JP3380671B2 - Substrate cleaning device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus for rotating a thin substrate (hereinafter referred to as "substrate") such as a semiconductor substrate or a liquid crystal glass substrate to perform a cleaning process.

[0002]

2. Description of the Related Art In general, various processes such as resist coating, exposure, and development are sequentially performed on the above substrate to perform a desired substrate process. At this time, if the substrate is contaminated due to particles or the like, the characteristics of the processed substrate are significantly deteriorated. Therefore, the substrate cleaning apparatus as described above is equipped with a cleaning brush, an ultrasonic cleaning nozzle, a high pressure cleaning nozzle, etc. The cleaning means is used to clean the substrate. The cleaning means is
It is provided at the tip of an arm having a rotating shaft outside the rotary table on which the substrate is placed. Then, the cleaning means, by the rotation of the arm, saves the substrate outside the rotary table before and after the cleaning process so as not to interfere with the transfer of the substrate, and is positioned above the substrate surface during the cleaning process. Has been

Conventionally, there is a substrate cleaning apparatus provided with a plurality of cleaning means in order to reliably remove the contamination of the substrate. In such a substrate cleaning apparatus, the plurality of cleaning means are sequentially moved above the substrate to perform the cleaning process.

[0004]

However, in the above-mentioned substrate cleaning apparatus, it is necessary to provide an interlock for sequentially moving a plurality of cleaning means, which complicates the apparatus configuration and allows one cleaning means to perform processing. Since the other cleaning means are repeatedly retracted to the outside of the turntable during the cleaning, the cleaning process takes a long time and the processing efficiency is lowered.

Therefore, when a plurality of cleaning means are simultaneously moved above the substrate surface to perform processing, the plurality of cleaning means interfere with each other in the vicinity of the central portion of the substrate, so that the center of the substrate surface is interfered with. It becomes difficult to clean the vicinity of the part. In the substrate as the final product, the central portion of the substrate surface is more important than the peripheral edge portion, and if the vicinity of the central portion of the substrate surface cannot be cleaned, the yield will decrease.

In view of the above problems, it is an object of the present invention to provide a substrate cleaning apparatus having a simple apparatus configuration, high processing efficiency, and capable of cleaning the vicinity of the center of the substrate surface.

[0007]

In order to solve the above problems, the invention of claim 1 is a substrate cleaning apparatus for performing a cleaning process while rotating a substrate, comprising: (a) placing and rotating the substrate. A rotating table for cleaning, (b) a cleaning brush for cleaning the substrate by abutting on or in close proximity to the main surface of the rotating substrate with a predetermined gap, and (c) a main surface of the rotating substrate. A cleaning nozzle for discharging the cleaning liquid to clean the substrate,
The cleaning brush and the cleaning nozzle are movable independently of each other, the cleaning nozzle is inclined so that the cleaning liquid discharge direction has a predetermined angle with the main surface of the substrate, and the cleaning brush moves along a trajectory. The locus of the landing point of the cleaning liquid from the cleaning nozzle is set so as not to cross each other except for point contact at the substantially center of rotation of the substrate, and the cleaning nozzle is substantially in the middle of the substrate.
While discharging the cleaning liquid to the heart,
In the operating state of cleaning the substantially center of the substrate, the cleaning
Both trajectories without interference between the brush and the cleaning nozzle
Comes into point contact .

According to a second aspect of the invention, in the substrate cleaning apparatus according to the first aspect of the invention, the cleaning brush is rotatable about a first shaft provided outside the rotary table. The cleaning nozzle and the cleaning nozzle are configured so that the cleaning nozzle is rotatable about a second shaft provided outside the rotary table, and the rotation range of the cleaning brush or the cleaning nozzle is regulated. Further, there is further provided a rotation restricting means for preventing the respective rotation loci of the above from crossing each other.

According to a third aspect of the present invention, there is provided a substrate cleaning apparatus that performs a cleaning process while rotating a substrate, comprising: (a) a rotary table on which the substrate is placed and rotated; and (b) a rotating stage. A plurality of cleaning nozzles for discharging the cleaning liquid onto the main surface of the substrate to clean the substrate, wherein the plurality of cleaning nozzles can be moved independently of each other, and all of the plurality of cleaning nozzles or Other than one is inclined so that the discharge direction of the cleaning liquid has a predetermined angle with the main surface of the substrate, and the locus of the landing point of the cleaning liquid from the plurality of cleaning nozzles is at the substantially rotation center of the substrate. They are set so that they do not cross each other except for point contact. Also bill
The invention of Item 4 is a substrate for performing a cleaning process while rotating the substrate.
In the cleaning device, (a) the substrate is placed and rotated.
The rotating table and (b) abut or touch the main surface of the rotating substrate.
Move close to each other at a fixed interval and move along the first rotation path
And a cleaning brush for cleaning the substrate while (c) second time
While moving along the rolling path, the main surface of the rotating substrate is
A cleaning nozzle for discharging a cleaning liquid to clean the substrate;
And the cleaning brush and the cleaning nozzle are independent of each other.
The cleaning nozzle can be vertically moved and the cleaning liquid is discharged from the cleaning nozzle.
Inclination so that the exit direction has a predetermined angle with the main surface of the substrate.
While tilting, the first and second rotation loci are
Two arcs that pass near the center of the board without intersecting with
Each set above, about the center of the board,
When the cleaning liquid is obliquely discharged from the cleaning nozzle,
Both cleaning with the cleaning brush is possible.

[0010]

DETAILED DESCRIPTION OF THE INVENTION

[0011]

[First Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic view showing a rotary substrate cleaning apparatus (spin scrubber) SS which is an embodiment of the present invention. In this rotary substrate cleaning apparatus SS, the substrate W is supported by the substrate support member 3 provided on the upper surface of the turntable 1. Further, the rotary table 1 is connected to a motor (not shown) by a motor shaft 2, and the rotary shaft 1
It is driven to rotate about a. The substrate W is also rotated around the rotation axis 1a as the rotary table 1 is driven to rotate.

The cleaning process for the substrate W is performed by the cleaning brush 20 contacting the rotating substrate W or approaching the rotating substrate W with a slight gap. The cleaning brush 20 is attached to the hanging portion 25a of the brush arm 25,
The brush arm 25 can be rotated and vertically moved by the pulse motor 40 and the air cylinder 60. That is, the support block 65 is the pulse motor 4
The motor shaft 41 of No. 0 is spline-fitted and connected to the piston 61 of the air cylinder 60. Here, the piston 61 and the support block 65 are connected so that the support block 65 can be rotated about the rotation shaft 40a by the pulse motor 40. And
A support rod 26 is vertically provided on the upper surface of the support block 65, and a horizontal portion 25b of the brush arm 25 is fixedly connected to an upper end of the support rod 26. Therefore, the support block 65 can be vertically moved and rotated by the air cylinder 60 and the pulse motor 40.
Along with this, the brush arm 25 moves up and down and rotates about the rotation shaft 40a.

The cleaning brush 2 is used during the cleaning process.
In addition to the cleaning by 0, the cleaning liquid is ejected from the ultrasonic cleaning nozzle 30. This ultrasonic cleaning nozzle 30
This is a nozzle provided with an ultrasonic vibrator, and the cleaning treatment capability is enhanced by irradiating the cleaning liquid with ultrasonic waves by the ultrasonic vibrator. The ultrasonic cleaning nozzle 30 is provided at the tip of the nozzle arm 35, and the nozzle arm 35
The same structure as the brush arm 25 allows vertical movement and rotation. That is, the support block 75 on which the support rod 36 fixedly connected to the nozzle arm 35 is erected is the motor shaft 51 of the pulse motor 50.
And is connected to the piston 71 of the air cylinder 70. The piston 71 and the support block 75 are connected so that the support block 75 can rotate about the rotation shaft 50a. Therefore, similarly to the brush arm 25, the nozzle arm 35 is moved up and down by the air cylinder 70, and is rotated by the pulse motor 50 about the rotation shaft 50a. The means for vertically moving the support blocks 65 and 75 is not limited to the air cylinder, and an electromagnetic actuator or the like may be used.

The ultrasonic cleaning nozzle 30 is provided on the nozzle arm 35 so that its ejection direction has a predetermined angle with respect to the substrate W. FIG. 2 is a diagram for explaining how the ultrasonic cleaning nozzle 30 is held. Three screw holes 35a are provided at the tip of the nozzle arm 35 along the vertical direction, and the nozzle holding member 37 is held by using two of them. That is, the nozzle holding member 37 is provided with two elongated holes 37a, and in the example shown in FIG. 2, the two screws 38 are inserted into the elongated holes 37a and the lower one of the three screw holes 35a is inserted. The nozzle holding member 37 is held by being screwed into two.

The nozzle holding member 37 has a long hole 37.
b is provided, and the ultrasonic cleaning nozzle 30 has a long hole 37.
It is fastened by a nut 32 at a desired position of b. At this time, the ultrasonic cleaning nozzle 30 is held so that its ejection direction has a predetermined angle with respect to the main surface of the substrate W. With the above configuration, the position and angle of the ultrasonic cleaning nozzle 30 can be adjusted.

A cable 31 for supplying a cleaning liquid is connected to the ultrasonic cleaning nozzle 30, and the cleaning liquid supplied from the cable 31 is ultrasonic cleaning nozzle 30.
After being irradiated with ultrasonic waves inside the container, the ultrasonic cleaning nozzle 30
The discharged cleaning liquid is deposited on the substrate W in the vicinity of the contact with the cleaning brush 20.

Returning to FIG. 1, a cup 10 for collecting the substrate W and the cleaning liquid scattered from the rotary table 1 during the rotation processing is arranged around the rotary table 1. The pulse motor 40 that drives the brush arm 25, the air cylinder 60, and the pulse motor 5 that drives the nozzle arm 35.
0 and the air cylinder 70 are electrically connected to the control unit 80. The control unit 80 includes a CPU 81 and a memory 82.
And a processing program input from the input panel 85 provided in the rotary substrate cleaning apparatus SS is stored in the memory 82, and the CPU 81 follows the programs to generate the pulse motors 40 and 50 and the air cylinder 60.
A command is given to 70 to control its operation. At this time,
The brush arm 25 and the nozzle arm 35 include the controller 8
0 are driven independently of each other.

Next, the operation of the brush arm 25 and the nozzle arm 35 in the rotary substrate cleaning apparatus SS will be described. FIG. 3 is a plan view illustrating operations of the brush arm 25 and the nozzle arm 35.

In the rotary substrate cleaning apparatus SS according to the first embodiment, as shown in FIG.
Since the rotation locus of the tip of the brush arm and the rotation locus of the tip of the nozzle arm 35 intersect, the CPU 81 of the control unit 80 regulates the rotation range of the brush arm 25 so that the two arms do not interfere with each other. That is, the brush arm 25 is
The substrate W can be rotated in a range from a position where it can be cleaned near the center of rotation (a position shown by a solid line in FIG. 3) to a retracted position when transferring a substrate (a position shown by a chain double-dashed line in FIG. 3). Is controlled.

On the other hand, the nozzle arm 35 is rotatable between the positions shown by the chain double-dashed line in FIG. 3, and the solid line in FIG. 3 supplies the cleaning liquid near the rotation center of the substrate W during the cleaning process. Rotate between the position and the peripheral edge of the substrate W. At this time, since the ultrasonic cleaning nozzle 30 is held so that the discharge direction thereof has a predetermined angle with respect to the main surface of the substrate W, the discharged cleaning liquid is discharged near the rotation center of the substrate W. It is possible to wash.

With this arrangement, even if the cleaning brush 20 and the ultrasonic cleaning nozzle 30 are used simultaneously or continuously without providing a time lag, the cleaning brush 20 and the ultrasonic cleaning nozzle 30 can be moved to the vicinity of the rotation center of the substrate without interfering with each other during movement. It becomes possible to wash.
Therefore, it is not necessary to provide an interlock, and the device configuration is simplified. Further, as a result of cleaning by using the cleaning brush and the cleaning nozzle simultaneously or continuously without providing a time lag, the processing time is shortened and the processing efficiency is improved.

In the first embodiment, the rotation range of the brush arm 25 is controlled, but the brush arm 25 may be freely rotatable and the rotation range of the nozzle arm 35 may be controlled. . In addition, the rotary substrate cleaning device SS
Although the ultrasonic cleaning nozzle 30 is applied, the ultrasonic cleaning nozzle 30 may be used as a high pressure cleaning nozzle described later.

Further, in the first embodiment, the rotation range of the brush arm 25 is electrically restricted by the controller 80, but a stopper or the like is provided on the arm so that the rotation range is mechanically restricted. You may

[0025]

[Second Embodiment] FIG. 4 is a plan view for explaining the operation of a rotary substrate cleaning apparatus SS2 according to a second embodiment of the present invention. The rotary substrate cleaning apparatus SS2 of the second embodiment is different from the rotary substrate cleaning apparatus SS of the first embodiment in that the relative positional relationship between the brush arm 25 and the nozzle arm 35 is different. .

As shown in FIG. 4, in the rotary substrate cleaning apparatus SS2 according to the second embodiment, the rotation locus of the tip of the brush arm 25 and the rotation locus of the tip of the nozzle arm 35 do not intersect each other. Even if the rotation range of both arms is not limited, both arms do not interfere with each other. Accordingly, if the relative positional relationship between the brush arm 25 and the nozzle arm 35 is set so that the rotation loci of both arms do not intersect, the cleaning brush 20 and the ultrasonic cleaning nozzle 30 do not interfere with each other, and Similar to the first embodiment, it is possible to clean the substrate W by using the cleaning brush 20 and the ultrasonic cleaning nozzle 30 simultaneously or continuously without providing a time lag.

[0027]

[Third Embodiment] FIG. 5 is a plan view for explaining the operation of a rotary substrate cleaning apparatus SS3 according to a third embodiment of the present invention. The rotary substrate cleaning apparatus SS3 includes a high-pressure cleaning nozzle 130 in addition to the cleaning brush 20 and the ultrasonic cleaning nozzle 30 similar to those in the first embodiment. The high-pressure cleaning nozzle 130 is a nozzle that discharges a high-pressure cleaning liquid to clean the substrate W.

The high-pressure cleaning nozzle 130 is the nozzle arm 1
The nozzle arm 1 is attached to the tip of 35.
Similar to the nozzle arm 35 provided with the ultrasonic cleaning nozzle 30, 35 is configured to be vertically movable by an air cylinder and a pulse motor (not shown) and rotatable about a rotating shaft 150a. The air cylinder and the pulse motor are controlled by the control unit 80 (see FIG. 1).
Controlled by the nozzle arm 135
Are driven independently of the brush arm 25 and the nozzle arm 35.

As shown in FIG. 5, the brush arm 25, the nozzle arm 35, and the nozzle arm 135 in the rotary substrate cleaning apparatus SS3 having the above-described structure are at positions for cleaning the vicinity of the rotation center of the substrate W (shown by the solid line in the figure). Position) and the retracted position (the position indicated by the chain double-dashed line in the figure). Since the rotation range of each arm is controlled, the cleaning brush 20, the ultrasonic cleaning nozzle 30, and the high-pressure cleaning nozzle 130 do not interfere with each other.
In addition, the ultrasonic cleaning nozzle 30 and the high pressure cleaning nozzle 13
Since 0 is held so as to have a predetermined angle with respect to the main surface of the substrate W, without interfering with each other,
The substrate W can be cleaned by using the ultrasonic cleaning nozzle 30, the high-pressure cleaning nozzle 130, and the cleaning brush 20 simultaneously or continuously without providing a time lag.

With the above configuration, even if the cleaning brush 20, the ultrasonic cleaning nozzle 30, and the high-pressure cleaning nozzle 130 are used simultaneously or continuously, they do not interfere with each other during movement and the vicinity of the center of rotation of the substrate. Can be washed, and as a result, it is not necessary to provide an interlock, and the device configuration can be simplified. Further, as a result of cleaning by using the above three cleaning means simultaneously or continuously, the processing time is shortened and the processing efficiency is improved.

In the above, it is not necessary to use three cleaning means at the same time, and one or two of them may be used for the cleaning treatment. And as a result,
The types of processing patterns will increase.

[0032]

[Fourth Embodiment] FIG. 6 is a plan view for explaining the operation of a rotary substrate cleaning apparatus SS4 according to a fourth embodiment of the present invention. This rotary substrate cleaning device SS4 is equipped with a cleaning brush 2
0, ultrasonic cleaning nozzle 30, high pressure cleaning nozzle 13
0 and 230 are provided. The cleaning brush 20, the ultrasonic cleaning nozzle 30, and the high-pressure cleaning nozzles 130, 230 are attached to the brush arm 25 and the nozzle arms 35, 135, 235, respectively, as in the first to third embodiments. Then, each of these arms is configured to be movable in the radial direction of the substrate W (direction indicated by an arrow in FIG. 6) by a moving unit (not shown). The moving means is controlled by the control unit 80, and each arm has a position for cleaning the vicinity of the rotation center of the substrate (a position shown by a solid line in FIG. 6) and a retracted position (a position shown by a chain double-dashed line in FIG. 6). ) Is controlled so that it can move independently of each other.

By doing so, the moving range of each arm is controlled, and the ultrasonic cleaning nozzle 30 and the high-pressure cleaning nozzles 130 and 230 are held so as to have a predetermined angle with respect to the main surface of the substrate W. Cleaning brush 2
0, ultrasonic cleaning nozzle 30 and high pressure cleaning nozzle 13
The cleaning brushes 20, 0 and 230 do not interfere with each other.
Ultrasonic cleaning nozzle 30 and high pressure cleaning nozzle 130, 2
It is possible to use 30 at the same time or continuously without providing a time lag to clean the substrate W.

[0034]

[Modification] The embodiment of the present invention has been described above. However, the present invention is not limited to the above example. For example, in the first to fourth embodiments, one cleaning brush is used. Although 20 is applied, all the cleaning means may be nozzles without using the cleaning brush 20.
In this case, all the nozzles may be inclined, or one of the plurality of nozzles may be a nozzle that ejects the cleaning liquid in the vertical direction. With this configuration, even when a plurality of nozzles are used at the same time, it is possible to clean the vicinity of the rotation center of the substrate without interfering with each other during movement. Therefore, it is not necessary to provide an interlock, and the device configuration is simplified. Further, as a result of cleaning by using a plurality of nozzles simultaneously or continuously without providing a time lag, the processing time is shortened and the processing efficiency is improved.

[0035]

As described above, according to the first aspect of the present invention, the cleaning nozzle is tilted so that the direction in which the cleaning liquid is discharged from the cleaning nozzle forms a predetermined angle with the main surface of the substrate. The movement path of the cleaning brush and the trajectory of the landing point of the cleaning liquid from the cleaning nozzle are set so that they do not cross each other except for point contact in the vicinity of the rotation center of the substrate. To the above wash
While cleaning liquid is being discharged,
In the operating state of cleaning the center, the cleaning brush and the front
Both trajectories make point contact without interference with the cleaning nozzle.
That, even using the washing nozzle with the cleaning brush at the same time or consecutively, without interfering with each other during the movement, to brush washing <br/> Kiyoshi while ejecting the washing liquid in the rotational center vicinity of the substrate It becomes possible. Therefore, it is not necessary to provide an interlock, and the device configuration is simplified. Also,
As a result of cleaning by using the cleaning brush and the cleaning nozzle simultaneously or successively, the processing time is shortened and the processing efficiency is improved.

According to the invention of claim 2, claim 1
Since the substrate cleaning apparatus according to the invention is provided with the rotation regulating means for regulating the rotation range of the cleaning brush or the cleaning nozzle,
Even when the rotation locus of the cleaning brush and the rotation locus of the cleaning nozzle intersect, the cleaning brush and the cleaning nozzle do not interfere with each other during movement, and the same effect as that of the invention of claim 1 is achieved. can get.

According to the third aspect of the present invention, all or some of the plurality of cleaning nozzles are inclined such that the cleaning liquid discharge direction has a predetermined angle with the main surface of the substrate, and Since the traces of the landing points of the cleaning liquid from multiple cleaning nozzles do not cross each other except for point contact in the vicinity of the center of rotation of the substrate, even if the multiple nozzles are used at the same time, they are moving. It is possible to clean the vicinity of the center of the substrate without interfering with each other. As a result, the same effect as the invention of claim 1 is obtained. According to the invention of claim 4, the cleaning block
The rotation paths of the brush and cleaning nozzle do not intersect with each other.
Set on each of two arcs that pass near the center of the board
Tilted from the cleaning nozzle about the center of the substrate.
Between the landing of the discharged cleaning liquid and the cleaning with a cleaning brush
Both are possible, so the cleaning brush and cleaning nozzle are all
Do not interfere with each other in the operating state. But
Therefore, each device must be restrained in its mutual positional relationship.
It is possible to perform control with a high degree of freedom.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a rotary substrate cleaning apparatus SS that is an embodiment of the present invention.

FIG. 2 is a diagram illustrating a state in which a nozzle is held.

FIG. 3 is a plan view illustrating operations of a brush arm and a nozzle arm.

FIG. 4 is a plan view illustrating the operation of the rotary substrate cleaning apparatus according to the second embodiment of the present invention.

FIG. 5 is a plan view illustrating the operation of the rotary substrate cleaning apparatus according to the third embodiment of the present invention.

FIG. 6 is a plan view illustrating the operation of the rotary substrate cleaning apparatus according to the fourth embodiment of the present invention.

[Explanation of symbols]

1 turntable 20 cleaning brush 25 brush arm 30 ultrasonic cleaning nozzle 35 nozzle arm 80 Control unit W board

Continuation of the front page (56) Reference JP-A-9-162151 (JP, A) JP-A-9-148295 (JP, A) JP-A-9-199458 (JP, A) JP-A-63-109978 (JP , A) JP-A-1-105376 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/304 643 H01L 21/304 644

Claims (4)

(57) [Claims] 1. A substrate cleaning apparatus that performs a cleaning process while rotating a substrate, comprising: (a) a rotary table on which the substrate is placed and rotated; and (b) contact with a main surface of the rotating substrate. A cleaning brush that cleans the substrate, and a cleaning nozzle that discharges a cleaning liquid onto the main surface of the rotating substrate to clean the substrate. The cleaning brush and the cleaning nozzle are movable independently of each other, and the cleaning nozzle is inclined so that the cleaning liquid discharge direction has a predetermined angle with the main surface of the substrate, and the movement path of the cleaning brush is The locus of the landing point of the cleaning liquid from the cleaning nozzle is set so as not to cross each other except for point contact at the substantially rotation center of the substrate, and the cleaning nozzle is set at the substantially center of the substrate. The above
While the cleaning liquid is being discharged, the cleaning brush cleans the substrate.
In the operating state of cleaning substantially the center, the cleaning brush and
Both trajectories make point contact without interference with the cleaning nozzle
A substrate cleaning apparatus characterized by: 2. The substrate cleaning apparatus according to claim 1, wherein the cleaning brush is a first brush provided outside the rotary table.
Is rotatable about the axis of the cleaning nozzle, and the cleaning nozzle is provided on the outside of the rotary table.
Is rotatable about the axis of the cleaning brush or the cleaning nozzle, and the rotation range of the cleaning brush or the cleaning nozzle is restricted so that the rotation paths of the cleaning brush and the cleaning nozzle do not cross each other. A substrate cleaning apparatus further comprising a motion restricting means. 3. A substrate cleaning apparatus for performing a cleaning process while rotating a substrate, comprising: (a) a rotary table on which the substrate is placed and rotated; and (b) a cleaning liquid is discharged onto a main surface of the rotating substrate. And a plurality of cleaning nozzles for cleaning the substrate, wherein the plurality of cleaning nozzles are movable independently of each other, and all of the plurality of cleaning nozzles or one of the plurality of cleaning nozzles is used for the cleaning liquid. The ejection direction is inclined so as to have a predetermined angle with the main surface of the substrate, and the loci of the landing points of the cleaning liquid from the plurality of cleaning nozzles are point-contacted at substantially the center of rotation of the substrate, A substrate cleaning device characterized in that it is set so as not to cross. 4. A substrate for performing a cleaning process while rotating the substrate.
In the cleaning device, (a) the substrate is placed and rotated.
(B) Abut on the rotating table and the main surface of the rotating substrate or make a predetermined interval.
While being separated from each other and moving along the first rotation locus,
A cleaning brush for cleaning the substrate, and (c) the rotating brush while moving along a second rotation path.
A cleaning method in which the cleaning liquid is discharged onto the main surface of the substrate to clean the substrate.
Comprising purification and nozzle, and moves to one another independently of the cleaning nozzle and the cleaning brush
It is possible that the cleaning nozzle is ejected in the main direction of the substrate.
The first and second rotation loci are tilted so as to have a predetermined angle with the surface, and the bases are not intersected with each other.
Set on each of two arcs that pass near the center of the plate.
It is, for almost the center of the substrate, and inclined from the cleaning nozzle
Of the cleaning liquid discharged by the
Substrate cleaning equipment characterized by being capable of both cleaning
Place