dispersed and kneaded again with three rolls. Subsequently, a degassing treatment was performed under vacuum to obtain a silver paste.

The viscosity of the obtained silver paste was measured using an E-type rotational viscometer immediately after preparation and one week after (at 25 ° C.), and the viscosity increase rate was calculated from the value at 2.5 rpm.
As a result, the rate of increase in viscosity was only about 9%, and it was clarified that long-term storage was possible without freezing. After applying the obtained silver paste to a 42 alloy frame,
Mount the chip of the square mm and place it in an oven (150 ° C 1
5 minutes) or on a hot platen (175 ° C., 60 seconds).
The adhesive strength was measured at room temperature (25 ° C.) and hot (250 ° C.) using an automatic shear strength measuring device. As a result, it was confirmed that a sufficient bonding strength was obtained even at a wire bonding temperature (about 250 ° C.), and no peeling of the chip was observed at all even by using an ultrasonic flaw detector (shown in Table 1).

Other evaluation methods Peeling after wire bonding: 6 m on lead frame
A chip of mx15 mm was hardened after mounting, and wire bonding was performed at 250 ° C, and the presence or absence of peeling of the chip was observed.

Warpage value: Measured for evaluation of low stress property.
6mm x 15mm x 0.2mm on a copper frame with a thickness of 200m.
3mm silicon chip at 175 ° C using paste
The paste was adhered so that the paste thickness became 20 μm in 0 seconds, the displacement of the chip in the longitudinal direction was measured using a contact type surface roughness meter, and the warpage value was measured based on the height difference.

Solder crack resistance: Sumicon EME-73
Using 20 (Sumitomo Bakelite Co., Ltd.) sealing material,
A package molded under the following conditions is 85 ° C and relative humidity 8
After a water absorption treatment of 5% for 168 hours, IR reflow (24
(0 ° C., 10 seconds), the number of internal cracks was measured by cross-sectional observation, and the index was used as an index of solder crack resistance.

Package: 80pQFP (14 × 20 ×
2mm) Chip size: 7.5 × 7.5mm (Aluminum wiring only) Lead frame: 42 alloy Molding: 175 ° C, 2 minutes Post-mold cure: 175 ° C, 4 hours Total number of packages: 12 Overall evaluation: As die attach paste Those which can be used were evaluated as ○, and those which could not be used were evaluated as ×.

Example 2 A silver paste was obtained in exactly the same manner as in Example 1 except for the composition and conditions shown in Table 1, and the characteristics were evaluated. The results are shown in Table 1.

Example 3 The composition shown in Table 1 was used in the oven of Example 1 (150 ° C.
15 minutes) A silver paste was obtained in the same manner as in Example 1 except that the curing was changed to curing on a hot platen (175 ° C., 60 seconds), and the characteristics were evaluated. The results are shown in Table 1.

Examples 4 to 8, Comparative Examples 1 to 4 A silver paste was obtained in exactly the same manner as in Example 1 except for the composition and conditions shown in Tables 1 and 2, and the characteristics were evaluated.
The results are as shown in Tables 1 and 2.

Comparative Example 5 A paste was obtained and evaluated in the same manner as in Example 1 except that the varnish of the varnish of Example 1 was replaced with the methacrylate containing a phosphoric acid group.

Comparative Example 6 A paste was obtained and evaluated in the same manner as in Example 1 except that the alicyclic alkoxysilane was removed from the components of the varnish of Example 1.

[0036]

[Table 1]

[0037]

[Table 2]

[0038]

Embedded image

[0039]

Embedded image

Polymerization initiator 1: Cumyl peroxyneodecanate, manufactured by NOF Corporation (decomposition temperature in a rapid heating test: 65 ° C.) Polymerization initiator 2: t-butyl, manufactured by NOF Corporation Peroxyisopropyl monocarbonate (decomposition temperature in rapid heating test: 108 ° C) Polymerization initiator 3: 2,2'-azobisisobutyronitrile, manufactured by Wako Pure Chemical Industries, Ltd. Polymerization initiator 4: Nippon Yushi ( Co., Ltd., 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanate (decomposition temperature in rapid heating test: 81 ° C) Silver content 1: Degussa, SF-65 Silver powder 2: ( TCG-1 manufactured by Tokuriki Chemical Laboratory Co., Ltd.

[0041]

Industrial Applicability According to the present invention, it is possible to produce an industrially useful semiconductor bonding paste having not only low stress properties and rapid curing properties, but also the conventional problems of storability and adhesiveness.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI H01L 21/52 H01L 21/52 E // C08F 290/06 C08F 290/06 (56) References JP-A-11-172205 (JP) JP-A-7-25957 (JP, A) JP-A-6-87938 (JP, A) JP-A-63-284213 (JP, A) JP-A-61-7369 (JP, A) JP-A-7-48422 (JP, A) JP-A-64-11108 (JP, A) JP-A-3-160077 (JP, A) JP-A-57-16077 (JP, A) JP-A-11-189763 (JP, A) A) JP-A-11-60654 (JP, A) JP-A-11-61086 (JP, A) JP-A-11-189747 (JP, A) JP-A-11-71436 (JP, A) JP-A-9 -100450 (JP, A) JP-A-11-171944 (JP, A) JP-A-7-508555 (JP, A) (58) Fields investigated (Int. Cl. ⁷⁾ , DB name) C09J 1/00-201/10 H01B 1/22 H01L 21/52 C08F 290/00-290/14 C08F 299/00-299/08

Claims (7)

(57) [Claims] 1. A die attach paste comprising the following components (A), (B), (C) and (D). (A) Urethane diacrylate and / or urethane dimethacrylate, a phosphoric acid group-containing acrylate and / or a phosphoric acid group-containing methacrylate having the following structure (1), and an alicyclic epoxy group-containing alkoxysilane are reacted at 0 to 50 ° C. (B) Monoacrylate having the following structure (2a) or monomethacrylate having the following structure (2b), (C) a polymerization initiator, and (D) silver powder. Embedded image (Wherein R: -H or -CH ₃ a: 0 or 1, b: 1 or 2, c: 1 or 2, b + c = 3) (In the formula, R ₁ : a substituent containing an alicyclic and / or aromatic group and having 10 or more carbon atoms) 2. The ratio of component (A) to component (B) is 8 by weight.
The die attach paste according to claim 1, wherein the ratio is 0/20 to 20/80. 3. An organic peroxide whose component (C) has a decomposition temperature of 40 ° C. to 140 ° C. in a rapid heating test, and / or
3. The die attach paste according to claim 1, which is an azo compound. 4. The amount of component (C) added is component A + component B
4. The die attach paste according to claim 1, wherein the amount is 0.1% by weight to 5% by weight based on the total weight. 5. Component (D) having an average particle size of 0.5 to 15 μm.
The die attach paste according to any one of claims 1 to 4, wherein m is m. 6. The die attach paste according to claim 1, wherein the component (D) is added in an amount of 60 to 85% by weight based on the total weight of the components A to F. 7. The total weight of the phosphoric acid group-containing acrylate and / or the phosphoric acid group-containing methacrylate used for the component (A) and the alkoxysilane containing the alicyclic epoxy is the total of the component (A) + the component (B). The die attach paste according to any one of claims 1 to 6, which is 0.1 to 5% by weight based on the weight.